METHOD AND DEVICE FOR SEPARATION OF A NANOOBJECT
Patent Information
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- CENT NAT DE LA RECH SCI (C N R S)
- Filing Date
- 2019-10-18
- Publication Date
- 2026-04-29
AI Technical Summary
Existing methods for integrating carbon nanotubes into electronic components suffer from defects, contamination, and lack of control over the interface, leading to degraded properties and reduced reproducibility, integration success rate, and stability.
A process and device using a comb-shaped support with adjustable optical and mechanical control under vacuum conditions to transfer nano-objects, such as carbon nanotubes, onto a substrate, minimizing contact areas and enabling precise alignment and electrical measurement for cleaner, more reproducible integration.
Enhances the cleanliness and reproducibility of nano-object integration, improves the interface control, and increases the stability and integration success rate of carbon nanotubes in electronic devices.
Description
technical field
[0001] The present invention relates to a method and device for depositing a nano-object.
[0002] Such a device allows a user to place a nano-object onto a surface. Prior art
[0003] Integrating nano-objects onto an electronic component enables the fabrication of devices capable of reaching quantum limits. Since quantum behavior is highly sensitive to its environment, a material of exceptional purity is crucial for quantum technology engineering. Carbon nanotubes possess exceptional crystallinity, allowing them to be as mechanically strong as diamond while exhibiting record-breaking electronic conductivity, as electrons are a hundred times more mobile than in silicon. Information can be encoded in quantum form within the spin of an electron, and carbon nanotubes are an ideal host material for these electrons due to their high crystalline purity. Carbon nanotubes also exhibit an optical response spanning a spectrum from the visible to the near-infrared, depending on their diameter.They are therefore also integrated into optical or optoelectronic devices. These nano-objects are also integrated onto silicon components to create sensors, which are highly sensitive thanks to the unparalleled surface-to-volume ratio of this material.
[0004] These properties are, however, degraded by defects or contamination on the nanotube. Carbon nanotubes also exhibit a diversity of crystalline structures during their growth and tend to agglomerate. The ability to isolate and manipulate a single object without degrading it allows for greater control over the behavior of the device using it. Furthermore, the fabrication of electronic circuits with inks or thin films does not allow for optimal control of the characteristics of the manufactured component. Inks also contain chemical additives that modify the nanotube's environment, a problem also found in nanotubes in solution. Similarly, integration using electron beam lithography techniques degrades the nanotube's crystalline structure due to the use of resin and an electron microscope.
[0005] The integration of a single nanotube, free from pollution and defects and with identified crystalline characteristics, preserves the properties of the nanotubes and ensures greater reproducibility and control of the devices. Furthermore, nanotube degradation and the presence of pollution impact the integration success rate, which depends crucially on the quality of the contact between the nanotube and the target substrate.
[0006] To avoid defects in the nanotube, one method involves mechanically transferring it, suspended on a support, to the target substrate. This is done in the final manufacturing step to protect the nanotube from any damage.
[0007] We know of such processes for depositing a nano-object such as a carbon nanotube, as described for example by: “One-Step Direct Transfer of Pristine Signe-Walled Carbon Nanotubes for Functional Nanoelectronics” by Chung Chiang Wu et al., Nanoletters 2010, 10, 1032-1036 “Fork stamping of pristine carbon nanotubes onto ferromagnetic contacts for spin-valve devices” by J. Gramich et al., Phys. Status Solidi B 252, 2496 (2015)
[0008] The aim of the present invention is to solve at least one of the problems of such processes according to the state of the art, and in particular to propose a process and a device for depositing a nano-object enabling: to obtain cleaner samples or components and / or more systematic transfer, and / or better control of the interface between the nano-object and the target substrate, and / or a better rate of integration of the nano-object, and / or better reproducibility of the deposition or integration of the nano-object, and / or better stability of the device produced, and / or better speed of execution, and / or increase the available surface area on the target substrate, by limiting the contact areas between the support and the target substrate during the transfer, these contact areas being generally defined by pits in the target substrate. Description of the invention
[0009] This objective is achieved with a process for depositing an object (preferably a nano-object) comprising: an approach, within an enclosure, of a support towards a carrier substrate, the support carrying an object (preferably a nano-object) to be transferred, the support preferably being a comb comprising at least two teeth, of which a pair of adjacent teeth carries an object (preferably a nano-object) to be transferred extended between the two teeth of the pair, then a transfer, within the enclosure, of the object from the support and towards a deposition zone of the carrier substrate (preferably while the deposition zone is located between the two teeth of the pair in the case of a comb).
[0010] The transfer step is preferably carried out while the inside of the enclosure is under vacuum at a pressure below 10⁻⁶ bar.
[0011] The approach may include optical control: of an inclination of the support relative to the deposit area, and / or of a relative position between the support and the deposit area, and / or of at least an angle between the support and the deposit area.
[0012] The method according to the invention (preferably the approach step) may include an adjustment, from outside the enclosure: of an inclination of the support relative to the deposit area inside the enclosure, and / or of a relative position between the support and the deposit area inside the enclosure, and / or of at least an angle between the support and the deposit area inside the enclosure.
[0013] During the adjustment stage: The support is preferably mobile relative to the enclosure, and the deposit area is preferably stationary relative to the enclosure.
[0014] The transfer can be carried out at a temperature inside the enclosure above -50°C and / or below +90°C.
[0015] The temperature inside the enclosure can be equal to the temperature outside the enclosure.
[0016] The process according to the invention may include encapsulation, within the enclosure and under vacuum at a pressure less than 10⁻⁶ bar, of the transferred object.
[0017] The carrier substrate may include, on either side of the deposition area, pits into which the teeth of the support are inserted during the transfer in the case where this support is a comb.
[0018] The deposition area may include electrodes or an electronic circuit, so that these electrodes and / or the electronic circuit are in contact, at the end of the transfer step, with the object to be transferred.
[0019] The method according to the invention may include, during the transfer step, an electrical measurement between two measuring electrodes of the deposition area.
[0020] The deposition zone may include two pairs of so-called cutting electrodes, the transfer preferably including an electric current flow between each pair of cutting electrodes so as to cut the object between each pair of cutting electrodes.
[0021] The method according to the invention may include, before the approach step, cleaning the deposition area inside the enclosure, preferably: by an ion gun, preferably by an Argon ion gun, and / or by stripping a protective layer with a plasma that selectively etches this protective layer.
[0022] Cleaning is preferably carried out while the inside of the enclosure is under vacuum at a pressure below 10⁻⁶ bar.
[0023] Vacuum at a pressure below 10⁻⁶ bar is preferably maintained from the cleaning stage until the transfer stage.
[0024] The support is preferably isolated from the substrate in a separate area, called a buffer zone, which is separated from the enclosure by a closed valve during the cleaning stage.
[0025] The object to be transferred may include or consist of a nanotube and / or a nanofiber and / or a nanowire and / or a carbon nanotube, and / or graphene and / or a two-dimensional heterostructure and / or a nanosheet.
[0026] The support: may comprise at least five teeth, preferably at least 25 teeth, and / or may have pairs of adjacent teeth spaced apart by a gap, defined according to a tooth alignment direction, greater than 5 µm and / or less than 100 µm, and / or may have teeth each having a width, defined according to a tooth alignment direction, greater than 5 µm and / or less than 100 µm, and / or may have teeth each having a length, defined according to a direction perpendicular to the tooth alignment direction, greater than 5 µm and / or less than 1000 µm.
[0027] The process according to the invention may include, prior to the approach step, the deposition or growth of carbon nanotubes on the support comprising: a catalyst is deposited on the support, followed by the growth of nanotubes on the support.
[0028] The catalyst may not be deposited uniformly on the support but may be deposited locally on an area less than 500 µm² per tooth at the end of several teeth of the support.
[0029] The method according to the invention may include, before the approach step, a localization and / or selection step, on the support, of the object to be transferred.
[0030] The selection may include a measurement of conductivity and / or chirality and / or defects of the object to be transferred.
[0031] According to yet another aspect of the invention, a device for depositing an object (preferably a nano-object) is proposed, said device comprising: an enclosure of means arranged to carry, in a support zone, a support, said support being preferably a comb comprising at least two teeth, means arranged to carry a substrate in a deposition zone, vacuum means arranged to create in the enclosure a vacuum at a pressure less than 10 -6 bar, manipulation means arranged to approach, in the enclosure, the support zone towards the deposition zone, so as to allow a transfer, in the enclosure, of an object (preferably a nano-object) from the support zone to the deposition zone.
[0032] The manipulation means are preferably arranged to approach, within the enclosure, the support area towards the deposition area, so as to allow a transfer, within the enclosure, of an object (preferably a nano-object) from the support area to the deposition area while the inside of the enclosure is in a vacuum at a pressure less than 10⁻⁶ bar created by the vacuum means.
[0033] The device according to the invention may include optical control means arranged to optically control: an inclination of the support relative to the deposit area, and / or a relative position between the support and the deposit area, and / or at least an angle between the support and the deposit area.
[0034] The device according to the invention may include adjustment means arranged to adjust, from outside the enclosure: an inclination of the support relative to the deposit area inside the enclosure, and / or a relative position between the support and the deposit area inside the enclosure, and / or at least an angle between the support and the deposit area inside the enclosure.
[0035] The adjustment means can be arranged so that the support area can be mobile relative to the enclosure while the deposit area is fixed relative to the enclosure.
[0036] The manipulation means can be arranged to approach, within the enclosure, the support area towards the deposition area, so as to allow a transfer, within the enclosure, of an object (preferably a nano-object) from the support area to the deposition area while the inside of the enclosure is at a temperature above -50°C and / or below +90°C.
[0037] The manipulation means can be arranged to approach, within the enclosure, the support area towards the deposition area, so as to allow a transfer, within the enclosure, of an object (preferably a nano-object) from the support area to the deposition area while the temperature inside the enclosure is equal to a temperature outside the enclosure.
[0038] The device according to the invention may include encapsulation means arranged to encapsulate, within the enclosure and under vacuum at a pressure less than 10⁻⁶ bar, an object (preferably a nano-object) transferred into the deposition zone.
[0039] The device according to the invention may include electrical and / or electronic means arranged to connect to electrodes or an electronic circuit located in the deposition area.
[0040] Electrical and / or electronic means may include means for performing an electrical measurement between two measuring electrodes located in the deposition zone.
[0041] Electrical and / or electronic means may include means for passing a current between each pair of cutting electrodes located in the deposition zone so as to cut an object (preferably a nano-object) between each pair of cutting electrodes.
[0042] The device according to the invention may include cleaning means arranged to clean the deposit area inside the enclosure, the cleaning means preferably comprising: an ion gun, preferably an Argon ion gun, and / or stripping means arranged to strip a protective layer by a plasma which selectively etches this protective layer.
[0043] The device according to the invention may include a valve arranged to: In a closed position, isolate the support area from the deposition area, and in an open position, do not isolate the support area from the deposition area.
[0044] According to yet another aspect of the invention, a comb is proposed comprising at least two teeth, of which at least one pair of adjacent teeth carries an object (preferably a nano-object) to be transferred extended between the two teeth of the pair.
[0045] The object to be transferred may include or consist of a carbon nanotube, a nanowire and / or graphene or a two-dimensional heterostructure.
[0046] The comb may include: at least five teeth, preferably at least 25 teeth, and / or pairs of adjacent teeth spaced apart by a gap, defined according to a tooth alignment direction, greater than 5 µm and / or less than 100 µm, and / or teeth each having a width, defined according to a tooth alignment direction, greater than 5 µm and / or less than 100 µm, and / or teeth each having a length, defined according to a direction perpendicular to the tooth alignment direction, greater than 5 µm and / or less than 1000 µm.
[0047] A growth catalyst for nano-objects (such as nanotubes) can be deposited on the comb.
[0048] The catalyst may not be deposited uniformly on the comb but may be deposited locally on an area less than 500 µm² per tooth at the tips of several teeth of the comb. The support or comb may include an adhesion layer for the nano-object.
[0049] The comb may include means for locating and / or selecting the object to be transferred on the comb. The comb may, for example, include means for measuring the conductivity and / or defects of the object to be transferred. In a further variant, the locating and / or selection means may, for example, include an electrode on each tooth; preferably such that the two electrodes of a pair of teeth are arranged to measure the presence and / or conductivity and / or defects of the object to be transferred located between the teeth of that pair.
[0050] According to yet another aspect of the invention, a method of using this last variant of the comb is proposed, in which an electrical response between the two electrodes of a pair of teeth is monitored or controlled.
[0051] According to yet another aspect of the invention, a method for using a comb according to the invention is proposed, in which an object (preferably a nano-object) located between two teeth of a pair of teeth is located and / or selected on the comb by a Rayleigh spectroscopy method. This selection may include determining the metallic or semiconducting nature of the object, the presence of defects on the object, and / or the chirality of the object. Description of the figures and methods of implementation
[0052] Other advantages and features of the invention will become apparent upon reading the detailed description of implementations and embodiments, which are by no means limiting, and the following attached drawings: there figure 1 is a profile view of a comb 1 according to the invention, with different enlargements of certain details figure 2 is a schematic view of a device 2 according to the invention, the figure 3is a schematic perspective view of teeth 3 of the comb 1 carrying a nano-object 6 and positioned above a substrate 5 figure 4 is a schematic profile view of teeth 3 of the comb 1 carrying the nano-object 6 and positioned above the substrate 5 figure 5 is a more detailed profile view of substrate 5, including a depositional zone 7 figure 6 illustrates: * in figure 6a a photo of the deposition zone 7 and its electrodes 91, 92, 93 * in figure 6b an increase in electric current between the pair 92 of electrodes until rupture or severance 25 of the nano-object 6 between the electrodes of the pair 92 * in figure 6c an increase in electric current between the pair 93 of electrodes until rupture or severance 26 of the nano-object 6 between the electrodes of the pair 93 the figure 7illustrates: * on its part (a) a variant of substrate 5 comprising two pits and two deposition zones 7 * on its part (b) an enlargement of one of the deposition zones 7 * on its part (c) an enlargement of part 27 of the figure 7(b) . there figure 8 illustrates a variant of the comb, device and method according to the invention.
[0053] These embodiments are not exhaustive; in particular, variants of the invention may be considered that comprise only a selection of features described or illustrated hereafter, isolated from the other described or illustrated features (even if this selection is isolated within a sentence including these other features), provided that this selection of features is sufficient to confer a technical advantage or to differentiate the invention from the prior art. This selection includes at least one preferably functional feature without structural details, and / or with only a portion of the structural details if this portion alone is sufficient to confer a technical advantage or to differentiate the invention from the prior art.
[0054] We will first describe, with reference to the figure 1 , a comb 1 according to the invention.
[0055] The comb 1 comprises at least two teeth 3, of which a pair 33 of neighboring teeth 3 carries a nano-object 6 to be transferred extended or suspended between the two teeth 3 of the pair 33.
[0056] The term nano-object is used in the case of an object having at least one of its external dimensions (typically its height, width, thickness, length) less than 100 nm: If its three external dimensions (defined along three orthogonal axes) are less than 100 nm, it is a nanoparticle. If two of its external dimensions (preferably defined along two orthogonal axes) are less than 100 nm, it is, for example, a hollow single- or multi-walled nanotube that may be closed at at least one end, or a nanofiber, i.e., a solid fiber. An electrically conductive or semiconducting nanofiber will subsequently be called a nanowire. If one external dimension is less than 100 nm (typically its thickness), it is a nanosheet.
[0057] As illustrated in the example on the figure 1 , the nano-object 6 to be transferred is a carbon nanotube, i.e. a single layer of carbon atoms rolled up on itself.
[0058] Comb 1 is a rectangular parallelepiped, one end of which includes all 3 aligned teeth.
[0059] Comb 1 is typically a multilayer formed by successive layers of Si, SiO2, Si, and Si3N4.
[0060] The comb 1 comprises at least five teeth 3, preferably at least twenty-five teeth 3. The example of the figure 1 illustrates a comb 1 with forty-eight teeth 3.
[0061] The comb 1 has pairs of adjacent teeth 3 spaced at a regular interval 12, defined according to an alignment direction 11 of the teeth 3, greater than 5 µm and / or less than 100 µm, equal to 30 µm on the figure 1 .
[0062] The comb 1 has teeth 3, each having a width 13, defined according to the alignment direction 11 of the teeth 13, greater than 5 µm and / or less than 100 µm, equal to 30 µm on the figure 1 .
[0063] Each tooth 3 has a thickness (perpendicular to the plane of the figure 1 ) of approximately 5 µm.
[0064] The teeth 3 are therefore located along the direction 11 with a spatial periodicity corresponding to the sum of the distance 12 and the width 13.
[0065] The comb has 3 teeth, each having a length 14, defined along a direction perpendicular to the alignment direction 11 of the teeth, greater than 5 µm and / or less than 1000 µm, equal to 500 µm on the figure 1 .
[0066] Comb 1 is produced by various stages of optical engraving and lithography.
[0067] Comb 1, with its 3 micrometer-sized teeth, forms a support with the least possible material, and: This allows for minimal contact surface constraints between comb 1 and target substrate 5 during mechanical transfer. It is more ergonomic for Rayleigh analysis of nanotubes, especially in a 90° geometry, because there is less parasitic signal from the scattering of comb 1.
[0068] The width of the teeth 3 allows lithography which enables the localization of the catalyst which initiates the growth of the nanotubes.
[0069] The comb 1 is adapted to the invention, which operates under vacuum. The presence of several teeth 3 allows for the placement of multiple objects 6, enabling them to be transferred one after another under vacuum (either by retrying or to different locations) without breaking the vacuum.
[0070] The embodiment of the process according to the invention illustrated includes, prior to the approach step described below, a deposition or growth of carbon nanotubes 6 on the comb 1.
[0071] This deposit includes: a catalyst deposition on comb 1, then growth of nanotubes 6 on comb 1 in solution or preferably by evaporation.
[0072] This growth can be carried out outside or inside enclosure 4 described below. It is preferably carried out in a growth oven, in the presence of CH4, H2 and Ar, heated to 900°C.
[0073] If this growth is carried out inside the enclosure, the process according to the invention preferably includes maintaining a vacuum at a pressure below 10⁻⁶ bar from the end of the growth step until the transfer step, preferably until the encapsulation step (described hereafter) under vacuum at a pressure below 10⁻⁶ bar of the nano-object 6 transferred into the deposition zone 7.
[0074] Thus, carbon nanotubes are formed directly on comb 1 by depositing catalyst in liquid solution on comb 1.
[0075] The catalyst (typically a solution of Fe(NO3)3, MoO2, Al2O3) is deposited: either uniformly or non-uniformly on the comb 1, i.e. it is deposited in a localized manner on a surface less than 500 µm² per tooth 3 at the end of several teeth 3 of the comb 1, preferably at the end of each tooth 3 of the comb 1, typically by an optical lithography method.
[0076] The growth stage is achieved by chemical vapor deposition (CVD) at 900°C under a flow of methane, hydrogen, and argon.
[0077] Evaporation allows for the controlled and unique deposition of a nano-object, the process including monitoring the electrical response of object 6. Object 6 is sensitive to the absorption of a single molecule. The response is monitored between the teeth 3 of the pair 33 thanks to the presence of electrodes on the comb 1, fabricated before the growth of object 6.
[0078] The support or comb 1 may include an adhesion layer for a nano-object, such as an adhesion polymer.
[0079] The embodiment of the process according to the invention illustrated includes, before the approach step described below, a localization and selection step, on the comb 1, of the nano-object 6 to be transferred.
[0080] As illustrated on the figure 1 that comb 1 carries several objects, but that: The nano-objects between the pair 333 of teeth 33 seem too numerous. The nano-object between the pair 332 of teeth 33 seems too far from the end of the teeth 3 of this pair 332.
[0081] The selection includes: a measurement of the presence of object 6, and / or a measurement of the conductivity of object 6 (including a quantification of this conductivity and / or a determination of its status, such as metallic or semiconducting), and possibly a measurement of its band gap if it is semiconducting and / or a measurement of the chirality of object 6 and / or a measurement of defects in object 6 and / or a measurement of the size of object 6 and / or the number of atomic layers of object 6 to be transferred, to check its properties and / or to distinguish it among several objects 6 among the different pairs of teeth 33.
[0082] Typically, at least one of these selections is implemented: by an optical method, preferably Rayleigh spectroscopy, using the electrodes carried by the comb 1 (except with regard to chirality)
[0083] In practice, at least one of these selections is implemented by a Rayleigh spectroscopy method (more precise), the comb electrodes (less precise) being used rather for monitoring the appearance of defects (especially desired defects such as molecular functionalizations) during a growth step of the object 6 (such as a carbon nanotube).
[0084] We will now describe, with reference to the figure 2 , a device 2 according to the invention for depositing or transferring or integrating an object 6.
[0085] Device 2 includes an enclosure 4. This enclosure 4 is a closed enclosure, at least in one position of use of device 2 in particular during the transfer step.
[0086] The enclosure is typically made of duralumin.
[0087] This enclosure 4 is designed to withstand a pressure difference between its interior 41 and its exterior 42 of at least 1 bar (its interior 41 being under negative pressure relative to its exterior 42).
[0088] Device 2 includes means 16 (such as a receptacle with means for fixing the comb 1) arranged to carry, in a support area (also called "comb area" in the case where the support 1 is a comb 1), the comb 1 comprising at least two teeth 3 of the pair 33 carrying the object 6.
[0089] By “support zone” or “comb zone”, we mean an area arranged to accommodate and carry respectively support 1 or comb 1.
[0090] Device 2 includes means 15 (such as a platform) arranged to carry a substrate 5 into a deposition area 7.
[0091] Device 2 includes vacuum means 17 arranged to create in enclosure 4 a vacuum at a pressure less than 10⁻⁶ bar, preferably less than 5.10⁻⁷ bar.
[0092] Vacuuming means typically include a turbo-molecular type pump and a spiral pump (for secondary and primary vacuums respectively).
[0093] Device 2 includes manipulation means 18 arranged to approach, in enclosure 4, the comb area and / or the comb towards the deposition area 7, so as to allow a transfer, in enclosure 4, of a nano-object 6 from the comb area to the deposition area 7 (typically when the deposition area 7 is inserted between the two teeth 3 of the pair 33).
[0094] The manipulation means 18 comprise at least one series of micromanipulators, each series being arranged to move the means 16 along three orthogonal axes. On the figure 2The manipulation means 18 comprise two series of micromanipulators 181, 182 in series and having finer spatial resolutions near the means 16. Typically, the means 18 comprise micromanipulators associated with piezoelectric motors (Attocube) allowing the precise positioning of the comb 1 relative to the substrate 5.
[0095] The manipulation means 18 include means 183 for adjusting the angles (roll, pitch, yaw around three axes perpendicular to each other) between: the comb zone or comb 1 and the target substrate 5 or the deposition zone 7.
[0096] The manipulation means 18 are arranged to approach, in the enclosure 4, the comb zone towards the deposition zone 7, so as to allow a transfer, in the enclosure 4, of a nano-object 6 from the comb zone to the deposition zone 7 while the interior 41 of the enclosure 4 is in a vacuum at a pressure less than 10 -6< bar (preferably less than 5.10 -7< bar ) created by the vacuum means 17.
[0097] Device 2 comprises 19 optical control means arranged to optically control: an inclination of the comb 1 relative to the deposition zone 7, and / or a relative position between the comb 1 and the deposition zone 7, and / or at least an angle between the comb 1 and the deposition zone 7.
[0098] The means 19 typically include: an optical objective (typically x50), and a window 28 (hermetic to gas but not to light collected by the objective) separating the interior 41 and the exterior 42 of the enclosure, the window 28 being disposed between the objective and the deposition zone 7 and / or the means 15.
[0099] Device 2 includes adjustment means 20 (including means 18, 181, 182, 183) arranged to adjust, from outside 42 of enclosure 4: an inclination of the comb 1 with respect to the deposition zone 7 inside 41 of the enclosure 4, and / or a relative position between the comb 1 and the deposition zone 7 inside 41 of the enclosure 7, and / or at least one angle (preferably three angles around three perpendicular axes) between the comb 1 and the deposition zone 7 inside 41 of the enclosure 7.
[0100] The adjustment means 20 are arranged so that the comb area can be mobile in rotation (around three perpendicular axes) and / or in translation relative to the enclosure 4 while the deposition area 7 and / or the means 15 is fixed relative to the enclosure 4.
[0101] The device further includes means 30 for adjusting the rotational position of the deposition zone 7 and / or means 15 relative to the enclosure 4.
[0102] The manipulation means 20 are arranged to approach, in the enclosure 4, the comb zone towards the deposition zone 7, so as to allow a transfer, in the enclosure 4, of a nano-object 6 from the comb zone to the deposition zone 7 while the inside 41 of the enclosure 4 is at a temperature greater than -50°C and / or less than +90°C, and / or while the temperature inside 41 of the enclosure 4 is equal to a temperature of the air outside 42 of the enclosure 4.
[0103] The device 2 includes encapsulation means 29 arranged to encapsulate, in the enclosure 4 and under vacuum at a pressure less than 10⁻⁶ bar (preferably less than 5.10⁻⁷ bar), a nano-object 6 transferred into the deposition zone 7.
[0104] Encapsulation means protecting the object 6 from direct contact with an atmosphere when the inside of the enclosure 4 is returned to this atmosphere having a pressure greater than 10⁻⁶ bar.
[0105] Device 2 comprises electrical and / or electronic means 21 (extending from means 15 to the outside of enclosure 4) arranged to connect to: electrodes (including at least two measuring electrodes 91 and / or at least two pairs 92, 93 of cutting electrodes), and / or a circuit 9 located in the deposition zone 7 and carried by the substrate 5 placed on the means 15.
[0106] The electrical and / or electronic means 21 include means for carrying out an electrical measurement between two measuring electrodes 91 located in the deposition zone.
[0107] The means 21 typically include: A current generator and / or a voltage generator, and respectively a voltmeter and / or an ammeter (and / or a synchronous detection).
[0108] The electrical and / or electronic means 21 include means 22 for circulating a current (of at least 20 µA) or generating a voltage (of at least 5 mV or even 10 mV) between the pair of cutting electrodes 92 located in the deposition zone 7 so as to cut a nano-object 6 between the pair of cutting electrodes 92.
[0109] The electrical and / or electronic means 21 include means 22 for circulating a current (of at least 20 µA) or generating a voltage (of at least 5 mV or even 10 mV) between the pair of cutting electrodes 93 located in the deposition zone 7 so as to cut a nano-object 6 between the pair of cutting electrodes 93.
[0110] The cutting electrode pairs 92 and 93 respectively are located at the ends of the deposition zone 7.
[0111] Device 2 includes cleaning means 23 arranged to clean the deposit area 7 inside enclosure 4, the cleaning means preferably comprising: an ion gun, preferably an Argon ion gun, and / or stripping means arranged to strip a protective layer by a plasma which selectively etches this protective layer.
[0112] Device 2 includes a valve 10 arranged for: in an open position (illustrated on the figure 1 ), do not isolate the comb area from the deposition area 7, and in a closed position (in which, with respect to the figure 1 , the manipulation means 18 position the means 16 to the right of the figure 2 ), isolate the comb area from the deposition area 7.
[0113] Thus, valve 10 is arranged to create isolation between: the receptacle 16 on which the object 6 is, and the interior 41 of the enclosure 4.
[0114] Device 2 is mounted on an air cushion table 24. This helps to reduce vibrations (especially from the pumping system 17).
[0115] We will now describe, with reference to figures 1 to 7 , an embodiment of the process according to the invention of depositing or transferring or integrating an object 6.
[0116] First, we place: the comb 1 on its receptacle 16 the substrate 5 on its receptacle 15.
[0117] Next, enclosure 4 is sealed airtight.
[0118] A secondary vacuum is created in enclosure 4, by means 17, at a pressure less than 10 -6< bar, preferably less than 5.10 -7< bar, typically equal to 10 -7< bar.
[0119] This embodiment of the process according to the invention then includes, before the approach step described below, cleaning the deposition zone 7 inside the enclosure 4 by: means 23 preferably including an ion gun, preferably an Argon ion gun, and / or by stripping a protective layer with a plasma which selectively etches this protective layer.
[0120] The cleaning step is carried out while the interior 41 of the enclosure 4 is under vacuum at a pressure less than 10⁻⁶ bar, preferably less than 5.10⁻⁷ bar.
[0121] Vacuum at a pressure below 10⁻⁶ bar (preferably below 5.10⁻⁷ bar) is maintained from the cleaning stage to the transfer stage.
[0122] The comb 1 is isolated (in a so-called buffer zone) from the part of the interior 41 of the enclosure comprising the substrate 5 by a closed valve 10 during the cleaning step.
[0123] This cleaning allows for optimal coupling between object 6 and substrate 5.
[0124] Next, we open valve 10.
[0125] This embodiment of the deposition (or integration or transfer) process of a nano-object 6 according to the invention then includes an approach, in the enclosure 4, of the comb 1 towards a carrier substrate 5 carried by the means 15.
[0126] Deposition zone 7 corresponds to a portion of substrate 5. The approach includes optical control by means of 19: of an inclination of the comb 1 with respect to the deposition zone 7, and / or of a relative position between the comb 1 and the deposition zone 7, and / or of at least an angle between the comb 1 and the deposition zone 7.
[0127] Thus, optical control is not only that of the inclination but also of the relative position, as well as the angles (roll, pitch, yaw), between the comb 1 and the target substrate 5.
[0128] These three angles (roll, pitch, yaw) are adjustable even when chamber 4 is closed. This angle positioning is interesting because it allows access to the unique properties of nano-objects. For example, two graphene sheets placed at an angle of 1.1° become superconducting.
[0129] The inclination between the receptacle 16 and the target substrate 5 is important here to minimize the contact area between the teeth 3 of the comb 1 and the target substrate 5.
[0130] As illustrated on the figure 3 This embodiment of the process according to the invention then includes an adjustment, by means 20, and from outside the enclosure 4: of an inclination of the comb 1 with respect to the deposition zone 7 inside 41 of the enclosure 4, and / or of a relative position between the comb 1 and the deposition zone 7 inside 41 of the enclosure 4, and / or of at least an angle between the comb 1 and the deposition zone 7 inside 41 of the enclosure 4.
[0131] During the adjustment stage: The comb 1 is mobile relative to the enclosure 4, and the deposition zone 7 is stationary relative to the enclosure 4.
[0132] Thus, a constraint is removed, since the deposition zone 7 does not necessarily have to be pointed. The movable comb 1 can be minimally inserted around the deposition zone 7.
[0133] Next, as illustrated on the figure 4, this embodiment of the process according to the invention includes a mechanical transfer, in the enclosure 4, of the nano-object 6 of the pair 33, 331 from the support 1 and towards the deposition zone 7 of the carrier substrate 5.
[0134] This transfer is implemented from the comb 1 while the deposition zone 7 is inserted between the two teeth 3 of the pair 33.
[0135] Thus, the mechanical transfer takes place at the end of the manufacturing of the assembly composed of the substrate 5 and the object 6, which makes it possible to preserve the nano-object 6 free of any chemical residue.
[0136] The carrier substrate 5 includes, on either side of the deposition zone 7, (two) pits 8 into which the teeth 3 of the comb 1 are inserted during the transfer.
[0137] The pits 8 are dug into the substrate 5 on either side of the place where the nano-object 6 is to be deposited. Each pit 8 is 2mm long, 200 µm wide and 15 µm deep.
[0138] The carrier substrate 5 includes in this non-limiting example a silicon substrate.
[0139] The transfer step (as well as the approach step) is carried out while the interior 41 of the enclosure 4 is under vacuum at a pressure less than 10⁻⁶ bar, preferably less than 5.10⁻⁷ bar.
[0140] The mechanical transfer therefore takes place under vacuum, which ensures clean contact between object 6 and substrate 5, which ensures better coupling, greater stability, and almost systematic integration.
[0141] The transfer (as well as the approach step) is carried out at a temperature 41 inside enclosure 4: greater than -50°C, preferably greater than 0°C, preferably greater than 10°C and / or less than +90°C, preferably less than 40°C, preferably less than 30°C.
[0142] By "enclosure temperature" or "temperature inside the enclosure", we preferably mean at least the temperature of the inner walls of the enclosure 4 in contact with the atmosphere inside 41 of the enclosure 4. Locally, the receptacle 15 and / or the substrate 5 and / or the deposition zone 7 can be cooled (for example by a cold finger) or heated (for example by a resistance).
[0143] During the transfer (as well as during the approach stage), the temperature inside 41 of the enclosure 4 is equal to an air temperature outside 42 of the enclosure 4 and / or outside the device 2.
[0144] In other words, the transfer (as well as the approach stage) takes place at ambient temperature, preferably between 10° and 30°, typically between 17 and 27°C.
[0145] As illustrated on the figure 5 , storage area 7 includes: electrodes 91, 92, 93, and / or a typically electronic and / or photonic and / or microfluidic circuit 9 that the substrate 5 carries, so that these electrodes (and / or circuit 9, depending on the height of the electrodes) are in contact, at the end of the transfer step, with the transferred nano-object 6.
[0146] Electrodes 91, 92, 93 comprise two measuring electrodes 91 located on the substrate 5 in the deposition zone 7.
[0147] This embodiment of the process according to the invention includes, during the transfer step, an electrical measurement between the two measuring electrodes 91 of the deposition zone 7, typically a voltage or current measurement between the two measuring electrodes 91. This makes it possible to verify the presence of the object 6 between the electrodes 91 and its contact with the electrodes 91.
[0148] The contact between object 6 and substrate 5 is detected by continuously measuring the electric current between the two electrodes 91 (this current becoming non-zero when object 6 touches both electrodes 91).
[0149] After the contact of the nano-object 6 and the substrate 5, and before the cut described later, the nano-object 6, as well as its contact with the target substrate 5, is characterized by electrical measurements; if these measurements are not suitable, one can try with another nano-object further along the comb 1. The electronic characteristics of the nanotube 6 in contact can be measured as previously described: metallic, semiconducting, gap size, defects, etc.
[0150] Electrodes 91, 92, 93 include in the deposition zone two pairs of so-called cutting electrodes 92, 93.
[0151] The two pairs 92 and 93 frame the electrodes 91.
[0152] One of the electrodes of pair 92 is preferably confused with one of the electrodes 91 and one of the electrodes of pair 93 is preferably confused with the other electrode 91.
[0153] The transfer includes a flow of current between each pair 92, 93 of cutting electrodes so as to cut the nano-object 6 between each pair of cutting electrodes.
[0154] There figure 6 illustrative: * in figure 6a a photo of the deposition zone 7 and its electrodes 91, 92, 93 * in figure 6b an increase in electric current (by means 22) between the pair 92 of electrodes until rupture or cutting 25 of the nano-object 6 between the electrodes of the pair 92 * in figure 6c an increase in electric current (by means 22) between the pair 93 of electrodes until rupture or severance 26 of the nano-object 6 between the electrodes of the pair 93
[0155] Object 6 is cut at two places located between the teeth 3 of pair 33 so as to separate it from comb 1 and attach it to substrate 5.
[0156] The cut provides information about the transferred object 6. If, for example, there are several nanotubes, they will cut for different values of electric current: there will be steps in the abrupt decrease in current indicating the cut.
[0157] One advantage of this embodiment of the invention compared to the prior art is the ability to remove the nano-object 6 with the in-situ Ar plasma while protecting the comb 1 in the buffer zone. The operation can thus be repeated.
[0158] Following the cutting, this embodiment of the process according to the invention therefore includes a step of verifying the nature and / or quality of the deposited nano-object 6 (this quality being, for example, a number of current jump steps measured during the cutting) and in case of non-quality (for example, in case of a number of jumps greater than 1; or greater than an upper threshold and / or less than a lower threshold): return of support 1 to the buffer zone closure of the buffer zone by valve 10 cleaning of the deposit zone 7 by means 23 opening of valve 10 and exit of support 1 repetition of the transfer step.
[0159] It is noted that the process according to the invention may include a displacement of the comb 1 by means 18 between different iterations of an object transfer 6 as described above, so as to: depositing several nano-objects 6 (initially carried by the comb 1 between different pairs of teeth 3) at different locations on the substrate 5; for example, as illustrated on the figure 7 , the substrate may in some variants comprise several deposition zones 7 such as the previously described deposition zone 7 and / or stack several nano-objects 6 (initially carried by the comb 1 between different pairs of teeth 3) on the substrate 1, and this without breaking the void created by means 17.
[0160] There figure 7This illustrates a substrate having, for each deposition zone 7, a quantum Q-bit architecture (the two zones 7 being linked by a coupling system), compatible with the invention. Implementing the invention for depositing a carbon nanotube on each zone 7 on such an architecture improves the characteristic lifetime of a quantum excitation by a factor of approximately 100 compared to depositing a carbon nanotube on the same architecture using a prior art method. The intrinsic noise limit for quantum excitations, determined by the proportion of carbon-13 atoms in the nanotube, is thus achieved according to the invention, highlighting the high cleanliness of the device.
[0161] Next, this embodiment of the process according to the invention includes encapsulation, inside 41 of the enclosure 4 and under vacuum at a pressure less than 10⁻⁶ bar (preferably less than 5.10⁻⁷ bar), of the transferred nano-object 6.
[0162] Two types of encapsulation are possible: hermetic encapsulation of the transferred nano object 6 where the entire target substrate 5 is kept under vacuum (encapsulation can be done by closing a hermetic lid on the target substrate 5, for example using a lid mounted on a ball joint rod inside the enclosure 4), or encapsulation only of the transferred nano object 6 by covering it with a material or nanomaterial which allows the nano object 6 to be isolated from the ambient atmosphere.
[0163] In a continuation of the process, the vacuum-encapsulated nano-object 6, which remains constantly under vacuum, can then be transported, for example by removing it from enclosure 4 and placing it in another piece of equipment, for example in a cryostat.
[0164] We will now describe, with reference to the figure 8 , a variant of comb 1, a variant of device 2 and a variant of method according to the invention.
[0165] These variants will only be described in terms of their differences from those previously described with reference to figures 1 to 7 .
[0166] In these variants, the nano-object 6 is a two-dimensional heterostructure or a nano-sheet, and typically includes graphene.
[0167] As in the case of the nanotube in the previous figures, object 6 illustrated on the figure 8 is transferred under vacuum while being carried by a support 1, more precisely by being carried: between two teeth 3 of the support or comb 1 (reference case 200), preferably when the deposition zone 7 is located between the teeth 3, or on a flat support 1 (reference case 300).
[0168] Object 6 is carried by support 1 preferably via an adhesion polymer 111.
[0169] The use of comb 1 prevents contamination of the deposited graphene 6 (on electrodes 91 and / or circuit 9) with the adhesion polymer 111.
[0170] As before, object 6 is cut by pairs 92, 93 and detached from support 1.
[0171] Advantageously, the cutting can be performed for an object 6 comprising two-dimensional conductive materials. It allows the detachment of only the first layer if the material consists of several sheets on the comb 1 and only the first sheet is to be detached from the comb 1 to the substrate 5.
[0172] The invention allows for the integration of a nano-object 6 onto the substrate 5 in a quasi-systematic and non-destructive manner.
[0173] The invention reduces contamination and degradation that can result from chemical processes, and therefore improves the performance and tunability of the object 6 assembled to the substrate 5.
[0174] The invention also allows the object 6 to be chosen when assembled to the substrate 5.
[0175] Thanks to the controlled atmosphere in enclosure 4, the connection between object 6 and substrate 5 is optimal.
[0176] The invention allows the mechanical transfer of a carbon 6 nanotube with a success rate close to 100%, i.e. with high efficiency.
[0177] The invention allows the transfer of a nano object 6 while maintaining flexibility on the target substrate 5, i.e. with the minimum of constraints on the target substrate 5.
[0178] The invention allows a nano object 6 to be transferred with speed in its execution thanks to optical control.
[0179] Mechanical transfer preserves the crystallinity of the nano-object 6.
[0180] In addition, the comb 1 allows us to test a large number of objects 6, previously characterized optically typically by the Rayleigh method.
[0181] Comb 1 has the advantage of allowing manipulation of object 6 free from any defects or residues. For example, functionalizing a nanotube with a single molecule is equivalent to adding a defect in a controlled manner. It is therefore advantageous to have a blank nanotube free of defects so that these do not compete with the effect of the single molecule on nanotube 6.
[0182] The applications of the invention are numerous, whether for manufacturing: A quantum circuit: Nanotube 6 can be used to create a quantum dot (in which an electron is trapped in three dimensions) or a one-dimensional channel for electrons. An optoelectronic component: Nanotube 6 can be used as a single-photon source. A nanotransistor. Other applications: a device for the mechanical transfer of graphene, two-dimensional heterostructures, nanowires, etc.
[0183] Of course, the invention is not limited to the examples just described and many modifications can be made to these examples without departing from the scope of the invention.
[0184] Thus, in combinable variants of the previously described embodiments: the nano-object to be transferred can be a nanotube or a nano-fiber or a nano-wire or graphene or a two-dimensional heterostructure (i.e. superposition of layers of graphene or other two-dimensional materials such as Hexagonal Boron Nitride (h-BN)) or a nano-sheet.
[0185] Of course, the various features, forms, variants, and embodiments of the invention can be combined in various ways, provided they are not incompatible or mutually exclusive. In particular, all the variants and embodiments described above are combinable.
Claims
1. Method for depositing an object, comprising: - moving, in a chamber (4), a comb (1) closer to a carrier substrate (5), the comb comprising at least two teeth (3), a pair (33) of neighbouring teeth of which carries an object (6) to be transferred extended between the two teeth of the pair, then - transferring, in the chamber, the object from the comb towards a deposition zone (7) of the carrier substrate while the deposition zone is inserted between the two teeth of the pair, characterised in that the transfer step is carried out while the interior of the chamber is under vacuum at a pressure of less than 10-6 bar.
2. Method according to claim 1, characterised in that the moving closer comprises an optical control: - of an inclination of the comb with respect to the deposition zone, and / or - of a relative position between the comb and the deposition zone, and / or - of at least one angle between the comb and the deposition zone.
3. Method according to claim 2, characterised in that the moving closer comprises an adjustment, from outside the chamber: - of an inclination of the comb with respect to the deposition zone inside the chamber, and / or - of a relative position between the comb and the deposition zone inside the chamber, and / or - of at least one angle between the comb and the deposition zone inside the chamber.
4. Method according to claim 3, characterised in that during the adjustment step: - the comb is movable with respect to the chamber, and - the deposition zone is immobile with respect to the chamber.
5. Method according to any one of the preceding claims, characterised in that: - the transfer is carried out at a temperature inside the chamber greater than -50°C and / or less than +90°C, and / or - the temperature inside the chamber is equal to a temperature outside the chamber.
6. Method according to any one of the preceding claims, characterised in that it comprises encapsulating, in the chamber and under vacuum at a pressure of less than 10-6 bar, the transferred object.
7. Method according to any one of the preceding claims, characterised in that the carrier substrate comprises, on either side of the deposition zone, pits (8) into which the teeth of the comb are inserted during the transfer.
8. Method according to any one of the preceding claims, characterised in that the deposition zone comprises electrodes or an electronic circuit (9), so that these electrodes and / or the electronic circuit are in contact, at the end of the transfer step, with the object to be transferred.
9. Method according to claim 8, characterised in that it comprises, during the transfer step, an electrical measurement between two measurement electrodes (91) of the deposition zone.
10. Method according to claim 8 or 9, characterised in that the deposition zone comprises two pairs of "cutting" electrodes (92, 93), the transfer comprising a flow of current between each pair of cutting electrodes so as to cut the object between each pair of cutting electrodes.
11. Method according to any one of the preceding claims, characterised in that it comprises, before the step of moving closer, cleaning the deposition zone inside the chamber, the cleaning being carried out while the inside of the chamber is under vacuum at a pressure of less than 10-6 bar, the vacuum at a pressure of less than 10-6 bar being maintained from the cleaning step to the transfer step.
12. Method according to claim 11, characterised in that the comb is isolated from the substrate by a closed valve (10) during the cleaning step.
13. Method according to any one of the preceding claims, characterised in that the object to be transferred is a carbon nanotube, a nanowire and / or graphene or a two-dimensional heterostructure.
14. Method according to any one of the preceding claims, characterised in that the comb: - comprises at least five teeth, preferably at least 25 teeth, and / or - has pairs of neighbouring teeth spaced apart by a space, defined according to a direction of alignment of the teeth, greater than 5µm and / or less than 100µm, and / or - has teeth each having a width, defined according to a direction of alignment of the teeth, greater than 5µm and / or less than 100um, and / or - has teeth each having a length, defined according to a direction perpendicular to the direction of alignment of the teeth, greater than 5µm and / or less than 1000µm.
15. Method according to any one of the preceding claims, characterised in that it comprises, before the step of moving closer, depositing carbon nanotubes on the comb, comprising: - depositing catalyst on the comb, then - growing the nanotubes on the comb.
16. Method according to claim 15, characterised in that the catalyst is not deposited uniformly on the comb but is deposited locally on a surface smaller than 500µm2 per tooth at the end of several teeth of the comb.
17. Method according to any one of the preceding claims, characterised in that it comprises, before the step of moving closer, a step of locating and selecting, on the comb, the object to be transferred.
18. Method according to claim 17, characterised in that the selection comprises a measurement of conductivity and / or chirality and / or defects of the object to be transferred.
19. Device for depositing an object, comprising: - a chamber (4) - means arranged to carry, in a comb area, a comb comprising at least two teeth (3), - means arranged to carry a substrate in a deposition zone, - vacuum means arranged to create a vacuum in the chamber at a pressure of less than 10-6 bar, - handling means arranged to move, in the chamber, the comb zone closer to the deposition zone, so as to allow a transfer, in the chamber, of an object from the comb zone to the deposition zone, characterised in that the handling means are arranged to move, in the chamber, the comb zone closer to the deposition zone, so as to allow a transfer, in the chamber, of an object from the comb zone to the deposition zone while the interior of the chamber is in a vacuum at a pressure of less than 10-6 bar created by the vacuum means.