MOS TRANSITOR, ISOLATED FROM THE SUBSTRATE OF AN INTEGRATED CIRCUIT, AND APPLICATION FOR DETECTING THE OPENING OF A CLOSED CONTAINER

Description

[0001] Embodiments and implementations of the invention relate to microelectronics, in particular MOS transistors isolated from the substrate of an integrated circuit, but also to the detection of the opening of a closed container containing, for example, a valuable product, for example a bottle of perfume, or a bottle of wine.

[0002] Some applications require integrated circuits containing MOS transistors electrically isolated from the integrated circuit substrate.

[0003] There is therefore a need to propose such MOS transistors having a structure that is simple to produce, and in particular compatible with conventional CMOS manufacturing processes using in particular two levels of polysilicon but also compatible with manufacturing processes for non-volatile memory cells having selection transistors with a gate buried in the substrate.

[0004] US 5712496A and FR 3091786 provide examples of dual-gate polysilicon transistors.

[0005] Document WO 2020 / 099747 describes a method and device for detecting an opening or an attempted opening of a closed container.

[0006] The invention relates to a system as defined by claim 1 and a detection method as defined by claim 15.

[0007] Preferred embodiments are defined by the dependent claims.

[0008] According to one aspect there is provided a system comprising an integrated circuit comprising a first substrate and at least one first MOS transistor.

[0009] This first MOS transistor has a first polysilicon region electrically isolated from the first substrate and including a gate region, a second polysilicon region electrically isolated from the first polysilicon region and the first substrate, and including a source region, a substrate region and a drain region of said first transistor, the first polysilicon region being located between an area of ​​the first substrate and the second polysilicon region.

[0010] Thus, such a transistor has two polysilicon regions, which makes it compatible with conventional CMOS manufacturing processes using two levels of polysilicon.

[0011] The gate region of the transistor is embedded in the first polysilicon region (the first polysilicon level) which lies between the integrated circuit substrate (called the "first substrate") and the second polysilicon region (the second polysilicon level).

[0012] And it is in this second polysilicon region, electrically isolated from the first region, and located above this first polysilicon region, that the source and drain regions of the first transistor are located, as well as the substrate region of this first transistor.

[0013] And, thus, even if the first polysilicon region is heavily doped, resulting for example from a conventional manufacturing process using in situ doping of the first polysilicon level, this is not detrimental to the operation of the first transistor since the active source and drain regions as well as the channel region (contained in the substrate region of the transistor), are located not in this first polysilicon region, but in the second polysilicon region.

[0014] According to one embodiment, the substrate region of the first transistor is advantageously less doped than the first polysilicon region.

[0015] This helps to reduce, or even eliminate, leakage between the source and drain regions of the first transistor.

[0016] For information purposes, the substrate region of the first transistor may comprise intrinsic polysilicon, i.e. having a doping of less than 10 15< atoms / cm3 or a dopant concentration of less than 10 17< atoms / cm3, for example of the order of 5.10 16< atoms / cm3.

[0017] The first polysilicon region can have a dopant concentration greater than 10 19< atoms / cm 3< , which may correspond to the in situ doping usually used in certain double-level polysilicon CMOS processes.

[0018] Doping the substrate region of the first transistor can also be used to advantageously adjust the threshold voltage of this first transistor.

[0019] This first transistor can be a PMOS transistor or an NMOS transistor.

[0020] According to a first variant, the integrated circuit may comprise an insulating trench, for example of the shallow trench type (STI: “Shallow Trench Isolation” in English), located in the first substrate of the integrated circuit and the first polysilicon region may then be located above this insulating trench.

[0021] According to an embodiment compatible with this first variant, the first polysilicon region may overflow from the second polysilicon region in the source-drain direction of the first transistor.

[0022] And also in this source-drain direction, the second polysilicon region rests on the first polysilicon region via a first dielectric region which may comprise, for example, a gate oxide framed by a silicon oxide-silicon nitride-silicon oxide stack.

[0023] In this embodiment, the gate contact can then advantageously be taken on the overhanging part of the first polysilicon region.

[0024] According to another embodiment, also compatible with this first variant, the first polysilicon region extends beyond the second polysilicon region in a direction perpendicular to the source-drain direction of the first transistor.

[0025] Furthermore, in the source-drain direction of the first transistor, the dimension of the second polysilicon region is greater than the dimension of the first polysilicon region and the second polysilicon region rests on the first polysilicon region as well as on the insulating trench via a second dielectric region, for example also of the silicon oxide-silicon nitride-silicon oxide type.

[0026] With this embodiment, a more compact structure is then obtained in which the gate contact can then be taken on the part of the first polysilicon region projecting from the second polysilicon region in the direction perpendicular to the source-drain direction.

[0027] According to yet another embodiment, also compatible with this first variant, the first polysilicon region projects from the second polysilicon region in a direction perpendicular to the source-drain direction of the first transistor.

[0028] Furthermore, in the source-drain direction of the first transistor, the dimension of the second polysilicon region is larger than the dimension of the first polysilicon region and the second polysilicon region rests on the first polysilicon region via a third dielectric region, for example a gate oxide, and also rests on the insulating trench.

[0029] In such a structure, it is possible to avoid the use of a silicon oxide-silicon nitride-silicon oxide stack while maintaining a compact structure.

[0030] According to a second variant, the integrated circuit may comprise an insulating trench located in the first substrate, for example again a trench of the shallow trench type, and a dielectric layer surrounding the first polysilicon region.

[0031] This first region of polysilicon surrounded by its dielectric layer extends through the insulating trench into the first substrate of the integrated circuit.

[0032] The substrate region of the first transistor rests at least in part on one end of the first polysilicon region surrounded by said dielectric layer and the source and drain regions rest on the insulating trench.

[0033] In this second variant, the first polysilicon region isolated from the first substrate of the integrated circuit is therefore a buried region, which makes such a variant compatible with the manufacturing methods of non-volatile memories with a selection transistor having a buried gate.

[0034] Thus, when the integrated circuit comprises at least one non-volatile memory cell of the selection transistor type having a gate buried in the first substrate, the first polysilicon region may have a shape similar to that of the buried gate of said selection transistor.

[0035] According to another embodiment, the integrated circuit may comprise a dielectric layer disposed between the first polysilicon region and the first substrate (of the integrated circuit), and a second MOS transistor comprising, in the first substrate, a source region, a drain region and a substrate region of the second transistor located between the source and drain regions and covered by said dielectric layer.

[0036] The first polysilicon region then comprises a gate region common to the first transistor and the second transistor.

[0037] This embodiment thus makes it possible to obtain a particularly compact two-transistor structure, one of the transistors being a transistor isolated from the first substrate of the integrated circuit and the other transistor being produced in this first substrate.

[0038] The second transistor can be an NMOS transistor or a PMOS transistor.

[0039] As we saw above, the first transistor can also be an NMOS transistor or a PMOS transistor.

[0040] And, when the first transistor is an NMOS transistor and the second transistor is a PMOS transistor or when the first transistor is a PMOS transistor and the second transistor is an NMOS transistor, we then obtain two complementary transistors (CMOS transistors) which are particularly compact and compatible with conventional CMOS transistor manufacturing processes.

[0041] According to another aspect there is provided a method of manufacturing a MOS transistor within an integrated circuit having a first substrate.

[0042] The method according to this aspect comprises a formation of a first polysilicon region electrically isolated from the first substrate, a formation of a second polysilicon region electrically isolated from the first polysilicon region and the first substrate, the first polysilicon region being located between an area of ​​the first substrate and the second polysilicon region, a formation within the second polysilicon region, of a source region and a drain region located on either side of a substrate region of the transistor, a formation of at least one source contact area on the source region and at least one drain contact area on the drain region and a formation of at least one gate contact area on the first polysilicon region.

[0043] According to one embodiment, the method comprises in situ doping of the first polysilicon region.

[0044] According to one embodiment, the method comprises an absence of doping of the substrate region or a doping of the substrate region lower than the in situ doping of the first polysilicon region.

[0045] According to one embodiment, the method comprises forming an insulating trench in the first substrate and forming the first polysilicon region above said insulating trench.

[0046] According to one embodiment, the formation of the first polysilicon region can be carried out simultaneously with the production of gates of non-volatile memory selection transistors, buried in the first substrate.

[0047] According to another possible embodiment, the formation of the first polysilicon region is carried out simultaneously with the formation of the floating gate of a dual-gate state transistor of a non-volatile memory cell.

[0048] According to one embodiment, the formation of the second polysilicon region can be carried out simultaneously with the formation of the gate of a low voltage transistor.

[0049] The transistor can be a PMOS or NMOS transistor.

[0050] Such a dual-level polysilicon MOS transistor with the gate in the first level can be advantageously used for detecting an opening of a container, as will be explained in more detail below.

[0051] Currently, in order to determine whether a product is suitable for use or sale, it is becoming increasingly mandatory to determine whether the container containing the product has not been opened, for example for the purpose of replacing the original product with a counterfeit or lower quality product.

[0052] A visual inspection of the container is no longer sufficient.

[0053] It has also been proposed to use an electrically conductive wire connecting two output terminals of an integrated circuit to detect non-opening or opening of the container corresponding respectively to non-sectioning or sectioning of said wire.

[0054] More precisely, the integrated circuit will compare the voltages present at the two output terminals to deduce whether or not the said wire is cut.

[0055] However, it turns out that if the wire, once cut, has been reattached, for example by means of solder or electrically conductive glue, the comparison of the voltages at the two output terminals of the integrated circuit will again correspond to a non-opening of the container when in reality it could have actually been opened.

[0056] There is therefore also a need to be able to detect not only a present cutting of the wire, but also a past cutting of the wire followed by a re-bonding of the latter, for example by a conductive glue or a soldering point, which could then be, for example, synonymous with an attempt to open or an opening of a container equipped with this wire with re-bonding of this wire after said opening.

[0057] The use of a first transistor as defined above, with a double polysilicon level with the gate in the first level and isolated from the substrate of the integrated circuit, provides a solution to this problem.

[0058] More specifically, according to one embodiment, the first transistor is for example a PMOS transistor having its source region connected to ground and having a threshold voltage such that it is on when a zero voltage is applied to its gate and blocked in the presence of a bias, for example negative, of its gate.

[0059] The first PMOS transistor is then a so-called “normally on” transistor, a term well known to those skilled in the art.

[0060] Thus, a system can then be proposed comprising a closed container, the integrated circuit as defined above and comprising this “normally on” PMOS transistor.

[0061] The integrated circuit has a first terminal and a second terminal connected by an electrically conductive wire having a severable portion and arranged to be severed at its severable portion in the event of opening or attempted opening of the container.

[0062] The system further comprises a detection device configured to detect a sectioning of the sectionable part, the detection device comprising within the integrated circuit a first capacitor electrically isolated from the first substrate of the integrated circuit and connected to the first terminal of the integrated circuit, the first PMOS transistor mentioned above, having its gate connected to the second terminal of the integrated circuit and its source connected to ground, a second capacitor electrically isolated from the first substrate of the integrated circuit and having a first electrode connected to the drain of the first PMOS transistor, and a measuring means configured to measure the voltage of said first electrode.

[0063] And, a voltage of said first electrode lower than a threshold is then representative of a present or past sectioning of said sectionable part of the wire.

[0064] That being said, such a system allowing the detection of a present or past sectioning of the sectionable part of the wire is not limited to the use of this first particular PMOS transistor.

[0065] Indeed, more generally, it is possible to use a first MOS transistor having its source and drain regions electrically isolated from the first substrate (of the integrated circuit), having its gate region connected to the second terminal of the integrated circuit and configured to be in an on state in the presence of a zero voltage applied to its gate and in a blocked state in the presence of a non-zero bias of its gate region.

[0066] Thus, more generally, a system is also proposed, comprising a closed container, an integrated circuit having a first substrate and first and second terminals connected by an electrically conductive wire having a sectionable portion and arranged to be sectioned at its sectionable portion in the event of opening or attempted opening of the container, and a detection device configured to detect sectioning of the sectionable portion, the detection device comprising within the integrated circuit, ○ a first capacitor electrically isolated from the first substrate of the integrated circuit and connected to the first terminal, ○ a first MOS transistor having its source and drain regions electrically isolated from the first substrate, having its gate region connected to the second terminal and configured to be in an on state in the presence of a zero voltage applied to its gate and in an off state in the presence of a non-zero bias of its gate region,○ a second capacitor electrically isolated from the first substrate of the integrated circuit and having a first electrode connected to the drain of the first PMOS transistor, and ○ a measuring means configured to measure the voltage of said first electrode, a voltage of said first electrode lower than a threshold being representative of a present or past sectioning of said sectionable part.

[0067] The first MOS transistor may be a MOS transistor as defined above (having its gate in the first polysilicon region and its source, substrate and drain regions in the second polysilicon region), or another transistor having another structure insulating it from the first substrate of the integrated circuit.

[0068] According to one embodiment, the first capacitor and the second capacitor are capacitors comprising two polysilicon electrodes separated by a dielectric and resting on an insulating region of the integrated circuit.

[0069] Passive contactless transponders, in particular NFC (“Near Field Communication”) transponders, for example tags, are well known to those skilled in the art.

[0070] It is particularly interesting to use them to detect an opening or an attempted opening by a malicious third party of a closed container containing, for example, a valuable product, such as a bottle of perfume.

[0071] Near field communication, better known to those skilled in the art as NFC (Near Field Communication), is a wireless connectivity technology that enables communication over a short distance, for example 10 cm, between electronic devices, such as contactless smart cards or labels, and readers.

[0072] More generally, NFC technology is a technology standardized by the NFC Forum consortium.

[0073] NFC technology is particularly suitable for connecting any type of user device and enables quick and easy communications.

[0074] A contactless transponder is a transponder capable of exchanging information via an antenna with a contactless reader, according to a contactless communication protocol.

[0075] An NFC transponder, which is a contactless transponder, is a transponder compatible with NFC technology.

[0076] NFC technology is an open technology platform standardized in ISO / IEC 18092 and ISO / IEC 21481 but incorporates many already existing standards such as the Type A and Type B protocols defined in ISO-14443 which can be communication protocols usable in NFC technology.

[0077] Contactless technology can also be used in RFID (Radio Frequency IDentification) transponders compatible with ISO 15693 and ISO 18000-3 standards.

[0078] When transmitting information between a reader and a passive transponder, the reader generates a magnetic field via its antenna which is generally, in the standards classically used, a sine wave (the carrier) at 13.56 MHz.

[0079] To transmit information from the reader to the transponder, the reader uses amplitude modulation of the said carrier.

[0080] The transponder demodulates the received carrier to deduce the data transmitted from the reader.

[0081] To transmit information from the transponder to the reader, the reader generates the magnetic field (the carrier) without modulation. The transponder's antenna then modulates the field generated by the reader, depending on the information to be transmitted. The frequency of this modulation corresponds to a subcarrier of the said carrier. The frequency of this subcarrier depends on the communication protocol used and can be, for example, 848 kHz.

[0082] This modulation is carried out by modifying the load connected to the terminals of the transponder antenna.

[0083] In other words, the transponder retro-modulates the wave from the reader to transmit information and does not incorporate, for the transmission of information, any actual transmission means, or transmitter, capable for example of generating its own magnetic field during transmission. Such a transponder without a transmitter is called a passive transponder, as opposed to an active transponder which includes a transmitter.

[0084] Generally, a passive transponder has no power supply because it uses the wave from the reader to power its integrated circuit.

[0085] As mentioned above, the transmission of information from the passive transponder to the reader is carried out by charge modulation.

[0086] Indeed, by changing the load across the transponder antenna, the output impedance of the reader antenna changes due to the magnetic coupling between the two antennas.

[0087] This load variation carried out during load modulation results in an amplitude and / or phase modulation of the signal (voltage or current) at the reader's antenna. A copy of the antenna current is generated and injected into the reader's reception chain where it is demodulated and processed in order to extract the transmitted information.

[0088] According to one embodiment, it is thus proposed that said system also comprises a passive contactless transponder configured to communicate with a reader via an antenna using a carrier signal, the transponder comprising the integrated circuit further having two antenna terminals connected to the antenna.

[0089] The integrated circuit also comprises a comparison means configured to compare the voltage of said first electrode of the second capacitor to said threshold, and processing means configured to in response to a first command from the reader, command a charge of the first capacitor, in response to a second command from the reader, command a charge of the second capacitor, in response to an activation command from the reader, activate the measuring means, and in response to a reading command from the reader, communicate the result of said comparison to the reader.

[0090] According to another aspect, a method is also proposed for detecting whether or not the sectioning, present or past, of the sectionable part of the electrically conductive wire of the system as defined above, comprising a charge of the first capacitor, a charge of the second capacitor, at least one measurement of the voltage of the first electrode of the second capacitor, and an analysis of the result of a comparison between said measured voltage and said threshold.

[0091] According to one embodiment, the method may comprise, in order to monitor the non-sectioning of the wire, and when the two capacitors have been charged only once, several measurements of the voltage of the first electrode carried out at temporally spaced measurement times and several comparisons between these measured voltages and said threshold, a measured voltage lower than said threshold at a measurement time indicating a sectionable part sectioned at said measurement time or previously at this measurement time.

[0092] Other advantages and characteristics of the invention will appear on examining the detailed description of modes of implementation and embodiment, which is in no way limiting, and the appended drawings in which: [ Fig 1 ] [ Fig 2 ] [ Fig 3 ] [ Fig 4 ] [ Fig 5 ] [ Fig 6 ] [ Fig 7 ] [ Fig 8 ] [ Fig 9 ] [ Fig 10 ] [ Fig 11 ] [ Fig 12 ] [ Fig 13 ] [ Fig 14 ] [ Fig 15 ] [ Fig 16 ] [ Fig 17 ] [ Fig 18 ] [ Fig 19 ] [ Fig 20 ] [ Fig 21 ] [ Fig 22 ] [ Fig 23 ] [ Fig 24 ] [ Fig 25 ], And [ Fig 26 ] illustrate modes of implementation and embodiment of the invention.

[0093] On the figure 1 , the reference IC designates an integrated circuit comprising a substrate SB1, hereinafter called “first substrate” so as to distinguish it from the substrate region RSB of the first transistor TRP whose structure will now be described.

[0094] This first transistor TRP, which is here a PMOS transistor, has a first polysilicon region P1 resting on an insulating trench 1, of the shallow trench type, formed in the first substrate SB1.

[0095] This first polysilicon region P1 is therefore electrically isolated from the first substrate SB1.

[0096] This first polysilicon region P1 includes a gate region RG of the first transistor TRP.

[0097] The first transistor TRP also comprises a second polysilicon region P2 electrically isolated from the first polysilicon region P1 via a first dielectric region 2 on which it rests.

[0098] In this example, the first dielectric region 2 comprises a gate oxide 21 framed by two dielectric stacks 20 each comprising, for example, a silicon oxide-silicon nitride-silicon oxide stack.

[0099] Since this second polysilicon region P2 is electrically isolated from the first polysilicon region P1, and this first polysilicon region P1 is electrically isolated from the first substrate SB1, the second polysilicon region P2 is also electrically isolated from the first substrate SB1.

[0100] The second polysilicon region P2 includes a source region RS, a substrate region RSB and a drain region RD of the first transistor TRP.

[0101] So, as we see on the figure 1 , the first polysilicon region P1 is located between a zone Z of the first substrate SB1 and the second polysilicon region P2.

[0102] In this exemplary embodiment, the first polysilicon region P1 extends beyond the second polysilicon region P2 in the source-drain direction of the first transistor and the second polysilicon region rests, as indicated above, on the first polysilicon region via the first dielectric region 2.

[0103] The overhanging part P1D of the first polysilicon region P1 allows the production on its surface of a silicided gate contact zone SG intended to receive a contact CG of conventional and known structure.

[0104] The first polysilicon region P1 can be doped quite heavily, for example with a dopant concentration greater than or equal to 10 19< atoms / cm3.

[0105] The substrate region of the first transistor is less doped than the first polysilicon region P1.

[0106] Thus, this substrate region RSB (in line with the gate oxide 21) may comprise intrinsic polysilicon, i.e. polysilicon having a dopant concentration less than or equal to 10 15< atoms / cm 3< . It could also be doped with a dopant concentration less than 10 17< atoms / cm 3< while of course remaining lower than the dopant concentration of the first polysilicon region P1.

[0107] Doping the RSB substrate region allows adjustment of the threshold voltage of the first TRP transistor.

[0108] In this example, since the first transistor TRP is a PMOS transistor, the source RS and drain RD regions are P+ doped (and are directly above the gate oxides 20).

[0109] Furthermore, in a conventional and known manner, the source region RS comprises on its upper surface a silicided source contact zone SS intended to receive a source contact CS of conventional structure.

[0110] The drain region RD has on its upper surface a silicided drain contact zone SD intended to receive a drain contact CD of conventional structure.

[0111] A first TRN transistor illustrated on the figure 2 simply differs from the first TRP transistor of the figure 1 in that the TRN transistor is an NMOS transistor with this time the source RS and drain RD regions doped N+.

[0112] There figure 3 , and the figure 4 which is a section along line IV-IV of the figure 3 , schematically illustrate another embodiment of a first TRP transistor which is again a PMOS transistor, it being understood that it could also be an NMOS transistor depending on the type of doping of its source and drain regions.

[0113] In the embodiment of the figure 3 , we see that the dimension of the second polysilicon region P2 is this time greater, in the source-drain direction, than the dimension of the first polysilicon region P1.

[0114] The second polysilicon region P2 this time rests on the first polysilicon region and on the insulating trench 1 via a second dielectric region 3. This second dielectric region comprises, like the first dielectric region 2, a silicon oxide-silicon nitride-silicon oxide stack 30 and a gate oxide 31.

[0115] The source and drain regions rest on the insulating region via the stacks 30 while the RSB substrate region rests partly on the first polysilicon region 1 via the gate oxide 31.

[0116] And, as illustrated on the figure 4 , the first polysilicon region P1 this time overflows from the second polysilicon region P2 in a direction perpendicular to the source-drain direction of the first transistor.

[0117] And, it is again on this overhanging part P1D that the silicided zone SG of the gate contact is located, intended to receive the gate contact CG.

[0118] The RSB substrate region also has on its upper surface a substrate contact SSB silicided area for receiving a CRSB substrate contact.

[0119] It should be noted that, on the figures 1 et 2 , this substrate contact is not shown for simplification purposes.

[0120] The TRP transistor of the figure 5 differs from the TRP transistor of the figure 3 in that the 30 silicon oxide-silicon nitride-silicon oxide stack has been removed.

[0121] And in this embodiment, the second polysilicon region P2 rests on the first polysilicon region P1 via a third dielectric region 40 which is here a gate oxide, and also rests directly on the insulating trench 1 at the source RS and drain RD regions.

[0122] And, the first polysilicon region P1 overflows from the second polysilicon region P2 in a direction perpendicular to the source-drain direction of the first transistor in a manner analogous to what was illustrated in the figure 4 .

[0123] We now refer more particularly to the figures 6 And 7which illustrate another variant embodiment of a first MOS transistor, which again is a PMOS transistor, it being understood that it could also be an NMOS transistor depending on the type of doping of its source and drain regions.

[0124] Again, the integrated circuit IC has an insulating trench 1 located in the first substrate SB1.

[0125] In this embodiment, the first polysilicon region P1 is surrounded by a dielectric layer 5, for example silicon dioxide.

[0126] And, the first polysilicon region P1 surrounded by its dielectric layer 5 extends through the insulating trench 5 into the first substrate SB1.

[0127] Furthermore, the second polysilicon region P2 still comprises the source region RS, the drain region RD and the substrate region RSB located between the source region RS and the drain region RD.

[0128] The substrate region RSB of the transistor TRP rests at least partly on one end 51 of the first polysilicon region surrounded by the dielectric layer 5 while the source regions RS and drain RD rest on the insulating trench 1.

[0129] Therefore, also in this embodiment variant, the first polysilicon region P1 is located between a zone Z of the first substrate and the second polysilicon region P2.

[0130] The second polysilicon region is again electrically isolated from the first polysilicon region and also electrically isolated from the first substrate SB1.

[0131] As seen on the figure 7 which is a section along line VII-VII of the figure 6 , the first polysilicon region P1 surrounded by its dielectric layer 5 overflows from the second polysilicon region P2 in a direction perpendicular to the drain-source direction which allows, as has been described with reference to the figure 4 , in contact with the CG grid, to come into contact with the silicided zone SG.

[0132] This embodiment variant is therefore compatible with a method of manufacturing non-volatile memory cells of the selection transistor type having a gate buried in the first substrate SB 1.

[0133] In fact, the production of the first buried polysilicon region can be carried out simultaneously with the production of the buried gates of the selection transistors of these memories.

[0134] And the first polysilicon region then has, for example, a shape similar to that of the buried gate of such a selection transistor.

[0135] In practice, the first MOS transistor comprises on the upper surface of the second polysilicon region P2, a protective layer intended to protect the underlying part of the second polysilicon region P2 during the siliciding step making it possible to obtain the silicidated zones.

[0136] For purposes of simplification of figures 1 à 7 , this protective layer is not shown in these figures, but will be mentioned during the description of the figure 8 and will be represented on the figures 13 à 15 .

[0137] We now refer more particularly to the figure 8 to describe a mode of implementation of a method of manufacturing a first MOS transistor.

[0138] In the substrate SB1, the first polysilicon region P1 isolated from the first substrate SB1 is formed (step ST80).

[0139] For example, after having conventionally produced the insulating trench 1, of the shallow trench type, the formation of the first polysilicon region P1 may comprise a deposition of polysilicon followed by etching (in the case, for example, of the embodiments of figures 1 à 5 ), or a deposit in a deep trench followed by chemical-mechanical polishing (in the case, for example, of the method of producing the figures 6 And 7 ). In this regard, more precisely, after having made the shallow trench 1, a deep etching is carried out through this trench 1 so as to make the deep trench, followed by an oxidation of this deep trench. Then a layer of polysilicon is deposited so as to fill the trench and the excess polysilicon is removed, for example by chemical-mechanical polishing.

[0140] Optionally, in situ ST81 doping of the first polysilicon region can be provided if a step similar to that of a conventional CMOS manufacturing process is used.

[0141] Then, in step ST82, the second polysilicon region P2 is formed isolated from the first polysilicon region P1 and the first substrate SB1.

[0142] For information purposes, this formation may comprise firstly a formation of a dielectric region (for example a growth of silicon oxide) on the polysilicon region formed in step ST80 then a deposition of a second level of polysilicon followed by etching, or in the case of a first buried polysilicon region, a deposition of a level of polysilicon on the insulating trench followed by etching, to form the second polysilicon region P2.

[0143] At this stage, we therefore obtain the first polysilicon region P1 between an area of ​​the first substrate SB1 and the second polysilicon region P2.

[0144] Then, in step ST83, the source regions RS and drain regions RD are formed in a conventional manner known per se, the substrate region RSB being located between the source and drain regions and being less doped than the first polysilicon region P1.

[0145] Optionally, localized doping of this RSB substrate region can be performed to adjust the threshold voltage of the transistor.

[0146] Then, in step ST84, the silicided zones SS, SB and SG are formed in a conventional and known manner after having protected the zones not to be silicided with the protective layer mentioned above.

[0147] We now refer more particularly to the figures 9 à 14 , which illustrate in more detail a mode of implementation of a method of producing a transistor such as that described in figure 1 .

[0148] On the figure 9 , after having produced in a conventional and known manner the insulating trench 1 in the first substrate SB1 of the integrated circuit, the first polysilicon region P1 is formed by deposition of polysilicon then etching.

[0149] The formation of this first polysilicon region can, for example, be carried out simultaneously with the formation of the floating gate of a double-gate state transistor of a non-volatile memory cell.

[0150] On the figures 10 à 14 , for simplification purposes, the first substrate SB1 is no longer shown.

[0151] Then, as illustrated in the figure 10 , the first polysilicon region P1 is covered with the first dielectric region 2 comprising a silicon oxide growth and a deposition of a silicon oxide-silicon nitride-silicon oxide stack. In practice, the silicon oxide-silicon nitride-silicon oxide stack is first deposited, then the area in which the silicon oxide growth is to be carried out is masked. The stack in this area is removed and then the silicon oxide growth is carried out in this area.

[0152] Then, as illustrated in the figure 11 , we form, by depositing a second level of polysilicon and etching, the second region of polysilicon P2 which rests on a part of the dielectric region 2.

[0153] The formation of this second polysilicon region can, for example, be carried out simultaneously with the formation of the gate of a low-voltage transistor of a memory circuit, for example, that is to say a transistor capable of supporting a gate-source voltage, for example, less than or equal to 3 volts.

[0154] To the figure 12 , the insulating lateral regions or ESP1 spacers are produced in a conventional and known manner on the sides of the first region P1 and the ESP2 spacers on the sides of the second region P2.

[0155] Then, a localized implantation of the second polysilicon region P2 is carried out so as to form the source RS and drain RD regions.

[0156] We then proceed to the deposit ( figure 13 ), on the upper surface of the second polysilicon region P2, of the protective layer SPRT, mentioned above, intended to protect the underlying part of the second polysilicon region P2 during the siliciding step which is described in figure 14 .

[0157] More precisely, during this siliciding step, the SS, SG and SD silicidated zones are produced in a conventional and known manner.

[0158] We now refer more particularly to the figure 15 which illustrates an example of the realization of two transistors TR1 and TR2.

[0159] The first transistor TR1 is a transistor having a structure similar to that described with reference to figures 1 et 2 .

[0160] In this example, the first transistor TR1 is an NMOS transistor but of course, transistor TR1 could also be a PMOS transistor by means of P+ doping of the source RS1 and drain RD1 regions.

[0161] This figure also shows the anti-silicidation protection layer which covers the substrate region RSB1 of the transistor TR1 as well as partially the source regions RS1 and drain RD1.

[0162] The first polysilicon region P1 of the first transistor TR1 rests on the first substrate SB1 of the integrated circuit IC via a dielectric layer 6, for example a gate oxide.

[0163] And, the integrated circuit IC then includes a second transistor TR2, here an NMOS transistor.

[0164] This second transistor TR2 comprises, in the first substrate SB1, a source region RS2, a drain region RD2 and a substrate region RSB2 between the source and drain regions, this substrate region RSB2 being covered by the dielectric layer 2.

[0165] And, the first polysilicon region P1 has a gate region common to the first transistor TR1 and the second transistor TR2.

[0166] Of course, the second transistor TR2 could be a PMOS transistor if the source RS2 and drain RD2 regions were P+ doped.

[0167] We therefore see that if one of the two transistors is an NMOS transistor and the other a PMOS transistor, then we obtain two complementary transistors with a compact structure.

[0168] We now refer more particularly to the figures 16 and following which schematically illustrate embodiments and implementations of a SYS system allowing detection of an opening or an attempted opening of a closed container.

[0169] On the figure 16 , the SYS system comprises a closed RCP container and an integrated circuit having a first terminal TDI and a second terminal TDO connected by an electrically conductive wire FL1.

[0170] This wire has a FL10 severable portion and is arranged to be severed at its severable portion in the event of opening or attempted opening of the RCP container.

[0171] The SYS system also includes a DSD detection device, incorporated here within the integrated circuit IC, and configured to detect a present or past sectioning of the sectionable part FL10 of the wire FL1.

[0172] As illustrated in the figure 17 , the RCP container may be a box comprising a CRP body closed by a CV cover forming with the CRP body an FNT slot.

[0173] Of course, this is just an example and the RCP container can take any shape appropriate to the contents of the container. The container could be, for example, a wine or liquor bottle closed with a cork.

[0174] In the example of the figure 17 , the electrically conductive wire FL1, surrounded by an insulating sheath, winds so as to extend alternately over the CV cover and over the CRP body.

[0175] This coil-shaped part FL10 forms the sectionable part of the electrically conductive wire.

[0176] In fact, when opening the CV cover, the FL1 wire will be cut at the sectionable part FL10.

[0177] Of course, the design of the figure 17 is not to scale and the person skilled in the art will know how to choose the appropriate diameter for the FL1 wire in order to guarantee that it is cut when the CV cover is opened.

[0178] The integrated circuit IC is for example fixed on a wall of the CRP body.

[0179] Then, once this assembly is done, the whole thing is covered with a CH cover as illustrated very schematically on the figure 18 .

[0180] We now refer more particularly to the figure 19 which illustrates an example of the implementation of a DSD detection device.

[0181] The DSD device here comprises a first capacitor C1, electrically isolated from the first substrate SB1 of the integrated circuit and having a first electrode BC11 connected to the first terminal TDI of the integrated circuit.

[0182] In this embodiment, the second electrode BC12 of the first capacitor C1 is connected to a supply voltage VCC1 via a first auxiliary capacitor CTUN1 and a first controllable switch SW1.

[0183] The DSD device also comprises a first MOS transistor TR having its source and drain regions electrically isolated from the first substrate SB1 and having its gate region connected to the second terminal TDO of the integrated circuit.

[0184] Generally, the first transistor TR is configured to be in an on state in the presence of a zero voltage applied to its gate and in a off state in the presence of a non-zero bias of its gate region.

[0185] By way of non-limiting example, the first transistor TR may be a PMOS transistor such as that described with reference to figures 1 And 3 à 7 .

[0186] In this case, the first PMOS transistor TR has for example its source connected to ground GND and is configured for, as illustrated in the figure 21 , be blocked in the presence of a negative Vg bias (for example -2 volts) applied to its grid and passing in the presence of a zero Vg voltage applied to its grid.

[0187] The first transistor TR is then normally on

[0188] To obtain such a configuration, the threshold voltage of this first PMOS transistor TR is negative and for example of the order of -600 to -700 mV.

[0189] The DSD device also includes a second capacitor C2 electrically isolated from the first substrate SB1 of the integrated circuit.

[0190] This second capacitor C2 has a first electrode BC21 connected to the drain of the first transistor TR.

[0191] The second capacitor C2 has a second electrode BC22 connected to a supply voltage VCC2 via a second auxiliary capacitor CTUN2 and a second controllable switch SW2.

[0192] The DSD detection device also comprises a measuring means MES configured to measure the voltage of the first electrode BC21.

[0193] As will be seen in more detail below, a voltage of the first electrode lower than a threshold TH is representative of a present or past sectioning of the sectionable part FL10 of the wire FL1.

[0194] In this regard, in this embodiment, the integrated circuit IC comprises a comparison means CMP configured to compare the voltage of the first electrode delivered by the measuring means MES to the threshold TH and deliver a signal SRS representative of the result of the comparison.

[0195] This SRS signal can be a signal having a high state when the measured voltage is lower than the TH threshold and a low state when the measured voltage is higher than the TH threshold.

[0196] Of course, the reverse is possible.

[0197] An exemplary embodiment making it possible to obtain capacitors C1 / C2 electrically isolated from the first substrate SB1 is illustrated schematically in the figure 20 .

[0198] We see in this figure that the first capacitor C1 and the second capacitor C2 are capacitors comprising two electrodes P10 and P20 made of polysilicon, separated by a dielectric 8 comprising for example a stack 80 of the silicon oxide-silicon nitride-silicon oxide type.

[0199] These capacitors rest on an insulating trench 100, for example of the shallow trench type, provided in the first substrate SB1.

[0200] Before returning in detail to the operation of the SYS system, it should be noted here that, as indicated above, a PMOS transistor TRP such as that described with reference to figures 1 And 3 à 7 , is not the only possible transistor that can be used.

[0201] Indeed, any transistor having its source and drain regions electrically isolated from the first substrate and configured to be in an on state in the presence of a zero voltage applied to its gate and in a off state in the presence of a non-zero bias of its gate region, is suitable.

[0202] This could be the case, for example, of a TRP100 transistor such as the one illustrated in the figure 22 .

[0203] This TRP100 transistor is also a dual-level polysilicon PMOS transistor whose first polysilicon region P100 rests on a shallow trench type insulating trench 15 and whose second polysilicon region P200 rests on the first polysilicon region P100 via a gate oxide 9.

[0204] But, unlike the TRP transistor of the figure 1 for example, this TRP100 transistor has its gate region located in the second polysilicon region and its source and drain regions located in the first polysilicon region.

[0205] Compared to such a TRP100 transistor, a TRP transistor such as that described with reference to figures 1 And 3 à 7 is more advantageous because it has less leakage between the source and drain regions since these are arranged in the second polysilicon region whose substrate region is either intrinsic or lightly doped polysilicon.

[0206] It would also be possible in the case where the substrate is a silicon-on-insulator (SOI) substrate comprising a carrier substrate topped with a buried insulating layer known to those skilled in the art by the English name BOX (Burried Oxide) itself topped with a semiconductor film, to place a MOS transistor in and on the semiconductor film. The latter would then be electrically isolated from the carrier substrate of the integrated circuit via the buried BOX layer.

[0207] Of course, while it is generally easier to provide a PMOS transistor as a TR transistor, the use of an NMOS transistor is not excluded.

[0208] We now refer more particularly to the figure 23 to describe the operation of the SYS system.

[0209] In a step STP 220, the first capacitor C1 is charged.

[0210] This charging is carried out by closing the switch SW1 so as to connect the first auxiliary capacitor CTUN1 to the supply voltage VCC1.

[0211] One role of the first auxiliary capacitor CTUN1 is to allow an injection of charges into the first capacitor C1 by Fowler-Nordheim effect or by a phenomenon of injection of hot electrons.

[0212] The thickness of the dielectric layer of the first auxiliary capacitor CTUN1, for example 65-95 angstroms, is advantageously less than that of the first capacitor C1 to allow the capacitive structure to be programmed without using too high a voltage.

[0213] The dielectric layer of the first capacitor C1, thick because it uses a silicon oxide-silicon nitride-silicon oxide stack, allows for a capacitive structure that is well insulated from the first substrate SB1. Such a thickness, for example 150-200 angstroms, offers very high charge retention, typically of the order of two decades, and avoids the risk of leakage on the first auxiliary capacitor CTUN1.

[0214] The first capacitor C1, once charged, then presents at its first electrode BC11 a voltage, for example negative and equal to -2 volts.

[0215] In step STP221, the second capacitor C2 is charged by this time connecting the second auxiliary capacitor CTUN2 to the supply voltage VCC2 via the first closed switch SW2.

[0216] The function of the second auxiliary capacitor CTUN2 is analogous to that of the first capacitor CTUN1.

[0217] Once charged, the voltage VC2 of the first electrode BC21 of the second capacitor C2 is for example a positive voltage equal to 2 volts.

[0218] This voltage VC2 is measured in step STP222 by the measuring means MES.

[0219] In this respect, the MES measuring means can be, for example, produced by a MOS transistor whose gate is connected to the electrode BC21, whose source is connected to ground and whose drain is connected to a current source allowing a current-voltage conversion of the drain current of this transistor.

[0220] The node BC21 is therefore not connected to the first substrate SB1 and to avoid gate leaks as much as possible, a high voltage MOS transistor with, for example, a gate oxide of the order of 200 angstroms will preferably be used.

[0221] If the sectionable part FL10 of the wire FL1 is not sectioned, then the transistor TR is blocked because its gate voltage is equal to -2 volts.

[0222] As a result, the second capacitor remains charged and if we choose a threshold TH equal to, for example, 1 volt, the comparison carried out in step STP223 shows that this voltage VC2 is greater than the threshold TH, which means that the sectionable part FL10 is not sectioned.

[0223] On the other hand, if the FL10 part of the wire is cut, then the gate voltage of the transistor TR is zero, which turns on this transistor TR and therefore connects the electrode BC21 to the ground GND.

[0224] This results in a discharge of the second capacitor C2 and consequently a drop in voltage VC2.

[0225] This then becomes lower than the TH threshold, which is representative of a sectioning of the sectionable part FL10.

[0226] It should be noted that a VC2 voltage lower than the TH threshold is also representative of a past sectioning of the sectionable part FL10 followed by a reconstitution, for example by spot welding, of this sectionable part.

[0227] In fact, as soon as the wire has been cut, the gate voltage of the transistor becomes zero and it becomes conductive, discharging the second capacitor C2 and causing the voltage VC2 to fall below the threshold TH.

[0228] And, even if the wire is reassembled, capacitor C2 remains discharged.

[0229] It is also possible, as schematically illustrated in the figure 24 , to monitor, at time intervals, regular or not, the state of the sectionable part of the wire.

[0230] Indeed, once capacitors C1 and C2 have been charged, we can carry out, in step STP230, a first measurement of voltage VC2 at time T0. Then, in step STP231, we compare voltage VC2 to the threshold.

[0231] If this voltage is lower than the threshold, then this means that the sectionable part is sectioned or has been sectioned.

[0232] If the VC2 voltage is higher than the threshold, this means that the sectionable part FL10 has never been sectioned.

[0233] And, we can then proceed to repeat steps STP230 and STP231 at measurement times Ti spaced in time (represented by the incrementation of the index i in step STP232).

[0234] And, a measured voltage lower than the threshold TH at a measurement time Ti then indicates that the sectionable part of the wire is either sectioned at this measurement time or has been sectioned previously at this measurement time.

[0235] It is particularly advantageous, as illustrated in the figure 25 , to use a passive transponder in combination with a reader to detect the present or past sectioning of the FL1 wire.

[0236] In this regard, on the figure 25 , the SYS system also includes a passive contactless transponder TG, for example a label (Tag).

[0237] The passive transponder TG is configured to communicate with an RD reader, for example a cellular mobile phone having a contactless reader function, via an ANT antenna using a carrier signal having a frequency for example equal to 13.56 MHz.

[0238] The TG passive contactless transponder is a transponder capable of communicating using a contactless communication protocol, for example using near field communication (NFC) technology.

[0239] This transponder can also be an RFID transponder using this NFC technology.

[0240] The TG transponder includes the integrated circuit IC which can be, for example, an integrated circuit from the ST25 family marketed by the company STMicroelectronics.

[0241] In addition to the two TDI and TDO terminals already described, the integrated circuit has two antenna terminals AC0 and AC1 respectively connected to the two terminals of the ANT antenna.

[0242] The IC circuit also includes MT processing means, for example including an energy recovery circuit, a microprocessor and / or hard-wired logic and a memory.

[0243] The processing means are configured to deliver a supply voltage to the entire integrated circuit from the magnetic field received from the reader and process the information received from the reader and retromodulate the carrier signal for the transmission of information to the reader.

[0244] More precisely, as illustrated in the figure 26 , the MT processing means are configured to in response to a first command CMD1 emanating (step STP260) from the reader, commanding (step STP262) a charge of the first capacitor C1, in response to a second command CMD2 emanating (step STP261) from the reader, commanding (step STP263) a charge of the second capacitor C2, in response to an activation command CMDA emanating (step STP264) from the reader, activating (step STP265) the measuring means and, in response to a reading command emanating (step STP266) from the reader, communicating (step STP267) the result SRS of said comparison to the reader RD.

Claims

1. A system, comprising an integrated circuit including - a first substrate (SB1) and - at least one first MOS transistor (TRP) having a first polysilicon region (P1) electrically insulated from the first substrate and including a gate region (RG), a second polysilicon region (P2) electrically insulated from the first polysilicon region (P1) and from the first substrate (SB1) and including a source region (RS), a substrate region (RSB) and a drain region (RD) of said first transistor, the first polysilicon region (P1) being located between a zone (Z) of the first substrate (SB1) and the second polysilicon region (P2), wherein the first transistor (TRP) is a PMOS transistor, - the first PMOS transistor (TRP) has its source region connected to the ground and has a threshold voltage such that it is ON when a zero voltage is applied to its gate, and OFF in the presence of a negative bias of its gate, and wherein the system comprises: - a closed container (RCP), - the integrated circuit (IC) having a first and a second terminal (TDI, TDO) connected by an electrically conductive wire (FL1) having a severable part (FL10) and arranged to be severed at its severable part in case of opening or attempting to open the container, and - a detection device (DSD) configured to detect severing of the severable part, the detection device including, within the integrated circuit, a first capacitor electrically insulated from the first substrate of the integrated circuit and connected to the first terminal, the first PMOS transistor having its gate connected to the second terminal and its source connected to the ground, a second capacitor electrically insulated from the first substrate of the integrated circuit and having a first electrode connected to the drain of the first PMOS transistor, and a measurement means configured to measure the voltage (VC2) of said first electrode, - a voltage of said first electrode lower than a threshold being representative of present or past severing of said severable part.

2. The system according to claim 1, wherein the substrate region (RSB) of the first transistor is less doped than the first polysilicon region (P1).

3. The system according to claim 1 or 2, wherein the substrate region (RSB) of the first transistor comprises intrinsic polysilicon or has a dopant concentration of less than 1017 atoms / cm3.

4. The system according to one of the preceding claims, wherein the first polysilicon region (P1) has a dopant concentration greater than 1019 atoms / cm3.

5. The system according to any of the preceding claims, wherein the integrated circuit comprises an insulating trench (1) located in the first substrate, and the first polysilicon region (P1) is located above this insulating trench.

6. The system according to claim 5, wherein, in the source-drain direction of the first transistor, the first polysilicon region (P1) protrudes from the second polysilicon region (P2) and the second polysilicon region rests on the first polysilicon region via a first dielectric region.

7. The system according to claim 5, wherein - the first polysilicon region (P1) protrudes from the second polysilicon region in a direction perpendicular to the source-drain direction of the first transistor, and - in the source-drain direction of the first transistor, the dimension of the second polysilicon region (P2) is greater than the dimension of the first polysilicon region (P1), and the second polysilicon region rests on the first polysilicon region and on the insulating trench via a second dielectric region.

8. The system according to claim 5, wherein - the first polysilicon region (P1) protrudes from the second polysilicon region in a direction perpendicular to the source-drain direction of the first transistor, and - in the source-drain direction of the first transistor, the dimension of the second polysilicon region (P2) is greater than the dimension of the first polysilicon region, and the second polysilicon region rests on the first polysilicon region via a third dielectric region and also rests on the insulating trench.

9. The system according to any of claims 1 to 4, wherein the integrated circuit comprises an insulating trench (1) located in the first substrate and a dielectric layer (5) surrounding the first polysilicon region (P1), the first polysilicon region surrounded by its dielectric layer extending through the insulating trench (1) into the first substrate (SB1), the substrate region (RSB) of the first transistor at least partly resting on an end (51) of the first polysilicon region surrounded by said dielectric layer and the source and drain regions resting on the insulating trench.

10. The system according to claim 9, wherein the integrated circuit (IC) comprises at least one non-volatile memory cell of the selection transistor type having a gate buried in the first substrate, and the first polysilicon region has a shape analogous to that of the buried gate of said selection transistor.

11. The system according to one of claims 1 to 4, wherein the integrated circuit comprises - a dielectric layer (6) disposed between the first polysilicon region and the first substrate, and - a second MOS transistor (TR2) including, in the first substrate, a source region, a drain region and a substrate region between the source and drain regions and covered with said dielectric layer, the first polysilicon region including a gate region common to the first transistor (TR1) and the second transistor (TR2).

12. The system according to claim 11, wherein the second transistor (TR2) is an NMOS transistor or a PMOS transistor.

13. System according to one of the preceding claims, wherein the first capacitor (C1) and the second capacitor (C2) are capacitors including two polysilicon electrodes separated by a dielectric and resting on an insulating region of the integrated circuit.

14. The system according to one of the preceding claims, further comprising a contactless passive transponder (TG) configured to communicate with a reader (RD) via an antenna (ANT) using a carrier signal, the transponder (TG) including the integrated circuit (IC) having two antenna terminals (AC0, AC1) connected to the antenna, the integrated circuit including a comparison means configured to compare the voltage of said first electrode to said threshold, and processing means (MT) configured to - in response to a first command coming from the reader, control charging of the first capacitor, - in response to a second command coming from the reader, control charging of the second capacitor, - in response to an activation command coming from the reader, activate the measurement means, and - in response to a read command coming from the reader, communicate the result of said comparison.

15. A method for detecting present or past severing, or no severing, of the severable part of the electrically conductive wire of the system according to one of the preceding claims, comprising charging the first capacitor (C1), charging the second capacitor (C2) and at least one measurement of the voltage (VC2) of the first electrode of the second capacitor, and analysing the result of a comparison between said voltage measured and said threshold.

16. The method according to claim 15, comprising, having the two capacitors been charged only once, several measurements of the voltage of the first electrode carried out at time-spaced measurement instants (Ti) and several comparisons between these voltages measured and said threshold, a voltage measured lower than said threshold at a measurement instant indicating a severable part being severed at said measurement instant or prior to this measurement instant.