STEAM CHAMBER DEVICE

DE602023002087T2Active Publication Date: 2025-02-19NATIONAL TSING HUA UNIVERSITY
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Patent Information

Application Number
DE602023002087
Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
Filing Date
2023-06-02
Publication Date
2025-02-19
Estimated Expiration
2043-06-02

AI Technical Summary

Technical Problem

Vapor chamber devices face challenges with deformation due to increased internal pressure during operation, and require precise alignment for manufacturing, which complicates the manufacturing process.

Method used

The vapor chamber device incorporates a design with a first casing and a second casing, featuring protrusions and capillary structures that enhance structural strength and prevent deformation. The staggered arrangement of protrusions allows for easy manufacturing without precise alignment, and the capillary structures help maintain the device's integrity under varying pressures.

Benefits of technology

This design effectively prevents deformation under increased pressure and simplifies the manufacturing process by eliminating the need for precise alignment, resulting in a vapor chamber device with improved structural strength and ease of production.

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