Display unit, display device, and method for producing a display unit

Abstract

The invention relates to a display unit (1) comprising a first contact layer (21), a second contact layer (22), a plurality of connection regions (30) and a plurality of optoelectronic semiconductor components (40). The first contact layer (21) comprises a plurality of row lines (210) at a row spacing (210D) with respect to one another. The second contact layer (22) comprises a plurality of column lines (220) at a column spacing (220D) with respect to one another The first contact layer (21) and the second contact layer (22) are stacked. The connection regions (3) each electrically conductively connect at least one row line (210) to at least one column line (220). The row spacing (210D) deviates by less than 50% from the column spacing (220D). The invention also relates to a display device (2) and to a method for producing a display unit (1).

Description

[0001] Description

[0002] DISPLAY UNIT, DISPLAY DEVICE AND METHOD FOR PRODUCING A DISPLAY UNIT

[0003] A display unit, a display device, and a method for producing a display unit are specified. The display unit and the display device are designed, in particular, to generate electromagnetic radiation, for example, light perceptible to the human eye.

[0004] One problem to be solved is to specify a display unit that has a particularly high radiation transmittance.

[0005] A further problem to be solved is to provide a display device which has a particularly high radiation transmittance.

[0006] A further object to be achieved is to provide a method for producing a display unit which enables simplified production.

[0007] These objects are achieved by devices and the method according to the independent patent claims. Advantageous embodiments and further developments of the devices and the method are the subject of the dependent patent claims and will further emerge from the following description and the figures.

[0008] The display unit has, for example, an edge length of less than 20 mm, preferably less than 5 mm. The display unit is therefore particularly suitable for integration into a display device comprising a plurality of display units.

[0009] According to at least one embodiment, the display unit comprises a first contact layer and a second contact layer. The first contact layer and the second contact layer are at least partially formed with an electrically conductive material. In particular, the first contact layer and the second contact layer comprise a metal. The contact layers have a thickness of at least 0.1 gm and at most 50 gm. Here and in the following, the thickness refers to an average extension of the contact layers transversely, in particular perpendicularly, to the main extension plane of the contact layers.

[0010] According to at least one embodiment, the display unit comprises a plurality of connecting regions. The connecting regions are formed, in particular, with an electrically conductive material.

[0011] According to at least one embodiment, the display unit comprises a plurality of optoelectronic semiconductor components. The optoelectronic semiconductor components are designed in particular to generate electromagnetic radiation, for example light perceptible to the human eye. For example, the optoelectronic semiconductor component comprises a semiconductor body with a first region of a first conductivity, a second region of a second conductivity, and an active region designed to emit electromagnetic radiation. The first conductivity preferably differs from the second conductivity. For example, the first region and the second region are formed with a doped semiconductor material.The active region has, in particular, a pn junction, a double heterostructure, a single quantum well (SQW) structure, or a multi-quantum well (MQW) structure for radiation generation or radiation detection. The semiconductor components are, for example, luminescence diodes, in particular light-emitting or laser diodes. For example, an optoelectronic semiconductor component is a pLED with an edge length in the range of pm or a miniLED with an edge length in the range of around 100 pm.

[0012] The display unit preferably comprises an optoelectronic semiconductor component configured to emit electromagnetic radiation in the red spectral range, an optoelectronic semiconductor component configured to emit electromagnetic radiation in the green spectral range, and an optoelectronic semiconductor component configured to emit electromagnetic radiation in the blue spectral range. The display unit can thus advantageously form an RGB pixel.

[0013] According to at least one embodiment of the display unit, the first contact layer has a plurality of row lines at a row spacing from one another. The row lines are preferably formed using a metal. The row spacing here and below corresponds to an average distance between two directly adjacent row lines. The row spacing is in particular between 50 pm and 500 pm, preferably 150 pm. Preferably, at least some of the row lines are electrically separated from one another. For example, row lines are electrically connected to one another exclusively in the region of a connection region. The row lines are in particular not designed as a grid.

[0014] According to at least one embodiment of the display unit, the second contact layer has a plurality of column lines at a column spacing from one another. The column lines are preferably formed using a metal. For example, the column lines are formed using the same material as the row lines. The column spacing here and below corresponds to an average spacing between two directly adjacent column lines. The column spacing is in particular between 50 pm and 500 pm, preferably 150 pm. The individual column lines are preferably each electrically separated from one another. For example, column lines are electrically connected to one another exclusively in the region of a connection region. The column lines are in particular not designed as a grid.

[0015] According to at least one embodiment of the display unit, the first contact layer and the second contact layer are arranged in a stacked manner. In other words, the first contact layer is arranged in a plane above or below the second contact layer. By means of such an arrangement of the contact layers, an advantageously compact design of the display unit is created. According to at least one embodiment of the display unit, the connecting regions each connect at least one row line to at least one column line in an electrically conductive manner. In particular, a direct electrical connection is produced between at least one row line and one column line in the connecting regions. In other words, apart from a connecting region, preferably no further components are connected between a row line and a column line.For example, a connection region in plan view of the display unit overlaps with at least one column line and / or at least one further row line.

[0016] According to at least one embodiment of the display unit, the line spacing deviates by less than 50% from the column spacing. Preferably, the line spacing deviates by less than 20% from the column spacing. Particularly preferably, the line spacing deviates by less than 10% from the column spacing. Here and below, a deviation is defined as a relative deviation of the line spacing (Z) to the column spacing (S) according to the following formula: |~~| 0.5, preferably |- -| < 0.2, particularly preferably |-^-| < 0.1. If the line spacing is equal to the column spacing, the display unit can have particularly few disturbing reflections for a human observer. In particular, the line spacing is equal to the column spacing.

[0017] The display unit is delimited in its lateral boundary by outer edges. Preferably, the outer edges form a rectangle, in particular a square. In particular, the row lines and the column lines are each aligned parallel to an outer edge of the display unit. According to at least one embodiment, the

[0018] Display unit:

[0019] - a first contact layer,

[0020] - a second contact layer,

[0021] - a plurality of connection areas, and

[0022] - a plurality of optoelectronic semiconductor components, wherein

[0023] - the first contact layer has a plurality of row lines at a row spacing from one another,

[0024] - the second contact layer has a plurality of column lines at a column spacing from one another,

[0025] - the first contact layer and the second contact layer are arranged stacked,

[0026] - the connecting regions each electrically connect at least one row line to at least one column line, and

[0027] - the line spacing differs from the column spacing by less than 50%.

[0028] The display unit described here is based, among other things, on the following considerations: The production of display units that are at least partially radiation-permeable opens up new areas of application. The radiation permeability of known display units can have an undesirable dependence on the viewing angle. For example, the radiation permeability of contact layers of a display unit can deteriorate significantly at viewing angles other than 0° and thus create an undesirable impression on the viewer. The display unit described here makes use, among other things, of the idea of ​​arranging a plurality of row lines in a first contact layer and a plurality of column lines in a second contact layer.By a stacked arrangement of the first contact layer and the second contact layer and the use of a plurality of row lines and column lines with a uniform row and column spacing, a particularly high radiation transmittance can be achieved which has an advantageously low dependence on a viewing angle.

[0029] According to at least one embodiment of the display unit, the connecting regions each comprise a plurality of connecting elements. In particular, each connecting element electrically connects a row line to a column line. Due to an increased number of connecting elements, the current-carrying capacity of a connecting region can be scaled particularly easily.

[0030] According to at least one embodiment of the display unit, the connecting elements are each arranged at intersection points of a row line and a column line. A intersection point arises, for example, where a distance between a column line and a row line is at a minimum. In a plan view of the display unit at a viewing angle of 0°, the intersection points appear in particular as the intersection point of a row line and a column line. Advantageously, connecting elements at intersection points of a row line and a column line are particularly inconspicuous for a viewer. According to at least one embodiment of the display unit, the connecting elements are formed with a metal. For example, the connecting elements are formed with an electroplated metal. For example, the connecting elements are formed with metal threads.Advantageously, metal threads exhibit particularly low expansion. This allows for advantageously high radiation permeability. Alternatively, the connecting elements are formed with an electrically conductive metal paste, particularly a silver paste. Advantageously, a metal paste is particularly easy to process.

[0031] According to at least one embodiment of the display unit, the connecting regions are formed with a radiation-permeable and electrically conductive material. Radiation-permeable here and below means permeable to electromagnetic radiation in the visible spectral range. The visible spectral range here and below is electromagnetic radiation with a wavelength in the range between 380 nm and 780 nm. For example, the connecting regions are formed with one of the following materials: poly-3,4-ethylenedioxythiophene doped with polystyrenesulfonate (PEDOT: PSS), poly-3,4-ethylenedioxythiophene doped with tosylate (PEDOT: Tos), carbon nanotubes, graphene flakes, metal nanowires, in particular silver nanowires. These materials are advantageously radiation-permeable and have a high electrical conductivity.

[0032] According to at least one embodiment of the display unit, the first contact layer and the second contact layer are arranged on a radiation-permeable substrate. The substrate is preferably formed from an electrically insulating material. The substrate is formed in particular from one of the following materials: polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI). The substrate has, for example, a thickness between 20 pm and 200 pm, preferably between 50 pm and 100 pm.

[0033] According to at least one embodiment of the display unit, the first contact layer is arranged on a side of the substrate opposite the second contact layer.

[0034] This advantageously results in a particularly simple construction of the display unit, since the substrate itself is arranged as an electrical insulator between the first contact layer and the second contact layer.

[0035] According to at least one embodiment of the display unit, the first contact layer and the second contact layer are arranged on a common side of the substrate. The first contact layer and the second contact layer are thus arranged from the common side. For example, this enables simplified production of the display unit.

[0036] According to at least one embodiment of the display unit, the first contact layer is arranged on a substrate and the second contact layer is arranged on a cover layer. The cover layer is in particular permeable to electromagnetic radiation in the visible spectral range. The cover layer is preferably electrically insulating. For example, the second contact layer is already arranged on the cover layer in a separate manufacturing step. The cover layer preferably has a thickness between 20 pm and 200 pm, preferably between 50 pm and 100 pm.

[0037] According to at least one embodiment of the display unit, a radiation-permeable bonding layer is arranged between the substrate and the cover layer. For example, the bonding layer is formed from one of the following materials: polyvinyl butyral (PVB), ethylene-vinyl acetate copolymer (EVA), photoresist, or polymer film. In particular, the bonding layer is formed from a perforated laminating film.

[0038] According to at least one embodiment of the display unit, the row lines and the column lines intersect at an angle of at least 45°. Preferably, the row lines and the column lines intersect at an angle of between 89° and 90°, preferably less than 90°. The largest possible angle is advantageous so that the first contact layer and the second contact layer are as unnoticeable as possible for a viewer.

[0039] According to at least one embodiment of the display unit, the row lines and the column lines have a constant width. In other words, the row lines and the column lines are each the same width over their length. Here and in the following, width is to be understood as a lateral extent of the row line or the column line transverse to the main direction of extent of the respective row line or column line. Preferably, the width of the row lines corresponds to the width of the column lines. For example, the row lines have a width of at least 2 pm and at most 20 pm. For example, the column lines have a width of at least 2 pm and at most 20 pm. Preferably, the row lines and the column lines have a width of 10 pm.

[0040] According to at least one embodiment of the display unit, the row lines and column lines have separations. Separations are to be understood here and below as an interruption in a row line or column line. Advantageously, the separations have a lateral extension of at least 10 μm. This allows sufficient electrical insulation to be achieved between the ends of the row line or column line adjacent to the separation.

[0041] In particular, the lateral extent of the separations corresponds to at most half the line or column spacing. A separation that is as short as possible is advantageous and particularly imperceptible to a human observer.

[0042] A method for producing a display unit is also specified. The display unit can be produced, in particular, using the method described here. This means that all features disclosed in connection with the display unit are also disclosed for the method for producing a display unit, and vice versa.

[0043] According to at least one embodiment, the method comprises providing a first contact layer on a substrate. In particular, the first contact layer is deposited on the first substrate. The first substrate is preferably designed to be radiation-transparent. For example, the first substrate has sufficient mechanical stability to be mechanically self-supporting.

[0044] According to at least one embodiment, the method comprises providing a second contact layer. The second contact layer is arranged, for example, on the first contact layer.

[0045] According to at least one embodiment, the method comprises structuring the first contact layer into a plurality of row lines spaced apart from one another. In particular, to produce the first contact layer, a material is first deposited over the entire surface, which is then at least partially removed.

[0046] According to at least one embodiment, the method comprises structuring the second contact layer into a plurality of column lines spaced at a column spacing from one another. In particular, to produce the second contact layer, a material is first deposited over the entire surface, which is then at least partially removed.

[0047] According to at least one embodiment, the method comprises forming a plurality of connection regions, each of which electrically connects at least one row line to at least one column line.

[0048] According to at least one embodiment, the method comprises arranging a plurality of optoelectronic semiconductor components on the display unit. The optoelectronic semiconductor components are preferably arranged on the first contact layer. In particular, an optoelectronic semiconductor component is arranged at each location on a row line where a separation is present. Preferably, an optoelectronic semiconductor component spans a separation in a row line.

[0049] According to at least one embodiment, the method comprises the steps:

[0050] - Providing a first contact layer on a substrate,

[0051] - Providing a second contact layer,

[0052] - Structuring the first contact layer into a plurality of row lines at a row spacing from each other,

[0053] - Structuring the second contact layer into a plurality of column lines at a column spacing from each other,

[0054] - forming a plurality of connection regions, each of which electrically connects at least one row line to at least one column line,

[0055] - Arranging a plurality of optoelectronic semiconductor components on the display unit.

[0056] According to at least one embodiment of the method, the second contact layer is arranged on a side of the substrate opposite the first contact layer. In particular, the substrate thus acts as an electrical insulator between the first contact layer and the second contact layer.

[0057] According to at least one embodiment of the method, the connecting region is introduced into a recess in the substrate. The connecting region is formed, in particular, with a radiation-permeable material. The recess preferably extends completely through the substrate. For example, the recess is completely filled with the material of the connecting region.

[0058] According to at least one embodiment of the method, the first contact layer is arranged on a side of the second contact layer facing away from the substrate. In other words, the first contact layer is arranged on the second contact layer. In particular, the first contact layer is arranged directly on the second contact layer.

[0059] According to at least one embodiment of the method, the second contact layer is arranged and structured on a second radiation-transparent cover layer. The cover layer is formed, in particular, from the material of the substrate.

[0060] According to at least one embodiment of the method, the substrate and the cover layer are joined together via a bonding layer. For example, a plurality of recesses are arranged in the bonding layer. In particular, the bonding layer is formed as a perforated laminating film. The connecting regions are formed, for example, in the recesses of the bonding layer.

[0061] According to at least one embodiment of the method, a plurality of optoelectronic semiconductor components are mounted on the substrate before the second contact layer is arranged. In other words, the optoelectronic components are arranged between the first contact layer and the second contact layer. Advantageously, the optoelectronic semiconductor components are thus particularly well protected from external influences. According to at least one embodiment of the method, connecting regions are mounted on the substrate before the second contact layer is arranged. In particular, the connecting regions are formed with spheres of a conductive paste that displace the material of the joining layer.

[0062] According to at least one embodiment of the method, the first and second contact layers are structured by nanoimprinting and, if appropriate, dry-chemically. Nanoimprinting is understood here and below to mean a process in which a mold layer is mechanically structured with a stamp. The structures are, in particular, a few pm or nm in size.

[0063] According to at least one embodiment of the method, first and second contact layers are deposited electrolytically. For example, a starting layer is first deposited by sputtering. Subsequently, additional material can be deposited on the starting layer by electroplating.

[0064] A display device is also specified. The display device comprises, in particular, a plurality of display units described herein. This means that all features disclosed in connection with the display unit are also disclosed for the display device, and vice versa.

[0065] According to at least one embodiment, the display device comprises a plurality of display units. Each display unit preferably forms an RGB pixel. In particular, all display units can be controlled individually. The display device comprises, in particular, a frame body. For example, the display units are arranged in the frame body. The frame body preferably completely surrounds the display units. The frame body has a rectangular shape with opposite outer sides aligned parallel to one another.

[0066] The row lines or the column lines of the display units are in particular aligned parallel to an outer side of the frame body of the display device.

[0067] A display unit described here is particularly suitable for use in transparent displays. In particular, for automotive rear window, front window, or side window symbols, automotive taillights with transparent optics, or advertising displays in glass panes in shopping centers.

[0068] Further advantages and advantageous embodiments and further developments of the display unit emerge from the following embodiments shown in the figures.

[0069] It shows :

[0070] Figure 1 is a schematic plan view of a display unit described here according to a first embodiment,

[0071] Figure 2 is a schematic plan view of a display unit described here according to a second embodiment, Figure 3 is a schematic sectional view of a display unit described here according to a third embodiment,

[0072] Figures 4A to 4D are schematic sectional views of a display unit described here according to the third embodiment in various stages of a method for its manufacture,

[0073] Figure 5 is a schematic plan view of a display unit described here according to a fourth embodiment,

[0074] Figure 6 is a schematic sectional view of a display unit described here according to a fifth embodiment,

[0075] Figures 7A to 7L are schematic sectional views of a display unit described here according to the fifth embodiment in various stages of a method for its manufacture,

[0076] Figure 8 is a schematic sectional view of a display unit described here according to a sixth embodiment,

[0077] Figures 9A to 9F are schematic sectional views of a display unit described here according to the sixth embodiment in various stages of a method for its manufacture, Figure 10 is a schematic sectional view of a display unit described here according to a seventh embodiment,

[0078] Figures 11A to 11C are schematic sectional views of a display unit described here according to an eighth embodiment in various stages of a method for its manufacture,

[0079] Figure 12 is a schematic sectional view of a display unit described here according to a ninth embodiment, and

[0080] Figure 13 is a schematic plan view of a display device described here according to a first embodiment.

[0081] Identical, similar, or functionally identical elements are provided with the same reference symbols in the figures. The figures and the relative sizes of the elements depicted in the figures are not to scale. Rather, individual elements may be exaggerated for clarity and / or clarity.

[0082] Figure 1 shows a schematic plan view of a display unit 1 described here according to a first exemplary embodiment. The display unit 1 comprises a first contact layer 21 with a plurality of row lines 210 and a second contact layer 22 with a plurality of column lines 220. The row lines 210 each have a constant width of 10 pm over their length. The row lines 210 are arranged at a row spacing 210D of 150 pm from one another. At least some of the row lines 210 are designed to be electrically separated from one another.

[0083] The column lines 210 each have a constant width of 10 pm along their length. The column lines 220 are arranged at a column spacing 220D of 150 pm from one another. At least some of the column lines 220 are electrically separated from one another.

[0084] The row lines 210 are arranged parallel to one another. The column lines 220 are arranged parallel to one another. The row lines 210 intersect the column lines 220 at an angle a of 90°. The width of the row lines 210 corresponds to the width of the column lines 220. The row spacing 210D corresponds to the column spacing 220D. In this way, a particularly high radiation transmittance of the display unit 1 can advantageously be achieved.

[0085] Furthermore, the display unit 1 comprises a plurality of connecting regions 30 and separations 80. The connecting regions 30 are formed with a radiation-permeable material, in particular PEDOT:PSS. The connecting regions 30 each electrically connect at least one row line 201 to at least one column line 220. In particular, a direct electrical connection is produced between at least one row line 210 and a column line 220 in the connecting regions 30. In other words, apart from a connecting region 30, no further components are preferably connected between a row line 210 and a column line 220. For example, row lines 210 are electrically connected to one another exclusively in the region of a connecting region 30. In particular, column lines 220 are electrically connected to one another exclusively in the region of a connecting region 30.

[0086] The separations 80 are each embodied as an interruption in a row line 210 or a column line 220. The separations 80 have a lateral extent of at least 10 μm. In particular, the lateral extent of the separations 80 corresponds at most to half of the row spacing 210D or the column spacing 220D. A separation 80 that is as short as possible is advantageously particularly imperceptible to a human observer.

[0087] By means of the separations 80 and the connecting regions 30, a plurality of row lines 210 and column lines 220 are connected to one another in such a way that they are at a common electrical potential.

[0088] Figure 2 shows a schematic plan view of a display unit 1 described here according to a second exemplary embodiment. The second exemplary embodiment shown in Figure 2 essentially corresponds to the first exemplary embodiment shown in Figure 1. In the second exemplary embodiment, first row line bundles 211, second row line bundles 212, first column line bundles 221 and second column line bundles 222 are shown for symbolic illustration. Each row line bundle 211, 212 comprises a plurality of row lines 210. Each column line bundle 221, 222 comprises a plurality of column lines 220. The row lines 210 of a row line bundle 211, 212 and the column lines 220 within a column line bundle 221, 222 are each at a common electrical potential. All lines within a bundle 211 , 212 , 221 , 222 act as a common electrical conductor .

[0089] The first row line bundle 211 and the first column line bundle 221 are used to electrically connect the common anode of the optoelectronic semiconductor components 40. The first row line bundle 211 comprises nine directly adjacent row lines 210. A cathode of an optoelectronic semiconductor component 40 is separately connected by means of the second row line bundle 212 and the second column line bundle 222.

[0090] The display unit 1 has a rectangular shape with an edge length XI of 3 mm.

[0091] Figure 3 shows a schematic sectional view of a display unit described here according to a third exemplary embodiment. The second exemplary embodiment shown in Figure 3 substantially corresponds to the first exemplary embodiment shown in Figure 1. The row lines 210 of the first contact layer 21 are arranged on a first side of a radiation-transmissive substrate 51. The column lines 220 of the second contact layer 22 are arranged on a side of the substrate 51 opposite the first contact layer 21. The substrate 51 is electrically insulating. The substrate has a thickness between 20 pm and 200 pm, preferably between 50 pm and 100 pm. The row lines 210 and the column lines 220 preferably comprise a dark coating on their side facing towards and away from the optoelectronic semiconductor component 40. The dark coating is formed, for example, with palladium.The dark coating can reduce disturbing reflections from the column lines 210 and the row lines 220 for an observer. The palladium is applied to the row lines 210 and the column lines 220, in particular, by galvanic deposition or by physical vapor deposition (PVD).

[0092] In the connecting region 30, a radiation-permeable and electrically conductive material extends completely through the substrate 51. The connecting region 30 electrically connects at least one row line 210 to two column lines 220. The optoelectronic semiconductor component 40 is oriented such that a main emission direction of the semiconductor component 40 points in a direction away from the substrate 51.

[0093] Figures 4A to 4D show schematic sectional views of a display unit 1 described here according to the third embodiment in various stages of a method for its production.

[0094] Figure 4A shows a first step of the method in which a substrate 51 is provided. The substrate 51 is formed from a radiation-transparent material, in particular PET. The substrate 51 is designed to be mechanically self-supporting. A first contact layer 21 having a plurality of row lines 210 is arranged on a first side of the substrate 51. A second contact layer 22 having a plurality of column lines 220 is arranged on a side of the substrate 51 opposite the first contact layer 21. For example, the first contact layer 21 and the second contact layer 22 are deposited on the substrate 51 using a galvanic process.

[0095] At least one row line 210 is interrupted at certain points by a separation 80. The separation 80 is produced, for example, using a photolithographic process, by laser ablation, or by a nano-imprint process.

[0096] Figure 4B shows a further step of the method, in which a recess 510 is introduced into the substrate 51. The recess 510 extends completely through the substrate 51. The recess 510 is introduced into the substrate 51, for example, by laser ablation, dry-chemical etching, or wet-chemical etching.

[0097] Figure 4C shows a further step of the method in which a material of a connecting region 30 is introduced into the recess 510. The connecting region 30 is formed with PEDOT:PSS and is radiation-transmissive.

[0098] Figure 4D shows a further step of the method in which an optoelectronic semiconductor component 40 is arranged on the row line 210. The optoelectronic semiconductor component 40 spans the separation 80 in the row line 210. In particular, the optoelectronic semiconductor component 40 is mounted by means of soldering. Figure 5 shows a schematic plan view of a display unit 1 described here according to a fourth exemplary embodiment. The fourth exemplary embodiment shown in Figure 5 essentially corresponds to the first exemplary embodiment shown in Figure 1. In contrast to the first exemplary embodiment, the connecting regions 30 each comprise a plurality of connecting elements 301. Each connecting element 301 electrically conductively connects a row line 210 to a column line 220.By increasing the number of connecting elements 301, the current carrying capacity of a connecting region 30 can be scaled particularly easily.

[0099] In particular, a direct electrical connection between a row line 210 and a column line 220 is established by a respective connecting element 301. In other words, preferably, no further components are connected between a row line 210 and a column line 220 besides a connecting element 301.

[0100] Row lines 210 are electrically connected to one another exclusively in the region of the connection region 30. Column lines 220 are electrically connected to one another exclusively in the region of the connection region 30.

[0101] The connecting elements 301 are each arranged at intersection points of a row line 210 and a column line 220. A intersection point occurs where a distance between a column line 210 and a row line 220 is at a minimum. In a plan view of the display unit at a viewing angle of 0°, the intersection points appear in particular as the intersection point of a row line 210 and a column line 220. The connecting elements 301 are particularly inconspicuous to a viewer at intersection points of a row line 210 and a column line 220.

[0102] The connecting elements 301 are formed with a metal. For example, the connecting elements 301 are formed with an electroplated metal.

[0103] Figure 6 shows a schematic sectional view of a display unit 1 described here according to a fifth exemplary embodiment. The display unit 1 comprises an optoelectronic semiconductor component 40, a radiation-transmissive substrate 51, a first contact layer 21 and a second contact layer 22. The second contact layer 22 is arranged on the substrate 51 and comprises a plurality of column lines 220 which are embedded in a first insulation layer 71. The first insulation layer 71 is formed, for example, with polymer, in particular with acrylic. The first contact layer 21 is arranged on the second contact layer 22 and comprises a plurality of row lines 210.

[0104] The display unit further comprises a plurality of connecting elements 301 which are embedded in a second insulation layer 72. The second insulation layer 72 is formed, for example, with polymer, in particular with acrylic. The second insulation layer 72 is preferably formed with the same material as the first insulation layer 71. The connecting elements 301 extend from the second contact layer 22 into the first contact layer 21. The contact layers 21, 22 have a thickness of at least 0.1 μm and at most 50 μm. Each connecting element 301 electrically connects a row line 210 to a column line 220. The connecting elements 301 are each arranged at intersection points of a row line 210 and a column line 220.

[0105] The connecting elements 301 are formed with a metal. For example, the connecting elements 301 are formed with an electroplated metal.

[0106] The optoelectronic semiconductor component 40 is arranged on the row line 210. The optoelectronic semiconductor component 40 spans the separation 80 in the row line 210. In particular, the optoelectronic semiconductor component 40 is mounted by soldering. A third insulation layer 73, which enables improved electrical insulation, is arranged in the separation 80. The third insulation layer 73 is formed, for example, with a polymer, in particular with acrylic. In particular, the third insulation layer 73 is formed with the same material as the second insulation layer 72.

[0107] Figures 7A to 7L show schematic sectional views of a display unit 1 described here according to the fifth embodiment in various stages of a method for its production.

[0108] Figure 7A shows a first step of the method in which a substrate 51 is provided. The substrate 51 is formed from a radiation-transmissive material, in particular PET. The substrate 51 is mechanically self-supporting. A first insulation layer 71 is applied to a first side of the substrate 51. The first insulation layer 71 is formed from a polymer, in particular acrylic. The first insulation layer 71 is radiation-transmissive.

[0109] Figure 7B shows a further step of the method, in which the first insulation layer 71 is structured using a nano-imprint method. A plurality of depressions 710 are introduced into a side of the first insulation layer 71 facing away from the substrate 51. For example, a stamp made of a polysiloxane is used to mechanically introduce the depressions 710 into the first insulation layer 71.

[0110] Figure 7C shows a further step of the method, in which a material of column lines 220 is deposited over the entire area of ​​the side of the first insulation layer 71 facing away from the substrate 51. For example, a starting layer is first deposited by sputtering, followed by a galvanic deposition of material. Preferably, metal is deposited.

[0111] Figure 7D shows a further step of the method, in which the side of the first insulation layer 71 facing away from the substrate 51 is polished and ground to remove part of the material of the column lines 220. Only the part of the material located in the recesses 710 remains. This forms a second contact layer 22 with separate column lines 220. The second contact layer 22 is consequently embedded in the radiation-transparent first insulation layer 71.

[0112] Figure 7E shows a further step of the method, in which a second insulation layer 72 is applied to the second contact layer 22. The second insulation layer 72 is formed with a polymer, in particular acrylic. The second insulation layer 72 is designed to be radiation-transmissive. In particular, the material of the second insulation layer 72 is identical to the first insulation layer 71 in the second contact layer 22.

[0113] Figure 7F shows a further step of the method, in which the second insulation layer 72 is structured using a nano-imprint process. A plurality of depressions 710 are introduced into a side of the second insulation layer 72 facing away from the substrate 51. The depressions 710 are each laterally aligned with a column line 220.

[0114] A thin layer of the second insulation layer 72 remains on the side of the column lines 220 facing away from the substrate 51.

[0115] Figure 7G shows a further step of the method in which the column lines 220 are each exposed by means of an etching process. The remaining thin layer of the second insulation layer 72 is consequently removed from the side of the column lines 220 facing away from the substrate 51. For example, the removal is carried out over the entire area using a dry-chemical etching process. Figure 7H shows a further step of the method in which a plurality of connecting elements 301 are arranged in the recesses 710. The material of the connecting elements 301 is deposited over the entire area on the side of the second contact layer 22 facing away from the substrate 51. For example, a starter layer is first deposited by means of sputtering and then a galvanic deposition of material takes place. Preference is given to a deposition of metal.

[0116] Subsequently, the side of the second contact layer 22 facing away from the substrate 51 is polished and ground to remove part of the material of the connecting elements 301. Only the part of the material located in the recesses 710 remains. This forms a plurality of separate connecting elements 301. The connecting elements 301 extend, in particular, from the second contact layer 22 into the first contact layer 21. The connecting elements 301 are embedded in the second insulation layer 72.

[0117] Figure 71 shows a further step of the method, in which a third insulation layer 73 is applied to the second insulation layer 72. The third insulation layer 73 is formed with a polymer, in particular acrylic. The third insulation layer 73 is designed to be radiation-permeable. In particular, the material of the third insulation layer 73 is identical to the second insulation layer 72.

[0118] The third step is then structured

[0119] Insulation layer 73 using a nano-imprint process. The structuring is carried out in such a way that at least one elevation is formed in the third insulation layer 73.

[0120] Figure 7J shows a further step of the method in which the third insulation layer 73 is etched over its entire area. The third insulation layer 73 is partially removed, so that surfaces of the connecting elements 301 facing away from the substrate 51 are free of the third insulation layer 73 and a raised portion formed in the previous step remains in the third insulation layer 73.

[0121] Figure 7K shows a further step of the method in which a first contact layer 21 with a plurality of row lines 210 is applied to the second insulation layer 72.

[0122] Analogous to the second contact layer, the second contact layer is first deposited over the entire surface and then at least partially removed by grinding and polishing. This results in a separation of the row line 210 at the locations where the third insulation layer 73 is still present.

[0123] Figure 7L shows a further step of the method in which an optoelectronic semiconductor component 40 is arranged on the row line 210.

[0124] Alternatively, the steps shown in Figures 7I, 7J and 7K can already be carried out together with the step shown in Figure 7F. In particular, for this purpose, a thickness of the second insulation layer 72 is increased, so that with the nanoimprint process, in addition to the depressions 710 for the connecting elements 301, a raised portion can also be formed in the second insulation layer 72 at the same time. In the same step, further depressions 710 for a first contact layer 210 with a plurality of row lines 210 can also be introduced onto the second insulation layer 72. The manufacturing process can thus advantageously be shortened.

[0125] Figure 8 shows a schematic sectional view of a display unit 1 described here according to a sixth exemplary embodiment. The display unit 1 comprises a substrate 51, on which a first contact layer 21 with a plurality of row lines 210 and an optoelectronic semiconductor component 40 are arranged. The optoelectronic semiconductor component 40 is oriented such that a main emission direction of the semiconductor component 40 points in a direction facing the substrate 51. The emission therefore occurs through the substrate 51.

[0126] Furthermore, the display unit 1 comprises a cover layer 52, on which a second contact layer 22 with a plurality of column lines 220 is arranged. The substrate 51 is designed to be radiation-transmissive. The cover layer 52 is designed to be radiation-transmissive. The cover layer 52 has a thickness between 20 pm and 200 pm, preferably between 50 pm and 100 pm.

[0127] A joining layer 60 formed from a radiation-transmissive material is arranged between the substrate 51 and the cover layer 52. In particular, the joining layer 60 is formed from a photosensitive material or a perforated PVB or an EVA. The joining layer 60 comprises a plurality of recesses, each filled with a connecting element 301. The connecting elements 301 are formed, for example, from a metal paste, in particular a silver paste.

[0128] Figures 9A to 9F show schematic sectional views of a display unit 1 described here according to the sixth embodiment in various stages of a method for its production.

[0129] Figure 9A shows a first step of the method, in which a radiation-transmissive substrate 51 is provided. A first contact layer 21 having a plurality of row lines 210 is arranged on the substrate 51. At least one row line 210 has an interruption in the form of a separation 80.

[0130] Figure 9B shows a further step of the method, in which an optoelectronic semiconductor component 40 is arranged on the substrate 51. In contrast to the preceding embodiments, the optoelectronic semiconductor component 40 in the sixth embodiment is arranged on the substrate 51 such that a main emission direction extends through the substrate 51. Furthermore, the optoelectronic semiconductor component 40 is arranged such that it is arranged entirely within the separation 80.

[0131] Figure 9C shows a further step of the method in which the optoelectronic semiconductor component 40 is electrically connected to the ends of the row line 210 via connection elements 90. The connection elements 90 are formed, for example, with a metal paste, in particular a silver paste. The connection elements 90 are preferably applied using a printing process. Figure 9D shows a further step of the method in which a cover layer 52 with a second contact layer 22 is provided. The second contact layer 22 is produced using a method analogous to the first contact layer 21 and comprises a plurality of column lines 220.

[0132] Figure 9E shows a further step of the method in which a joining layer 60 is arranged on the substrate 51. A plurality of recesses are arranged in the joining layer 60. The joining layer 60 is formed with one of the following materials: polyvinyl butyral (PVB), ethylene-vinyl acetate copolymer (EVA), photoresist, polymer film. In particular, the joining layer 60 is formed with a perforated laminating film. Furthermore, a material of a connecting element 301 is applied to at least some column lines 220. The cover layer 52 is aligned laterally to the substrate 51. The alignment of the cover layer 52 is effected such that the column lines 220 are laterally aligned with the recesses in the joining layer 60.

[0133] Figure 9F shows a further step of the method, in which the cover layer 52 is applied to the joining layer 60. The material of the connecting elements 301 is at least partially pressed into the recesses of the joining layer 60 and extends to the first contact layer 21. The connecting elements 301 are thus formed in the recesses of the joining layer 60.

[0134] Figure 10 shows a schematic sectional view of a display unit 1 described here according to a seventh exemplary embodiment. The seventh exemplary embodiment shown in Figure 10 essentially corresponds to the sixth exemplary embodiment shown in Figure 8. In contrast to the sixth exemplary embodiment, the connecting region 30 comprises a radiation-permeable material, and the optoelectronic semiconductor component 40 is configured for emission through the cover layer 52.

[0135] Figures 11A to 11C show schematic sectional views of a display unit 1 described here according to an eighth embodiment in various stages of a method for its production.

[0136] Figure 11A shows a first step of the method, in which a radiation-transmissive substrate 51 is provided. A first contact layer 21 having a plurality of row lines 210 is arranged on the substrate 51. At least one row line 210 has an interruption in the form of a separation 80. An optoelectronic semiconductor component 40 is arranged on the substrate 51. The optoelectronic semiconductor component 40 is arranged on the substrate 51 such that a main emission direction runs through the substrate 51.

[0137] Furthermore, the display unit 1 comprises a plurality of connecting elements 301 arranged on the first contact layer 21. The connecting elements 301 are formed with a metal paste, in particular a silver paste. Alternatively, the connecting elements 301 are formed with a radiation-transmissive conductive material, in particular PEDOT:PSS. For example, the connecting elements 301 are formed by means of screen printing, stencil printing, microdispensing, laser induced forward transfer (LI FT) or

[0138] Aerosol jetting applied to the first contact layer 21.

[0139] Figure 11B shows a further step of the method, in which a joining layer 60 is applied to the substrate 51. The joining layer 60 does not project beyond the connecting elements 301 in the vertical direction. In other words, the connecting elements 301 remain free of the material of the joining layer 60 on their side facing away from the substrate 51. The joining layer 60 is applied to the substrate 51, for example, by printing or dosing.

[0140] Figure 11C shows a further step of the method in which a cover layer 52 is arranged on the joining layer 60. The cover layer 52 comprises a second contact layer 22 with a plurality of column lines 22. The cover layer 52 is aligned laterally to the substrate 51 such that a respective connecting element 301 meets a column line 220 assigned to it.

[0141] Figure 12 shows a schematic sectional view of a display unit 1 described here according to a ninth exemplary embodiment. The ninth exemplary embodiment shown in Figure 12 essentially corresponds to the sixth exemplary embodiment shown in Figure 8. In contrast to the sixth exemplary embodiment, the ninth exemplary embodiment comprises various designs of connecting elements 301 in a joining layer 60. The basic idea is based on the integration of thin metal threads in the joining layer 60. For example, the connecting elements 301 are formed with copper, silver or gold threads. The metal threads can be connected to the first contact layer 21 and the second contact layer 22 by means of an adhesive. Alternatively, the metal thread can have a greater length than the thickness of the joining layer 60 and thus establish contact between the contact layers 21, 22 by means of a compression.The metal thread can optionally be bent at one or both ends to achieve better contact with the contact layers 21, 22.

[0142] Figure 13 shows a schematic plan view of a display device 2 described here according to a first exemplary embodiment. The display device 2 comprises a plurality of display units 1 arranged in a frame body 20. The display units 1 are electrically controlled via common first and second row line bundles 211, 212 and second column line bundles 221, 222.

[0143] The row spacing 210D of the row lines 210 of all display units 1 of the display device 2 is the same. The column spacing 220D of the column lines 220 of all display units 1 of the display device 2 is the same. The width of the row lines 210 and the column lines 220 is the same in all display units 1. The row spacing 210D deviates by less than 10% from the column spacing 220D. The row spacing 210D is equal to the column spacing 220D.

[0144] The frame body 20 completely surrounds the display units 1. In plan view, the frame body 20 has a rectangular shape. The frame body 20 comprises a top side and a bottom side opposite the top side. Furthermore, the frame body comprises a left side and a right side. The row lines 210 are aligned parallel to the bottom side and the top side of the frame body 20. The column lines 220 are aligned parallel to the left and right sides of the frame body 20.

[0145] This results in an advantageously particularly high radiation permeability of the display device 2 for a viewer.

[0146] The invention is not limited by the description based on the exemplary embodiments. Rather, the invention encompasses any novel feature and any combination of features, including in particular any combination of features in the patent claims, even if this feature or combination itself is not explicitly stated in the patent claims or exemplary embodiments.

[0147] This patent application claims priority from German patent application 102022103970 . 6 , the disclosure of which is hereby incorporated by reference .

[0148] Reference symbol list

[0149] 1 display unit

[0150] 2 display device

[0151] 20 frame element

[0152] 21 first contact layer

[0153] 22 second contact layer

[0154] 30 connection area

[0155] 40 optoelectronic semiconductor component

[0156] 210 line line

[0157] 211 first row line bundle

[0158] 212 second row line bundle

[0159] 210D line spacing

[0160] 220 column line

[0161] 221 first columnar bundle

[0162] 222 second columnar line bundle

[0163] 220D column spacing

[0164] 301 connecting element

[0165] 51 Substrat

[0166] 52 Top layer

[0167] 60 joining layer

[0168] 510 recess

[0169] 71 first insulation layer

[0170] 72 second insulation layer

[0171] 73 third insulation layer

[0172] 710 recesses

[0173] 80 Separation

[0174] 90 connecting element a cutting angle

[0175] XI edge length

Claims

Patent claims 1. Display unit (1) comprising: - a first contact layer (21) , - a second contact layer (22) , - a plurality of connection areas (30) , and - a plurality of optoelectronic semiconductor devices (40) , wherein - the first contact layer (21) has a plurality of line lines (210) at a line spacing (210D) to each other, - the second contact layer (22) has a plurality of column conductors (220) at a column spacing (220D) from each other, - the first contact layer (21) and the second contact layer (22) are arranged in a stacked arrangement, - the connection areas (30) each electrically connect at least one row line (210) with at least one column line (220), and - the row spacing (210D) differs from the column spacing (220D) by less than 50%.

2. Display unit (1) according to the preceding claim, wherein - the connection areas (30) each comprise a plurality of connection elements (301).

3. Display unit (1) according to the preceding claim, wherein - the connecting elements (301) are arranged at the intersection points of a row line (210) and a column line (220).

4. Display unit (1) according to one of the preceding claims, wherein - the connecting elements (301) are formed with a metal .

5. Display unit (1) according to any one of the preceding claims 1 to 3, wherein - the connection areas (30) are formed with a radiation-transparent and electrically conductive material.

6. Display unit (1) according to one of the preceding claims, wherein - the first contact layer (21) and the second contact layer (22) are arranged on a radiation-transparent substrate (51).

7. Display unit (1) according to the preceding claim, wherein - the first contact layer (21) is arranged on one side of the substrate (51) opposite the second contact layer (22).

8. Display unit (1) according to claim 6, wherein - the first contact layer (21) and the second contact layer (22) are arranged on a common side of the substrate (51).

9. Display unit (1) according to any one of claims 1 to 5, wherein - the first contact layer (21) is arranged on a substrate (51) and the second contact layer (22) is arranged on a cover layer (52).

10. Display unit (1) according to the preceding claim, wherein - a radiation-transparent joining layer (60) is arranged between the substrate (51) and the cover layer (52).

11. Display unit (1) according to one of the preceding claims, wherein - the row lines (210) and the column lines (220) intersect at an angle (a) of at least 45° .

12. Display unit (1) according to one of the preceding claims, wherein - the row lines (210) and the column lines (220) have a constant width.

13. Method for manufacturing a display unit (1) , comprising the steps: - Providing a first contact layer (21) on a substrate (51) , - Providing a second contact layer (22) , - Structuring the first contact layer (21) into a Multiple line lines (210) at a line spacing (210D) of each other, - Structuring the second contact layer (22) into a Multiple column lines (220) at a column spacing (220D) from each other, - Forming a plurality of connection areas (30) each electrically connecting at least one row line (210) to at least one column line (220), - Arranging a plurality of optoelectronic semiconductor devices (40) on the display unit (1) .

14. Method for manufacturing a display unit (1) according to the preceding claim, wherein - the second contact layer (22) is arranged on one side of the substrate (51) opposite the first contact layer (21).

15. Method for manufacturing a display unit (1) according to one of the preceding claims, wherein - the connecting area (30) is inserted into a recess (510) in the substrate (51).

16. Method for manufacturing a display unit (1) according to claim 13, wherein - the first contact layer (21) is arranged on a side of the second contact layer (22) facing away from the substrate (51).

17. Method for manufacturing a display unit (1) according to claim 13, wherein - the second contact layer (22) is arranged and structured on a second radiation-transparent cover layer (52).

18. Method for manufacturing a display unit (1) according to the preceding claim, wherein - the substrate (51) and the top layer (52) are joined together via an joining layer (60).

19. Display device (2) comprising a plurality of display units (1) according to at least one of the preceding claims .

20. Display unit (1) according to one of the preceding Claims 1 to 12, wherein - at least some of the row lines (210) and / or some of the column lines (220) are electrically separated from each other.

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