Device for a transition of a radio-frequency connection between a stripline connection and a waveguide, radio-frequency arrangement and radar system

Abstract

The invention relates to a transition between a stripline connection and a waveguide for a radio-frequency connection. For this purpose, a stripline connection is arranged on a carrier substrate, a transition to a waveguide structure integrated in the carrier substrate being adjacent to said stripline connection. Adjacent to said waveguide structure integrated in the carrier substrate there is a waveguide on an outer side of the carrier substrate.

Description

[0001] Description

[0002] title

[0003] Device for a transition of a high-frequency connection between a stripline connection and a waveguide, high-frequency arrangement and radar system

[0004] Technical area

[0005] The present invention relates to a device for a transition of a high-frequency connection between a stripline connection and a waveguide. The present invention further relates to a high-frequency arrangement and a radar system comprising such a device.

[0006] State of the art

[0007] Radar systems, such as those used in the automotive sector, require an antenna or antenna system for transmitting high-frequency signals and receiving reflections from the transmitted high-frequency signals. In addition to the commonly used patch antennas, waveguide antennas, for example, can also be used as an alternative. However, this requires a transition of the high-frequency line between the waveguide and a stripline connection for connecting the high-frequency electronics.

[0008] For example, EP 0 925 617 B1 describes a transition from a waveguide to a stripline. For this purpose, this document proposes providing a bridge in the transition area, which extends from a waveguide wall opposite the stripline and is in contact with the stripline.

[0009] Disclosure of the invention

[0010] The present invention discloses a device for a transition of a high-frequency connection between a stripline connection and a waveguide, a high-frequency arrangement, and a radar system having the features of the independent claims. Further advantageous embodiments are subject to the dependent claims.

[0011] Accordingly, it is provided:

[0012] A device for a transition of a high-frequency connection between a stripline connection and a waveguide, comprising an electrically insulating carrier substrate, wherein the electrically insulating carrier substrate has a top side and a bottom side opposite the top side. The carrier substrate comprises a first section with a stripline structure. The carrier substrate further comprises a second section with a waveguide structure integrated into the carrier substrate. Furthermore, the carrier substrate comprises a third section with a waveguide arranged on an outer side of the carrier substrate. The second section is arranged between the first section and the third section.

[0013] Furthermore, it is planned:

[0014] A radio-frequency arrangement comprising a device according to the invention for the transition between a stripline connection and a waveguide, as well as a monolithic microwave integrated circuit (MMIC). The MMIC is arranged in the first section on the top side of the carrier substrate.

[0015] Finally, it is planned:

[0016] A radar system with a high-frequency arrangement according to the invention. In particular, the MMIC can be designed to generate high-frequency signals emitted by an antenna structure of the radar system and to evaluate reflected high-frequency signals received by an antenna structure of the radar system.

[0017] Advantages of the Invention Numerous electronic circuits for high-frequency applications, such as those used for radar systems in motor vehicles, can provide the high-frequency signals generated by the circuit via a stripline connection and receive external signals via such a stripline connection. Using such stripline connections, patch antennas, for example, can be connected very easily. However, waveguide antennas can also be used as an alternative to such patch antennas in numerous applications. However, connecting waveguide antennas requires a transition between the stripline connection and the waveguide.

[0018] With increasing optimization and miniaturization, monolithic microwave integrated circuits (MMICs) and similar devices are increasingly being used for the generation and processing of high-frequency signals. These are typically arranged on a printed circuit board substrate, with the high-frequency connection established via the aforementioned stripline connection.

[0019] It is therefore an idea of ​​the present invention to create a transition from a stripline connection to a waveguide, which fits efficiently into an overall concept with an MMIC on a printed circuit board substrate.

[0020] For this purpose, the invention provides for the transition from a stripline connection to a waveguide to be realized using the carrier substrate, which can also be used for the printed circuit board substrate for accommodating the MMIC. In this way, a compact and low-loss transition between the stripline connection and a waveguide can be created.

[0021] According to the invention, it is provided to first form a transition from the stripline connection into a section with a waveguide structure integrated into the carrier substrate. In the further course, this waveguide structure integrated into the carrier substrate is followed by a waveguide on an outer side of the carrier substrate. Through this two-stage transition, first from the stripline connection into the waveguide structure integrated into the carrier substrate and then from the waveguide structure integrated into the carrier substrate to the actual waveguide, a customized and low-loss transition from the stripline to the waveguide can be realized in a simple and efficient manner. In particular, the printed circuit board substrate on which the electronic components and, for example, the MMIC are arranged can be used as the carrier substrate.Thus, a compact and at the same time cost-effective design can be used for the transition from the stripline structure to the waveguide.

[0022] According to one embodiment, the stripline structure in the first section comprises an electrical conductor track on the top side of the carrier substrate and an electrically conductive coating on the underside of the carrier substrate. The waveguide in the third section can also be arranged on the top side of the carrier substrate. In this way, all raised components, such as waveguides and other electronic components, for example, the MMIC, are arranged on the top side, while only an electrically conductive coating is provided on the underside. This results in a smooth or flat underside without raised structures.

[0023] According to one embodiment, the waveguide structure of the second section integrated into the carrier substrate comprises an electrically conductive coating on the top and bottom sides of the carrier substrate. Furthermore, the lateral boundary of the waveguide structure of the second section integrated into the carrier substrate is formed by means of electrically conductive vias between the top and bottom sides. These electrically conductive vias thus form a type of sidewall of the waveguide structure integrated into the carrier substrate. This allows a waveguide structure adapted to the respective requirements and properties of the radio frequency to be transmitted to be easily formed in the substrate.

[0024] According to one embodiment, the waveguide structure of the second section integrated into the carrier substrate and the waveguide arranged on the carrier substrate overlap in an overlap region. The transition from the waveguide structure integrated into the carrier substrate to the waveguide on the carrier substrate occurs in this overlap region.

[0025] According to one embodiment, an opening is provided on the top side of the electrically conductive coating in the overlap region between the waveguide structure integrated into the carrier substrate and the waveguide arranged on the carrier substrate. Accordingly, the high-frequency signal can propagate through this opening.

[0026] According to one embodiment, an electrically conductive connecting element is provided at one edge of this opening. Such an electrically conductive connecting element can form an electrical short circuit between the top and bottom sides at this position, terminating the waveguide structure integrated into the carrier substrate. In this way, the waveguide structure integrated into the substrate can be adapted.

[0027] According to one embodiment, an electrically conductive matching element is provided in an interior region of the opening. This matching element is arranged insulated from the surrounding electrically conductive coating. This allows for an alternative matching for the transition from the waveguide structure integrated into the carrier substrate to the waveguide arranged on the top side.

[0028] According to one embodiment, the waveguide comprises at least one antenna element in the third section. Such an antenna element can emit a high-frequency signal into the environment and / or receive high-frequency signals from the environment and guide them into the waveguide. The antenna element(s) in the waveguide can be, for example, horn antennas or similar.

[0029] The above embodiments and further developments can be combined with one another as desired, where appropriate. Further embodiments, further developments, and implementations of the invention also include combinations of features of the invention not explicitly mentioned above or described below with respect to the exemplary embodiments. In particular, those skilled in the art will also add individual aspects as improvements or additions to the respective basic forms of the invention.

[0030] Short description of the drawings

[0031] Further features and advantages of the invention are explained below with reference to the figures.

[0032] Fig. 1: a schematic representation of a cross section through a high-frequency arrangement in a device for the transition between a stripline connection and a waveguide according to an embodiment;

[0033] Fig. 2: a perspective view of a device for the transition of a high-frequency connection between a stripline connection and a waveguide according to an embodiment;

[0034] Fig. 3: a perspective view of a partial view of a device for the transition of a high-frequency connection between a stripline connection and a waveguide according to a further embodiment; and

[0035] Fig. 4: a schematic representation of a device for the transition of a radio frequency link with integrated antenna elements according to an embodiment.

[0036] Description of the embodiments

[0037] Figure 1 shows a schematic representation of a cross-section through a high-frequency arrangement according to one embodiment. Such a high-frequency arrangement can be used, for example, for a radar system, in particular a radar system in a motor vehicle. The high-frequency arrangement comprises a component 20 with a monolithic microwave integrated circuit (MMIC). This component 20 can be arranged on a printed circuit board 10. For example, the connection elements of the component 20 can be soldered to corresponding conductor track structures on the carrier substrate 10. For this purpose, a ball grid array (BGA) structure can be provided, for example, on the underside of the component 20. In principle, however, any other suitable contacting options are also conceivable.In addition to the power supply and the data and signal lines, the component 20 can also have one or more connections for transmitting and / or receiving high-frequency signals. For this purpose, the corresponding connections can be connected to one or more striplines located in the region of the component 20 on the carrier substrate 10. Such a stripline arrangement can be formed, for example, by an electrically conductive structure on the top side 11 and an electrically conductive coating on the bottom side 12 of the carrier structure 10. Here and below, the top side 11 refers to the side of the carrier structure 10 on which the component 20 is located.

[0038] The stripline structure in the first section I in the region of the component 20 transitions in section II into a waveguide structure integrated into the carrier substrate 10. For this purpose, a corresponding transition element can be provided in the transition from the stripline structure in section I to the waveguide structure integrated into the carrier substrate in section II. Section II with the waveguide structure integrated into the carrier substrate 10 is followed in section III by a waveguide 30 on the top side 11 of the carrier substrate 10. In this way, a transition can be created between the waveguide 30 in the third section III and the stripline structure in section I.

[0039] Such an arrangement makes it possible to guide the high-frequency signals output by the component 20, for example, the MMIC, along the stripline structure into the waveguide 30 and subsequently to emit the high-frequency signals via a waveguide antenna, for example, one or more horn antennas. It is also possible to transmit high-frequency signals received by waveguide antennas to the

[0040] stripline structure and further to the component 20.

[0041] Figure 2 shows a perspective view of the device for the transition between the stripline connection in section I and the waveguide in section III according to one embodiment. In the first section I, a conductor track 15 for a stripline structure is provided on the top side. This stripline structure transitions, in the region of a transition element 14, into a waveguide structure integrated into the carrier substrate 10. This waveguide structure integrated into the carrier substrate 10 extends over section II.

[0042] The waveguide structure integrated into the carrier substrate 10 is formed by electrically conductive coatings on the top side 11 and the bottom side 12 of the carrier substrate 10. The lateral boundaries of this waveguide structure integrated into the carrier substrate 10 can be formed, for example, by means of electrically conductive via elements 16. It is understood that a material suitable for the propagation of high-frequency signals in the waveguide structure integrated into the carrier substrate 10 is selected for the material of the carrier substrate 10.

[0043] In Section III, as already described above, a waveguide 30 is located on the top side 11 of the carrier substrate 10. Here, the waveguide structure integrated into the carrier substrate 10 and the waveguide 30 arranged on the carrier substrate 10 can overlap in an overlap region. An opening can be provided in this overlap region in the electrically conductive coating on the top side 11 of the carrier substrate. Thus, the high-frequency signal can propagate through this opening between the waveguide structure integrated into the carrier substrate 10 and the waveguide 30.

[0044] Furthermore, the frequency or propagation properties of the waveguide structure integrated into the carrier substrate 10 can be adjusted, for example, by means of an electrically conductive connection between the coating on the top side 11 and the coating on the bottom side 12. In particular, the waveguide structure integrated into the carrier substrate 10 is thereby terminated by a short circuit 17.

[0045] Figure 3 shows a schematic representation of an alternative adaptation of the transition between the waveguide structure integrated into the carrier substrate 10 and the adjoining waveguide 30 on the carrier substrate 10. In this case, an electrically conductive adaptation element 18 can be provided in the opening of the electrically conductive coating on the top side of the carrier substrate 10, through which the transition between the waveguide 30 and the waveguide structure integrated into the carrier substrate 10 takes place. This adaptation element 18 can, for example, be an electrically conductive element that is arranged at a distance, i.e., insulated from the remaining electrically conductive coating on the top side 11 of the carrier substrate 10.

[0046] Otherwise, the structure corresponds to the previously described structure for the transition from the stripline connection to the waveguide 30.

[0047] Figure 4 shows a perspective external view of a device for the transition of a high-frequency connection between a stripline connection and a waveguide 30 according to one embodiment. This can, for example, be one of the previously described embodiments. As can also be seen in Figure 4, one or more antenna elements 31 can be arranged on the waveguide 30. For example, slots can be provided in the waveguide 30, to which one or more antenna elements 31 are connected. These can, for example, be horn antenna elements, as shown in Figure 4. The number of four horn antenna elements shown here serves merely as an example and does not represent a limitation of the present invention.

[0048] Such an arrangement with a transition from a stripline structure to a waveguide and optionally adjoining waveguide antenna elements can be used, for example, for a radar system, in particular a radar system in a motor vehicle. In summary, the present invention relates to a transition between a stripline connection and a waveguide for a radio-frequency connection. For this purpose, it is proposed to arrange a stripline connection on a carrier substrate. This stripline connection is followed by a transition to a waveguide structure integrated into the carrier substrate. This waveguide structure integrated into the carrier substrate is then followed by a waveguide on an outer side of the carrier substrate.

Claims

Claims 1. Device for a transition of a high-frequency connection between a strip conductor connection and a waveguide (30), comprising: an electrically insulating support substrate (10) with a top (11) and a bottom (12) opposite the top (11), wherein the support substrate (10) comprises a first section (I) with a strip conductor structure, a second section (II) with a waveguide structure integrated into the support substrate (10) and a third section (III) with a waveguide (30) arranged on an outside of the support substrate (10), and wherein the second section (II) is arranged between the first section (I) and the third section (III). 2 Device according to claim 1, wherein the strip conductor structure in the first section (I) comprises an electrical conductor (15) on the top (11) and an electrically conductive coating on the bottom (12) of the support substrate (10), and wherein the waveguide (30) is arranged in the third section (III) on the top (11) of the support substrate (10).

3. Device according to claim 1 or 2, wherein the waveguide structure of the second section (II) integrated into the support substrate (10) comprises an electrically conductive coating on the top (11) and the bottom (12), and wherein lateral boundaries of the waveguide structure of the second section (II) integrated into the support substrate are formed by means of electrically conductive via elements (16) between the top (11) and the bottom (12). Device according to any one of claims 1 to 3, wherein the waveguide structure of the second section (II) integrated into the support substrate (10) and the waveguide (30) arranged on the support substrate (10) overlap at least partially in an overlap region. Device according to claim 4, wherein an opening is provided in the electrically conductive coating on the top surface (11) of the support substrate (10) for the waveguide structure integrated into the support substrate (10) in the overlap region. Device according to claim 5, wherein an electrically conductive connecting element (17) is provided at an edge of the opening, which is designed to electrically contact the electrically conductive coatings on the top surface (11) and the bottom surface (12) of the support substrate (10). Device according to claim 5, wherein an electrically conductive adapter element (18) is provided in an interior region of the opening.Device according to any one of claims 1 to 7, wherein the waveguide (30) of the third section (III) comprises at least one antenna element (31). High-frequency arrangement comprising: a device according to any one of claims 1 to 8; and a monolithically integrated microwave circuit (20) arranged in the first section (I) on the top surface (11) of the substrate (10). Radar system with a high-frequency arrangement according to claim 9.

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