Substrate, power module, electrical device and method for producing a power module
Patent Information
- Application Number
- EP2023739140
- Authority / Receiving Office
- EP · EP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2022-09-28
- Filing Date
- 2023-06-28
- Publication Date
- 2025-05-21
AI Technical Summary
In power electronics, achieving uniform inductance among three-phase alternating voltage phases in power modules with limited space is challenging due to the need for symmetric intermediate circuit connections, leading to uneven loading and increased heating, which affects the service life and requires additional cooling efforts.
A substrate design with three AC connections on long sides and four DC connections on short sides, arranged to ensure symmetric impedance distribution, allowing for even loading and reduced heating, along with a power module housing that accommodates this substrate and includes capacitors close to DC connections for further impedance balancing.
This design achieves uniform loading of alternating voltage phases, reducing heating and extending the service life of components, while allowing for the use of proven housing types without the need for larger or new manufacturing technologies, thus maintaining electrical power without spatial expansion.
Smart Images
Figure 1.1
Abstract
Description
[0001] Description
[0002] Substrate, power module, electrical device and method for producing a power module
[0003] The invention relates to a substrate for a power module, wherein the substrate is substantially rectangular in plan view with two opposite long sides and two opposite short sides, and wherein the substrate has a plurality of semiconductors for converting a three-phase alternating voltage (AC) into a positive, a medium and a negative direct voltage (DC) or for converting a positive, a medium and a negative direct voltage (DC) into a three-phase alternating voltage (AC).
[0004] Furthermore, the invention relates to a power module comprising at least one such substrate.
[0005] Furthermore, the invention relates to an electrical device, in particular a converter, comprising at least one such power module.
[0006] Finally, the invention relates to a method for producing such a power module.
[0007] Such devices or such a method are used in a variety of applications in power electronics. For example, in multi-phase semiconductor modules with a half-bridge topology, the intermediate circuit connections are led out symmetrically on both sides in order to achieve the most uniform inductance possible for the individual phases. This is also desirable in a 3-level topology and therefore requires additional space. With small housing sizes, this is difficult to achieve due to the limited space for connections while maintaining the clearance and creepage distances. Alternatively, other housing types can be selected which provide more space. A power semiconductor module with four power connections is known from US 8847328B1.An insulated-gate bipolar transistor (IGBT) has a collector connected to the first power terminal and an emitter coupled to the third power terminal. An anti-parallel diode is coupled in parallel with the IGBT. A DC link is connected between the second and fourth power terminals. The DC link may comprise two diodes and two IGBTs, with the IGBTs connected in a common collector configuration. The first and second power terminals are arranged in a first line along one side of the module, and the third and fourth power terminals are arranged in a second line along the opposite side of the module.Two identical instances of the module can be connected together to form a three-stage NPC phase branch with low leakage inductances, with the phase branch having two parallel DC connections.
[0008] An object of the invention is to provide an improved substrate , a corresponding power module , a corresponding electrical device and a corresponding method for producing a power module .
[0009] The object is achieved by a substrate of the type mentioned at the outset in that the substrate further comprises three AG connections arranged on the long sides, a positive DC connection arranged on the first short side, a first middle DC connection arranged on the first short side, a second middle DC connection arranged on the second short side and a negative DC connection arranged on the second short side, and wherein the positive DC connection is arranged closer to the first long side than the first middle DC connection, and wherein the negative DC connection is arranged closer to the second long side than the second middle DC connection. A further solution to the object is achieved by a power module of the type mentioned at the outset in that the power module has the proposed substrate and a module housing which at least partially encloses the substrate.
[0010] An additional solution to the problem is provided by an electrical device of the type mentioned at the outset in that the device has at least one first intermediate circuit capacitor, which is connected between the module DC connection electrically connected to the positive DC connection on the one hand and the module DC connections electrically connected to the middle DC connections on the other hand, and at least one second intermediate circuit capacitor, which is connected between the module DC connection electrically connected to the negative DC connection on the one hand and the module DC connections electrically connected to the middle DC connections on the other hand.
[0011] Finally, the problem is solved by a method for manufacturing the proposed power module in that the method comprises the following process steps:
[0012] - Providing an output power module comprising: o at least two output power module voltage terminals arranged on the first short side, o at least two output power module voltage terminals arranged on the second short side, o an output module housing for receiving and at least partially enclosing the substrate, and
[0013] - Inserting the substrate into the output power module,
[0014] - Establish a respective electrical connection from the four DC terminals of the substrate to the four output power module voltage terminals.
[0015] The proposed substrate can be, for example, a
[0016] The substrate can be a DCB (Direct Copper Bonded) or an AMB (Active Metal Brazing) substrate. In some examples, a printed circuit board (PCB) can also be used as the substrate. Furthermore, the substrate can also be constructed in two or more pieces.
[0017] When viewed from above, the substrate is essentially rectangular, and may be configured as a flat plate or as a flat cuboid. If the substrate is configured in two or more pieces, the substrate formed from the two or more substrate pieces has an essentially rectangular outline when viewed from above.
[0018] To convert the three-phase alternating voltage into three different direct voltages or vice versa, the substrate comprises several semiconductors, such as transistors, which are designed as power MOSFETs, IGBTs, etc., or diodes. The semiconductors are preferably power semiconductors and are also suitably interconnected, e.g., according to a 3-stage design, and electrically connected to the AG terminals and the DC terminals.
[0019] The three AC terminals for the three phases of the AC voltage are arranged on the long sides of the essentially rectangular substrate. Remarkably, four DC terminals are provided for the three different DC voltages, namely one positive DC terminal for a positive DC voltage, two middle DC terminals for a middle or neutral DC voltage and one negative DC terminal for a negative DC voltage. The four DC terminals are arranged on the short sides of the essentially rectangular substrate as follows. The positive DC terminal and the first middle DC terminal are arranged on the first short side of the essentially rectangular substrate, with the positive DC terminal being arranged closer to the first long side of the essentially rectangular substrate than the first middle DC terminal.The second middle DC terminal and the negative DC terminal are arranged on the second short side of the substantially rectangular substrate, with the negative DC terminal being arranged closer to the second long side of the substantially rectangular substrate than the second middle DC terminal.
[0020] To illustrate, assume the substrate is viewed from a top view and oriented with the long sides at the top and bottom and the short sides at the right and left. Then, the AC terminals are positioned at the top and / or bottom, the positive DC terminal is positioned at the top left, the first middle DC terminal is positioned at the bottom left, the second middle DC terminal is positioned at the top right, and the negative DC terminal is positioned at the bottom right.
[0021] The described design of the substrate, in particular the special arrangement of the AC connections and the DC connections, brings about a relatively even distribution of the impedances and inductances, in particular among the three AC voltage phases in the substrate. The relatively even distribution of the impedances is achieved, among other things, by the fact that the impedances of the individual AC voltage phases are designed to be relatively symmetrical thanks to the arrangement of the DC connections. This results in a relatively even load on the individual AC voltage phases during operation of the substrate or the corresponding power module, which is a huge advantage. This is because unevenly loaded AC voltage phases cause...of the proposed power module, particularly strong heating of one of the AC voltage phases results, which impairs the service life of the components of this AC voltage phase and thus the service life of the substrate and the power module. Furthermore, it may be necessary to structurally counteract the described, stronger heating of one of the AC voltage phases by additional cooling expenditure, e.g., larger heat sinks and the like. This entails greater costs and sometimes requires more bulk, thus resulting in a spatially larger power module without a corresponding increase in electrical output.
[0022] Furthermore, the described design of the substrate allows proven housing types to be used as module housings. In addition, the described arrangement of the DC connections allows capacitors to be placed close to the relevant potential, in particular closer than 20% or 10% of the substrate diagonal when viewed from above. This eliminates the need for new module types or housing types, which are either larger or require new manufacturing technologies. Furthermore, it makes it easier to implement platforms in device series.
[0023] In an advantageous embodiment of the invention, the three AG connections are arranged on one of the two long sides, preferably on the first long side.
[0024] This means that all three AG connections are arranged on the same long side, which in particular makes it easier to design the arrangement symmetrically. The three AG connections can be arranged, for example, on the first long side (in the above example for the purpose of illustration, at the top) or on the second long side (in the above example for the purpose of illustration, at the bottom), whereby the DC connections can be arranged for reasons of symmetry as explained above or can be arranged point-symmetrically with respect to the center of the substrate and mirrored (in the above example for the purpose of illustration, as follows: the positive DC connection is at the top left, the first middle DC connection is at the bottom left, the second middle DC connection is at the top right and the negative DC connection is at the bottom right; orin a point-mirrored arrangement as follows: the negative DC connection is top left, the second middle DC connection is bottom left, the first middle DC connection is top right and the positive DC connection is bottom right). In a further advantageous embodiment of the invention, the substrate is designed such that the impedances between the DC connections of two of the direct voltages for the three phases of the alternating voltage are equal within a tolerable deviation, wherein the tolerable deviation is 25%, in particular 15% or 10%.
[0025] For example, the impedance, i.e. the AC resistance, between the positive DC terminal and the negative DC terminal is the same for the three phases of the AC voltage within the tolerable deviation. This means in particular that the impedance between the positive DC terminal and the negative DC terminal along the first phase of the three-phase AC voltage is, within the tolerable deviation, the same as the impedance between the positive DC terminal and the negative DC terminal along the second phase of the three-phase AC voltage, both of which are, in turn, the same as the impedance between the positive DC terminal and the negative DC terminal along the third phase of the three-phase AC voltage, within the tolerable deviation.The same applies to the impedances between the positive DC terminal and the two DC terminals of the middle / neutral DC voltage, as well as to the impedances between the negative DC terminal and the two DC terminals of the middle / neutral DC voltage. In particular, the aforementioned impedances are the same at the operating frequency of the substrate or the semiconductors, within the tolerable deviation. If the semiconductors are designed as transistors, the aforementioned impedances are the same, within the tolerable deviation, particularly at the switching or clock frequency of the transistors. In some examples, the corresponding inductance between the DC terminals of two of the DC voltages for the three phases of the AC voltage can be the same, within the tolerable deviation. Further details on this aspect are explained below in connection with Figure 2.The tolerable deviation is in the range of up to 25%, preferably up to 15% or up to 10%.
[0026] In order to make the said impedances equal within the tolerable deviation, the substrate can, for example, be designed symmetrically or approximately symmetrically. The symmetrical design of the substrate can, for example, comprise the three AC connections being arranged approximately equidistant from one another and approximately in the middle between the two short sides. The three AC connections are preferably arranged very close to one another, in particular closer than 20% or 10% of the diagonal of the substrate in a plan view of the substrate. Furthermore, the electrical conductors or conductor tracks which connect the AC connections to the semiconductors or the semiconductors to the DC connections can be designed approximately symmetrically or with approximately the same cross-sections and approximately the same inductances. In particular, the impedances of the said electrical conductors or conductor tracks can be calculated or determined in advance.be simulated and adjusted or matched to one another in such a way that the desired impedances are achieved. This adjustment or match can be achieved, for example, by designing the conductors or tracks with a larger or smaller cross-section than originally or otherwise planned, or by routing them on the substrate in a way other than the shortest possible connection in order to match the inductance or impedance of the conductors or tracks to one another as closely as possible.
[0027] In a further advantageous embodiment of the invention, the substrate is designed such that the impedances between the positive DC terminal and the two middle DC terminals for the three phases of the alternating voltage are equal within the tolerable deviation and are also equal to the impedances between the negative DC terminal and the two middle DC terminals for the three phases of the alternating voltage within the tolerable deviation. As already mentioned above, the impedances between the positive DC terminal and the two DC terminals of the middle / neutral direct voltage are also equal to one another within the tolerable deviation, whereby the impedances between the negative DC terminal and the two DC terminals of the middle / neutral direct voltage are also equal to one another within the tolerable deviation.For reasons of symmetry, and in particular to achieve the most even loading possible of the individual AC voltage phases during operation of the substrate or the power module, the impedances between the positive DC terminal and the two DC terminals of the middle / neutral DC voltage are now equal, within the tolerable deviation, to the impedances between the negative DC terminal and the two DC terminals of the middle / neutral DC voltage, taking into account the three phases of the AC voltage. Further details on this aspect are explained below in connection with Figure 2.
[0028] As already mentioned above, the proposed power module has a module housing which, for example, can be partly frame-shaped and which accommodates and fixes the substrate in its center. In addition to a frame-shaped housing part, the module housing can also have a cover which can serve, among other things, to protect the substrate from environmental influences and to prevent hazards due to voltages occurring during operation of the power module. In some examples, the module housing has a number of recesses for receiving connection pins. The three AC connections and the four DC connections of the substrate can then each be electrically connected to at least one connection pin, wherein the respective connection pin is accommodated in one of the recesses in the module housing.
[0029] In a further advantageous embodiment of the invention, the power module has three module AC terminals arranged on the long sides, which are electrically connected to the three AC terminals of the substrate, and four module DC terminals arranged on the short sides, which are electrically connected to the four DC terminals of the substrate. The respective electrical connection can be made, for example, via the above-mentioned connection pins if the module housing has them.
[0030] The power module has three module AC connections and four module DC connections so that the power module can be supplied with the three-phase AC voltage or the three DC voltages mentioned, or so that the three-phase AC voltage or the three DC voltages mentioned can be tapped off at the power module. The three AC connections on the substrate are electrically connected to the three module AC connections, and the four DC connections on the substrate are electrically connected to the four module DC connections. Like the three AC connections on the substrate, the three module AC connections are arranged on the long sides, while the four module DC connections - like the DC connections on the substrate - are arranged on the short sides. This design of the power module enables a short and direct electrical connection of the module AC connections or the module DC connections to the corresponding AC connections.DC connections of the substrate, whereby in some examples the electrical connection is made via the appropriate connection pins.
[0031] In a further advantageous embodiment of the invention, the module DC connection electrically connected to the positive DC connection and the module DC connection electrically connected to the first middle DC connection are arranged on the first short side, wherein the module DC connection electrically connected to the positive DC connection is arranged closer to the first long side than the module DC connection electrically connected to the first middle DC connection, wherein the module DC connection electrically connected to the negative DC connection and the module DC connection electrically connected to the second middle DC connection are arranged on the second short side, wherein the module DC connection electrically connected to the negative DC connection is arranged closer to the second long side than the module DC connection electrically connected to the second middle DC connection.
[0032] The described design, and in particular the described arrangement of the module's AC terminals and the module's DC terminals, enables a particularly short and direct electrical connection to the corresponding AC terminals or DC terminals of the substrate. This further reduces the electrical losses occurring during operation, as well as unwanted inductances, while simultaneously supporting the aforementioned uniform loading of the individual AC voltage phases.
[0033] Concrete embodiments of this aspect are explained below in connection with Figures 4 to 7.
[0034] In a further advantageous embodiment of the invention, the power module further comprises a first backup capacitor which is connected between the positive DC voltage at the positive DC terminal and the average DC voltage at the first middle DC terminal, and a second backup capacitor which is connected between the negative DC voltage at the negative DC terminal and the average DC voltage at the second middle DC terminal.
[0035] A backup capacitor or decoupling capacitor is the use of a capacitor to stabilize the supply voltage in high-frequency and complex digital circuits. In its function, the backup capacitor is similar to a smoothing capacitor. Here, one or more capacitors are connected in parallel to the supply voltage for each circuit or circuit section; these capacitors act as a voltage or energy source in moments of high current or power demand. Due to their low impedance at high frequencies, they reduce the impedance of the higher-level voltage supply or its supply line and prevent mutual influence on the power supply of subcircuits. On the output signal lines, they reduce both overshoots and undershoots in the signal level and thus the possibility of interference in signal processing.Conversely, capacitors can absorb disruptive, temporary overvoltages in electronic circuits and thus reduce their propagation and damaging effects.
[0036] The explained, particularly symmetrical arrangement of the DC connections or module DC connections enables, in particular, good positioning of backup capacitors for the relevant commutation branches outside the module. In particular, the respective backup capacitor can be arranged spatially very close to the said DC connections, in particular closer than 20% or 10% of the diagonal of the substrate when viewed from above the substrate, as a result of which electrical losses occurring during operation, as well as unwanted inductances, can be further reduced. The electrical connection of the respective backup capacitor to the respective DC connection preferably has a length of at most 20% or 10% of the diagonal of the substrate when viewed from above the substrate.
[0037] In a further advantageous embodiment of the invention, the power module further comprises a printed circuit board, wherein the first backup capacitor and the second backup capacitor are each arranged on the printed circuit board.
[0038] Said printed circuit board can be designed, for example, as a printed circuit board (PCB), but also as another DCB substrate or another AMB substrate or the like. The printed circuit board is preferably arranged in close proximity to the substrate in order to ensure short electrical connections between the respective backup capacitor and the respective DC connection. In a further advantageous embodiment of the invention, the first backup capacitor and the second backup capacitor are each arranged on the substrate.
[0039] Particularly short electrical connections between the respective backup capacitor and the respective DC terminal can be achieved in particular by arranging the respective backup capacitor on the substrate and electrically connecting it to the respective DC terminal. Preferably, the first backup capacitor is arranged in the region of the first short side and the second backup capacitor is arranged in the region of the second short side, the distance of the respective backup capacitor from the respective short side being, in particular, at most 20% or 10% of the diagonal of the substrate in a plan view of the substrate.
[0040] In a further advantageous embodiment of the invention, the power module can be operated with an electrical power of at least several 10 kW, preferably 40 kW to 500 kW, with an alternating voltage of at least several 100 V, preferably 280 V to 800 V, with a direct voltage of at least several 100 V, preferably 800 V to 1500 V, and / or electrical currents of several 10 A, preferably 70 A to 1000 A.
[0041] As already mentioned above, the proposed electrical device comprises at least one power module, at least one first intermediate circuit capacitor and at least one second intermediate circuit capacitor.
[0042] In some modified examples, the electrical device can be designed as a rectifier for rectifying a three-phase alternating voltage into the three direct voltages, for which the electrical device, for example, only has a suitably electrically connected power module. In other modified examples, the electrical device can be designed as an inverter for converting the three direct voltages into a three-phase alternating voltage, for which the electrical device, for example, only has a suitably electrically connected power module. If the electrical device has both a rectifier and an inverter, the electrical device can be designed as a converter for converting a three-phase alternating voltage into another three-phase alternating voltage.
[0043] A particular advantage of the proposed method is that commercially available output power modules or at least their output module housings can be used, which are inexpensive and available in large quantities. For example, the IGBT modules "EconoDual3" from Infineon Technologies AG, Munich, "SEMiX" from SEMIKRON Elektronik GmbH & Co. KG, Nuremberg or "SD3" from Siemens AG, Munich or their module housings can serve as output power modules or output module housings. These IGBT modules are used specifically for applications in 2-level technology, for example to create a single half-bridge from several individual IGBT semiconductors.
[0044] According to the proposed method, no expensive special adaptations are required, which are sometimes difficult to obtain on the market due to the low expected production volumes. In particular, a conventional printed circuit board or a conventional substrate can be dispensed with for the output power module or the output module housing, since the output power module or the output module housing is equipped with the proposed substrate and thus strengthened.
[0045] To do this, the output power module or output module housing described above is equipped with the proposed substrate. The four DC terminals of the substrate are then electrically connected to the four output power module voltage terminals.
[0046] In a further advantageous embodiment of the invention, the positive DC terminal and the first middle DC terminal are electrically connected to the two output power module voltage terminals arranged on the first short side, wherein the output power module voltage terminal electrically connected to the positive DC terminal is arranged closer to the first long side than the output power module voltage terminal electrically connected to the first middle DC terminal, wherein the negative DC terminal and the second middle DC terminal are electrically connected to the two output power module voltage terminals arranged on the second short side, and wherein the output power module voltage terminal electrically connected to the negative DC terminal is arranged closer to the second long side than the output power module voltage terminal electrically connected to the second middle DC terminal.
[0047] Preferably, the respective one of the four output power module voltage terminals and the respective one of the four DC terminals of the substrate are arranged on the same short side, whereby short electrical connections between the matching, said terminals can be achieved, wherein the respective electrical connection is preferably shorter than 20% or 10% of the diagonal of the substrate in a plan view of the substrate.
[0048] In a further advantageous embodiment of the invention, three module AC terminals are provided, arranged on the long sides of the output power module, and a respective electrical connection is established from the three AC terminals of the substrate to the three module AC terminals. Preferably, the three module AC terminals and the three AC terminals of the substrate are arranged on the same long side, thereby achieving short electrical connections between the corresponding terminals, wherein the respective electrical connection is preferably shorter than 20% or 10% of the diagonal of the substrate when viewed from above. The invention is described and explained in more detail below with reference to the exemplary embodiments illustrated in the figures. They show:
[0049] FIG 1 shows a first embodiment of the proposed substrate,
[0050] FIG 2 is a circuit diagram of a second embodiment of the proposed substrate,
[0051] FIGS 3-8 show a first to sixth embodiment of the proposed power module,
[0052] FIG 9 an embodiment of the proposed electrical device and
[0053] FIG 10 is a flow chart of an embodiment of the proposed method for producing an embodiment of a power module.
[0054] Figure 1 shows a first embodiment of the proposed substrate 1, wherein a schematic plan view is shown.
[0055] In the plan view shown, the substrate 1 is essentially rectangular and thus has two opposite long sides 2A and 2B and two opposite short sides 3A, 3B. Furthermore, the substrate 1 has a plurality of semiconductors 4, although only two semiconductors 4 are shown in Figure 1 for the sake of clarity. The semiconductors 4 serve to convert a three-phase alternating voltage (AC) into a positive, a medium and a negative direct voltage (DC) or to convert a positive, a medium and a negative direct voltage (DC) into a three-phase alternating voltage (AC).
[0056] On the long sides 2A, 2B, the substrate 1 has three AC terminals AC1, AC2, AC3 for applying three-phase alternating voltage (AC) to the substrate 1 or tapping it off from the substrate 1. The three AC terminals AC1, AC2, AC3 are preferably arranged on one of the two long sides 2A, 2B, for example on the first long side 2A as shown in Figure 1. On the first short side 3A, the substrate 1 has a positive DC terminal DCP for applying a positive direct voltage to the substrate 1 or tapping it off from the substrate 1. Furthermore, the substrate 1 has a first middle DC terminal DCM1 on the first short side 3A for applying a middle or neutral direct voltage to the substrate 1 or tapping it off from the substrate 1. The positive DC terminal DCP is arranged closer to the first long side 2A than the first middle DC terminal DCM1.
[0057] On the second short side 3B, the substrate 1 has a negative DC terminal DCN for applying a negative DC voltage to the substrate 1 or tapping it off from the substrate 1. Furthermore, the substrate 1 has a second middle DC terminal DCM2 on the second short side 3B for applying the middle or neutral DC voltage to the substrate 1 or tapping it off from the substrate 1. The negative DC terminal DCN is arranged closer to the second long side 2B than the second middle DC terminal DCM2.
[0058] For the voltage conversion mentioned, the semiconductors 4 are suitably interconnected and electrically connected to the AC terminals AC1, AC2, AC3 and the DC terminals DCP, DCM1, DCM2, DCP, which is not shown in detail in Figure 1 for the sake of clarity, but is shown as an example in Figure 2.
[0059] Figure 2 shows a circuit diagram of a second embodiment of the proposed substrate 1, wherein the same reference numerals as in Figure 1 designate the same objects.
[0060] In contrast to the first exemplary embodiment, the substrate 1 according to the second exemplary embodiment has a first backup capacitor 9A and a second backup capacitor 9B. The first backup capacitor 9A is connected between the positive direct voltage at the positive DC terminal DCP and the average direct voltage at the first middle DC terminal DCM1. The second backup capacitor 9B is connected between the negative direct voltage at the negative DC terminal DCN and the average direct voltage at the second middle DC terminal DCM2. Alternatively, the first backup capacitor 9A and the second backup capacitor 9B can also be arranged outside the substrate 1 in the power module 5, for example on a circuit board 10 which is included in the power module.
[0061] The substrate 1 has a total of nine semiconductors 4, which are numbered TI, T2, ..., T9. Between the respective AC terminal AC1, AC2, or AC3, one semiconductor 4 is arranged to the positive DC terminal DCP, to the two middle DC terminals DCM1 and DCM2, and to the negative DC terminal DCN. This arrangement allows the voltage conversion mentioned above.
[0062] Furthermore, the substrate 1 has a total of ten impedances Z , whereby the notation Z_DCXY is used for this in Figure 2, where X stands for the DC potential (i.e. positive, middle / neutral or negative DC voltage DCP, DCM, DCN) and Y is numbered for each DC potential.
[0063] Advantageously, substrate 1 is designed such that the impedances Z between the DC terminals DCP, DCM1, DCM2, DCN of two of the DC voltages for the three phases of the AC voltage are equal within a tolerable deviation, wherein the tolerable deviation is 25%, in particular 15% or 10%.
[0064] In this example, the impedances between the positive DC terminal DCP and the negative DC terminal DCN for the three phases of the alternating voltage are equal within the tolerable deviation, i.e. because of a series connection of the individual impedances: • For the first alternating voltage phase (connected to the AC terminal AC1):
[0065] Z(DCP->DCN, AC1) = Z_DCP1 + Z_DCN3 + Z_DCN2 + Z_DCN1
[0066] • For the second AC phase (connected to the AC terminal AC2):
[0067] Z(DCP->DCN, AC2) = Z_DCP1 + Z_DCP2 + Z_DCN2 + Z_DCN1
[0068] • For the third AC phase (connected to the AC terminal AC3):
[0069] Z(DCP->DCN, AC3) = Z_DCP1 + Z_DCP2 + Z_DCP3 + Z_DCN1 where Z(DCP->DCN, AC1), Z(DCP->DCN, AC2) and Z(DCP->DCN, AC3) should be equal within the tolerable deviation.
[0070] Furthermore, in this example, the impedances between the positive DC terminal DCP or the negative DC terminal DCN on the one hand and the two middle DC terminals DCM1 and DCM2 on the other hand are equal for the three phases of the alternating voltage within the tolerable deviation, i.e. due to a partial series connection and partial parallel connection of the individual impedances (noted with "| |", where the inverse of a total impedance in a parallel connection of individual impedances results from the sum of the inverse values of the individual impedances):
[0071] • For the first AC phase (connected to the AC terminal AC1):
[0072] Z (DCP->DCM1 / DCM2, AC1) = Z_DCP1 + (Z_DCM1 | | ( Z_DCM2 + Z_DCM3 + Z_DCM4 ) ) Z(DCN-> DCM1 / DCM2, AC1) = Z_DCN1 + Z_DCN2 + Z_DCN3 + (Z_DCM1 | | (Z_DCM2 + Z_DCM3 + Z_DCM4 ) )
[0073] • For the second AC phase (connected to the AC terminal AC2):
[0074] Z (DCP->DCM1 / DCM2, AC2 ) = Z_DCP1 + Z_DCP2 + ( ( Z_DCM2 + Z_DCM1) | | (Z_DCM3 + Z_DCM4 ) ) Z(DCN-> DCM1 / DCM2, AC2 ) = Z_DCN1 + Z_DCN2 + ( ( Z_DCM2 + Z_DCM1) | | (Z_DCM3 + Z_DCM4 ) )
[0075] • For the third AC phase (connected to the AC terminal AC3):
[0076] Z (DCP->DCM1 / DCM2, AC3) = Z_DCP1 + Z_DCP2 + Z_DCP3 + ( (Z DCM3 + Z DCM2 + Z DCM1 ) | | Z DCM4 ) Z(DCN->DCM1 / DCM2, AC3) = Z_DCN1 + ( ( Z_DCN3 + Z_DCN2 + Z_DCN1) | | Z_DCM4) where Z (DCP->DCM1 / DCM2, AC1) , Z ( DCP->DCM1 / DCM2 , AC2) and Z (DCP->DCM1 / DCM2 , AC3) should be equal within the tolerable deviation, where Z (DCN->DCM1 / DCM2, AC1) , Z(DCN->DCM1 / DCM2, AC2 ) and Z (DCN->DCM1 / DCM2, AC3) should also be equal within the tolerable deviation. tolerable deviation should be equal and finally, for reasons of symmetry, Z (DCP->DCM1 / DCM2, AC1), Z (DCP->DCM1 / DCM2, AC2) and Z (DCP->DCM1 / DCM2, AC3) as well as Z (DCN->DCM1 / DCM2, AC1), Z (DCN->DCM1 / DCM2, AC2) and Z (DCN->DCM1 / DCM2, AC3) should be equal within the tolerable deviation.
[0077] If the semiconductors 4 are configured as transistors T1, T2, T9, the aforementioned impedances Z are equal within the tolerable deviation, particularly at the switching or clock frequency of the transistors T1, T2, ..., T9. In some examples, the corresponding inductance between the DC terminals of two of the DC voltages for the three phases of the AC voltage can be equal within the tolerable deviation.
[0078] Figure 3 shows a first embodiment of the proposed power module 5, wherein a schematic plan view is shown.
[0079] The power module 5 has a substrate 1, which has similarities to the substrate 1 according to the first exemplary embodiment. The power module 5 also has a module housing 6, which partially encloses the substrate 1. Furthermore, the power module 5 has three module AC terminals MAC1, MAC2, MAC3 arranged on the long sides 2A, 2B, which are electrically connected to the three AC terminals AC1, AC2, AC3 of the substrate 1. The three module AC terminals MAC1, MAC2, MAC3 are preferably arranged on one of the two long sides 2A, 2B, for example, as shown in Figure 1, on the first long side 2A. In addition, the power module has four module DC terminals MDCP, MDCM1, MDCM2, MDCN arranged on the short sides 3A, 3B, which are electrically connected to the four DC terminals DCP, DCM1, DCM2, DCN of the substrate 1.
[0080] Figure 4 shows a second embodiment of the proposed power module 5, wherein a schematic plan view is shown.
[0081] The power module 5 has a substrate 1 which is similar to the substrate 1 according to the first exemplary embodiment. The power module 5 also has a module housing 6 which partially encloses the substrate 1. The module housing 6 has a plurality of recesses 7, wherein a connection pin 8 is introduced into some of the recesses 7. Advantageously, a respective connection pin 8 is introduced into each recess 7, which are arranged near the DC connections DCP, DCM1, DCM2, DCN or the AC connections AC1, AC2, AC3 of the substrate 1. Three of the connection pins 8 are electrically connected to the three AC connections AC1, AC2, AC3 of the substrate 1, and four of the connection pins 8 are electrically connected to the four DC connections DCP, DCM1, DCM2, DCN of the substrate 1.
[0082] Figure 5 shows a third embodiment of the proposed power module 5, again showing a schematic plan view.
[0083] The power module 5 has similarities to the power module 5 according to the second embodiment. Furthermore, the power module 5 has three module AC connections MAC1, MAC2, MAC3 arranged on the long sides 2A, 2B, which are electrically connected to the three AC connections AC1, AC2, AC3 of the substrate 1 via the three above-mentioned connection pins 8. The three module AC connections MAC1, MAC2, MAC3 are preferably arranged on one of the two long sides 2A, 2B, for example, as shown in Figure 1 on the first long side 2A. Furthermore, the power module has four module DC connections MDCP, MDCM1, MDCM2, MDCN arranged on the short sides 3A, 3B, which are electrically connected to the four DC connections DCP, DCM1, DCM2, DCN of the substrate 1 via the four above-mentioned connection pins 8.
[0084] As shown in Figure 5, the module DC terminal MDCP electrically connected to the positive DC terminal DCP and the module DC terminal MDCM1 electrically connected to the first middle DC terminal DCM1 are arranged on the first short side 3A, wherein the module DC terminal MDCP electrically connected to the positive DC terminal DCP is arranged closer to the first long side 2A than the module DC terminal MDCM1 electrically connected to the first middle DC terminal DCM1. Furthermore, the module DC terminal MDCN electrically connected to the negative DC terminal DCN and the module DC terminal MDCM2 electrically connected to the second middle DC terminal DCM2 are arranged on the second short side 3B, wherein the module DC terminal MDCN electrically connected to the negative DC terminal DCN is arranged closer to the second long side 2B than the module DC terminal MDCM2 electrically connected to the second middle DC terminal DCM2.
[0085] Figure 6 shows a fourth embodiment of the proposed power module 5, again showing a schematic plan view.
[0086] The power module 5 has similarities to the power module 5 according to the first exemplary embodiment. The power module 5 also has a first backup capacitor 9A and a second backup capacitor 9B, both of which are arranged on the substrate 1. The first backup capacitor 9A is connected between the positive direct voltage at the positive DC terminal DCP and the average direct voltage at the first middle DC terminal DCM1. The second backup capacitor 9B is connected between the negative direct voltage at the negative DC terminal DCN and the average direct voltage at the second middle DC terminal DCM2. Figure 7 shows a fifth exemplary embodiment of the proposed power module 5, again showing a schematic top view.
[0087] The power module 5 has similarities to the power module 5 according to the fourth embodiment, wherein the arrangement of the first backup capacitor 9A and the second backup capacitor 9B differs from the fourth embodiment. The power module 5 now has a printed circuit board 10 on which the first backup capacitor 9A and the second backup capacitor 9B are arranged, wherein the first backup capacitor 9A and the second backup capacitor 9B are furthermore electrically connected to the aforementioned DC terminals DCP, DCM1, DCM2, DCN, as already explained above.
[0088] Figure 8 shows a sixth embodiment of the proposed power module 5, wherein a more realistic representation is shown in a plan view.
[0089] The power module 5 has great similarities with the power module 5 according to the third embodiment.
[0090] Figure 9 shows an embodiment of the proposed electrical device 11, wherein a schematic plan view is shown.
[0091] The electrical device 11 shown is a converter that can convert a three-phase alternating voltage, which can be supplied via the device AC connections GAC1, GAC2, GAC3, into another three-phase alternating voltage, which can be tapped off via the device AC connections GAC1', GAC2', GAC3'. For this purpose, the electrical device 11 has two power modules 5 and 5', which can each be designed, for example, according to the second exemplary embodiment of a power module explained above. For reasons of clarity, some details of the two power modules 5 and 5' are only indicated in Figure 9 and are not shown in more detail.
[0092] The device AC terminals GAC1, GAC2, GAC3 are electrically connected to the module AC terminals MAC1, MAC2, MAC3 of the first power module 5, and the device AC terminals GAC1', GAC2', GAC3' are electrically connected to the module AC terminals MAGI', MAC2', MAC3' of the second power module 5'.
[0093] The electrical device 11 further comprises a first intermediate circuit capacitor 12A, which is connected, on the one hand, to the module DC terminals MDCP, MDCP' for the positive DC voltage of the two power modules 5 and 5'. On the other hand, the first intermediate circuit capacitor 12A is connected to the module DC terminals MDCM1, MDCM2, MDCM1', MDCM2' for the medium / neutral DC voltage of the two power modules 5 and 5'.
[0094] In addition, the electrical device 11 has a second intermediate circuit capacitor 12B, which is connected, on the one hand, to the module DC terminals MDCN, MDCN' for the negative DC voltage of the two power modules 5 and 5'. On the other hand, the second intermediate circuit capacitor 12B is connected to the module DC terminals MDCM1, MDCM2, MDCM1', MDCM2' for the medium / neutral DC voltage of the two power modules 5 and 5'.
[0095] In some modified examples, the electrical device 11 can also be designed as a rectifier for rectifying a three-phase alternating voltage into the three direct voltages, for which the second (in Figure 9: right) power module 5' and the device AC connections GAC1', GAC2', GAC3' are omitted. In other modified examples, the electrical device 11 can also be designed as an inverter for converting the three direct voltages into a three-phase alternating voltage, for which the first (in Figure 9: left) power module 5' and the device AC connections GAC1, GAC2, GAC3 are omitted.
[0096] Figure 10 shows an exemplary embodiment of the proposed method 1000 for producing an exemplary embodiment of a power module 5. The method comprises the following method steps.
[0097] In a method step 1002, an output power module 5A is provided, which has two output power module voltage connections XC-3A-2A, XC-3A-2B arranged on the first short side 3A. Furthermore, the output power module 5A has two output power module voltage connections XC-3B-2A, XC-3B-2B arranged on the second short side 3B. In addition, the output power module 5A has an output module housing 6A for receiving and at least partially enclosing the substrate 1.
[0098] In a method step 1004, the substrate 1 is introduced into the output power module 5A.
[0099] In a method step 1006, a respective electrical connection is established from the four DC terminals DCP, DCM1, DCM2, DCN of the substrate 1 to the four output power module voltage terminals XC-3A-2A, XC-3A-2B, XC-3B-2A, XC-3B-2B.
[0100] The positive DC terminal DCP and the first middle DC terminal DCM1 are electrically connected to the two output power module voltage terminals XC-3A-2A, XC-3A-2B arranged on the first short side 3A, wherein the output power module voltage terminal XC-3A-2A electrically connected to the positive DC terminal DCP is arranged closer to the first long side 2A than the output power module voltage terminal XC-3A-2B electrically connected to the first middle DC terminal DCM1.Furthermore, the negative DC terminal DCN and the second middle DC terminal DCM2 are electrically connected to the two output power module voltage terminals XC-3B-2A, XC-3B-2B arranged on the second short side 3B, wherein the output power module voltage terminal XC-3B-2B electrically connected to the negative DC terminal DCN is arranged closer to the second long side 2B than the output power module voltage terminal XC-3B-2A electrically connected to the second middle DC terminal DCM2. In an optional method step 1008 (indicated by the dashed arrow), three module AC terminals MAC1, MAC2, MAC3 arranged on the long sides 2A, 2B of the output power module 5A are provided and a respective electrical connection of three AC terminals AC1, AC2, AC3 of the substrate 1 to the three module AC terminals MAC1, MAC2, MAC3 is established.
Claims
Patent claims 1. Substrate (1) for a power module, wherein the substrate (1) is designed in a plan view substantially rectangular with two opposite long sides (2A, 2B) and two opposite short sides (3A, 3B), and wherein the substrate (1) has a plurality of semiconductors (4) for converting a three-phase alternating voltage (AC) into a positive, a medium and a negative direct voltage (DC) or for converting a positive, a medium and a negative direct voltage (DC) into a three-phase alternating voltage (AC), characterized by - three AC connections (AC1, AC2, AC3) arranged on the long sides (2A, 2B), - a positive DC terminal (DCP) located on the first short side (3A), - a first central DC terminal (DCM1) arranged on the first short side (3A), - a second central DC terminal (DCM2) arranged on the second short side (3B) and - a negative DC terminal (DCN) arranged on the second short side (3B), wherein the positive DC terminal (DCP) is arranged closer to the first long side (2A) than the first middle DC terminal (DCM1), and wherein the negative DC terminal (DCN) is arranged closer to the second long side (2B) than the second middle DC terminal (DCM2).
2. Substrate (1) according to claim 1, wherein the three AC terminals (AC1, AC2, AC3) are arranged on one of the two long sides (2A, 2B), preferably on the first long side (2A).
3. Substrate (1) according to one of the preceding claims, wherein the substrate (1) is designed such that the im- pedances (Z) between the DC terminals (DCP, DCM1, DCM2, DCN) of two of the DC voltages for the three phases of the AC voltage are equal within a tolerable deviation, wherein the tolerable deviation is 25%, in particular 15% or 10%.
4. Substrate (1) according to claim 3, wherein the substrate (1) is designed such that the impedances (Z) between the positive DC terminal (DCP) and the two middle DC terminals (DCM1, DCM2) for the three phases of the alternating voltage are equal within the tolerable deviation and are further equal within the tolerable deviation to the impedances (Z) between the negative DC terminal (DCN) and the two middle DC terminals (DCM1, DCM2) for the three phases of the alternating voltage.
5. Power module (5) comprising: - a substrate (1) according to one of the preceding claims, - a module housing (6) which at least partially encloses the substrate (1).
6. Power module (5) according to claim 5, further comprising: - three module AC terminals (MAC1, MAC2, MAC3) arranged on the long sides (2A, 2B) which are electrically connected to the three AC terminals (AC1, AC2, AC3) of the substrate (1), and - four module DC terminals (MDCP, MDCM1, MDCM2, MDCN) arranged on the short sides (3A, 3B) which are electrically connected to the four DC terminals (DCP, DCM1, DCM2, DCN) of the substrate (1).
7. Power module (5) according to claim 6, wherein the module DC terminal (MDCP) electrically connected to the positive DC terminal (DCP) and the module DC terminal (MDCP) electrically connected to the first middle DC terminal (DCM1) Connection (MDCM1) are arranged on the first short side (3A), wherein the module DC connection (MDCP) electrically connected to the positive DC connection (DCP) is arranged closer to the first long side (2A) than the module DC connection (MDCM1) electrically connected to the first middle DC connection (DCM1), wherein the module DC connection (MDCN) electrically connected to the negative DC connection (DCN) and the module DC connection (MDCM2) electrically connected to the second middle DC connection (DCM2) are arranged on the second short side (3B), and wherein the module DC connection (MDCN) electrically connected to the negative DC connection (DCN) is arranged closer to the second long side (2B) than the module DC connection (MDCM2) electrically connected to the second middle DC connection (DCM2).
8. Power module (5) according to one of claims 5 to 7, further comprising: - a first backup capacitor (9A) connected between the positive DC voltage at the positive DC terminal (DCP) and the middle DC voltage at the first middle DC terminal (DCM1), and - a second backup capacitor (9B) which is connected between the negative DC voltage at the negative DC terminal (DCN) and the middle DC voltage at the second middle DC terminal (DCM2).
9. Power module (5) according to claim 8, further comprising a circuit board (10), wherein the first backup capacitor (9A) and the second backup capacitor (9B) are each arranged on the circuit board (10).
10. Power module (5) according to claim 8, wherein the first support capacitor (9A) and the second support capacitor (9B) are each arranged on the substrate (1).
11. Power module (5) according to one of claims 5 to 10, wherein the power module (10) can be operated with an electrical power of at least several tens of kW, preferably 40 kW to 500 kW, with an alternating voltage of at least several hundred V, preferably 280 V to 800 V, with a direct voltage of at least several hundred V, preferably 800 V to 1500 V, and / or electrical currents of several tens of A, preferably 70 A to 1000 A.
12. Electrical device (11), in particular converter, comprising: at least one power module (5), preferably at least two power modules (5), according to one of claims 5 to 11, at least one first intermediate circuit capacitor (12A) which is connected between the capacitors connected to the positive DC terminal (DCP) electrically connected module DC terminal (MDCP) on the one hand and the module DC terminals (MDCM1, MDCM2) electrically connected to the middle DC terminals (DCM1, DCM2) on the other hand, and at least one second intermediate circuit capacitor (12B) which is connected between the module DC terminal (MDCM1, MDCM2) electrically connected to the negative DC terminal (DCN) electrically connected module DC terminal (MDCN) on the one hand and the module DC terminals (MDCM1, MDCM2) electrically connected to the middle DC terminals (DCM1, DCM2) on the other hand.
13. A method for producing a power module (5) according to one of claims 5 to 11, comprising the method steps: - Providing an output power module (5A) comprising: o at least two output power module voltage terminals (XC-3A-2A, XC-3A-2B) arranged on the first short side (3A), o at least two output power module voltage terminals (XC-3B-2A, XC-3B-2B) arranged on the second short side (3B), o an output module housing (6A) for receiving and at least partially enclosing the substrate (1), and - Inserting the substrate (1) into the output power module (5A), - Establish a respective electrical connection from the four DC terminals (DCP, DCM1, DCM2, DCN) of the substrate (1) to the four output power module voltage terminals (XC-3A-2A, XC-3A-2B, XC-3B-2A, XC-3B-2B).
14. The method according to claim 13, wherein the positive DC terminal (DCP) and the first middle DC terminal (DCM1) are electrically connected to the two output power module voltage terminals (XC-3A-2A, XC-3A-2B) arranged on the first short side (3A), wherein the output power module voltage terminal (XC-3A-2A) electrically connected to the positive DC terminal (DCP) is arranged closer to the first long side (2A) than the output power module voltage terminal (XC-3A-2B) electrically connected to the first middle DC terminal (DCM1), wherein the negative DC terminal (DCN) and the second middle DC terminal (DCM2) are electrically connected to the two output power module voltage terminals (XC-3B-2A, XC-3B-2B) arranged on the second short side (3B),and wherein the output power module voltage terminal (XC-3B-2B) electrically connected to the negative DC terminal (DCN) is arranged closer to the second long side (2B) than the output power module voltage terminal (XC-3B-2A) electrically connected to the second middle DC terminal (DCM2).
15. The method according to claim 13 or 14, further comprising the following method steps: - Providing three module AC connections (MAC1, MAC2, MAC3) arranged on the long sides (2A, 2B) of the output power module (5A), and - Establishing a respective electrical connection from the three AC terminals (AC1, AC2, AC3) of the substrate (1) to the three module AC terminals (MAC1, MAC2, MAC3) .