Electric connection structure and method for producing said electric connection structure
Patent Information
- Application Number
- EP2023761133
- Authority / Receiving Office
- EP · EP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-01-25
- Filing Date
- 2023-08-24
- Publication Date
- 2025-07-16
AI Technical Summary
The challenge lies in applying partial coatings to electrical contact surfaces of geometrically complex components like busbars, which are difficult to access and require complex masking processes, leading to inefficiencies in manufacturing and material usage.
Direct printing of conductive metal contact surfaces onto a carrier structure at predetermined positions using methods like screen printing, ensuring only necessary areas are coated, with the option to punch and bend the structure for optimal adaptation and reduced material usage.
This approach ensures consistently low transition resistance and optimized material usage, allowing for selective finishing and adaptation of contact surfaces, reducing manufacturing effort and material expenditure while maintaining good electrical conductivity.
Smart Images

Figure EP2023073285_02082024_PF_FP
Abstract
Description
[0001] ELECTRICAL CONNECTION STRUCTURE AND MANUFACTURING METHOD OF THIS ELECTRICAL CONNECTION STRUCTURE
[0002] Description:
[0003] The invention relates to an electrical connection structure comprising an electrically conductive support structure and at least one electrical contact surface. Furthermore, the invention relates to a method for manufacturing the electrical connection structure. The partial coating of the contact surfaces for electrically contacting electrical connection structures, such as busbars or similar current-conducting components, represents a major challenge for a large number of specially geometrically designed components. The contact surfaces are often difficult to access and require complex masking of the remaining component. Currently, such contact surfaces are applied using complex coating technologies such as PVD processes, galvanic processes, or dipping processes. The masking of the corresponding areas described above is typically used.
[0004] It is therefore an object of the present invention to provide an improved electrical connection structure and an optimized manufacturing method of the electrical connection structure.
[0005] This problem is solved by the combination of features according to patent claim 1.
[0006] According to the invention, an electrical connection structure, in particular a busbar or a comparable electrically conductive component, is proposed, consisting of an electrically conductive support structure and at least one electrical contact surface. The at least one electrical contact surface is applied in a protruding manner at a predetermined position on a support structure surface, preferably printed directly onto the corresponding support structure surface using a direct printing process with a conductive metal. Furthermore, in non-printed surface areas of the support structure, the support structure is formed without a coating and / or covering.
[0007] The advantage of this is that the electrical contact surface is printed directly onto the carrier structure, and for the electrical contacting of an electrical connection structure, in particular busbars or similar current-conducting components, subsequent finishing of the later contact surfaces is used. This ensures that a consistently low contact resistance is always guaranteed at the contact surfaces over the entire service life of the device. Another advantage is that the contact materials are only printed on the areas of the finished part that are used for contacting. The use of a printing process enables the selective finishing of the later contact surfaces. Accordingly, the electrical connection structure is optimally adapted or designed to a specific application. This also reduces, for example, the manufacturing effort and material usage.
[0008] In a favorable embodiment of the present electrical connection structure, it is further provided that the support structure is or consists of a sheet metal panel, a coil or metal strip or a flat steel with an electrical contact surface.
[0009] In a further development of the present invention, the electrical contact surface is arranged at least partially on the carrier structure in an area for contacting a contact element, in particular in an edge region of the carrier structure. As a result, the carrier structure is printed only in the area intended for contacting. Consequently, the material requirements of the electrical connection structure are optimized.
[0010] In an advantageous embodiment, a second electrical contact surface is applied in a protruding manner at a second predetermined position on the carrier structure surface, preferably printed directly onto the corresponding carrier structure surface using a direct printing method with a conductive metal. In a further development of the invention, a plurality of corresponding contact surfaces are applied in a protruding manner at a respective predetermined position on the carrier structure surface. This is advantageous in that further contact surfaces are provided on the electrical connection structure and, accordingly, the electrical connection structure can be contacted at any desired number of predetermined contact surfaces. In an advantageous embodiment, the carrier structure is made of aluminum and / or copper and / or alloys of copper or aluminum.This ensures good electrical conductivity and optimizes contact. Printable materials can be typical conductor materials, which increase the contact resistance of mechanical contacts over time by forming insulating oxide layers.
[0011] It is further advantageous if the electrical contact surface is made of silver, gold, nickel, platinum, and / or alloys of silver, gold, nickel, and / or platinum. In particular, the materials to be printed are metals that do not form insulating oxide layers over time. Although silver forms oxides, these are highly conductive.
[0012] The invention also proposes a method for manufacturing an electrical connection structure according to the above disclosure, in which an electrically conductive carrier structure is first provided. Subsequently, at least one electrical contact surface is printed onto the carrier structure using a printing device. The electrical contact surface is printed onto the carrier structure at a predetermined position.
[0013] Because the electrical contact surface is printed directly onto the carrier structure, the electrical contact surface can be arranged directly according to a predetermined topology or at a predetermined contact position on the carrier structure. Accordingly, the electrical connection structure is optimally adapted or designed for a specific application. This also reduces, for example, manufacturing costs and material usage.
[0014] In a further advantageous variant, the invention provides that the carrier structure is punched in a predetermined manner using a punching device after printing. Furthermore, in one embodiment, a protective film is applied to the electrical contact surface after printing or punching. Furthermore, in a preferred embodiment, after punching or applying the protective film, i.e., after the last process step, the printed carrier structure is bent into a predetermined configuration using a bending device. Alternatively, the protective film is removed after the electrical connection structure has been produced.
[0015] In an advantageous embodiment, the printing device prints the at least one electrical contact surface by means of screen printing, flexographic printing, gravure printing or inkjet printing from the liquid phase of the metal to be printed.
[0016] The features disclosed above can be combined as desired, as long as this is technically possible and they do not contradict each other.
[0017] Other advantageous developments of the invention are characterized in the subclaims or are presented in more detail below, together with the description of the preferred embodiment of the invention, with reference to the figures. They show:
[0018] Fig. 1 shows an electrical connection structure consisting of a support structure and at least one electrical contact surface;
[0019] Fig. 2 shows a schematic sequence of a manufacturing method of the electrical connection structure.
[0020] The figures are schematic examples. Identical reference numerals in the figures indicate identical functional and / or structural features. Figure 1 shows an electrical connection structure 10 comprising an electrically conductive carrier structure 1 and at least one electrical contact surface 8. The contact surface 8 is applied in a protruding manner at a predetermined position on a carrier structure surface, specifically by means of a direct printing process with a conductive metal printed directly onto the corresponding carrier structure surface. Furthermore, in non-printed surface areas of the carrier structure 1, the carrier structure 1 is formed without a coating or covering. The carrier structure 1 is a metal sheet with an electrical contact surface 8 or consists thereof.Furthermore, the electrical contact surface 8 is arranged in sections on the carrier structure 1 in an edge region of the carrier structure 1 for contacting a contact element. The carrier structure 1 is formed from aluminum and / or copper. Furthermore, the electrical contact surface 8 is formed from silver, gold, nickel, platinum, and / or alloys of silver, gold, nickel, and / or platinum.
[0021] Figure 2 shows a schematic sequence of a manufacturing method for the electrical connection structure 10, in which an electrically conductive carrier structure 1 is first provided and then at least one electrical contact surface 8 is printed onto the carrier structure 1 using a printing device. The printing device prints the at least one electrical contact surface 8 using screen printing, flexographic printing, gravure printing, or inkjet printing from the liquid phase of the metal to be printed.
[0022] In one embodiment of the method, the carrier structure 1 is punched in a predetermined manner after printing using a punching device. Following the preceding method step, i.e., printing or punching, a protective film is applied to the electrical contact surface 8. Following the preceding method step, i.e., punching or applying the protective film or printing, the printed carrier structure 1 is bent into a predetermined configuration using a bending device.
[0023] The invention is not limited to the preferred embodiments described above. Rather, a number of variants are conceivable that utilize the presented solution even in fundamentally different embodiments.
[0024] * * * * *
Claims
Patent claims 1. Electrical connection structure (10) comprising an electrically conductive carrier structure (1) and at least one electrical contact surface (8), wherein the at least one electrical contact surface (8) is applied in a protruding manner at a predetermined position on a carrier structure surface, preferably by means of a direct printing process with a conductive metal printed directly onto the corresponding carrier structure surface, wherein in non-printed surface areas of the carrier structure (1), the carrier structure (1) is formed without a coating and / or covering.
2. Electrical connection structure (10) according to claim 1, wherein the support structure (1) is or consists of a sheet metal panel, a metal strip or a flat steel with at least one electrical contact surface (8).
3. Electrical connection structure (10) according to claim 1 or 2, wherein the electrical contact surface (8) is arranged at least in sections on the carrier structure (1) in a region for contacting a contact element, in particular in an edge region of the carrier structure 1.
4. Electrical connection structure (10) according to one of claims 1 to 3, wherein a second electrical contact surface (8) is applied at a second predetermined position on the carrier structure surface in a protruding manner, preferably by means of the direct printing method with a conductive metal printed directly on the corresponding carrier structure surface.
5. Electrical connection structure (10) according to one of the preceding claims, wherein the support structure (1) is formed from aluminum and / or copper and / or alloys of copper or aluminum.
6. Electrical connection structure (10) according to one of the preceding claims, wherein the electrical contact surface (8) is formed from silver, gold, nickel, platinum and / or alloys of silver, gold, nickel and / or platinum.
7. A method for manufacturing an electrical connection structure (10) according to one of the preceding claims 1 to 6, comprising the steps of: a. providing an electrically conductive carrier structure (1); b. printing at least one electrical contact surface (8) onto the carrier structure (1) by means of a printing device.
8. Manufacturing method according to claim 7, wherein the support structure (1) is punched in a predetermined manner after printing by means of a punching device.
9. Manufacturing method according to claim 7 or 8, wherein a protective film is applied to the electrical contact surface (8) following the preceding method step.
10. Manufacturing method according to claim 7 to 9, wherein following the preceding method step, the printed carrier structure (1) is bent into a predetermined arrangement by means of a bending device.
11. Manufacturing process according to one of claims 7 to 10, wherein the printing device which prints at least one electrical conductor track (2) by means of screen printing, flexographic printing, gravure printing or inkjet printing from the liquid phase of the metal to be printed.