Laser machining process using a scanner optical system

EP4587215A2Pending Publication Date: 2025-07-23TRUMPF WERKZEUGMASCHINEN GMBH & CO KG
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Patent Information

Application Number
EP2023772430
Authority / Receiving Office
EP · EP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-09-16
Filing Date
2023-09-11
Publication Date
2025-07-23

AI Technical Summary

Technical Problem

Laser processing systems face limitations in beam deflection speed and stability due to thermal load and contamination susceptibility, especially when handling high laser powers, which affects the performance of scanner mirrors in material processing.

Method used

A laser processing head with a scanner unit featuring a tiltably mounted scanner mirror about two axes of rotation, optimized for reduced angle of incidence to minimize mirror mass and enhance deflection speed, combined with a collimation unit, deflection unit, and focusing unit to achieve precise beam control, and incorporating a diaphragm and heat dissipation elements to protect the scanner mirror from thermal and contamination issues.

Benefits of technology

The solution increases the dynamics and deflection speed of the laser beam, improves process stability, and reduces the scanner's susceptibility to contamination and thermal overload, resulting in enhanced contour fidelity and repeatability during high-power laser cutting.

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Abstract

The invention relates to a laser machining head comprising a scanner unit which is arranged in the beam path of the laser machining head and which has a scanner mirror that is tiltably mounted about two rotational axes. The scanner unit is arranged in the laser machining head such that a laser beam which runs through the beam path is incident on the scanner mirror at an angle of incidence of maximally 30°, preferably maximally 22.5°, more preferably maximally 15°, relative to a surface normal of the scanner mirror. The invention additionally relates to a scanner unit for such a laser machining head, to a laser machining system comprising the laser machining head, and to a laser cutting method.
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