Power module for supplying power to an electrical load of an aircraft, power supply system and associated method
Patent Information
- Application Number
- EP2023814176
- Authority / Receiving Office
- EP · EP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2022-12-07
- Filing Date
- 2023-11-28
- Publication Date
- 2025-10-15
- Estimated Expiration
- 2043-11-28
AI Technical Summary
Existing power module designs for aircraft face challenges in protecting electronic components from high currents and electric arcs, leading to potential damage and increased complexity due to the need for bulky and dissipative fuse protection devices.
Integration of a fuse protection layer within the power module that changes state at a current threshold to permanently stop current flow, absorbing energy from electric arcs and protecting components, thereby eliminating the need for external fuse protection devices.
This solution effectively contains electric arcs locally, protects power electronic components, reduces system complexity, and facilitates easier recommissioning by allowing for lower cut-off currents without untimely power interruptions.
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Figure 1.1
Abstract
Description
Power module for supplying an electrical load of an aircraft, power supply system and associated method
[0001] The present invention relates to the field of protection against electric arcs in a power supply system for at least one electrical load of an aircraft.
[0002] Climate change is a well-known concern for many legislative and regulatory bodies around the world. Indeed, various restrictions on carbon emissions have been, are being, or will be adopted by various states. In particular, an ambitious standard applies both to new aircraft types and to those already in operation, requiring the implementation of technological solutions to comply with current regulations. Civil aviation has been mobilizing for several years now to contribute to the fight against climate change.
[0003] Technological research efforts have already led to very significant improvements in the environmental performance of aircraft. The Applicant takes into consideration the impact factors in all phases of design and development to obtain less energy-intensive, more environmentally friendly aeronautical components and products whose integration and use in civil aviation have moderate environmental consequences with the aim of improving the energy efficiency of aircraft.
[0004] This ongoing research and development work focuses in particular on new generations of hybrid thermal and electric aircraft engines. The Applicant's objective is in particular to develop aircraft integrating a high-power electrical generation system. This would make it possible to increase the proportion of electrical equipment on board in order to reduce fuel consumption.
[0005] In practice, with reference to the drawing, a simplified power supply system according to the prior art is shown for supplying an electrical load L from a power source S via a power device DP. In practice, the power source S may be an electric battery, a fuel cell or an electrical machine capable of operating as a motor and a generator to draw mechanical energy from a shaft of the aircraft turbomachine to produce electrical energy. In practice, a power supply system comprises a plurality of power sources S and a plurality of electrical loads L.
[0006] In a known manner, with reference to the, a power device DP comprises one or more power modules M1 to ensure the conversion of electrical energy, for example, inverters. A power module M1 comprises several electronic components controlled so as to ensure the conversion function. Their number depends on the quantity of energy that the power module M1 will have to convert. In practice, the power device DP is configured to receive a control instruction PCONS, for example switch switching orders, which is transmitted to each power module M1 in order to configure the conversion of electrical energy according to requirements.
[0007] With reference to the, a power module M1 conventionally comprises a substrate 11 on which power electronic components 12 are mounted, in particular electronic chips. In this example, the power electronic components 12, controlled or not, are connected by electrical connections 14 in order to allow an electrical connection. The power electronic components 12 are protected by an encapsulation layer 15, which ensures electrical insulation, and a protective cover 17. The power module M1 comprises at least one power connector 13P configured to interface with a power source S or an electrical load L. The power module M1 further comprises at least one data connector 13D, in order to allow the control of the so-called controllable power electronic components 12.A controllable component is understood to mean a component whose state can be modified under the effect of an electrical signal type command sent to it. Power transistors are part of the controllable components. The nature of the signals carried by the data connector 13D may vary depending on the nature of the electrical commands and information exchanged with the control instruction PCONS. The structure of such a power module M1 is known to those skilled in the art.
[0008] In practice, various faults can appear at any point in the power system: a short circuit occurring in equipment or wiring, damage to a component subjected to unforeseen stress, an inoperative component, an electric arc, etc. In order to protect the various equipment against currents of excessively high values, it is known to provide controllable protection devices OPC to isolate part of the equipment and thus protect them. Controllable protection devices OPC generally take the form of electromechanical contactors or so-called static components, using semiconductor components. An OPC controllable protection device can isolate the fault, for example, a power source S as illustrated in.In a known manner, in the event of detection of a fault in a power source S, the controllable protection devices OPC are controlled so as to reconfigure the power supply system to supply the electrical loads L with the power sources S which are available.
[0009] To make a controllable OPC protection device redundant, it is often necessary to provide another protection component with a dissimilar breaking technology, for example, a fuse technology.
[0010] With reference to, a protective device of the OPF fuse type makes it possible to permanently cut an electrical connection. In a known manner, such a protective device of the OPF fuse type, for example made of silica, makes it possible to change state in order to absorb an electric arc and cut off the flow of current on the electrical line on which it is mounted. Under the effect of a strong current, the silica will vitrify to cut off the flow of current. Advantageously, a protective device of the OPF fuse type makes it possible to absorb a large quantity of electrical energy to ensure the extinction of the electric arc without causing projection of material or other damage.
[0011] In practice, due to its positioning in series with the equipment to be protected, for example a power source S as illustrated in, the OPF fuse type protection device must be sized to withstand the main current and transients on the power line connecting the power source S to the power device DP. In the event of a short circuit and fault in the OPC controllable protection device, the OPF fuse type protection device will cut off for a high breaking current. In practice, when the current increases to the breaking current, the currents flowing in the M1 power module also increase and are likely to damage the power electronic components 12 of the M1 power modules.In other words, when the OPF fuse-type protection devices interrupt the flow of current, the power electronic components 12 of the M1 power modules are likely to already be damaged, which presents a significant disadvantage. Recommissioning is therefore expensive. In addition, OPF fuse-type protection devices are bulky, dissipative and cooled by natural air convection. To reduce the risk of overheating, an OPF fuse-type protection device is generally oversized. This significantly penalizes the power supply system, which must remain compact.
[0012] An immediate solution to eliminate this drawback would be to provide OPF fuse protection devices with a lower breaking current value, but this would lead to an untimely cut-off in the event of a current fluctuation on the supply line between the power source S and the power device DP.
[0013] The invention thus aims to eliminate at least some of these drawbacks by proposing a fuse protection device making it possible to protect the electronic power components of a power module which are faulty, without increasing the complexity and bulk.
[0014] Application US20070085181A1 discloses a power module comprising semiconductors and a protection device to prevent destruction by explosion of the power module following the circulation of excessively high currents. PRESENTATION OF THE INVENTION
[0015] The invention relates to a power module for supplying at least one electrical load of an aircraft, the power module comprising a plurality of electronic power components mounted on a support substrate, at least one layer for encapsulating the plurality of electronic power components in order to protect them, at least one electrical power connection connected to at least one electronic power component.
[0016] The invention is remarkable in that the power module comprises at least one fusible protection layer in which at least a portion of the electrical power connection extends, the fusible protection layer being configured to change state when a current, greater than an admissible threshold, flows in the portion of the electrical power connection so as to definitively stop the flow of current in said portion.
[0017] Thanks to the invention, a fuse protection is integrated directly into the power module. It makes it possible to permanently stop the flow of current in a portion of an electrical power connection. Furthermore, this fuse protection makes it possible to maintain the power electronic components in an encapsulation layer in order to protect them. The fuse protection layer makes it possible to absorb the energy released by an electric arc and to stop its flow. Thus, an electric arc is contained locally, which protects the power electronic components. Having a fuse protection integrated into the power module is a significant advantage because it makes the use of a dedicated fuse-type protection device, which is bulky and complex to install, superfluous.
[0018] In one aspect, a plurality of electrical connections include a portion in the fusible protective layer. This permanently stops the flow of current through said portions for said electrical connections. In a preferred aspect, all of the electrical connections include a portion in the fusible protective layer.
[0019] Preferably, the fusible protection layer covers several components of the power module, in particular the semiconductors (the chips), potentially all the electrical connections, the passive components or any other component placed in the power module and likely to release energy during a fault.
[0020] In one aspect, the power electrical connection is connected between two power electronic components.
[0021] According to one aspect, the power electrical connection is connected between at least one power electronic component and at least one power electrical connector comprising at least one portion extending outside the encapsulation layer.
[0022] In one aspect, the power electrical connection is partly in the encapsulation layer and partly in the fusible protection layer.
[0023] In one aspect, the power module includes at least one remote connector connecting the power electronic component to the power electrical connection, the power electrical connection extending only into the fusible protection layer. The fusible protection layer allows all heat associated with the fault to be absorbed. The power electronic components remain protected in the encapsulation layer.
[0024] Preferably, the remote connector is positioned on the support substrate.
[0025] Preferably, the power module comprises at least one printed circuit board mounted at the interface between the encapsulation layer and the fusible protection layer, the remote connector being connected to the power electrical connection via the printed circuit board. The printed circuit board comprises the power electrical connections and can be conveniently replaced.
[0026] In one aspect, the power module comprises at least one electrical data connection connected to a data connector, the electrical data connection comprising at least a portion extending into the fusible protection layer. Advantageously, the power electronic components are fully protected.
[0027] The invention also relates to a system for supplying at least one aircraft electrical load comprising at least one power device comprising at least one power module as presented previously.
[0028] The invention also relates to a method for manufacturing a power module for supplying at least one electrical load of an aircraft, the power module comprising a plurality of electronic power components mounted on a support substrate, the method comprising steps consisting of: Connecting at least one electrical power connection to an electronic power component, Depositing an encapsulation layer on the electronic power component so as to protect it, and Depositing a fusible protection layer on at least a portion of the electrical power connection, the fusible protection layer being configured to change state when a current, greater than an admissible threshold, flows in the portion of the electrical power connection so as to permanently stop the flow of current in said portion.
[0029] Preferably, the fusible protective layer is deposited on the encapsulation layer.
[0030] In one aspect, the fusible protective layer is deposited directly onto the encapsulation layer, thereby facilitating assembly.
[0031] In one aspect, the fusible protective layer is deposited indirectly on the encapsulation layer, for example by using an intermediate support. The intermediate support serves as an interface to contain the fusible protective layer. This allows the choice of materials constituting the fusible protective layer that would be incompatible with the encapsulation layer. In one aspect, the intermediate support is a printed circuit board and electrical connections are specifically made on the printed circuit board to provide the fusible function. PRESENTATION OF FIGURES
[0032] The invention will be better understood upon reading the following description, given by way of example, and referring to the following figures, given by way of non-limiting examples, in which identical references are given to similar objects.
[0033] This is a schematic representation of a power supply system according to the prior art.
[0034] This is a schematic representation of a power module according to the prior art.
[0035] This is a schematic representation of a power supply system according to the invention.
[0036] This is a simplified schematic representation of a power supply system according to the invention.
[0037] This is a schematic representation of a power module according to one embodiment of the invention.
[0038] This is a close-up schematic representation of an electrical connection comprising a portion mounted in the fusible protection layer.
[0039] This is a close-up schematic representation of the electrical connection of the after absorption of an electric arc by the fusible protection layer.
[0040] This is a schematic representation of a power module according to another embodiment according to the invention.
[0041] It should be noted that the figures set out the invention in detail to implement the invention, said figures can of course be used to better define the invention where appropriate. DETAILED DESCRIPTION OF THE INVENTION
[0042] With reference to the, there is shown a power supply system for powering a plurality of electrical loads L from a plurality of power sources S. A power source S may in particular be in the form of an electric battery, a fuel cell or an electrical machine configured to operate as a motor or as a generator to draw mechanical energy from a shaft of an aircraft turbomachine. The electrical load L may in particular be in the form of an actuator or a motor, in particular, comprising two stator stars so as to improve redundancy.
[0043] Still with reference to the, the power supply system comprises a plurality of power devices DP for converting and processing the electrical energy from the power sources S to power the electrical loads L. By way of example, a power device DP may comprise several power modules for powering the different stator stars of an electrical machine.
[0044] Still with reference to the, the power supply system comprises a plurality of controllable protection devices OPC, for example contactors, so as to enable a fault to be isolated from equipment and to enable reconfiguration of the power supply system for degraded operation.
[0045] In a simplified manner, with reference to the, there is shown for the sake of clarity and conciseness a system for supplying a single electrical load L from a single power source S. At the, the supply system comprises a power device DP for converting and processing the electrical energy from the power source S to supply the electrical load L. A controllable protection member OPC is provided on the supply line connecting the power source S to the power device DP.
[0046] As illustrated in the, the power device DP comprises a plurality of power modules M. Preferably, each power module M is configured to perform at least one conversion function, for example, to process a three-phase current for an inverter of an electrical machine or to provide a distribution current to an electrical load L.
[0047] With reference to the, there is shown a power module M according to a first embodiment of the invention. The power module M comprises a plurality of power electronic components 2 mounted on a support substrate 1. In this example, the power electronic components 2 are in the form of electronic chips or semiconductors.
[0048] The power module M comprises at least one 3P power connector configured to receive power. It is for example configured to be connected to an electrical load L or to a power source S. The 3P power connector is accessible from the outside of the power module M.
[0049] The power module M comprises at least one 3D data connector configured to receive a PCONS control instruction (), for example, switching commands for switches or transistors. It is for example configured to be connected to a control computer (not shown). The 3D data connector is accessible from outside the power module M.
[0050] In this example, the power electronic components 2 and the 3P, 3D connectors are connected by electrical connections 4, in particular, electrical wires ("wire bonding") but it goes without saying that other types of connection could be suitable. With reference to the, among the electrical connections 4, a distinction is made, on the one hand, of 4P power electrical connections which allow high currents to flow, for example greater than 10A, and, on the other hand, of 4D data electrical connections which allow low currents to flow, for example less than 10A.
[0051] The power module 4 comprises an encapsulation layer 5, covering the plurality of power electronic components 2 in order to protect them. Preferably, the encapsulation layer 5 is made of a silicone-based dielectric gel, a thermosetting dielectric two-component silicone gel or a Parylene insulating layer. Such an encapsulation layer 5 is known to those skilled in the art. This encapsulation layer 5 advantageously ensures electrical insulation. The 3P, 3D connectors comprise at least one portion extending outside the encapsulation layer 5.
[0052] The invention is remarkable in that the power module M comprises at least one fusible protection layer 6 in which at least a portion 40 of an electrical connection 4 extends. In this example, several electrical connections 4 comprise a portion 40 in the fusible protection layer 6, in particular, a 4P electrical power connection connecting a power electronic component 2 to a 3P power connector, a 4P electrical power connection connecting the two power electronic components 2 and a 4D electrical data connection connected to the 3D data connector.
[0053] The fusible protection layer 6 is configured to change state when a current flows above an admissible threshold so as to definitively stop the flow of current in the portions 40 of electrical connection 4 located in the fusible protection layer 6.
[0054] As illustrated in schematically representing a power electrical connection 4, a portion 40 is located in the fusible protection layer 6. When a fault occurs inside or outside the power module DP, a current already present in the portion 40 of the electrical connection 4 will increase, until it exceeds an admissible threshold, preferably at least equal to twice the nominal current flowing through the portion 40 of the electrical connection 4 according to a nominal operating mode. In a few microseconds, the portion 40 of the electrical connection 4 will melt, will form a liquid bridge and will eventually separate, giving rise to an electric arc.
[0055] When the permissible threshold is exceeded, the current flowing in the portion 40 of the electrical connection 4 causes a change in state of the fusible protection layer 6 which becomes a cut-off layer 6', as illustrated in, which definitively stops the circulation in said portion 40. Currents of excessive values can no longer flow, which protects the integrity of the power electronic components 2.
[0056] This change of state will make it possible to absorb the energy released by the electrical connection 4. When the fusible protection layer 6 returns to its original state (solid state), it is transformed into a cut-off layer 6' which ensures the definitive interruption of the flow of current in the portion 40 of the electrical connection 4.
[0057] The power device DP in which the faulty power module M is used is then in a safe state, due to the stopping of the fault and the capacity of the fusible protection layer 6 (cut-off layer 6') to contain the voltage at the electrical connection 4.
[0058] The fusible protection layer 6 is preferably configured to change phase when it changes state, under the effect of the presence of a high heat density. Preferably, the fusible protection layer 6 is thermally and chemically stable and compatible with the encapsulation layer 5. Preferably, the fusible protection layer 6 is configured to provide electrical insulation so as to prevent the propagation of electrical currents from the power electronic components 2, even when the fusible protection layer 6 becomes a cut-off layer 6'. Preferably, the fusible protection layer 6 is hydrophobic and also allows fire resistance without the release of toxic fumes. Preferably, the fusible protection layer 6 comprises sand, preferably pure silica sand.
[0059] In this example, the fusible protection layer 6 is in direct contact with the encapsulation layer 5.
[0060] With reference to the, to ensure mechanical protection, the power module is mounted in a housing 7 which preferably comprises a sole 72 connected to the substrate 1 and a cover 71. Preferably, the connectors 3P, 3D extend projecting from the cover 71. In this example, the power module M comprises a heat sink 73 to improve the drainage of calories which is connected to the sole 72, in particular, via a thermal interface layer. According to one aspect of the invention, the encapsulation layer 15 and the housing 71 are made in a single element.
[0061] An example of implementation of a manufacturing method for a power module M will now be presented. The power electronic components 2 are positioned on the substrate 1, preferably of the SnAg type. Preferably, the substrate 1 has been previously screen-printed so as to form a redistribution layer for the electrical connectors and the power electronic components 2 are fixed on the substrate 1 by reflow.
[0062] In this example, the method comprises steps consisting of: Connecting at least one electrical connection 4 to a power electronic component 2, Depositing an encapsulation layer 5 on the power electronic component 2 so as to protect it, Stabilizing the encapsulation layer 5, for example, by a baking, polymerization or other operation, and Depositing a fusible protection layer 6 on at least a portion 40 of the power electrical connection 4.
[0063] According to one aspect, the method comprises a step of mounting a part of the housing 7 before the step of depositing the encapsulation layer 5. This makes it possible to use the volume of the first part of the housing to facilitate the deposition of the encapsulation layer 5. Preferably, the method comprises a step of mounting a second part of the housing 7 after the step of depositing the fusible protection layer 6.
[0064] Preferably, the encapsulation layer 5 is deposited before the fusible protection layer 6 in order to produce the power module M by depositing superimposed layers, which is practical.
[0065] An example implementation will be presented with reference to Figures 5 to 7. As illustrated in, the power module M is powered by the 3P power connector which provides power to two power electronic components 2 via 4P power electrical connections. In this example, a power electronic component 2 is also connected to a 3D data connector via a 4D data electrical connection.
[0066] When a short circuit occurs in the power system, the current increases rapidly, especially in the 4P power electrical connections as shown in.
[0067] Advantageously, the portion 40 of the power electrical connection 4 makes it possible to change the state of the fusible protection layer 6 which transforms into a cut-off layer 6'. In this state, the current flowing in the portion 40 of the power electrical connection 4 is permanently stopped as illustrated in. This advantageously makes it possible to protect the power electronic components 2 against high value currents. Advantageously, the fusible protection layer 6 makes it possible to absorb the energy of the electrical art to protect the power electronic components 2.
[0068] Preferably, when the fusible protection layer 6 changes state, the current is stopped in all of the portions 40, that is to say, even in those which have not caused a current to flow higher than the admissible threshold. This is particularly the case for the 4D control electrical connection in which no high current flows.
[0069] The power electronic components 2 are thus protected. An operator only needs to replace the fuse protection layer 6 and the electrical connections 4P, 4D to put the power module M back into service, which is advantageous.
[0070] Another embodiment is shown in FIG. 1. For the sake of clarity and brevity, only the differences with the first embodiment of FIG. 1 will be described. Common or similar elements bear the same references in FIG. 1 and will not be described again.
[0071] With reference to the, the power module M comprises a printed circuit board 8, called “PCB”, arranged between the encapsulation layer 5 and the fusible protection layer 6. Advantageously, this allows the electrical connections to facilitate return to service by creating a boundary between the encapsulation layer 5 and the fusible protection layer 6. In addition, this allows for great freedom in choosing the materials for the encapsulation layer 5 and the fusible protection layer 6 since they are not in direct contact. This also makes return to service easier.
[0072] In this example, the power module M comprises several remote members 9, housed in the encapsulation layer 5, which are connected on the one hand to an electronic power component 2 and on the other hand, to the printed circuit board 8. The electrical power connection 4 is connected only to the printed circuit board 8 and extends into the fusible protection layer 6, in particular, only in the latter.
[0073] Thus, following the occurrence of an electric arc, the power electrical connections 4 can be removed conveniently with the fusible protection layer 6. When returning to service, it is sufficient to recreate the power electrical connections 4 and deposit a new fusible protection layer 6. The encapsulation layer 5, the power electronic components 2 and the remote members 9 are advantageously not affected. Preferably, the power electrical connections 4 are pre-wired on the printed circuit board 8, which facilitates assembly and return to service.
[0074] Preferably, each offset member 9 is in the form of a vertical pillar mounted on the substrate 1. Preferably, each offset member 9 is connected to a power electronic component 2 via an internal electrical connection 4a which preferably extends only in the encapsulation layer 5 as illustrated in.
[0075] In this example, with reference to the, the 3P power connector comprises: an internal part 31P, housed in the encapsulation layer 5, which is mounted on the one hand on the substrate 1 and connected on the other hand to the printed circuit board 8, an external part 32P, housed partly in the fusible protection layer 6 and an external link 33P electrically connecting the external part 32P to the internal part 31P via the printed circuit board 8.
[0076] Similarly, the external connection 33P extends only in the fusible protection layer 6. The fusible protection layer 6 is configured to change state when a current, greater than an admissible threshold, flows in the external connection 33P so as to permanently stop the flow of current in the external connection 33P. Thus, advantageously, the fusible protection layer 6 can change state when an electric arc occurs in the 3P power connector.
[0077] An example of implementation of a manufacturing method for a power module M will now be presented. The power electronic components 2 are positioned on the substrate 1. Preferably, the substrate 1 has been previously screen-printed so as to form a redistribution layer of the electrical connectors and the power electronic components 2 are fixed on the substrate 1 by reflow with the offset members 9 and the internal electrical connections 4a. Preferably, the internal part 31P of the power connector 3P is also positioned on the substrate 1.
[0078] The method comprises a step of depositing an encapsulation layer on the elements positioned on the substrate 1 in order to protect them and form a first assembly.
[0079] Next, the method comprises a step of assembling the printed circuit board 8 onto the first assembly. The electrical connections 4, the external link 33P and the external part 32P of the 3P power connector are preferably pre-wired. The assembly can be carried out by soldering but also, preferably, by a press-fit operation. Compatible offset members 9 are chosen in the case of press-fit assembly. After assembly, the method comprises a step of depositing the fusible protection layer 6. Such a manufacturing method makes it possible to offer great flexibility in the choice of the material of the encapsulation layer 5 and the fusible protection layer 6 given that they are not in direct contact.
[0080] Thanks to the invention, a current cut-off is carried out locally in a power module M for lower cut-off currents than in the prior art. This makes it possible to protect the power electronic components 2 and facilitates restarting. The power of an electric arc is absorbed locally by the fusible protection layer 6. This makes it possible to limit material projections and the spread of damage.
Claims
Power module (M) for supplying at least one electrical load (L) of an aircraft, the power module (M) comprising a plurality of electronic power components (2) mounted on a support substrate (1), at least one encapsulation layer (5) for the plurality of electronic power components (2) in order to protect them, at least one electrical power connection (4) connected to at least one electronic power component (2), power module (M) characterized in that it comprises at least one fusible protection layer (6), several electrical power connections (4) comprise at least one portion (40) in the fusible protection layer (6), the fusible protection layer (6) being configured to change state when a current flows, greater than an admissible threshold,in the portion (40) of the electrical power connection (4) so as to permanently stop the flow of current in said portion (40)., Power module (M) according to claim 1, wherein the electrical power connection (4) is connected between two electronic power components (2). Power module (M) according to one of claims 1 to 2, in which the electrical power connection (4) is connected between at least one electronic power component (2) and at least one electrical power connector (3P) comprising at least one portion extending outside the encapsulation layer (5). Power module (M) according to one of claims 1 to 3, comprising at least one remote connector (9) connecting the electronic power component (2) to the electrical power connection (4), the electrical power connection (4) extending only in the fusible protection layer (6). Power module (M) according to claim 4, comprising at least one printed circuit board (8) mounted at the interface between the encapsulation layer and the fusible protection layer (6), the remote connector (9) being connected to the electrical power connection (4) via the printed circuit board (8). Power module (M) according to one of claims 1 to 5, comprising at least one electrical data connection (4D) connected to a data connector (3D), the electrical data connection (4D) comprising at least one portion (40) extending into the fusible protection layer (6). Power module (M) according to one of claims 1 to 6, the electrical power connection (4) of which is in the form of a longitudinal wire which comprises several parts (41, 42) having different sections. Power supply system for an aircraft electrical network (REA) comprising at least one power device (DP) comprising at least one power module (M) according to one of claims 1 to 7. A method of manufacturing a power module (M) for supplying at least one electrical load (L) of an aircraft, the power module (M) comprising a plurality of power electronic components (2) mounted on a support substrate (1), the method comprising steps consisting of: Connecting at least one electrical power connection (4) to a power electronic component (2), Depositing an encapsulation layer (5) on the power electronic component (2) so as to protect it, and Depositing a fusible protection layer (6) on at least one portion (40) of the power electrical connection (4), the fusible protection layer (6) being configured to change state when a current, greater than an admissible threshold, flows in the portion (40) of the power electrical connection (4) so as to permanently stop the flow of current in said portion (40).