Mounting system for modularly constructed, electronically controllable sound transducer systems

Abstract

The invention relates to a mounting system for modularly constructed, electronically controllable sound transducer systems, characterised by at least one mounting frame (100), in particular a plurality of mounting frames (100), and at least one module insert (200), in particular a plurality of module inserts (200), wherein the at least one mounting frame (100) can be mounted in a fixed location and the at least one module insert (200) with the electronic components and the sound transducers (201) can be arranged, in particular inserted from the front, in the at least one mounting frame (100).

Description

[0001] Mounting system for modular, electronically controllable sound transducer systems

[0002] According to the Huygens principle, directed sound wavefronts can be composed of elementary waves from a multitude of individual transducers. The orientation of the sound wavefront can be determined by mechanically offsetting the individual transducers from each other and / or by electronically delaying the control.

[0003] Mechanical solutions for directional sound radiation have been widespread for many years in the form of curved line arrays suspended directly above the stage at events. Electronic solutions for directional sound radiation using straight line arrays have also been on the market for more than a decade. Mathematical processes are used to control the time and amplitude of each individual transducer so that the desired directivity of the emitted wavefront is achieved through the superposition of the elementary waves of the individual transducers in the elevation plane. However, the control options for such loudspeaker lines are limited to this elevation plane. In the azimuth plane, the radiation characteristics of the array continue to be determined by the orientation of the individual transducer units.

[0004] Two-dimensional, electronically controllable sound transducer surfaces have also been available for several years. From their front surface, sound wavefronts can be precisely directed toward the audience area in both the azimuth and elevation planes. This largely prevents unwanted reflections that mask the signal content, even in acoustically very unfavorable environments. The sound transducer systems, especially the sound transducer surfaces, can be used for beamforming the wavefront, or they can be used to generate multiple directed wavefronts simultaneously, even with different signal content, based on the principle of wave field synthesis.

[0005] However, the assembly of such loudspeaker arrays generally proves difficult. Precise alignment of the wavefronts down to the fundamental frequency range is only possible with transducer arrays that are larger than the wavelength of the emitted audio signal. Such large arrays, with diagonals of several meters, are difficult to transport. They are therefore generally assembled from modules, as described in WO 2015 036508 A1.

[0006] In practice, the installation of such modules is challenging. They are designed as active modules because each transducer requires its own amplifier. With separate amplifier units, the cabling effort becomes too extensive, so the power amplifiers are integrated into the modules. These active modules are relatively heavy, requiring stable mounting systems. Furthermore, the mechanical precision requirements of the transducer surface are very high. The position of each individual transducer in the room must be known to the millimeter to ensure precise alignment of the wavefront up to the high frequency range.

[0007] In very high-quality permanent installations, such two-dimensional sound transducer surfaces are also used in rooms with difficult acoustic control. Because the wave front can be electronically aligned in both spatial axes, even at an angle to the audience area, a suitable, stable wall surface is often available for mounting. However, the modules cannot currently be mounted directly to the wall because sufficient space must be left between them and the mounting wall for the cabling. Because the modules are only wired after they have been mechanically mounted, this space must be large enough to allow access. Ventilation at the rear of the active amplifiers must also be ensured. Furthermore, direct mounting is not permitted for servicing reasons. In the event of any defect, all modules up to the affected unit would have to be dismantled and then rewired.Therefore, it has been common practice to build a stable frame to which the individual modules are attached, even when direct mounting on a wall would be more advantageous.

[0008] The object of the invention is therefore to describe a device for mounting a modular sound transducer system which can be mounted on a frame or directly on a flat wall, whereby all electronic components of each individual module must remain accessible and replaceable even after complete assembly, without the need to dismantle further modules.

[0009] This problem is solved by the subject matter of claim 1.

[0010] The mounting system is designed for modular, electronically controllable sound transducer systems, particularly sound transducer surfaces. The mounting system comprises at least one module frame, into each of which at least one module insert can be arranged. In many cases, a plurality of mounting frames will be used, each of which can accommodate multiple module inserts.

[0011] The at least one mounting frame is arranged at a fixed location, e.g. a rack, on a flat surface or a wall, and can be aligned and wired there.

[0012] The at least one module insert with electronic components and the sound transducers can be arranged in the at least one mounting frame, in particular inserted from the front.

[0013] This allows all mounting frames to be mounted in a first step, so that even after the complete modular two-dimensional, electronically controllable sound transducer surface has been mounted, all electronic components of each individual module are accessible and replaceable, e.g. by dismantling the module inserts from the front, without having to dismantle further modules.

[0014] In one embodiment, a plurality of module frames can be mechanically interconnected to form a planar module arrangement, a vertical column arrangement, or a horizontal column arrangement. The module frames have sufficient mechanical stability for this purpose.

[0015] Furthermore, it is possible for each mounting frame to be coupled to a terminal device or for each mounting frame to have a terminal device, with supply and / or signal lines being connectable to the terminal device, e.g., via connectors. In particular, it is possible for the terminal device to also have elements for signal selection corresponding to the position of the mounting frame within the mounting frames connected to form an array. This means that the sound transducers of each mounting frame can be controlled separately, e.g., by the signal selection elements separating the channels assigned to the position of the respective module slot in the array from a serial signal for controlling the individual sound transducers.

[0016] Since the fixed locations where the mounting system is mounted are often not completely level, at least one adjusting element, in particular an adjusting screw, can be used to compensate for this.

[0017] In one embodiment, it is further possible to connect sheets welded into the at least one mounting frame to a bleaching part bent out of a flat steel sheet of the at least one mounting frame.

[0018] For secure positioning of the at least one module insert in the mounting frame, it is useful if the insertion depth of the at least one module insert is limited by at least one guide element. Additionally or alternatively, at least one centering element can also serve this purpose, which in particular also functions as a guide element. The at least one centering element ensures the centering of the at least one module insert, so that the module insert arranged (e.g., inserted) with a small gap to the at least one mounting frame can be positioned at a defined position in the mounting frame.

[0019] In one embodiment, amplifier devices are integrated into at least one module insert or all module inserts, each of which is combined with the associated sound transducers to form a detachable unit. At least one amplifier device is thermally coupled to at least one heat sink, wherein the at least one heat sink is arranged on the rear side of the mounting frame. In particular, the at least one amplifier device can also be connected to the terminal via an electrical connection, in particular a contact in the region of a connecting element, for example, a printed circuit board, as soon as the module insert is inserted into the mounting frame.

[0020] A central fastening screw, which can be covered, in particular, by a removable cap, can also engage an internal thread of a connecting piece on at least one mounting frame, thus mechanically connecting the mounting frame and the respective module insert. This facilitates repair work.

[0021] It is also possible for several mounting frames to be grouped together as pre-assembled clusters.

[0022] Embodiments are explained by way of example in connection with the illustrations.

[0023] Fig. 1 shows an embodiment of a mounting frame;

[0024] Fig. 2 shows an embodiment of a module insert;

[0025] Fig. 3 a group of nine mounting frames (100)

[0026] Fig. 4 the insertion of a module insert 200 into a mounting frame (100).

[0027] Fig. 5 Exploded view of components of an embodiment of the mounting system.

[0028] Embodiments for solving the problem are described below by way of example. The mounting system comprises mounting frames 100 and module inserts 200. During assembly, in a first step, all mounting frames 100 are mounted at a fixed location (e.g., a wall), aligned, and wired. Then, the module inserts 200, containing electronic components such as amplifier devices and the sound transducers 201, are inserted frontally into the mounting frames 100 and secured. In principle, other mounting methods are also possible, such as inserting the module inserts 200 from above or below, or suspending the module inserts 200.

[0029] In this way, even after the complete module wall has been installed, the electronic components of the individual module inserts 200 are accessible and can be replaced from the front without having to dismantle further module inserts 200.

[0030] In a first step, the assembly frames 100 are assembled to the desired size and attached, for example, to a wall. Alternatively, a mounting frame can be used for mounting, from which the module frames 100 are suspended or secured in some other way. The module frames 100 are mechanically connected vertically and horizontally during assembly. Their mechanical stability also allows multiple rows to be suspended one above the other. Wall mounting is also possible. A single vertical column or a horizontal row can also be constructed from a row of modules.

[0031] A terminal device 106 can be installed in each mounting frame 100, to which all the cabling can be connected from the open front of the mounting frame 100 before the module inserts 200 are inserted.

[0032] The rear of the mounting frames 100 is designed in such a way that sufficiently large openings remain on the rear side through which the corresponding cable connections 107 with their connectors can be inserted, even when the mounting frames 100 have already been attached to a wall. Furthermore, the rear openings of the mounting frames 100 ensure sufficient air circulation. Towards the front, a connector or suitable piston contacts on the terminal device 106 provide the subsequent electrical connection to the module inserts 200. The power supply unit 110 for supplying the module insert 200 can optionally be mounted in the module frame 100, or a central power supply can be provided via the cable connections 107.

[0033] After the module frames have been aligned and wired, the active module inserts 200 are inserted into the mounting frames 100 from the front. Their outer dimensions are smaller than the inner dimensions of the front part of the mounting frames 100 by a small gap width. A small gap width can be in the range of 1 mm. They are fixed in position, for example, by guide pins 111 or screw connections in the mounting frames 100. The screw connections can be covered by a front grille 204, which in turn has the outer dimensions of the mounting frames 100 minus the gap widths. It can be screwed to the module or magnetically attached to it. An exemplary embodiment of the invention is shown schematically in Figures 1 to 5. Other embodiments are possible.

[0034] Fig. 1 shows an example of a mounting frame 100. It is largely open at the rear. In the example solution, it is made of thicker sheet steel, so that its stability is sufficient to screw and suspend even larger mounting units consisting of module frames (100) and module inserts via connections in the outer surfaces of the module frames (100), which lie approximately in the plane of the center of gravity of the complete modules. Threaded nuts or other connecting pieces 112 are welded in on the right and top for this purpose; the mounting frames are then screwed or connected to one another through the holes 102 on the left and bottom.

[0035] Another mounting option is to screw the mounting frame 100 directly onto a flat wall through holes 103. Additional internal threads 104 allow unevenness in the wall to be compensated for with an adjusting screw. The rear wall of the mounting frame 100 can be made of sheet metal, with sections of the sheet metal being cut (e.g., with a laser) and bent over. The bent sections are then, for example, perpendicular to the rear wall and can be used to accommodate components inside the mounting frame. In this area, connecting pieces 105, for example, hold the housing bent from the developed shape (e.g., the rear wall) together. The mounting frame 100 can, however, also be assembled from individual sections. The bent sheets can then be used as holding points for welded-in sheets.

[0036] A terminal device 106 is mounted in each mounting frame 100, which accommodates all cable connections 107. Openings 108 in the rear area of ​​the mounting frames are sufficiently large to pass through the cables with wired connectors. The cabling can also be configured using Power over Ethernet (POE) in the well-known network technology, optionally as a redundant network. All voltages and signals are forwarded from there to the module inserts 200 via piston contacts 109 or other connectors.

[0037] If the module inserts 200 are not supplied with operating voltage via a Power Over Ethernet connection, a power supply 110 is provided in the mounting frame 100. Alternatively, a central power supply that supplies all terminals 106 via cable connections 107 can be provided.

[0038] After assembling, connecting, and aligning all mounting frames 100 to form an array 300 of connected mounting frames 100, the entire unit is wired 107 from the front. The insertion depth of the module units 200 is limited by spacers 111. They also center the inserted modules in the rear area because a small gap must remain between the module frame and the module insert so that the module inserts 200 can be easily inserted into the mounting frames 100.

[0039] Fig. 2 shows such a module insert 200. The sound transducers 201, usually dynamic loudspeakers, are integrated into the front. Acoustically, the individual sound transducers 201 should be separated by individual chambers 202 because their signals for beamforming or wave field synthesis applications are controlled separately in time and amplitude. The respective integrated amplifiers with a rear heat sink and connector 202 can be mounted on a contacting unit, for example, a printed circuit board, at the rear of the chambers. They are connected to the terminal 106 via a contacting unit, for example, a printed circuit board with connectors, via the piston contacts or connectors 109 as soon as the module insert 200 is inserted into the mounting frame 100. After removing the front grille 203, individual loudspeaker units 202, together with their amplifier and heat sink, can be easily replaced.

[0040] The units, consisting of the 202 loudspeaker, integrated rear amplifier, heat sink, and connectors, can also contain separate components for the low-midrange and high-frequency ranges via crossovers. For the high-frequency range, multiple transducers can be installed in each unit. These high-frequency transducers can also be driven with discrete signals if the appropriate number of separate amplifiers is installed in the mounting units.

[0041] Electronic components can be integrated into the contact unit, which provide the individual channels for controlling the individual sound transducers from a serial signal. The position of the individual sound transducers within the module insert 100 is determined by the mechanical structure. However, the position of the module inserts 200 within the mounting frames 200 connected to the array 300 must be defined. One possibility for this is to provide corresponding switches or other setting options on the terminal device 106, which make a corresponding signal selection for the respective position within the mounting frames 300 connected to the array.

[0042] The transducer diaphragms are protected by a front grille 203. It has the same external dimensions as the mounting frame and is connected to the module magnetically or with fastening screws. For magnetic mounting, additional front screwing is required for safety reasons, or the front grille must be additionally held by a central fastening screw 204.

[0043] Once the module insert 200 is inserted into its mounting frame 100, the fastening screws are no longer accessible. In the example application, a central fastening screw 204 is therefore provided (see Fig. 4). It is accessible from the front behind a removable cap 205 and engages the internal thread for the central fastening of the module insert 101 to the mounting frame 100.

[0044] Fig. 3 shows a group of nine mounting frames 100, which are mounted on a wall via holes 103 or suspended from a traverse using threaded nuts 112. The maximum size of the module group is determined by the stability of the mounting frames 100 and the weight of the module inserts 200. Before the module inserts 200 are inserted frontally, the alignment of the flat surface must be checked and adjusted if necessary. In particular, if the module arrangement is used to superpose elementary waves according to the principle of wave field synthesis, alignment accurate to the millimeter is necessary, because otherwise frequency response drops in the overtone range will occur. Only after the cable connections 107 have been fully installed are the module inserts 200 inserted frontally and fixed into the module frame 100.

[0045] It is also possible to combine multiple 100 mounting frames into pre-assembled clusters. This simplifies the assembly process and alignment on site because only the clusters need to be precisely aligned, not each individual mounting frame.

[0046] Fig. 4 shows the insertion of a module insert 200 into a mounting frame 100. In the exemplary embodiment, the module insert 200 is screwed into place using only a stable, central fastening screw 204 with the thread for the central fastening of the module insert 200. The front grille 203 is connected to the module insert 200, preferably by screwing on the side edges. The removable cap 205 is not yet placed on the screw head, so that the module is pulled into the guide pieces and spacers 111 with the central fastening screw until it stops. This precisely fixes the position of the module insert 200 in the previously aligned mounting frame 100. The module insert 200 is supplied with all supply voltages and all signals for controlling the amplifiers via the piston contacts or connectors 109.The levels and delay times for controlling the individual amplifiers are provided by an external processor unit.

[0047] Fig. 5 shows an exploded view of components in one embodiment of the assembly system. In Figure 5, the components of the electrical connection between the modules are shown in darker color. Piston contacts 109 connect during assembly of the modules via a through-hole printed circuit board 206 in the module insert 200. If necessary, electronic components can also be mounted on this printed circuit board 206, which separate the signals from a data bus, which are then fed to the individual amplifiers in the loudspeaker housings 202. The illustration also shows that the assembly units consisting of the loudspeaker housing, amplifier, and heat sink can be individually replaced from the front after removing the front grille 203 in the module frame 200. Other connectors are also possible instead of the piston contacts.

[0048] List of reference symbols

[0049] 100 mounting frames

[0050] 101 thread for the central fastening of the module insert

[0051] 102 holes for mechanical connection of the mounting frames

[0052] 103 holes for screwing to a flat wall

[0053] 104 Adjusting element, internal thread with adjusting screw to compensate for unevenness

[0054] 105 Connection of sheet metal parts bent from the development

[0055] 106 Terminal device

[0056] 107 cable connections

[0057] 108 openings in the rear area of ​​the mounting frames

[0058] 109 piston contacts or connectors

[0059] 110 power supply in mounting frame

[0060] 111 Guide pieces and spacers

[0061] 112 connecting pieces on the mounting frame

[0062] 200 module insert

[0063] 201 transducers

[0064] 202 Integrated amplifiers with rear heatsink and connector

[0065] 203 Front grille

[0066] 204 Central fastening screw

[0067] 205 Removable cap

[0068] 206 printed circuit board, circuit board

[0069] 300 Mounting frames connected to the array

[0070] 301 Vertical Connections

[0071] 302 Horizontal Connections

Claims

Patent claims 1. Mounting system for modular, electronically controllable sound transducer systems, characterized by at least one mounting frame (100), in particular a plurality of mounting frames (100), and at least one module insert (200), in particular a plurality of module inserts (200), wherein the at least one mounting frame (100) can be mounted at a fixed location and the at least one module insert (200) with the electronic components and the sound transducers (201) can be arranged in the at least one mounting frame (100), in particular can be inserted frontally.

2. Mounting system according to claim 1, characterized in that a plurality of module frames (100) can be mechanically connected to one another to form a flat module arrangement, a vertical column arrangement or a horizontal column arrangement.

3. Mounting system according to claim 1 or 2, characterized in that each mounting frame (100) is coupled to a terminal device (106) or each mounting frame (100) has a terminal device (106), wherein supply and / or signal lines can be connected to the terminal device (106).

4. Mounting system according to claim 3, characterized in that the terminal device (106) also has elements for signal selection corresponding to the position of the mounting frame (100) within the mounting frames (100) connected to form an array (300), wherein the elements for signal selection separate from a serial signal the channels assigned to the position of the respective module insert (200) in the array (300) for controlling the individual sound transducers (201).

5. Mounting system according to at least one of the preceding claims, characterized in that a sufficiently large distance is provided between the at least one mounting frame (100) and the fixed location, e.g. a wall, so that cables with their connectors can be arranged, even if the mounting frames (100) are already arranged at the fixed location, wherein in particular in the vertical direction sufficient space remains between the mounting frame (100) and the mounting wall in order to ensure the cooling of the components installed in the module insert (200), in particular amplifiers.

6. Mounting system according to at least one of the preceding claims, characterized in that unevenness at the fixed location, in particular on a mounting wall, can be compensated with at least one adjusting element (104), in particular an adjusting screw.

7. Mounting system according to at least one of the preceding claims, characterized in that welded sheets in the at least one mounting frame (100) serve for connection to sheet metal parts (105) bent from a flat steel sheet of the at least one mounting frame (100).

8. Mounting system according to at least one of the preceding claims, characterized in that an insertion depth of the at least one module insert (200) is limited by at least one guide element (111).

9. Mounting system according to at least one of the preceding claims, characterized by at least one centering element, which in particular also has the function of a guide element, wherein the at least one centering element ensures the centering of the at least one module insert (200) so that the module insert (200) arranged with a small gap to the mounting frame (100) can be positioned at a defined position in the mounting frame (100).

10. Mounting system according to at least one of the preceding claims, characterized in that amplifier devices are integrated in at least one module insert (200) or all module inserts (200), which are each combined with the associated sound transducers (201) to form a detachable unit.

11. Mounting system according to claim 10, characterized in that at least one amplifier device is thermally coupled to at least one heat sink (202), wherein the at least one heat sink (202) is arranged on the rear side of the mounting frame (100).

12. Mounting system according to claim 10 or 11, characterized in that the at least one amplifier device is connected to the terminal (106) via an electrical connection, in particular a contact in the area (203) of a connecting element, for example a printed circuit board, as soon as the module insert (200) is inserted into the mounting frame (100).

13. Mounting system according to at least one of the preceding claims, characterized in that a central fastening screw (204), which can in particular be covered by a removable cap (205), engages in an internal thread of a connecting piece (112) on at least one mounting frame (100) and thus the mounting frame (100) and the respective module insert (200) are mechanically connected.

14. Mounting system according to at least one of the preceding claims, characterized in that several mounting frames are combined as pre-assembled clusters.

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