Infrared micro-led for taillight

Abstract

A Micro-LED-based vehicle taillight. Micro-LEDs may be arranged in a panel with density to create the same or similar intensity light as existing taillight designs or to conform with legal requirements. These Micro-LED taillights may allow for cheaper, more energy efficient, smaller, and / or more customizable taillights. The taillight contains Infrared Micro-LEDs, which can generate heat and aid in the de-icing or de-frosting taillights.

Description

INFRARED MlCRO-LED FOR TAILLIGHTBACKGROUND AND FIELD OF THE DISCLOSURE[1] The present disclosure is generally related to Micro-LEDs and their use in automotive applications.[2] Due to the required brightness of vehicle taillights, they often take up a large volume of the front of a vehicle.[3] Taillights can be costly, especially on larger vehicles or vehicles with computerized taillight control.[4] In cold and / or snowy weather, taillights can become iced or frosted, reducing their visibility which increases the risk of the following driver, causing colliding with the vehicle.[5] De-icing and de-frosting systems exist, but they can be cumbersome, costly, and difficult to install if the vehicle does not already have them built in.SUMMARY[6] The present inventions relates to a method to use Micro-LED and infrared radiation to operate vehicle taillight, the method comprising, having a Micro-LED panel comprising of a plurality of Micro-LED s, at least one of which is capable of emitting infrared radiation, having a substrate to which a Micro-LED tile is bound, and having a connector that allows the electronics of the Micro LED panel to integrate with a vehicle, wherein the Micro-LED panel performs a function of a vehicle taillight, and wherein further the Micro-LEDs capable of emitting infrared radiation are used to heat the taillight.DESCRIPTIONS OF THE DRAWINGS[7] FIG. 1 : Illustrates an integration of a transferred microdevice with an electro-optical thin film device in a hybrid structure, according to an embodiment.[8] FIG. 2: Illustrates a Micro-LED section for a taillight with infrared (IR) Micro-LEDs, according to an embodiment.[9] FIG. 3 : Illustrates a flat Micro-LED panel for a taillight with IR Micro-LEDs, according to an embodiment.

[0010] FIG. 4: Illustrates three sections of the same taillight, or three taillights, with Micro-LED panels, according to an embodiment.

[0011] FIG. 5: Illustrates a Micro-LED section for a taillight with infrared (IR) Micro-LEDs, according to an embodiment.DETAILED DESCRIPTION

[0012] Embodiments of the present disclosure will be described more fully hereinafter with reference to the accompanying drawings in which like numerals represent like elements throughout the several figures, and in which example embodiments are shown. Embodiments of the claims may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. The examples set forth herein are non-limiting examples and are merely examples among other possible examples.

[0013] FIG. 1A shows an example of integrating a transferred microdevice 106 with an electro- optical thin film device 112 in a hybrid structure. This is an example of an integrated Micro-LED tile that is later picked and placed into an array of tiles. It should be obvious to those in the art there are many ways to create Micro-LED tiles and integrate them in an array of tiles, as per US20160218143A1 - Microdevice integration into system substrate. A receiver substrate 102 and contact pads 104 upon which the microdevice 106 arrays are transferred and into which the thin film electro-optical device is integrated in a number of hybrid structure embodiments. Microdevice 106 may be transferred and bonded to the bonding pad 104 of the receiver substrate 100. In one case, a dielectric layer 108 is formed over the substrate 102 to cover the exposed electrodes and conductive layers. Lithography and etching may be used to pattern the dielectric layer 108. Conductive layer 110 is then deposited and patterned to form the bottom electrode of the thin film electro-optical device 112. If there is no risk of unwanted coupling between bottom electrode 110 and other conductive layers in the receiver substrate, the dielectric layer 108 may be eliminated. However, this dielectric layer can also act as a planarization layer to offer better fabrication of electro-optical devices 112. A bank layer 114 is deposited on the substrate 102 to cover the edgesof the electrode 110 and the microdevice 106. Thin film electro-optical device 112 is then formed over this structure. Organic LED (OLED) devices are an example of a thin film electro-optical device that may be formed using different techniques, including but not limited to shadow mask, lithography, and printing patterning. Finally, the top electrode 118 of the electro-optical thin film device 112 is deposited and patterned if needed. In an embodiment where the microdevices' 106 thickness is significantly high, cracks or other structural problems may occur within the bottom electrode 110. In these embodiments, a planarization layer may be used in conjunction with or without the dielectric layer 108 to address this issue. In another embodiment, the microdevice 106 can have a device electrode 116. This electrode can be common between other microdevices 106 in the system substrate. In this case, the planarization layer (if present) and / or bank structure 114 covers the electrode 116 to avoid any shorts between the electro-optical device 112 and device electrode 116.

[0014] FIG. IB illustrates structures where the device is shared between a few pixels (or subpixels) after post-processing to deposit a common electrode and color conversion layers. Here the microdevice 106 is not fully patterned, but the horizontal condition is engineered so that the contacts 104 define the area allocated to each pixel. The system substrate 102 with contact pads 104 and a donor substrate with microdevices 106. After the microdevices 106 are transferred to system substrate 102, one can do post-processing, such as depositing common electrode 120, color conversion layers 122, color filters, and so on. However, the methods described in this disclosure and other possible methods can be used. It is possible to add the color conversion layers as described into pixel (or sub-pixel) active areas after forming the active area. This can offer a higher fill factor and higher performance and avoid color leaking from the side pixel (or sub-pixel) if theactive area of the pixel (or sub-pixel) is covered by reflective layers. The microdevices 106 are grown on a buffer / sacrificial layer in another embodiment.

[0015] FIG. 2A displays a Micro-LED section for a taillight with infrared (IR) Micro-LEDs. FIG. 2B is a cross-section of the Micro-LED section of FIG. 2A across the line A-A'. FIG. 2C displays a Micro-LED panel for a taillight. FIG. 2D displays a housing for the Micro-LED Panel of FIG. 2C. Element 202 may be a Micro-LED section which may be comprised of one or more tiles that contain multiple Micro-LEDs. This may be a portion of the Micro-LED panel of FIG. 2C. The Micro-LED section may contain Micro-LEDs capable of generating IR light. IR light may be between the wavelengths of 750 nm to 1 mm. The IR light is used to generate heat within or near the taillight. IR Micro-LEDs may be mixed with non-IR Micro-LEDs, separated into IR Micro- LED tiles, or may be a setting that all Micro-LEDs can be tuned to. Element 204 may be a substrate to which the Micro-LED tiles may be bound. The substrate may be silicon, glass, sapphire, any other substrate known in the art, any material to which Micro-LED tiles can be bound, or any combination of these materials. The substrate may further house or be bound to electronics which connect to the Micro-LEDs. These electronics may be contained within the substrate, tunnel through the substrate to reach the Micro-LEDs, or use the substrate as part of the circuit. Element 206 may be a Micro-LED tile comprised of multiple Micro-LEDs. Element 208 may be an IR Micro-LED tile comprised of multiple Micro-LEDs. A portion or all of these Micro-LEDs may be capable of emitting IR light. Element 210 may be a protective layer. The protective layer may protect from environmental and / or vibrational damage. The protective layer may be made of glass, epoxy, plastic, metal, other protective materials, or any combination of protective materials. The protective layer may be hermetically sealed. Element 212 may be a tile panel that may attach or adhere to the Micro-LED panel of the vehicle. Element 214 may be a Micro-LED panel which maybe comprised of one or more tiles that contain multiple Micro-LEDs. Multiple small Micro-LED tiles can be integrated together into a larger flat plate. The panel may contain Micro-LEDs in the density to create the same light as the existing taillights. The panel may use IR Micro-LEDs, RGB Micro-LEDs, and / or Blue Micro-LEDs with Phosphorus to get white light. Element 216 may be a substrate to which the Micro-LED tiles may be bound. The substrate may be silicon, glass, sapphire, any other substrate known in the art, any material to which Micro-LED tiles can be bound, or any combination of these materials. The substrate may further house or be bound to electronics which connect to the Micro-LEDs. These electronics may be contained within the substrate, tunnel through the substrate to reach the Micro-LEDs, or use the substrate as part of the circuit. Element 218 may be a Micro-LED tile comprised of multiple Micro-LEDs. Element 220 may be a connector which allows the electronics of the Micro-LED panel of FIG. 2C to connect to the electronics system of the vehicle. This may allow the Micro-LED panel to be powered and controlled by the vehicle and to give feedback information to the vehicle. Element 220 may be a structure that houses the Micro-LED panel of FIG. 2C. This structure may conform to the shape of taillights in existing or upcoming car models, so they could be interchanged with non-Micro-LED taillights. Element 222 may be a window that allows the light from the Micro-LEDs through. The window may comprise glass, plastic, crystal, transparent or semi-transparent material, or any combination of these materials. The window may contain lenses or patterns which may diffuse, focus, polarize, block, redirect, or otherwise interact with the light coming from the Micro-LEDs. Element 224 may be the Micro-LED panel of FIG. 2C. Element 226 may be a stand or base which holds the Micro-LED Panel in place with respect to the vehicle. The stand or base may also ensure that the electronic connection between the Micro-LED panel and the vehicle is not broken. Infrared Micro- LEDs could be used to enhance improvements against ice in vehicles. Because they emit heat, theycould be used to melt ice on the taillights of a vehicle. This would help to improve visibility and safety during ice and snow events.

[0016] FIG. 3A displays a flat Micro-LED panel for a taillight with IR Micro-LEDs. FIG. 3B displays components of a system that automatically activates the IR Micro-LEDs in the presence of ice on the taillight. Element 310 may be a Micro-LED panel which may be comprised of one or more tiles that contain multiple Micro-LEDs. Multiple small Micro-LED tiles can be integrated together into a larger flat plate. The Micro-LED panel may contain Micro-LEDs capable of generating IR light. IR light may be between the wavelengths of 750 nm to 1 mm. The IR light is used to generate heat within or near the taillight. IR Micro-LEDs may be mixed with non-IR Micro- LEDs, separated into IR Micro-LED tiles, or may be a setting that all Micro-LEDs can be tuned to. Element 312 may be a substrate to which the Micro-LED tiles may be bound. The substrate may be silicon, glass, sapphire, any other substrate known in the art, any material to which Micro-LED tiles can be bound, or any combination of these materials. The substrate may further house or be bound to electronics which connect to the Micro-LEDs. These electronics may be contained within the substrate, tunnel through the substrate to reach the Micro-LEDs, or use the substrate as part of the circuit. Element 314 may be a Micro-LED tile comprised of multiple Micro-LEDs. Element 316 may be a connector which allows the electronics of the Micro-LED panel of FIG. 3 A to connect to the electronics system of the vehicle. This may allow the Micro-LED panel to be powered and controlled by the vehicle and to give feedback information to the vehicle. Element 318 may be a memory unit that stores data. Data stored in the memory unit may include data from sensors and any memory required to run the ice module. Element 320 may be the Micro-LED panel of FIG 3 A. Element 324 may be an ice module that activates the IR Micro-LEDs in the presence of ice. Element 326 may be a processor that runs the ice module. Element 328 may be a bus controllerwhich handles communication between the processor, memory, sensors, and Micro-LED panel. Element 330 may be an ice detector. The ice detector may be used to identify the presence of icing conditions. Ice detection may be performed using direct and indirect methods. Direct methods may include identifying the presence of atmospheric icing conditions, such as the presence of supercooled water droplets. Indirect methods may include detecting ice accretions on a surface or changes in vehicle performance behavior, thereby inferring the presence of icing conditions. Infrared Micro-LEDs could be used to enhance improvements against ice in vehicles. Because they emit heat, they could be used to melt ice on the taillights of a vehicle. This would help to improve visibility and safety during ice and snow events.

[0017] FIG. 4A displays three sections of the same taillight, or three taillights, with Micro-LED panels. FIG. 4B displays components of a system that automatically activates the IR Micro-LEDs in the presence of ice on the taillight. Element 401 may be three separate sections of a taillight. Each section may serve a different purpose. For example, one section may be for brake lights, another for turn signal lights, and another for night lights. Element 402 may be the first section of the taillight, which may be the brake lights. Element 404 may be the second section of a taillight, which may turn signal lights. Element 406 may be the third section of a taillight, which may be night lights. Element 408 may be a Micro-LED panel which may be comprised of one or more tiles that contain multiple Micro-LEDs. Multiple small Micro-LED tiles can be integrated together into a larger flat plate. The Micro-LED panel may contain Micro-LEDs capable of generating IR light. IR light may be between the wavelengths of 750 nm to 1 mm. The IR light is used to generate heat within or near the taillight. IR Micro-LEDs may be mixed with non-IR Micro-LEDs, separated into IR Micro-LED tiles, or maybe a setting that all Micro-LEDs can be tuned to. Element 410 may be a stand or base which holds the Micro-LED Panel in place with respect to the vehicle. The standor base may also ensure that the electronic connection between the Micro-LED panel and the vehicle is not broken. Element 432 may be a system for detecting the presence of ice on one or more of the taillight sections and turning on the IR Micro-LEDs for the iced sections. Element 434 may be the Micro-LED panel of FIG 3 A. Element 436 may be a memory unit that stores data. Data stored in the memory unit may include data from sensors and any memory required to run the ice module and section module. Element 437 may be a processor that runs the ice module and section module. Element 438 may be a bus controller which handles communication between the processor, memory, sensors, and Micro-LED panel. Element 440 may be a section module that determines which sections of the taillight are iced and need to be activated by the ice module. Element 442 may be an ice detector. The ice detector may be used to identify the presence of icing conditions. Ice detection may be performed using direct and indirect methods. Direct methods may include identifying the presence of atmospheric icing conditions, such as the presence of supercooled water droplets. Indirect methods may include detecting ice accretions on a surface or changes in vehicle performance behavior, thereby inferring the presence of icing conditions. Sectioning the taillight in this way reduces the amount of IR Micro-LEDs that need to be active to de-ice or defrost the taillight.

[0018] FIG. 5A displays a Micro-LED section for a taillight with infrared (IR) Micro-LEDs. FIG. 5B is a cross-section of the Micro-LED section of FIG. 5 A across the line A-A'. FIG. 5C displays a patterned taillight with embedded IR Micro-LEDs. Element 502 may be a Micro-LED section which may be comprised of one or more tiles that contain multiple Micro-LEDs. This may be a portion of the Micro-LED panel of FIG. 2C. The Micro-LED section may contain Micro-LEDs capable of generating IR light. IR light may be between the wavelengths of 750 nm to 1 mm. The IR light is used to generate heat within or near the taillight. IR Micro-LEDs may be mixed withnon-IR Micro-LEDs, separated into IR Micro-LED tiles, or may be a setting that all Micro-LEDs can be tuned to. Element 504 may be a substrate to which the Micro-LED tiles may be bound. The substrate may be silicon, glass, sapphire, any other substrate known in the art, any material to which Micro-LED tiles can be bound, or any combination of these materials. The substrate may further house or be bound to electronics which connect to the Micro-LEDs. These electronics may be contained within the substrate, tunnel through the substrate to reach the Micro-LEDs, or use the substrate as part of the circuit. Element 506 may be an IR Micro-LED tile comprised of multiple Micro-LEDs. A portion or all of these Micro-LEDs may be capable of emitting IR light. Element 508 may be a protective layer. The protective layer may protect from environmental and / or vibrational damage. The protective layer may be made of glass, epoxy, plastic, metal, other protective materials, or any combination of protective materials. The protective layer may be hermetically sealed. Element 510 may be a tile panel that may attach or adhere to the Micro-LED panel of the vehicle. Element 512 may be a patterned taillight with embedded IR Micro-LEDs. The Micro-LEDs with IR capability may be arranged to only de-ice or defrost the portions of the taillight that show the patterned taillight. Alternatively, the Micro-LEDs with IR capability may be arranged such that they only de-ice or de-frost the portions of the taillight that convey essential information from the taillight, such as brake lights and turn signals. The taillight may prioritize these modes based on de-ice or de-frost speed. For example, once the essential information portions of the taillight are de-iced or defrosted, then the pattern portions may be de-iced or defrosted, and then the entire taillight. De-icing or de-frosting the taillight in this way reduces the amount of IR Micro-LEDs that need to be active to de-ice or defrost the taillight. It also assures that if the system is incapable of de-icing or de-frosting the entire taillight, the heat from the IR Micro-LEDs is focused on the most important portions.

[0019] The functions performed in the processes and methods may be implemented in differing order. Furthermore, the outlined steps and operations are only provided as examples, and some of the steps and operations may be optional, combined into fewer steps and operations, or expanded into additional steps and operations without detracting from the essence of the disclosed embodiments.

Claims

CLAIMS1. A method to use Micro-LED and infrared radiation to operate vehicle taillight, the method comprising: having a Micro-LED panel comprising of a plurality of Micro-LEDs, at least one of which is capable of emitting infrared radiation; having a substrate to which a Micro-LED tile is bound; and having a connector that allows the electronics of the Micro LED panel to integrate with a vehicle, wherein the Micro-LED panel performs a function of a vehicle taillight, and wherein further the Micro-LEDs capable of emitting infrared radiation are used to heat the taillight.

2. The method of claim 1, wherein there is a Micro-LED section containing Micro-LEDs capable of generating an IR light.

3. The method of claim 2, wherein the IR light is between the wavelengths of 750 nm to 1 mm.

4. The method of claim 2, wherein the IR light is used to generate heat within or near the taillight.

5. The method of claim 2, wherein the IR Micro-LEDs are mixed with non-IR Micro-LEDs, separated into IR Micro-LED tiles, or a setting that all Micro-LEDs are tunable to.

6. The method of claim 2, wherein there is a Micro-LED tile comprising of multiple Micro-LEDs.

7. The method of claim 2, wherein there is an IR Micro-LED tile comprising of multiple Micro- LEDs, wherein a portion or all of these Micro-LEDs may be capable of emitting IR light.

8. The method of claim 1, wherein the substrate is one of silicon, glass, sapphire, or any material to which Micro-LED tiles are bound or any combination of these materials.

9. The method of claim 1, wherein the connector allows electronics of the panel to connect to the electronics system of a vehicle wherein further the electronics are contained within the substrate, tunnel through the substrate to reach the Micro-LEDs, or use the substrate as part of a circuit.

10. The method of claim 1, wherein there is a protective layer protecting from environmental and / or vibrational damage and wherein further the protective layer is either made of glass, epoxy, plastic, metal, or any combination of protective materials and wherein further the protective layer is hermetically sealed.

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