Sensor, apparatus and system configured to measure temperatures of human feet

Abstract

The present disclosure relates to a sensor (121 ) configured to measure temperatures of human feet, the sensor comprising: circuitry (460) configured to measure one or more temperatures of the human feet and send an output signal indicative of the one or more measured temperatures, wherein the circuitry (460) comprises: a printed circuit board, PCB, (P) configured to be thermally coupled to the human feet, and one or more electrical components (450) configured to measure temperature of the human feet via the PCB (P) and send an output signal indicative of the measured temperature, wherein at least one of the one or more electrical components (450) is thermally coupled to the PCB (P).

Description

[0001] SENSOR, APPARATUS AND SYSTEM CONFIGURED TO MEASURE TEMPERATURES OF HUMAN FEET

[0002] TECHNICAL FIELD

[0003] The present invention relates to measuring temperatures and calculating temperature differences of human feet.

[0004] BACKGROUND

[0005] The health of a human being is often reflected in body temperatures. This is particularly true for the temperature of human feet.

[0006] Many conditions which have a negative impact on the health of humans, are preceded by small changes in body temperature, e.g., the temperature of feet.

[0007] Some conditions can be predicted by a change in body temperatures. In one example, the temperature on the bottom of the feet can be predictive of foot problems such as inflammation or other conditions.

[0008] Conditions such as diabetes may lead to developing foot-related medical problems If left untreated this may further lead to hospitalizations, e.g., for foot-related medical problems, such as sores that will not heal.

[0009] There is therefore a need in the art for a sensor, apparatus and system which facilitates the monitoring of feet temperatures. For diabetics particularly, there is a need in the art for a device and system which will monitor temperatures and / or temperature differences of human feet.

[0010] Conventional solutions include light sensors and infrared temperature sensors, both which are costly and complex to implement.

[0011] Thus, there is a need for an improved sensor for measuring temperatures of human feet.

[0012] The object of the invention is at least partially to overcome the shortcomings of conventional solutions. SUMMARY OF THE INVENTION

[0013] The above-described drawbacks are overcome by the subject matter described herein. Further advantageous implementation forms of the invention are described herein.

[0014] According to a first aspect of the invention the object of the invention is achieved by a sensor configured to measure temperatures of human feet, the sensor comprising circuitry configured to measure one or more temperatures of the human feet and send an output signal indicative of the one or more measured temperatures, wherein the circuitry comprises a printed circuit board, PCB, configured to be thermally coupled to the human feet, and one or more electrical components configured to measure temperature of the human feet via the PCB and send an output signal indicative of the measured temperature, wherein at least one of the one or more electrical components is thermally coupled to the PCB.

[0015] Advantages of the first aspect include at least reduced complexity of the sensor, cost reduction at production of the sensor, the sensor has a small footprint, a stable temperature is achieved relatively quick and the sensor enables easy reconfiguration of measured points on the human feet.

[0016] In an embodiment of the first aspect, the one or more electrical components is thermally coupled to the PCB using one or more plated through holes.

[0017] In an embodiment of the first aspect, the one or more electrical components comprises at least a temperature sensing component.

[0018] In an embodiment of the first aspect, the temperature sensing component comprises a transistor.

[0019] In an embodiment of the first aspect, the PCB comprises a top conductive layer and a bottom conductive layer separated by an insulating layer, wherein an outline of the top conductive layer is smaller than the outline of the insulating layer.

[0020] In an embodiment of the first aspect, the top conductive layer is centered on the PCB.

[0021] In an embodiment of the first aspect, where a length of sides of the PCB are in the range 6-7 mm, and the PCB has a thickness of 1 mm ± 10%.

[0022] According to a second aspect of the invention the object of the invention is achieved by an apparatus configured to measure temperature of human feet, the apparatus comprising a chassis having a measuring surface, two measuring zones arranged on the measuring surface of the chassis, a plurality of sensors according to the first aspect arranged on the measuring surface of the chassis and within the two measuring zones.

[0023] In an embodiment of the second aspect, where the apparatus further comprises a controller, the controller being electrically coupled to each of the plurality of sensors via an electrical coupler, wherein the controller is configured to receive output signals of the plurality of sensors indicative of measured temperatures and calculate temperature differences of the human feet.

[0024] In an embodiment of the second aspect, where the controller is configured to calculate temperature differences over time.

[0025] In an embodiment of the second aspect, the controller is configured to calculate temperature differences between a first plurality of sensors arranged within a first measuring zone and a second plurality of sensors arranged within a second measuring zone.

[0026] In an embodiment of the second aspect, the controller 310 configured to calculate temperature differences between a plurality of sensors arranged within the same measuring zone.

[0027] In an embodiment of the second aspect, the apparatus further comprises an output device configured to visualize the calculated temperature differences, where the controller is further configured to send data to the output device, wherein the data is indicative of the calculated temperature differences.

[0028] In an embodiment of the second aspect, the electrical coupler is a twisted pair coupler.

[0029] In an embodiment of the second aspect, the electrical coupler is a coaxial coupler.

[0030] In an embodiment of the second aspect, the apparatus further comprises a communications interface which is configured to send and / or receive data as a signal to or from the controller.

[0031] In an embodiment of the second aspect, the apparatus further comprises an overlay layer configured to be in contact with the human feet and the top conductive layer. According to a third aspect of the invention the object of the invention is achieved by a method performed by a user device, the method comprising receiving data, visualizing the data to a user of the user device.

[0032] According to a fourth aspect of the invention the object of the invention is achieved by a user device, the user device comprising processor, and a memory, said memory containing instructions executable by said processor, whereby said user device is operative to perform the method according to the third aspect.

[0033] According to a fourth aspect of the invention the object of the invention is achieved by a system configured to measure temperatures of human feet, the system comprising an apparatus according to the second aspect, a user device according to the third aspect, wherein the system is configured to calculate, by the apparatus, data indicative of temperature differences, send, by the apparatus, the calculated data to the user device, receive, by the user device, the calculated data, visualize the received data to a user, by the user device.

[0034] The scope of the invention is defined by the claims, which are incorporated into this section by reference.

[0035] BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Fig. 1 shows a system configured to measure temperatures of human feet according to one or more embodiments of the present disclosure.

[0037] Fig. 2 illustrates an apparatus according to one or more embodiments of the present disclosure.

[0038] Fig. 3 illustrates further details of the apparatus according to one or more embodiments of the present disclosure.

[0039] Fig. 4 illustrates details of a sensor according to one or more embodiments of the present disclosure.

[0040] Fig. 5 illustrates further details of the sensor according to one or more embodiments of the present disclosure, closure.

[0041] Fig. 6 shows a flowchart of a method according to one or more embodiments of the present disclosure. Fig. 7 shows a flowchart of a method according to one or more embodiments of the present disclosure.

[0042] Fig. 8 shows details of an apparatus according to one or more embodiments of the present disclosure.

[0043] A more complete understanding of embodiments of the invention will be afforded to those skilled in the art, as well as a realization of additional advantages thereof, by a consideration of the following detailed description of one or more embodiments. It should be appreciated that like reference numerals are used to identify like elements illustrated in one or more of the figures.

[0044] DETAILED DESCRIPTION

[0045] The present disclosure relates to measuring temperatures of human feet and calculating temperature differences of the human feet. The variation of temperature over time and / or variation of temperature between different positions on the feet and / or variation of temperature between different feet can be monitored and form useful information when diagnosing various conditions.

[0046] This is achieved according to a first aspect by providing a sensor that delivers high accuracy, and that stabilizes at a measured temperature relatively quick.

[0047] The sensor is provided as a Printed Circuit Board, PCB, and one or more electrical components. A top conductive layer of the PCB acts as a sensing element that is configured to be thermally coupled to the human feet. In other words, configured to measure temperature of the human feet. A bottom conductive layer of the PCB electrically couples the one or more electrical components. At least one temperature sensing component of the one or more electrical components, located on the bottom conductive layer of the PCB, is thermally coupled to the top conductive layer of the PCB, e.g., using plated through holes. The sensor then measures temperatures of the human feet via the PCB and sends an output signal indicative of the measured temperature to a controller via an electrical coupler, such as a coaxial cable.

[0048] A further aspect of the invention provides an apparatus comprising two measuring zones, each measuring zone comprises a plurality of sensors for each feet coupled to the controller. This enables measuring both feet and optionally calculating differential temperatures.

[0049] A further aspect of the invention provides a system of the apparatus and a user device, where data, such as measured temperatures and / or differential temperatures, are sent to the user device for visualization to a user.

[0050] Fig. 1 shows a system configured to measure temperatures of human feet according to one or more embodiments of the present disclosure. A user device 110 receives data from an apparatus 120 configured to measure temperatures of human feet. The data is typically indicative of measured temperatures and / or calculated differential temperatures and / or any other relevant characteristics of the apparatus 120 or the human feet. Such characteristics may e.g., include time and / or date when the measurement was made and / or ambient temperature.

[0051] The user device 110 may be any type of suitable computer, such as a smart phone, a tablet computer, or a laptop.

[0052] The apparatus 120 is optionally configured to send messages comprising the data to the user device 110.

[0053] Examples of such data may be measured temperatures from a sensor over time / historic measured temperatures. A further example may include differential values from an average of a plurality of sensors to measured values of individual sensors. A further example may include differential values from corresponding positions of left and right feet.

[0054] The data may be transmitted over wired or wireless communication techniques, e.g., Bluetooth.

[0055] Fig. 2 illustrates an apparatus 120 according to one or more embodiments of the present disclosure. The apparatus 120 is configured to measure temperature of human feet. The apparatus comprises:

[0056] A chassis 230 having a measuring surface. Two measuring zones 210, 220 are arranged on the measuring surface of the chassis 230. The chassis may e.g., comprise a self-supporting measuring surface, a supporting frame and a measuring surface or any other suitable design. The chassis 230 is configured to be placed on a surface, e.g., a floor, the chassis 230 typically provided with a bottom surface facing the surface and a measuring surface facing towards the user, e.g., upwards in a direction perpendicular from the floor. In a further example, the chassis 230 is configured to be placed on a wall surface, and the feet are pressed against the measuring surface.

[0057] A plurality of sensors 121 are arranged on the measuring surface of the chassis 230 and within the two measuring zones 210, 220. A first plurality of sensors is arranged within a first measuring zone 210, and a second plurality of sensors are arranged within a second measuring zone 220, e.g., for a left and right foot respectively. Depending on the application, the two measuring zones 210, 220 may comprise the same number or a different number of sensors.

[0058] Optionally, the apparatus 120 further comprises an output device 240 configured to visualize data, e.g., data indicative of measured temperature or calculated temperature differences of the human feet. Other examples of data that may be visualized are fault conditions, calibration indications, operational state such as “ready to measure”, “measuring” and “result”.

[0059] Fig. 3 illustrates further details of the apparatus 120 according to one or more embodiments of the present disclosure. The apparatus 120 further comprises a controller 310. The controller 310 is electrically and / or communicatively coupled to each of the plurality of sensors 121 via an electrical coupler 330. Each of the plurality of sensors 121 sends signals indicative of measured temperature to the controller 310, e.g., an electrical signal. The controller 310 further register characteristics of the apparatus 120 and / or the human feet, such as date, time, ambient temperature etc.

[0060] Optionally, the apparatus 120 further comprises an overlay layer (not shown) configured to be in contact with the human feet. The overlay layer is further described in relation to Fig. 4.

[0061] In one embodiment, the electrical coupler is a twisted pair coupler.

[0062] In one embodiment, the electrical coupler is a coaxial coupler.

[0063] Optionally, the apparatus 120 further comprises a communications interface 320 which is configured to send and / or receive data as a signal to or from the controller 310 and / or external units / nodes. The data is typically indicative of measured temperatures and / or calculated differential temperatures and / or any other relevant characteristics of the apparatus 120 or human feet. The communications interface 320 is communicatively coupled to the controller 310.

[0064] In embodiments, the controller 310 is configured to receive output signals of the plurality of sensors 121 indicative of measured temperatures.

[0065] The controller 310 is further optionally configured to calculate data indicative of temperature differences.

[0066] Optionally, the controller 310 configured to calculate temperature differences over time for each sensor 121 , e.g., a trend and / or a deviation from an average value. The average value may e.g., be calculated as a weighted arithmetic mean, weighted geometric mean, or weighted median.

[0067] Optionally, the controller 310 is configured to calculate temperature differences between a first plurality of sensors arranged within a first measuring zone 210 and a second plurality of sensors arranged within a second measuring zone 220.

[0068] Optionally, the controller 310 is configured to calculate temperature differences between a plurality of sensors arranged within the same measuring zone 210, 220.

[0069] The controller 310 may further optionally be configured to calculate temperature differences between sensors having corresponding positions within the first measuring zone 210 the second measuring zone 220. In one example, temperature differences between sensors located at the heel of the left and right foot are calculated.

[0070] Fig. 4 illustrates details of a sensor 121 according to one or more embodiments of the present disclosure. The sensor 121 is configured to measure temperatures of human feet. The sensor comprises: circuitry 460 configured to measure one or more temperatures of the human feet and send an output signal indicative of the one or more measured temperatures, wherein the circuitry 460 comprises: a printed circuit board, PCB, P configured to be thermally coupled to the human feet, and one or more electrical components 450 configured to measure temperature of the human feet via the PCB and send an output signal indicative of the measured temperature, wherein at least one of the one or more electrical components 450 is thermally coupled to the PCB.

[0071] Additionally, or alternatively, the one or more electrical components 450 is thermally coupled to the PCB using one or more plated through holes 431.

[0072] Additionally, or alternatively, the one or more electrical components 450 comprises at least a temperature sensing component. In one embodiment, the temperature sensing component comprises a transistor.

[0073] Additionally, or alternatively, the PCB comprises a top / upper conductive layer 420 and a bottom / lower conductive layer 440 separated by an insulating layer 430. In one embodiment, an outline of the top conductive layer 420 is smaller than an outline of the insulating layer 430. This effectively creates a border of insulating material around the top conductive layer 420. In one embodiment, the top conductive layer 420 is centered on the PCB. The conductive layer 420 may comprise a metal, such as copper or gold.

[0074] Additionally, or alternatively, the length of sides of the PCB are in the range 6-7 millimeters, mm, and the PCB has a thickness of 1 mm ± 10%. In other embodiments, the length of sides of the PCB are in the range of [2-20] mm.

[0075] Fig. 5 illustrates further details of the sensor 121 according to one or more embodiments of the present disclosure. Fig. 5 shows a view of the bottom conductive layer 440 of the PCB P and the one or more electrical components J1 , FB1 , C1 and Q1 . In this embodiment a transistor Q1 is thermally coupled to the top conductive layer 420 of the PCB P. Further, a wire link J1 configured to receive one end of the electrical coupler forwarding signals to the controller 310. Further a capacitor C1 and component FB1 configured to reduce interference to the measured temperature.

[0076] Fig. 6 shows a flowchart 600 of a method according to one or more embodiments of the present disclosure. The method is performed by the controller 310. The method comprising:

[0077] Step 610: receiving output signals of the plurality of sensors 121 indicative of measured temperatures.

[0078] Optional step 620: calculating temperature differences. In one embodiment, temperature differences are calculated over time for each sensor 121 , e.g., a trend or deviation from an average value. The average value may be calculated as a weighted arithmetic mean, weighted geometric mean, or weighted median.

[0079] In one embodiment, temperature differences are calculated between one or more of a first plurality of sensors arranged within a first measuring zone 210 and one or more of a second plurality of sensors arranged within a second measuring zone 220.

[0080] In one embodiment, temperature differences are calculated between a plurality of sensors arranged within the same measuring zone 210, 220. In one embodiment, temperature differences are calculated between sensors having corresponding positions within the first measuring zone 210 the second measuring zone 220. In one example, temperature differences between sensors located at corresponding positions, e.g., the heel of the left and right foot, is / are calculated.

[0081] In one embodiment, the method further comprises sending data to the communications interface 320. The data may comprise measured temperatures, calculated temperature differences or any characteristics of the apparatus 120 and / or controller 310.

[0082] Fig. 7 shows a flowchart of a method 700 according to one or more embodiments of the present disclosure. The method is performed by a user device 110. The method comprises:

[0083] Step 710: receiving data indicative of measured temperatures and / or temperature differences. The temperature differences may be calculated between a first plurality of sensors arranged within a first measuring zone 210 and a second plurality of sensors arranged within a second measuring zone 220.

[0084] Step 720: visualize the data to a user of the user device.

[0085] The data may e.g., be indicative of measured temperature, calculated temperature differences of the human feet, fault conditions, calibration indications, operational state such as “ready to measure”, “measuring” and “result”.

[0086] Fig. 8 shows details of an apparatus 800 according to one or more embodiments of the present disclosure. The apparatus 800 may be in the form of a selection of any of a medical device, desktop computer, server, laptop, mobile device, a smartphone, a tablet computer, a smart watch etc. The apparatus may comprise processing circuitry 812. The apparatus may optionally comprise a communications interface 804 for wired and / or wireless communication. Further, the apparatus may further comprise at least one optional antenna (not shown in figure). The antenna may be coupled to a transceiver of the communications interface 804 and is configured to transmit and / or emit and / or receive wireless signals, e.g., in a wireless communication system.

[0087] In one example, the processing circuitry 812 may be any of a selection of processor and / or a central processing unit and / or processor modules and / or multiple processors configured to cooperate with each-other. Further, the apparatus may further comprise a memory 815. The memory 815 may contain instructions executable by the processing circuitry 812, that when executed causes the processing circuitry 812 to perform any of the methods and / or method steps described herein.

[0088] The communications interface 804, e.g., the wireless transceiver and / or a wired / wireless communications network adapter, which is configured to send and / or receive data values or parameters as a signal to or from the processing circuitry 812 to or from other external nodes. In an embodiment, the communications interface 804 communicates directly between units or via a communications network.

[0089] In one or more embodiments the apparatus may further comprise an input device 817, configured to receive input or indications from a user and send a user-input signal indicative of the user input or indications to the processing circuitry 812.

[0090] In one or more embodiments the apparatus may further comprise a display 818 configured to receive a display signal indicative of rendered objects, such as text or graphical user input objects, from the processing circuitry 812 and to display the received signal as objects, such as text or graphical user input objects.

[0091] In one embodiment the display 818 is integrated with the user input device 817 and is configured to receive a display signal indicative of rendered objects, such as text or graphical user input objects, from the processing circuitry 812 and to display the received signal as objects, such as text or graphical user input objects, and / or configured to receive input or indications from a user and send a user-input signal indicative of the user input or indications to the processing circuitry 812.

[0092] In one or more embodiments the apparatus may further comprise one or more additional sensors (not shown). Examples of such additional sensors may e.g., be sensors configured to measure ambient temperature.

[0093] In embodiments, the processing circuitry 812 is communicatively coupled to the memory 815 and / or the communications interface 804 and / or the input device 817 and / or the display 818.

[0094] In embodiments, the communications interface and / or transceiver 804 communicates using wired and / or wireless communication techniques.

[0095] In embodiments, the one or more memory 815 may comprise a selection of a hard RAM, disk drive, a floppy disk drive, a magnetic tape drive, an optical disk drive, a CD or DVD drive (R or RW), or other removable or fixed media drive.

[0096] In a further embodiment, the apparatus may further comprise and / or be coupled to one or more additional sensors (not shown) configured to receive and / or obtain and / or measure physical properties pertaining to the apparatus or the environment of the apparatus and send one or more sensor signals indicative of the physical properties to the processing circuitry 812.

[0097] It is to be understood that the apparatus comprises any suitable combination of hardware and / or software needed to perform the tasks, features, functions, and methods disclosed herein. Moreover, while the components of the apparatus are depicted as single boxes located within a larger box, or nested within multiple boxes, in practice, an apparatus may comprise multiple different physical components that make up a single illustrated component (e.g., memory 815 may comprise multiple separate hard drives as well as multiple RAM modules).

[0098] Similarly, the apparatus may be composed of multiple physically separate components, which may each have their own respective components.

[0099] The communications interface 804 may also include multiple sets of various illustrated components for different wireless technologies, such as, for example, GSM, WCDMA, LTE, NR, Wi-Fi, or Bluetooth wireless technologies. These wireless technologies may be integrated into the same or different chip or set of chips and other components within the apparatus.

[0100] Processing circuitry 812 is configured to perform any determining, calculating, or similar operations (e.g., certain obtaining operations) described herein as being provided by an apparatus. These operations performed by processing circuitry 812 may include processing information obtained by processing circuitry 812 by, for example, converting the obtained information into other information, comparing the obtained information, or converted, and / or performing one or more operations based on the obtained information or converted information, and as a result of said processing making a determination.

[0101] Processing circuitry 812 may comprise a combination of one or more of a microprocessor, controller, microcontroller, central processing unit, digital signal processor, application-specific integrated circuit, field programmable gate array, or any other suitable computing device, resource, or combination of hardware, software and / or encoded logic operable to provide, either alone or in conjunction with other apparatus components, such as device readable medium, computer apparatus functionality. For example, processing circuitry 812 may execute instructions stored in device readable medium 815 or in memory within processing circuitry 812. Such functionality may include providing any of the various wireless features, functions, or benefits discussed herein. In some embodiments, processing circuitry 812 may include a system on a chip.

[0102] In some embodiments, processing circuitry 812 may include one or more of radio frequency, RF, transceiver circuitry and baseband processing circuitry. In some embodiments, RF transceiver circuitry and baseband processing circuitry may be on separate chips or sets of chips, boards, or units, such as radio units and digital units. In alternative embodiments, part or all of RF transceiver circuitry and baseband processing circuitry may be on the same chip or set of chips, boards, or units.

[0103] In certain embodiments, some or all the functionality described herein as being provided by an apparatus may be performed by the processing circuitry 812 executing instructions stored on device readable medium 815 or memory within processing circuitry 812. In alternative embodiments, some or all the functionalities may be provided by processing circuitry 812 without executing instructions stored on a separate or discrete device readable medium, such as in a hard-wired manner. In any of those embodiments, whether executing instructions stored on a device readable storage medium or not, processing circuitry 812 can be configured to perform the described functionality. The benefits provided by such functionality are not limited to processing circuitry 812 alone or to other components of apparatus but are enjoyed by apparatus, and / or by end users.

[0104] Device readable medium or memory 815 may comprise any form of volatile or nonvolatile computer readable memory including, without limitation, persistent storage, solid-state memory, remotely mounted memory, magnetic media, optical media, random access memory (RAM), read-only memory (ROM), mass storage media (for example, a hard disk), removable storage media (for example, a flash drive, a Compact Disk (CD) or a Digital Video Disk (DVD)), and / or any other volatile or non-volatile, non- transitory device readable and / or computer-executable memory devices that store information, data, and / or instructions that may be used by processing circuitry 812. Device readable medium 815 may store any suitable instructions, data, or information, including a computer program, software, an application including one or more of logic, rules, code, tables, etc. and / or other instructions capable of being executed by processing circuitry 812 and, utilized by the apparatus. Device readable medium may be used to store any calculations made by processing circuitry 812 and / or any data received via interface 804. In some embodiments, processing circuitry 812 and device readable medium 815 may be considered to be integrated.

[0105] The communications interface 804 is used in the wired or wireless communication of signaling and / or data between apparatus and other nodes. Interface 804 may comprise port(s) / terminal(s) to send and receive data, for example to and from apparatus over a wired connection. Interface 804 also includes radio front end circuitry that may be coupled to, or in certain embodiments a part of, an antenna. Radio front end circuitry may comprise filters and amplifiers. Radio front end circuitry may be connected to the antenna and / or processing circuitry 812.

[0106] Examples of an apparatus include, but are not limited to a medical device, a smart phone, a mobile phone, a cell phone, a voice over IP (VoIP) phone, a wireless local loop phone, a tablet computer, a desktop computer, a personal digital assistant (PDA), a wireless cameras, a gaming console or device, a music storage device, a playback appliance, a wearable terminal device, a wireless endpoint, a mobile station, a tablet, a laptop, a laptop-embedded equipment (LEE), a laptop-mounted equipment (LME), a smart device, a wireless customer-premise equipment (CPE), a vehicle-mounted wireless terminal device, etc.

[0107] The communication interface 804 may encompass wired and / or wireless networks such as a local-area network (LAN), a wide-area network (WAN), a computer network, a wireless network, a telecommunications network, another like network or any combination thereof. The communication interface may be configured to include a receiver and a transmitter interface used to communicate with one or more other devices over a communication network according to one or more communication protocols, such as Ethernet, TCP / IP, SONET, ATM, optical, electrical, and the like). The transmitter and receiver interface may share circuit components, software, or firmware, or alternatively may be implemented separately.

[0108] In embodiments, the user device 110 may comprise all of the features described in relation to Fig. 8, or may comprise a subset of the features described in relation to Fig. 8.

[0109] In one embodiment, a user device 110 is provided, the user device comprising: a processor, and a memory, said memory containing instructions executable by said processor, whereby said user device is operative to perform the method described herein.

[0110] In one embodiment, a system is provided and is configured to measure temperature of human feet, the system comprising: an apparatus 120, a user device 110, where the system is configured to: calculate, by the apparatus 120, data indicative of temperature differences, send, by the apparatus 120, the calculated data to the user device 110, receive, by the user device 110, the calculated data, visualize the received data to a user, by the user device 110. Finally, it should be understood that the invention is not limited to the embodiments described above, but also relates to and incorporates all embodiments within the scope of the appended independent claims.

Claims

CLAIMS1. A sensor (121 ) configured to measure temperatures of human feet, the sensor comprising: circuitry (460) configured to measure one or more temperatures of the human feet and send an output signal indicative of the one or more measured temperatures, wherein the circuitry (460) comprises: a printed circuit board, PCB, (P) configured to be thermally coupled to the human feet, and one or more electrical components (450) configured to measure temperature of the human feet via the PCB (P) and send an output signal indicative of the measured temperature, wherein at least one of the one or more electrical components (450) is thermally coupled to the PCB (P).

2. The sensor according to claim 1 , wherein the one or more electrical components(450) is thermally coupled to the PCB (P) using one or more plated through holes (431 ).

3. The sensor according to any of the preceding claims, wherein the one or more electrical components (450) comprises at least a temperature sensing component.

4. The sensor according to claim 3, wherein the temperature sensing component comprises a transistor.

5. The sensor according to any of the preceding claims, wherein the PCB (P) comprises a top conductive layer (420) and a bottom conductive layer (440) separated by an insulating layer (430), wherein an outline of the top conductive layer (420) is smaller than the outline of the insulating layer (430).

6. The sensor according to claim 5, wherein the top conductive layer (420) is centered on the PCB (P).

7. The sensor according to any of the preceding claims, wherein a length of sides of the PCB are in the range 6-7 mm, and the PCB has a thickness of 1 mm ± 10%.

8. An apparatus (120) configured to measure temperature of human feet, the apparatus comprising: a chassis (230) having a measuring surface, two measuring zones (210, 220) arranged on the measuring surface of the chassis (230), a plurality of sensors (121 ) according to any of claims 1 -7 arranged on the measuring surface of the chassis (230) and within the two measuring zones (210, 220).

9. The apparatus according to claim 8, further comprising a controller (310), the controller (310) being electrically coupled to each of the plurality of sensors (121 ) via an electrical coupler (330), wherein the controller (310) is configured to: receive output signals of the plurality of sensors (121 ) indicative of measured temperatures, and calculate temperature differences.

10. The apparatus according to claim 9, wherein the controller 310 is configured to calculate temperature differences over time.11 . The apparatus according to claim 9-10, wherein the controller 310 is configured to calculate temperature differences between a first plurality of sensors arranged within a first measuring zone (210) and a second plurality of sensors arranged within a second measuring zone (220).

12. The apparatus according to claim 9-11 , wherein controller 310 is configured to calculate temperature differences between a plurality of sensors arranged within the same measuring zone 210, 220.

13. The apparatus according to claim 9, further comprising an output device (240) configured to visualize the calculated temperature differences, wherein the controller (310) is further configured to send data to the output device (240), wherein the data is indicative of the calculated temperature differences.

14. The apparatus according to any of claims 9-13, wherein the electrical coupler is a twisted pair coupler.

15. The apparatus according to any of claims 9-13, wherein the electrical coupler is a coaxial coupler.

16. The apparatus according to any of the preceding claims, further comprising a communications interface (320) which is configured to send and / or receive data as a signal to or from the controller (310).

17. The apparatus according to any to any of the preceding claims, further comprising an overlay layer (410) configured to be in contact with the human feet and the top conductive layer (420).

18. A method performed by a user device (110), the method comprising: receiving data, visualize the data to a user of the user device.

19. A user device (110), the user device comprising: a processor, and a memory, said memory containing instructions executable by said processor, whereby said user device is operative to perform the method according to claim 18.

20. A system configured to measure temperatures of human feet, the system comprising: an apparatus (120) according to any of claims 8-17, a user device (110) according to claim 16, wherein the system is configured to: calculate, by the apparatus (120), data indicative of temperature differences, send, by the apparatus (120), the calculated data to the user device (110), receive, by the user device (110), the calculated data, visualize, by the user device (110), the received data to a user, by the user device (110).

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