Speaker module and electronic device comprising same

Abstract

According to an embodiment of the present disclosure, an electronic device including a speaker module may include a housing and a speaker module accommodated in the housing. The speaker module, according to an embodiment, may include a yoke configuring one surface of the speaker module, a diaphragm configuring another surface of the speaker module, a frame configuring a lateral surface of the speaker module, a first magnet disposed between the yoke and the diaphragm, a second magnet substantially surrounding the first magnet and spaced apart from the first magnet, a coil attached to an area of the diaphragm, the area substantially corresponding to a space between the first magnet and the second magnet, and a conductive wire configured to provide power to the coil. The conductive wire of the speaker module according to an embodiment may include a first wire part extending from the coil toward the frame, a second wire part extending from the first wire part toward the yoke, and a third wire part extending from the second wire part toward the frame. Various other embodiments may be made in addition to various embodiments disclosed in the present document.

Description

[Technical Field]

[0001] The embodiments of the present disclosure relate to a speaker module and an electronic device including the same.[Background Art]

[0002] As the performance of electronic devices become more advanced, electronic components performing various functions are being disposed inside the electronic device. One example of the electronic components may include a speaker module for outputting sound. The speaker module can use the surround included in a diaphragm to facilitate the vibration of the air, thereby converting the electrical signal generated in the electronic device into a sound signal that a user can hear and outputting it.

[0003] The information described above may be provided as the related art for the purpose of enhancing the understanding of the present disclosure. No assertion or determination is made with respect to the applicability of any of the above-mentioned as the prior art related to the present disclosure.[Disclosure of Invention][Technical Problem]

[0004] Meanwhile, as electronic devices slim down, the slimming down of the thickness of a speaker module may also be required. In this case, the thickness of the magnetic field circuit that configures a speaker may become thinner. This may result in the output characteristics (e.g., sound pressure level) of the speaker module deteriorating due to the magnetic force regarding the magnetic field of the speaker module not being secured.

[0005] A speaker module according to various embodiments of the present disclosure may include a first magnet for securing a magnetic force and a second magnet substantially surrounding the first magnet and disposed to be spaced apart from the first magnet. The speaker module may include a conductive wire (e.g., a flexible printed circuit board and / or a rigid printed circuit board) configured to connect a coil included in the speaker module to an external electrode. The conductive wire included in the speaker module may form an electrical path that connects the coil and the external electrode through a space between a surround of a diaphragm and a frame, which is an outer space of the second magnet.[Solution to Problem]

[0006] An electronic device, according to an embodiment of the present disclosure, may include a housing and a speaker module accommodated in the housing. The speaker module, according to an embodiment, may include a yoke configuring one surface of the speaker module, a diaphragm configuring another surface of the speaker module, a frame configuring a lateral surface of the speaker module, a first magnet disposed between the yoke and the diaphragm, a second magnet substantially surrounding the first magnet and disposed to be spaced apart from the first magnet, a coil attached to an area of the diaphragm, the area substantially corresponding to a space between the first magnet and the second magnet, and a conductive wire configured to provide power to the coil. The conductive wire of the speaker module according to an embodiment may include a first wire part extending from the coil toward the frame, a second wire part extending from the first wire part toward the yoke, and a third wire part extending from the second wire part toward the frame.

[0007] The speaker module, according to an embodiment of the present disclosure, may include a yoke configuring one surface of the speaker module, a diaphragm configuring another surface of the speaker module, a frame configuring a lateral surface of the speaker module, a first magnet disposed between the yoke and the diaphragm, a second magnet substantially surrounding the first magnet and disposed to be spaced apart from the first magnet, a coil attached to an area of the diaphragm, the area substantially corresponding to a space between the first magnet and the second magnet, and a conductive wire configured to provide power to the coil. The conductive wire of the speaker module according to an embodiment may include a first wire part extending from the coil toward the frame, a second wire part extending from the first wire part toward the yoke, and a third wire part extending from the second wire part toward the frame.[Advantageous Effects of Invention]

[0008] The speaker module and the electronic device including the same according to various embodiments of the present disclosure includes a first magnet and a second magnet substantially surrounding the first magnet and disposed to be spaced apart from the first magnet. As a result, the magnetic field efficiency is improved, which can reduce the degradation of the output characteristics (e.g., sound pressure level) of the speaker module.

[0009] The speaker module and the electronic device including the same according to various embodiments of the present disclosure form an electrical path that connects a coil and an external electrode through the space between the surround and the frame of the diaphragm, which is the external space of the second magnet using a conductive wire (e.g., a flexible printed circuit board and / or a rigid printed circuit board), thereby contributing to the slimming down of the speaker module.

[0010] The effects obtained by the present disclosure are not limited to the aforementioned effects, and other effects, which are not mentioned above, will be clearly understood by those skilled in the art from the following description.[Brief Description of Drawings]

[0011] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar constituent elements. FIG. 1 is a block diagram of an electronic device in a network environment according to an embodiment of the present disclosure. FIG. 2A is a front perspective view of the electronic device according to an embodiment of the present disclosure. FIG. 2B is a rear perspective view of the electronic device in FIG. 2A according to an embodiment of the present disclosure. FIG. 3 is an exploded perspective view of the electronic device in FIG. 2A and FIG. 2B according to an embodiment of the present disclosure. FIG. 4 is an exploded perspective view of a speaker module according to an embodiment of the present disclosure. FIG. 5 is a view for describing the disposition of a coil, a first conductive plate part, a second conductive plate part, a first magnet, and / or a second magnet of the speaker module according to an embodiment of the present disclosure. FIG. 6A is a cross-sectional view schematically illustrating the configuration of the speaker module according to an embodiment of the present disclosure. FIG. 6B is a view illustrating the speaker module according to an embodiment of the present disclosure. FIG. 6C is a view for describing a conductive wire of the speaker module according to an embodiment of the present disclosure. FIG. 7 is a view for describing an effective area of a diaphragm of the speaker module according to an embodiment of the present disclosure. FIG. 8 is a view for describing the first conductive plate part and / or second conductive plate part of the speaker module according to an embodiment of the present disclosure. FIG. 9 is a view for describing the first magnet and / or second magnet of the speaker module according to an embodiment of the present disclosure. FIG. 10 is a cross-sectional view schematically illustrating the configuration of the speaker module according to an embodiment of the present disclosure. FIG. 11 is a view for describing the second conductive plate part of the speaker module according to an embodiment of the present disclosure. FIG. 12 is a graph comparing the output of the speaker module according to an embodiment of the present disclosure. [Mode for the Invention]

[0012] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings so that those with ordinary skill in the art to which the present disclosure pertains may easily carry out the embodiments. However, the present disclosure may be implemented in various different ways and is not limited to the embodiments described herein. In connection with the description of the drawings, the similar or same reference numerals may be used for the similar or same constituent elements. In addition, in the drawings and related descriptions, the description of well-known features and configurations may be omitted for clarity and conciseness.

[0013] FIG. 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0014] Referring to FIG. 1, an electronic device 101 in a network environment 100 may communicate with an electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or at least one of an electronic device 104 or a server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added in the electronic device 101. In some embodiments, some of the components (e.g., the sensor module 176, the camera module 180, or the antenna module 197) may be implemented as a single component (e.g., the display module 160).

[0015] The processor 120 may execute, for example, software (e.g., a program 140) to control at least one other component (e.g., a hardware or software component) of the electronic device 101 coupled with the processor 120, and may perform various data processing or computation. According to one embodiment, as at least part of the data processing or computation, the processor 120 may store a command or data received from another component (e.g., the sensor module 176 or the communication module 190) in volatile memory 132, process the command or the data stored in the volatile memory 132, and store resulting data in non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)), or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor 121. For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be specific to a specified function. The auxiliary processor 123 may be implemented as separate from, or as part of the main processor 121.

[0016] The auxiliary processor 123 may control at least some of functions or states related to at least one component (e.g., the display module 160, the sensor module 176, or the communication module 190) among the components of the electronic device 101, instead of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or together with the main processor 121 while the main processor 121 is in an active state (e.g., executing an application). According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., the neural processing unit) may include a hardware structure specified for artificial intelligence model processing. An artificial intelligence model may be generated by machine learning. Such learning may be performed, e.g., by the electronic device 101 where the artificial intelligence is performed or via a separate server (e.g., the server 108). Learning algorithms may include, but are not limited to, e.g., supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include a plurality of artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-network or a combination of two or more thereof but is not limited thereto. The artificial intelligence model may, additionally or alternatively, include a software structure other than the hardware structure.

[0017] The memory 130 may store various data used by at least one component (e.g., the processor 120 or the sensor module 176) of the electronic device 101. The various data may include, for example, software (e.g., the program 140) and input data or output data for a command related thereto. The memory 130 may include the volatile memory 132 or the non-volatile memory 134. The non-volatile memory 134 may include an internal memory 136 and / or an external memory 138.

[0018] The program 140 may be stored in the memory 130 as software, and may include, for example, an operating system (OS) 142, middleware 144, or an application 146.

[0019] The input module 150 may receive a command or data to be used by another component (e.g., the processor 120) of the electronic device 101, from the outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0020] The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing record. The receiver may be used for receiving incoming calls. According to an embodiment, the receiver may be implemented as separate from, or as part of the speaker.

[0021] The display module 160 may visually provide information to the outside (e.g., a user) of the electronic device 101. The display module 160 may include, for example, a display, a hologram device, or a projector and control circuitry to control a corresponding one of the display, hologram device, and projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch, or a pressure sensor adapted to measure the intensity of force incurred by the touch.

[0022] The audio module 170 may convert a sound into an electrical signal and vice versa. According to an embodiment, the audio module 170 may obtain the sound via the input module 150, or output the sound via the sound output module 155 or a headphone of an external electronic device (e.g., an electronic device 102) (e.g., speaker or headphone) directly (e.g., wiredly) or wirelessly coupled with the electronic device 101.

[0023] The sensor module 176 may detect an operational state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) external to the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0024] The interface 177 may support one or more specified protocols to be used for the electronic device 101 to be coupled with the external electronic device (e.g., the electronic device 102) directly (e.g., through wires) or wirelessly. According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0025] The connection terminal 178 may include a connector via which the electronic device 101 may be physically connected with the external electronic device (e.g., the electronic device 102). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0026] The haptic module 179 may convert an electrical signal into a mechanical stimulus (e.g., a vibration or a movement) or electrical stimulus which may be recognized by a user via his tactile sensation or kinesthetic sensation. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.

[0027] The camera module 180 may capture a still image or moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

[0028] The power management module 188 may manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0029] The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell.

[0030] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and the external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108) and performing communication via the established communication channel. The communication module 190 may include one or more communication processors that are operable independently from the processor 120 (e.g., an application processor (AP)) and supports a direct (e.g., wired) communication or a wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate with the external electronic device via the first network 198 (e.g., a short-range communication network, such as Bluetooth ™< , Wi-Fi direct, or infrared data association (IrDA)) or the second network 199 (e.g., a long-range communication network, such as a legacy cellular network, a fifth generation (5G) network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or wide area network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multi components (e.g., multi chips) separate from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199, using subscriber information (e.g., international mobile subscriber identity (IMSI)) stored in the subscriber identification module 196.

[0031] The wireless communication module 192 may support a 5G network, after a 4G network, and next-generation communication technology, e.g., new radio (NR) access technology. The NR access technology may support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable and low-latency communications (URLLC). The wireless communication module 192 may support a high-frequency band (e.g., the mmWave band) to achieve, e.g., a high data transmission rate. The wireless communication module 192 may support various technologies for securing performance on a high-frequency band, such as, e.g., beamforming, massive multiple-input and multiple-output (massive MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., the electronic device 104), or a network system (e.g., the second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate (e.g., 20Gbps or more) for implementing eMBB, loss coverage (e.g., 164dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5ms or less for each of downlink (DL) and uplink (UL), or a round trip of 1ms or less) for implementing URLLC.

[0032] The antenna module 197 may transmit or receive a signal or power to or from the outside (e.g., the external electronic device) of the electronic device 101. According to an embodiment, the antenna module 197 may include an antenna including a radiating element composed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., array antennas). In such a case, at least one antenna appropriate for a communication scheme used in the communication network, such as the first network 198 or the second network 199, may be selected, for example, by the communication module 190 (e.g., the wireless communication module 192) from the plurality of antennas. The signal or the power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 197.

[0033] According to various embodiments, the antenna module 197 may form mmWave antenna module. According to an embodiment, the mmWave antenna module may include a printed circuit board, a RFIC disposed on a first surface (e.g., the bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a designated high-frequency band (e.g., an mmwave band), and a plurality of antennas (e.g., array antennas) disposed on a second surface (e.g., the top or a side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the designated high-frequency band.

[0034] At least some of the above-described components may be coupled mutually and communicate signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)).

[0035] According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 coupled with the second network 199. Each of the electronic devices 102 or 104 may be a device of a same type as, or a different type, from the electronic device 101. According to an embodiment, all or some of operations to be executed at the electronic device 101 may be executed at one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 should perform a function or a service automatically, or in response to a request from a user or another device, the electronic device 101, instead of, or in addition to, executing the function or the service, may request the one or more external electronic devices to perform at least part of the function or the service. The one or more external electronic devices receiving the request may perform the at least part of the function or the service requested, or an additional function or an additional service related to the request, and transfer an outcome of the performing to the electronic device 101. The electronic device 101 may provide the outcome, with or without further processing of the outcome, as at least part of a reply to the request. To that end, a cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device 101 may provide ultra low-latency services using, e.g., distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an internet-of-things (IoT) device. The server 108 may be an intelligent server using machine learning and / or a neural network. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology or IoT-related technology.

[0036] FIG. 2A illustrates a perspective view showing a front surface of an electronic device 200 according to an embodiment of the disclosure. FIG. 2B illustrates a perspective view showing a rear surface of the electronic device 200 shown in FIG. 2A according to an embodiment of the disclosure.

[0037] The electronic device 200 shown in FIGS. 2A and 2B may be similar, at least in part, to the electronic device 101 in FIG. 1, or may further include another embodiment of the electronic device.

[0038] Referring to FIGS. 2A and 2B, an electronic device 200 may include a housing 210 that includes a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a lateral surface 210C that surrounds a space between the first surface 210A and the second surface 210B. In another embodiment (not shown), the housing 210 may refer to a structure that forms a part of the first surface 210A, the second surface 210B, and the lateral surface 210C. The first surface 210A may be formed of a front plate 202 (e.g., a glass plate or polymer plate coated with a variety of coating layers) at least a part of which is substantially transparent. The second surface 210B may be formed of a rear plate 211 which is substantially opaque. The rear plate 111 may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or any combination thereof. The lateral surface 210C may be formed of a lateral bezel structure (or "lateral member") 218 which is combined with the front plate 202 and the rear plate 211 and includes a metal and / or polymer. In some embodiments, the rear plate 211 and the lateral bezel structure 218 may be integrally formed and may be of the same material (e.g., a metallic material such as aluminum).

[0039] The front plate 202 may include two first regions 210D disposed at long edges thereof, respectively, and bent and extended seamlessly from the first surface 210A toward the rear plate 211. Similarly, the rear plate 211 may include two second regions 210E disposed at long edges thereof, respectively, and bent and extended seamlessly from the second surface 210B toward the front plate 202. In some embodiments, the front plate 202 (or the rear plate 211) may include only one of the first regions 210D (or of the second regions 210E). In some embodiments, the front plate 202 may not include the first region 210D and the second region 210E, and may only include a flat plane that is arranged parallel to the second surface 210B. When viewed from a lateral side of the electronic device 200, the lateral bezel structure 218 may have a first thickness (or width) on a lateral side where the first region 210D or the second region 210E is not included, and may have a second thickness, being less than the first thickness, on another lateral side where the first region 210D or the second region 210E is included.

[0040] In one embodiment, the electronic device 200 may include at least one of a display 201 (e.g., a display module 160 of FIG. 1), an input device 203 (e.g., an input module 150 of FIG. 1), a sound output devices 207 and 214 (e.g., a sound output module 155 of FIG. 1), sensor modules 204 and 219 (e.g., a sensor module 176 of FIG. 1), camera modules 205, 212, and 213 (e.g., a camera module 180 of FIG. 1), a key input device 217, an indicator (not shown), and connector 208 (e.g., a connection terminal 178 of FIG. 1). In some embodiments, the electronic device 200 may omit at least one (e.g., the key input device 217 or the indicator) of the above components, or may further include other components.

[0041] The display 201 may be exposed through a substantial portion of the front plate 202, for example. In some embodiments, at least a part of the display 201 may be exposed through the front plate 202 that forms the first surface 210A and the first region 210D of the lateral surface 210C. The display 201 may be combined with, or adjacent to, a touch sensing circuit, a pressure sensor capable of measuring the touch strength (pressure), and / or a digitizer for detecting a stylus pen. In some embodiments, at least a part of the sensor modules 204 and 219 and / or at least a part of the key input device 217 may be disposed in the first region 210D and / or the second region 210E.

[0042] The input device 203 may include a microphone. In some embodiments, the input device 203 may include a plurality of microphones arranged to sense the direction of the sound. The sound output devices 207 and 214 may include speakers. The speakers may include an external speaker 207 and a receiver 214 for a call. In some embodiments, the microphone, the speakers, and the connector 208 are disposed in the space of the electronic device 200 and may be exposed to the external environment through at least one hole formed in the housing 210. In some embodiments, a hole formed in the housing 210 may be used in common for the microphone and speakers. In some embodiments, the sound output devices may include a speaker (e.g., a piezo speaker) that operates while excluding a hole formed in the housing 210.

[0043] The sensor modules 204 and 219 may generate electrical signals or data corresponding to an internal operating state of the electronic device 200 or to an external environmental condition. The sensor modules 204 and 219 may include a first sensor module 204 (e.g., a proximity sensor) and / or a second sensor module (e.g., a fingerprint sensor) disposed on the first surface 210A of the housing 210, and / or a third sensor module 219 (e.g., a heart rate monitor (HRM) sensor). The fingerprint sensor may be disposed on the first surface 210A (e.g., the display 201) of the housing 210. A fingerprint sensor (e.g., an ultrasonic or optical fingerprint sensor) may be disposed below the display 201 on the first surface 210A. The electronic device 200 may further include at least one of a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0044] The camera modules 205, 212, and 213 may include a first camera device 205 disposed on the first surface 210A of the electronic device 200, and a second camera device 212, and / or a flash 213 disposed on the second surface 210B. The camera modules 205 and 212 may include one or more lenses, an image sensor, and / or an image signal processor. The flash 213 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (e.g., wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 200.

[0045] The key input device 217 may be disposed on the lateral surface 210C of the housing 210. In another embodiment, the electronic device 200 may not include some or all of the key input device 217 described above, and the key input device 217 which is not included may be implemented in another form such as a soft key on the display 201. In another embodiment, the key input device 217 may include the sensor module disposed on the second surface 210B of the housing 210. In another embodiment, the key input device 217 may be implemented using a pressure sensor included in the display 201.

[0046] The indicator (not shown) may be disposed on the first surface 210A of the housing 210. For example, the indicator may provide status information of the electronic device 200 in an optical form. In another embodiment, the indicator (e.g., a light emitting device) may provide a light source associated with the operation of the camera module 205. In another embodiment, the indicator may include, for example, a light emitting diode (LED), an infrared (IR) LED, or a xenon lamp.

[0047] The connector hole 208 may include a connector hole adapted for a connector (e.g., a universal serial bus (USB) connector) for transmitting and receiving power and / or data to and from an external electronic device and / or a connector hole adapted for a connector (e.g., an earphone jack) for transmitting and receiving an audio signal to and from an external electronic device.

[0048] Some camera module 205 of camera modules 205 and 212, some sensor module 204 of sensor modules 204 and 219, or an indicator may be arranged to be exposed through a display 201. For example, the camera module 205, the sensor module 204, or the indicator may be arranged in the internal space of an electronic device 200 so as to be brought into contact with an external environment through an opening of the display 201, which is perforated up to a front plate 202. The area facing the camera module 205 of the display 201 may be formed as a transparent area having a designated transmittance as a part of an area displaying content. The transmissive region may have a transmittance ranging from about 5% to about 20%. Such a transmissive region may include a region overlapping an effective region (e.g., an angle of view region) of the camera module 205 through which light for generating an image by being imaged by an image sensor passes. For example, the transparent area of the display 201 may include an area having a lower pixel density or wiring density or both than the surrounding area. For example, the transmissive area may replace the aforementioned opening. The camera module 205 may include an under display camera (UDC). In another embodiment, some sensor module 204 may be arranged to perform their functions without being visually exposed through the display 201 in the internal space of the electronic device 200. For example, in this case, an area of the display 201 facing the sensor module may not require a perforated opening.

[0049] According to one embodiment, the electronic device 200 has a bar type or plate type appearance, but the present disclosure is not limited thereto. For example, the illustrated electronic device 200 may be part of a foldable electronic device, a slidable electronic device, a stretchable electronic device, and / or a rollable electronic device. The "foldable electronic device", "slidable electronic device", "stretchable electronic device", and / or "rollable electronic device" may refer to an electronic device in which a display (e.g., a display 330 of FIG. 3) is capable of bending deformation, such that at least a portion thereof is folded, wound or rolled, at least a portion thereof is expanded, and / or the display can be accommodated inside a housing (e.g., a housing 210 of FIGS. 2A and 2B). The foldable electronic device, the slidable electronic device, the stretchable electronic device, and / or the rollable electronic device can be used by expanding the screen display area by unfolding the display 330 or exposing a wider area of the display 330 to the outside, depending on the needs of the user.

[0050] FIG. 3 illustrates an exploded perspective view showing an electronic device 200 of FIGS. 2A and 2B according to an embodiment of the disclosure.

[0051] The electronic device 200 shown in FIG. 3 may be similar, at least in part, to the electronic device 101 in FIG. 1, or to the electronic device 200 in FIGS. 2A and 2B, may further include another embodiment of the electronic device.

[0052] Referring to FIG. 3, an electronic device 200 may include a lateral member 310 (e.g., lateral bezel structure), a first support member 311 (e.g., a bracket or a support structure), a front plate 320 (e.g., a front cover) (e.g., a front plate 202 of FIG. 2A), a display 330 (e.g., a display 201 of FIG. 2A), a printed circuit board (PCB) 340, a battery 350, a second support member 360 (e.g., a rear case), an antenna 370, and a rear plate 380 (e.g., a rear cover) (e.g., a rear plate 211 of FIG. 2B). In some embodiments, the electronic device 200 may omit at least one (e.g., the first support member 311 or the second support member 360) of the above components or may further include another component. Some components of the electronic device 200 may be the same as or similar to those of the electronic device 200 shown in FIG. 2A or FIG. 2B, thus, descriptions thereof are omitted below.

[0053] The first support member 311 is disposed inside the electronic device 200 and may be connected to, or integrated with, the lateral bezel structure 310. The first support member 311 may be formed of, for example, a metallic material and / or a non-metal (e.g., polymer) material. The first support member 311 may be combined with the display 330 at one side thereof and also combined with the printed circuit board (PCB) 340 at the other side thereof. On the PCB 340, a processor (e.g., a processer 120 of FIG.1), a memory (e.g., a memory 130 of FIG. 1), and / or an interface (e.g., an interface 177 of FIG. 1) may be mounted.

[0054] The processor may include, for example, one or more of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communications processor (CP).

[0055] The memory may include, for example, one or more of a volatile memory (e.g., a volatile memory 132 of FIG. 1) and a non-volatile memory (e.g., a non-volatile memory 134 of FIG. 1).

[0056] The interface may include, for example, a high definition multimedia interface (HDMI), a USB interface, a secure digital (SD) card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device 200 with an external electronic device and may include a USB connector, an SD card / multimedia card (MMC) connector, or an audio connector.

[0057] The battery 350 (e.g., a battery 189 of FIG. 1) is a device for supplying power to at least one component of the electronic device 200, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a part of the battery 350 may be disposed on substantially the same plane as the PCB 340. The battery 350 may be integrally disposed within the electronic device 200. The battery 350 may be detachably disposed from the electronic device 200.

[0058] The antenna 370 may be positioned between the rear plate 380 and the battery 350. The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna 370 may perform short-range communication with an external device, or transmit and receive power required for charging wirelessly. In another embodiment, an antenna structure may be formed by a part or combination of the lateral bezel structure 310 and / or the first support member 311.

[0059] FIG. 4 is an exploded perspective view of a speaker module 400 according to an embodiment of the present disclosure.

[0060] With reference to FIG. 4, the speaker module 400 (e.g., acoustic output module 155 in FIG. 1) may include a frame 460 (e.g., housing), a diaphragm 420, a conductive wire 430, a coil 440, a first conductive plate part 445, a second conductive plate part 450, a first magnet 465, a second magnet 470, an air vent, and a yoke 490.

[0061] In an embodiment, the frame 460 (e.g., housing) may configure a lateral surface of the speaker module 400. For example, the frame 460 may configure the outer shape of the speaker module 400 (e.g. its side wall(s)). For example, the frame 460 may be made of plastic. However, the present disclosure is not limited thereto.

[0062] In an embodiment, the diaphragm 420 may include a surround 410 (or edge, or peripheral area) that contributes to efficient air vibration by widening a vibrating area. The surround 410 may have a shape that facilitates the vibration of the diaphragm 420. The surround 410 may be adjacent to an edge of the diaphragm 420, and may be formed along the edge. The diaphragm 420 may include a center cap 415 that is located to substantially correspond to the coil 440. For example, the center cap 415 may contribute to determining the directionality of the sound waves. The center cap 415 may serve to prevent foreign objects, such as dust, from entering the inside of the coil 440.

[0063] In an embodiment, the diaphragm 420 may be implemented in an integrated form that includes the surround 410 and the center cap 415. For example, the surround 410 and the center cap 415 may be integrally formed. However, the present disclosure is not limited thereto.

[0064] In an embodiment, the diaphragm 420 may be coupled with the coil 440. For example, the diaphragm 420 may be disposed with the coil 440 mounted on its inner surface. In an embodiment, the diaphragm 420 may be configured to output sound in the direction of the speaker hole (e.g., speaker holes 207 and 214 in FIG. 2A) of the electronic device (e.g., electronic device 101 in FIG. 1, electronic device 200 in FIG. 2A to FIG. 3). The diaphragm 420, by vibrating together with the coil 440, may generate sound. The diaphragm 420 may be made of a thin film.

[0065] In an embodiment, the yoke 490 may fix the first magnet 465 and the second magnet 470. In an embodiment, the yoke 490 may be made of a material through which a magnetic force effectively passes. For example, the yoke 490 may be made of a cobalt alloy (FeCo). However, the present disclosure is not limited thereto.

[0066] In an embodiment, the first magnet 465 and the second magnet 470 may be disposed between the yoke 490 and the diaphragm 420. For example, the first magnet 465 and the second magnet 470 may be mounted on the yoke 490 to form a magnetic field. In another example, the first magnet 465 and the second magnet 470 may be disposed to be supported through the yoke 490. Preferably, the yoke 490 is positioned opposite the diaphragm 420 as shown in Fig. 4.

[0067] In an embodiment, the first magnet 465 and the second magnet 470 may include, for example, a neodymium magnet, an alnico magnet, or a ferrite magnet. However, the present disclosure is not limited thereto.

[0068] In an embodiment, the first magnet 465 may be disposed in the central area of the speaker module 400. The second magnet 470 may substantially surround the first magnet 465 and be disposed to be spaced apart from the first magnet 465. For example, the second magnet 470 may have a closed-loop structure or an annular structure.

[0069] In an embodiment, the first magnet 465 and the second magnet 470 may cause the coil 440 to vibrate vertically according to Fleming's left-hand rule.

[0070] In an embodiment, the coil 440 may be disposed on the inner surface of the diaphragm 420. The coil 440 may be configured by winding a conductive wire around at least one axis disposed on the inner surface of the diaphragm 420. The coil 440 may vibrate the diaphragm 420 by an electrical signal applied from the outside.

[0071] In an embodiment, the first conductive plate part 445 may be disposed in a position corresponding to the first magnet 465 in a first direction (e.g., z-axis direction). For example, the first conductive plate part 445 may be disposed on a first surface of the first magnet 465 (e.g., a surface facing the z-axis direction). The second conductive plate part 450 may be disposed in a position corresponding to the second magnet 470 in the first direction (e.g., z-axis direction). For example, the second conductive plate part 450 may be disposed on a first surface of the second magnet 470 (e.g., a surface facing the z-axis direction). For example, the second conductive plate part 450 may substantially surround the first conductive plate part 445 and be disposed to be spaced apart from the first conductive plate part 445. For example, the second conductive plate part 450 may have a closed-loop structure or an annular structure.

[0072] In an embodiment, the first conductive plate part 445 and the second conductive plate part 450 may perform the function of gathering the magnetic fields generated by the first magnet 465 and the second magnet 470.

[0073] In an embodiment, the first conductive plate part 445 and the second conductive plate part 450 may be made of a material through which a magnetic force effectively passes. For example, the first conductive plate part 445 and the second conductive plate part 450 may be made of a cobalt alloy (FeCo).

[0074] In an embodiment, the first conductive plate part 445 and the second conductive plate part 450, together with the yoke 490, first magnet 465, and second magnet 470, may configure the magnetic circuit of the speaker module 400. For example, the first conductive plate part 445, the second conductive plate part 450, the yoke 490, the first magnet 465, and the second magnet 470 may configure the magnetic circuit of the speaker module 400, serving to maximize the magnetic field density at a position where the coil 440 is disposed. For example, the magnetic flux generated by the first magnet 465 and the second magnet 470 may form a magnetic flux path entering the yoke 490 through the first conductive plate part 445 and the second conductive plate part 450.

[0075] In an embodiment, the first conductive plate part 445, the first magnet 465, and the yoke 490 may be configured to be not ventilated to the outside

[0076] In an embodiment, although not illustrated, the air vent may allow air to ventilate through a first surface of the diaphragm 420 (e.g., a surface facing the z-axis) to enable smooth vibration.

[0077] In an embodiment, the conductive wire 430 may electrically connect the coil 440 and an external electrode (e.g., external power terminal). For example, the conductive wire 430 may electrically connect the coil 440 and the external electrode through a space between the surround 410 of the diaphragm 420 (e.g., a protruding area of the surround 410) and the frame 460, which is the external space of the second magnet 470. The external electrode may include a constituent element disposed on a printed circuit board (e.g., the substrate 340 in FIG. 3) disposed outside the speaker module 400. The conductive wire 430 may provide power to the coil 440.

[0078] In an embodiment, the conductive wire 430 may include a flexible printed circuit board (FPCB) and / or a rigid flexible printed circuit board.

[0079] FIG. 5 is a view for describing the disposition of the coil 440, first conductive plate part 445, second conductive plate part 450, first magnet 465, and / or second magnet 470 of the speaker module 400 according to an embodiment of the present disclosure.

[0080] With reference to FIG. 5, reference numeral <510> in FIG. 5 according to an embodiment is a view of the coil (e.g., coil 440 in FIG. 4), first magnet (e.g., first magnet 465 in FIG. 4), and second magnet (e.g., second magnet 470 in FIG. 4) as viewed from the rear surface (e.g., surface facing the -z-axis) of the speaker module (e.g., speaker module 400 in FIG. 4).

[0081] In an embodiment, the first magnet 465 may be formed in the central area of the speaker module 400 when viewed from the rear surface (e.g., surface facing the -z-axis) of the speaker module 400. The second magnet 470 may substantially surround the first magnet 465 and be disposed to be spaced apart from the first magnet 465. For example, the second magnet 470 may have a closed-loop structure or an annular structure.

[0082] In an embodiment, when the coil 440, first magnet 465, and second magnet 470 are viewed from the rear surface (e.g., surface facing the -z-axis) of the speaker module 400, the coil 440 may be in a structure disposed, at least partially, within a spaced area 440A between the first magnet 465 and the second magnet 470.

[0083] Reference numeral <530> in FIG. 5, according to an embodiment, is a view of the coil 440, second conductive plate part (e.g., second conductive plate part 450 in FIG. 4), and yoke (e.g., yoke 490 in FIG. 4) as viewed from the front surface (e.g., surface facing the z-axis) of the speaker module 400.

[0084] In an embodiment, when the coil 440, second conductive plate part 450, and yoke 490 are viewed from the front surface (e.g., surface facing the z-axis) of the speaker module 400, the second conductive plate part 450 may be disposed to overlap the yoke 490.

[0085] In an embodiment, when the coil 440, second conductive plate part 450, and yoke 490 are viewed from the front surface (e.g., surface facing the z-axis) of the speaker module 400, the second conductive plate part 450 may be in a form disposed to surround the outer circumferential surface of the coil 440.

[0086] Reference numeral <550> in FIG. 5, according to an embodiment, is a view of the coil 440, first conductive plate part (e.g., first conductive plate part 445 in FIG. 4), and yoke 490 as viewed from the front surface (e.g., surface facing the z-axis) of the speaker module 400.

[0087] In an embodiment, when the coil 440, first conductive plate part 445, and yoke 490 are viewed from the front surface (e.g., surface facing the z-axis) of the speaker module 400, the first conductive plate part 445 may be in a form disposed to surround the inner circumferential surface of the coil 440 (or the outer circumferential surface of the first conductive plate part 445).

[0088] Reference numeral <570> in FIG. 5, according to an embodiment, is a view of the first conductive plate part 445, second conductive plate part 450, first magnet 465, and second magnet 470 as viewed from the lateral surface.

[0089] In an embodiment, the first conductive plate part 445 may be disposed to overlap the first magnet 465 in the first direction (e.g., z-axis direction), and the second conductive plate part 450 may be disposed to overlap the second magnet 470 in the first direction (e.g., z-axis direction).

[0090] FIG. 6A is a cross-sectional view schematically illustrating the configuration of the speaker module 400 according to an embodiment of the present disclosure. FIG. 6B is a view illustrating the speaker module 400 according to an embodiment of the present disclosure. FIG. 6C is a view for describing the conductive wire 430 of the speaker module 400 according to an embodiment of the present disclosure.

[0091] In an embodiment, FIG. 6A is a view of the speaker module (e.g., speaker module 400 in FIG. 4) as viewed from the lateral surface (e.g., surface facing the y-axis). In an embodiment, FIG. 6B is a view of the speaker module 400 as viewed from the rear and lateral surface.

[0092] With reference to FIG. 6A and FIG. 6B, the speaker module 400 may include the frame 460 that configures the lateral surface (e.g., outer shape) of the speaker module 400.

[0093] In an embodiment, the speaker module 400 may include the yoke 490 that configures one surface (e.g., surface facing the -z-axis) of the speaker module 400. In an embodiment, the yoke 490 may fix the first magnet (e.g., first magnet 465 in FIG. 4) and the second magnet 470. For example, the yoke 490 may be made of a material through which a magnetic force effectively passes, such as a cobalt alloy (FeCo).

[0094] In an embodiment, the first magnet 465 may be disposed in the central area of the speaker module 400. The second magnet 470 may substantially surround the first magnet 465 and be disposed to be spaced apart from the first magnet 465. For example, the second magnet 470 may have a closed-loop structure or an annular structure.

[0095] In an embodiment, the speaker module 400 may include the frame 460 (e.g., housing), diaphragm 420, conductive wire 430, second conductive plate part 450, second magnet 470, and / or yoke 490. Although not illustrated, the speaker module 400 may further include the coil 440, first conductive plate part 445, first magnet 465, and / or an air vent (not illustrated).

[0096] In an embodiment, the second conductive plate part 450 may be disposed in a position corresponding to the second magnet 470 in the first direction (e.g., direction facing the z-axis). The second conductive plate part 450 may substantially surround the first conductive plate part (e.g., first conductive plate part 445 in FIG. 4) and be disposed to be spaced apart from the first conductive plate part 445. In an embodiment, the second conductive plate part 450 may be made of a material through which a magnetic force effectively passes, such as a cobalt alloy (FeCo).

[0097] In an embodiment, although not illustrated, the speaker module 400 may include a coil (e.g., coil 440 in FIG. 4). For example, the coil 440 may be attached to an area of the diaphragm 420 that substantially corresponds to the space between the first magnet 465 and the second magnet 470. In an embodiment, the coil 440 may vibrate the diaphragm 420 by an electrical signal applied from the outside.

[0098] In an embodiment, the diaphragm 420 may include the surround 410 and the center cap 415. For example, the center cap 415 may be disposed in a position corresponding to the coil 440 in the first direction (e.g., direction facing the z-axis). The center cap 415 may contribute to determining the directionality of the sound waves. The surround 410 may be adjacent to an edge of the diaphragm 420, and may be formed along the edge. In an embodiment, the surround 410 may include a protruding area 615 formed along the edge of the diaphragm 420, protruding in a second direction (e.g., -z-axis direction).

[0099] In an embodiment, the conductive wire 430 may electrically connect the coil 440 and the external electrode (e.g., an electrode disposed outside the speaker module 400). For example, the conductive wire 430 may provide power to the coil 440.

[0100] In an embodiment, the conductive wire 430 may electrically connect the coil 440 and the external electrode through a space between the protruding area of the surround 410 of the diaphragm 420 and the frame 460, which is the external space of the second magnet 470. For example, the conductive wire 430 may include a first wire part 4301, a second wire part 4302, and a third wire part 4303. The first wire part 4301 of the conductive wire 430 may be connected to a part of the coil 440 and may be coupled with at least a partial area of the center cap 415 of the diaphragm 420. For example, the first wire part 4301 of the conductive wire 430 may be coupled with at least a partial area of the center cap 415 of the diaphragm 420 through bonding or printing. The first wire part 4301 of the conductive wire 430 may extend from the coil 440 toward the frame 460.

[0101] In an embodiment, the second wire part 4302 of the conductive wire 430 may extend from the first wire part 4301 toward the yoke 490.

[0102] In an embodiment, the third wire part 4303 of the conductive wire 430 may extend from the second wire part 4302 toward the frame 460.

[0103] In an embodiment, the first wire part 4301, the second wire part 4302, and the third wire part 4303 of the conductive wire 430 may be formed of a flexible material.

[0104] The present disclosure is not limited thereto, and the first wire part 4301 and at least a part of the third wire part 4303 of the conductive wire 430 may be formed of a rigid material. For example, the first wire part 4301 and at least a part of the third wire part 4303 of the conductive wire 430 may be formed of a rigid material. In an embodiment, the third wire part 4303 may include a third-first wire part 43031, a third-second wire part 43032, and a third-third wire part 43033. The third-first wire part 43031 may be a part that extends from the second wire part 4302 toward the frame 460. The third-second wire part 43032 may be a part that extends from the third-first wire part 43031 (e.g., extending in the x-axis direction) and extends toward the frame 460 with a length longer than that of the third-first wire part 43031. The third-third wire part 43033 may be a part that extends from the third-second wire part 43032 (e.g., extending in the x-axis direction) and that is connected to the external electrode.

[0105] In an embodiment, the first wire part 4301 and at least a part of the third wire part 4303 (e.g., third-first wire part 43031 and third-third wire part 43033) of the conductive wire 430 may be formed of a rigid material. For example, the first wire part 4301 and at least a part of the third wire part 4303 (e.g., third-first wire part 43031 and third-third wire part 43033) of the conductive wire 430 may be formed of a rigid material to prevent contact with the magnet (e.g., first magnet 465 and second magnet 470) and / or the conductive plate parts (e.g., first conductive plate part 445 and second conductive plate part 450) due to the vibration of the diaphragm 420. For example, the first wire part 4301 and at least a part of the third wire part 4303 (e.g., third-first wire part 43031 and third-third wire part 43033) of the conductive wire 430 may be an area that is coupled (or fixed) with at least a partial area of the diaphragm 420 (e.g., coupled by bonding or printing), and accordingly, may be formed of a rigid material. The present disclosure is not limited thereto, and the first wire part 4301 and at least a part of the third wire part 4303 (e.g., third-first wire part 43031 and third-third wire part 43033) of the conductive wire 430 may also be formed of a flexible material.

[0106] In an embodiment, at least another part of the second wire part 4302 and third wire part 4303 (e.g., third-second wire part 43032) of the conductive wire 430 may be formed of a flexible material. For example, at least another part of the second wire part 4302 and third wire part 4303 (e.g., third-second wire part 43032) may be an area that is not coupled (or fixed) with at least a partial area of the diaphragm 420, and accordingly, may be formed of a flexible material. It may be advantageous in the design and manufacturing process to configure at least another part of the second wire part 4302 and third wire part 4303 (e.g., third-second wire part 43032) of the conductive wire 430, which is an area that is not coupled (or fixed) with at least a partial area of the diaphragm 420 using a flexible material.

[0107] In an embodiment, the peripheral area of the diaphragm 420 (e.g., surround 410) may include the protruding area 615 that protrudes toward the yoke 490. At least a part of the second wire part 4302 of the conductive wire 430 may be located opposite to the frame 460 with reference to the protruding area 615. In an embodiment, at least a part of the third wire part 4303 of the conductive wire 430 may be formed below the protruding area 615.

[0108] In the above-described FIG. 6A and FIG. 6B according to various embodiments, it has been described that the second wire part 4302 of the conductive wire 430 extends from the first wire part 4301 toward the yoke 490, and the third wire part 4303 of the conductive wire 430 extends from the second wire part 4302 toward the frame 460. However, the present disclosure is not limited thereto.

[0109] Specifically, in an embodiment the first wire part (4301) extends from the coil (440) toward the frame (460). Further, the second wire part (4302) extends, toward the yoke (490), from an end (4301a) of the first wire part (4301) distant from the coil (440). Lastly, the third wire part (4303) extends, toward the frame (460), from an end (4302a) of the second wire part (4302) distant from the first wire part (4301).

[0110] For example, with reference to FIG. 6B and FIG. 6C, the second wire part 4302 of the conductive wire 430 may extend in a direction substantially parallel to one lateral surface of the second magnet 470 that the second wire part 4302 faces (e.g., y-axis direction), and may include an extension part 43021 that includes a part formed lower than a height of a lowest point of the protruding area 615 of the surround 410. In this case, the third wire part 4303 may extend from the extension part 43021 toward the frame 460 (e.g., extending in the x-axis direction).

[0111] Through the space between the protruding area of the surround 410 of the diaphragm 420 and the frame 460, which is the external space of the second magnet 470, according to an embodiment, the conductive wire 430 (e.g., first wire part 4301, second wire part 4302, and third wire part 4303) may be used to electrically connect the coil 440 and the external electrode without interfering with the movement of the diaphragm 420. Accordingly, this may contribute to the slimming down of the speaker module 400. In addition, by including the first magnet 465 and the second magnet 470, which is disposed in a manner that substantially surrounds the first magnet 465, the magnetic field efficiency is increased, thereby improving the acoustic performance of the speaker module 400.

[0112] FIG. 7 is a view for describing an effective area of the diaphragm 420 of the speaker module 400 according to an embodiment of the present disclosure.

[0113] As seen in FIG. 4, FIG. 5, and FIG. 6A according to various embodiments, the conductive wire (e.g., conductive wire 430 in FIG. 4) may electrically connect the coil (e.g., coil 440 in FIG. 4) and the external electrode (e.g., electrode disposed outside the speaker module 400). For example, the conductive wire 430 may connect the coil 440 and the external electrode through the space between the protruding area of the surround (e.g., surround 410 in FIG. 4), which is formed to protrude in the second direction (e.g., -z-axis direction) along the edge of the diaphragm (e.g., diaphragm 420 in FIG. 4), and the frame (e.g., frame 460 in FIG. 4), which is the external space of the second magnet (e.g., second magnet 470 in FIG. 4). However, the present disclosure is not limited thereto.

[0114] With reference to FIG. 7 according to an embodiment, at least a partial area of the center cap (e.g., center cap 415 in FIG. 4) of the diaphragm 420 that is coupled with at least a part of the conductive wire 430 (e.g., first wire part 4301 of the conductive wire 430 in FIG. 6A) may be at least a partial area of an effective area 710 of the diaphragm 420. In an embodiment, at least another part of the conductive wire 430 (e.g., second wire part 4302, third wire part 4303) may be bent in the second direction (e.g., -z-axis direction) and third direction (e.g., x-axis direction) by a designated length from one end of at least a partial area of the effective area 710 of the diaphragm 420, and may be electrically connected to the external electrode.

[0115] FIG. 8 is a view for describing the first conductive plate part 445 and / or second conductive plate part 450 of the speaker module 400 according to an embodiment of the present disclosure.

[0116] In an embodiment, the first conductive plate part (e.g., first conductive plate part 445 in FIG. 4) and / or second conductive plate part (e.g., second conductive plate part 450 in FIG. 4) may include a step for increasing the magnetic field efficiency (or magnetic field density).

[0117] With reference to FIG. 8, the first conductive plate part 445 and / or second conductive plate part 450 may be formed of a material through which a magnetic force effectively passes. For example, a material through which a magnetic force effectively passes may include a cobalt alloy (FeCo). However, the present disclosure is not limited thereto.

[0118] In an embodiment, the first conductive plate part 445 and / or second conductive plate part 450 may include a step. For example, as illustrated in reference numeral <810> in FIG. 8, the first conductive plate part 445 may include a first step 815 formed along the outer circumferential surface of the first conductive plate part 445 (e.g., formed at the outer edge area). In another example, as illustrated in reference numeral <850> in FIG. 8, the second conductive plate part 450 may include a second step 855 formed along the inner circumferential surface of the second conductive plate part 450 (e.g., formed at the inner edge area).

[0119] In an embodiment, the first conductive plate part 445 including the first step 815 and / or the second conductive plate part 450 including the second step 855, may contribute to improving the efficiency of the magnetic flux lines generated by the interaction with the coil 440 to reduce the degradation of the output characteristics (e.g., sound pressure level) of the speaker module 400 or the efficiency of the magnetic field of the magnetic circuit (e.g., first conductive plate part 445, second conductive plate part 450, first magnet 465, second magnet 470, and yoke 490).

[0120] In FIG. 8 according to various embodiments, it has been described that the first conductive plate part 445 and / or second conductive plate part 450 includes a step (e.g., first step 815 and / or second step 855). However, the present disclosure is not limited thereto. For example, the first magnet (e.g., first magnet 465 in FIG. 4) and / or the second magnet (e.g., second magnet 470 in FIG. 4) of the speaker module 400 may also include a step to improve the magnetic field efficiency (or magnetic field density). In this regard, various embodiments will be described in FIG. 9, which will be described below.

[0121] FIG. 9 is a view for describing the first magnet 465 and / or second magnet 470 of the speaker module 400 according to an embodiment of the present disclosure.

[0122] With reference to FIG. 9, the first magnet 465 may be disposed in the central area of the speaker module 400 when viewed from the rear surface of the speaker module (e.g., speaker module 400 in FIG. 4) (e.g., surface facing the -z-axis). The second magnet 470 may substantially surround the first magnet 465 and be disposed to be spaced apart from the first magnet 465. For example, the second magnet 470 may have a closed-loop structure or an annular structure. For example, the second magnet 470 may have a closed-loop structure or an annular structure, and may have a shape that is circular, square, elliptical, or track-shaped.

[0123] In an embodiment, when viewed from the rear surface of the speaker module 400 (e.g., surface facing the -z-axis), the coil (e.g., coil 440 in FIG. 4) may be in a form disposed, at least partially, in the spaced area 440A between the first magnet 465 and the second magnet 470.

[0124] In an embodiment, the first magnet 465 and the second magnet 470 may be mounted on the yoke (e.g., yoke 490 in FIG. 4). The first magnet 465 and the second magnet 470 may form a magnetic field that causes the coil 440 to vibrate vertically.

[0125] In an embodiment, the first magnet 465 and / or second magnet 470 may include a step to improve the magnetic field efficiency (or magnetic field density).

[0126] For example, as illustrated in reference numeral <910> in FIG. 9, the first magnet 465 may include a protruding area 4655 formed in the central area of the first magnet 465. In this case, the first conductive plate part 445, which is disposed to correspond to the first magnet 465, may include an opening 4455 formed to correspond to the protruding area 4655 formed in the central area of the first magnet 465.

[0127] For example, as illustrated in reference numeral <950> in FIG. 9, the second magnet 470 may include a step 4705 formed along the outer circumferential surface of the second magnet 470. In this case, the second conductive plate part 450, which is disposed to correspond to the second magnet 470, may be formed to be disposed on one surface of the second magnet 470 (e.g., one surface having a height lower than the height of the step 4705 formed along the outer circumferential surface of the second magnet 470).

[0128] In an embodiment, the first magnet 465 including the protruding area 4655 and / or the second magnet 470 including the step 4705, may contribute to improving the efficiency of the magnetic flux lines generated by the interaction with the coil 440 to reduce the degradation of the output characteristics (e.g., sound pressure level) of the speaker module 400 or the efficiency of the magnetic field of the magnetic circuit (e.g., first conductive plate part 445, second conductive plate part 450, first magnet 465, second magnet 470, and yoke 490).

[0129] FIG. 10 is a cross-sectional view schematically illustrating the configuration of the speaker module 400 according to an embodiment of the present disclosure.

[0130] With reference to FIG. 10, reference numerals <1010> and <1050> in FIG. 10 are views of the speaker module (e.g., speaker module 400 in FIG. 4) as viewed from the lateral surface (e.g., surface facing the y-axis).

[0131] In an embodiment, the speaker module 400 may include the frame 460, diaphragm 420, conductive wire 430, coil 440, first conductive plate part 445, second conductive plate part 450, first magnet 465, second magnet 470, and / or yoke 490. Although not illustrated, the speaker module 400 may further include a conductive wire (e.g., conductive wire 430 in FIG. 4) and an air vent (not illustrated).

[0132] In an embodiment, the yoke 490 may configure one surface of the speaker module 400 (e.g., surface facing the -z-axis). In an embodiment, the yoke 490 may fix the first magnet 465 and the second magnet 470. For example, the yoke 490 may be made of a material through which a magnetic force effectively passes, such as a cobalt alloy (FeCo).

[0133] In an embodiment, the first magnet 465 may be disposed in the central area of the speaker module 400. The second magnet 470 may substantially surround the first magnet 465 and be disposed to be spaced apart from the first magnet 465. For example, the second magnet 470 may have a closed-loop structure or an annular structure.

[0134] In an embodiment, the first conductive plate part 445 may be disposed in a position corresponding to the first magnet 465 in the first direction (e.g., direction facing the z-axis). The second conductive plate part 450 may be disposed in a position corresponding to the second magnet 470 in the first direction (e.g., direction facing the z-axis). The second conductive plate part 450 may substantially surround the first conductive plate part 445 and be disposed to be spaced apart from the first conductive plate part 445. In an embodiment, the second conductive plate part 450 may be made of a material through which a magnetic force effectively passes, such as a cobalt alloy (FeCo).

[0135] In an embodiment, the coil 440 may be disposed on the inner surface of the diaphragm 420. In an embodiment, the coil 440 may vibrate the diaphragm 420 by an electrical signal applied from the outside. In an embodiment, the coil 440 is configured to vibrate in a direction perpendicular to a plane of the diaphragm 420 wherein during the vibrations the coil may at least partially enter the space 440A defined between the first magnet 465 and the second magnet 470. This arrangement also facilitates a slimmer speaker module 400. As described above, when not producing sound, the coil 440 may already be at least partially positioned in the space 440A. In such a case, when producing sound the extent, to which the coil 440 is positioned in the space 440A, changes.

[0136] In an embodiment, the diaphragm 420 may include the surround 410 and the center cap 415. For example, the center cap 415 may be disposed in a position corresponding to the coil 440 in the first direction (e.g., direction facing the z-axis). The center cap 415 may contribute to determining the directionality of the sound waves. The surround 410 may be adjacent to an edge of the diaphragm 420, and may be formed along the edge. In an embodiment, the surround 410 may include a protruding area (e.g., protruding area 615 in FIG. 6A) formed along the edge of the diaphragm 420, protruding in the second direction (e.g., -z-axis direction).

[0137] In an embodiment, although not illustrated, the conductive wire 430 may electrically connect the coil 440 and the external electrode (e.g., electrode disposed outside the speaker module 400). For example, the conductive wire 430 may electrically connect the coil 440 and the external electrode through the space between the protruding area 615 of the surround 410 of the diaphragm 420 and the frame 460, which is the external space of the second magnet 470.

[0138] In an embodiment, the first conductive plate part 445, second conductive plate part 450, first magnet 465, second magnet 470, and yoke 490 of the speaker module 400 may configure the magnetic circuit of the speaker module 400. For example, the first conductive plate part 445, second conductive plate part 450, first magnet 465, second magnet 470, and yoke 490 may configure the magnetic circuit of the speaker module 400, serving to maximize the magnetic field density at the position where the coil 440 is disposed.

[0139] In FIG. 4 according to various embodiments, among the constituent elements configuring the magnetic circuit of the speaker module 400, it has been described that the first conductive plate part 445, first magnet 465, and yoke 490, may be configured to not be ventilated to the outside. However, the present disclosure is not limited thereto. For example, as illustrated in reference numeral <1010> in FIG. 10, some portions of the first magnet 465 and some portions 1015 of the first conductive plate part 445, among the constituent elements that constitute the magnetic circuit of the speaker module 400, may be in a removed form. In this case, the inside of the speaker module 400 may not be ventilated with the outside by the yoke 490. In another example, as illustrated in reference numeral <1050> in FIG. 10, only a portion 1055 of the first conductive plate part 445, among the constituent elements that constitute the magnetic circuit of the speaker module 400, may be in a removed form. In this case, the inside of the speaker module 400 may not be ventilated with the outside by the first magnet 465 and the yoke 490.

[0140] FIG. 11 is a view for describing the second conductive plate part 450 of the speaker module 400 according to an embodiment of the present disclosure.

[0141] In FIG. 4 to FIG. 10 according to various embodiments, it has been described that the second conductive plate part (e.g., second conductive plate part 450 in FIG. 4) has a closed-loop structure or an annular structure. However, the present disclosure is not limited thereto.

[0142] For example, with reference to FIG. 11, the second conductive plate part 450 may be composed of two or more conductive plate parts. For example, the speaker module (e.g., speaker module 400 in FIG. 4) may include two or more plates, such as a second-first conductive plate part 4501 and a second-second conductive plate part 4503. The second-first conductive plate part 4501 and the second-second conductive plate part 4503 may be disposed to be spaced apart with a space 1105 and 1110 therebetween.

[0143] FIG. 12 is a graph comparing the output of the speaker module 400 according to an embodiment of the present disclosure.

[0144] With reference to FIG. 12, the x-axis may represent the frequency range in Hz (1205), and the y-axis may represent the sound pressure level (SPL) in dB (1210).

[0145] In an embodiment, the graph 1215 represents the sound pressure level (SPL) of a general speaker module, and the graph 1220 represents the sound pressure level (SPL) of the speaker module (e.g., speaker module 400 in FIG. 4) according to an embodiment of the present disclosure.

[0146] As seen in FIG. 4 to FIG. 11 described above, the speaker module 400 according to an embodiment may use the conductive wire (e.g., conductive wire 430 in FIG. 4) to form a path that electrically connects the coil (e.g., coil 440 in FIG. 4) and the external electrode (e.g., an electrode disposed outside the speaker module 400) through the space between the surround (e.g., surround 410 in FIG. 4) (e.g., the protruding area (e.g., protruding area 615 in FIG. 6A) of the surround 410) and the frame (e.g., frame 460 in FIG. 4), which is the external space of the second magnet (e.g., second magnet 470 in FIG. 4), thereby contributing to the slimming down of the speaker module 400.

[0147] Even when the speaker module 400 is slimmed down according to an embodiment of the present disclosure, the magnetic field efficiency may be improved by including the first magnet 465 and the second magnet 470. Accordingly, as illustrated in the graph 1220 in FIG. 12, compared to the graph 1215, the output characteristics (e.g., sound pressure level) of the speaker module 400 may be increased (e.g., the sound pressure level may rise by approximately 1 dB).

[0148] The speaker module 400 according to a particular embodiment of this paragraph of the present disclosure includes the yoke 490 that configures one surface of the speaker module 400. The speaker module 400 further includes the diaphragm 420 that configures another surface of the speaker module 400. The speaker module 400 further includes the frame 460 that configures the lateral surface of the speaker module 400. The speaker module 400 further includes the first magnet 465 disposed between the yoke 490 and the diaphragm 420. The speaker module 400 further includes the second magnet 470 that substantially surrounds the first magnet 465 and is disposed to be spaced apart from the first magnet 465. The speaker module 400 further includes the coil 440 attached to the area of the diaphragm 420 that substantially corresponds to the space between the first magnet 465 and the second magnet 470. The speaker module 400 further includes the conductive wire 430 for providing power to the coil 440. The conductive wire 430 includes the first wire part 4301 that extends from the coil 440 toward the frame 460. The conductive wire 430 further includes the second wire part 4302 that extends from the first wire part 4301 toward the yoke 490. The conductive wire 430 further includes the third wire part 4303 that extends from the second wire part 4302 toward the frame 460.

[0149] The first wire part 4301, the second wire part 4302, and the third wire part 4303 of the conductive wire 430 according to an embodiment may be formed of a flexible material.

[0150] The first wire part 4301 and at least a part of the third wire part 4303 (e.g., 43031, 43033) of the conductive wire 430 according to an embodiment may be formed of either a rigid material or a flexible material. The second wire part 4302 and at least of another part of the third wire part 4303 (e.g., 43032) of the conductive wire 430 according to an embodiment may be formed of a flexible material.

[0151] The peripheral area of the diaphragm 420 according to an embodiment may include the protruding area 615 that protrudes toward the yoke 490. At least a part of the second wire part 4302 of the conductive wire 430 according to an embodiment may be located opposite to the frame 460 with reference to the protruding area 615.

[0152] At least a part of the third wire part 4303 of the conductive wire 430 according to an embodiment may be formed below the protruding area 615.

[0153] The second wire part 4302 of the conductive wire 430 according to an embodiment may extend in a direction substantially parallel to one lateral surface of the second magnet 470 that the second wire part 4302 faces, and may include the extension part 43021 that includes a part formed lower than a height of a lowest point of the protruding area 615. The third wire part 4303 of the conductive wire 430 according to an embodiment may extend from the extension part 43021 of the second wire part 4302 toward the frame 460.

[0154] The speaker module 400 according to an embodiment may include the first conductive plate part 445 disposed on one surface of the first magnet 465 that is opposite to the yoke 490. The speaker module 400 according to an embodiment may include the second conductive plate part 450, which surrounds the first conductive plate part 445 and is disposed on one surface of the second magnet 470 that is opposite to the yoke 490.

[0155] The first conductive plate part 445 and the second conductive plate part 450 according to an embodiment may be spaced apart.

[0156] At least one of the first conductive plate part 445 or the second conductive plate part 450 according to an embodiment may include a step 815 or 855 formed at the edge area of at least one of the first conductive plate part 445 or the second conductive plate part 450.

[0157] The second magnet 470 according to an embodiment may have a closed-loop shape.

[0158] The first magnet 465 according to an embodiment may include the protruding area 4655 formed in the central area of the first magnet 465.

[0159] The second magnet 470 according to an embodiment may include the step 4705 formed along the edge area of the second magnet 470.

[0160] The electronic device 101 or 200 according to a particular embodiment of this paragraph of the present disclosure includes the housing 210 and the speaker module 400 accommodated in the housing 210. The speaker module 400 further includes the yoke 490 that configures one surface of the speaker module 400. The speaker module 400 further includes the diaphragm 420 that configures another surface of the speaker module 400. The speaker module 400 further includes the frame 460 that configures the lateral surface of the speaker module 400. The speaker module 400further includes the first magnet 465 disposed between the yoke 490 and the diaphragm 420. The speaker module 400 further includes the second magnet 470 that substantially surrounds the first magnet 465 and is disposed to be spaced apart from the first magnet 465. The speaker module 400 further includes the coil 440 attached to the area of the diaphragm 420 that substantially corresponds to the space between the first magnet 465 and the second magnet 470. The speaker module 400 further includes the conductive wire 430 for providing power to the coil 440. The conductive wire 430 includes the first wire part 4301 that extends from the coil 440 toward the frame 460. The conductive wire 430 further includes the second wire part 4302 that extends from the first wire part 4301 toward the yoke 490. The conductive wire 430 further includes the third wire part 4303 that extends from the second wire part 4302 toward the frame 460.

[0161] The first wire part 4301, the second wire part 4302, and the third wire part 4303 of the conductive wire 430 according to an embodiment may be formed of a flexible material.

[0162] The first wire part 4301 and at least a part of the third wire part 4303 (e.g., 43031, 43033) of the conductive wire 430 according to an embodiment may be formed of either a rigid material or a flexible material. The second wire part 4302 and at least another part of the third wire part 4303 (e.g., 43032) of the conductive wire 430 according to an embodiment may be formed of a flexible material.

[0163] The peripheral area of the diaphragm 420 according to an embodiment may include the protruding area 615 that protrudes toward the yoke 490. At least a part of the second wire part 4302 of the conductive wire 430 according to an embodiment may be located opposite to the frame 460 with reference to the protruding area 615.

[0164] At least a part of the third wire part 4303 of the conductive wire 430 according to an embodiment may be formed below the protruding area 615.

[0165] The second wire part 4302 of the conductive wire 430 according to an embodiment may include the extension part 43021 that extends in a direction substantially parallel to one lateral surface of the second magnet 470 facing the second wire part 4302, and includes a part formed lower than the height of a lowest point of the protruding area 615. The third wire part 4303 of the conductive wire 430 according to an embodiment may extend from the extension part 43021 of the second wire part 4302 toward the frame 460.

[0166] The speaker module 400 according to an embodiment may include the first conductive plate part 445 disposed on one surface of the first magnet 465 that is opposite to the yoke 490. The speaker module 400 according to an embodiment may include the second conductive plate part 450, which surrounds the first conductive plate part 445 and is disposed on one surface of the second magnet 470 that is opposite to the yoke 490.

[0167] The first conductive plate part 445 and the second conductive plate part 450 according to an embodiment may be spaced apart.

[0168] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic devices may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment of the disclosure, the electronic devices are not limited to those described above.

[0169] It should be appreciated that various embodiments of the disclosure and the terms used therein are not intended to limit the technological features set forth herein to particular embodiments and include various changes, equivalents, or replacements for a corresponding embodiment. With regard to the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It is to be understood that a singular form of a noun corresponding to an item may include one or more of the things, unless the relevant context clearly indicates otherwise. As used herein, each of such phrases as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C," may include any one of, or all possible combinations of the items enumerated together in a corresponding one of the phrases. As used herein, such terms as "1st" and "2nd," or "first" and "second" may be used to simply distinguish a corresponding component from another, and does not limit the components in other aspect (e.g., importance or order). It is to be understood that if an element (e.g., a first element) is referred to, with or without the term "operatively" or "communicatively," as "coupled with," "coupled to," "connected with," or "connected to" another element (e.g., a second element), it means that the element may be coupled with the other element directly (e.g., through wires), wirelessly, or via a third element.

[0170] As used in connection with various embodiments of the disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may interchangeably be used with other terms, for example, "logic," "logic block," "part," or "circuitry." A module may be a single integral component, or a minimum unit or part thereof, adapted to perform one or more functions. For example, according to an embodiment, the module may be implemented in a form of an application-specific integrated circuit (ASIC).

[0171] Various embodiments as set forth herein may be implemented as software (e.g., the program 140) including one or more instructions that are stored in a storage medium (e.g., internal memory 136 or external memory 138) that is readable by a machine (e.g., the electronic device 101). For example, a processor (e.g., the processor 120) of the machine (e.g., the electronic device 101) may invoke at least one of the one or more instructions stored in the storage medium, and execute it, with or without using one or more other components under the control of the processor. This allows the machine to be operated to perform at least one function according to the at least one instruction invoked. The one or more instructions may include a code generated by a complier or a code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Wherein, the term "non-transitory" simply means that the storage medium is a tangible device, and does not include a signal (e.g., an electromagnetic wave), but this term does not differentiate between where data is semi-permanently stored in the storage medium and where the data is temporarily stored in the storage medium.

[0172] According to an embodiment, a method according to various embodiments of the disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded) online via an application store (e.g., PlayStore ™< ), or between two user devices (e.g., smart phones) directly. If distributed online, at least part of the computer program product may be temporarily generated or at least temporarily stored in the machine-readable storage medium, such as memory of the manufacturer's server, a server of the application store, or a relay server.

[0173] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) may be integrated into a single component. In such a case, according to various embodiments, the integrated component may still perform one or more functions of each of the plurality of components in the same or similar manner as they are performed by a corresponding one of the plurality of components before the integration. According to various embodiments, operations performed by the module, the program, or another component may be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order or omitted, or one or more other operations may be added.

Claims

1. A speaker module (400) comprising: a yoke (490) configuring one surface of the speaker module (400); a diaphragm (420) configuring another surface of the speaker module (400) opposite the one surface of the speaker module (400); a frame (460) configuring a lateral surface of the speaker module (400) and being positioned between the one surface and the another surface; a first magnet (465) disposed between the yoke (490) and the diaphragm (420); a second magnet (470) substantially surrounding the first magnet (465) and spaced apart from the first magnet (465); a coil (440) attached to an area of the diaphragm (420), the area substantially corresponding to a space between the first magnet (465) and the second magnet (470); and a conductive wire (430) configured to provide power to the coil (440), wherein the conductive wire (430) comprises: a first wire part (4301) extending from the coil (440) toward the frame (460); a second wire part (4302) extending toward the yoke (490) from an end (4301a) of the first wire part (4301); and a third wire part (4303) extending toward the frame (460) from an end (4302a) of the second wire part (4302).

2. The speaker module (400) of claim 1, wherein the first wire part (4301), the second wire part (4302), and the third wire part (4303) are formed of a flexible material.

3. The speaker module (400) of claim 1, wherein the first wire part (4301) and at least a part (43031, 43033) of the third wire part (4303) are formed of a rigid material or a flexible material, and wherein the second wire part (4302) and at least another part (43032) of the third wire part (4303) are formed of a flexible material.

4. The speaker module (400) of any one of claims 1 to 3, wherein a peripheral area of the diaphragm (420) comprises a protruding area (615) protruding toward the yoke (490), and wherein at least a part of the second wire part (4302) is located opposite to the frame (460) with reference to the protruding area (615).

5. The speaker module (400) of claim 4, wherein at least a part of the third wire part (4303) is disposed below the protruding area (615).

6. The speaker module (400) of claim 4, wherein the second wire part (4302) comprises an extension part extending in a direction substantially parallel to one lateral surface of the second magnet (470) facing the second wire part (4302), the extension part comprising a part formed to have a height lower than the height of the lowest point of the protruding area (615), and wherein the third wire part (4303) extends from the extension part toward the frame (460).

7. The speaker module (400) of any one of claims 1 to 6, further comprising: a first conductive plate part (445) disposed on one surface of the first magnet (465), the one surface of the first magnet being opposite to the yoke (490); and a second conductive plate part (450) surrounding the first conductive plate part (445) and disposed on one surface of the second magnet (470), the one surface of the second magnet being opposite to the yoke (490), wherein the first conductive plate part (445) and the second conductive plate part (450) are spaced apart from each other, and wherein at least one of the first conductive plate part (445) or the second conductive plate part (450) comprises a step (815, 855) disposed in an edge area of the at least one of the first conductive plate part (445) or the second conductive plate part (450).

8. The speaker module (400) of any one of claims 1 to 7, wherein the first magnet (465) comprises a protruding area (4655) disposed in a central area of the first magnet (465), wherein the second magnet (470) comprises a step (4705) disposed along an edge area of the second magnet (470), and wherein the second magnet (470) has a closed loop shape.

9. An electronic device (101, 200) comprising: a housing (210); and a speaker module (400) accommodated in the housing (210), wherein the speaker module (400) comprises: a yoke (490) configuring one surface of the speaker module (400); a diaphragm (420) configuring another surface of the speaker module (400) opposite the one surface of the speaker module (400); a frame (460) configuring a lateral surface of the speaker module (400) and being positioned between the one surface and the another surface; a first magnet (465) disposed between the yoke (490) and the diaphragm (420); a second magnet (470) substantially surrounding the first magnet (465) and spaced apart from the first magnet (465); a coil (440) attached to an area of the diaphragm (420), the area substantially corresponding to a space between the first magnet (465) and the second magnet (470); and a conductive wire (430) configured to provide power to the coil (440), wherein the conductive wire (430) comprises: a first wire part (4301) extending from the coil (440) toward the frame (460); a second wire part (4302) extending toward the yoke (490) from an end (4301a) of the first wire part (4301); and a third wire part (4303) extending toward the frame (460) from an end (4302a) of the second wire part (4302).

10. The electronic device (101, 200) of claim 9, wherein the first wire part (4301), the second wire part (4302), and the third wire part (4303) are formed of a flexible material.

11. The electronic device (101, 200) of claim 9, wherein the first wire part (4301) and at least a part (43031, 43033) of the third wire part (4303) are formed of a rigid material or a flexible material, and wherein the second wire part (4302) and at least another part (43032) of the third wire part (4303) are formed of a flexible material.

12. The electronic device (101, 200) of claim 9, wherein a peripheral area of the diaphragm (420) comprises a protruding area (615) protruding toward the yoke (490), and wherein at least a part of the second wire part (4302) is located opposite to the frame (460) with reference to the protruding area (615).

13. The electronic device (101, 200) of claim 12, wherein at least a part of the third wire part (4303) is disposed below the protruding area (615).

14. The electronic device (101, 200) of claim 12, wherein the second wire part (4302) comprises an extension part extending in a direction substantially parallel to one lateral surface of the second magnet (470) facing the second wire part (4302), the extension part comprising a part formed to have a height lower than the height of the lowest point of the protruding area (615), and wherein the third wire part (4303) extends from the extension part toward the frame (460).

15. The electronic device (101, 200) of claim 9, further comprising: a first conductive plate part (445) disposed on one surface of the first magnet (465), the one surface of the first magnet being opposite to the yoke (490); and a second conductive plate part (450) surrounding the first conductive plate part (445) and disposed on one surface of the second magnet (470), the one surface of the second magnet being opposite to the yoke (490), wherein the first conductive plate part (445) and the second conductive plate part (450) are spaced apart from each other.

Images