Radio-frequency electronic device

Abstract

The present description relates to an electronic device (507) comprising: - at least one first radio-frequency transition terminal (119b) intended to receive a radio-frequency signal (SIG); and – at least one capacitive or inductive element (517) connected to a second radio-frequency transition terminal (119a), the first and second radio-frequency transition terminals being intended to be placed in contact with an outer face of a metal enclosure (101).

Description

DESCRIPTION Radiofrequency electronic device This application is based on, and claims priority from, French patent application 2304315 filed on April 28, 2023 and entitled “Radiofrequency electronic device”, which is considered an integral part of this description to the extent permitted by law. Technical field

[0001] This description relates generally to electronic devices, and more particularly to radiofrequency electronic devices. Prior art

[0002] Radiofrequency electronic devices capable of powering and / or communicating remotely with other electronic devices have been proposed. However, existing radiofrequency electronic devices suffer from various drawbacks. In particular, when a transmitting device is used to produce a radiofrequency electromagnetic field intended to power and / or communicate with a receiving device located inside a metal enclosure, the radiofrequency electromagnetic field produced by the transmitting device is subject to constraints due to the existence of natural excitation modes imposed by the dimensions and geometry of the enclosure. This results in undesirable phenomena, such as a reduction in bandwidth and the occurrence of local drops in field intensity, impairing the power supply of the receiving device by the transmitting device and / or remote communication between these devices.

[0003] In order to overcome these drawbacks, it has been proposed to act on the natural modes of a metal enclosure by modifying its geometry using parasitic elements placed inside the metal enclosure. However, such a modification of the internal geometry of the metal enclosure may prove difficult, or even impossible, to implement, in particular due to layout constraints tending to limit the number of possible locations for arranging the parasitic elements inside the metal enclosure, and also has the disadvantage of only being optimized for a very restricted range of transmission frequencies.

[0004] Alternatively, another strategy is to choose the dimensions of the metal enclosure so that several natural excitation modes can be established within the enclosure at the desired transmission frequency. Transmitters are then distributed within the enclosure and controlled, for example incoherently, in order to establish the field at the desired frequency. However, this has the disadvantage of having to fix the dimensions of the metal enclosure as a function of the frequency. This also requires that the transmitters be integrated within the enclosure, which can be difficult or even impossible due to the ambient conditions (pressure, temperature, humidity, etc.) prevailing within the enclosure. Summary of the invention

[0005] It would be desirable to overcome the disadvantages of existing radiofrequency electronic devices. In particular, there is a need to improve devices designed to emit a field inside a metal enclosure.

[0006] For this, one embodiment provides an electronic device comprising: - a power divider circuit comprising an input intended to receive a radiofrequency signal; - at least one first radiofrequency transition terminal connected to a first output of the power divider circuit; and - at least one phase shifter circuit connecting a second output of the power divider circuit to a second radiofrequency transition terminal, the first and second radiofrequency transition terminals being intended to be placed in contact with an external face of a metal enclosure.

[0007] According to one embodiment, each phase shifter circuit comprises a delay line.

[0008] According to one embodiment, the delay line comprises a microstrip line.

[0009] According to one embodiment, the input of the power divider circuit is connected to a coaxial connector.

[0010] According to one embodiment, the power divider circuit is a Wilkinson divider.

[0011] According to one embodiment, the power divider circuit, the phase shifter circuit and the first and second radio frequency transition terminals are formed in a same metallization level of a printed circuit board.

[0012] One embodiment provides a system comprising: - a metal enclosure; - at least one first electronic device arranged inside the metal enclosure; and - at least one second device as described.

[0013] According to one embodiment, the metal enclosure comprises a cover closing a tank.

[0014] According to one embodiment, the radiofrequency transition terminals are in contact with the cover of the enclosure

[0015] According to one embodiment, each first device is a sensor, preferably a temperature sensor.

[0016] According to one embodiment, each first device is an energy receiver.

[0017] According to one embodiment, each first device comprises an antenna and a surface acoustic wave sensor.

[0018] According to one embodiment, the system comprises a single second device.

[0019] Furthermore, one embodiment provides an electronic device comprising: - at least one first radiofrequency transition terminal intended to receive a radiofrequency signal; and - at least one capacitive or inductive element connected to a second radiofrequency transition terminal, the first and second radiofrequency transition terminals being intended to be placed in contact with an external face of a metal enclosure.

[0020] According to one embodiment, said at least one capacitive or inductive element is a single capacitor of variable capacitance.

[0021] According to one embodiment, said at least one capacitive or inductive element is a single variable inductance coil.

[0022] According to one embodiment, said at least one capacitive or inductive element is connected to the second radiofrequency transition terminal by a microstrip line.

[0023] According to one embodiment, the first radio frequency transition terminal is connected to a coaxial connector by a microstrip line.

[0024] According to one embodiment, said at least one capacitive or inductive element and the first and second radiofrequency transition terminals are formed in the same metallization level of a printed circuit board. Brief description of the drawings

[0025] These and other features and advantages will be set forth in detail in the following description of particular embodiments given without limitation in relation to the attached figures, among which:

[0026] Figure 1 is a schematic and partial side and sectional view of an exemplary system comprising radiofrequency electronic devices according to one embodiment;

[0027] Figure 2 is a graph illustrating variations, as a function of a transmission frequency, of a reflection coefficient of the radiofrequency electronic devices of the system of Figure 1;

[0028] Figure 3 is a schematic and partial top view of an example system comprising a radiofrequency electronic device according to one embodiment;

[0029] Figure 4 is a top view, schematic and partial, of the radiofrequency electronic device of the system of Figure 3 according to one embodiment;

[0030] Figure 5 is a schematic and partial side and sectional view of an exemplary system comprising radiofrequency electronic devices according to one embodiment;

[0031] Figure 6 is a graph illustrating variations, as a function of a transmission frequency, of a reflection coefficient of the radiofrequency electronic devices of the system of Figure 5;

[0032] Figure 7 is a schematic and partial top view of an example system comprising a radiofrequency electronic device according to one embodiment;

[0033] Figure 8 is a schematic and partial top view of a portion of the radiofrequency electronic device of the system of Figure 7 according to one embodiment; and

[0034] Figure 9 is a top view, schematic and partial, of another part of the radiofrequency electronic device of the system of Figure 7 according to one embodiment. Description of the embodiments

[0035] The same elements have been designated by the same references in the different figures. In particular, the structural and / or functional elements common to the different embodiments may have the same references and may have identical structural, dimensional and material properties.

[0036] For the sake of clarity, only the steps and elements useful for understanding the described embodiments have been shown and are detailed. In particular, the metal enclosures on which the described radiofrequency electronic devices can be arranged are not detailed, the embodiments of the present description being compatible with all or most of the metal enclosures likely to benefit from the implementation of a radiofrequency electronic device to power and / or communicate with one or more other radiofrequency electronic devices located inside the metal enclosure.

[0037] Unless otherwise specified, when referring to two elements connected together, this means directly connected without intermediate elements other than conductors, and when referring to two elements connected (in English "coupled") together, this means that These two elements can be connected or linked through one or more other elements.

[0038] In the following description, when referring to absolute position qualifiers, such as the terms "front", "back", "top", "bottom", "left", "right", etc., or relative, such as the terms "above", "below", "upper", "lower", etc., or to orientation qualifiers, such as the terms "horizontal", "vertical", etc., reference is made, unless otherwise specified, to the orientation of the figures.

[0039] Unless otherwise specified, the expressions “about”, “approximately”, “substantially”, and “in the order of” mean to within 10%, preferably to within 5%.

[0040] Figure 1 is a schematic and partial side and sectional view of an exemplary system 100 comprising radio frequency electronic devices according to one embodiment.

[0041] In the example shown, the system 100 comprises an enclosure 101 comprising a tank 103 closed, in the upper part, by a cover 105. The tank 103 and the cover 105 thus form a chamber, or cavity, delimited by the walls and the bottom of the tank 103, and by the internal face of the cover 105 (the lower face of the cover 105, in the orientation of FIG. 1). The enclosure 101 of the system 100 is for example essentially made of a conductive material, for example a metal or a conductive metal alloy. The cover 105 may be made of the same material as the tank 103, or of a different material. Although Figure 1 illustrates an example in which the enclosure 101 comprises the tank 103 closed by the cover 105, this example is not limiting, the enclosure 101 of the system 100 being able, more generally, to be produced by means of any elements making it possible to form a cavity, or room, entirely delimited by walls made mainly of a conductive material.

[0042] Although this has not been detailed in Figure 1, the cover 105 is electrically insulated from the tank 103. For example, the cover 105 is separated from the tank 103 by an insulating element, for example a seal made of a dielectric material, interposed between the cover 105 and the tank 103. The tank 103 is for example brought to a reference potential, for example ground.

[0043] In the illustrated example, the system 100 further comprises a radiofrequency electronic device 107 located outside the enclosure 101. The radiofrequency electronic device 107 is for example intended to communicate, by electromagnetic coupling, with one or more other radiofrequency electronic devices 109 located inside the enclosure 101. More specifically, in this example, the radiofrequency electronic device 107 is intended to power the cover 105, so that the cover 105 produces an electromagnetic field inside the enclosure 101 to enable communication with the radiofrequency electronic devices 109.Although Figure 1 illustrates an example in which five radiofrequency electronic devices 109-1, 109-2, 109-3, 109-4 and 109-5 are placed inside the enclosure 101, this example is not limiting, the enclosure 101 being able to contain any number, non-zero, of radiofrequency electronic devices 109 capable of communicating with the radiofrequency electronic device 107 placed outside the enclosure 101.

[0044] In the example illustrated in Figure 1, the radiofrequency electronic devices 109 are secured to a substrate 111. The substrate 111 is for example a wafer or a piece of wafer in and on which the radiofrequency electronic devices 109. In the example shown, the substrate 111 rests on a support 113, for example a heating plate. The support 113 has for example, in side view, a T shape of which one end of the vertical part rests on the bottom of the tank 103 and of which the horizontal part is substantially parallel to the bottom of the tank 103 and to the lower and upper faces of the cover 105. In the example illustrated, the radiofrequency electronic devices 109 are located on the side of a face of the substrate 111 opposite the support 113 (on the side of the upper face of the substrate 111, in the orientation of FIG. 1), the radiofrequency electronic devices 109 being arranged opposite the cover 105 of the enclosure 101.

[0045] For example, the radiofrequency electronic devices 109 of the system 100 are sensors, for example temperature or pressure sensors, intended to be powered by an electromagnetic field EMF produced by the cover 105 excited by the device 107 and to transmit in return, to the device 107, information relating to physical quantities, for example the temperature or the pressure prevailing inside the enclosure 101. In a case where the radiofrequency electronic devices 109 are temperature sensors, this makes it possible, for example, to know the temperature at different locations inside the enclosure 101, for example at different points on the surface of the substrate 111, in order, for example, to make it possible to map the temperature in different zones located inside the enclosure 101.For example, this allows the temperature of the substrate 111 to be monitored in real time while the substrate 111 is heated by the support 113.

[0046] Although not detailed in Figure 1, each radiofrequency electronic device 109 of the system 100 comprises for example, in the case where the devices 109 are sensors, an antenna connected to a surface acoustic wave (SAW) sensor. The acoustic wave sensor of each radiofrequency electronic device 109 has for example a resonance frequency that varies depending on the temperature to which the radiofrequency electronic device 109 is subjected, in the case where the devices 109 are temperature sensors. For example, the resonance frequencies of the devices 109-1, 109-2, 109-3, 109-4 and 109-5 vary around central frequencies f i, f2, fs, f4 and fs, respectively. The central frequencies f i, fs, fs, f4 and fs are for example different from each other, so as to be able to discriminate the signals coming from the different radiofrequency electronic devices 109.

[0047] In the example shown, the radiofrequency electronic device 107 comprises a power divider circuit 115 (DIV) one output of which is connected, via a phase shifter circuit 117 (c|)), to a radiofrequency transition terminal 119a and another output of which is connected to another radiofrequency transition terminal 119b. In the illustrated example, the radiofrequency transition terminals 119a and 119b of the radiofrequency electronic device 107 are on and in contact with an outer face of the enclosure 101. More specifically, in the illustrated example, the terminals 119a and 119b are on and in contact with the outer face of the cover 105 of the enclosure 101 (the upper face of the cover 105, in the orientation of FIG. 1), so as to excite the cover 105 by means of the radiofrequency signals applied by the radiofrequency transition terminals 119a and 119b.

[0048] For example, each radiofrequency transition terminal 119a, 119b is a metal pad having, in top view, a periphery of substantially circular shape. This example is however not limiting, each radiofrequency transition terminal 119a, 119b being able, as a variant, to have any shape.

[0049] The power divider circuit 115 of the device 107 is for example intended to receive a radiofrequency signal SIG, and to retransmit the radiofrequency signal on each of its outputs. The power of the signal on each output of the circuit 115 is for example substantially equal to half the power of the input signal SIG. The radiofrequency signal is then transmitted to the radiofrequency transition terminals 119a and 119b so as to allow the emission of the electromagnetic field EMF by means of the cover 105. In the example shown, the electromagnetic field EMF is produced inside the enclosure 101, for example in the direction of the radiofrequency electronic devices 109.The electromagnetic field EMF makes it possible, for example, to power and communicate with the radiofrequency electronic devices 109, for example to determine the resonance frequency of each device 109 in order to estimate the temperature to which this device 109 is exposed, in the case where the devices 109 are temperature sensors. The SIG signal is, for example, a voltage referenced relative to the potential applied to the tank 103.

[0050] Figure 2 is a graph illustrating variations, as a function of an emission frequency f, of a reflection coefficient Su of the radiofrequency electronic devices 107 and 109 of the system 100 of Figure 1. More specifically, Figure 2 includes a curve 207 illustrating the variations of the reflection coefficient Su of the radiofrequency electronic device 107 as a function of the emission frequency f, and curves 209-1, 209-2, 209-3, 209-4 and 209-5 illustrating the variations of the reflection coefficient Su of the devices radio frequency electronics 109-1, 109-2, 109-3, 109-4 and 109-5, respectively, depending on the transmission frequency f .

[0051] To simplify, Figure 2 illustrates an example in which the reflection coefficient Su of each radiofrequency electronic device 109-1, 109-2, 109-3, 109-4, 109-5 is minimal when the emission frequency f is equal to the center frequency fi, f2, fs, fv fs of the device considered. In other words, Figure 2 illustrates an example in which the resonant frequency, or natural frequency, of each radiofrequency electronic device 109-1, 109-2, 109-3, 109-4, 109-5 is substantially equal to its center frequency. This example is however not limiting, the resonant frequency of each radiofrequency electronic device 109-1, 109-2, 109-3, 109-4, 109-5 can of course be different from its center frequency fi, fs, fs, f fs.For example, the shift of the resonant frequency of a radiofrequency electronic device 109-1, 109-2, 109-3, 109-4, 109-5 relative to its central frequency fi, fs, fs, f fs depends on a temperature difference to which the device 109 is exposed relative to a temperature corresponding to the case where the resonant frequency of the device 109-1, 109-2, 109-3, 109-4, 109-5 is equal to its central frequency fi, f2, fs, f fs- This thus makes it possible to know the temperature to which each device 109 considered is exposed inside the enclosure 101.

[0052] Furthermore, Figure 2 illustrates an example in which the center frequencies fi, f2, fs, f4 and f5 are spaced from each other uniformly. This example is not, however, limiting, the center frequencies fi, f2, fs, f4 and fs can, as a variant, be spaced from each other in any way.

[0053] An advantage of providing, in the radiofrequency electronic device 107, two radiofrequency transition terminals 119a and 119b transmitting signals out of phase with each other is that this makes it possible to broaden the bandwidth of the radiofrequency electromagnetic field EMF produced by the device 107 (curve 207) compared to the bandwidth that would be obtained by using, for example, a single radiofrequency transition terminal (dotted curve 207'), for example, terminal 119b. This makes it possible, for example, to address several devices 109, or a larger number of devices 109.

[0054] An advantage of the radiofrequency electronic device 107 is that it does not require modifications to the geometry of the enclosure 101. This makes it possible to integrate the device 107 into enclosures of various shapes and sizes. Another advantage of the device 107 is that it does not require the integration of elements, in particular one or more radiofrequency field emitters, inside the enclosure 101. This makes it possible to use the device 107 in applications where the devices 109 are exposed to difficult ambient conditions, for example temperatures of the order of several hundred degrees, making it impossible to integrate all or part of the radiofrequency electronic device 107 inside the enclosure.

[0055] For example, the central frequencies fi, f2, fs, f4 and fs are of the order of several hundred megahertz, for example between 800 and 1000 MHz. The frequency band comprising the central frequencies fi, fs, fs, f4 and fs has, for example, a width that is all the greater as the number of devices 109 increases.

[0056] Figure 3 is a partial schematic top view of an exemplary system 300 including the radiofrequency electronic device 107 according to one embodiment. The system 300 of Figure 3 differs from the system 100 of Figure 1 in that, in the system 300 of Figure 3, the radiofrequency electronic device 107 is interposed between the cover 105 and the tank 103 (not shown) of the enclosure 101.

[0057] In the example shown, the cover 105 comprises several access points or ports 301 (five ports 301-1, 301-2, 301-3, 301-4 and 301-5, in the example illustrated in FIG. 3). The radiofrequency transition terminals 119a and 119b of the radiofrequency electronic device 107 are for example arranged so as to be brought into contact with the ports 301-1 and 301-2, respectively. For example, the ports 301 correspond to holes intended to be crossed by fixing means, for example bolts, making it possible to mechanically secure the cover 105 to the tank 103. Insulating elements, not illustrated in FIG. 3, may be provided to provide electrical insulation between the cover 105 and the tank 103.

[0058] In the example shown, the ports 301-1 and 301-2 where the radiofrequency transition terminals 119a and 119b are placed are adjacent. This example is not, however, limiting, the ports 301 receiving the terminals 119a and 119b may, as a variant, be non-adjacent. For example, the ports 301 where the radiofrequency transition terminals 119a and 119b are placed are chosen from results obtained using digital simulation tools, depending for example on the geometry of the enclosure 101, the number of ports 301 available, the frequency of the field, etc., for example so as to obtain the widest possible bandwidth.

[0059] Figure 4 is a schematic and partial top view of the radiofrequency electronic device 107 of the system 300 of Figure 3 according to one embodiment.

[0060] In the example shown, the power divider circuit 115 is a Wilkinson divider comprising an input terminal connected to the input of the radiofrequency electronic device 107. In the example shown, the input of the device 107 comprises a connector 401, for example a coaxial connector, for example of the SMA (SubMiniature version A) type, intended to receive the SIG signal. The power divider circuit 115 comprises two conductive tracks connected to the connector 401 and a resistive element 403, for example a resistor, connecting the two conductive tracks in the vicinity of the outputs of the circuit 115. For example, the resistive element 403 has a resistance of the order of 100 Ω.

[0061] In the example shown, the outputs of the power divider circuit 115 are connected to the radiofrequency transition terminals 119a and 119b by conductive tracks of different lengths. The phase shifter circuit 117 thus comprises, for example, a delay line. More specifically, in the example illustrated in FIG. 4, the radiofrequency transition terminal 119a is connected to an output of the power divider circuit 115 by a conductive track 405a having a length greater than another conductive track 405b connecting the radiofrequency transition terminal 119b to the other output of the power divider circuit 115. For example, the difference in length between the tracks 405a and 405b is such that the signal transmitted to the radiofrequency transition terminal 119a is phase shifted by approximately 90° relative to the signal transmitted to the radiofrequency transition terminal 119b. This example is not, however, exhaustive, the respective lengths of the tracks conductive 405a and 405b which can be chosen to obtain any phase shift between the signals applied to the radiofrequency transition terminals 119a and 119b, the phase shift between these signals being able for example to be determined by means of digital simulation tools so as to maximize the width of the bandwidth of the EMF field produced by the device 107.

[0062] For example, the power divider circuit 115, the phase shifter circuit 117, the conductive traces 405a and 405b, and the radio frequency transition terminals 119a and 119b are formed in one metallization level of a printed circuit board. The conductive traces 405a and 405b are, for example, part of microstrip lines further comprising a ground plane formed in another metallization level disposed on a side of the printed circuit board opposite the side on which the circuits 115 and 117, the traces 405a and 405b, and the terminals 119a and 119b are formed. In a case where the radiofrequency transition terminals 119a and 119b are in contact with the cover 105 of the enclosure 101, the ground plane located on the opposite side of the printed circuit board is for example in contact with the tank 103.This example is not, however, limiting, the conductive tracks 405a and 405b being able, as a variant, to be produced by any type of transmission line, for example a stripline, a coplanar waveguide, a coaxial cable, etc. Furthermore, although, for the purposes of simplification, a case has been set out in which the printed circuit board comprises two levels of metallization, the embodiments described are not limited to this case, the printed circuit board being able more generally to have any number, for example greater than or equal to two, of levels of metallization in. which are formed the conductive elements of the device 107.

[0063] Although an example has been detailed above in relation to FIG. 4 in which the power divider circuit 115 is of the “Wilkinson divider” type and in which the phase shifter circuit 117 comprises a delay line, formed on one side of a printed circuit board, these circuits can of course be produced by any other means and on any type of support appropriate to the application.

[0064] As a variant, structures other than that illustrated in Figure 4 may be provided by the person skilled in the art based on the indications of the present description, in particular to meet objectives of compactness of the system. For example, the person skilled in the art is able to provide a more compact structure than that illustrated in Figure 4 and in which the power divider circuit 115 has a generally oval or elliptical shape. In this case, a conductive track substantially orthogonal to the major axis of the ellipse formed by the circuit 115 connects for example the connector 401 to the circuit 115, and the conductive tracks 405a and 405b are for example respectively connected to the circuit 115 in the vicinity of foci of the ellipse. The conductive tracks 405a and 405b to the circuit 115 are for example respectively connected at locations of the circuit 115 separated by a distance substantially equal to the major axis of the ellipse.Furthermore, each conductive track 405a, 405b may, as a variant, have a non-angular shape.

[0065] Figure 5 is a schematic and partial side and sectional view of an exemplary system 500 comprising radio frequency electronic devices according to one embodiment. The system 500 of Figure 5 and the system 100 of Figure 1 comprise elements in common. These common elements will not be detailed again below.

[0066] The system 500 of Figure 5 differs from the system 100 of Figure 1 in that the system 500 comprises a radiofrequency electronic device 507 similar to the radiofrequency electronic device 107 of the system 100 of Figure 1, and comprising in particular the radiofrequency transition terminals 119a and 119b. In the device 507, the radiofrequency transition terminal 119a is connected to a terminal for applying a reference potential, for example ground, via an adjustable or controllable element 517, and the radiofrequency signal SIG to be transmitted is applied to the radiofrequency transition terminal 119b. The controllable element 517 comprises for example at least one controllable capacitive element and / or at least one controllable inductive element. For example, the controllable element 517 includes a single variable capacitance capacitor, a single varicap diode, a set of switchable capacitors, or a set of switchable varicap diodes.The controllable element 517 may, in addition or as a variant, comprise a single variable inductance coil or a set of switchable coils. The capacitance and / or the inductance of the controllable element 517 may vary discretely, or substantially continuously. The element 517 is for example controlled by a control signal originating from a control circuit (not illustrated in FIG. 5) external or internal to the radiofrequency electronic device 507. The controllable element 517 plays for example the role of a controllable parasitic element making it possible to modify the central frequency of the signal produced by the device 507, via the cover 105, inside the enclosure 101.

[0067] Figure 6 is a graph illustrating variations, as a function of a transmission frequency f, of a reflection coefficient Su of the radiofrequency electronic devices 507 and 109 of the system 500 of Figure 5. More specifically, Figure 6 includes a curve 607 illustrating the variations of the reflection coefficient Su of the radiofrequency electronic device 507 as a function of the transmission frequency f. Figure 6 further includes curves 209-1, 209-2, 209-3, 209-4 and 209-5 illustrating the variations of the reflection coefficient Su of the radiofrequency electronic devices 109-1, 109-2, 109-3, 109-4 and 109-5 as a function of the transmission frequency f as previously described in relation to Figure 2.

[0068] An advantage of providing, in the radiofrequency electronic device 507, the controllable element 517 is that this makes it possible to shift the natural resonant frequency of the device 507 (arrows pointing to the left and to the right, in the orientation of Figure 6), compared to what would be obtained by using, for example, only the radiofrequency transition terminal 119b. This makes it possible, for example, to address several devices 109, or a larger number of devices 109, by controlling the element 517 so as to scan the frequency domain within which the natural frequencies of the devices 109 are likely to be found.

[0069] Figure 7 is a schematic and partial top view of an example of a system 700 comprising the radiofrequency electronic device 507 of Figure 5 according to one embodiment. The system 700 of Figure 7 differs for example from the system 500 of Figure 5 in that, in the system 700 of Figure 7, the radiofrequency electronic device 507 is interposed between the cover 105 and the tank 103 (not shown) of the enclosure 101.

[0070] In the example shown, the radiofrequency electronic device 507 comprises two separate parts 507a and 507b. In this example, the part 507a of the device 507 comprises, for example, the radiofrequency transition terminal 119a, and the part 507b of the device 507 comprises the radiofrequency transition terminal 119b.

[0071] The radiofrequency transition terminals 119a and 119b of the radiofrequency electronic device 507 are, for example, arranged so as to be brought into contact with the ports 301-4 and 301-2, respectively. In the example shown, the ports 301-4 and 301-2 where the radiofrequency transition terminals 119a and 119b are placed are not adjacent. This example is not, however, limiting, the ports 301 receiving the terminals 119a and 119b being able, as a variant, to be adjacent. For example, the ports 301 where the radiofrequency transition terminals 119a and 119b are placed are chosen from results obtained using digital simulation tools, depending for example on the geometry of the enclosure 101, the number of ports 301 available, the frequency of the field, etc., for example so as to be able to scan the widest possible range of frequencies.

[0072] Figure 8 is a schematic and partial top view of part 507b of the radiofrequency electronic device 507 of the system 700 of Figure 7 according to one embodiment.

[0073] In the example shown, the part 507b of the device 507 comprises a connector 801 intended to receive the SIG signal. The connector 801 is for example similar or identical to the connector 401 previously described in relation to FIG. 4.

[0074] The connector 801 is connected, by a conductive track 803, to the radio frequency transition terminal 119b. For example, the radiofrequency transition terminal 119b is formed in a metallization level of a printed circuit board. The conductive track 803 is for example part of a microstrip line further comprising a ground plane formed in another metallization level arranged on one side of the printed circuit board opposite the side on which the terminal 119b is formed. In a case where the radiofrequency transition terminals 119a and 119b are in contact with the cover 105 of the enclosure 101, the ground plane located on the opposite side of the printed circuit board is for example in contact with the tank 103. This example is however not limiting, the conductive track 803 being able, as a variant, to be produced by any type of transmission line as detailed previously for the conductive tracks 405a and 405b.

[0075] Figure 9 is a schematic and partial top view of part 507a of the radiofrequency electronic device 507 of the system 700 of Figure 7 according to one embodiment.

[0076] In the example shown, the portion 507a of the device 507 comprises a conductive track 903 connecting the radiofrequency transition terminal 119a to the controllable element 517. For example, the radiofrequency transition terminal 119a is formed in a metallization level of a printed circuit board. The conductive track 903 is for example part of a microstrip line further comprising a ground plane formed in another metallization level arranged on one side of the printed circuit board opposite the side on which the terminal 119a is formed. In a case where the radiofrequency transition terminals 119a and 119b are in contact with the cover 105 of the enclosure 101, the ground plane located on the opposite side of the printed circuit board is for example in contact with the tank 103.

[0077] For example, the controllable element 517 is a surface-mounted component disposed on the side of the printed circuit board where the conductive track 903 is formed.

[0078] Various embodiments and variations have been described. Those skilled in the art will understand that certain features of these various embodiments and variations could be combined, and other variations will occur to those skilled in the art. In particular, although the description in relation to Figures 1 to 4 takes as an example a case in which the systems 100 and 300 comprise a single device 107 comprising two radio frequency transition terminals 119a and 119b, the person skilled in the art is able, from the indications of the present description, to provide in each of the systems 100 and 300: - any number, greater than or equal to two, of devices identical or similar to the device 107, for example at least two devices 107, the terminals 119a and 119b of each device 107 being arranged at locations different from those where the terminals 119a and 119b of the other device(s) 107 are arranged; and / or - any number, greater than or equal to two, of radiofrequency transition terminals similar to terminals 119a and 119b and making it possible to apply, at different locations on the external face of the enclosure 101, signals out of phase with respect to each other, the terminals being for example connected to outputs of the same power divider circuit by microstrip lines of different lengths.

[0079] Furthermore, although the description in relation to figures 5 to 9 takes as an example a case in which the systems 500 and 700 comprise a single controllable element 517 connected to a radiofrequency transition terminal 119a, the person skilled in the art is able, from the indications of the present description, to provide any number, greater than or equal to two, of controllable elements identical or analogous to the element 517, for example a number greater than or equal to two of controllable elements 517 each connected to radiofrequency transition terminals at different locations on the outer face of the enclosure 101, for example a device 507 comprising a single part 507b and several parts 507a arranged on several ports 301 of the cover 105.

[0080] Although examples of metrology applications have been described above in which the devices 109 are sensors exchanging data with the device 107, the described embodiments also apply to wireless power transfer applications, for example applications in which the devices 109 are power receivers not exchanging data with the device 107.

[0081] Finally, the practical implementation of the embodiments and variants described is within the reach of the person skilled in the art from the functional indications given above. In particular, the determination of the number and position of the radiofrequency transition terminals as well as the values ​​of the phase shifts between the signals transmitted by these terminals are within the reach of the person skilled in the art from the indications of the present description.

[0082] Furthermore, the person skilled in the art is capable of producing the parts 507a and 507b of the device 507 on the same printed circuit board, and of producing the device 107 on several printed circuit boards.

Claims

CLAIMS 1. Electronic device (507) comprising: - at least one first radiofrequency transition terminal (119b) intended to receive a radiofrequency signal (SIG); and - at least one capacitive or inductive element (517) connected to a second radiofrequency transition terminal (119a), the first and second radiofrequency transition terminals being intended to be placed in contact with an external face of a metal enclosure (101).

2. Device according to claim 1, wherein said at least one capacitive or inductive element (517) is a single capacitor of variable capacitance.

3. Device according to claim 1, wherein said at least one capacitive or inductive element (517) is a single variable inductance coil.

4. Device according to any one of claims 1 to 3, wherein said at least one capacitive or inductive element (517) is connected to the second radiofrequency transition terminal (119a) by a microstrip line.

5. Device according to any one of claims 1 to 4, wherein the first radio frequency transition terminal (119b) is connected to a coaxial connector (801) by a microstrip line.

6. Device according to any one of claims 1 to 5, wherein said at least one capacitive or inductive element (517) and the first and second radiofrequency transition terminals (119a, 119b) are formed in the same metallization level of a printed circuit board.

7. System (500; 700) comprising: - a metal enclosure (101); - at least one first electronic device (109-1, 109-2, 109-3, 109-4, 109-5) arranged inside the metal enclosure; and - at least one second device (507) according to any one of claims 1 to 6.

8. System according to claim 7, in which the metal enclosure (101) comprises a cover (105) closing a tank (103).

9. System according to claim 8, in which the radiofrequency transition terminals (119a, 119b) are in contact with the cover (105) of the enclosure (101).

10. System according to any one of claims 7 to 10. 9, wherein each first device (109-1, 109-2, 109-3, 109-4, 109-5) is a sensor, preferably a temperature sensor.

11. System according to any one of claims 7 to 9, wherein each first device (109-1, 109-2, 109-3, 109-4, 109-5) is an energy receiver.

12. System according to any one of claims 7 to 10. 11, wherein each first device (109-1, 109-2, 109-3, 109-4, 109-5) comprises an antenna and a surface acoustic wave sensor.

13. System according to any one of claims 7 to 10. 12, comprising a single second device (507).

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