Plate polishing and grinding device and plate polishing and grinding method

Abstract

The present application relates to a slab polishing and grinding device and a slab polishing and grinding method, where the slab polishing and grinding device includes: a conveying assembly provided with a conveying plane for conveying a slab; a polishing and grinding assembly disposed at an upper side of the conveying assembly, the polishing and grinding assembly including a polishing head unit swingable along a first direction and a second direction; a detection assembly located at a slab-entering end of the conveying assembly, and configured to detect an outer edge contour size of a peripheral outer side of the slab; where a plurality of polishing-head turning points are disposed on the outer edge contour of the slab, and a polishing and grinding trajectory is formed by planning according to the plurality of polishing-head turning points, the polishing head unit swinging along the polishing and grinding trajectory to polish and grind the slab.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of slab polishing and grinding, and in particular, to a slab polishing and grinding device and a slab polishing and grinding method.BACKGROUND

[0002] In the prior art, surface polishing of slabs such as stone slabs, rock slabs, ceramic slabs, metal slabs, and glass is an important part of the processing, which involves continuous polishing of the surface of the slab by a polishing grinding head to achieve a certain glossiness on the surface of the slab.

[0003] Existing slab polishing devices polish the slab by swinging multiple polishing grinding heads uniformly, but since the edge contours of slabs are typically irregular, and the width of each slab during polishing production varies. In existing slab polishing equipment, there are sensors for detecting the edge contour of the slab at the front end in the tile-entering direction; when the edge contour of the slab is detected, the polishing head will be lifted to avoid contact and prevent the polishing head from grinding the conveyor belt. Then, the polishing head continues to swing outward until it reaches the outermost position of the slab before turning back; when returning to the edge contour position of the slab, the polishing head is lowered to resume polishing work.

[0004] Evidently, to prevent the polishing head from grinding the conveyor belt, it is lifted, but the lifted polishing head still rotates without contacting the slab, operating idly and wasting energy. Additionally, untimely lifting and lowering of the polishing head and impacts during the process may lead to poor polishing effects at the edge of the slab, resulting in issues such as yellow edges or dark shadows at the edge positions.SUMMARY

[0005] To overcome at least one of the deficiencies described in the above prior art, according to an aspect of the present application, a slab polishing and grinding device is provided, which effectively avoids idle operation of the polishing head unit, thereby improving efficiency and reducing energy consumption.

[0006] A slab polishing and grinding device includes: a conveying assembly, provided with a conveying plane for conveying a slab; a polishing and grinding assembly, disposed at an upper side of the conveying assembly, the polishing and grinding assembly including a polishing head unit swingable along a first direction and a second direction; within the conveying plane, the first direction is a conveying direction of the conveying assembly, and the second direction is a direction perpendicular to the conveying direction of the conveying assembly; and a detection assembly, located at a slab-entering end of the conveying assembly, and configured to detect an outer edge contour size of a peripheral outer side of the slab; a plurality of polishing-head turning points are disposed on the outer edge contour of the slab, and a polishing and grinding trajectory is formed by planning according to the plurality of polishing-head turning points, the polishing head unit swinging along the polishing and grinding trajectory to polish and grind the slab.

[0007] Optionally, the polishing head unit is liftable and lowerable along a third direction, the third direction is a height direction of the conveying assembly, and the detection assembly is further configured to detect an inner edge contour size of a hole on the slab; a polishing head lifting point and a polishing head lowering point are determined on the inner edge contour of the slab, and a lifting and lowering trajectory for avoiding the hole is formed according to the polishing head lifting point and the polishing head lowering point, the polishing head unit lifts and lowers along the lifting and lowering trajectory, and the lifting and lowering trajectory is formed within the polishing and grinding trajectory.

[0008] Optionally, the plurality of polishing-head turning points are planned at intervals on both opposite outer edge contours of the slab along the second direction; on one outer edge contour, along the first direction, the plurality of polishing-head turning points are sequentially marked as the i-th point, where i = {1, 2, ..., n}, and n represents a corresponding count and is a natural number greater than 1; on the other outer edge contour, along the first direction, the plurality of polishing-head turning points are sequentially marked as the r-th point, r = {1, 2, ..., n}, and n represents a corresponding count and is a natural number greater than 1; and the plurality of polishing-head turning points move along a path planned according to the i=1 point, r=1 point, r=2 point, i=2 point, i=3 point, r=3 point, ..., i=n point or r=m point to form the polishing and grinding trajectory.

[0009] Optionally, the i-th polishing-head turning point and the r-th polishing-head turning point are aligned along the second direction, where i=r.

[0010] Optionally, a polishing and grinding trajectory between the i-th polishing-head turning point and the r-th polishing-head turning point is a first polishing and grinding path, where i=r;

[0011] Optionally, the slab polishing and grinding device further includes a frame, and the polishing and grinding assembly further includes: a first guide rail, connected to the frame; a first beam body, slidably connected to the first guide rail; a fixing seat, slidably connected to the first beam body, the polishing head unit being disposed on the fixing seat; a first-direction swinging driving unit, configured to drive the fixing seat to move relative to the first beam body along the first direction; and a second-direction swinging driving unit, configured to drive the first beam body to move relative to the first guide rail along the second direction.

[0012] Optionally, the first-direction swinging driving unit is connected to the fixing seat, and the second-direction swinging driving unit is connected to the first beam body; a straight rack is fixed on the first guide rail, the first beam body is slidably disposed on the first guide rail, and a driving end of the second-direction swinging driving unit is provided with a gear meshing with the straight rack; a driving end of the first-direction swinging driving unit is provided with a rotating disk, the rotating disk is eccentrically and rotatably connected to a connecting rod, and an end of the connecting rod away from the rotating disk is rotatably connected to the first beam body.

[0013] Optionally, the polishing and grinding assembly further includes: a third-direction lifting and lowering driving unit, connected to the fixing seat, a lifting end of the third-direction lifting and lowering driving unit being provided with a main shaft, the main shaft being connected to the polishing head unit; and a polishing head rotary driving unit, connected to the fixing seat, a driving end of the polishing head rotary driving unit being connected via a transmission belt to a rotary sleeve, the rotary sleeve being sleeved outside the main shaft, and where one of the main shaft and the rotary sleeve is provided with a guide key and the other is provided with a guide groove.

[0014] According to another aspect of the present application, provided is a slab polishing and grinding method applied to the aforementioned slab polishing and grinding device, including the following steps: acquiring outer edge contour position data of the slab, and calculating outer edge contour size data of the slab using the outer edge contour position data; determining polishing-head turning points based on the outer edge contour size data of the slab and conveying speed data; planning a polishing and grinding trajectory according to the polishing-head turning points; and driving the polishing head unit to swing along the polishing and grinding trajectory for adaptive edge contour polishing and grinding.

[0015] Optionally, the slab polishing and grinding method further includes the following steps: acquiring inner edge contour position data of the slab, and calculating inner edge contour size data of the slab using the inner edge contour position data; determining a polishing head lifting point and the polishing head lowering point based on the inner edge contour size data of the slab and conveying speed data; planning a lifting and lowering trajectory according to the polishing head lifting point and the polishing head lowering point; and driving the polishing head unit to lift and lower along the lifting and lowering trajectory.

[0016] In summary, the slab polishing and grinding device and method provided in the present application achieve the following technical effects: In view of the issues in existing slab polishing devices where the polishing head idles without useful work and results in poor edge polishing quality of the slab, the slab polishing and grinding device of the present embodiment addresses these by improving the polishing structure. Specifically, the detection assembly detects the outer edge contour size corresponding to each slab of different shapes in real time. The plurality of polishing-head turning points are determined on their respective outer edge contours. Then, a respective polishing and grinding trajectory is formed by planning using preset algorithms. This enables the polishing swing amplitude of the polishing head unit to adapt to the outer edge contour of the slab, allowing adaptive polishing and grinding for slabs of different shapes, avoiding idle operation of the polishing head unit, improving efficiency, and reducing energy consumption. Meanwhile, adaptive polishing and grinding for slabs of different shapes enhance the surface polishing and grinding quality of the slab, especially the edge polishing effect, thereby preventing issues such as yellow edges or dark shadows at the edge positions of the slab.BRIEF DESCRIPTION OF THE DRAWINGS

[0017] FIG. 1 is a schematic diagram showing the slab polishing and grinding trajectory in a slab polishing equipment of the prior art; FIG. 2 is a schematic structural diagram of a slab polishing and grinding device according to an embodiment of the present application; FIG. 3 is a schematic structural diagram of conveying a slab by a conveying assembly in the slab polishing and grinding device according to an embodiment of the present application; FIG. 4 is a structural schematic diagram of a polishing and grinding trajectory path for a slab with a hole in the slab polishing and grinding device according to an embodiment of the present application; FIG. 5 is a structural schematic diagram of a polishing and grinding trajectory path for a slab without a hole in the slab polishing and grinding device according to an embodiment of the present application; FIG. 6 is another schematic structural diagram of the slab polishing and grinding device according to an embodiment of the present application; FIG. 7 is a partial enlarged view at A in FIG. 6; FIG. 8 is a schematic structural diagram of a polishing and grinding assembly in the slab polishing and grinding device according to an embodiment of the present application; FIG. 9 is another schematic structural diagram of the polishing and grinding assembly in the slab polishing and grinding device according to an embodiment of the present application; FIG. 10 is yet another schematic structural diagram of the polishing and grinding assembly in the slab polishing and grinding device according to an embodiment of the present application; FIG. 11 is still another schematic structural diagram of the polishing and grinding assembly in the slab polishing and grinding device according to an embodiment of the present application.

[0018] Drawings: 1-frame, 11-first guide rail, 2-conveying assembly, 21-conveyor belt, 3-polishing and grinding assembly, 31-polishing head unit, 32-first guide rail, 321-straight rack, 322-gear, 33-first beam body, 34-fixing seat, 35-first-direction swinging driving unit, 36-second-direction swinging driving unit, 37-rotating disk, 371-connecting rod, 38-third-direction lifting and lowering driving unit, 381-main shaft, 382-rotary sleeve, 39-polishing head rotary driving unit, 391-transmission belt, 4-detection assembly, 5-polishing-head turning point, 61-polishing head lifting point, 62-polishing head lowering point, 7-slab, 71-outer edge contour position, 72-inner edge contour position, 73-polishing and grinding trajectory, 731-first polishing and grinding path, 732-second polishing and grinding path, 74-lifting and lowering trajectory.DETAILED DESCRIPTION

[0019] For a better understanding and implementation, the technical solutions in the embodiments of the present application are clearly and completely described below in conjunction with the attached drawings of the present application.

[0020] In the description of the present application, it is to be noted that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and other orientation or position relationships are based on the orientation or position relationships shown in the attached drawings. It is only intended to facilitate description of the present application and simplify description, but not to indicate or imply that the referred device or element has a specific orientation, or is constructed and operated in a specific orientation. Therefore, they should not be construed as a limitation of the present application.

[0021] Unless otherwise defined, all terms including technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which the present application belongs. The terms used herein in the specification of the present application are used only to describe specific embodiments and are not intended as a limitation of the present application.

[0022] In the prior art, surface polishing of slabs such as stone slabs, rock slabs, ceramic slabs, metal slabs, and glass is an important part of the processing, which involves continuous polishing of the surface of the slab by a polishing grinding head to achieve a certain glossiness on the surface of the slab.

[0023] Existing slab polishing devices polish the slab by swinging multiple polishing grinding heads uniformly, but since the edge contours of slabs are typically irregular, and the width of each slab during polishing production varies. In existing slab polishing equipment, there are sensors detecting the edge contour of the slab at the front end in the tile-entering direction. When the edge contour of the slab is detected, the polishing head will be lifted to avoid contact (i.e., lifted at Line B2) to prevent the polishing head from grinding the conveyor belt (refer to FIG. 1, FIG. 1 specifically shows the slab polishing and grinding trajectory in existing slab polishing equipment). Subsequently, the polishing head continues to swing outward (i.e., in the direction of Arrow B) until reaching the outermost position of the slab before turning back to swing (i.e., swinging back at Line B1). Upon returning to the edge contour position of the slab, the polishing head lowers to resume polishing work.

[0024] Evidently, to prevent the polishing head from grinding the conveyor belt, it is lifted, but the lifted polishing head still rotates without contacting the slab. This results in idle operation without useful work (i.e., the polishing head operates uselessly in the area between B1 and B2 in the figure), leading to wasteful energy consumption. Additionally, untimely lifting and lowering of the polishing head and impacts during the process can lead to poor polishing effects at the edge of the slab, resulting in issues such as yellow edges or dark shadows at the edge positions.

[0025] Referring to FIGS. 2-11, the present application discloses a slab polishing and grinding device and a slab polishing and grinding method for polishing and grinding a non-regular slab 7 using the same.Embodiment 1 Structure of a slab polishing and grinding device

[0026] Referring to FIGS. 2-11, the present embodiment discloses a slab polishing and grinding device, specifically applicable to slabs 7 of irregular contours and capable of adaptive linking for polishing and grinding. The polishing and grinding objects include, but are not limited to, stone slabs, rock slabs, ceramic slabs, metal slabs, glass slabs 7, etc., with specific structures as follows:

[0027] The slab polishing and grinding device includes a conveying assembly 2, a polishing and grinding assembly 3, and a detection assembly 4.

[0028] The conveying assembly 2 is provided with a conveying plane for conveying the slab 7. The polishing and grinding assembly 3 is disposed at an upper side of the conveying assembly 2, and the polishing and grinding assembly 3 includes a polishing head unit 31 swingable along a first direction and a second direction. Within the conveying plane, the first direction is a conveying direction of the conveying assembly 2, and the second direction is a direction perpendicular to the conveying direction of the conveying assembly 2. The detection assembly 4 is located at a slab-entering end of the conveying assembly 2 and configured to detect an outer contour size of the slab 7.

[0029] A plurality of polishing-head turning points 5 are disposed on the outer edge contour of the slab 7, and a polishing and grinding trajectory 73 is formed by planning according to the plurality of polishing-head turning points 5, the polishing head unit 31 swinging along the polishing and grinding trajectory 73 to polish and grind the slab 7.

[0030] It should be noted that the first direction corresponds to direction X in FIG. 2, and the second direction corresponds to direction Y in FIG. 2.

[0031] In view of the issues in existing slab polishing devices where the polishing head idles without useful work and results in poor edge polishing quality of the slab 7, the slab polishing and grinding device of the present embodiment addresses these by improving the polishing structure. Specifically, the detection assembly 4 detects the outer edge contour size corresponding to each slab 7 of different shapes in real time. The plurality of polishing-head turning points 5 are determined on their respective outer edge contours. Then, a respective polishing and grinding trajectory 73 is formed by planning using preset algorithms. This enables the polishing swing amplitude of the polishing head unit 31 to adapt to the outer edge contour of the slab 7, allowing adaptive polishing and grinding for slabs 7 of different shapes, avoiding idle operation of the polishing head unit 31, improving efficiency, and reducing energy consumption.

[0032] Meanwhile, adaptive polishing and grinding for slabs 7 of different shapes enhance the surface polishing and grinding quality of the slab 7, especially the edge polishing effect, thereby preventing issues such as yellow edges or dark shadows at the edge positions of the slab.

[0033] Preferably, regarding how to determine the polishing-head turning point 5 on the outer edge contour of the slab 7, the detection assembly 4 may detect the outer edge contour size of the slab 7, a speed sensor may detect the conveying speed of the slab 7, and then based on the outer edge contour size and the conveying speed, preset algorithm software on a computer automatically calculates the polishing-head turning point 5. The plurality of polishing-head turning points 5 are sequentially connected to form the polishing and grinding trajectory 73, as shown in FIGS. 4 and 5.

[0034] Referring to FIGS. 9 to 11, optionally, the polishing head unit 31 is liftable and lowerable along a third direction, the third direction is a height direction of the conveying assembly 2, and the detection assembly 4 is further configured to detect an inner edge contour size of a hole on the slab 7; a polishing head lifting point 61 and a polishing head lowering point 62 are determined on the inner edge contour of the slab 7, and a lifting and lowering trajectory 74 for avoiding the hole is formed according to the polishing head lifting point 61 and the polishing head lowering point 62, the polishing head unit 31 lifts and lowers along the lifting and lowering trajectory 74, and the lifting and lowering trajectory 74 is formed within the polishing and grinding trajectory 73. In the illustrated embodiment, the third direction is the Z direction.

[0035] In view of the fact that some existing slabs 7 have holes, to prevent the polishing head unit 31 from contacting the conveyor belt 21 of the conveying assembly 2 while passing over the holes of the slab 7, the polishing head unit 31 needs to lift when reaching the edge of the hole and lower after passing the hole to continue polishing and grinding. Therefore, the polishing head unit 31 is liftable and lowerable along the third direction to avoid the holes, enabling more adaptable polishing and grinding of the slab 7.

[0036] Simultaneously, the lifting and lowering trajectory 74 is planned within the polishing and grinding trajectory 73, integrating the lifting and lowering points of the polishing head unit 31 into its polishing and grinding trajectory 73. This effectively plans a polishing and grinding trajectory 73 with the highest polishing efficiency to improve polishing efficiency, while also avoiding the holes to prevent contact between the polishing head unit 31 and the conveyor belt 21.

[0037] It should be noted that, considering existing slabs 7 fall into two types, one is a slab 7 without holes, in which case the contour size detected by the detection assembly 4 is the outer edge contour size; the other is a slab 7 with holes, in which case the contour size detected by the detection assembly 4 includes both the outer edge contour size and the inner edge contour size. Therefore, the slab polishing and grinding device may be applied to at least two different kinds of irregular slabs 7.

[0038] Specifically, when polishing and grinding a slab 7 without holes is required, referring to FIG. 6, the slab polishing and grinding device may calculate the plurality of polishing-head turning points 5 and plan the polishing and grinding trajectory 73 based on the outer edge contour size and conveying speed of the slab 7 detected by the detection assembly 4 using preset algorithm software on a computer, then drive the polishing head unit 31 to swing along the polishing and grinding trajectory 73 according to instructions.

[0039] Further specifically, when polishing and grinding a slab 7 with holes is required, referring to FIG. 7, the slab polishing and grinding device may calculate the polishing-head turning point 5, polishing head lifting point 61, and polishing head lowering point 62 based on the outer edge contour size, inner edge contour size, and conveying speed of the slab 7 detected by the detection assembly 4 using preset algorithm software on a computer. It then plans the polishing and grinding trajectory 73 and lifting and lowering trajectory 74, and issues instructions to drive the polishing head unit 31 to swing along the polishing and grinding trajectory 73 and lift / lower along the lifting and lowering trajectory 74.

[0040] It should also be noted that, referring to FIGS. 4 and 5, the polishing-head turning point 5 refers to the turning point where the polishing head unit 31 moves across the surface of slab 7 for polishing and reaches the outer contour of the peripheral outer side of slab 7. The turn angle may be approximately 90 degrees or other suitable angles, depending on the actual outer contour of slab 7. The polishing head lifting point 61 and polishing head lowering point 62 refer to points where the polishing head unit 31 lifts or lowers while moving for polishing across the surface of slab 7 and reaches the inner contour of the hole on slab 7. The lifting / lowering height may be set according to actual conditions.

[0041] Referring to FIG. 4 and 5, optionally, the plurality of polishing-head turning points 5 are planned at intervals on both opposite outer edge contours of the slab 7 along the second direction; on one outer edge contour, along the first direction, the plurality of polishing-head turning points 5 are sequentially marked as the i-th point, where i = {1, 2, ..., n}, and n represents a corresponding count and is a natural number greater than 1; on the other outer edge contour, along the first direction, the plurality of polishing-head turning points 5 are sequentially marked as the r-th point, r = {1, 2, ..., n}, and n represents a corresponding count and is a natural number greater than 1; and the plurality of polishing-head turning points 5 move along a path planned according to the i=1 point, r=1 point, r=2 point, i=2 point, i=3 point, r=3 point, ..., i=n point or r=m point to form the polishing and grinding trajectory 73. Thus, the specific positions of the polishing-head turning points 5 are located on opposite outer edge contours of slab 7 along the second direction. The plurality of polishing-head turning points 5 are connected in a specific logical sequence to form the polishing and grinding trajectory 73. The logical sequence is: first connecting to the opposite-side polishing-head turning point 5, then connecting to the same-side polishing-head turning point 5, then connecting to the opposite-side polishing-head turning point 5. That is, the connections follow an "opposite side → same side" pattern to form the polishing and grinding trajectory 73. Therefore, a wave-shaped polishing and grinding trajectory 73 is formed, effectively covering the surface area of slab 7 to be polished, thereby improving polishing efficiency.

[0042] Referring to FIG. 4 and 5, optionally, the i-th polishing-head turning point 5 and the r-th polishing-head turning point 5 are aligned along the second direction, where i=r. Thus, the first polishing-head turning point 5 aligns with the first polishing-head turning point 5, the second polishing-head turning point 5 aligns with the second polishing-head turning point 5, and the third polishing-head turning point 5 aligns with the third polishing-head turning point 5. Therefore, paired polishing-head turning points 5 on opposite sides are vertically aligned. This effectively simplifies determining the positions of the polishing-head turning points 5 on the outer edge contour, improving the efficiency of positioning the polishing-head turning points 5.

[0043] Meanwhile, it should be noted that the polishing and grinding trajectory 73 formed by the polishing head unit 31 on the surface of slab 7 appears approximately as a square-wave-like shape, as shown in FIGS. 4 and 5. This further ensures thorough polishing of the surface on slab 7, enhancing polishing efficiency.

[0044] For clarity in understanding the positioning of the polishing-head turning points 5 and the polishing and grinding trajectory 73, the opposite outer edge contours along the second direction of slab 7 are exemplified as the upper and lower outer edge contours.

[0045] Specifically, the polishing and grinding trajectory 73 includes a first polishing and grinding path 731 and a second polishing and grinding path 732. The plurality of polishing-head turning points 5 are spaced along the upper and lower outer edge contours of slab 7. Each pair of polishing-head turning points 5 aligned vertically between these contours forms the first polishing and grinding path 731. Adjacent points on the same contour form the second polishing and grinding path 732, arranged alternately above and below along the first direction between two adjacent first polishing and grinding paths 731.

[0046] Based on the contour dimensions acquired by the detection assembly 4, preset algorithm software determines the plurality of polishing-head turning points 5 according to the method described. These polishing-head turning points 5 are connected as follows: aligned pairs on the upper and lower contours form the first polishing and grinding path 731, while adjacent points on the same contour are connected as the second polishing and grinding path 732. The second paths are alternately arranged above and below sequentially between adjacent first polishing and grinding paths 731, creating an approximately square-wave-like polishing path. In other embodiments, the spacing between polishing-head turning points 5 on the same contour may vary based on the actual dimensions of slab 7.

[0047] It should be noted that uniform spacing between polishing-head turning points 5 on the same contour refers to maintaining consistent distance between adjacent first polishing and grinding paths 731.

[0048] Referring to FIG. 4 and 5, optionally, a polishing and grinding trajectory 73 between the i-th polishing-head turning point 5 and the r-th polishing-head turning point 5 is a first polishing and grinding path 731, where i=r; the first polishing and grinding path 731 passes through an inner edge contour of a hole on the slab 7, and the polishing head lifting point 61 and the polishing head lowering point 62 are disposed at the inner edge contour. Thus, the lifting and lowering trajectory 74 at the lifting and lowering points of the polishing head unit 31 may be specifically integrated into the first polishing and grinding path 731 of the polishing and grinding trajectory 73, effectively planning a polishing and grinding trajectory 73 with the highest polishing efficiency to improve polishing efficiency. At the same time, it also avoids the holes to prevent contact between the polishing head unit 31 and the conveyor belt 21.

[0049] Referring to FIGS. 6 to 11, optionally, the slab polishing and grinding device further includes a frame 1.

[0050] The polishing and grinding assembly 3 further includes a first guide rail 11, a first beam body 33, a fixing seat 34, a first-direction swinging driving unit 35, and a second-direction swinging driving unit 36.

[0051] The first guide rail 11 is connected to the frame 1, the first beam body 33 is slidably connected to the first guide rail 11, and the fixing seat 34 is slidably connected to the first beam body 33. The polishing head unit 31 is arranged on the fixing seat 34. The first-direction swinging driving unit 35 is configured to drive the fixing seat 34 to move relative to the first beam body 33 along the first direction, and the second-direction swinging driving unit 36 is configured to drive the first beam body 33 to move relative to the first guide rail 11 along the second direction.

[0052] Considering that the polishing head unit 31 swings along the first and second directions to polish and grind the slab 7, the specific implementation structure in the present embodiment may include: the first guide rail 11 is arranged on the frame 1, the first beam body 33 is arranged on the first guide rail 11, the fixing seat 34 is arranged on the first beam body 33, and the polishing head unit 31 is arranged on the fixing seat 34. The second-direction swinging driving unit 36 drives the first beam body 33 to move along the second direction. At this point, the first beam body 33, the fixing seat 34, and the polishing head unit 31 all move together along the second direction.

[0053] Simultaneously, the first-direction swinging driving unit 35 drives the fixing seat 34 to move along the first direction. At this point, the fixing seat 34 and the polishing head unit 31 both move along the first direction. This enables the polishing head unit 31 to move along the first and second directions, polishing and grinding the slab 7 according to the polishing and grinding trajectory 73.

[0054] In other embodiments, the first-direction swinging driving unit 35 may be a linear motion module, such as a synchronous belt linear module, ball screw linear module, linear motor module, or telescopic cylinder, to drive the polishing head unit 31 to move linearly along the first direction.

[0055] In other embodiments, the second-direction swinging driving unit 36 may be a linear motion module, such as a synchronous belt linear module, ball screw linear module, linear motor module, or telescopic cylinder, to drive the polishing head unit 31 to move linearly along the second direction.

[0056] Referring to FIGS. 6-11, optionally, the first-direction swinging driving unit 35 is connected to the fixing seat 34, and the second-direction swinging driving unit 36 is connected to the first beam body 33. A straight rack 321 is fixed on the first guide rail 11, and the first beam body 33 is slidably disposed on the first guide rail 11. A driving end of the second-direction swinging driving unit 36 is provided with a gear 322 meshing with the straight rack 321. A driving end of the first-direction swinging driving unit 35 is provided with a rotating disk 37, and the rotating disk 37 is eccentrically and rotatably connected to a connecting rod 371. An end of the connecting rod 371 away from the rotating disk 37 is rotatably connected to the first beam body 33.

[0057] Considering that the first-direction swinging driving unit 35 and the second-direction swinging driving unit 36 drive the polishing head unit 31 to move along the first and second directions, the specific implementation structure in the present embodiment may include: a straight rack 321 is fixed on the first guide rail 11; the second-direction swinging driving unit 36 is mounted on the first beam body 33; and the driving end of the second-direction swinging driving unit 36 is provided with a gear 322. The second-direction swinging driving unit 36 drives the gear 322 to rotate, and the gear 322 meshes with the straight rack 321. Since the straight rack 321 is fixed on the first guide rail 11, the straight rack 321 remains stationary. Therefore, the gear 322 moves along the second direction on the straight rack 321, thereby driving the second-direction swinging driving unit 36, the first beam body 33, the fixing seat 34, the first-direction swinging driving unit 35, and the polishing head unit 31 to move along the second direction.

[0058] Additionally, the driving end of the first-direction swinging driving unit 35 is provided with the rotating disk 37. An end of the connecting rod 371 is eccentrically disposed on the rotating disk 37, and an opposite end of the connecting rod 371 is connected to the first beam body 33. Thus, when the first-direction swinging driving unit 35 drives the rotating disk 37 to rotate, the relative distance in the first direction between the first-direction swinging driving unit 35 and the first beam body 33 changes due to the positional shift of the connecting rod 371, thereby driving the fixing seat 34 and the polishing head unit 31 to move along the first direction. With this configuration, the polishing head unit 31 is enabled to move along the first and second directions for polishing and grinding the slab 7 according to the polishing and grinding trajectory 73, achieving a more compact structure.

[0059] Optionally, the first-direction swinging driving unit 35 and the second-direction swinging driving unit 36 may be servo motors.

[0060] Referring to FIGS. 6 to 11, optionally, the polishing and grinding assembly 3 further includes: a third-direction lifting and lowering driving unit 38, connected to the fixing seat 34, a lifting end of the third-direction lifting and lowering driving unit 38 being provided with a main shaft 381, the main shaft 381 being connected to the polishing head unit 31; and a polishing head rotary driving unit 39, connected to the fixing seat 34, a driving end of the polishing head rotary driving unit 39 being connected via a transmission belt 391 to a rotary sleeve 382, the rotary sleeve 382 being sleeved outside the main shaft 381, and where one of the main shaft 381 and the rotary sleeve 382 is provided with a guide key and the other is provided with a guide groove.

[0061] Specifically, an inner wall of the rotary sleeve 382 is axially provided with a guide groove along its own axis. Here, the axial direction of the main shaft 381 is parallel to that of the rotary sleeve 382. The main shaft 381 is configured with a guide key adapted to the guide groove, and the guide key is slidably embedded within the guide groove. In the illustrated embodiment, the axial direction of the inner wall of the rotary sleeve 382 itself is the third direction, i.e., the Z direction. Additionally, a rotary bearing is provided between the lifting end of the third-direction lifting and lowering driving unit 38 and the main shaft 381, and another rotary bearing is provided between the rotary sleeve 382 and the fixing seat 34.

[0062] Considering that the polishing head unit 31 achieves rotational motion to polish and grind the slab 7 while also being liftable and lowerable along the third direction, the specific implementation structure in this embodiment is as follows: the polishing head rotary driving unit 39 drives the rotary sleeve 382 to rotate via the transmission belt 391. The rotary sleeve 382, through the guide key, drives the main shaft 381 to rotate. The main shaft 381 in turn drives the polishing head unit 31 to rotate, enabling the polishing and grinding of slab 7.

[0063] Simultaneously, when the polishing head unit 31 needs to lift or lower to avoid holes, the third-direction lifting and lowering driving unit 38 extends or retracts to drive the main shaft 381 to move axially. The main shaft 381 then drives the polishing head unit 31 to lift or lower. Since the guide key can slide axially within the guide groove, this allows the polishing head unit 31 to move vertically without affecting its rotational motion. Consequently, the polishing head unit 31 achieves both its own rotation and vertical movement while maintaining a compact structure with a small footprint.

[0064] Optionally, the third-direction lifting and lowering driving unit 38 may be a linear motion module, such as a synchronous belt linear module, ball screw linear module, linear motor module, or telescopic cylinder, to drive the polishing head unit 31 to move linearly along the third direction.

[0065] Optionally, the polishing head rotary driving unit 39 may be a servo motor.

[0066] Optionally, portions of the polishing head rotary driving unit 39 and the third-direction lifting and lowering driving unit 38 that contact the transmission belt 391 are correspondingly equipped with belt pulleys.

[0067] In other embodiments, the polishing head unit 31 may also be implemented using a polishing polishing head driving device as described in patent CN202210736268.6 to achieve both its rotation and vertical movement.

[0068] In other embodiments, the polishing head unit 31 may alternatively be mounted on the frame 1 via an XYZ motion platform. An XYZ motion platform, also known as a three-coordinate high-precision positioning stage, enables precise linear motion along the X, Y, and Z axes. An XYZ platform primarily includes an X-axis motion module, Y-axis motion module, and Z-axis motion module. As this is prior art, further elaboration is omitted.

[0069] Referring to FIG. 6, optionally, a plurality of polishing and grinding assemblies 3 are provided, arranged sequentially at intervals along the first direction above the conveying assembly 2. Thus, the polishing head unit 31 in each polishing and grinding assembly 3 may swing along the first and second directions and lift / lower along the third direction. Each polishing head unit 31 is independently controlled to polish and grind the slab 7 multiple times sequentially, improving the polishing effect on slab 7. Additionally, adjacent slabs 7 can be conveyed without gaps, achieving continuous polishing and grinding of slabs 7 and enhancing production efficiency.

[0070] Preferably, the detection assembly 4 may be a detection tool for obtaining contour dimensions of irregular slabs 7. For example, a detection tool equipped with image sensors related to machine vision, such as a CCD (Charge-coupled Device) chip-based camera or a CMOS (Complementary Metal Oxide Semiconductor)-based camera; or a detection tool employing lasers or ultrasound to measure contour dimensions of irregular slabs 7, such as a profile measuring instrument using laser detection principles to measure the contour of objects. These detection tools can acquire edge contour position data of slab 7 and calculate outer / inner edge contour size data through built-in programs, providing a basis for subsequent polishing and grinding motions.

[0071] Moreover, since the contours detected by detection assembly 4 specifically include outer and inner contours, the aforementioned detection tools can precisely acquire outer edge contour position 71 data and inner edge contour position 72 data of slab 7. Through built-in program calculations, they obtain outer and inner edge contour size data of slab 7 to provide a basis for subsequent polishing and grinding motions.

[0072] Preferably, the conveying assembly 2 includes conveyor belts 21, a driving shaft, a driven shaft, and a conveying actuator. The driving shaft and driven shaft are respectively installed on opposite sides of frame 1 along the first direction, with both shafts perpendicular to the first direction. Conveyor belts 21 are sleeved over the driving and driven shafts. The conveying actuator is mounted on one side of frame 1, with its output end connected to the driving shaft. This configuration allows the conveying actuator to drive the driving shaft, which, in coordination with the driven shaft and conveyor belts 21, rotates the conveyor belts 21 to transport slab 7. Further and preferably, the conveying actuator is a servo motor.Embodiment 2 A slab polishing and grinding method

[0073] The present embodiment discloses a slab polishing and grinding method, specifically applicable to adaptively connected polishing and grinding of slabs 7 with irregular contours. The method may utilize the slab polishing and grinding device described in Embodiment 1 to polish and grind the slab 7, with the specific steps including: S10: acquiring outer edge contour position 71 data of the slab 7, and calculating outer edge contour size data of the slab 7 using the outer edge contour position 71 data; S11: determining polishing-head turning points 5 based on the outer edge contour size data of the slab 7 and conveying speed data; S12: planning a polishing and grinding trajectory 73 according to the polishing-head turning points 5; and S13: driving the polishing head unit 31 to swing along the polishing and grinding trajectory 73 for adaptive edge contour polishing and grinding.

[0074] In view of the issues in existing slab polishing devices where the polishing head idles without useful work and results in poor edge polishing quality of the slab 7, the slab polishing and grinding method of the present embodiment addresses these by acquiring outer edge contour position 71 data for slabs 7 of different shapes. It calculates their respective outer edge contour size data, determines multiple polishing-head turning points 5 on each corresponding outer edge contour, and plans a respective polishing and grinding trajectory 73. This enables the polishing swing amplitude of the polishing head unit 31 to adapt to the outer edge contour of slabs 7 of various shapes, performing adaptive polishing and grinding that avoids idle operation of the polishing head unit 31, thereby improving efficiency and reducing energy consumption. Meanwhile, adaptive polishing and grinding for slabs 7 of different shapes enhance the surface polishing and grinding quality of the slab 7, especially the edge polishing effect, thereby preventing issues such as yellow edges or dark shadows at the edge positions of the slab 7.Embodiment 3 A slab polishing and grinding method

[0075] The present embodiment discloses a slab polishing and grinding method, specifically applicable to adaptively connected polishing and grinding of slabs 7 with irregular contours. The method utilizes the slab polishing and grinding device described in Embodiment 1 to polish and grind the slab 7. In view of the fact that some existing slabs 7 contain holes, to prevent the polishing head unit 31 from contacting the conveyor belt 21 of the conveying assembly 2 while passing over the holes of the slab 7, the polishing head unit 31 should lift at the edge of the hole before passing over it and lower to resume polishing and grinding after passing. Therefore, the specific steps include: S20: acquiring outer edge contour position 71 data of the slab 7, and calculating outer edge contour size data of the slab 7 using the outer edge contour position 71 data; S21: acquiring inner edge contour position 72 data of the slab 7, and calculating inner edge contour size data of the slab 7 using the inner edge contour position 72 data; S22: determining polishing-head turning points 5 based on the outer edge contour size data of the slab 7 and conveying speed data; S23: planning a polishing and grinding trajectory 73 according to the polishing-head turning points 5; S24: determining a polishing head lifting point 61 and the polishing head lowering point 62 based on the inner edge contour size data of the slab 7 and conveying speed data; S25: planning a lifting and lowering trajectory 74 according to the polishing head lifting point 61 and the polishing head lowering point 62; and S26: driving the polishing head unit 31 to swing along the polishing and grinding trajectory 73 and to lift / lower along the lifting and lowering trajectory 74 for adaptive edge contour polishing and grinding.

[0076] This arrangement prevents the polishing head unit 31 from contacting the conveyor belt 21 of the conveying assembly 2 while passing over the holes in the slab 7. Specifically, the polishing head unit 31 lifts at the edge of the hole, passes over the hole, then lowers to continue polishing and grinding. Consequently, the polishing head unit 31 achieves lifting and lowering along the third direction to avoid the holes, enabling more adaptable polishing and grinding of the slab 7. Simultaneously, by planning the lifting and lowering trajectory 74 within the polishing and grinding trajectory 73, the lifting and lowering points of the polishing head unit 31 are integrated into its polishing and grinding trajectory 73. This effectively plans a polishing and grinding trajectory 73 with the highest polishing efficiency, improving efficiency while also avoiding the holes to prevent contact between the polishing head unit 31 and the conveyor belt 21.

[0077] Optionally, in the specific steps of the slab polishing and grinding method, the polishing and grinding trajectory 73 may first be planned in S23. Then in step S24, the polishing head lifting point 61 and the polishing head lowering point 62 are determined based on the inner edge contour size data of the slab 7, the conveying speed data, and the polishing and grinding trajectory 73.Embodiment 4 A slab polishing and grinding method

[0078] The present embodiment discloses a slab polishing and grinding method, specifically applicable to adaptively connected polishing and grinding of slabs 7 with irregular contours. The method utilizes the slab polishing and grinding device described in Embodiment 1 to polish and grind the slab 7. Simultaneously, to enable the polishing head unit 31 to move along three axes-the first direction, second direction, and third direction-for adaptive polishing and grinding of slabs 7 of different shapes, the specific implementation steps include: S30: acquiring, using the detection assembly 4, outer edge contour position 71 data of the slab 7, and calculating, using a program built into the detection assembly 4, outer edge contour size data of the slab 7 based on the outer edge contour position 71 data; S31: acquiring, using the detection assembly 4, inner edge contour position 72 data of the slab 7, and calculating, using a program built into the detection assembly 4, outer edge contour size data of the slab 7 based on the inner edge contour position 72 data; S32: determining polishing-head turning points 5 based on the outer edge contour size data of the slab 7 and conveying speed data; S33: planning, using a preset algorithm, a polishing and grinding trajectory 73 according to the polishing-head turning points 5; S34: determining a polishing head lifting point 61 and the polishing head lowering point 62 based on the inner edge contour size data of the slab 7 and conveying speed data; S35: planning, using a preset algorithm, a lifting and lowering trajectory 74 according to the polishing head lifting point 61 and the polishing head lowering point 62; and S36: driving the polishing head unit 31 with the first-direction swinging driving unit 35 and the second-direction swinging driving unit 36 to swing along the polishing and grinding trajectory 73, and driving the polishing head unit 31 with the third-direction lifting and lowering driving unit 38 to lift and lower along the lifting and lowering trajectory 74 for adaptive edge contour polishing and grinding.

[0079] The technical means disclosed in the solution of the present application are not limited to those disclosed in the embodiments mentioned above but also include technical solutions consisting of any combination of the above technical features. It should be noted that for those skilled in the art, multiple improvements and modifications may be made without departing from the principles of the present application. These improvements and modifications are also considered to be within the scope of protection of the present application.

Claims

1. A slab polishing and grinding device, comprising: a conveying assembly (2), provided with a conveying plane for conveying a slab (7); a polishing and grinding assembly (3), disposed at an upper side of the conveying assembly (2), the polishing and grinding assembly (3) comprising a polishing head unit (31) swingable along a first direction and a second direction, wherein, within the conveying plane, the first direction is a conveying direction of the conveying assembly (2), and the second direction is a direction perpendicular to the conveying direction of the conveying assembly (2); and a detection assembly (4), located at a slab-entering end of the conveying assembly (2), and configured to detect an outer edge contour size of a peripheral outer side of the slab (7); wherein a plurality of polishing-head turning points (5) are disposed on the outer edge contour of the slab (7), and a polishing and grinding trajectory (73) is formed by planning according to the plurality of polishing-head turning points (5), the polishing head unit (31) swinging along the polishing and grinding trajectory (73) to polish and grind the slab (7).

2. The slab polishing and grinding device according to claim 1, wherein the polishing head unit (31) is liftable and lowerable along a third direction, the third direction is a height direction of the conveying assembly (2), and the detection assembly (4) is further configured to detect an inner edge contour size of a hole on the slab (7); wherein a polishing head lifting point (61) and a polishing head lowering point (62) are determined on the inner edge contour of the slab (7), and a lifting and lowering trajectory (74) for avoiding the hole is formed according to the polishing head lifting point (61) and the polishing head lowering point (62), the polishing head unit (31) lifts and lowers along the lifting and lowering trajectory (74), and the lifting and lowering trajectory (74) is formed within the polishing and grinding trajectory (73).

3. The slab polishing and grinding device according to claim 2, wherein the plurality of polishing-head turning points (5) are planned at intervals on both opposite outer edge contours of the slab (7) along the second direction; wherein on one outer edge contour, along the first direction, the plurality of polishing-head turning points (5) are sequentially marked as the i-th point, wherein i = {1, 2, ..., n}, and n represents a corresponding count and is a natural number greater than 1; on the other outer edge contour, along the first direction, the plurality of polishing-head turning points (5) are sequentially marked as the r-th point, r = {1, 2, ..., n}, and n represents a corresponding count and is a natural number greater than 1; and the plurality of polishing-head turning points (5) move along a path planned according to the i=1 point, r=1 point, r=2 point, i=2 point, i=3 point, r=3 point, ..., i=n point or r=m point to form the polishing and grinding trajectory (73).

4. The slab polishing and grinding device according to claim 3, wherein the i-th polishing-head turning point (5) and the r-th polishing-head turning point (5) are aligned along the second direction, wherein i=r.

5. The slab polishing and grinding device according to claim 3, wherein a polishing and grinding trajectory (73) between the i-th polishing-head turning point (5) and the r-th polishing-head turning point (5) is a first polishing and grinding path (731), wherein i=r; wherein the first polishing and grinding path (731) passes through an inner edge contour of a hole on the slab (7), and the polishing head lifting point (61) and the polishing head lowering point (62) are disposed at the inner edge contour.

6. The slab polishing and grinding device according to any one of claims 1 to 5, further comprising a frame (1), the polishing and grinding assembly (3) further comprising: a first guide rail (32), connected to the frame (1); a first beam body (33), slidably connected to the first guide rail (32); a fixing seat (34), slidably connected to the first beam body (33), the polishing head unit (31) being disposed on the fixing seat (34); a first-direction swinging driving unit (35), configured to drive the fixing seat (34) to move relative to the first beam body (33) along the first direction; and a second-direction swinging driving unit (36), configured to drive the first beam body (33) to move relative to the first guide rail (32) along the second direction.

7. The slab polishing and grinding device according to claim 6, wherein the first-direction swinging driving unit (35) is connected to the fixing seat (34), and the second-direction swinging driving unit (36) is connected to the first beam body (33); a straight rack (321) is fixed on the first guide rail (32), the first beam body (33) is slidably disposed on the first guide rail (32), and a driving end of the second-direction swinging driving unit (36) is provided with a gear (322) meshing with the straight rack (321); a driving end of the first-direction swinging driving unit (35) is provided with a rotating disk (37), the rotating disk (37) is eccentrically and rotatably connected to a connecting rod (371), and an end of the connecting rod (371) away from the rotating disk (37) is rotatably connected to the first beam body (33).

8. The slab polishing and grinding device according to claim 6, wherein the polishing and grinding assembly (3) further comprises: a third-direction lifting and lowering driving unit (38), connected to the fixing seat (34), a lifting end of the third-direction lifting and lowering driving unit (38) being provided with a main shaft (381), the main shaft (381) being connected to the polishing head unit (31); and a polishing head rotary driving unit (39), connected to the fixing seat (34), a driving end of the polishing head rotary driving unit (39) being connected via a transmission belt (391) to a rotary sleeve (382), the rotary sleeve (382) being sleeved outside the main shaft (381), and wherein one of the main shaft (381) and the rotary sleeve (382) is provided with a guide key and the other is provided with a guide groove.

9. A slab polishing and grinding method, applied to the slab polishing and grinding device according to any one of claims 1-8, comprising following steps: acquiring outer edge contour position (71) data of the slab (7), and calculating outer edge contour size data of the slab (7) using the outer edge contour position (71) data; determining polishing-head turning points (5) based on the outer edge contour size data of the slab (7) and conveying speed data; planning a polishing and grinding trajectory (73) according to the polishing-head turning points (5); and driving the polishing head unit (31) to swing along the polishing and grinding trajectory (73) for adaptive edge contour polishing and grinding.

10. The slab polishing and grinding method according to claim 9, further comprising the following steps: acquiring inner edge contour position (72) data of the slab (7), and calculating inner edge contour size data of the slab (7) using the inner edge contour position (72) data; determining a polishing head lifting point (61) and the polishing head lowering point (62) based on the inner edge contour size data of the slab (7) and conveying speed data; planning a lifting and lowering trajectory (74) according to the polishing head lifting point (61) and the polishing head lowering point (62); and driving the polishing head unit (31) to lift and lower along the lifting and lowering trajectory (74).

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