Electrical connector apparatus and method

Abstract

An electrical connector apparatus and method as described herein. The electrical connector may include a plug connector. The electrical connector may include a mating interface. The mating interface may include a plurality of plates. The electrical connector may include a substrate. The electrical connector may include a cable connector. The electrical connector may have at least a density of 256 differential pairs per square inch. The electrical connector may include at least one internal and / or external locking mechanism. The electrical connector and / or interposer may include a film. The electrical connector may include a cup shaped connector. The electrical connector and / or interposer may include one or more containment structures.

Description

ELECTRICAL CONNECTOR APPARATUS AND METHODBYJONATHAN BUCK TROY B. HOLLAND BRANDON GORE ANDANDREW JOSEPHSONATTORNEY REFERENCE: SAMTE-0009-WG-05CROSS-REFERENCE TO PREVIOUS APPLICATONS

[0001] This application claims priority from United States provisional patent application no. 63 / 511,451 filed on June 30, 2023, United States provisional patent application no. 63 / 625,851 filed on January 26, 2024, and United States provisional patent application no. 63 / 633,390 filed on April 12, 2024, the entire contents of which are hereby incorporated herein by reference in its entirety.TECHNICAL FIELD

[0002] The present embodiments relate generally to an electrical connector apparatus / assembly, with particular embodiments shown for an electrical connector.BACKGROUND

[0003] Typical connectors intended to operate at 112G / 224G PAM4 signaling may require a larger width of the die package substrate to accommodate. However, this practice of increasing the size of the die package substrate may increase insertion loss and / or make the die package substrate more susceptible to curling, warping, and / or losing coplanarity during reflow. Thus,there is a need to improve the die package substrate size, reduce the width of the connector, minimize coplanarity issues, and / or minimize insertion loss.

[0004] Mechanical, separable connectors can have mating cycle limitations, plating limitations, thermal limitations, size limitations, and signal integrity limitations.

[0005] The present invention is directed at overcoming, or at least improving upon, the disadvantages of the prior art.BRIEF DESCRIPTION OF OTHER TECHNICAL FEATURES

[0006] US Patent Nos. 6,612,852; 7,568,960; 7,927,144; 3,587,028; 11,539,169; 4,571,014; 4,720,770; 6,435,913; 6,506,076; 6,981,898; and 4,632,476 and US Publication Nos. US20200212631; US20200280145; US20220368084; US20090203259; US20050215120; US20110143602;US9905972; US9004925; US20050176301; US20080299841; W02010039867; and US20210265785 are hereby incorporated by reference in their entireties.BRIEF DESCRIPTION OF THE ILLUSTRATIONS

[0007] In the drawings, like reference characters generally refer to the same parts throughout the different views. Also, the drawings are not necessarily to scale, emphasis instead generally being placed upon illustrating the principles of the invention.

[0008] Figure 1 is a perspective view of one embodiment of an electrical connector assembly illustrating one embodiment of an electrical connector.

[0009] Figure 2 is an exploded view of the electrical connector assembly of Fig. 1.

[0010] Figures 3A is a perspective view of a plurality of electrical connectors of Fig. 1.

[0011] Figures 3B is a side view of a vertical cable of Fig. 3A.

[0012] Figures 3C is a side view of a right-angle cable of Fig. 3A.

[0013] Figure 4A is a perspective view of the right-angle cable and electrical connector of Fig. 3A.

[0014] Figure 4B is a perspective view of the right-angle cable of Fig. 4A.

[0015] Figure 5 is a perspective view of an embodiment of the mating interface of the electrical connector of Fig. 1.

[0016] Figure 6 is an exploded view of the mating interface of Fig. 5.

[0017] Figure 7 is a perspective view of the electrical connector assembly illustrating 1024 pairs.

[0018] Figure 8 is a perspective view of the electrical connector assembly illustrating 1192 and / or 1280 pairs.

[0019] Figure 9 is a perspective view of the electrical connector, illustrating the mating interface or plates surrounding the cable connector and / or spaced from the substrate for a distance.

[0020] Figure 10 is a perspective view of the electrical connector with the mating surface broken away.

[0021] Figure 11 is a chart illustrating the impedance profile of the cable to the package for one embodiment.

[0022] Figure 12 is a chart illustrating the shield return path transition impact for one embodiment.

[0023] Figure 13 is a chart illustrating the differential FD NEXT Power Sum for one embodiment.

[0024] Figure 14 is a chart illustrating the differential FD FEXT Power Sum for one embodiment.

[0025] Figure 15 illustrates a PKG and PCB embodiment of the 64 pair blocks.

[0026] Figure 16A and 16B illustrate an embodiment of a retention bracket.

[0027] Figure 17 is a portion of the PKG substrate routing.

[0028] Figure 18 is an embodiment of the PKG versus the PCB, the designs are rotated for vertical routing.

[0029] Figures 19A-19C are views of an embodiment of the Mezzanine, illustrating a height of less than 8mm.

[0030] Figure 20 is another embodiment of the electrical connector, with portions of the cable connector removed to illustrate a locking mechanism.

[0031] Figure 20A is an enlarged sectional view of Fig. 20 illustrating the latch locking mechanism of the engagement between portions of the mating interface.

[0032] Figure 21 is an exploded view of Fig. 20.

[0033] Figure 22 is a perspective view of the mating interface, illustrating the assembled receptacle base and ground member.

[0034] Figure 22A is an enlarged perspective view of Fig. 22.

[0035] Figure 23 is an exploded view of Fig. 22.

[0036] Figure 24 is a perspective view of a row of cavities of the mating interface receiving a row or plurality of connectors.

[0037] Figure 25 is an exploded view of Fig. 24.

[0038] Figures 25A and 25B are enlarged perspective views of Fig. 25.

[0039] Figure 26 is another embodiment of the electrical connector, with portions of the cable connector removed to illustrate a mating interface and portions of the plug connector broken away.

[0040] Figure 27 is a perspective view of the electrical connector of Fig. 26, with portions of the housing of the mating interface broken away and portions of the housing of the plug connector removed to illustrate an embodiment of a stiffener and a retention member.

[0041] Figure 28 is a perspective view of the electrical connector of Fig. 26, with the mating interface and cable connector exploded away from the plug connector, with portions of the housing of the mating interface removed.

[0042] Figure 29 is an exploded view of a row of cavities of the mating interface of Fig. 26 receiving a partial row or plurality of connectors.

[0043] Figure 30 is a chart illustrating the differential FD NEXT Power Sum for one embodiment shown in Fig. 26.

[0044] Figure 31 is a chart illustrating the differential FD FEXT Power Sum for one embodiment shown in Fig. 26.

[0045] Figure 32 is an exploded view of one embodiment of an electrical assembly having an interposer or film exploded away from a housing and a twin axial cable.

[0046] Figure 33 is a perspective view of one embodiment of a film, or more specifically a nonconductive portion(s), prior to forming one or more conductive materials or portions thereto.

[0047] Figure 34 is a perspective view of the film after forming the conductive material(s) or portion(s) to the nonconductive portion(s) of Fig. 33.

[0048] Figure 35 is a sectional view taken along line 35-35 of Fig. 34.

[0049] Figure 36 is a sectional view taken along line 36-36 of Fig. 34.

[0050] Figure 37 is a sectional view taken along line 37-37 of Fig. 34.

[0051] Figure 38 is a perspective view of another embodiment of a film, or more specifically a nonconductive portion(s), prior to forming one or more conductive materials or portions thereto.

[0052] Figure 39 is a perspective view of the film after forming one or more conductive material(s) or portion(s) to the nonconductive portion(s) of Fig. 38.

[0053] Figure 40 is a top view of another embodiment of a film, or more specifically a nonconductive portion, prior to forming a conductive material or portion thereto.

[0054] Figure 41 is a top view of the film after forming the conductive material(s) or portion(s) to the nonconductive portion(s) of Fig. 40.

[0055] Figure 42 is a side view of one embodiment of a film splitting a signal.

[0056] Figure 43 is a side sectional view of a cable to cable application of one embodiment of a film therebetween, and illustrating the cables are twin axial cables.

[0057] Figure 44 is a side sectional view of a cable to cable application of one embodiment of a film therebetween, and illustrating the cables are coax cables.

[0058] Figure 45 is a side sectional view of a cable to board application of one embodiment of a film therebetween, and illustrating the cable embodiment is a coax cable.

[0059] Figure 46 is a side sectional view of a board to board application of one embodiment of a film therebetween.

[0060] Figure 47 is a perspective view of one embodiment of an electrical connector.

[0061] Figure 48 is a sectional view of the electrical connector taken along line 48-48 of Fig. 47, and illustrating the pin / contact axially engaging the nonconductive receptacle and the circumferential forces applied thereto.

[0062] Figure 49 is an exploded view of the electrical connector of Fig. 47.

[0063] Figure 50 is a perspective view of another embodiment of a film, or more specifically a nonconductive portion(s), prior to forming one or more conductive materials or portions thereto.

[0064] Figure 51 is a perspective view of the film after forming one or more conductive materials or portions to the nonconductive portion(s) of Fig. 50.

[0065] Figure 52 is a sectional view taken along line 52-52 of Fig. 51.

[0066] Figure 53 is a perspective view of another embodiment of a film, or more specifically a nonconductive portion(s), prior to forming one or more conductive materials or portions thereto.

[0067] Figure 54 is a perspective view of the film after forming one or more conductive materials or portions to the nonconductive portion(s) of Fig. 53.

[0068] Figure 55 is a side sectional view of a cable to cable application of one embodiment of a film therebetween, and illustrating the cables are twin axial cables.

[0069] Figure 56 is a side sectional view of a cable to cable application of one embodiment of a film therebetween, and illustrating the cables are coax cables.

[0070] Figure 57 is a side sectional view of a cable to board application of one embodiment of a film therebetween, and illustrating the cable embodiment is a coax cable.

[0071] Figure 58 is a side sectional view of a board to board application of one embodiment of a film therebetween.

[0072] Figure 59 is a side sectional view of a cable to cable application of another embodiment of a film therebetween without one or more conductive portions such as in Fig. 50, and illustrating the cables are twin axial cables.

[0073] Figure 60 is a side sectional view of a cable to cable application of one embodiment of a film therebetween without one or more conductive portions such as in Fig. 50, and illustrating the cables are coax cables.

[0074] Figure 61 is a side sectional view of a cable to board application of one embodiment of a film therebetween without one or more conductive portions such as in Fig. 50, and illustrating the cable embodiment is a coax cable.

[0075] Figure 62 is a side sectional view of a board to board application of one embodiment of a film therebetween without one or more conductive portions such as in Fig. 50.

[0076] Figure 63 is a top view of one or more cables connected to one embodiment of a film or one or more conductive portions of the film, and illustrating the cables are a wire.

[0077] Figure 64 is a perspective view of one embodiment of an interposer, illustrating the conductive material(s) or portion(s) and the nonconductive material(s) or portion(s).

[0078] Figure 65 is sectional view taken along line 65-65 of Fig. 64.

[0079] Figure 66 is a sectional view of a twin axial cable to coax cables application of the interposer ofFig. 64 therebetween.

[0080] Figure 67 is an exploded view of the application of Fig. 66.

[0081] Figure 68 is a top view of one embodiment of a compressive application, interposer, or film.

[0082] Figure 68A is an enlarged view of the interposer of Fig. 68.

[0083] Figure 69 is a perspective view of one embodiment of a film of Fig. 68, or more specifically a nonconductive portion(s), prior to forming / coupling one or more conductive materials or portions thereto.

[0084] Figure 70 is a perspective view of the film after forming the conductive material(s) or portion(s) to the nonconductive portion(s) of Fig. 69.

[0085] Figure 71 is a sectional view taken along line 71-71 of Fig. 70.

[0086] Figure 72 is a perspective view of another embodiment of a film of Fig. 68, or more specifically a nonconductive portion(s), prior to forming / coupling one or more conductive materials or portions thereto.

[0087] Figure 73 is a perspective view of the film after forming / coupling one or more conductive materials or portions to the nonconductive portion(s) of Fig. 72.

[0088] Figure 74 is a sectional view taken along line 74-74 of Fig. 73.

[0089] Figure 75 is a perspective view of a film illustrating one embodiment of one or more containment structures of a film, or portions thereof.

[0090] Figure 76 is a sectional view taken along line 75-75 of Fig. 75.

[0091] Figure 77 is a side sectional view of a cable to cable application of one embodiment of a film of Fig. 75 therebetween, and illustrating the cables are coax cables.

[0092] Figure 78 is a perspective view of a film illustrating another embodiment of one or more containment structures of a film, or portions thereof.

[0093] Figure 79 is a sectional view taken along line 78-78 of Fig. 78.

[0094] Figure 80 is a side sectional view of a cable to cable application of one embodiment of a film of Fig. 78 therebetween, and illustrating the cables are coax cables.

[0095] Figure 81 is a side sectional view of a cable to board application of one embodiment of a film therebetween, and illustrating the cable embodiment is a power cable.

[0096] Figure 82 is a perspective view of an electrical assembly having an interposer or film mounted to an edge card embodiment.

[0097] Figure 83 is a perspective view of an inner periphery and / or one half of the connector of Fig. 82, illustrating one or more conductive portions or film positioned within the connector.

[0098] Figure 84 is a sectional view taken along line 84-84 of Fig. 82, illustrating the edge card deployed and the one or more conductive portions and / or film uncompressed and having a first thickness.

[0099] Figure 85 is a sectional view taken along line 84-84 of Fig. 82, illustrating the edge card stowed and the one or more conductive portions and / or film compressed and having a second thickness smaller than the first thickness.[OOlOOJFigure 86 is a sectional view taken along line 86-86 of Fig. 82, illustrating the edge card removed and the one or more conductive portions and / or film uncompressed and having a first thickness.[OOlOlJFigure 87A is a perspective view of a plurality of contacts.

[0102] Figure 87B is a perspective view of the contacts of Fig. 87A inserted or overmolded into a mold and / or wafer.

[0103] Figure 87C is a perspective view of the mold and / or wafer of Fig. 87B with contacts inserted into a shield and illustrating the conductive portion(s) or film exploded therefrom.

[0104] Figure 87D is a perspective view of the wafer and contacts of Fig. 87C with the conductive portion(s) or film printed or engaged thereto.

[0105] Figure 87E is a perspective view of a connector formed from abutting two Fig. 87D wafers and contacts and conductive portions / film.

[0106] Figure 88A is a bottom perspective view of the connector of Fig. 82, and illustrating a mounting interface of another conductive portion(s) or film exploded therefrom.

[0107] Figure 88B is a bottom perspective view of the connector of Fig. 88A, and illustrating the conductive portion(s) or film printed or engaged thereto.

[0108] Figure 89 is a bottom perspective view of one embodiment of the electrical connector assembly.

[0109] Figure 90 is an enlarged perspective view of the electrical connector assembly of Fig. 89.

[0110] Figure 91 is a sectional view along line 91-91 of Fig. 89.

[0111] Figure 92 is a sectional view along line 92-92 of Fig. 89.

[0112] Figure 93 is an exploded view of a wafer and film exploded from a portion of and / or assembled wafers of the cable organizer.

[0113] Figure 94A is a perspective view of one embodiment of cable engaging a channel of a cable organizer, and illustrating a conductive elastomer or portion surrounding the foil of the cable.

[0114] Figure 94B is a perspective view of one embodiment of cable engaging a channel of a cable organizer, and illustrating a cable without foil.

[0115] Figure 94C is a perspective view of one embodiment of cable engaging a channel of a cable organizer, and illustrating a cable with foil.

[0116] Figure 95 is a perspective view of a vertical cable in compression with a film via a cable organizer.

[0117] Figure 96 is a perspective view of an angled cable in compression with a film via a cable organizer.DETAILED DESCRIPTION

[0118] Embodiments may further be understood with reference to the various Figures. With reference to Figures, an embodiment provides for one or more electrical connector assemblies 20. The assembly 20 may include at least one or more electrical connectors 30. In some embodiments, the electrical connectors may include a width of about 12.5 mm, operation at about 224 Gbps, and / or a package size of about 75mm. The number of pairs may be 64 in less than half an inch or a density of greater than 256 pairs per square inch. In some embodiments, an electrical connector may be sized and shaped such that a plurality of the electrical connectors may fit on a single side of a die package substrate that is no larger than approximately 75mm by 75mm to approximately 85mm to 85mm, the plurality of electrical connectors may collectively carry at least 1024 differential signal pairs, and the plurality of electrical connectors transmit approximately 224GbpsPam4 signals at approximately 56GHz to approximately 70GHz of bandwidth with no more than approximately -40dB of FEXT (far end crosstalk). In various embodiments, an electrical connector may be sized and shaped such that a plurality of the electrical connectors may fit on a single side of a die package substrate that is no larger than approximately 75mm by 75mm to approximately 85mm to 85mm, the plurality of electrical connectors collectively carry at least 1024 differential signal pairs, and the plurality of electrical connectors transmit approximately 224Gbps Pam4 signals at approximately 56GHz to approximately 70GHz of bandwidth with no more than approximately -50dB of NEXT (near endcrosstalk). In some embodiments, the die package substrate with sides no larger than approximately 75-96mm each, including approximately 80mm±5mm and 91mm±5mm, the plurality of electrical connectors collectively carry at least 1024 differential signal pairs, and the plurality of electrical connectors transmit approximately 224Gbits / sec PAM-4 signals at approximately 56GHz to approximately 70GHz of bandwidth with no more than approximately -40dB of FEXT.

[0119] Referring now to the Figures, Figs. 1-4B illustrates an exemplary embodiment of an electrical connector assembly 20 according to an aspect of the present invention. Electrical connector assembly 20 includes an electrical connector 30 and / or a plurality of cable connectors 40 configured to mate with electrical connector 30. Electrical connector 30 may include or be connected to a circuit substrate 50, such as, e.g., die package substrate 50a, a printed circuit board 50b. As shown in the one embodiment, the connector 30 may be positioned / fit on a single side of the circuit substrate 50 (e.g. 50a, 50b). However, the connector 30 may be positioned on both sides in some embodiments. Referring to Figs. 5 and 6, electrical connector 30 may include a mating interface or cable head organizer 60 (e.g. egg-crate mating interface or shield). The mating interface 60 may include a plurality of interlocking plates 62 defining a plurality of cavities 63. The connector 30 may include or is configurated to mate with one or more cable connectors 40. Each cavity 63 is sized for accepting or mating to the cable connector 40. The electrical connector 30 may include one or more plug connectors 70. The electrical connector 30 or plug connector 70 further includes one or more electrical contacts 71 and / or one or more ground contact elements 72. Each electrical contact 71 is positioned within the cavity 63, electrically isolated from interlocking plates 62, and configured to mate with a contact or signal conductor 42 (e.g. socket) of the cable connector 40. Each of the ground contact elements 72 iselectrically grounded and configurated to mate with at least one plate 62 (e.g. directly, indirectly, first plate, second plate). The plug connector 70 (e.g. ground contact elements, electrical contact) is soldered to the circuit substrate 50 (e.g. 50a, 50b). In some embodiments as shown in Fig. 7, the 1024 pair solution may be used. In other embodiments as shown in Fig. 8, a 1192 or 1280 pair solution may be used.

[0120] In some implementations, at least one of interlocking plates 62 (e.g. first) is electrically conductive and provides a ground connection between cable connector 40 and circuit substrate 50, or portions thereof. Generally, interlocking plates 62 may be electrically conductive or insulative. As shown in Figs. 9 and 10, at least one interlocking plates 62 include a terminal end 64 spaced away from the circuit substrate 50 and a mating end 65 for electrically contacting an electrically conductive outer shield element 43 of the cable connector 40. To lower / control the impedance back and forth, a spacing or distance D from the circuit substrate 50 (e.g. package, 50a, 50b) to the terminal end 64 of the plate 62 / shield 43 may be reduced by a length L of the plates 62 or cavities 63. The remaining portion of the length or distance D from circuit substrate to the terminal end 64 may be at least one source of the crosstalk. The plates 62 defining the cavity 63 cover or overlap about 85 to 95 percent of the length of the cable connector 40 to the package or substrate 50 to minimize the distance D. As shown in the one embodiment in Fig. 9, the plates 62 defining the cavity 63 covering / overlapping about 90 percent or the length L of the cable connector 40 to the package to reduce the crosstalk, while the remaining portion or distance D may be about 10 percent to the substrate. One embodiment of the impedance profile of the cable to package is shown in Fig. 11, the simulation shown with a TDR signal of 92Q + / - 5Q at 6ps (20%-80% rise time).

[0121] In some implementations, the terminal end 64 of the plates 62 or cavities 63 may be spaced (e.g. predetermined distance D) from the package / substrate 50. The terminal end 64 or plate 62 may abut / position / mate with the ground contact element 72 of the plug connector at the distance D.The contact element 72, or portions thereof, may space the plate 62, or portion thereof, (e.g. terminal end 64) from the substrate 50 at the distance D. In the one embodiment shown, the ground contact element 72 extends / projects from the circuit substrate 50 (e.g. 50a, 50b). The ground contact element 72 may include one or more arms / blades. For example, the ground contact element may include at least one arm, at least two arms, at least three arms, at least four arms, or four or more arms. The increase in the number of arm(s) may increase contact area / width when mating to the mating interface (e.g. plate(s)). As shown in the one embodiment, the ground contact element 72 may include two arms 72a, 72b (e.g. at least two laterally offset, cantilevered beams) extending upwardly and away from each other to define a slot 73 to receive the terminal end 64 of the plate(s) 62 (e.g. first). The two arms may diverge from the remaining portion of the ground contact element or body. The two arms 72a may be offset by a distance from each other along the length or plane of the slot 73 receiving the plate(s) 62. Although the arms may not overlap or cross along the length of the slot, it should be understood that a portion of the arms may overlap in some embodiments. The slot or one of more portions of the ground contact element 72 (e.g. arm(s)) may define a stop or vertical stopping mechanism for limiting further axial travel of the plate 62 within the slot or towards the circuit substrate. The stop may position the mating interface, plate, or cavity at the distance D. Further, the first and second arms 72a, b may be mirror images of each other with the plane of the slot 73. The first arm 72a engages the interior of one cavity / plate and the second arm 72b engages the interior of the adjacent cavity / plate. In the one embodiment shown, two groundcontact elements 72 may engage adjacent and parallel plates 62 (e.g. first), and not the adjacent second plates defining the cavity 63 receiving the cable connector 40. However, in some embodiments, one or more ground contact elements 72 may engage one or more second plates and / or in combination with one or more first plates. In the one embodiment shown, each arm 72a, b may be spring loaded or biased to urge towards the slot 73 or engaged plate 62. Further, each arm or distal free end of the arm may flare / curve away from the slot or engaged plate. As shown in the one embodiment, the arms 72 may be surrounded by air or free space, without contact with a plastic or insulating member. No plastic may be between the mating ends of the ground contact elements 72 and the mating ends of the signal contacts 71. The mating ends of71 and 72 may be unrestricted or not surrounded by plastic or insulating member(s). The arms72 (e.g. mating ends) may be freestanding, project, and / or extend (e.g. not internal to plastic) above the plastic of plug connector 70 at the base of the arm. Further, there may be no plastic or insulating material along a line that extends between mating end of arm 72b and an immediately adjacent mating end of arm 72b. One example of the S-parameter of the shield return path or ground contact element is illustrated in Fig. 12. The simulation embodiment shown in Fig. 12 was conducted at 92Q + / - 5Q at 6ps (20%-80% rise time). In some implementations, the contact(s) may include one or more solder ball / masses 74. In the one embodiment shown, the ground contact element 72 includes at least one solder mass 74. It should be understood that the ground contact element 72 may include one or more solder masses. For example, at least one solder mass, at least two solder masses, or at least three solder masses. In some embodiments, the two or more solder masses may be immediately adjacent to each other (e.g. linearly aligned).In some embodiments, the soldering for the contacts may be one or more elongated pads of avariety of lengths. In some implementations, the electrical / signal contacts 71 may be perpendicular to the ground contact elements 72.

[0122] In a preferred embodiment, interlocking plates 62 are metal plates formed by any suitable method, such as, e.g., metal stamping. In other embodiments, interlocking plates 62 are formed by other means, including molding and / or machining of polymeric material, molding and / or machining of metal, or construction of a metal frame overmolded with a polymeric material. In some embodiments, a plastic frame / base may be plated.

[0123] In some implementations, interlocking / interconnected plates 62 include a plurality of first plates 62a and a plurality of second plates 62b as shown in Figs. 5 and 6. The plate(s) 62 may include one or more grooves 66 and / or one or more slots 67. The grooves, if used, may be interlocking with the slots, if used, to define the cavities 63. The first plate 62a may include a plurality of first slots 67a aligned with a plurality of first grooves 66a. The second plate 62b may include a plurality of second slots 67b aligned with a plurality of second grooves 66b. Second plates 62b are transversely positioned and interconnected with respect to first plates 62a by interlocking first slot 67a with the second groove 66b and interlocking the second slot 67b with the first groove 66a such that when assembled, the plurality of first plates and second plates define the plurality of cavities 63. The slot / groove engagements 66, 67 or mating interface 60 provide a fully enclosed or 360 degree shield / circumference about one or more cable connectors 40. The 360 shield or plates reduce the crosstalk between the cable connectors within the cavities. This may prevent or reduce gaps / holes / pathways in the cavity walls to reduce crosstalk. The walls of the slot / groove engagements may abut or overlap edges of the opposing slot / groove engagement to reduce gaps. As shown in Fig. 13, the plurality of electrical connectors may transmit approximately 70Ghz signals with no more than approximately -40dB of FEXT (far endcrosstalk). The simulation embodiment shown in Fig. 13 was conducted at 92Q + / - 5Q at 6ps (20%-80% rise time).

[0124] In some implementations, the mating interface 60 may include a housing 68. The housing 68, if used, may include a plurality of grooves 69 positioned in the inner periphery. The groove(s) 69 may maintain spacing of the cavities 63 / plates 62 and / or provide rigidity to the one or more plates 62. The grooves 69 may receive the ends of the first plate 62a and the second plate 62b.

[0125] In some implementations, the electrical connector 30 may include one or more gaps / spaces 32 between the cable connectors 40 to reduce crosstalk. In some embodiments, the more space or distance between rows may lower NEXT of the PKG. In the one embodiment shown, the gap 32 may be defined by one or more rows of cavities 63 defined by the plurality of plates 62 that do not contain the cable connectors 40. The one or more rows without the cable connectors 40 or gaps 32 within the array of cable connectors 40 may reduce the crosstalk between the cable connectors 40. As shown in the one embodiment, the one or more rows / gaps 32 without the cable connectors 40 may be defined by a plurality of smaller cavities (e.g. smaller through opening) or closer spaced plates(s). The smaller row or gap 32, if used, may be defined by at least two adjacent and parallel plates (e.g. first plates 62a and / or second plates 62b) being spaced at a less distance than the remaining parallel plates. The grooves 66 and slots 67 may be positioned on the respective plates 62 to define the gap(s) 32 of a variety of row to row spacing / distances D. Although not shown, the intersecting plates 62 of both the first plates and the second plates may be spaced at a less distance (e.g. row to row) to define a smaller row. Further, as shown in Fig. 14, the plurality of electrical connectors may transmit approximately 70Ghz signals with no more than approximately -50dB of NEXT (near end crosstalk). Thesimulation embodiment shown in Fig. 14 was conducted at 92Q + / - 5Q at 6ps (20%-80% rise time).

[0126] In some implementations, the assembly / connector, or portions thereof (e.g. mating interface, plug connector, and / or cable connector) may be a 224 Gbps Pam4 signal with 92Q + / - 5Q at 6ps with 20%-80% rise time as simulated in one embodiment. In some embodiments, the bandwidth may be about 70 to 50 GHz. In some embodiments, the bandwidth may be about 56 GHz. In various embodiments, the FEXT may be about -30dB to about -45dB. For example, under or equal to -30dB, under or equal to -35dB, under or equal to -40dB, and / or under or equal to - 45dB. In some embodiments, the insertion loss may be between about OdB to about -5dB. For example, between OdB and -IdB, between -IdB and to -2dB, between -2dB and to -3dB, between -3dB and to -4dB, and / or between -4dB and to -5dB. The bandwidth may be about 50 GHz to about 80 GHz. For example, 50 GHz, 55 GHz, 60 GHz, 65 GHz, 70 GHz, 75 GHz, and / or 80 GHz. In various embodiments, the NEXT may be about -40dB to about -60dB. For example, under or equal to -40dB, under or equal to -45dB, under or equal to -50dB, under or equal to -55dB, and / or under or equal to -60dB. In some embodiments, the insertion loss may be between about OdB to about -5dB. For example, between OdB and -IdB, between -IdB and to -2dB, between -2dB and to -3dB, between -3dB and to -4dB, and / or between -4dB and to - 5dB. The bandwidth may be about 50 GHz to about 70 GHz. For example, 50 GHz, 55 GHz, 60 GHz, 65 GHz, and / or 70 GHz.

[0127] In some implementations, the assembly 20 or electrical connector 30 may include a bend / cable organizer 80 for one or more cables 90. The bend / cable organizer 80 may include a strain relief 81 in some embodiments. The strain relief 81, if used, may be a hot melt. As shown in Figs. 3A and 15, the bend organizer 80 may be used with a vertical cable 90a or a right-angle cable 90b.The overall height of the electrical connector 30 or assembly 20 may be less than 15mm. The right-angle cable 90b with bend organizer 80 may define a height of about 15mm. The vertical cable 90a with bend organizer 80 may define a height of about 10mm.

[0128] In some implementations, one or more cables 90 may be connected to the one or more cable connectors 40. Although the cable 90 is shown as a twin cable in the one embodiment shown, it should be understood that a variety of cables may be used and still be within the scope of the invention. For example, a coax cable may be used in some embodiments. Cable 90 can include a shield, such as a wrapped shield or an extruded shield or any type of ground, or reference, or EMI shield. The shield can be stripped with respect to an exposed surface of the center electrical insulator, can be partially stripped, but is not limited to, a length of greater than zero mm to approximately 1 mm to 2 mm, or zero mm, or 2 mm or larger, or zero mm to 0.5 mm. Any of the connectors may include electrically conductive or electrically lossy, magnetic absorbing material.

[0129] In some implementations, the assembly 20 or electrical connector may include one or more retention brackets 95. As shown in Figs. 16A and 16B, one example of a retention bracket 95 may be one or more spring fingers. The retention device, if used, may ensure mated parts and / or allow service. Another example of the retention bracket may be latching.

[0130] In some implementations, the circuit substrate 50 may have a routing determining density. For example, as shown in Fig. 17 the PKG or die substrate package may start with a 350 um pitch to minimize FEXT and squeeze the pitch down to 200um as route pass vias. The BGA pitch of 0.35 may determine the routing density (e.g. 224 Gbps). There may be a PCB embodiment of 64 pair blocks. The PCB version may be about 5mm wider and deeper than the die substrate package as shown in Fig. 15. Further, one embodiment of the PKG versus the PCB embodimentis shown in Fig. 18. The designs are shown rotated for vertical routing. The PKG may be 2 layers and the PCB may be 4 / 8 layers.

[0131] In some implementations, the electrical connector assembly may include a lower RA height option. For example, the cable organizer may be less than 8mm with compatibility. As shown in Figs. 19A-19C, the configuration may be a stacked flex 98 in a mezzanine configuration. One example as shown, may be four 3 -layer flex films, stacked and one soldered to the connector. The flex 98 may be converted to one or more cables for longer lengths.

[0132] In some implementations, the electrical connector assembly 20, electrical connector 30, mating interface 60, 160, substrate 50, and / or plug connector 70, 170 may include one or more locking mechanisms 82, or portions thereof, coupling the mating interface 160 with the plug connector 170. In the one embodiment shown in Figs. 20-23, the locking mechanism 82 may be a middle or internal locking mechanism spaced or positioned inwardly from or within the outer periphery (e.g. outer housing, walls) of the electrical connector 30 / connector 170 / mating interface 160. The locking mechanism 82 may include one or more latches, clips, or friction locks 82a (e.g. middle, internal). The one or more clips 82a are shown internal or inside to / within the plug connector 170, mating interface 160, and / or electrical connector 30 (e.g. outer periphery). Although the clips 82a are shown internal to the electrical / phig connector 30, 170 and / or mating interface 160, it should be understood that external clips (e.g. positioned on the outer periphery, wall) may be used in combination with the internal clip(s) / locking mechanism in some embodiments. The one or more clips 82a project upwardly from the bottom of the plug connector 170 and / or substrate 50, and / or spaced interior of the outer periphery. The clips may project upwardly from a middle or internal wall 82ab extending between or within the outer peripheral walls (e.g. opposing walls) of the mating interface 160 (e.g. base, ground member) orplug connector 170. In the one embodiment shown, two spaced apart clips 82a may be spring loaded in a transverse direction (e.g. opposing directions, inwardly towards opposing sides of the internal panel 82b) to the plane of the clips 82a and / or internal wall 82ab. The clips 82a apply friction to the locking mechanism 82 of the mating interface 160, or portions thereof, (e.g. internal panel 82b, catches 82ba) to reduce or prevent axial separation between the mating interface 160 and the plug connector 170. The locking mechanism 82, or portions thereof, of the mating interface 160 may be one or more receptacles / catches 82ba and / or internal panel 82b releasably engaging the one or more clips 82a. When assembled, the clips 82a engage the internal panel 82b, or portions thereof, (e.g. upper notches / catches / receptacles 82ba) of the mating interface 160. The clips 82a of the plug connector 170 interfere with the axial separation of the mating interface 160 or intemal / middle panel 82b. The internal panel 82b may be positioned in the gap 32 between the cable connectors 40 and / or cavities 32 (e.g. rows of cable connectors). The internal panel 82b may include one or more notches / catches 82ba in the upper edge thereof. If two notches 82ba are used, the notches may be spaced away from each other along the length of the panel 82b. One or more portions of the locking mechanism 82 may be reversed between the mating interface 160 and the plug connector 170. For example, it should be understood in some embodiments the mating interface 160 may include the clips and the plug connector 170 may include the internal panel.

[0133] In the one embodiment shown in Figs. 20-25, the mating interface 160 may include a plurality of interlocking plates 62 defining at least one row R1 of cavities 63 receiving at least one row or one or more cable connectors 40. The interlocking plates 62 may include at least two third / opposing / parallel plates 62c interconnected by one or more fourth / parallel plates 62d transverse to the third plate. The fourth plates 62d may define opposing end plates at theopposing ends of the row of cavities or third plates 62c. Each row R1 may include the third and fourth plates. The mating interface 160 may include a plurality of rows R1 defined by the third and fourth plates. The cavities 63 may have a through opening (e.g. open top and open bottom) defined by the third and fourth plates 62c, 62d. In some embodiments, the third plates 62c may include one or more through apertures 62ca receiving one or more projections 62da extending from the outer periphery (e.g. opposing ends / sides) of the fourth plates 62d when assembled. As shown in the one embodiment in Figs. 24, 25, and 25B, the third plate(s) 62c may include one or more through apertures or elongated slots 62ca (e.g. in the direction between the mating end 65 towards the terminal end 64). As shown in Figs. 24, 25, and 25A, each fourth plate 62d may include one or more protrusions or elongated protrusion 62da on opposing sides / edges, engaging the corresponding elongated slots 62ca of opposing third plates 62c. The mating end 65 of one or more of the third plates 62c and / or the fourth plates 62d may include a plurality of curved edges to mate or contour with the one or more cables 90 or cable connector 40. The other of the opposing / parallel third plate 62c may be longer than and extend beyond the curved edges, if used, as shown in Figs. 24 and 25. In some embodiments, solder paste may be used adjacent the engagement of the apertures / projections. The cavities defined by the third and fourth plates 62c, 62d may receive the cable connectors 40. The end plates or fourth plates 62d may be spaced inwardly from the opposing ends of the third plates or rows R1 to define a groove 200b. The groove 200b may include a bottom opening to receive or insert the tongue member 200a of the remaining portion of the mating interface 160 (e.g. base, ground member). The third / fourth plates 62c, 62d (e.g. ground, metal) may be stamped and / or plated. In some embodiments, the plates 62 may be cream solder printed, solder plated, and / or laser welded together. The cavities or third and / or fourth plates may be assembled with one or more hot blades with the one or morecable connectors 40 therein. When assembled, a row R1 of cavities defined by the third and fourth plates 62c, 62d are positioned adjacent to one or more rows R1 of cavities. Adjacent third plates 62c of adjacent cavities / rows R1 may be positioned parallel to and / or in contact with each other as shown in Figs. 20, 20A, and 21. As shown in the one embodiment in Fig. 20, the locking mechanism 82, or portions thereof, internal wall 82ab, gap 32, internal panel 82b, notch 82ba, and / or clip 82a may space two adjacent rows R1 from each other.

[0134] In some implementations, the mating interface 160 may include the plates (e.g. third, fourth, etc.), a receptacle base 160a, and / or a ground member 160b. In some embodiments, the receptacle base 160a may be, but is not limited to, molded plastic and / or the ground member 160b may be, but is not limited to, stamped metal (e.g. conductive). The base 160a or mating interface 160 may include one or more internal panels 82b and / or locking mechanism(s) 82, or portions thereof, in some embodiments. The base 160a may include the housing 68 having an outer peripheral wall(s) 68a defining a through opening 68b. The internal panel 82b may be inside or within the outer periphery and extend between opposing walls of the outer peripheral walls 68a and / or intersecting the through opening 68b. The ground member 160b may include an outer peripheral wall 68c defining a through opening 68d. The outer peripheral wall 68c of the ground member 160b may include a channel 68e (e.g. U-shaped, inverted channel). The ground member outer peripheral wall 68c may mate with the base outer peripheral wall 68a. The channel 68e or ground member walls 68c may receive the upper edge of the base outer peripheral walls 68a. The mating interface 160 may include one or more tongue and groove engagements 200. Opposing walls 68c of the ground member 160b may include one or more tongue members or mating surfaces 200a, adjacent opposing walls of the base 160a. The tongue members 200a are positioned along at least one wall of the base 160a / ground member 160b andmay be spaced away from each adjacent tongue member 200a along the wall(s) by a slot 68f (e.g. vertical, longitudinal). Although not shown, the slot 68f may increase in width from distal free end of the tongue towards the proximal end or upper edge of the ground member. For example, the slot may include an upper slot portion larger than a lower slot portion. The tongue members may be interior to the outer peripheral walls 68a and mate / engage with the one or more grooves 200b of the one or more rows Rl / opposing ends of the third and / or fourth plates 62c, 62d of the mating interface. Although not shown, the tongue members, or portions thereof, may be spaced inwardly away from the interior surface of the base walls 68a. The plates 62c, 62b may contact one or more walls 68c (e.g. opposing walls, one wall, two walls, three walls, etc.) of the ground member 160b and / or adjacent plates / rows (e.g. 62c, 62b).

[0135] In some implementations, the plates 62c, 62d defining the one or more rows R1 of cavities 63 may engage the ground member 160b and / or base 160a by one or more latches. In the one embodiment shown in Figs. 20-24, the latch may be one or more tongue and groove engagements 200 between the plates 62 (e.g. third and fourth) and the ground member 160b and / or base 160a. It should be understood that a variety of engagements or latches may be used between the plates 62 and the ground member 160b. The one or more opposing tongues 200a of the base / ground member engage or are received by the opposing grooves 200b or ends of the one or more rows R1 of cavities 63 defined by the third and fourth plates, and / or positions the third plates 62d of adjacent rows R1 in contact with each other when assembled. The tongues 200a and / or grooves 200b adjacent opposing walls of the ground member 160b may be adjacent the opposing ends of the internal panel 82b, if used. The ends of the third plates 62c or groove 200b (e.g. a portion of the row Rl) may extend between the tongue 200a, or portions thereof (e.g. slots 68f), and / or the base wall 68a to slidiable engage the tongue and groove engagementtherebetween. A latch locking mechanism 300 may be used in some embodiments to axially lock the tongue and groove engagement 200 or mating interface portions therebetween. In the one embodiment shown in Figs. 20-25, latch locking mechanism 300 may be a releasable engagement between the ground member 160b and the plates 62 (e.g. 62c, 62d) and / or row(s) Rl. As more clearly shown in Fig. 20A, one or more third plates 62c may include one or more protrusions 300a adjacent to and projecting outwardly from the opposing ends of the one or more rows Rl that releasably mate with one or more protrusions 300b extending away from or laterally from adjacent tongues 200a into the slot 68f therebetween. The protrusion(s) 300b, if used, may narrow a portion of the slot 68f between adjacent tongues 200a. The latch locking mechanism 300 (e.g. protrusions 300a, 300b, openings, etc.), if used, may engage upon axial engagement / traveling (e.g. sliding) for a distance when engaging the tongue and groove engagements 200. For example, relative sliding therebetween of the tongue and groove engagement results in engagement (e.g. axial) of the one or more protrusions 300a of the row of cavities / plates of the mating interface containing the cable connectors 40 with the one or more protrusions 300b of the ground member and / or base of the mating interface. Further, when the mating interface 160 is assembled to the plug connector 170, the clip(s) 82a, if used, may extend upwardly between the internal panel 82b and the adjacent third plate 62c of the row(s) Rl of cavities / connectors on one or both sides of the internal panel. If two clips 82a are used as shown in the one embodiment, the clips may extend along or mate with opposing sides of the internal panel 82b of the base 160a.

[0136] In some implementations, the electrical connector 30 and / or cable connector 40 may include the shielding (e.g. 60, 160) of the differential signal pairs while the plug connector 70, 170 does not provide shielding of the differential signal pairs. As shown in Figs. 1, 21, and 26, the plugconnector 70, 170 is devoid of its own, separate circumferential shielding or egg-crate shielding (e.g. crosstalk). Only the electrical connector 30 and / or cable connector 40 includes the circumferential, egg-crate shielding (e.g. crosstalk) or mating interface 60, 160 of the differential signal pairs.

[0137] In some implementations, the electrical connector assembly 20, electrical connector 30, mating interface 60, 160, substrate 50, and / or plug connector 70, 170 may include one or more locking mechanisms 182, or portions thereof, coupling the mating interface 160 with the plug connector 170 (e.g. housing, substrate). In the one embodiment shown in Figs. 26-29, the locking mechanism 182 may be an external locking mechanism positioned within the outer periphery (e.g. outer housing, walls) of the electrical connector 30 / connector 170 / mating interface 160. The locking mechanism 182 may include one or more latches or clips 182a (e.g. external). The one or more clips 182a are shown external to the plug connector 170, mating interface 160, and / or electrical connector 30 (e.g. outer periphery). Although the clips 182a are shown external to the electrical / plug connector 30, 170 and / or mating interface 160, it should be understood that internal clips (e.g. positioned on the outer periphery, wall) may be used in combination with the external clip(s) / locking mechanism in some embodiments. The one or more clips 182a project downwardly from the bottom of the mating interface 160 or be included in the housing 168 of the electrical connector 30. The clips 182a may project downwardly from one or more exterior walls 168a (e.g. opposing) to releasably engage the plug connector 170 (e.g. housing 178, exterior wall 178a, receptacle 179). One or more receptacles 170 within the housing 178 and / or exterior wall 178a of the plug connector 170 may releasably receive the one or more clips 182a. The receptacle 179 may project from or engage the die package substrate 50 (e.g. 50a, 50b). In the one embodiment shown, two spaced apart clips 182a may be spring loaded in a transversedirection (e.g. opposing directions, inwardly towards the connector) to the plane of the clips 182a. The clips 182a may include one or more protrusions 182b releasably engaging one or more apertures 179a of the receptacle 179 or housing 178. It should be understood that the clips 182a and the receptacle 179 may be reversed and still be within the scope of the invention.

[0138] In some implementations, the plug connector 170 (e.g. housing) and / or circuit substrate 50 may include one or more stiffeners 180. The stiffeners 180 may support one or more portions of the plug connector 70, 170. As shown in the one embodiment in Figs. 26-29, the one or more stiffeners 180 may attach to the board side of the circuit substrate 50 and / or engage one or more portions of the housing 178 (e.g. bottom 178b, exterior wall 178a). One stiffener may engage three exterior walls 178a in some embodiments as shown, or a single exterior wall or the entire periphery of the exterior wall in some embodiments. The embodiment shown includes two opposing stiffeners. The stiffener may include one or more upwardly projection members / tabs 181 engaging the housing 178 (e.g. walls). The tabs 181 may include one or more posts 181a received within receptacles 177 of the housing 178 and / or one or more posts 181b having an aperture 181ba receiving a biased tab 178c of the housing 178. The stiffener may support an outer periphery or edge of the bottom / substrate wall 178b or housing 178 in some embodiments. The stiffener, or portions thereof, may be made of an electrically conductive material, electrically non-conductive material, or both. In some embodiments, the stiffener may be stainless steel. It should be understood that the stiffener may be a variety of shapes, sizes, quantities, positions, and constructions and still be within the scope of the invention.

[0139] In some implementations, the assembly 20, cable connectors 40, and / or mating interface 60, 160 may include one or more retention members 190. The one or more retention members 190 may align or retain the engagement (e.g. conductive, non-conductive) between one or more portionsof the mating interface 160. The retention member 190 may retain and / or align (e.g. horizontally, vertically) the plates 62, cavities 63, egg-crate shielding, or mating interface, or portions thereof, therebetween in some embodiments. The retention member 190 may retain and / or align (e.g. horizontally, vertically) the egg-crate shielding, cavities 63, plates 62 with the housing 168 in some embodiments. In the one embodiment shown in Figs. 26-29, the retention member 190 may be a one or more elongated members or bars 191 (e.g. horizontal) engaging one or more elongated slots / apertures 192 of the housing 168 (e.g. wall(s)) and / or one or more slots / apertures 193 of the plates 62 / cavities 63 / egg-crate shielding. The retention member, or portions thereof, may be made of an electrically conductive material, electrically non-conductive material, or both. It should be understood that the retention member / mechanism may be a variety of shapes, sizes, quantities, positions, and constructions and still be within the scope of the invention.

[0140] In some implementations, one or more ends 65 of one or more plates 62 may electrically contact an electrically conductive outer shield element 43 of the cable connector 40. As shown in Figs. 24, 25, and 25A, the mating end 65 of one or more of the third plates 62c and / or second plates 62d may include a plurality of curved edges to mate or contour with the one or more cables 90 or cable connector 40 (e.g. outer shield element 43). The mating end 65 may be in direct contact with the outer shield element 43 in some embodiments. As shown in Figs. 26-29, the mating end 65 of one or more of the third plates 62c may include a plurality of flat edges to mate or contour with the one or more cables 90 or cable connector 40 (e.g. outer shield element 43), or portions thereof. Further, in some embodiments, the mating interface 160 and / or connector 30 may include an epoxy 65a at one or more conductive engagements. For example, as shown in the one embodiment in Figs. 26-29, an epoxy 65a (e.g. conductive) may be used between theplanar shaped mating end 65 or one or more portions of the plate(s) 62 (e.g. mating end) and the outer shield element 43.

[0141] In some implementations, Figs. 30 and 31 illustrate the differential FD Next Power Sum and the differential FD FEXT Power Sum for one embodiment of the electrical connector shown in Figs. 26-29. As shown in Fig. 30, the plurality of electrical connectors may transmit approximately 70Ghz signals with no more than approximately -50dB of NEXT (near end crosstalk). The simulation embodiment shown in Fig. 30 is the total power sum, industry standard summation of all noise sources. Further, as shown in Fig. 31, the plurality of electrical connectors may transmit approximately 70Ghz signals with no more than approximately -30dB of FEXT (far end crosstalk). The simulation embodiment shown in Fig. 31 is the total power sum, industry standard summation of all noise sources.

[0142] In some implementations, the assembly / connector 20, 30, or portions thereof (e.g. mating interface, plug connector, circuit substrate, and / or cable connector) may include at least 257 differential pairs per square inch, at least 256-264 differential pairs per square inch, at least 139- 263 differential pairs per square inch, at least 138-145 differential pairs per square inch, and / or at least 88 to 137 differential pairs per square inch.

[0143] In some implementations, the assembly / connector 20, 30, or portions thereof (e.g. mating interface, plug connector, circuit substrate, and / or cable connector) may include at least 257 single ended pins per square inch, at least 256-264 single ended pins per square inch, at least 139-263 single ended pins per square inch, at least 138-145 single ended pins per square inch, and / or at least 88-137 single ended pins per square inch

[0144] In some implementations, the assembly / connector 20, 30, or portions thereof (e.g. mating interface, plug connector, circuit substrate, and / or cable connector) may include at least 127differential pairs per linear inch, at least 128 differential pairs per linear inch, and / or at least 129 pairs per linear inch.

[0145] In some implementations, the assembly / connector 20, 30, or portions thereof (e.g. mating interface, plug connector, circuit substrate, and / or cable connector) may include conductors of approximately 32, 33, 34, 35, and / or 36 AWG.

[0146] In some implementations, the assembly / connector 20, 30, or portions thereof (e.g. mating interface, plug connector, circuit substrate, and / or cable connector) may include approximately 92 Ohms plus / minus 9 Ohms, or plus / minus 5%, and / or plus / minus 10%.

[0147] In some implementations, the assembly / connector 20, 30, or portions thereof (e.g. mating interface, plug connector, circuit substrate, and / or cable connector) may include over approximately 55dB of IL to XT separation at approximately 25GHz.

[0148] In some implementations, the assembly / connector 20, 30, or portions thereof (e.g. mating interface, plug connector, circuit substrate, and / or cable connector) may include over approximately 40dB of IL to XT separation at approximately 60GHz.

[0149] In some implementations, the assembly / connector 20, 30, or portions thereof (e.g. mating interface, plug connector, circuit substrate, and / or cable connector) may include 60GHz of bandwidth.

[0150] In some implementations, the assembly / connector 20, 30, or portions thereof (e.g. mating interface, plug connector, circuit substrate, and / or cable connector) may include skewless, edge- coupled connectors (fully symmetrical paths in connector).

[0151] In some implementations, the assembly / connector 20, 30, or portions thereof (e.g. mating interface, plug connector, circuit substrate, and / or cable connector) may include cable, mezzanine, and / or card edge connectors.

[0152] In some implementations, the assembly / connector 20, 30, or portions thereof (e.g. mating interface, plug connector, circuit substrate, and / or cable connector) may include a single track routing in the die package substrate.

[0153] In some implementations, the assembly / connector 20, 30, or portions thereof (e.g. mating interface, plug connector, circuit substrate, and / or cable connector) may include a SMT / BGA / surface mount. In some embodiment, a through hole mounting may be used.

[0154] In some embodiments of the invention, for example, an electrical connector may be sized and shaped such that a plurality of the electrical connectors fit on a single side of die package substrate that is no larger than approximately 75mm by 75mm to approximately 85mm to 85mm, the plurality of electrical connectors collectively carry at least 1024 differential signal pairs, and / or the plurality of electrical connectors transmit approximately 224Gbps Pam4 signals at approximately 56GHz to approximately 70GHz of bandwidth with no more than approximately -40dB of FEXT (far end crosstalk).

[0155] In some embodiments, an electrical connector may be sized and shaped such that a plurality of the electrical connectors fit on a single side of die package substrate that is no larger than approximately 75mm by 75mm to approximately 85mm to 85mm, the plurality of electrical connectors collectively carry at least 1024 differential signal pairs, and / or the plurality of electrical connectors transmit approximately 224Gbs Pam4 signals at approximately 56GHz to approximately 70GHz of bandwidth with no more than approximately -50dB of NEXT (near end crosstalk).

[0156] In addition, in some embodiments, the plurality of electrical connectors may transmit signals at approximately 60GHz with no more than approximately -45dB of FEXT. In various embodiments, the plurality of electrical connectors may transmit signals at approximately50GHz with no more than approximately -45dB of NEXT. In some embodiments, each electrical connector in the plurality of electrical connectors may comprise an egg-crate mating interface. In various embodiments, the electrical connector may be configured to mate with a cable connector.

[0157] In some embodiments, an electrical connector may include a mating interface having a plurality of interconnected plates defining a plurality of cavities therein.

[0158] In addition, in some embodiments, the connector may include a plurality of cable connectors mated within the plurality of cavities. In various embodiments, each plate of the plurality of plates may include a plurality of slots aligned with a plurality of grooves. In some embodiments, the plurality of plates may define a circumference of a first cavity of the plurality of cavities without any gaps therein. In various embodiments, the plurality of plates may define a row of cavities without any of the plurality of cable connectors. In some embodiments, the plurality of plates may extend for about 90 percent of the length of the cable connector to a substrate. In various embodiments, the electrical connector may include a substrate and a ground contact element positioning the plurality of plates at a distance from the substrate. In some embodiments, the electrical connector may include a die package substrate that is no larger than approximately 75mm by 75mm to approximately 85mm to 85mm, a plurality of electrical connectors collectively carry at least 1024 differential signal pairs, and / or the plurality of electrical connectors transmit approximately 224Gbps Pam4 signals at approximately 56GHz to approximately 70GHz of bandwidth with no more than approximately -40dB of FEXT (far end crosstalk) or with no more than approximately -50dB of NEXT (near end crosstalk). In various embodiments, the plurality of electrical connectors may transmit signals at approximately 60GHz with no more than approximately -45dB of FEXT. In some embodiments, the pluralityof electrical connectors may transmit signals at approximately 50GHz with no more than approximately -45dB of NEXT.

[0159] In addition, in some embodiments, an electrical connector configured to be attached to a die package may include at least a density of 256 differential pairs per square inch.

[0160] In various embodiments, the electrical connector may transmit approximately 224Gbps Pam4 signals with no more than approximately -40dB of crosstalk. In some embodiments, the connector may transmit at approximately 56GHz to approximately 70GHz of bandwidth.

[0161] In addition, in some embodiments, an electrical connector may include a mating interface. In various embodiments, the connector may include a plug connector having at least one ground contact element configured to mate with the mating interface.

[0162] In some embodiments, the ground contact element may include at least one arm mating with the mating interface. In various embodiments, the ground contact element may include at least two arms mating with the mating interface. In some embodiments, the ground contact element may include at least three arms mating with the mating interface. In various embodiments, the ground contact element may include at least four arms mating with the mating interface. In some embodiments, the ground contact element comprises four or more arms mating with the mating interface. In various embodiments, the ground contact element may include at least one solder mass. In some embodiments, the ground contact element may include at least two solder masses immediately adjacent to each other. In various embodiments, the ground contact element comprises at least three solder masses immediately adjacent to each other.

[0163] In some embodiments, an electrical connector may include at least one of a mating interface, a plug connector, and / or a cable connector. In various embodiments, the connector may include a 224 Gbps Pam4 signal at 6ps with 20%-80% rise time.

[0164] In some embodiments, the connector may include at least one of FEXT and / or insertion loss. In various embodiments, the FEXT may be under or equal to -30dB. In some embodiments, the FEXT may be under or equal to -35dB. In various embodiments, the FEXT may be under or equal to -40dB. In some embodiments, the FEXT may be under or equal to -45dB. In various embodiments, the insertion loss may be between OdB and -IdB. In some embodiments, the insertion loss may be between - IdB and -2dB. In various embodiments, the insertion loss may be between -2dB and -3dB. In some embodiments, the insertion loss may be between -3dB and -4dB. In various embodiments, the insertion loss may be between -4dB and -5dB. In some embodiments, the connectors may be at 50 GHz, 55 GHz, 60 GHz, 65 GHz, 70 GHz, 75 GHz, and / or 80 GHz.

[0165] In various embodiments, the electrical connector may include at least one of NEXT and / or insertion loss. In some embodiments, the NEXT may be under or equal to -40dB. In various embodiments, the NEXT may be under or equal to -45dB. In various embodiments, the NEXT may be under or equal to -5 OdB. In some embodiments, the NEXT may be under or equal to - 55dB. In various embodiments, the NEXT may be under or equal to -60dB. In some embodiments, the insertion loss may be between OdB and -IdB. In various embodiments, the insertion loss may be between - IdB and -2dB. In some embodiments, the insertion loss may be between -2dB and -3dB. In some embodiments, the insertion loss may be between -3dB and - 4dB. In various embodiments, the insertion loss may be between -4dB and -5dB. In some embodiments, the connectors may be at 50 GHz, 55 GHz, 60 GHz, 65 GHz, and / or 70 GHz.

[0166] In addition, in some embodiments, an electrical connector may include an outer periphery. In various embodiments, the connector may include a locking mechanism positioned within the outer periphery of the electrical connector.

[0167] In some embodiments, the electrical connector may include a mating interface and a plug connector, wherein the locking mechanism may be positioned within an outer periphery of at least one of the mating interface and / or the plug connector. In various embodiments, the locking mechanism may include at least one clip. In some embodiments, the locking mechanism may include at least two clips. In various embodiments, the locking mechanism may include at least one notch. In some embodiments, the locking mechanism may include at least two notches. In various embodiments, the locking mechanism may be positioned within at least one gap between adjacent rows of cavities. In some embodiments, the electrical connector may include a plurality of cable connectors, wherein the locking mechanism may be positioned between adjacent cable connectors of the plurality of cable connectors. In various embodiments, the electrical connector may include a plurality of cavities, wherein the locking mechanism may be positioned between adjacent cavities of the plurality of cavities. In some embodiments, the locking mechanism may be spaced internally away from one or more walls of the outer periphery of the electrical connector. In various embodiments, the connector may be configured to be attached to a die package having at least a density of 256 differential pairs per square inch.

[0168] In some embodiments, an electrical connector may include a plurality of differential signal pairs.In various embodiments, the electrical connector may include a plurality of ground contact elements, each configured to receive a respective portion of an egg-crate shield of a mating connector, wherein the electrical connector is devoid of egg-crate crosstalk shielding, is sized and shaped such that a plurality of electrical connectors each respectively fit on a single side of a die package substrate with sides no larger than approximately 75 -96mm each, including approximately 80mm±5mm and 91mm±5mm, the plurality of electrical connectors collectively carry at least 1024 differential signal pairs, and the plurality of electrical connectors transmitapproximately 224Gbits / sec PAM-4 signals at approximately 56GHz to approximately 70GHz of bandwidth with no more than approximately -40dB of FEXT.

[0169] In addition, in some embodiments, the electrical connector further includes a first housing that carries the differential signal pairs and at least two or more of the plurality of ground contacts each define at least two laterally offset, cantilevered beams, wherein each of the at least two laterally offset, cantilevered beams has a respective free end. In various embodiments, the differential signal pairs are surface mounted to the die package substrate. In some embodiments, the differential signal pairs may each comprise first and second stamped and formed electrical conductors. In some embodiments, the electrical connector may further include electrically conductive or electrically non-conductive, magnetic absorbing material or electrically lossy material. In various embodiments, the plurality of differential signal pairs are electrically connected, physically connected, or both to corresponding, respective pads on the die package substrate.

[0170] In some embodiments, an electrical connector may include a mating interface having a housing and a plurality of plates defining a plurality of cavities in the housing. In various embodiments, the electrical connector may include at least one retention member retaining at least one of the plurality of plates therebetween and / or the plurality of plates with the housing.

[0171] In addition, in some embodiments, at least one retention member may retain the plurality of plates therebetween. In various embodiments, at least one retention member may retain the plurality of plates with the housing. In some embodiments, at least one retention member may retain both the plurality of plates therebetween and the plurality of plates with the housing. In various embodiments, at least one retention member may be an elongated member engaging oneor more slots. In some embodiments, at least one retention member may be electrically conductive or electrically non-conductive.

[0172] In some embodiments, an electrical connector may include an outer periphery. In various embodiments, the electrical connector may include a locking mechanism positioned in the outer periphery of the electrical connector.

[0173] In addition, in some embodiments, the electrical connector may include a mating interface and a plug connector, wherein the locking mechanism may be positioned in an outer periphery of at least one of the mating interface and / or the plug connector. In various embodiments, the locking mechanism may include at least one clip. In some embodiments, the locking mechanism may include at least two clips. In various embodiments, the locking mechanism may include at least one receptacle releasably engaging at least one clip. In some embodiments, the electrical connector may include another locking mechanism positioned within the outer periphery.

[0174] In some embodiments, an electrical connector may include a plug connector having a housing. In various embodiments, the electrical connector may include at least one stiffener coupled to the housing.

[0175] In addition, in some embodiments, at least one stiffener may be attached to a board side of a die package substrate. In various embodiments, the electrical connector may include at least two of the stiffeners spaced from each other in a horizontal plane. In some embodiments, at least one stiffener may be electrically conductive or electrically non-conductive. In various embodiments, at least one stiffener may include at least one projecting tab.

[0176] Thus far, a novel 2-piece, mechanical, high-speed, high density, beam-on-beam or beam-on- blade coaxial or single-ended or twin axial or differential signal connector system has beendescribed. Individual connectors have also been described. However, the present disclosure is not limited to the connectors described above.

[0177] The connectors described above can also be used with, modified to be used with, or be enhanced electrically, mechanically or both through capacitively coupling. Capacitive coupling can generally include the step of electrically coupling a coaxial or a radio frequency (RF) transmission line to another coaxial or RF transmission line. Capacitively coupling can include the step of electrically coupling a differential signal transmission line to another twin axial transmission line. Capacitive coupling can occur between two interconnects without mechanically separable beam on blade, beam on beam, or pin in socket mating interfaces. Capacitive coupling can occur without a first mating element of a first interconnect exerting a cantilevered normal force on a respective second mating element of a second interconnect. Capacitive coupling can occur with zero or minimal insertion force. Capacitive coupling can occur with by only latching two mating parts together.

[0178] In one embodiment, a mounting end of a first part, a mating end of a first part or both can be configured to mate with or can include a respective film or thin film 320 (Fig. 32) made from a plastic, polymer, ceramic, printed polymer, dielectric or other electrically non- conductive material. Alternatively, a mounting end of a first part, a mating end of a first part or both can be configured to mate with or can include a film or thin film 120 / 220 (Fig. 32) made from a plastic, polymer, ceramic, printed polymer, dielectric or other electrically non-conductive material that contains at least one or more than one electrically conductive elements, such as a signal conductor / connector 140a (Figs. 34, 51), a ground conductor / connector 140b (Figs. 34, 51), or both. Signal and ground conductors / connector 140a, 140b (Figs. 34, 51) can, in turn, form a coaxial transmission line, a twin axial transmission line, or both.

[0179] An interposer 120a can include any one of: a film or thin film 120, 220, 320; a film or thin film 120, 220 and a signal conductor 140a; a film or thin film 120, 220, a signal conductor 140a and a ground conductor 140b; and a film or thin film 120, 220 and a ground conductor 140b. The interposer 120a can include only capacitive coupling film or thin film 320. The interposer 120a can include film or thin film 120, 220 and at least one or more than one coaxial transmission lines, generally shown as 140, 140b. The interposer 120a can include film or thin film 120, 220 and one or more differential transmission lines, such as two adjacent coaxial transmission lines, each shown generally as 140, 140b. A differential signal transmission line can also be formed by two signal conductors 140a bounded by, circumscribed by, surrounded by, substantially surrounded by, at least partially surrounded by a ground conductor 140b.

[0180] As one example, interposer 120a can take the place of plug connector 170 (Fig. 28). In turn, connector 30 can be modified, as shown in Fig. 32 and as described below, to remove signal conductor mating beams, signal conductor mating blades, or both. The interposer 120a can lie in the transmission path to provide capacitance. The interposer 120a may be positioned between two mating parts and is not permanently attached to or soldered to or welded to any electrical conductors of a connector 30. The interposer 120a can be removably positioned between two mating parts. In some embodiments, an electrical connector assembly may include a connector mounting end that defines a plurality of discrete, spaced apart, electrically isolated coaxial or twin axial cables. In various embodiments, each of the plurality of discrete, spaced apart, electrically isolated coaxial or twin axial cables (e.g. end(s), ends arranged in a pre-determined pattern) may not terminate in a solder mass and may not physically contact a corresponding pad on a printed circuit board. In some embodiments, the electrical connector assembly and / or connector mounting end may define a plurality of discrete, spaced apart, electrically isolatedcoaxial or twin axial cable ends arranged in a pre-determined pattern. In some embodiments, each of the plurality of discrete, spaced apart, electrically isolated coaxial or twin axial cables (e.g. ends, ends arranged in a pre-determined pattern) may have at least one exposed electrically conductive cable conductor that is devoid of a solder mass, a cantilevered beam and a press-fit tail. In various embodiments, the electrical connector assembly and / or connector mounting end may define a plurality of discrete, spaced apart, electrically isolated coaxial or twin axial cables arranged in a pre-determined pattern and a film may contain the same pre-determined pattern as the connector mounting end of the electrical connector assembly.

[0181] In a mezzanine configuration, the interposer 120a can be placed or positioned between two parallel substrates or boards (not shown), such as FR4 printed circuit boards, to make an electrical connection or connections between the two parallel substrates or boards. In a cable to substrate or cable to board configuration, interposer 120a can be sandwiched between, and perhaps only between, connector 30 (Fig. 32) and a corresponding mating (or mounting) substrate, such as board 50 (not shown in Fig. 32). In this configuration, it is possible that the only structure between a mating interface of the cable connector 30 (Fig. 32) and a board 50 is interposer 120a. In a cable-to-cable configuration, an interposer 120a can be positioned between, and perhaps only between, respective mating interfaces of two mating cable connectors 30 (Fig. 32). In this configuration, it is possible that the only structure between the respective mating interfaces of the cable connectors 30 (Fig. 32) is the interposer 120a. In a cable to connector configuration, an interposer 120a can be sandwiched between, and perhaps only between, cable connector 30 (Fig. 32) and a corresponding mating connector, such as board connector (not shown). In this configuration, it is possible that the only structure between a mating interface of the cable connector 30 (Fig. 32) and a mating interface of the correspondingboard connector (not shown) is the interposer 120a. Embodiments described herein can also be used in other interconnects, such as bayonet-style connectors, transceivers, etc.

[0182] In some implementations, one or more electrical connectors 30, assembly 20, cables 90, and / or substrate 50 may include or may be configured to mate with one or more tapes, films, connector films, or interface films 120, 220, 320 and / or interposer 120a. The film(s)120, 220, 320 may be used in some implementations to connect, such as through capacitive coupling, two single-ended or differential signal transmission lines, such as cables to cables (e.g. 90, coax, twin axial, etc.) as shown in Figs. 43, 44, 55, 56, 59, and 60, board to board (e.g. 50, substrate) as shown in Fig. 46, 58, and 62, and / or cable 90 (e.g. coax, twin axial, ground contact(s), signal contact(s)) to board 50 as shown in Fig. 45, 57, and 61. A card edge connector (not shown) can also be capacitively coupled to a board 50. For example, the film may connect a first board to a second board, or portions thereof. Further for example, the film may connect a first cable to a second cable, or portions thereof. Further for example, the film 120, 220, 320 may connect a cable to a board (e.g. PCB, substrate). The film may connect one or more signal connectors / contacts / elements to each other and / or one or more ground connectors / contacts / elements to each other in some implementations. The film, or portions thereof, may be used in some implementations of the densities and / or structures described herein. The film may used in a capacitively coupled, high-density, high-performance connector.

[0183] Compared to the prior art, embodiments consistent with the invention may incorporate the film 120, 220, 320 and / or connector 230 to, but is not limited to, reduce or remove metal-to-metal contact, decrease mechanical wear, increase a number of mating cycles, reduce galvanic corrosion, reduce contact / compression force (e.g. axial), increase alignment with reduced sensitivity, increase density (e.g. pairs), improve insertion loss, and / or reduce volume, and saveboard / substrate / host printed circuit board space by removing capacitors that are mounted to the board 50 in an immediate vicinity around the plug connector 170 or a RF / coaxial connector.

[0184] As mentioned briefly above and shown in Fig. 32, connector 30 can be modified as follows.Instead of terminating a cable 90 to a respective signal conductor 42 (Fig. 9), each cable 90 (Fig. 32) can include a cable signal conductor, a cable insulator, and a cable shield that each terminate at or in or parallel to a common plane, such as a mating interface plane. Instead of terminating a cable 90 or a cable signal conductor to a respective signal conductor 42 (Fig. 9), each cable 90 (Fig. 32) can include a cable signal conductor, a cable insulator, and a cable shield that each terminate at or in or parallel to a common film or thin film 120, 220, 320 (Fig. 32). Plug connector 170 (Fig. 28) can be completely replaced with a film or thin film 120, 220, 320 (Fig. 32), such as a capacitively coupling film. The film or thin film 120 or the interposer 120a can carry or form electrically conductive elements / portions 140 (Fig. 34) that can each extend through the film or thin film 120, from one side of the film or thin film 120 to the other side of the film, forming a direct current (DC) coupled signal transmission path. The film or thin film 220 or interposer 120a can carry or form electrically conductive elements 140 (Fig. 51) that can be configured to not pass completely through the film or thin film 120. For example, a first conductive element 140 or first signal conductor 140a can be positioned on one side of the film or thin film 120 and a directly opposed second conductive element 140 or second signal conductor 140b can be positioned on a second side of the film or thin film 120, wherein first and second conductive elements 140 or the first and second signal conductors 140a are not in electrical communication with one another, are not in physical communication with one another, or both, but still form an alternating current (AC) coupled signal transmission path between the first and second conductive elements. In some embodiments, the nonconductive and / orconductive elements shown in Figs. 51 and 52 may be compressible and / or an elastomer (e.g. conductive, nonconductive, both). The conductive element(s) 140 (e.g. opposing, top, bottom, signal 140a, ground 140b) may be compressible in some embodiments, or a conductive elastomer. The nonconductive element(s) 130 may be compressible in some embodiments, or a nonconductive elastomer. An electrical insulator (e.g. 130), such as air, dielectric material, plastic, polymer, glass, etc. can be positioned between the first and second conductive elements 140 or between the first and second signal conductors 140a. The film or thin film 320 or interposer 120a can alternatively form one, at least one, or more than one AC coupled signal transmission paths that are devoid of electrically conductive elements 140 (Figs. 50 and 59). The one side of the film or thin film 120 or compressible electrically nonconductive layer, the second side of the film or thin film 120 or compressible electrically nonconductive layer or both sides can be devoid of one or more of an electrically conductive ground plane, an electrically conductive reference plane, an electrically conductive flood plane, or electrically conductive material that electrically connects or commons, physically connects or commons or both electrically connects or commons at least two, at least three, at least four, at least five, at least six or six or more immediately adjacent electrically conductive elements 140 (Fig. 51) or ground connectors 140b. Stated another way, the film or thin film 120 or a compressible electrically nonconductive layer of the film or thin film 120 can carry a plurality of distinct, spaced apart, electrically isolated coaxial or twin axial signal paths that each extend through the compressible electrically nonconductive layer. Each of the coaxial or twin axial signal transmission paths can include at least one electrically conductive signal connector 140a and at least one reference or ground connector 140b that surrounds or at least partially surrounds at least one electrically conductive signal connector 140a. The film or thin film 120, the electrically conductiveelements 140 or both can compress in the same direction. The plurality of distinct, spaced apart, electrically isolated coaxial or twin axial signal paths can be compressible in a same direction as the compressible electrically nonconductive layer. One or more or all of the electrically conductive elements 140 can be non- anisotropic, meaning that the electrically conductive elements 140 can be electrically conductive even when not under compression, such as axial compression. The compressible electrically nonconductive layer can surround at least one electrically conductive signal connector 140a. The electrically conductive elements 140, such as a combination of one or two signal connectors 140a and a corresponding reference or ground connector 140b can define an electrically conductive coaxial or differential signal transmission path between the one side of the film or thin film 120 and the second side of the thin film or thin film 120. Transmission paths may be electrically conductive even when the film or thin film 120, the electrically conductive elements 140, signal and ground connectors 140a and 140b, or any combination are not under compression, such as axial compression. The at least one electrically conductive signal connector 140a can extend or can only extend vertically or perpendicularly to both one side of the film or thin film 120 and a second side of the film or thin film 120. The at least one reference or ground connector can extend or can only extend vertically or perpendicularly to both one side of the film and a second side of the film or thin film 120. In embodiments described herein where opposed, coincident electrically conductive elements 140 are not configured to form an electrically conductive path between the one side and the second side of the film or thin film 120, the film or thin film 120 can be devoid of one, two, three, four or more than four electrically conductive elements positioned in the film or thin film 120 between respective, opposed, coincident electrically conductive elements140. Electrically conductive elements 140 can be positioned in pre-defined locations. The filmor thin film 120 can be configured to be or can be only electrically conductive in the pre-defined locations. At least one electrically conductive signal connector 140a can be configured to physically contact or can physically contact a mating electrical conductor, such as an exposed electrically conductive cable conductor of a mating electrical connector assembly.

[0185] At differential signal speeds of at least 56Gbps NRZ or 112Gbps Pam4, such as at least, 112Gbps NRZ or 224Gbps Pam4 data transfer rates, direct current (DC) signals can be coupled using an interposer 120a that includes a film or thin film 120 that carries or forms electrically conductive elements 140 (Fig. 34) that can each extend completely through the film or thin film 120, from one side of the film or thin film 120 to the other side of the film. At differential signal speeds of at least 56Gbps NRZ or 112Gbps Pam4, such as at least 112Gbps NRZ or 224Gbps Pam4 data transfer rates, alternating current (AC) signals can be coupled and DC signals can be blocked using the first conductive element 140 positioned on one side of the film or thin film 220 and the directly opposed second conductive element positioned on a second side of the film or thin film 220, wherein the first and second conductive elements 140 are not in electrical communication with one another, are not in physical communication with one another, or both. At differential signal speeds of at least 56Gbps NRZ or 112Gbps Pam4, such as at least.112Gbps NRZ or 224Gbps Pam4 data transfer rates, AC signals can be coupled and DC signals can be blocked for signal transmission paths that are devoid of electrically conductive elements 140 along the entire length of the AC signal transmission path using an interposer 120a that includes a film or thin film 320. In differential or single-ended or RF applications, unwanted crosstalk can be reduced or eliminated because each AC signal transmission path, each DC signal path, or both, is tightly coupled with its associated mating part signal transmission part. Stated another way, each AC orDC signal transmission path does not radiate enough energy to adversely affect the electrical performance of immediately adjacent signal transmission paths.

[0186] In some implementations, the film 120, 220, 320, assembly 20, cable 90, substrate 50, and / or connector 30 may include one or more nonconductive portions / layers / members 130 and / or one or more conductive portions / layers / members 140. As shown in Figs. 32-46, the nonconductive portion 130 may include or define one or more through apertures or passageways 131. The through aperture 131 may extend from a top surface 132 to a bottom surface 133 thereof. The through aperture 131 and / or nonconductive portion 130 may be a variety of shapes, sizes, quantities, positions, and constructions and still be within the scope of the invention. The nonconductive portion may be electrically nonconductive, thermally nonconductive, or both electrically and thermally nonconductive. The through apertures 131 and / or nonconductive portion 130 may receive or position or space one or more of the conductive portions 140 within the film 120. The conductive portion 140 may be continuously conductive through the film or fixed in position relative to the nonconductive portion 130 and / or film 120. Alternatively stated, the nonconductive portion 130 may not be compressible or compressed together with or to move the conductive portions relative to each other. For example, the nonconductive portion or conductive portion or film may not be compressed or reconfigured to combine together two separate or discontinuous conductive portions within the film and / or make previously non- electrically / conductive connected conductive portions to become electrically / conductively connected or continuous with each other. The conductive portion 140 may extend through the film 120 or nonconductive portion 130. The conductive portion may extend and / or be continuous from at least the top surface 132 to at least the bottom surface 133. As shown in the one embodiment in Figs. 43-46, the conductive portion extends to or is substantially flush withthe top surface and the bottom surface. The conductive portion may extend above and / or below the opposing surfaces or extent of the nonconductive portion (e.g. top surface, bottom surface). As shown in the one embodiment in Figs. 34-37, 39 and 41, the conductive portion may extend above the top surface 132 and / or below the bottom surface 133. The conductive portion 140, or portions thereof, and / or film 120 may include one or more flanges 141 above and / or below the opposing surfaces (e.g. top surface, bottom surface). The one or more flanges 141 and / or conductive portions 140 may extend away (e.g. radially, radially inward, radially outward, laterally between apertures, circumferentially, between apertures, in one or more directions) from the one or more through apertures 131 (e.g. in a horizontal plane, along the top surface, along the bottom surface). Alternatively, the conductive portions may not include flanges in one or more directions (e.g. radially) as shown in Figs. 43-46. The conductive portion may be a variety of shapes, sizes, quantities, positions, and constructions and still be within the scope of the invention.

[0187] In some implementations, the one or more conductive portions 140 may include one or more signal connectors 140a and / or one or more ground connectors 140b. The one or more conductive portions 140 may include one or more ground connectors 140b surrounding / circumscribing one or more signal connectors 140a. At least one or at least two, etc., of the signal connectors 140a may be circumscribed or surrounded (e.g. 360 degrees, partially, less than 360) by one or more ground connectors 140b. As shown in Figs. 33-37, 40- 41, 44-46, 51, 56, 57, 58, 60, 61, and 62, for an embodiment of a coax cable and / or of board, one signal connector 140a is circumscribed or surrounded by or spaced radially inward of the ground connector 140b. As shown in Figs. 38, 39, 43, 55, and 59 for an embodiment of a twin axis cable, two signal connectors 140a is circumscribed or surrounded by or spaced radially inwardof the ground connector 140b. The one or more signal members / connectors 140a may be spaced inwardly (e.g. radially) relative to the one or more ground members / connectors 140b. A portion of the top surface 132 and / or bottom surface 133 of the nonconductive portion 130 may be exposed or free from the conductive portion 140. For example, between the signal connectors 140a and / or between the ground connector (e.g. segmented on the surface(s)) and / or between the signal connector(s) and the ground connector(s). In some embodiments, the nonconductive and / or conductive elements shown in Fig. 39 may be compressible and / or an elastomer (e.g. conductive, nonconductive, both) and / or noncompressible (e.g. conductive, nonconductive, both). The conductive element(s) 140 (e.g. opposing, top, bottom, signal 140a, ground 140b) may be compressible in some embodiments, or a conductive elastomer. The nonconductive element(s) 130 may be compressible in some embodiments, or a nonconductive elastomer.

[0188] In some implementations, one or more conductive members / portions 140 may be received in one or more apertures 131. A conductive portion 140 (e.g. single, signal, ground) may pass through or be received within one aperture 131. For example as shown in the Figures, the signal connector 140a is received by a single aperture 131 (e.g. signal connector aperture).Alternatively, the signal connector 140a may be received by a plurality of apertures 131. A conductive portion 140 (e.g. single, signal, ground) may pass through or be received within a plurality of the apertures 131. For example as shown in the Figures, the ground connector 140b may be received by or through a plurality of apertures 131. Alternatively, the ground connector may be received by a single aperture in some embodiments. The ground connector may be received by a plurality of apertures 131 arranged or patterned in a circle or arcuate pattern (e.g. about the one or more apertures of the signal connector(s)). A gap or runner 134 of nonconductive portion 130 may be positioned between the ground connector apertures 131 (e.g.outside) to connect to the nonconductive portion within or inside defining the signal connector aperture 131. The apertures 131 (e.g. circular, periphery) of the signal connector 140a may be different than the apertures (e.g. arcuate, periphery) of the ground connector 140b. For example, the apertures (e.g. arcuate, ring, rectangular) for the ground connectors 140b may be different (e.g. shape, size, position) from the apertures (e.g. circular, square) for the signal connectors 140a as shown in Figs. 33 and 38. Alternatively, they may be the same. For example, the apertures may be circular in shape as shown in Fig. 40.

[0189] In some implementations, the conductive portion 140 may be may the same shape as the aperture or may be different in some embodiments. In some embodiments, the conductive portion may cover and / or fill in the volume of the aperture(s) or may partially cover and / or fill in the volume of the aperture(s).

[0190] In some implementations, the conductive portion 140 (e.g. signal, ground) and / or flanges 141, if used, may include an inner periphery 142 and / or an outer periphery 143. The inner periphery and / or outer periphery (e.g. radial) may be proximate the top surface 132 and the bottom surface 133 of the nonconductive portion 130 or film 120 or opposing ends of the apertures 131. The one or more conductive portions 140 (e.g. signal connector 140a) may include an outer periphery in some embodiments. As shown in the one embodiment in Figs. 34-37, 39, and 41, the signal connector(s) 140a may include only an outer periphery 143. The signal connector 140a, or portions thereof, may be circular. The one or more conductive portions 140 (e.g. ground connector 140b) may include an outer periphery and an inner periphery in some embodiments. The ground connector may be arcuate or ring shaped. As shown in the one embodiment, the ground connector(s) 140b (e.g. flanges) includes both an outer periphery 143 and an inner periphery 142. The flanges 141, if used, may define one or more of the peripheriesof the conductive portions 140. The peripheries (e.g. inner, outer) may be continuous or discontinuous. In the one embodiment shown, the inner and outer peripheries 142, 143 are continuous (e.g. not segmented, not discontinuous, 360 degrees) for both the signal connector 140a and the ground connector 140b. Alternatively (not shown), the signal and / or ground connector may be discontinuous (e.g. segmented) and still connect with the corresponding one or more structures (e.g. contacts) of the cable and / or board.

[0191] In some implementations, the film, interposer, and / or signal / ground connector 140a, 140b may split the signal / ground. The one or more conductive portions 140 (e.g. signal) may include a signal connector split as shown in the one embodiment in Fig. 42. The signal member / connector 140a may be split through the apertures 131, film 120, and / or nonconductive portion 130 from the top / bottom surface to the bottom / top surface, respectively. The signal split may be a coax or twin axial cable for example. The split signal may be evenly split (e.g. downstream) in some embodiments.

[0192] In some implementations, the ground and / or signal structure(e.g. pins, grounds, cable, board, connector, contacts, shape, size, and / or periphery of the contacting end) may be the same or different / dissimilar to the film conductive portions (e.g. signal connector(s), ground connector(s)). For example as shown in Figs. 38 and 39, the ground connector 140b, the signal connector 140a, and / or apertures 131 are rectangular in shape and different (e.g. does not match shape / size) from the circular / arcuate ends of the cable 90 (e.g. ground, signal pins, contacts). For example as shown in Figs. 33-37, the ground connector and the signal connector are substantially the same shape as the circular / arcuate ends of the cable 90 (e.g. ground, signal pins). Further for example, the ground connector 140b may be a different shape than theaperture 131 and the signal connector 140a may be the same shape as the aperture 131 as shown in the one embodiment in Figs. 40 and 41.

[0193] In use, the one or more films 120 may be used in a variety of applications to connect or couple a variety of structures / connectors including, but is not limited to, cable to cable, board to board, and / or cable to board structures, or portions thereof. A nonconductive layer(s) or portion 130 may be provided. The nonconductive portion 130 may include a plurality of apertures 131 therethrough. In some embodiments, the nonconductive portion 130 may not include apertures therethrough. The nonconductive portion may be, but is not limited to, a dielectric material and / or polymer. The apertures 131 may be laser etched in some embodiments. One or more conductive layers or portions 140 may be coupled or formed on or to the nonconductive portion 130, or portions thereof. The conductive portions may be continuous within the film such that no compression is needed or without compression on the film to make conductivity between the top side and bottom side of the film 120. The film may split the one or more conductive layers into a plurality of signals as shown in Fig. 42. The conductive portion 140 (e.g. signal, ground) may be, but is not limited to, a conductive elastomeric material, electrical conductive paste, FUZZ BUTTON, single metal (e.g. copper, silver, etc.), alloy, electrically nonconductive material that is plated (e.g. gold plated ball). Forming the conductive portion may include, but is not limited to, molding, printing, screen printing, or squeezing a paste on the nonconductive portion. The downward compression force on the film, or portions thereof, (e.g. signal connector, ground connector, conductive portion) may be reduced when engaging structure thereto (e.g. cable, board, etc.). In some embodiments, the conductive portion may be compressed and not the nonconductive portion when connecting. When forming the conductive portion, one or more flanges, if used, may be formed over the top surface and / or bottom surfaceof the nonconductive portion in one or more directions. When connecting the ground and / or signal (e.g. cable, board, connector, contacts, elements) to the film, the axial ends and / or outer peripheries may engage the corresponding conductive portion 140 (e.g. ground connector 140b, signal connector 140a) and / or nonconductive portions 130.

[0194] In some implementations, one or more connectors or couplings 30, assembly 20, and / or substrate 50 may have circumferential / friction / compression forces RF (e.g. radially) to retain or secure the signal pin / member / contact 90, or portions thereof. In the one embodiment shown in Figs. 47-49, the electrical connector 230 (e.g. cup / cylinder style) and / or assembly 20 may include one or more conductive receptacles / cup 231 (e.g. first, hollow member with bottom, outer conductive cylinder) and / or one or more nonconductive or electrically nonconductive receptacles 232 (e.g. second, hollow member with bottom, inner nonconductive cylinder) within the conductive receptacles 231. The conductive receptacle 231 may position the nonconductive receptacle 232 therein. The conductive receptacle 231 may include or define an opening 231a. The nonconductive receptacle 232 may include or define an opening 232a. The nonconductive receptacle 232 may be received within the opening 231 a of the conductive receptacle 231. The opening 232a, if used, and / or nonconductive receptacle 232 may receive (e.g. axially) the contact / pin (e.g. cylindrical outer periphery). Each receptacle 231, 232 may include a wall 231b, 232b (e.g. axially extending, concentric, arcuate). The conductive wall 231b may include an inner periphery 23 Iba and an outer periphery. The nonconductive wall 232b may have an outer periphery 232bb and an inner periphery 232ba. The outer periphery 232bb of the nonconductive wall 232b is proximate or adjacent the inner periphery 23 Iba of the conductive wall 23 lb. Each receptacle 231, 232 may include a bottom wall 231c, 232c, opposite to the opening, with the walls 23 lb, 232b extending therefrom. In some embodiments, a bottom wallmay not be used. For example, the nonconductive receptacle may not use a bottom wall in some embodiments. The friction force RF may be between the inner periphery 232ba and the outer periphery of the connector or cable (e.g. pin). The outer periphery of the pin or connector may include a larger radius than the inner periphery 232ba or opening 232a or wall 232b.

[0195] In some implementations, the one or more conductive receptacles may have a hollow nonconductive receptacle therein. The nonconductive receptacle may be configured to receive (e.g. axially) a pin (e.g. signal, contact).

[0196] In some implementations, the one or more connectors 230 may be combined with or connected to a die package substrate 50 as shown in the one embodiment in Figs. 47 and 48.

[0197] The circumferential forces applied to or from the pin 90 may increase the more the length of the pin is inserted. The circumferential forces RF (e.g. radial direction, for a length, transverse to the axis of the pin) may be in the radial direction away from and / or towards the longitudinal axis of the opening(s) / receptacle(s). The metal-to-metal contact may be minimal or reduced or reduced to zero. The compression against the connector or nonconductive portion 232 may be outward (e.g. radially) instead of or more than downwardly (e.g. axially). The axial compression force AF (e.g. between the distal end of the connector member or pin and the bottom wall of 232c of the nonconductive receptacle 232) may be less than the radial friction / compression force RF. The axial and / or downward compression force AF may be reduced and / or zero in some embodiments. The pin or connector may push (e.g. radially) on the volume of the nonconductive portion / material within the conductive receptacle 231.

[0198] In some implementations, the nonconductive receptacle may be, but is not limited to, a compressible dielectric material, elastomeric, and / or nonconductive material. Thenonconductive material may be thermally nonconductive, electrically nonconductive, and / or both thermally and electrically nonconductive.

[0199] It should be understood that the connector 230, conductive receptacle, and / or nonconductive receptacle may be of a variety of shapes, sizes, quantities, and constructions and still be within the scope of the invention. For example, the nonconductive receptacle may not include an opening whereby the pin may create an aperture within the volume of material.

[0200] In some implementations, the connector 230 may be a solder free connection.

[0201] In some implementations, the film 220 may include separated conductive portions. As shown in the one embodiment in Figs. 50-58, the film 220 may include one or more conductive portions 140 / 140a / 140b with a nonconductive or film portion 130 therebetween in a variety of applications (e.g. cable to cable, board to board, board to cable, cable, coax, wire, axial, etc.). The nonconduction portion 130 may space or separate the upper / first and lower / second conductive portions 140 (e.g. portions on opposing surfaces) away from each other. The film (e.g. 230, 320) may not include one or more apertures 131 therethrough. Although the conductive portion 140 (e.g. 140a, 140b) is shown on both sides (e.g. opposing sides, top and bottom surfaces, not directly in contact with each other, directly across from each other), it should be understood that the conductive portion(s) 140a and / or 140b may be in a variety of positions relative to each other. For example, the conductive portion 140 may be positioned on one or more sides of the film (e.g. top surface, bottom surface, combination of top and bottom). For example, the signal connector 140a may be positioned only on the top surface 132. For example, the signal connector 140a may be positioned only on the bottom surface 133. For example, the ground connector 140b may be positioned only on the top surface 132. For example, the ground connector 140b may be positioned only on the bottom surface 133. Forexample, the signal connector 140a / ground connector 140b may be positioned on the bottom surface 133 not directly opposite to another signal connector 140a / ground connector 140b on the top surface 132. The conductive portions may be a variety of shapes, sizes, positions (e.g. recessed, one or more surfaces), quantities, and construction and still be within the scope of the invention.

[0202] In some implementations, the film / interface / interconnection / interposer may not need conductive portions 140. As shown in the one embodiment in Figs. 59-62, the film 320 may be free of or may not include conductive portions between the one or more interfacing components.

[0203] In some implementations, a single film / interface / interposer may include connectors having one or more of the film portions 120, 220, and / or 320 interfacing or configured to mate with one or more components. A single film may have connectors / portions / interposers of film 120, film 220, film 230, or combinations thereof to interface / connect / mate one or more components thereto (e.g. wires, boards, cables, etc.).

[0204] In some implementations, the cables 90, or portions thereof, may be connected to the film may be one or more wires (e.g. ground, signal, etc.). The wire, board, component, and / or cable may be connected / bonded to the film (e.g. nonconductive portion, conductive portion, or combination of both) in a variety of ways such as, but is not limited to, soldering, laser attached, mechanical attached, clamps, latches, screws, brackets, etc. In the one embodiment shown in Fig. 63, the wires are bonded by soldering to the one or more conductive portions (e.g. 140a, 140b). The one or more components may be fixed or releasably secured to the film / interposer, or portions thereof.

[0205] It should be understood that the conductive portions / elements 140 (e.g. 140a, 140b) and / or film130, or portions thereof, may be a variety of shapes, positions, and sizes to control / configure,but is not limited to, impedance, relative rotation, relative movement, and / or insertion loss. As shown in the one embodiment in Figs. 68-74, the ground connector 140b may be substantially noncircular (e.g. trapezoidal, triangular, diamond, oval, etc.) in cross section along one or more portions along its length (e.g. axial, longitudinal). Although a circular shape is contemplated along one or more portions along its length. As shown in one embodiment in Figs. 68-74, the ground connector 140b may be substantially triangular (e.g. noncircular) in shape along or adjacent the top surface 132 and / or bottom surface 133. The ground connector 140b (e.g. first) may be separated or spaced from an adjacent ground connector 140b (e.g. second) along a pattern or position (e.g. arcuate). The distal ends or portions, if used, beyond the extent of the film / aperture (e.g. 130, top surface, bottom surface) may be triangular in shape. Although the ground connector portion extending through the apertures 131 or connecting the one or more distal ends (e.g. noncircular, circular, etc.) may be circular in cross section as shown more clearly in Fig. 70, the ground connector portion positioned within the aperture 131 may be noncircular in cross section in some embodiments. As shown in Figs. 33-37, it should be understood that the apertures 131 and / or conductive elements 140 within the apertures 131 may be noncircular to reduce or prevent relative movement (e.g. rotation, slipping, unlocking) between the film 130 and the one or more conductive elements (e.g. 104a, 140b), or portions thereof. As shown in Figs. 69-71 the apertures 131 of the signal connector 140a and the ground connector 140b are both circular in shape and / or the same shape, however the apertures 131 of the signal connector 140a and the ground connector 140b may be different in shape in some embodiments. For example as shown in Fig. 33, the apertures 131 of the one or more signal connectors 140a and the one or more ground connectors 140b are different in shape.

[0206] In some implementations, the interposer 120a may include a plurality of conductive elements140 arranged on a film 120. In the one embodiment shown in Figs. 69-71, the interposer 120a and / or film 120 may include one or more apertures 131 therethrough receiving the conductive elements 140, respectively. In the one embodiment shown in Figs. 72-74, the interposer 120a and / or film 220 may not include one or more apertures 131 therethrough. The conductive elements 140 may be positioned on opposing surfaces of the film 220. The conductive elements / portions in the film or elastomer may be superconductive (e.g. fillers) in some embodiments. The superconductive fillers may be used in applications for cryogenic, lower power computing, quantum computing (e.g. sub 1 Kelvin range), and / or supercomputing. The superconductive fillers may be made of a variety of superconductive materials such as, but is not limited to, aluminum, lead, magnesium diboride, compound(s), element(s), alloy(s), etc.

[0207] In some implementations, the one or more electrically conductive elements 140, or portions thereof, may taper or reduce in cross section or material towards one or more adjacent electrically conductive elements 140. The one or more distal ends (e.g. extending beyond the film extent or surface, flush with film surface, within the film surface, exposed / contact surface, flange) or portions (e.g. lengths, sections, within aperture, outside aperture) of the conductive elements 140 may taper or narrow in the direction (e.g. laterally, horizontally) of the adjacent one or more distal ends (e.g. extending beyond the film extent or surface, flush with film surface, within the film surface, exposed / contact surface, flange) or portions (e.g. lengths, sections, within aperture, outside aperture) of the conductive elements 140. As shown in the one embodiment in Figs. 68-74, at least one end 140b 1 or both opposing ends 140b 1 of the noncircular shaped (e.g. triangular) ground connector(s) 140b adjacent opposing ground connector(s) 140b may be tapered, reduced (e.g. in material, cross section), and / or narrowedadjacent to or in the direction of the adjacent ground connector(s) 140b (e.g. adjacent end 140b 1 ). For example, the width, material, cross section of the ground connector may decrease / narrow / taper towards an adjacent ground connector, or portion thereof. As shown in Fig. 68A, the ground connector may have a first width W1 distal from the adjacent ground connector and a second width W2 proximal the adjacent ground connector, wherein the second width W2 is smaller than the first width W1. It should be understood that in some embodiments, one end 140b 1 of the opposing ends of the noncircular shaped (e.g. triangular) ground connector(s) 140b adjacent another ground connectors may be tapered, reduced (e.g. in material, in cross section), and / or narrowed adjacent to or in the direction of the adjacent ground connector(s) 140b. One benefit of the tapering / narrowing / reduction of materiaFconnector / element (e.g. 140a, 140b, 140) adjacent another or spaced apart conductive element 140 (e.g. 140a, 140b, 140) may, but is not limited to, reduce or control impedance.

[0208] In some implementations, a pattern (e.g. first, arcuate) of a plurality of ground connectors 140b (e.g. first, noncircular) about one or more signal connectors 140a (e.g. first) may share (e.g. overlap) one or more ground connectors 140b of another pattern (e.g. second, arcuate) of another plurality of ground connectors 140b (e.g. second, noncircular) about another one or more signal connectors 140a (e.g. second) within a film or structure. For example, see the one embodiment in Figs. 68-74.

[0209] In some implementations, the film and / or interposer, or portions thereof, may be devoid of signal traces that run horizontal to the film / interposer. For example, the via or conductive elements 140 (e.g. 140a, 140b) may extend only perpendicular / longitudinal through the film in some embodiments. As shown in the one embodiment 32, the cables 90 (e.g. coax, twin axial), conductive portions of the cable / board, and / or conductive elements of the film may extendperpendicular relative to or within the film. Further, the film, or portions thereof, may not be compressible or may be uncompressible. Whereby in some embodiments, the film 120, 130 or conductive portions 140 may be in a single configuration maintaining the conductive portions 140 separate from each other. For example, the film (e.g. 120, 130) may not compress to physically abut and / or laterally contact previously separate conductive elements 140 (e.g. 140a, 140b, longitudinally oriented).

[0210] In some implementations, one or more electrical connectors 30, assembly 20, cables 90, and / or substrate 50 may include or may be configured to mate with another (e.g. same, different) one or more electrical connectors 30, assembly 20, cables 90, and / or substrate 50 one or more tapes, films, connector films, or interface films 120, 220, 320 and / or interposer 120a. The film(s)120, 220, 320 may be used in some implementations to connect, such as through capacitive coupling, two single-ended or differential signal transmission lines, such as cables to cables (e.g. 90, coax, twin axial, etc.). One embodiment of different cables 90 (e.g. coax, twin axial) being mated with each is shown in Figs. 64-67. As shown in Figs. 66 and 67, one embodiment of a cable to cable implementation may include one or more coax cables 91 coupled to at least one twin axial cable 92 via the interposer 120a and / or film 120.

[0211] In some implementations, one embodiment of the film 120 and / or interposer 120a may include the differential signal transmission lines or conductors / connectors 140a surrounded at least partially by ground conductors / connectors 140b. As described above with respect to Figs. 66 and 67, the film 120 and / or interposer 120a may couple two different cable types. For example, the differential signal transmission connectors 140a may couple two coax cables 91 to a twin axial cable 92 as shown in Fig. 66. The one or more ground connectors 140b may couple the two coax cables 91 to a twin axial cable 92 as shown in Fig. 66. The film 120a may include thetwo signal connectors 140a surrounded by the ground connector 140b extending through the film 130 via one or more apertures 131. In some embodiments, the apertures may not be used. At least one first signal connector 140a may couple a signal conductor 91a of the first coax cable 91 with a first signal conductor 92a of the twin axial cable 92. At least one second signal connector 140a may couple a signal conductor 91a of the second coax cable 91 with a second signal conductor 92b of the twin axial cable 92. The signal conductors of the respective cables may be laterally / radially / horizontally offset / spaced away from or may be not coaxially aligned when coupled to the signal connector 140a and / or interposer 120a as more clearly shown in the one embodiment in Fig. 66. The signal conductor 91a (e.g. longitudinal axis) of the coax cable 91 may be spaced radially / laterally / horizontally outward or away from the signal conductor 92a, 92b (e.g. longitudinal axis) of the twin axial cable 92. For example, towards the ground connector 140b.

[0212] In some embodiments, one or more signal connector 140a may be constructed of one or more members. As shown in the one embodiment in Figs. 64-67, the signal connector 140a may be a plurality of members. Alternatively, the signal connector may be a unitary member as shown in Fig. 35. The signal connector 140a may include a via 140al and / or one or more pads 140a2. The one or more pads 140a2, if used, may be opposing pads coupled to the via. However, one pad may be used in some embodiments. The via 140al, if used, may extend through the film 130 (e.g. one or more apertures 131). The opposing pads 140a2 may be coupled to opposing ends / sides of the via 140al (e.g. adjacent the top surface 132, adjacent the bottom surface 133).The opposing pads 140a2 may be offset or spaced (e.g. laterally / radially / horizontally) from each along the respective surfaces (e.g. bottom, top) of the film / via. Although the pads may be dissimilar in shape and / or size, the pads may be a variety of shapes, sizes, quantities, positions,and constructions and still be within the scope of the invention. For example, the pads may be both circular and the same size in some embodiments. As shown in the one embodiment, the pad 140a2 engaging the twin axial signal conductor 92a, 92b may be larger in diameter than the opposing pad 140a2 engaging the coax signal conductor 91a on the other side of the via 140al. Although the via 140al is laterally elongated within the film 130 / aperture 131 or substantially oval shaped (e.g. noncircular), the via may be a variety of shapes, sizes, quantities, positions, and constructions and still be within the scope of the invention. For example as shown in the one embodiment, the via may have one lateral end larger than the other lateral end in the horizontal direction of the film. The larger lateral end may be coupled to the pad 140a2 (e.g. larger diameter) engaging the twin axial signal conductor 92a, 92b while the smaller lateral end may be coupled to the opposing pad 140a2 (e.g. smaller diameter) engaging the coax signal conductor 91 a.

[0213] In some implementations, the ground connector 140b may be constructed of one or more members. Although the ground connector 140b may be of a unitary construction as shown in Fig. 37 for example, the ground connector may be at least a two piece / member construction. As shown in Figs. 65-67, a first member 140b2 may extend through the film 130 to engage a second member 140b3. The first member 140b2, if used, may include a first plate / flange 140b21 on the bottom surface 133 of the film 130 with an upwardly projecting protrusion / via 140b22 extending through the apertures 131. The second member 140b3, if used, may include a second plate / flange 140b31 on the top surface 132 of the film 130. The first plate and second plate (e.g. flanges) may extend outwardly from the protrusion 140b22, if used, and / or aperture 131.

[0214] In some implementations, the one or more electrical connectors 30, assembly 20, cables 90, films 120, 220, 320, and / or interposer 120a may include one or more mezzanines, housings, orblocks 150. The blocks 150, if used, may retain or engage the one or more cables 90 and / or ground the shielding of the one or more cables 90. The blocks 150 may axially / radially compress / connect (e.g. physically, electrically, capacitively) the cables and / or blocks, or portions thereof, to one or more portions of the interposer, or portions thereof. The one or more apertures 151 of the blocks 150 may engage / ground the one or more cable shielding of the one or more cables. The block(s) 150, if used, may engage / ground the one or more cable shielding to one or more of the ground connectors 140b. As shown in the one embodiment in Figs. 66 and 67, the ground connectors 140b may ground / connect to the one or more cable shielding alone or in combination with blocks 150. The film 120 may include an upper block 150a and / or a lower block 150b. The blocks 150 may be made of a variety of materials, but is not limited to, electrically conductive materials, conductive plastic, electrically conductive material covering plastic, diecast, etc.

[0215] In some implementations, the shielding / ground and / or signal transmission lines may be in contact or engagement (e.g. physically, compressed against) with one or more portions or the interposer 120a. The contact may be in a variety of ways and directions such as but is not limited to axial and / or horizontally / laterally / radially relative to the film / interposer, or portions thereof. For example as shown in Figs. 43-46 and 55-62, the lines / conductors of the board / cable are axially in contact with respective conductive elements 140 or film 130. For example as shown in Fig. 66, the lines / conductors (e.g. signal conductors) of the cable are axially in contact with respective conductive elements 140a and the lines / conductors (e.g. shielding) of the cable are radially / horizontally in contact with at least the respective blocks 150 (e.g. inner periphery of the aperture 151), if used. It should be understood that both axially and laterally contact may be used in some embodiments.

[0216] Benefits of the instant disclosure can include but are not limited to: if an existing radio frequency (RF) band device has 100 channels at a given frequency, say in the 2±1 GHz range, the 2.4GHz range, the 3±1 GHz range, the 4±lGHz range, the 5±lGHz range, the 6±lGHz range, etc., embodiments disclosed herein can increase the total number of channels without increasing the volume or area of channels. Increasing the number of RF channels can be described as a larger scale factor or larger scale factoring or a larger scale factor; board or host substrate or transceiver printed circuit board DC blocking capacitors can be eliminated, resulting in more usable board / host substrate / transceiver board area and a reduced cost (DC blocking caps and associated power consumption); in supercomputing or extreme low temperature applications, such as 0-degrees K or 0-50 degrees K, embodiments disclosed herein permit connectors to be made with off-the-shelf NiTi wire, without a need to plate electrical conductors, such as mating, mounting or intermediate portions of stamped, machined or stamped and formed metal conductors with exotic plating materials, such as NiTi. No metal conductors or plated metal conductors are needed, especially at a mating interface of an associated electrical connector, because the cables or wires, such as NiTi wires terminate directly or indirectly to a corresponding signal transmission path carried by the film or thin film 120. This can result in lower costs and lower heat transfer; connectors or substrates can be mated and unmated with the film or thin film 120 over more mating / unmating cycles without the mechanical wear of beam on blade or beam on beam conductors. Alternatively, the film or thin film 120 can be glued, epoxied, melted, or otherwise affixed to a substrate or a connector; signal integrity through metrics, which can include unwanted insertion loss and return loss, are improved compared to pogo pin interconnects having the same transmission path, or the same conductor density of an embodiment described and claimed herein.

[0217] Embodiments described herein can operate at direct current (DC) and / or at frequencies greater than 0, greater than 0GHz through approximately 1GHz, approximately 2GHz±0.9GHz, approximately 3GHz±0.9GHz, approximately 4GHz±0.9GHz, approximately 5GHz±0.9GHz, approximately 6GHz±0.9GHz, approximately 7GHz±0.9GHz, approximately 8GHz±0.9GHz, approximately 9GHz±0.9GHz, approximately 10GHz±0.9GHz, approximately 10GHz±0.9GHz, approximately 2GHz±0.9GHz, approximately 3GHz±0.9GHz, approximately 4GHz±0.9GHz, approximately 5GHz±0.9GHz, approximately 6GHz±0.9GHz, approximately 7GHz±0.9GHz, approximately 8GHz±0.9GHz, approximately 9GHz±0.9GHz, approximately 10GHz±0.9GHz, approximately 1 lGHz±0.9GHz, approximately 12GHz±0.9GHz, approximately13GHz±0.9GHz, approximately 14GHz±0.9GHz, approximately 15GHz±0.9GHz, approximately 16GHz±0.9GHz, approximately 17GHz±0.9GHz, approximately18GHz±0.9GHz, approximately 19GHz±0.9GHz, approximately 20GHz±0.9GHz, approximately 21GHz±0.9GHz, approximately 22GHz±0.9GHz, approximately23GHz±0.9GHz, approximately 24GHz±0.9GHz, approximately 25GHz±0.9GHz, approximately 26GHz±0.9GHz, approximately 27GHz±0.9GHz, approximately28GHz±0.9GHz, approximately 29GHz±0.9GHz, approximately 30GHz±0.9GHz, approximately 31GHz±0.9GHz, approximately 32GHz±0.9GHz, approximately33GHz±0.9GHz, approximately 34GHz±0.9GHz, approximately 35GHz±0.9GHz, approximately 36GHz±0.9GHz, approximately 37GHz±0.9GHz, approximately38GHz±0.9GHz, approximately 39GHz±0.9GHz, approximately 40GHz±0.9GHz, approximately 41GHz±0.9GHz, approximately 42GHz±0.9GHz, approximately43GHz±0.9GHz, approximately 44GHz±0.9GHz, approximately 45GHz±0.9GHz, approximately 46GHz±0.9GHz, approximately 47GHz±0.9GHz, approximately48GHz±0.9GHz, approximately 49GHz±0.9GHz, approximately 50GHz±0.9GHz, approximately 51GHz±0.9GHz, approximately 52GHz±0.9GHz, approximately53GHz±0.9GHz, approximately 54GHz±0.9GHz, approximately 55GHz±0.9GHz, approximately 56GHz±0.9GHz, approximately 57GHz±0.9GHz, approximately58GHz±0.9GHz, approximately 59GHz±0.9GHz, approximately 60GHz±0.9GHz, approximately 61GHz±0.9GHz, approximately 62GHz±0.9GHz, approximately63GHz±0.9GHz, approximately 64GHz±0.9GHz, approximately 65GHz±0.9GHz, approximately 66GHz±0.9GHz, approximately 67GHz±0.9GHz, approximately68GHz±0.9GHz, approximately 69GHz±0.9GHz, approximately 70GHz±0.9GHz, approximately 71GHz±0.9GHz, approximately 72GHz±0.9GHz, approximately73GHz±0.9GHz, approximately 74GHz±0.9GHz, approximately 75GHz±0.9GHz, approximately 76GHz±0.9GHz, approximately 77GHz±0.9GHz, approximately78GHz±0.9GHz, approximately 79GHz±0.9GHz, approximately 80GHz±0.9GHz, approximately 81GHz±0.9GHz, approximately 82GHz±0.9GHz, approximately83GHz±0.9GHz, approximately 84GHz±0.9GHz, approximately 85GHz±0.9GHz, approximately 86GHz±0.9GHz, approximately 87GHz±0.9GHz, approximately88GHz±0.9GHz, approximately 89GHz±0.9GHz, approximately 90GHz±0.9GHz, approximately 91GHz±0.9GHz, approximately 92GHz±0.9GHz, approximately93GHz±0.9GHz, approximately 94GHz±0.9GHz, approximately 95GHz±0.9GHz, approximately 96GHz±0.9GHz, approximately 97GHz±0.9GHz, approximately98GHz±0.9GHz, approximately 99GHz±0.9GHz, approximately 100GHz±0.9GHz, and greater than 100GHz. All frequencies include all ranges, out to three decimal places between 0.0 and0.1, 0.1 and 0.2, 0.2 and 0.3, 0.3 and 0.4, and 0.4 and 0.5, 0.5 and 0.6, 0.6 and 0.7, 0.7 and 0.8, 0.8 and 0.9, and 0.9 and 1.000GHz.

[0218] In some embodiments, an electrical connector may include a film. In various embodiments, the film may include a nonconductive portion defining one or more through apertures and one or more conductive portions received within the one or more through apertures. In some embodiments, the one or more conductive portions may be configured to be continuously conductive through the film.

[0219] In addition, in various embodiments, the one or more conductive portions may include at least one circumscribed signal connector. In some embodiments, the one or more conductive portions may include at least two circumscribed signal connectors. In various embodiments, the one or more conductive portions extend above and below opposing surfaces of the nonconductive portion. In some embodiments, the one or more conductive portions may include one or more flanges extending away from the through apertures. In various embodiments, the nonconductive portion and the one or more conductive portions do not compress together. In some embodiments, the nonconductive portion may be electrically nonconductive, thermally nonconductive, or both electrically and thermally nonconductive. In various embodiments, the one or more conductive portions may include one or more ground connectors surrounding one or more signal connectors. In some embodiments, at least one of the one or more conductive portions may be connected to a plurality of the one or more through apertures. In various embodiments, at least one of the one or more conductive portions may be connected to a single aperture of the one or more through apertures. In some embodiments, the one or more conductive portions may include an inner periphery and an outer periphery. In various embodiments, the inner periphery and the outer periphery may be continuous. In someembodiments, the one or more conductive portions may include a signal connector split. In various embodiments, the film may connect a first cable to a second cable. In some embodiments, the film may connect a first board to a second board. In various embodiments, the film may connect a cable to a board. In some embodiments, the one or more conductive portions may be dissimilar in shape to one or more signal pins and / or grounds.

[0220] In some embodiments, a film include one or more conductive layers coupled to one or more apertures of a nonconductive layer.

[0221] In some embodiments, a film may be configured to be attached to a die package comprising at least a density of 256 differential pairs per square inch.

[0222] In some embodiments, an electrical connector may include at least one of a mating interface, a plug connector, a film, and / or a cable connector. In various embodiments, the connector may include a 224 Gbps Pam4 signal at 6ps with 20%-80% rise time.

[0223] In some embodiments, an electrical connector may include a film having a plurality of conductive portions extending through one or more apertures of a nonconductive portion. In various embodiments, the connector may include at least one of mating interface, a plug connector, and / or cable connector.

[0224] In some embodiments, a film may include a nonconductive layer having a plurality of apertures extending from a top surface to a bottom surface. In various embodiments, the film may include a conductive member extending through one or more of a plurality of apertures from at least the top surface to at least the bottom surface.

[0225] In addition, in some embodiments, the conductive member may extend from above the top surface to below the bottom surface. In various embodiments, the conductive member may include one or more flanges. In some embodiments, the one or more flanges may extendoutwardly along the top surface and / or bottom surface in one or more directions. In various embodiments, the conductive member may include one or more ground members and one or more signal members spaced inwardly relative to the ground members. In some embodiments, the conductive member may be received within one of the plurality of apertures. In various embodiments, the conductive member may be received within a plurality of the apertures. In some embodiments, the conductive member may include a plurality of conductive members. In various embodiments, the conductive member may be continuous from the top surface to the bottom surface. In some embodiments, the conductive member may include an inner periphery and an outer periphery proximate the top surface and / or the bottom surface. In various embodiments, the conductive member may include an outer periphery adjacent the top surface and / or the bottom surface. In some embodiments, a portion of the top surface and / or bottom surface may be exposed between a signal member and ground member of a plurality of the conductive members. In various embodiments, the conductive member may include a signal member split from the top surface to the bottom surface. In some embodiments, the conductive member may be arcuate.

[0226] In some embodiments, a method of coupling a connector and / or component with a film may include providing a nonconductive layer having a plurality of apertures therethrough. In various embodiments, the method may include forming one or more conductive layers to the nonconductive layer.

[0227] In addition, in some embodiments, the method may include continuous conductivity via the one or more conductive layers through the plurality of apertures without compression. In various embodiments, the method may include splitting a signal with the one or more conductive layers. In some embodiments, the method may include connecting a cable to a cable with the film. Invarious embodiments, the method may include connecting a cable to a board with the film. In some embodiments, the method may include connecting a board to a board with the film. In various embodiments, forming the conductive layer may include forming flanges over a top surface and / or bottom surface of the nonconductive layer. In some embodiments, the method includes compressing the conductive layer and not the nonconductive layer when connecting. In various embodiments, the nonconductive layer may be electrically, thermally, or both electrically and thermally nonconductive. In some embodiments, forming may include molding, printing, or squeezing a paste. In various embodiments, the method may include reducing the downward compression force. In some embodiments, the one or more conductive layers may be received within one or more apertures. In various embodiments, a single one of the one or more conductive layers may be received within a single one of the one or more apertures. In some embodiments, a single one of the one or more conductive layers may be received within a plurality of the one or more apertures. In various embodiments, the one or more conductive layers may define at least one signal conductor circumscribed by a ground conductor. In various embodiments, the one or more conductive layers may define at least two signal conductors circumscribed by a ground conductor.

[0228] In some embodiments, an electrical connector may include a conductive receptacle defining an opening. In various embodiments, a connector may include a nonconductive receptacle received within the opening.

[0229] In some embodiments, an electrical connector may include a first conductive cup having a second nonconductive cup therein configured to axially receive a cylindrical pin.

[0230] In some embodiments, an electrical connector may include an arcuate conductive wall having an inner periphery. In various embodiments, the connector may include an arcuate nonconductivewall having an outer periphery and an inner periphery. In some embodiments, the outer periphery may be adjacent the inner periphery of the arcuate conductive wall.

[0231] In various embodiments, an electrical connector may include a substrate. In some embodiments, one or more conductive receptacles may have a hollow, electrically nonconductive receptacle therein. In various embodiments, the nonconductive receptacle may be configured to receive a pin.

[0232] In addition, in some embodiments, the connector may include a pin axially received within the hollow, electrically nonconductive receptacle. In some embodiments, the hollow, electrically nonconductive receptacle may include a bottom.

[0233] In some embodiments, an electrical connector may include an outer conductive cylinder surrounding an inner, electrically nonconductive cylinder. In various embodiments, the inner, electrically nonconductive cylinder may define an axial opening therein configured to receive a connector.

[0234] In some embodiments, an electrical connector may include an electrically nonconductive receptacle having an inner periphery. In various embodiments, the connector may include a connector member having an outer periphery. In some embodiments, the connector member may be axially received within the electrically nonconductive receptacle. In various embodiments, a friction force in a radial direction between the inner periphery and the outer periphery may secure the connector member in the electrically nonconductive receptacle.

[0235] In some embodiments, the outer periphery may include a larger radius than the inner periphery. In various embodiments, the electrical connector may include a conductive receptacle positioning the electrically nonconductive receptacle therein. In some embodiments, an axial compression force between a distal end of the connector member and a bottom of the electricallynonconductive receptacle may be less than the radial friction force. In various embodiments, the axial compression force may be zero.

[0236] In some embodiments, an electrical connector may include a cylindrical connector having a nonconductive circumferential engagement with at least one signal element.

[0237] In some embodiments, an electrical connector may include a solder free engagement with a signal element.

[0238] In some embodiments, a high-speed connector having a housing. In various embodiments, the connector may include electrical cables carried by the housing. In some embodiments, the electrical cables may be configured to pass signals to a substrate and / or to another connector through a thin film.

[0239] In addition, in some embodiments, the thin film may include electrically conductive elements.In various embodiments, the thin film may be devoid of electrically conductive elements. In some embodiments, the electrical cables carry differential signals of at least 224Gbps Pam4 signals at approximately 56GHz to approximately 70GHz of bandwidth with no more than approximately -40dB of FEXT (far end crosstalk). In various embodiments, the electrical cables each have a respective mating end and each respective mating end may be devoid of solder. In various embodiments, the electrical cables may each include a signal conductor, an insulator, and a shield, and each of the signal conductor, the insulator and the shield all terminate in a common plane or all form a planar mating interface.

[0240] In some embodiments, an apparatus for carrying or transmitting high-speed electrical signals may include a connector or a first substrate. In various embodiments, the apparatus may include a means for passing a differential signal from the connector or the first substrate to a second substrate or to a mating electrical connector, wherein the differential signal has a data transferrate of at least 224Gbps Pam4 with no more than approximately -40dB of FEXT (far end crosstalk).

[0241] In some embodiments, an apparatus for carrying or transmitting high-speed electrical signals may include a connector or a first substrate. In various embodiments, the apparatus may include an interposer that physically mates, electrically mates or both physically and electrically mates with the connector or the first substrate and a mating connector or a second substrate, wherein the connector or the first substrate and the interposer are devoid of any one, any two, any three, any three, any four, any five, any six, any seven, any eight, any nine, any ten, any eleven, or any twelve of: solder balls, solder charges, solder masses, FUZZ BUTTONS®, compressible conductive meshes, anisotropic conductive elastomer, formed wire, stamped and formed conductors, pogo pins, spring-loaded pins, press-fit pins, through hole pins and J-leads.

[0242] In addition, in some embodiments, the interposer may include coaxial signal paths, wherein the coaxial signal paths further comprise a center electrical signal conductor circumscribed, surrounded or mostly surrounded by a ground or reference conductor. In various embodiments, the interposer may only contain coaxial signal paths.

[0243] In some embodiments, an interposer may include a sheet of electrically insulative or dielectric material that carries at least one coaxial transmission path. In various embodiments, at least one coaxial transmission path may include means for transmitting a signal through the electrically insulative or dielectric material. In some embodiments, at least one coaxial transmission path may include means for shielding the means for transmitting the signal through the electrically insulative or dielectric material.

[0244] In some embodiments, an interposer may include a sheet of electrically insulative or dielectric material and a first signal transmission path, the first signal transmission path further comprisingonly a single signal conductor or only a pair of signal connectors surrounded by a solid or broken reference or ground conductor, wherein the sheet of electrically insulative or dielectric material is devoid of any one, any two, or any three, or any four or any five of the following: a ground plane, FR4 material, signal traces physically connected to vias, press-fit vias, and solder masses.

[0245] In addition, in some embodiments, the solid or broken reference or ground conductor may be configured to receive or physically touch or be electrically connected to or physically touch and be electrically connected to a mating cable shield.

[0246] In some embodiments, an interposer may include a sheet of electrically insulative or dielectric material and a first signal transmission path, the first signal transmission path further comprising only a single signal conductor or only a pair of signal connectors surrounded by a solid or broken reference or ground conductor, wherein the sheet of electrically insulative or dielectric material is devoid of any one, any two, any three, any four, any five, or any six of the following: a ground plane, FR4 material, glass, signal traces physically connected to vias, press-fit vias, and solder masses.

[0247] In some embodiments, a film may include one or more conductive layers. In various embodiments, the film may include one or more nonconductive layers. In some embodiments, the one or more conductive layers may be positioned on one or more sides of the one or more nonconductive layers. In various embodiments, the one or more nonconductive layers may include one or more through apertures positioning the one or more conductive layers through the film.

[0248] In some embodiments, a film may include one or more nonconductive layers without conductive portions.

[0249] In some embodiments, a method of coupling with a film may include providing one or more nonconductive layers. In various embodiments, the method may include forming one or more conductive layers to the nonconductive layer. In some embodiments, the nonconductive layer may include a plurality of apertures therethrough. In various embodiments, the one or more conductive layers may be separated by the one or more nonconductive layers.

[0250] In some embodiments, a method of coupling with a film may include providing a nonconductive layer without conductive portions. In various embodiments, the method may include coupling two or more components with the nonconductive layer.

[0251] In some embodiments, an electrical connector may comprise a film. In various embodiments, the film may have a nonconductive portion defining one or more through apertures and one or more conductive portions received within the one or more through apertures configured to be continuously conductive through the film. In some embodiments, the one or more conductive portions may include at least one via through the one or more through openings and / or one or more pads coupled to at least one via.

[0252] In addition, in some embodiments, the one or more conductive portions may include at least one circumscribed signal connector. In various embodiments, the one or more conductive portions may include at least two circumscribed signal connectors. In some embodiments, the one or more pads may be positioned above and / or below opposing surfaces of the nonconductive portion and / or at least one via. In various embodiments, the one or more pads may include opposing pads on opposing sides of at least one via. In some embodiments, the opposing pads may be laterally offset on the opposing sides of at least one via. In various embodiments, the pads may not be coaxially aligned. In some embodiments, the one or more conductive portions may include one or more ground connectors surrounding one or more signal connectors. Invarious embodiments, at least one of the one or more conductive portions may be connected to a plurality of the one or more through apertures. In some embodiments, at least one of the one or more conductive portions may be connected to a single aperture of the one or more through apertures. In various embodiments, the film may connect a first cable to one or more second cables. In some embodiments, the film may connect a first board to a second board. In various embodiments, the film may connect a cable to a board.

[0253] In some embodiments, an electrical connector may comprise a film having a first signal connector interconnecting a first signal conductor of a first cable to a second signal conductor of a second cable. In various embodiments, the axis of the first signal conductor of the first cable may not be axially aligned with the axis of the second signal conductor of the second cable.

[0254] In addition, in some embodiments, the electrical connector may include a second signal conductor of the first cable, wherein the film may include a second signal connector interconnecting the second signal conductor of the first cable to a third signal conductor of a third cable, and wherein the axis of the second signal connector of the first cable may not be axially aligned with the axis of the third signal conductor of the third cable. In various embodiments, the first signal connector may include one or more pads positioned adjacent opposing surfaces of the film. In some embodiments, the one or more pads may include opposing pads on the opposing surfaces of the film, respectively. In some embodiments, the opposing pads may not be axially aligned. In various embodiments, the electrical connector may include a housing carrying at least one of the first cable and / or second cable. In some embodiments, the electrical connector may include one or more ground connectors at least partially surrounding the first signal connector. In various embodiments, the film may include one or more apertures receiving the first signal connector.

[0255] In some embodiments, a film may include one or more conductive layers. In various embodiments, the film may include one or more nonconductive layers. In some embodiments, the one or more conductive layers may include a first conductive portion adjacent a second conductive portion. In various embodiments, the first conductive portion may narrow (e.g. cross section, width, height, shape, size) towards the second conductive portion.

[0256] In addition, in some embodiments, the one or more conductive layers may be positioned on one or more sides of the one or more nonconductive layers. In various embodiments, the first conductive portion and the second conductive portion may be positioned on at least one side of the one or more sides of the one or more nonconductive layers. In some embodiments, the one or more nonconductive layers may include one or more through apertures positioning the one or more conductive layers through the film.

[0257] In some embodiments, an electrical connector may include a film. In various embodiments, the film may include a nonconductive portion and one or more conductive portions. In some embodiments, the one or more conductive portions may include at least one signal connector circumscribed by two or more adjacent ground connectors. In various embodiments, the two or more adjacent ground connectors may include a first ground connector and a second ground connector. In some embodiments, at least a portion of the first ground connector tapers / narrows towards the adjacent second ground connector.

[0258] In addition, in some embodiments, the one or more conductive portions may include at least two circumscribed signal connectors. In various embodiments, the film may include a nonconductive portion defining one or more through apertures and the one or more conductive portions may be received within the one or more through apertures configured to be continuously conductive through the film. In various embodiments, the first ground connectormay be connected to a plurality of the one or more through apertures. In some embodiments, the first ground connector may be connected to a single aperture of the one or more through apertures. In various embodiments, the one or more conductive portions may be positioned above and / or below opposing surfaces of the nonconductive portion. In some embodiments, the two or more adjacent ground connectors may include a third ground connector, and wherein the first ground connector tapers towards the adjacent third ground connector. In various embodiments, one or more ends of the first ground connector may taper / narrow away from the remaining portion of the first ground connector.

[0259] In some embodiments, a film may include a nonconductive layer. In various embodiments, the film may include at least two adjacent ground connectors circumscribing at least one signal connector. In some embodiments, the film, or portions thereof, may include a means for reducing impedance between at least two adjacent ground connectors.

[0260] In some embodiments, a film may include a nonconductive layer. In various embodiments, the film may include a first plurality of ground connectors circumscribing at least one first signal connector. In some embodiments, the film may include a second plurality of ground connectors circumscribing at least one second first signal connector. In various embodiments, the first plurality of ground connectors and the second plurality of ground connectors may share or have at least one common ground connector therebetween.

[0261] In addition, in some embodiments, at least one common ground connector may taper / narrow to both an adjacent ground connector of the first plurality of ground connectors and an adjacent ground connector of the second plurality of ground connectors. In various embodiments, at least one ground connector of the first plurality of ground connectors may taper / narrow toward at least one adjacent ground connector of the first plurality of ground connectors. In someembodiments, at least one ground connector of the second plurality of ground connectors may taper / narrow toward at least one adjacent ground connector of the second plurality of ground connectors.

[0262] Although the interposer film or films 120a may be laser cut dielectric films in some embodiments, in some applications the interposer film or film(s) 120a, or portions thereof, may be manufactured using additive manufacturing techniques. The additive manufacturing may screen print the dielectric material(s) simultaneously with the conductive material(s). Alternatively, the screen print of at least two materials may be separately printed. The dielectric and the conductive material may be an elastomer (e.g. when using the additive technique, uniform film). In some implementations as shown in Figs. 52-58, if additive manufacturing is used to create the capacitive film (e.g. without the conductive via / aperture) the distance between the conductive portions 140 or thickness / height of dielectric elastomer between the conductive pads 140 and / or signal / ground conductors / connectors may be readily adjustable to achieve a variety of desired capacitance and / or desired inductance. In some implementations as shown in Figs. 34 and 43-46, one or more vias / apertures, if used, may be printed by additive manufacturing such that the shape and size may be readily adjustable to achieve a variety of characteristics (e.g. a variety of capacitances, a variety of inductances). For example although the via may be shown as substantially straight walled, it should be understood that that outer peripheral walls may be or my contain any one or more shapes of concave, convex, or a cross section varied along its height to achieve a variety of characteristics. The screen printing of one or more layers may be layered in a single direction or multiple directions. For example, the layers may be applied to each other thereby increasing in height in only a first direction. In other examples, a first layer(s) or a layer(s) may be added to increase the height in a firstdirection then the product may be flipped to apply a second layer or another layer(s) to the other side of the product to increase the height in a second / opposing direction to the first direction. One layer and / or each layer of a plurality of layers may be about 5 microns in thickness / height. In some embodiments, traditional printing may used for one or more portions of the interposer 120a, or portions thereof. For example, stencil printing may be used.

[0263] In some implementations, one or more containment structures 280 (e.g. material(s), wall(s)), or portions thereof, may be defined by the interposer / film and / or printed / deposited / coupled upon the film or portions thereof, to define / form one or more containment areas / volumes 290. The containment structure 280 (e.g. walls, layers, projections, recesses, etc.), or portions thereof, may be printed by a variety of methods such as, but is not limited to, 3D printing, silkscreen printing, stencil printing, mask printing, or aerosol printing. The structure 280 (e.g. sleeves, wall(s), etc.), or portions thereof, may be defined / formed / coupled to the film 220. The containment structure 280, or portions thereof, may provide containment / collection of one or more materials (e.g. debris) and / or may position one or more materials (e.g. rare materials, gold, alloys, layers). The containment structure 280, if used, may contain or collect one or more debris materials 2 in one or more targeted or confined or containment areas / volumes 290 (e.g. adjacent pads, conductors, connectors). Debris 2 may be pulled from components or be created by repeated contact and / or separation of the one or more conductors and the interposer (e.g. signal, ground). In some embodiments, the structure 280, if used, may position material into the volume 290 (e.g. radial, axial). For example, an additional layer or material 3 (e.g. gold) may be added to the contact surface of the signal conductor 140, 140a and / or ground conductor 140, 140b as shown more clearly in Figs. 76 and 77. Although material is applied to the axial contactsurface as shown, the radial surface of the conductor 140 may be added with material 3 in some embodiments alone or in combination with the axial contact surface.

[0264] The volume 290 defined by one or more containment structures 280 may be a variety of shapes, sizes, quantities, and positions. An axial volume 291, one or more radial volumes 292, and / or both an axial and radial volume may be defined by the one or more containment structures. The volume 290 (e.g. axial 291) defined by the containment structure 280 may axially extend away from or be vertically / axially above and / or below an end surface or axial extent of the conductor 140 (e.g. 140a, 140b). In some embodiments, the containment structure 280 may be positioned adjacent (e.g. directly against, spaced from) the one or more peripheries (e.g. inner 142, outer 143) of the conductor to define the volume 290 to create an axial volume 291 as shown in Figs. 75-80. In some embodiments as shown in Figs. 78-80, the containment structure 280 may be spaced radially (e.g. inwardly, outwardly) from the periphery (e.g. inner 142, outer 143) of the conductor to create one or more radial volumes 292. Further, the radial volume or radial spacing / gaps 292 of one or more containment structures 280, if used, may be adjacent or on the side of the inner periphery 142, outer periphery 142, or both the outer and inner periphery in some embodiments. Although the containment structure may project axially beyond the distal end or axial extent of the structure or conductor, the containment structure may not extend axially beyond the axial extent of the conductor or may be flush in the same plane and thereby not creating an axial volume and only defining a radial volume, if any, if spaced away therefrom. For example, see containment structure 280 (e.g. 281) about the signal conductor 140a on the top surface of the film 220 extends flush with the axial extend of the conductor 140a shown in Fig. 79.

[0265] In some implementations, the containment structure 280, or portions thereof, may include one or more walls 281, 282 surrounding or defining the areas / surfaces / volume(s) 290 (e.g. inner periphery, outer periphery), or portions thereof, on the interposer 120a or film 220. For example, the signal conductor wall(s) 281 (e.g. a single wall), if used, may surround or at least partially surround or define an area / surface / volume 290 (e.g. containment, 291, 292) on / adjacent the conductor or pad 140a as shown in the one embodiment in Figs. 75-80. The structure 280 (e.g. 281) may maintain or keep the positioned metal or material 3 and / or debris 2 in the confined area / volume (e.g. 291) in some embodiments. The raised / deposited / coupled structure 280 (e.g. wall(s) 281) may be screen printed or 3D printed or aerosol printed in some embodiments. The wall 281 may be a hollow cylinder. In the embodiment shown in Fig. 76, the cylinder or wall 281 may be adjacent (e.g. directly against) the outer periphery 143 of the one or more signal conductors 140, 140a. As shown in Fig. 79, the wall 281 may be radially spaced outwardly from the conductor outer periphery 143. The wall(s) may be a shape different from the outer / inner periphery. The wall 281 may axially project beyond the axial extent or distal free end of the signal conductor 140, 140a as shown in Figs. 76 and 79. The volume 290 (e.g. axial) may be defined as substantially cylindrical. Further for example, the ground conductor wall(s) 282, if used, may surround or at least partially surround or define an area / surface / volume 290 (e.g. containment, 291, 292) on / adjacent the conductor or pad 140b as shown in the one embodiment in Figs. 75-80. The structure 280 (e.g. 282) may maintain or keep the positioned metal or material 3 (e.g. layer) and / or debris 2 in the confined area / volume in some embodiments. The raised / deposited / coupled structure 280 (e.g. wall(s) 282) may be screen printed or 3D printed or aerosol printed in some embodiments. The wall(s) 282 may be a hollow cylinder. In some embodiments, the cylinder or wall 282 may be adjacent (e.g. directlyagainst) the outer periphery of the one or more ground conductors 140, 140b. In some embodiments, the cylinder or wall 282 may be adjacent (e.g. directly against) the inner periphery of the one or more ground conductors 140, 140b. In the embodiment shown in Fig. 76, the inner wall 282 may be adjacent (e.g. directly against) the inner periphery and the outer wall 282 may be adjacent (e.g. directly against) the outer periphery, defining a volume (e.g. arcuate, annular, 291, 292) therebetween. As shown in Figs. 78-80, the wall 282 may be radially spaced outwardly from the conductor outer periphery 143 and / or radially spaced inwardly from the conductor inner periphery 142. In some embodiments, the wall(s) 282 may be a shape different from the outer / inner periphery. The wall 282 (e.g. outer, inner) may axial project beyond the axial extent of the ground conductor 140, 140b. The wall 282 may be substantially flush the conductor (e.g. 140a, 140b).

[0266] In some implementations, the containment structure 280 may include a wall(s) that contains / defines a volume for both the signal conductor 140a and the 140b. As shown in Figs. 78-80, a wall 281, 282 (e.g. single) between the signal conductor and the ground conductor may be used to define a volume for each one of the signal and ground conductors. The wall 281, 282 may define a first volume 290 (e.g. axial, radial) adjacent the signal conductor and a second volume 290 (e.g. axial, radial) adjacent the ground conductor. Further, a wall(s) may define a volume that may encompass one or more conductors (e.g. signal, ground). For example, a single wall may surround both the ground conductor and the signal conductor.

[0267] Although the containment structure / walls / volume(s) are shown in the Figures, it should be understood that a variety of shapes, sizes, quantities, positions, and constructions may be used and still be within the scope of the invention. Further, for example, the area or periphery of the volume 290 may be rectangular in shape rather than arcuate in shape as shown in the oneembodiment. Although the area 290 is shown as being surrounded 360 degrees by the wall(s), the periphery may be partially surrounded or less than 360 degrees. The containment areas / volumes 290 may be similar or different from each other (e.g. height, shape, size, volume, spacing, patterns, etc.). The walls or peripheral surfaces 281, 282 of the area / volume(s) 290 may be perpendicular to the surface 132, 133 as shown in the one embodiment, however other orientations are contemplated such as, but is not limited to, angled.

[0268] In some implementations, the structure / wall, or portions thereof, may be made of an elastomer (e.g. dielectric) in some embodiments. Other materials are contemplated. For example, the material may be a dielectric in some embodiments. The containment structure 280 may be flexible or stiff in some embodiments. The walls may be a variety of thicknesses / heights / widths / patterns and still be within the scope of the invention.

[0269] In some implementations, the one or more containment structures, or portions thereof, may guide / orientate the coup ling / uncoup ling of components attached to the interposer 120a or film.

[0270] In some implementations, the one or more containment structures, or portions thereof, may expel or block debris or other materials from the containment area 290.

[0271] It should be understood that the film or thin film 220 or interposer 120a having one or more containment structures 280 may be used in applications devoid of electrically conductive elements 140 such as shown in Figs. 50 and 59.

[0272] In some implementations, one or more power cables / devices 93, or portions thereof, may be used with the film or thin film 120, 220, 320 or interposer 120a. Powered devices (e.g. cables, connectors, etc.), or portions thereof, may be supplied with power through one or more conductive portions 140 (e.g. compressible, noncompressible, compression interface, conductive elastomer), alone or in combination with nonconductive portion(s) 130 (e.g. compressible,noncompressible, elastomer) The cable 90 or power cable 93, or portions thereof, may be compressed, engaged, and / or positioned with the one or more conductive portions 140 and / or interposer(s) 120a / film(s)120, or portions thereof. As shown in Fig. 81, the conductive portions 140 (e.g. elastomer) of the film 120 / interposer may be compressed between the conductor(s) 93a and the board 50. Power through the conductive elastomer or portion(s) 140 may give greater cross-sectional area, may lower inductance and may lower contact resistance, one or more of which can help generate less unwanted heat.

[0273] In some implementations as shown in the Figures, the interposer 120a, film, or thin film(s) 120, 220, 320, or portions thereof, (e.g. compressible, noncompressible, conductive, nonconductive) may be a used in mating applications, mounting applications, or both. The interposer 120a, film, or thin film(s) 120, 220, 320, or portions thereof, may include one or more conductive layers / portions / members 140 and be in a variety of compression applications (e.g. mating, mounting). The film 120 may not include any nonconductive portions / layers in some embodiments as shown in Figs. 82-88. For example, as shown in the one embodiment in Figs. 82-87, the conductive interposer 120a or film 120 (e.g. compressible, conductive elastomer) may be used in edge card applications. The conductive interposer 120a and / or film 120 may be in communication electrically, physically, or both between the edge card 3 (e.g. top metal, differential pairs, grounds, single ended pins), or portions thereof, and the connector 270 (e.g. PCle, one or more sides, inner periphery, contacts, shield, ground contact, signal contact, molds), or portions thereof. One or more interposer films 120 and / or conductive portions 140 may be on one or more sides (e.g. first side, opposing second side opposite the first side) of the edge card 3. The interposer film(s) 120 may be positioned on both sides of the edge card 3 (e.g. parallel, vertical, perpendicular to the board) when engaged with the connector 270 (e.g. female,card edge connector). An interposer film(s) 120 (e.g. first, second) may be positioned on opposing sides of the inner periphery of the connector. A first interposer film / portions 140 and an opposing second interposer film / portions 140 may be spaced from each other on the opposing sides of the inner periphery / receptacle of the connector 270.

[0274] In some implementations, an edge card connector can include an elastomeric interface instead of a more traditional stamped and formed conductor interface. Stated another way, repeatedly compressible elastomeric material can take the place of deflectable electrical conductors or electrical contacts or electrical beams, such as cantilevered conductors or contacts or beams.The use of an elastomeric interface, such as the interposer film 120 or a variant thereof, can help reduce unwanted stub length and can more fully shield each respective differential signal pair or each single ended signal conductor carried by the vertical or right-angled card edge connector. As shown in Fig. 82, for example, he interposer film 120 may include a plurality of conductive segments / portions / members 140 (e.g. compressible) positioned in one or more planes. For example as shown in the one embodiment in Figs. 82-88B, at least one interposer film 120 includes a plurality of conductive portions 140 (e.g. repeatab ly compressible) spaced from each other in a single plane. Each conductive portion 140 of one or more films 120 or interposer 120a may correspond to a respective one or more of contacts 270a (e.g. row, one, two, two or more, ground 270aa (e.g. one, two, two or more), signal 270ab (e.g. one, two, two or more)) and / or shield portions 270c (e.g. one, two, two or more) of the connector 270. As shown, one conductive portion 140 may correspond to one or more grounds 270aa / contacts 270a (e.g. single, double). The conductive portion 140 may correspond or engage to one or more grounds 270aa and / or shields 270c, or portions thereof. The conductive portion 140 may correspond or engage to a corresponding signal contact 270ab, or portions thereof. The conductive portion 140(e.g. proximal end, planar surface) may be connected to the housing / shield 270c (e.g. halves, metal) of the connector 270 at one or more positions / portions / surfaces of the conductive member. As shown in the one embodiment in Fig. 83, a single conductive elastomer 140, 140b may physically touch, may be electrically connected to, or both two respective adjacent grounds, a portion of the length of a shield 270c, and distally engage the shield 270c at one end of the conductive elastomer 140. Another conductor portion 140, 140a (e.g. single) may connect or engage a signal contact 270ab. The plurality of and / or adjacent conductive portions 140 may be substantially parallel to each other in a plane. Each conductive portion may be of different shapes and sizes, although similar size and shape is contemplated. At least two adjacent conductive portions (e.g. 140a and 140b) may include different lengths in some embodiments.In various embodiments, adjacent conductive portions (e.g. 140a, 140b) may be similar in lengths. A single conductive portion of the interposer / film may physically touch, be electrically connected to, or both a respective single contact of the connector. A single conductive portion may engage or be compressed against at least two contacts of the connector. Although ground conductors 140b are shown as separated, spaced from each other, or individual members, it should be understood that the adjacent or a plurality of ground conductors 140b may be connected or combined (e.g. printed together, interconnected at one end).

[0275] In some implementations as shown in Figs. 82-88B, the interposer 120a and / or film 120 (e.g. compressible, conductive), or portions thereof, may be an electrically conductive elastomer.The conductive elastomer or interposer, or portions thereof, may be compressed during and / or after assembly of one or more components. The conductive elastomer may be made of one or more materials, such as but is not limited to silver nano wire / particles. As shown in Figs. 83, 84, and 86, the conductive portion or elastomer 140 may be uncompressed when the edge card 3 isnot engaged, or deployed from the connector 270. Stated alternatively, the conductive portion or elastomer 140 has a first thickness when uncompressed. As shown in Figs. 82 and 85, the conductive portion or elastomer 140 may be compressed, such in a direction perpendicular to an insertion direction of the edge card 3, when the edge card 3 is engaged, or stowed, or mated with with the connector 270. Stated alternatively, the conductive portion may have a second thickness when compressed, wherein the second thickness may be less than the first / uncompressed thickness. The edge card 3 and / or contacts of the edge card may compress the conductive portion 140 when engaged. In the embodiment shown, the contacts 270a of the connector 270 can each be in a fixed position, may not contain a spring / cantilever, are not biased, and / or do not include a biasing or separate biasing mechanism. Instead, corresponding contacts or pads of the edge card 3 and / or portions of a mating connector compress respective conductive portions 140 that are physically attached, electrically connected to, or both to a respective contact or contacts 270a (e.g. ground 270aa, signal 270ab) and / or shield 270c. The conductive portion 140 may be biased towards a card slot configured to receive the edge card 3 and / or away from the contact(s) 270a (e.g. fixed position). With being biased towards the stowed structure (e.g. edge card), the biased conductive portion(s) retains the edge card 3 in the stowed and / or engaged position. With the conductive portion 140 being spring or biased, the conductive portion 140 returns to a rest position having the larger / first / uncompressed thickness (Fig. 84) than the smaller / compressed / second thickness (Fig. 85) when the edge card or structure is removed / deployed from contact therewith. Stated another way, the conductive portion 140 and / or the interposer 120a and / or film 120 can be configured to frictionally hold the edge card 3 in the connector 270. The edge card 3 can be repeatedly inserted and removed from the connector 270. The edge card 3 can be configured to have no movable and / or no deflectableelectrical conductors or contacts in a mating interface area of the electrical connector 270, only respective compressible conductive portions 140.

[0276] Use of the compressive elastomer(s) may remove or reduce stub impact. Typical spring loaded or cantilevered contacts of a connector may have a point contact creating stub impact by leaving portion of edge card 3 conductors or pads exposed to air. As shown generally in Fig. 83, film / conductive portions 120, 140 can be sized and shaped to touch or cover or electrically connect to or extend along eighty or ninety or ninety- five or one hundred percent of the surface area of a corresponding edge card 3 contact or pad, virtually eliminating any exposed stub length. The one embodiment of the film / conductive portions 120, 140 shown in Figs. 82-88, may increase the surface contact / conductivity with the fixed contact 270a and / or may increase physical contact between the film / conductive portions 120, 140 and a corresponding edge card 3 contact or trace or pad by more than one or two points contact or physical points of contact. The surface contact / compression between the film and card contact or trace or pad may progressively increase (e.g. in length) when inserting the edge card against the conductive portion / elastomer. In some embodiments, use of the compressive film, or portions thereof, and / or conductive elastomer may fully shield a signal conductor or differential signal pair, may reduce crosstalk, and / or may improve single-ended or differential signal impedance.

[0277] In some implementations, the one or more conductive portions and / or elastomers 140 (e.g. compressible) may be printed directly against one or more contacts / structure / connectors / boards, or portions thereof. The one or more conductive portions and / or elastomers 60, 120, 120a, 140, 260 may be printed directly adjacent to a mating interface of an electrical connector 270, such as a card edge connector, directly adjacent to a mounting interface of the electrical connector 270, such as a mezzanine connector, a vertical connector, a card edge connector, a right-angleconnector, etc., or both. As shown in Figs. 82, 87D, and 88B, the mating conductive elastomer(s) 60 and / or mounting conductive elastomer(s) 260 may be printed onto the desired structure, such as connector 270. As shown in the one embodiment in Figs. 87A-87E, a process of assembling the connector 270 with one or more conductive connectors / elastomers 140 and / or interposers 120a may include a variety of methods. One embodiment of making the conductive elastomer / interposer may be printing. For example, one or more contacts 270a of the connector 270 may be stamped or formed or both as shown in Fig. 87A. In some embodiments as shown in Fig. 87B, the contacts 270a may be inserted into a mold 270b or insert molded or printed. In some embodiments as shown in Fig. 87C, the mold 270b and / or contacts 270a (e.g. wafer(s)) may be inserted into one or more shield(s) / housings (e.g. metal, half). As shown in Fig. 87D, one or more conductive elastomer / portion(s) 140, film(s) 120, and / or interposer(s) 120a (e.g. compressible members, first) may be printed into and / or on one or more contacts 270a, shield portions 270c, and / or mold portions 270b (e.g. surfaces), or portions thereof. The mold 270b, shield 270c, and / or printed elastomer 140, or portions thereof, may fix the contacts 270a into a fixed position or nonmoving position within the connector 270. Subsequently, as shown in Fig. Fig. 87E, two halves or assembled shields 270c, if used, containing the contacts 270a, mold 270b, and conductive elastomer(s) 140 are combined to form the connector. Alternatively, a single housing / shield may be used in some embodiments. As shown in Figs. 82, 84, 88A, and 88B, a second or additional conductive elastomer elastomer / portion(s) 140, film(s) 120, and / or interposer 120a (e.g. compressible members, second) may be printed / positioned on the connector 270 (e.g. bottom, surface opposite the receptacle, J-lead, mounting interface 260). The second conductive elastomer may be compressed between the conductor 270 and the host substrate 50 (e.g. PCB, board) for a compression mount. Alternatively, the film 120 and / orinterposer 120a can have non-compressive, conductive elastomer and a connector with a mounting interface can have compressive, electrically conductive conductors that are configured to mate with respective ones of the non-compressive, conductive elastomers. Film 120 and / or interposer 120a can include both at least one signal electrically conductive elastomer / portion 140 and at least one ground or reference electrically conductive elastomer / portion 140. The at least one signal electrically conductive elastomer / portion 140 and at least one ground or reference electrically conductive elastomer / portion 140 can each be configured to physically touch or be compressed over corresponding pads on a host substrate. Film 120 and / or interposer 120a can be configured to electrically isolate immediately adjacent single-ended or differential signal conductors in a mounting interface 260 region of the electrical connector 270.

[0278] Figs. 89-92 generally show one way that a film 120 having respective electrically conductive elastomer / portions 140 can be used to electrically connect a chip or die or ASIC on one side of a host substrate 50 with electrical connectors, such as cable connectors, positioned on an opposed or opposite side of the host substrate 50. In some implementations, a mounting interface 260 between the one or more connectors 30 and host substrate / board 50 may include one or more films 120, 220, 320 and / or interposer 120a having one or more compressible members / portions / conductors 140 (e.g. 140a, 140b). The one or more compressible members may be conductive and / or nonconductive. As shown in Figs. 89-92, the films 120 / interposer 120a may be positioned on the bottom side of the PCB or host substrate 50 and the die or die package 250 (e.g. with heat sink) may be positioned on the top side of the PCB or host substrate50. The PCB or host substrate 50 on the bottom side may be directly opposite from the die or die package 250 (e.g. with heat sink) on the top side. As shown in Figs. 89-92, one film / interposer 120a, or portions thereof, may be positioned / compressed by the metalbody / housing / bracket / backing plate 380 between cable organizer 80 and host substrate 50.Further, another film / interposer 120, 120a, or portions thereof, if used may be positioned / compressed between the die package 250 and host substrate 50. The housing 380 may position the cable organizer 80 (e.g. wafers 188) and / or strain relief 81 relative to the film / interposer. Apertures 381, adjacent the cable organizer 80, within or defined by the metal body / housing / bracket / backing plate 380 may position / receive / guide the cable ends 90, or portions thereof, into compression with the film / interposer, or portions thereof. As shown in the one embodiment, apertures 381 may be countersunk on the side opposite the film / interposer.

[0279] In some implementations, the cable organizer 80 may include a plurality of wafers / segments 188. As shown in Figs. 89-93, the one or more wafers 188 may define one or more channels 189 to guide the cables 90 in one or more orientations relative to the host substrate 50 and / or film / interposer. One embodiment of a vertical orientation of one or more cables 90 in one or more wafers 188 or cable organizer 80 is shown in Fig. 95. One embodiment of a right-angle orientation of one or more cables 90 in one or more wafers 188 or cable organizer 80 is shown in Figs. 89-94C. Another embodiment of an angled orientation (e.g. 30 degrees) of one or more cables in one or more wafers 188 or cable organizer 80 is shown in Fig. 96. Two or more adjacent wafers 188 may define the channel(s) 189 for a cable 90, although it should be understood that a single wafer or block may define one or more channels 189. The one or more channels 189 may be arcuate, linear, and / or angled relative to the wafer(s) 188, organizer 80, and / or film(s), or portions thereof.

[0280] In some implementations, one or more wafer locking mechanisms 187 may be used in the compression / mounting interface and / or to lock the position between a plurality of wafers 188.In the one embodiment shown in Figs. 89-93, the wafer locking mechanism 187 may be one ormore elongated members 187a. The one or more elongated members, if used, may be recessed within a notch 188a of each wafer 188. Two or more elongated members 187a may be used in some embodiments. For example, one elongated member may be positioned along the top side of the cable organizer 80 or wafers 188 and another elongated member along a side of the cable organizer 80 or wafers 188.

[0281] In some implementations, one or more housing locking mechanisms 186 may be used to lock the position between the wafer(s) 188 and / or cable organizer 80 with the housing 380. In the one embodiment shown in Figs. 89-93, the housing locking mechanism 186 may be one or more elongated members 186a (e.g. pin). The housing locking mechanism locks the one or more wafers 188 to the housing 380. The one or more elongated members 186a, if used, may extend through apertures 188b within each wafer 188 and engage the housing 380 (e.g. apertures 382) at opposing ends.

[0282] In some implementations, a method of assembling the cable organizer 80 may include connecting a plurality of wafers / segments 188. The one or more cables 90 may be inserted into the one or more channels 189 of one or more wafers 188. In the one embodiment shown in Figs. 89-93, a first wafer 188 may define a first portion of the channel 189. With one or more cables 90 laterally inserted in the first channel portion, the adjacent / second wafer 188 may be assembled with the first wafer 188 to define another / remaining portion of the channel 189. The process is repeated to create the cable organizer 80 having a plurality wafers 188, channels 189, and / or cables 90. Although the cables are shown to be inserted laterally into the channels, it should be understood that one or more cables may be inserted axially / longitudinally in the channels in some embodiments.

[0283] Switching now to Figs. 94A-94C, one or more cables 90 may be processed to be inserted into the cable organizer 80, channel 189, and / or wafer(s) 188. In some embodiments as shown in Fig. 94C when the cable organizer (e.g. wafer(s)) is made of a plastic or polymer material, the cable 90 (e.g. twin axial, coax, etc.) may include the foil cable shield within the channel (e.g. arcuate, large radius, bending). In various embodiments as shown in Fig. 94A when the cable organizer (e.g. wafer(s)) is made of a plastic or polymer material, the cable 90 (e.g. twin axial, coax, etc.) may include the foil surrounded by a conductive elastomer / portion 140 (e.g. sleeve) or film 120 within the channel (e.g. arcuate, bending). In some embodiments as shown in Fig. 94B, when the cable organizer (e.g. wafer(s)) may be of a metal material, or plated metal polymer block, the cable 90 (e.g. twin axial, coax, etc.) may not include the foil within the channel (e.g. arcuate, bending). In some embodiments when the foil is removed adjacent the cable organizer 80, a conductive elastomer / portion 140 (e.g. sleeve) or film 120 may be used in some embodiments. In partial summary, Figs. 94A and 94C respectively show signal conductors electrically shielded by electrically conductive elastomer / portion 140 or a wrapped cable shield. The corresponding cable organizers 80 can be made from an electrically non- conductive material. In contrast, the Fig. 94B embodiment has the cable shield removed, so the cable organizer can be made from an electrically conductive material, such as die cast or metallized plastic.

[0284] In some embodiments, a film may include one or more containment structures defining one or more containment volumes. In various embodiments, the film may include one or more conductive layers. In some embodiments, one or more containment volumes may include the one or more conductive layers. In some embodiments, the film may include one or more nonconductive layers. In various embodiments, the one or more containment structures mayinclude one or more walls. In some embodiments, a single wall of one or more walls may define one or more containment volumes. In various embodiments, a plurality of walls of one or more walls may define the one or more containment volumes. In some embodiments, one or more walls may be cylindrical. In various embodiments, one or more containment volumes may include an axial volume. In some embodiments, one or more containment volumes may include a radial volume. In various embodiments, one or more containment structures may be positioned on one or more sides of the film.

[0285] In some embodiments, a method of film containment may include providing one or more nonconductive layers. In various embodiments, the method may include forming one or more containment structures to the nonconductive layer. In some embodiments, the method may include surrounding one or more conductors with one or more containment structures.

[0286] In some embodiments, a film may include a means for containing debris within one or more containment volumes.

[0287] In some embodiments, a film may include a means for positioning one or more materials within one or more containment volumes.

[0288] In some embodiments, a film may include one or more conductors. In various embodiments, the film may include one or more containment structures circumscribing one or more conductors. In some embodiments, one or more conductors may be a ground conductor. In various embodiments, one or more conductors may be a signal conductor. In some embodiments, the one or more containment structures may be one or more walls. In various embodiments, one or more walls may project axially beyond an axial extent of the one or more conductors. In some embodiments, the one or more walls may not project axially beyond an axial extent of the one or more conductors. In various embodiments, the one or more walls may be adjacent an outerperiphery and / or an inner periphery of the one or more conductors. In some embodiments, one or more walls may be radially spaced from the one or more conductors. In various embodiments, one or more walls may be positioned directly against the one or more conductors. In some embodiments, the one or more containment structures may be positioned between two of the one or more conductors.

[0289] In some embodiments, a film may include a compressible electrically nonconductive layer that carries a plurality of distinct, pre-determined, spaced apart, electrically isolated coaxial or twin axial signal transmission paths that each extend through the compressible electrically nonconductive layer, wherein each of the coaxial or twin axial signal transmission paths each include at least one electrically conductive signal connector and at least one reference or ground connector that surrounds or at least partially surrounds at least one electrically conductive signal connector.

[0290] In addition, in some embodiments, the compressible electrically nonconductive layer may surround at least one electrically conductive signal connector. In various embodiments, at least one electrically conductive signal connector may extend or only extends vertically or perpendicularly to both one side of the film and a second side of the film. In some embodiments, at least one reference or ground connector may extend or only extends vertically or perpendicularly to both one side of the film and a second side of the film. In various embodiments, at least one electrically conductive signal connector may be configured to physically contact or physically contacts a mating electrical conductor, such as an exposed electrically conductive cable conductor of a mating electrical connector assembly.

[0291] In some embodiments, an electrical connector assembly may include a connector mounting end that defines a plurality of discrete, spaced apart, electrically isolated coaxial or twin axial cables,wherein each of the plurality of discrete, spaced apart, electrically isolated coaxial or twin axial cables do not terminate in a solder mass and do not physically contact a corresponding pad on a printed circuit board.

[0292] In some embodiments, an electrical connector assembly may include a connector mounting end that defines a plurality of discrete, spaced apart, electrically isolated coaxial or twin axial cables arranged in a pre-determined pattern and film that contains the same pre-determined pattern as the connector mounting end of the electrical connector assembly.

[0293] In some embodiments, an electrical connector assembly may include a connector mounting end that defines a plurality of discrete, spaced apart, electrically isolated coaxial or twin axial cable ends arranged in a pre-determined pattern, wherein each of the plurality of discrete, spaced apart, electrically isolated twin axial cables have at least one exposed electrically conductive cable conductor that is devoid of a solder mass, a cantilevered beam and a press-fit tail.

[0294] In some embodiments, an electrical connector assembly may include a first connector having one or more fixed position contacts adjacent a mating interface to engage a second connector. In various embodiments, the assembly may include a plurality of conductive elastomer portions connected to the one or more fixed position contacts of the first connector, wherein the plurality of conductive elastomer portions is a spring positionable between an uncompressed position and a compressed position, wherein when in the compressed position the plurality of conductive elastomer portions is biased towards the uncompressed position to engage the second connector at the mating interface.

[0295] In addition, in some embodiments, the second connector may be an edge card. In various embodiments, the plurality of conductive elastomer portions may be connected to one or more ground contacts of the one or more fixed position contacts, one or more signal contacts of theone or more fixed position contacts, and / or one or more shield portions. In some embodiments, the assembly may include a compressible first film having one or more conductive connectors and / or one or more nonconductive connectors engaging the first connector to a first side of a host substrate. In various embodiments, the assembly may include a die package on a second side of the host substrate opposite the first side, and a compressible second film having one or more conductive connectors and / or one or more nonconductive connectors engaging the die package to the second side of the host substrate.

[0296] In some embodiments, an electrical connector assembly may include a means for reducing stub impact between connectors. In various embodiments, the assembly may include one or more conductive elastomer portions compressible at a mating interface between the connectors.

[0297] In some embodiments, a method of assembling one or more compressible films to a connector may include the step of providing a connector with one or more fixed position contacts. In various embodiments, the method may include printing one or more conductive elastomer portions to at least the one or more fixed position contacts.

[0298] In addition, in some embodiments, the method may include printing the one or more conductive elastomer portions to one or more portions of a shield. In various embodiments, printing one or more conductive elastomer portions to the one or more fixed position contacts may include printing on one or more portions of a mold.

[0299] In some embodiments, a mating interface may include a first film and a second film on opposing sides of a host substrate. In various embodiments, the mating interface may include at least one of the first film and the second film may include one or more compressible portions, wherein the one or more compressible portions include at least one of a conductive portion and / or a nonconductive portion. In some embodiments, the one or more compressible portions may bean elastomer. In various embodiments, the mating interface may include a cable organizer having a plurality of wafers defining a plurality of channels, wherein the plurality of channels may be configured to position one or more cables in compression with the one or more compressible portions. In some embodiments, the mating interface may include a housing positioning the cable organizer and one or more housing lock mechanism locking the plurality of wafers to the housing. In various embodiments, the housing may include a plurality of apertures configured to compress ends of the one or more cables in compression with the one or more compressible portions.

[0300] In some embodiments, an electrical connector assembly may include a connector mounting end that defines a power cable that does not terminate in a solder mass and does not physically contact a corresponding pad on a printed circuit board.

[0301] In some embodiments, a film may include an electrically non-conductive portion that has a first side and an opposed second side. In various embodiments, the film may include at least one first elastomeric conductive portion that extends beyond a first major surface of the first side of the electrically non-conductive portion and at least one second elastomeric conductive portion that extends beyond a second major surface of the opposed second side of the electrically non- conductive portion, wherein both the first elastomeric conductive portion and the second elastomeric conductive portion each respectively define at least one signal conductor at least partially circumscribed by a respective ground conductor and a line oriented perpendicular to both the first side and the opposed side of the electrically non-conductive portion passes through a respective center of the at least one signal conductor.

[0302] In addition, in some embodiments, an electrical connector having a mounting interface, further comprising a film positioned adjacent to the mounting interface. In some embodiments, the filmmay include an electrically non-conductive portion that has a first side and an opposed second side. In various embodiments, the film may include at least one first elastomeric conductive portion that extends beyond a first major surface of the first side of the electrically non- conductive portion and at least one second elastomeric conductive portion that extends beyond a second major surface of the opposed second side of the electrically non-conductive portion. In some embodiments, both the first elastomeric conductive portion and the second elastomeric conductive portion each respectively may define at least one signal conductor at least partially circumscribed by a respective ground conductor and a line oriented perpendicular to both the first side and the opposed side of the electrically non-conductive portion passes through a respective center of at least one signal conductor.

[0303] In some embodiments, a connector may include a housing that defines a mating interface and a mounting interface, at least one of the mating interface and the mounting interface including a film having compressible or non-compressible, shielded, coaxial or twin axial signal transmission lines.

[0304] In some embodiments, the electrical connector may include a film, wherein the film includes a nonconductive portion defining one or more through apertures and one or more conductive portions received within the one or more through apertures configured to be continuously conductive through the film, the film positioned adjacent or on at least one of the mating side of the electrical connector or the mounting side of the electrical connector. In various embodiments, the plurality of electrical connectors transmit signals at approximately 60GHz with no more than approximately -45dB of FEXT.

[0305] In some embodiments, an electrical connector may include a mounting end of a first part and / or a mating end of the first part configured to mate with or can include a respective film or thinfilm made from a plastic, polymer, ceramic, printed polymer, dielectric or other electrically non- conductive material. In various embodiments, the electrical connector may include a plurality of cables. In some embodiments, the electrical connector may include a plurality of plates that are interconnected and define a plurality of cavities therein. In various embodiments, the plurality of plates define a row of cavities. In some embodiments, the plurality of plates extend for about 90 percent of the length of the electrical connector to a substrate. In various embodiments, the electrical connector may include a substrate and a ground contact element positioning the plurality of plates at a distance from the substrate. In some embodiments, the electrical connector may include a die package substrate that is no larger than approximately 75mm by 75mm to approximately 85mm to 85mm, and approximately 224Gbps Pam4 signals at approximately 56GHz to approximately 70GHz of bandwidth pass through the respective film with no more than approximately -40dB of FEXT (far end crosstalk) or with no more than approximately -50dB of NEXT (near end crosstalk). In some embodiments, the plurality of electrical connectors transmit signals at approximately 60GHz through the respective film with no more than approximately -45dB of FEXT. In various embodiments, the plurality of electrical connectors transmit signals through the respective film at approximately 50GHz with no more than approximately -45dB of NEXT.

[0306] In some embodiments, an electrical connector configured to be attached to a die package may include a housing having a mating side and a mounting side. In some embodiments, the electrical connector may include differential signal pairs. In various embodiments, the electrical connector may include a film. In some embodiments, the film having a nonconductive portion defining one or more through apertures and one or more conductive portions received within the one or more through apertures configured to be continuously conductive through the film, thefilm positioned adjacent or on at least one of the mating side of the electrical connector or the mounting side of the electrical connector and the respective ones of the one or more conductive portions are physically connected, electrically connected, or both to a respective signal conductor of a respective differential pair. In some embodiments, the electrical connector may have a density of at least 256 differential signal pairs per square inch and transmits approximately 224Gbps Pam4 signals with no more than approximately -40dB of crosstalk.

[0307] In some embodiments, an electrical connector may include a mating interface. In various embodiments, the electrical connector may include a plug connector having at least one ground contact element configured to mate with the mating interface. In some embodiments, the electrical connector may include a film having a nonconductive portion defining one or more through apertures and one or more conductive portions received within the one or more through apertures configured to be continuously conductive through the film, the film configured to be positioned between the mating interface and the plug connector.

[0308] In some embodiments, an electrical connector may include at least one of a mating interface, a plug connector, and / or a cable connector. In various embodiments, the electrical connector may include a film having a nonconductive portion defining one or more through apertures and one or more conductive portions received within the one or more through apertures configured to be continuously conductive through the film. In some embodiments, the electrical connector may include a 224 Gbps Pam4 signal at 6ps with 20%-80% rise time.

[0309] In some embodiments, an electrical connector may include an outer periphery. In various embodiments, the electrical connector may include a mating interface. In some embodiments, the electrical connector may include a locking mechanism positioned within the outer periphery of the electrical connector. In some embodiments, the electrical connector may include a filmhaving a nonconductive portion defining one or more through apertures and one or more conductive portions received within the one or more through apertures configured to be continuously conductive through the film, the film configured to be positioned at the mating interface. In some embodiments, the electrical connector may include a plug connector, wherein the locking mechanism may be positioned within an outer periphery of at least one of the mating interface and / or the plug connector.

[0310] In some embodiments, an electrical connector may include a plurality of differential signal pairs. In various embodiments, the electrical connector may include a film having a nonconductive portion defining one or more through apertures and one or more conductive portions received within the one or more through apertures configured to be continuously conductive through the film, the conductive portions each respectfully in physical contact, electrical contact, or both with a respective, individual electrical conductor of the plurality of differential signal pairs, wherein the electrical connector is devoid of egg-crate crosstalk shielding, is sized and shaped such that a plurality of electrical connectors each respectively fit on a single side of a die package substrate with sides no larger than approximately 75 -96mm each, including approximately 80mm±5mm and 91mm±5mm, the plurality of electrical connectors collectively carry at least 1024 differential signal pairs, and the plurality of electrical connectors transmit approximately 224Gbits / sec PAM-4 signals at approximately 56GHz to approximately 70GHz of bandwidth with no more than approximately -40dB of FEXT. In various embodiments, the electrical connector may be devoid of cantilevered beams.

[0311] While several embodiments have been described and illustrated herein, those of ordinary skill in the art will readily envision a variety of other means and / or structures for performing the function and / or obtaining the results and / or one or more of the advantages described herein, andeach of such variations and / or modifications is deemed to be within the scope of the embodiments described herein. More generally, those skilled in the art will readily appreciate that all parameters, dimensions, materials, and configurations described herein are meant to be exemplary and that the actual parameters, dimensions, materials, and / or configurations will depend upon the specific application or applications for which the teachings is / are used. Those skilled in the art will recognize, or be able to ascertain using no more than routine experimentation, many equivalents to the specific embodiments described herein. It is, therefore, to be understood that the foregoing embodiments are presented by way of example only and that, within the scope of the appended claims and equivalents thereto, embodiments may be practiced otherwise than as specifically described and claimed. Embodiments of the present disclosure are directed to each individual feature, system, article, material, and / or method described herein. In addition, any combination of two or more such features, systems, articles, materials, and / or methods, if such features, systems, articles, materials, and / or methods are not mutually inconsistent, is included within the scope of the present disclosure.[00312JA11 definitions, as defined and used herein, should be understood to control over dictionary definitions, definitions in documents incorporated by reference, and / or ordinary meanings of the defined terms.

[0313] The indefinite articles “a” and “an,” as used herein in the specification and in the claims, unless clearly indicated to the contrary, should be understood to mean “at least one.”

[0314] The phrase “and / or,” as used herein in the specification and in the claims, should be understood to mean “either or both” of the elements so conjoined, i.e., elements that are conjunctively present in some cases and disjunctively present in other cases. Multiple elements listed with“and / or” should be construed in the same fashion, i.e., “one or more” of the elements soconjoined. Other elements may optionally be present other than the elements specifically identified by the “and / or” clause, whether related or unrelated to those elements specifically identified. Thus, as a non-limiting example, a reference to “A and / or B”, when used in conjunction with open-ended language such as “comprising” can refer, in one embodiment, to A only (optionally including elements other than B); in another embodiment, to B only (optionally including elements other than A); in yet another embodiment, to both A and B (optionally including other elements); etc.

[0315] As used herein in the specification and in the claims, “or” should be understood to have the same meaning as “and / or” as defined above. For example, when separating items in a list, “or” or “and / or” shall be interpreted as being inclusive, i.e., the inclusion of at least one, but also including more than one, of a number or list of elements, and, optionally, additional unlisted items. Only terms clearly indicated to the contrary, such as “only one of’ or “exactly one of,” or, when used in the claims, “consisting of,” will refer to the inclusion of exactly one element of a number or list of elements. In general, the term “or” as used herein shall only be interpreted as indicating exclusive alternatives (i.e. “one or the other but not both”) when preceded by terms of exclusivity, such as “either,” “one of,” “only one of,” or “exactly one of.” “Consisting essentially of,” when used in the claims, shall have its ordinary meaning as used in the field of patent law.

[0316] As used herein in the specification and in the claims, the phrase “at least one,” in reference to a list of one or more elements, should be understood to mean at least one element selected from any one or more of the elements in the list of elements, but not necessarily including at least one of each and every element specifically listed within the list of elements and not excluding any combinations of elements in the list of elements. This definition also allows that elements mayoptionally be present other than the elements specifically identified within the list of elements to which the phrase “at least one” refers, whether related or unrelated to those elements specifically identified. Thus, as a non-limiting example, “at least one of A and B” (or, equivalently, “at least one of A or B,” or, equivalently “at least one of A and / or B”) can refer, in one embodiment, to at least one, optionally including more than one, A, with no B present (and optionally including elements other than B); in another embodiment, to at least one, optionally including more than one, B, with no A present (and optionally including elements other than A); in yet another embodiment, to at least one, optionally including more than one, A, and at least one, optionally including more than one, B (and optionally including other elements); etc.

[0317] It should also be understood that, unless clearly indicated to the contrary, in any methods claimed herein that include more than one step or act, the order of the steps or acts of the method is not necessarily limited to the order in which the steps or acts of the method are recited.

[0318] In the claims, as well as in the specification above, all transitional phrases such as “comprising,” “including,” “carrying,” “having,” “containing,” “involving,” “holding,” “composed of,” and the like are to be understood to be open-ended, i.e., to mean including but not limited to. Only the transitional phrases “consisting of’ and “consisting essentially of’ shall be closed or semi-closed transitional phrases, respectively, as set forth in the United States Patent Office Manual of Patent Examining Procedures, Section 2111.03.

[0319] It is to be understood that the embodiments are not limited in its application to the details of construction and the arrangement of components set forth in the description or illustrated in the drawings. The invention is capable of other embodiments and of being practiced or of being carried out in various ways. Unless limited otherwise, the terms “connected,” “coupled,” “in communication with,” and “mounted,” and variations thereof herein are used broadly andencompass direct and indirect connections, couplings, and mountings. In addition, the terms “connected” and “coupled” and variations thereof are not restricted to physical or mechanical connections or couplings.

[0320] The foregoing description of several embodiments of the invention has been presented for purposes of illustration. It is not intended to be exhaustive or to limit the invention to the precise steps and / or forms disclosed, and obviously many modifications and variations are possible in light of the above teaching.

Claims

CLAIMS1. An electrical connector comprising: a film; and wherein the film having a nonconductive portion defining one or more through apertures and one or more conductive portions received within the one or more through apertures configured to be continuously conductive through the film.

2. The electrical connector of claim 1 wherein the one or more conductive portions include at least one circumscribed signal connector.

3. The electrical connector of claim 1 or 2 wherein the one or more conductive portions include at least two circumscribed signal connectors.

4. The electrical connector of any one of claims 1-3 wherein the one or more conductive portions extend above and below opposing surfaces of the nonconductive portion.

5. The electrical connector of any one of claims 1-4 wherein the one or more conductive portions includes one or more flanges extending away from the through apertures.

6. The electrical connector of any one of claims 1-5 wherein the nonconductive portion and the one or more conductive portions do not compress together.

7. The electrical connector of any one of claims 1-6 wherein the nonconductive portion is electrically nonconductive, thermally nonconductive, or both electrically and thermally nonconductive.

8. The electrical connector of any one of claims 1-7 wherein the one or more conductive portions include one or more ground connectors surrounding one or more signal connectors.

9. The electrical connector of any one of claims 1-8 wherein at least one of the one or more conductive portions is connected to a plurality of the one or more through apertures.

10. The electrical connector of any one of claims 1-9 wherein at least one of the one or more conductive portions is connected to a single aperture of the one or more through apertures.

11. The electrical connector of any one of claims 1-10 wherein the one or more conductive portions includes an inner periphery and an outer periphery.

12. The electrical connector of any one of claims 1-11 wherein the inner periphery and the outer periphery is continuous.

13. The electrical connector of any one of claims 1-12 wherein the one or more conductive portions includes a signal connector split.

14. The electrical connector of any one of claims 1-13 wherein the film connects a first cable to a second cable.

15. The electrical connector of any one of claims 1-14 wherein the film connects a first board to a second board.

16. The electrical connector of any one of claims 1-15 wherein the film connects a cable to a board.

17. The electrical connector of any one of claims 1-16 wherein the one or more conductive portions are dissimilar in shape to one or more signal pins and / or grounds.

18. A film comprising: one or more conductive layers coupled to one or more apertures of a nonconductive layer.

19. A film configured to be attached to a die package comprising: at least a density of 256 differential pairs per square inch.

20. An electrical connector comprising: at least one of a mating interface, a plug connector, a film, and / or a cable connector; and a 224 Gbps Pam4 signal at 6ps with 20%-80% rise time.

21. An electrical connector comprising: a film having a plurality of conductive portions extending through one or more apertures of a nonconductive portion; and at least one of mating interface, a plug connector, and / or a cable connector.

22. A film comprising: a nonconductive layer having a plurality of apertures extending from a top surface to a bottom surface; a conductive member extending through one or more of the plurality of apertures from at least the top surface to at least the bottom surface.

23. The film of claim 22 wherein the conductive member extends from above the top surface to below the bottom surface.

24. The film of claims 22 and / or 23 wherein the conductive member includes one or more flanges.

25. The film of claim 24 wherein the one or more flanges extends outwardly along the top surface and / or bottom surface in one or more directions.

26. The film of any one of claims 22-25 wherein the conductive member includes one or more ground members and one or more signal members spaced inwardly relative to the ground members.

27. The film of any one of claims 22-26 wherein the conductive member is received within one of the plurality of apertures.

28. The film of any one of claims 22-26 wherein the conductive member is received within a plurality of the apertures.

29. The film of any one of claims 22-28 wherein the conductive member includes a plurality of conductive members.

30. The film of any one of claims 22-29 wherein the conductive member is continuous from the top surface to the bottom surface.

31. The film of any one of claims 22-30 wherein the conductive member includes an inner periphery and an outer periphery proximate the top surface and / or the bottom surface.

32. The film of any one of claims 22-31 wherein the conductive member includes an outer periphery adjacent the top surface and / or the bottom surface.

33. The film of any one of claims 22-32 wherein a portion of the top surface and / or bottom surface is exposed between a signal member and ground member of a plurality of the conductive members.

34. The film of any one of claims 22-33 wherein the conductive member includes a signal member split from the top surface to the bottom surface.

35. The film of any one of claims 20-34 wherein the conductive member is arcuate.

36. A method of coupling a connector with a film comprising the steps of: providing a nonconductive layer having a plurality of apertures therethrough; forming one or more conductive layers to the nonconductive layer.

37. The method of claim 36 further comprising continuous conductivity via the one or more conductive layers through the plurality of apertures without compression.

38. The method of any one of claims 36-37 further comprising splitting a signal with the one or more conductive layers.

39. The method of any one of claims 36-38 further comprising connecting at least one cable to at least one cable with the film.

40. The method of any one of claims 36-39 further comprising connecting a cable to a board with the film.

41. The method of any one of claims 36-40 further comprising connecting a board to a board with the film.

42. The method of any one of claims 36-41 wherein forming the conductive layer includes forming flanges over a top surface and / or a bottom surface of the nonconductive layer.

43. The method of any one of claims 36-42 compressing the conductive layer and not the nonconductive layer when connecting.

44. The method of any one of claims 36-43 wherein the nonconductive layer is electrically, thermally, or both electrically and thermally nonconductive.

45. The method of any one of claims 36-44 wherein forming includes molding, printing, or squeezing a paste.

46. The method of any one of claims 36-45 further comprising reducing the downward compression force.

47. The method of any one of claims 36-46 wherein the one or more conductive layers is received within one or more apertures.

48. The method of any one of claims 36-47 wherein a single one of the one or more conductive layers is received within a single one of the one or more apertures.

49. The method of any one of claims 36-49 wherein a single one of the one or more conductive layers is received within a plurality of the one or more apertures.

50. The method of any one of claims 36-49 wherein the one or more conductive layers define at least one signal conductor circumscribed by a ground conductor.

51. The method of any one of claims 36-49 wherein the one or more conductive layers define at least two signal conductors circumscribed by a ground conductor.

52. An electrical connector comprising: a conductive receptacle defining an opening; and a nonconductive receptacle received within the opening.

53. An electrical connector comprising: a first conductive cup having a second nonconductive cup therein configured to axially receive a cylindrical pin.

54. An electrical connector comprising: an arcuate conductive wall having an inner periphery; and an arcuate nonconductive wall having an outer periphery and an inner periphery, wherein the outer periphery is adjacent the inner periphery of the arcuate conductive wall.

55. An electrical connector comprising: a substrate; andI l lone or more conductive receptacles having a hollow, electrically nonconductive receptacle therein, wherein the nonconductive receptacle is configured to receive a pin.

56. The electrical connector of claim 55 further including a pin axially received within the hollow, electrically nonconductive receptacle.

57. The electrical connector of claims 55 and / or 56 wherein the hollow, electrically nonconductive receptacle includes a bottom.

58. An electrical connector comprising: an outer conductive cylinder surrounding an inner, electrically nonconductive cylinder, wherein the inner, electrically nonconductive cylinder defines an axial opening therein configured to receive a connector.

59. An electrical connector comprising: an electrically nonconductive receptacle having an inner periphery; a connector member having an outer periphery, wherein the connector member is axially received within the electrically nonconductive receptacle; and whereby a friction force in a radial direction between the inner periphery and the outer periphery secures the connector member in the electrically nonconductive receptacle.

60. The electrical connector of claim 59 wherein the outer periphery includes a larger radius than the inner periphery.

61. The electrical connector of claims 59 and / or 60 further comprising a conductive receptacle positioning the electrically nonconductive receptacle therein.

62. The electrical connector of any one of claims 59-61 wherein an axial compression force between a distal end of the connector member and a bottom of the electrically nonconductive receptacle is less than the radial friction force.

63. The electrical connector of claim 62 wherein the axial compression force is zero.

64. An electrical connector comprising: a cylindrical connector having a nonconductive circumferential engagement with at least one signal element.

65. An electrical connector comprising: a solder free engagement with a signal element.

66. A high-speed connector comprising: a housing; and electrical cables carried by the housing, wherein the electrical cables are configured to pass signals to a substrate or to another connector through a thin film.

67. The high-speed connector of claim 66 wherein the thin film comprises electrically conductive elements.

68. The high-speed connector of claim 66 wherein the thin film is devoid of electrically conductive elements.

69. The high-speed connector of any one of claims 66-68 wherein the electrical cables carry differential signals of at least 224Gbps Pam4 signals at approximately 56GHz to approximately 70GHz of bandwidth with no more than approximately -40dB of FEXT (far end crosstalk).

70. The high-speed connector of any one of claims 66-69 wherein the electrical cables each have a respective mating end and each respective mating end is devoid of solder.

71. The high-speed connector of any one of claims 66-70 wherein the electrical cables each comprises a signal conductor, an insulator, and a shield, and each of the signal conductor, the insulator and the shield all terminate in a common plane or all form a planar mating interface.

72. An apparatus for carrying or transmitting high-speed electrical signals comprising: a connector or a first substrate; and means for passing a differential signal from the connector or the first substrate to a second substrate or to a mating electrical connector, wherein the differential signal has a data transferrate of at least 224Gbps Pam4 with no more than approximately -40dB of FEXT (far end crosstalk).

73. An apparatus for carrying or transmitting high-speed electrical signals comprising: a connector or a first substrate; and an interposer that physically mates, electrically mates or both physically and electrically mates with the connector or the first substrate and a mating connector or a second substrate, wherein the connector or the first substrate and the interposer are devoid of any one, any two, any three, any four, any five, any six, any seven, any eight, any nine, any ten, any eleven, or any twelve of: solder balls, solder charges, solder masses, FUZZ BUTTONS®, compressible conductive meshes, anisotropic conductive elastomer, formed wire, stamped and formed conductors, pogo pins, spring-loaded pins, press-fit pins, through hole pins and J-leads.

74. The apparatus of claim 73 wherein the interposer comprises coaxial signal paths, wherein the coaxial signal paths further comprise a center electrical signal conductor circumscribed, surrounded or mostly surrounded by a ground or reference conductor.

75. The apparatus of any one of claims 73 and / or 74 wherein the interposer only contains coaxial signal paths.

76. An interposer comprising a sheet of electrically insulative or dielectric material that carries at least one coaxial transmission path, the at least one coaxial transmission path comprising means for transmitting a signal through the electrically insulative or dielectric material and means for shielding the means for transmitting the signal through the electrically insulative or dielectric material.

77. An interposer comprising a sheet of electrically insulative or dielectric material and a first signal transmission path, the first signal transmission path further comprising only a single signal conductor or only a pair of signal connectors surrounded by a solid or broken reference or ground conductor, wherein the sheet of electrically insulative or dielectric material is devoid ofany one, any two, or any three, or any four or any five of the following: a ground plane, FR4 material, signal traces physically connected to vias, press-fit vias, and solder masses.

78. The interposer of claim 77 wherein the solid or broken reference or ground conductor is configured to receive or physically touch or be electrically connected to or physically touch and be electrically connected to a mating cable shield.

79. An interposer comprising a sheet of electrically insulative or dielectric material and a first signal transmission path, the first signal transmission path further comprising only a single signal conductor or only a pair of signal connectors surrounded by a solid or broken reference or ground conductor, wherein the sheet of electrically insulative or dielectric material is devoid of any one, any two, any three, any four, any five, or any six of the following: a ground plane, FR4 material, glass, signal traces physically connected to vias, press-fit vias, and solder masses.

80. A film comprising: one or more conductive layers; and one or more nonconductive layers.

81. The film of claim 80 wherein the one or more conductive layers is positioned on one or more sides of the one or more nonconductive layers.

82. The film of claim 80 wherein the one or more nonconductive layers include one or more through apertures positioning the one or more conductive layers through the film.

83. A film comprising: one or more nonconductive layers without conductive portions.

84. A method of coupling with a film comprising the steps of: providing one or more nonconductive layers; and forming one or more conductive layers to the nonconductive layer.

85. The film of claim 84 wherein the nonconductive layer includes a plurality of apertures therethrough.

86. The film of claim 84 wherein the one or more conductive layers are separated by the one or more nonconductive layers.

87. A method of coupling with a film comprising the steps of: providing a nonconductive layer without conductive portions; coupling two or more components with the nonconductive layer.

88. An electrical connector comprising: a film; wherein the film having a nonconductive portion defining one or more through apertures and one or more conductive portions received within the one or more through apertures configured to be continuously conductive through the film; and wherein the one or more conductive portions include at least one via through the one or more through openings and one or more pads coupled to the at least one via.

89. The electrical connector of claim 88 wherein the one or more conductive portions include at least one circumscribed signal connector.

90. The electrical connector of any one of claims 88-89 wherein the one or more conductive portions include at least two circumscribed signal connectors.

91. The electrical connector of any one of claims 88-90 wherein the one or more pads are positioned above and / or below opposing surfaces of the nonconductive portion and / or the at least one via.

92. The electrical connector of any one of claims 88-91 wherein the one or more pads include opposing pads on opposing sides of the at least one via.

93. The electrical connector of claim 92 wherein the opposing pads are laterally offset on the opposing sides of the at least one via.

94. The electrical connector of claim 92 wherein the pads are not coaxially aligned.

95. The electrical connector of any one of claims 88-94 wherein the one or more conductive portions include one or more ground connectors surrounding one or more signal connectors.

96. The electrical connector of any one of claims 88-95 wherein at least one of the one or more conductive portions is connected to a plurality of the one or more through apertures.

97. The electrical connector of any one of claims 88-94 wherein at least one of the one or more conductive portions is connected to a single aperture of the one or more through apertures.

98. The electrical connector of any one of claims 88-97 wherein the film connects a first cable to one or more second cables.

99. The electrical connector of any one of claims 88-98 wherein the film connects a first board to a second board.

100. The electrical connector of any one of claims 88-99 wherein the film connects a cable to a board.

101. An electrical connector comprising: a film having a first signal connector interconnecting a first signal conductor of a first cable to a second signal conductor of a second cable; and wherein the axis of the first signal conductor of the first cable is not axially aligned with the axis of the second signal conductor of the second cable.

102. The electrical connector of claim 101 further comprising a second signal conductor of the first cable, wherein the film includes a second signal connector interconnecting the secondsignal conductor of the first cable to a third signal conductor of a third cable, and wherein the axis of the second signal connector of the first cable is not axially aligned with the axis of the third signal conductor of the third cable.

103. The electrical connector of any one of claims 101-102 wherein the first signal connector includes one or more pads positioned adjacent opposing surfaces of the film.

104. The electrical connector of claim 103 wherein the one or more pads include opposing pads on the opposing surfaces of the film, respectively, and wherein the opposing pads are not axially aligned.

105. The electrical connector of any one of claims 101-104 further comprising a housing carrying at least one of the first cable and / or second cable.

106. The electrical connector of any one of claims 101-105 further comprising one or more ground connectors at least partially surrounding the first signal connector.

107. The electrical connector of any one of claims 101-106 wherein the film includes one or more apertures receiving the first signal connector.

108. A film comprising: one or more conductive layers; one or more nonconductive layers; and wherein the one or more conductive layers includes a first conductive portion adjacent a second conductive portion, and wherein the first conductive portion narrows towards the second conductive portion.

109. The film of claim 108 wherein the one or more conductive layers is positioned on one or more sides of the one or more nonconductive layers.

110. The film of any one of claims 108-109 wherein the first conductive portion and the second conductive portion is on at least one side of the one or more sides of the one or more nonconductive layers.

111. The film of any one of claims 108-110 wherein the one or more nonconductive layers include one or more through apertures positioning the one or more conductive layers through the film.

112. An electrical connector comprising: a film; wherein the film includes a nonconductive portion and one or more conductive portions; and wherein the one or more conductive portions include at least one signal connector circumscribed by two or more adjacent ground connectors, wherein the two or more adjacent ground connectors include a first ground connector and a second ground connector, wherein at least a portion of the first ground connector tapers towards the adjacent second ground connector.

113. The electrical connector of claim 112 wherein the one or more conductive portions include at least two circumscribed signal connectors.

114. The electrical connector of any one of claims 112-113 wherein the film includes a nonconductive portion defining one or more through apertures and the one or more conductive portions are received within the one or more through apertures configured to be continuously conductive through the film.

115. The electrical connector of claim 114 wherein the first ground connector is connected to a plurality of the one or more through apertures.

116. The electrical connector of claim 114 wherein the first ground connector is connected to a single aperture of the one or more through apertures.

117. The electrical connector of any one of claims 112-116 wherein the one or more conductive portions are positioned above and / or below opposing surfaces of the nonconductive portion.

118. The electrical connector of any one of claim 112-117 wherein the two or more adjacent ground connectors include a third ground connector, and wherein the first ground connector tapers towards the adjacent third ground connector.

119. The electrical connector of any one of claim 112-118 wherein one or more ends of the first ground connector taper away from the remaining portion of the first ground connector.

120. A film comprising: a nonconductive layer; at least two adjacent ground connectors circumscribing at least one signal connector; and means for reducing impedance between the at least two adjacent ground connectors.

121. A film comprising: a nonconductive layer; a first plurality of ground connectors circumscribing at least one first signal connector; a second plurality of ground connectors circumscribing at least one second first signal connector; and wherein the first plurality of ground connectors and the second plurality of ground connectors share or have at least one common ground connector therebetween.

122. The film of claim 121 wherein the at least one common ground connector tapers to both an adjacent ground connector of the first plurality of ground connectors and an adjacent ground connector of the second plurality of ground connectors.

123. The film of any one of claims 121-122 wherein at least one ground connector of the first plurality of ground connectors tapers toward at least one adjacent ground connector of the first plurality of ground connectors.

124. The film of any one of claims 121-123 wherein at least one ground connector of the second plurality of ground connectors tapers toward at least one adjacent ground connector of the second plurality of ground connectors.

125. A film comprising: one or more containment structures defining one or more containment volumes.

126. The film of claim 125 further comprising one or more conductive layers, wherein the one or more containment volumes include the one or more conductive layers.

127. The film of any one of claims 125-126 further comprising one or more nonconductive layers.

128. The film of any one of claims 125-127 wherein the one or more containment structures include one or more walls.

129. The film of claim 128 wherein a single wall of the one or more walls defines the one or more containment volumes.

130. The film of any one of claims 128-129 wherein a plurality of walls of the one or more walls define the one or more containment volumes.

131. The film of any one of claims 128-130 wherein the one or more walls are cylindrical.

132. The film of any one of claims 125-131 wherein the one or more containment volumes include an axial volume.

133. The film of any one of claims 125-132 wherein the one or more containment volumes include a radial volume.

134. The film of any one of claims 125-133 wherein the one or more containment structures is positioned on one or more sides of the film.

135. A method of film containment comprising the steps of: providing one or more nonconductive layers; and forming one or more containment structures to the nonconductive layer.

136. The method of claim 135 further comprising surrounding one or more conductors with the one or more containment structures.

137. A film comprising: means for containing debris within one or more containment volumes.

138. A film comprising: means for positioning one or more materials within one or more containment volumes.

139. A film comprising: one or more conductors; and one or more containment structures circumscribing the one or more conductors.

140. The film of claim 139 wherein the one or more conductors is a ground conductor.

141. The film of any one of claims 139-140 wherein the one or more conductors is a signal conductor.

142. The film of any one of claims 139-141 wherein the one or more containment structures is one or more walls.

143. The film of claim 142 wherein the one or more walls project axially beyond an axial extent of the one or more conductors.

144. The film of any one of claims 142-143 wherein the one or more walls do not project axially beyond an axial extent of the one or more conductors.

145. The film of any one of claims 142-144 wherein the one or more walls are adjacent an outer periphery and / or an inner periphery of the one or more conductors.

146. The film of any one of claims 142-145 wherein the one or more walls are radially spaced from the one or more conductors.

147. The film of any one of claims 142-146 wherein the one or more walls are positioned directly against the one or more conductors.

148. The film of any one of claims 139-146 wherein the one or more containment structures is positioned between two of the one or more conductors.

149. A film comprising: a compressible electrically nonconductive layer that carries a plurality of distinct, predetermined, spaced apart, electrically isolated coaxial or twin axial signal transmission paths that each extend through the compressible electrically nonconductive layer, wherein each of the coaxial or twin axial signal transmission paths each include at least one electrically conductive signal connector and at least one reference or ground connector that surrounds or at least partially surrounds the at least one electrically conductive signal connector.

150. The film of claim 149 wherein the compressible electrically nonconductive layer surrounds the at least one electrically conductive signal connector.

151. The film of any one of claims 149 and 150 wherein the at least one electrically conductive signal connector extends or only extends vertically or perpendicularly to both one side of the film and a second side of the film.

152. The film of any one of claims 149-151 wherein the at least one reference or ground connector extends or only extends vertically or perpendicularly to both one side of the film and a second side of the film.

153. The film of any one of claims 149-152 wherein the at least one electrically conductive signal connector is configured to physically contact or physically contacts a mating electrical conductor, such as an exposed electrically conductive cable conductor of a mating electrical connector assembly.

154. An electrical connector assembly comprising: a connector mounting end that defines a plurality of discrete, spaced apart, electrically isolated coaxial or twin axial cables, wherein each of the plurality of discrete, spaced apart, electrically isolated coaxial or twin axial cables do not terminate in a solder mass and do not physically contact a corresponding pad on a printed circuit board.

155. An electrical connector assembly comprising: a connector mounting end that defines a plurality of discrete, spaced apart, electrically isolated coaxial or twin axial cables arranged in a pre-determined pattern and film that contains the same pre-determined pattern as the connector mounting end of the electrical connector assembly.

156. An electrical connector assembly comprising: a connector mounting end that defines a plurality of discrete, spaced apart, electrically isolated coaxial or twin axial cable ends arranged in a pre-determined pattern, wherein each of the plurality of discrete, spaced apart, electrically isolated twin axial cables have at least one exposed electrically conductive cable conductor that is devoid of a solder mass, a cantilevered beam and a press-fit tail.

157. An electrical connector assembly comprising: a first connector having one or more fixed position contacts adjacent a mating interface to engage a second connector; anda plurality of conductive elastomer portions connected to the one or more fixed position contacts of the first connector, wherein the plurality of conductive elastomer portions is a spring positionable between an uncompressed position and a compressed position, wherein when in the compressed position the plurality of conductive elastomer portions is biased towards the uncompressed position to engage the second connector at the mating interface.

158. The assembly of claim 156 wherein the second connector is an edge card.

159. The assembly of any one of claims 157-158 the plurality of conductive elastomer portions are connected to one or more ground contacts of the one or more fixed position contacts, one or more signal contacts of the one or more fixed position contacts, and / or one or more shield portions.

159. The assembly of any one of claims 157-158 further comprising a compressible first film having one or more conductive connectors and / or one or more nonconductive connectors engaging the first connector to a first side of a host substrate.

160. The assembly of claim 159 further comprising a die package on a second side of the host substrate opposite the first side, and a compressible second film having one or more conductive connectors and / or one or more nonconductive connectors engaging the die package to the second side of the host substrate.

161. An electrical connector assembly comprising: a means for reducing stub impact between connectors.

162. The assembly of claim 161 further comprising one or more conductive elastomer portions compressible at a mating interface between the connectors.

163. A method of assembling one or more compressible films to a connector comprising the steps of: providing a connector with one or more fixed position contacts; andprinting one or more conductive elastomer portions to at least the one or more fixed position contacts.

164. The method of claim 163 further comprising printing the one or more conductive elastomer portions to one or more portions of a shield.

165. The method of any one of claims 163 and / or 164 wherein printing one or more conductive elastomer portions to the one or more fixed position contacts includes printing on one or more portions of a mold.

166. A mating interface comprising: a first film and a second film on opposing sides of a host substrate; at least one of the first film and the second film includes one or more compressible portions, wherein the one or more compressible portions include at least one of a conductive portion and / or a nonconductive portion.

167. The mating interface of claim 166 wherein the one or more compressible portions is an elastomer.

168. The mating interface of any one of claims 166 and 167 further comprising a cable organizer having a plurality of wafers defining a plurality of channels, wherein the plurality of channels is configured to position one or more cables in compression with the one or more compressible portions.

169. The mating interface of claim 168 further includes a housing positioning the cable organizer and one or more housing lock mechanism locking the plurality of wafers to the housing.

170. The mating interface of claim 168 wherein the housing includes a plurality of apertures configured to compress ends of the one or more cables in compression with the one or more compressible portions.

171. An electrical connector assembly comprising: a connector mounting end that defines a power cable that does not terminate in a solder mass and does not physically contact a corresponding pad on a printed circuit board.

172. A film comprising: an electrically non-conductive portion that has a first side and an opposed second side; at least one first elastomeric conductive portion that extends beyond a first major surface of the first side of the electrically non-conductive portion and at least one second elastomeric conductive portion that extends beyond a second major surface of the opposed second side of the electrically non-conductive portion, wherein both the first elastomeric conductive portion and the second elastomeric conductive portion each respectively define at least one signal conductor at least partially circumscribed by a respective ground conductor and a line oriented perpendicular to both the first side and the opposed side of the electrically non-conductive portion passes through a respective center of the at least one signal conductor.

173. An electrical connector having a mounting interface, further comprising the film of claim 172 positioned adjacent to the mounting interface.

174. A connector comprising: a housing that defines a mating interface and a mounting interface, at least one of the mating interface and the mounting interface including a film having compressible or non-compressible, shielded, coaxial or twin axial signal transmission lines.

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