Flexible LED strip

Abstract

The present invention relates to a flexible LED strip (1) having: a flexible circuit board (2) extending longitudinally along a longitudinal extent (L), electrical conductor tracks (3) which are provided on the circuit board (2), components (4) at least having an LED chip (40), wherein the components (4) are fastened to the circuit board (2) and are each electrically connected to at least one of the conductor tracks (3), and terminal contact points (6) for the electrical connection of external terminal contacts (8) to the conductor tracks (3), wherein the terminal contact points (6) are each at least partially covered with solder (5) of a soldering paste that has been melted and hardened again, and electrically connected.

Description

[0001] Flexible LED strip

[0002] Description:

[0003] The present invention relates to a flexible LED strip with connection contact points for the electrical connection of external connection contacts as well as a light strip system with such a flexible LED strip and a connection contact to be connected thereto.

[0004] Flexible LED strips are generally known from the prior art. For this purpose, a large-area printed circuit board component is typically manufactured and then divided into narrow and elongated LED strips. The printed circuit board component is first provided with the appropriate electrical conductors and contact points. The surface is then coated with an organic surface protection agent (also called an "organic solderability preservative" (OSP)). This layer consists of organic substances such as benzotriazole, imidazole, or benzimidazole, which protect the conductors and contact points—for example, those made of copper—from oxidation.

[0005] In the next step, appropriate electrical / electronic components or electrical conductors can be soldered onto the circuit board or contact points. For example, electrical conductors in the form of an electrical cable with a stripped end can be soldered directly onto the circuit board. Alternatively or additionally, it is conceivable to provide chip-on-board (COB) components (e.g., COB LEDs). In this case, LED chips are attached to the circuit board, e.g., using flip-chip assembly. The LED chips are covered with a phosphor matrix. Optionally, the LED chips can first be surrounded laterally with a dam (e.g., made of silicone resin), which is then filled with the phosphor matrix, thus encapsulating the LED chip. The phosphor matrix and, if present, the dam material are then cured in one step (or alternatively in separate steps) (curing step).Alternatively or additionally, it is conceivable that in a first step, solder paste is applied to the circuit board component – ​​for example, using a screen printing process – particularly to conductor track sections. Subsequently, corresponding surface-mounted components (SMDs) are placed onto the printed solder paste areas. In a subsequent reflow soldering process (also called reflow soldering), the circuit board populated with the components is heated sufficiently to melt the solder contained in the solder paste, while at the same time the increased temperature activates the flux in the solder paste gel. This attaches the surface-mounted components to the circuit board. The circuit board component can then be cut open to separate the individual flexible LED strips. These can then be rolled up in a final step, if required.Depending on the configuration and design of the flexible LED strip, it is then possible to divide it into smaller sub-strip sections.

[0006] Since the heat introduced during reflow soldering and / or the curing of the phosphor matrix and, if applicable, the dam material, in particular, leads to damage of the organic surface protection, the connection contact points are often partially exposed and oxidized. This, in turn, reduces the subsequent electrical connection of a connection contact via these connection contact points. To ensure that the connection contact points remain permanently and efficiently electrically conductive, even when reflow soldering or curing is used, the surface of the connection contact points is usually treated. These are often coated with chemical silver, chemical gold, or even chemical tin. Such coatings are comparatively expensive but enable highly effective electrical conductivity even after reflow soldering or curing.

[0007] It is therefore an object of the present invention to provide a flexible LED strip and a light strip system equipped therewith, which can be produced cost-effectively, while the connection contact points simultaneously retain effective electrical conductivity.

[0008] This object is achieved by the subject matter of the independent claims. The dependent claims develop the central idea of ​​the present invention in a particularly advantageous manner.

[0009] According to a first aspect, the present invention relates to a flexible LED strip. This comprises a flexible printed circuit board extending longitudinally along a longitudinal extent. The flexible LED strip further comprises electrical conductor tracks provided on the printed circuit board. In addition, the flexible LED strip comprises components (e.g., COB components such as COB LEDs or surface-mounted components), which in turn comprise at least one LED chip for emitting light. The components (e.g., surface-mounted or mounted using COB technology) are attached to the printed circuit board and each electrically connected to at least one of the conductor tracks. The flexible LED strip further comprises connection contact points for electrically connecting external connection contacts to the (i.e., at least one of the) conductor tracks (and thus preferably to the components).The connection contact points are at least partially covered with melted and re-cured solder from a solder paste by means of reflow soldering and are electrically connected thereto.

[0010] By coating the terminal contact points with solder from a solder paste using the reflow soldering process, they are reliably protected from oxidation while simultaneously retaining a cost-effective material for the electrical connection of the terminal contact points. This provides an effective and cost-effective method for protecting the terminal contact points while maintaining their electrical conductivity, which is also used, for example, in the attachment of surface-mounted components. In this way, the coating on the terminal contact points can be implemented not only effectively but also in a process-efficient manner.

[0011] The terminal contact points are preferably completely covered with the (melted and recured) solder and electrically connected. This allows for a highly effective coating of the terminal contact points. This allows for secure electrical contacting of a terminal contact via the terminal contact points. However, it is also conceivable to partially cover the terminal contact points with the cured solder, particularly in the contact sections required for the electrical connection—for example, via the terminal contacts.

[0012] The (cured) solder is preferably provided exposed at the connection contact points to easily enable connection of external connection contacts.

[0013] At least one of the connection contact points can preferably be provided adjacent to at least one or both narrow end edges of the circuit board that are opposite in terms of the longitudinal extent. Thus, the connection contact points are exposed to the outside or are easily accessible, enabling easy connection via this connection contact point. For example, a corresponding connector plug can be easily plugged onto the side of the flexible LED strip to enable a corresponding electrical connection to at least one of the connection contact points.

[0014] Preferably, several connection contact points can be provided distributed along the length of the LED strip. This allows a connection contact to be electrically connected at different points along the LED strip, allowing for significantly more flexible use of the corresponding LED strip.

[0015] The multiple connection contact points are preferably provided at regular intervals along the length. Such a design enables the provision of similar, recurring connection points, which in turn simplifies the connection of the corresponding connection contacts and thus the overall use of the LED strip.

[0016] The flexible LED strip can preferably have at least one predetermined separation section along its longitudinal extent or a plurality of predetermined separation sections distributed along its longitudinal extent, at which the LED strip can be separated transversely to the longitudinal extent into a plurality of flexible sub-strip sections (i.e., preferably into two flexible sub-strip sections for each predetermined separation section). The sub-strip sections can then preferably themselves form the flexible LED strip according to the invention. The predetermined separation section(s) preferably extend perpendicularly or orthogonally to the longitudinal extent of the circuit board. This makes it possible to separate defined sub-strip sections from the LED strip as required in order to make them available for individual use. This enables a particularly flexible application of the LED strip for a customer.

[0017] Preferably, the plurality of predetermined separation sections are provided at regular intervals along the longitudinal extent. This makes it possible to provide similar sub-band sections, which can then be separated as needed. Thus, identical parts can be easily separated from the LED strip as needed and then used as a standalone LED strip. At least one of the connection contact points can preferably be provided adjacent to the predetermined separation section or sections. Thus, after the LED strip has been separated into the sub-band sections, corresponding connection contact points can be provided in an easily accessible manner.

[0018] According to a preferred embodiment, it is conceivable that at least one of the connection contact points is provided adjacent to the intended separation section(s) in such a way that, after the flexible LED strip has been separated at the intended separation section(s) into the plurality of sub-strip sections, these connection contact points are arranged adjacent to a further narrow end edge of these sub-strip sections created by the separation. Thus, the corresponding connection contact points are highly effectively provided and easily contactable at the sub-strip sections even after the LED strip has been separated into the sub-strip sections. The remaining sub-strip section or the LED strip can also be used effectively—for example, for equipping additional components such as LED chips.

[0019] As already mentioned, the components can preferably comprise COB (chip-on-board) components. This allows the flexible LED strip to be manufactured using COB technology. This, in turn, offers the advantage of simple and cost-effective production. The flexible LED strip can thus be provided in a compact form or with a higher component density. Furthermore, COB technology enables an effective thermal connection between the LED component and the circuit board.

[0020] At least one of the COB components can preferably comprise the LED chip, thus forming a COB LED. The LED chip is then preferably covered with a phosphor matrix. In addition to the aforementioned advantages, COB technology enables effective thermal connection between the LED chip and the circuit board, whereby the phosphor matrix can usually also contribute to heat dissipation to the circuit board. The phosphor matrix also makes it easy to achieve a defined color temperature.

[0021] The LED strip can preferably have a dam that borders the LED chip laterally or circumferentially and is filled with the phosphor matrix, so that the LED chip is preferably encapsulated with the phosphor matrix. This allows the phosphor matrix to be applied in a defined position in a simple and effective manner.

[0022] The dam can preferably be made of an epoxy resin or a silicone resin. This allows for precise and easy application and deployment.

[0023] The dam can preferably be reflective; for example, it can have reflective particles and / or a reflective surface. This allows for high luminaire efficiency to be achieved.

[0024] The dam can preferably be opaque at least to the wavelength of the light emitted by the LED chip and / or the light subsequently converted in the phosphor matrix. This enables a defined, directed light emission and effectively reduces stray light.

[0025] As already mentioned, the components can preferably also comprise surface-mounted components. These are particularly suitable for use on flexible printed circuit boards. At least one of the surface-mounted components can preferably comprise the LED chip, so that the LED chip can be provided accordingly easily and safely.

[0026] The components—particularly surface-mounted components, but also, for example, COB components—can preferably be attached to the circuit board by reflow soldering using melted and recured solder from the solder paste, and each can be electrically connected to at least one of the conductor tracks. Since, in addition to the connection contact points, the components are also subjected to a reflow soldering process and are attached to the circuit board with the solder by reflow soldering, the reflow soldering process can be used both to attach the components and simultaneously to coat the connection contact points with the solder. In this way, the coating on the connection contact points can be implemented not only effectively but also in a technically efficient manner.For example, in a single screen-printing process, both the positions intended for the components and the connection pads can be coated with solder paste without any additional effort. After the components have been placed, reflow soldering can then be performed by heating the circuit board, mounting the components in a single step while simultaneously coating the connection pads with solder. This results in a simple and cost-effective process while maintaining the electrical conductivity of the connection pads even after reflow soldering.

[0027] Preferably, the conductor tracks are made of copper or a copper alloy. This allows for high conductivity of these conductor tracks.

[0028] The connection contact points can also be made of copper or a copper alloy and thus also have a high conductivity.

[0029] The solder is preferably made of tin or a tin alloy. This provides a material that is both inexpensive and highly electrically conductive for covering the connection points and, if necessary, for mounting the components. This material can then be easily melted using reflow soldering, thus making it functional.

[0030] The solder paste can be any commercially available solder paste. The solder paste preferably consists of 85-95% solder and 15-5% flux. This makes it easy to prepare and generally common solder paste.

[0031] According to a further aspect, the present invention further relates to a light strip system comprising, on the one hand, the flexible LED strip according to the present invention or at least one of the flexible sub-strip sections of the flexible LED strip, and, on the other hand, at least one connection contact. The connection contact can then be directly electrically contacted with at least one of the connection contact points in order to be electrically connected to at least one of the components or LED chips (e.g., surface-mounted or mounted using COB technology).

[0032] The LED strip, with all its advantages, can thus be easily connected to a corresponding connection contact, whereby this connection contact can then be electrically connected to the connection contact points in an effective manner due to the cost-effective but effective coating of the connection contact points with the solder.

[0033] The light strip system preferably further comprises at least one connector plug having the connection contact. The connector plug can then preferably be mechanically connected to the LED strip or its sub-strip section such that the connection contact is held in direct electrical contact with the at least one connection contact point. This provides a simple but effective way of connecting the connection contact to the connection contact point(s). This facilitates assembly and enables a particularly secure electrical connection.

[0034] The connector plug can preferably be plugged onto the narrow end edge of the LED strip or onto the further narrow end edge of the partial strip section. This enables a spatially compact, simple, and secure electrical connection between the connection contact and the connection contact point. Since the connector plug can be plugged onto the narrow end edge or the further narrow end edge, the connector plug can preferably completely accommodate it, thus creating a highly effective mechanical connection option to reliably maintain the electrical connection permanently.

[0035] The connector preferably has a wiring harness that is electrically connectable or connected to the LED strip via the connection contact and the at least one connection contact point. This enables a simple connection of external components or, in the simplest case, an external power supply to the LED strip and, in particular, the components provided thereon, such as LED chips.

[0036] Further embodiments, features, and advantages of the present invention are described below with reference to the accompanying drawings. They show:

[0037] Fig. 1 shows a circuit board component for separating into a plurality of flexible LED strips according to a first embodiment of the present invention with surface-mounted components, Fig. 2 shows a plan view of a flexible LED strip according to the first embodiment of the present invention, for example after separation from the circuit board component according to Fig. 1,

[0038] Fig. 3 is a perspective view of the flexible LED strip according to Fig. 2,

[0039] Fig. 4 shows several views of a flexible LED strip - here a partial strip section of the flexible LED strip - according to Fig. 2, showing:

[0040] Fig. 4a is a plan view of the partial strip section of the flexible LED strip according to Fig. 2,

[0041] Fig. 4b is a side view of the partial band section according to Fig. 4a,

[0042] Fig. 4c is a perspective view of the partial band section according to Fig. 4a,

[0043] Fig. 5 is a perspective view of the flexible LED strip according to Fig. 3 or - here - of the partial strip section according to Fig. 4 with a connection contact connected thereto to form a light strip system according to the invention,

[0044] Fig. 6 side sectional views of a detail of the light strip system according to Fig. 5 in the area of ​​the connection contact, showing:

[0045] Fig. 6a shows the side detail sectional view of the light strip system according to Fig. 5 in the area of ​​the connection contact with the pivoting lever open, and

[0046] Fig. 6b shows the side detail sectional view according to Fig. 6a with the pivot lever closed, Fig. 7 shows several views of a flexible LED strip or of partial strip sections of a flexible LED strip according to two embodiments in COB technology without a dam, showing:

[0047] Fig. 7a is a plan view of a partial strip section of the flexible LED strip according to a second embodiment of the present invention in COB technology,

[0048] Fig. 7b is a side view of the partial band section according to Fig. 7a,

[0049] Fig. 7c is a plan view of a partial strip section of the flexible LED strip according to a third embodiment of the present invention in COB technology with two parallel arranged rows of LED chips,

[0050] Fig. 7d is a front view of the partial band section according to Fig. 7c,

[0051] Fig. 8 shows several views of a flexible LED strip or of partial strip sections of a flexible LED strip according to two further embodiments in COB technology with dam, showing:

[0052] Fig. 8a is a plan view of a partial strip section of the flexible LED strip according to a fourth embodiment of the present invention in COB technology with dam,

[0053] Fig. 8b is a front view of a partial strip section of the flexible LED strip according to a fifth embodiment of the present invention in COB technology with two parallel arranged rows of LED chips and with dam, and

[0054] Fig. 8c is a plan view of the partial strip section of the flexible LED strip according to Fig. 8b.

[0055] The figures show several embodiments of a flexible LED strip 1, as well as parts thereof and a light strip system 100 produced therewith. The flexible LED strip 1 has a flexible printed circuit board 2 extending longitudinally along a longitudinal extent L, as can be seen in particular in Figs. 2 to 8. This flexible printed circuit board 2 can be bendable, twistable, and preferably also rollable; see, for example, Figs. 3 and 4c.

[0056] The flexible LED strip 1 further comprises electrical conductor tracks 3 provided on the circuit board 2. These are schematically illustrated as examples in Fig. 2 and also in Fig. 4a; for the sake of clarity, the conductor tracks 3 are not shown in the remaining figures. The electrical conductor tracks 3 are preferably made of copper or a copper alloy.

[0057] Furthermore, the flexible LED strip 1 comprises components 4. The components 4, in turn, comprise at least one LED chip 40 for light emission, as can be seen in all Figs. 1 to 8. The components 4 are mounted on the circuit board 2 and are each electrically connected to the conductor tracks 3 or to at least one of them.

[0058] The components 4 can preferably have COB components 42, as shown by way of example in the exemplary embodiments in FIGS. 7 and 8. At least one of the COB components 42 can preferably have the LED chip 40 and thus form a COB LED. The LED chip 40 can be provided on the circuit board 2, for example, by means of flip-chip assembly or also by means of chip-and-wire technology. With chip-and-wire technology, the LED chip 40 is first attached to the circuit board during chip bonding. Subsequently, wire connections are created from the LED chip 40 to the circuit board 2 or the conductor tracks 3 during wire bonding. In this case, the LED chip 40 is generally connected to landing pads 14 on the circuit board 2 by means of wires 15 in order to establish an electrical connection between the LED chip 40 and the circuit board 2.

[0059] In the embodiments of Fig. 7a, 7b and Fig. 8a, the components 4 each have seven COB-LEDs 42. In the embodiments of Fig. 7c and 8c, the components 4 each have two parallel rows of COB-LEDs 42; thus a total of fourteen COB-LEDs 42. The two parallel COB-LED strands can preferably be controlled independently. It is advantageous if the different COB-LED strands emit light with different color temperatures in order to create a tunable-white effect. Possible controllable color temperature values ​​are preferably in a range between 2700K and 6500K; e.g., 2700K, 3000K, 4000K, 5000K and 6500K. However, the invention is not limited with regard to the number or arrangement of the COB components 42 or their color temperature and color temperature ranges.

[0060] The LED chip 40 is preferably covered with a phosphor matrix 12. This preferably serves to convert the light emitted by the LED chip 40, for example, to achieve a defined color temperature. The phosphor matrix 12 can contain scattering particles (e.g., SiO2, Al2O3). The phosphor matrix 12 is typically applied in liquid form and subsequently cured.

[0061] As can be seen in particular from the embodiments of Fig. 8, the LED strip

[0062] 1 have a dam 13 that laterally delimits or circumferentially surrounds the LED chip 40 and is filled with the phosphor matrix 12. In the illustrated embodiments, several of the LED chips 40 share the same dam 13 or the same dams 13; or the dams 13 of the respective LED chips 40 are formed integrally with one another.

[0063] In the embodiments shown here in Fig. 8, the dam 13 or the dams 13 extend longitudinally parallel to the longitudinal extension L. The dam 13 can, for example, be designed in the form of a web. The dam 13 can, in a plan view of the circuit board,

[0064] 2, for example, have an elongated, square, rectangular, round, or oval shape. An elongated, rectangular, or oval shape is preferred if a plurality of LED chips 40 in a row or matrix arrangement are covered by the same phosphor matrix 12, as shown by way of example in Figs. 7 and 8.

[0065] The dam 13 is preferably made of an epoxy resin or a silicone resin. The dam 13 can contain scattering particles (e.g., SiO2, Al2O3). The dam 13 can be applied in liquid form and then cured. The curing of the dam 13 can be performed simultaneously with the curing of the phosphor matrix 12. The dam 13 can also be prefabricated and then attached to the circuit board 2.

[0066] The dam 13 can preferably be reflective, particularly on its side facing the LED chip 40. For this purpose, the dam 13 can comprise, for example, highly reflective particles (e.g., TiO2, BaTiO3). The dam 13 can preferably be non-transparent, at least for the wavelength of the light emitted by the LED chip 40 that it laterally borders or circumferentially surrounds, and / or the light then converted in the phosphor matrix 12 that it laterally borders or circumferentially surrounds.

[0067] The components 4 can also comprise surface-mounted components 41, as shown, for example, in Figs. 1 to 6. At least one of the surface-mounted components 41 can then preferably comprise the LED chip 40. The invention is not limited with regard to the number or arrangement of the surface-mounted components 41.

[0068] The components 4 can preferably be attached to the circuit board 2 by means of reflow soldering using melted and recured solder 5 of the solder paste, and each can be electrically connected to at least one of the conductor tracks 3. This particularly preferably applies to the surface-mounted components 41 of the embodiment of Figs. 1 to 6, but can equally be applied to the COB components 42 according to the embodiments of Figs. 7 and 8.

[0069] In principle, any commercially available solder paste can be used. For example, the solder paste could consist of 85-95% solder 5 and 15-5% flux.

[0070] Solder 5 can preferably consist of tin or a tin alloy.

[0071] The flexible LED strip 1 further comprises connection contact points 6 for the electrical connection of external connection contacts 8 to the conductor tracks 3 or the components 4 (e.g. the COB components 42 or the surface-mounted components 41), as can be seen in particular from the sectional views of Fig. 6 (i.e. Fig. 6a and Fig. 6b). The connection contact points 6 are preferably made of copper or a copper alloy. The connection contact points 6 are each at least partially - and preferably completely - covered and electrically connected with melted and re-cured solder 5 of the solder paste by means of reflow soldering. A flexible printed circuit board 2 can be used directly for reflow soldering. In principle, it is also conceivable that a connection contact point shown in Fig.1, a flexible printed circuit board component B is provided, from which the flexible LED strips 1 (see, for example, Fig. 2 and 3) are then separated by cutting along the dividing lines T.

[0072] The surface of the printed circuit board component B or the printed circuit board 2 can first be coated with an organic surface protection (OSP) for the preliminary protection of the conductor tracks 3 and connection contact points 6.

[0073] Solder paste can then be applied—for example, using a screen printing process—to the locations for providing the connection contact points 6 for electrically connecting external connection contacts 8. Solder paste can also preferably be applied—for example, using the same screen printing process—to the locations for providing the components 4 (e.g., the surface-mounted components 41 or the COB components 42 or the LED chips 40). The components 4 can then be placed on the solder paste at the appropriate positions.

[0074] The solder 5 is then melted by reflow soldering. The melted solder 5 covers the connection contact points 6 at least partially or completely. If provided, the melted solder 5 can also position the components 4 (e.g., the surface-mounted components 41 or the COB components 42 or the LED chip(s) 40) and connect to them, and these to the corresponding conductor track 3. The solder 5 then hardens accordingly. Thus, in the reflow soldering step, the connection contact points 6 can be provided protected beneath the solder 5. Preferably, the corresponding components 4 can also be provided in the same—preferably single—reflow soldering step.

[0075] As can be seen in particular from Figures 1 to 3, at least one of the connection contact points 6 can be provided adjacent to at least one or both narrow end edges 20 of the circuit board 2 that are opposite one another with respect to the longitudinal extension L. Distributed along the longitudinal extension L, a plurality of connection contact points 6 can be provided, as can be seen in particular from Figures 1 to 4, 7a, 7c, 8a, and 8c. The plurality of connection contact points 6 can be provided distributed at regular intervals along the longitudinal extension L; see in particular Figures 1 to 3.

[0076] The flexible LED strip 1 can preferably have at least one predetermined separation section 7 along its longitudinal extent L (cf. Figs. 2 and 3) or a plurality of predetermined separation sections 7 distributed along its longitudinal extent L (cf. Fig. 1), at which the LED strip 1 can be separated into a plurality of flexible partial strip sections 10 transversely (here preferably perpendicular or orthogonal) to the longitudinal extent L (cf. Figs. 4 to 6). The plurality of predetermined separation sections 7 can preferably be provided distributed at regular intervals along the longitudinal extent L (cf. Fig. 1). At least one of the connection contact points 6 can preferably be provided adjacent to the predetermined separation section(s) 7 (cf. Figs. 1 to 3). The partial strip sections 10 can in turn themselves form the flexible LED strip 1 according to the invention.

[0077] In a preferred embodiment, at least one of the connection contact points 6 can be provided adjacent to the intended separation section(s) 7 in such a way that, after the flexible LED strip 1 has been separated at the intended separation section(s) 7 into the plurality of sub-strip sections 10, these connection contact points 6 are arranged adjacent to a further narrow end edge 11 of these sub-strip sections 10 created by the separation (cf. Figs. 2 and 3 in conjunction with Fig. 4; the same applies analogously to Figs. 7a, 7c, 8a and 8c). The further narrow end edges 11 are located in the region of the former intended separation section(s) 7 and are therefore created by the separation precisely in the region of the intended separation section(s) 7 at these locations. Since the connection contact points 6 are provided adjacent to these areas, they can be effectively accessible after the LED strip 1 has been separated via the predetermined separation section(s) 7.

[0078] 5 and 6 show an embodiment of a light strip system 100 according to the invention. This comprises, on the one hand, a flexible LED strip 1, as already described above, or - as shown - at least one of the flexible sub-strip sections 10 of the flexible LED strip 1, as also already described above. Furthermore, the light strip system 100 has at least one connection contact 8. The connection contact 8 can be directly electrically contacted with at least one of the connection contact points 6 in order to be electrically connected to at least one of the components 4 (e.g., at least one of the surface-mounted components 41 or the COB components 42) or LED chips 40.

[0079] The light strip system 100 can preferably further comprise at least one connector 9, which has the connection contact 8. This can also be seen in Figs. 5 and 6. The connector 9 can then preferably be mechanically connected to the LED strip 1 or its sub-strip section 10 such that the connection contact 8 is held in direct electrical contact with the at least one connection contact point 6, as can be seen from the sectional views in Fig. 6.

[0080] The connecting plug 9 can preferably be plugged onto the narrow end edge 20 of the LED strip 1 or onto the further narrow end edge 11 of the partial strip section 10, as can also be seen by way of example in Figs. 5 and 6.

[0081] The connection plug 9 preferably has a wiring W which can be or is electrically connected to the LED strip 1 via the connection contact 8 and the at least one connection contact point 6 - thus via the conductor tracks 3 to the components 4 (e.g. the surface-mounted components 41 or the COB components 42) or LED chips 40.

[0082] The connection contact 8 can, for example, have a pivotable or spring-mounted contact part 80 for electrically contacting the connection contact point(s) 6. Likewise, the connection contact 8 can have a spring-loaded terminal connection 81 for the (electrical and preferably also mechanical) connection of the cabling W. The contact part 80 and the spring-loaded terminal connection 81 are preferably electrically connected to one another. The contact part 80 and the spring-loaded terminal connection 81 can be accommodated in an insulating housing 82. The insulating housing 82 can then serve for the mechanical connection to the flexible LED strip 1 or the sub-strip section 10 or the printed circuit board 11—for example, via the (further) narrow end edge 20 (11). For this purpose, the insulating housing can, for example, have clamping or locking sections 83, which can interact with the circuit board 2 in a force-fitting and / or form-fitting manner, as can be seen by way of example in Fig. 6.In the embodiment shown here in Figs. 5 and 6, the connector plug 9 has a pivoting lever 90, which is mounted in the insulating housing 82 and pivotably supports the contact part 80. The contact part 80 - here by means of the pivoting lever 90 - can preferably be movable between an open position (cf. Fig. 6a), in which the LED strip 1 or its sub-strip section 10 can be inserted into the connector plug 9, and a contacting position in which the connection contact 8 or its contact part 80 is in direct electrical contact with the at least one connection contact point 6 of the inserted LED strip 1 or sub-strip section 10 (cf. Fig. 6b).

[0083] The present invention is not limited to the embodiments described above, as long as it is encompassed by the subject matter of the following claims.

Claims

Claims:

1. Flexible LED strip (1), comprising, • a flexible printed circuit board (2) extending longitudinally along a longitudinal extent (L), • electrical conductor tracks (3) provided on the printed circuit board (2), • Components (4) comprising at least one LED chip (40), wherein the components (4) are mounted on the circuit board (2) and are each electrically connected to at least one of the conductor tracks (3), and • Connection contact points (6) for the electrical connection of external connection contacts (8) to the conductor tracks (3), wherein the connection contact points (6) are at least partially covered and electrically connected by means of reflow soldering with melted and re-cured solder (5) of a solder paste.

2. Flexible LED strip (1) according to claim 1, wherein the connection contact points (6) are completely covered with the solder (5) and electrically connected.

3. Flexible LED strip (1) according to one of the preceding claims, wherein at least one of the connection contact points (6) is provided adjacent to at least one or both narrow end edges (20) of the printed circuit board (2) which are opposite one another with respect to the longitudinal extent (L).

4. Flexible LED strip (1) according to one of the preceding claims, wherein a plurality of connection contact points (6) are provided distributed along the longitudinal extent (L).

5. Flexible LED strip (1) according to the preceding claim, wherein the plurality of connection contact points (6) are provided distributed at regular intervals along the longitudinal extent (L).

6. Flexible LED strip (i) according to one of the preceding claims, wherein the flexible LED strip (1) has at least one predetermined separation section (7) along its longitudinal extent (L) or a plurality of predetermined separation sections (7) distributed along its longitudinal extent (L), at which or at which the LED strip (1) can be separated transversely to the longitudinal extent (L) into a plurality of flexible partial strip sections (10).

7. Flexible LED strip (1) according to the preceding claim, wherein the plurality of predetermined separation sections (7) are provided distributed at regular intervals along the longitudinal extent (L).

8. Flexible LED strip (1) according to one of the two preceding claims, wherein at least one of the connection contact points (6) is provided adjacent to the predetermined separation section (7) or to the predetermined separation sections (7).

9. Flexible LED strip (1) according to the preceding claim, wherein at least one of the connection contact points (6) is provided adjacent to the intended separation section (7) or to the intended separation sections (7) in such a way that after the flexible LED strip (1) has been separated at the respective intended separation section (7) into the plurality of partial strip sections (10), these connection contact points (6) are arranged adjacent to a further narrow end edge (11) of these partial strip sections (10) created by the separation.

10. Flexible LED strip (1) according to one of the preceding claims, wherein the components (4) comprise COB components (42).

11. Flexible LED strip (1) according to the preceding claim, wherein at least one of the COB components (42) comprises the LED chip (40), wherein the LED chip (40) is covered with a phosphor matrix (12).

12. Flexible LED strip (1) according to the preceding claim, further comprising a dam (13) which laterally delimits or circumferentially surrounds the LED chip (40) and is filled with the phosphor matrix (12). 13- Flexible LED strip (1) according to the preceding claim, wherein the dam (13) is made of an epoxy resin or a silicone resin.

14. Flexible LED strip (1) according to one of the two preceding claims, wherein the dam (13) is reflective, and / or wherein the dam (13) is non-transparent at least for the wavelength of the light emitted by the LED chip (40) and / or the light then converted in the phosphor matrix (12).

15. Flexible LED strip (1) according to one of the preceding claims, wherein the components (4) comprise surface-mounted components (41).

16. Flexible LED strip (1) according to the preceding claim, wherein at least one of the surface-mounted components (41) comprises the LED chip (40).

17. Flexible LED strip (1) according to one of the preceding claims, wherein the components (4) are fastened to the circuit board (2) by means of reflow soldering via melted and recured solder (5) of the solder paste and are each electrically connected to at least one of the conductor tracks (3).

18. Flexible LED strip (1) according to one of the preceding claims, wherein the conductor tracks (3) are made of copper or a copper alloy.

19. Flexible LED strip (1) according to one of the preceding claims, wherein the connection contact points (6) are made of copper or a copper alloy.

20. Flexible LED strip (1) according to one of the preceding claims, wherein the solder (5) consists of tin or a tin alloy.

21. Flexible LED strip (1) according to one of the preceding claims, wherein the solder paste consists of 85-95% solder (5) and correspondingly 15-5% flux.

22. Light strip system (too), comprising: • a flexible LED strip (1) according to one of the preceding claims or at least one of the flexible sub-strip sections (10) of the flexible LED strip (i), and • at least one connection contact (8), wherein the connection contact (8) can be directly electrically contacted with at least one of the connection contact points (6) in order to be electrically connected to at least one of the components (4) or LED chips (40).

23. Light strip system (100) according to the preceding claim, further comprising at least one connection plug (9) which has the connection contact (8), wherein the connection plug (9) is mechanically connectable to the LED strip (1) or its sub-strip section (10) in such a way that the connection contact (8) is held in direct electrical contact with the at least one connection contact point (6).

24. Light strip system (100) according to the preceding claim, wherein the connecting plug (9) can be plugged onto the narrow end edge (20) of the LED strip (1) or onto the further narrow end edge (11) of the partial strip section (10).

25. Light strip system according to one of the two preceding claims, wherein the connection plug (9) has a wiring (W) which can be or is electrically connected to the LED strip (1) via the connection contact (8) and the at least one connection contact point (6).

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