Hall-effect current sensor connector and method of forming same

Abstract

In an embodiment, a current sensor connector is coupled to a busbar and is couplable with a mating connector. The current sensor connector includes an insulative housing, and a subassembly partially embedded into the housing and partially extending therefrom. The subassembly includes a Hall-Effect current sensor member on an insulative substrate and electrically coupled with at least a portion of traces on the substrate. A sensing element of the sensor member is orthogonal to electric current flowing through the busbar. The subassembly is formed by an Application Specific Electronics Packaging process.

Description

HALL-EFFECT CURRENT SENSOR CONNECTOR AND METHOD OF FORMING SAMERELATED APPLICATION

[0001] This application claims priority to United States Provisional Application No. 63 / 526,589, filed July 13, 2023, the contents of which are incorporated herein by reference in their entireties.TECHNICAL FIELD

[0002] This disclosure relates to a Hall-Effect current sensor connector, and the method of manufacturing thereof. More specifically, this disclosure relates to a Hall-Effect current sensor connector, which partially uses an Application Specific Electronics Packaging manufacturing process to form the Hall-Effect current sensor connector.DESCRIPTION OF RELATED ART

[0003] One common method to measure current flowing through a conductor involves measurement of the magnetic fields generated by the flow of current through the conductor. These are called CT (Current Transformer) sensors. LEM International SA manufactures CT sensors, but these CT sensors are relatively bulky due to the need for a magnetic core that “wrap around” the conductor to pick up the magnetic fields created by the current flow. These CT sensors also have size and weight limitations which can often make them a challenge to design into applications where size and weight are important. Furthermore, the windings can become saturated if too high a current is run through the conductor. For several of these reasons, the sensors can also be expensive.

[0004] Another common method to measure current flowing through a conductor involves measurement of the voltage drop across a known resistance which is in series with the current flow using the relationship V=IR. These are known as shunt resistor sensors. If the resistance of the shunt resistor sensor is known precisely and the voltage drop can be measured across the shunt resistor sensor, the current flow through the shunt resistor sensor can be measured very accurately. Several of the challenges with shunt resistor sensors include the need to position the shunt resistor sensor into the path of the current flow. In order to do this, the current path must be broken, and the cables or busbars used to carry the current must integrate the shunt resistor sensor in a way that would make it possible to measure the voltageacross the shunt resistor sensor. A second challenge with using a shunt resistor sensor is related to the amount of heat that the shunt resistor sensor must be able to withstand during its use. If the currents that are being measured are in the hundreds or thousands of Amps, the use of a shunt resistor sensor may not be practical.

[0005] Application Specific Electronics Packaging devices and manufacturing processes have been developed by the Applicant and are useful for the creation of electronics modules. An advantage of the Application Specific Electronics Packaging manufacturing process is that it allows a manufacturer to integrate connector functions into the electronics module that would be much larger and more expensive if the connector functions were discrete components. Furthermore, conductive contacts integrated into Application Specific Electronics Packaging devices are highly conductive, so the conductive contacts provide an optimal path for carrying high current, as well as removing heat very efficiently.

[0006] The Application Specific Electronics Packaging manufacturing process utilizes many of the same manufacturing steps used to produce connectors, but adds significantly more functionality with minimal addition of cost. Application Specific Electronics Packaging manufacturing processes have previously been described and illustrated in United States Patent Nos. 10,433,428, 10,667,407, 10,905,014 and 11,503,718, the disclosures of which are incorporated herein by reference.SUMMARY

[0007] In an embodiment, a current sensor connector is coupled to a conductive busbar and is couplable with a mating connector. The current sensor connector includes an insulative housing, and a subassembly partially embedded into the housing and partially extending therefrom. The subassembly includes a Hall-Effect current sensor member on an insulative substrate and electrically coupled with at least a portion of traces on the substrate. A sensing element of the sensor member is orthogonal to the electrical current (which creates magnetic flux) flowing through the busbar. The subassembly is formed by an Application Specific Electronics Packaging process which comprises: forming a lead frame defining an opening and having a plurality of conductive contacts which extend into the opening, overmolding a substrate onto a portion of each conductive contact, the substrate having a plurality of openings provided therethrough which exposes sections of the respective conductive contacts, forming and electroplating traces on the substrate, electrically attaching the Hall-Effect current sensor member with at least a portion of the traces, and removing the lead frame.

[0008] The Hall-Effect current sensor member may be a differential Hall-Effect current sensor or a non-differential Hall-Effect current sensor.

[0009] In an embodiment, the current sensor connector has a creepage range between 5mm to 50mm relative to any exposed conductive elements from the sensor member or the connector to the busbar or any conductive components close to or making contact with the busbar.

[0010] In an embodiment, the substrate is formed of a liquid crystal polymer or a thermoset material, and the housing is formed of a high temperature material having a high comparative tracking index (CTI) of at least 300 volts. The substrate may be formed of Acrylonitrile butadiene styrene (ABS), Polyphenylene sulfide (PPS), Syndiotactic Polystyrene (SPS), poly carbonate, poly carbonate blends, polypropylene, polypropylene blends, polyvinyl chloride (PVC or Vinyl), polyvinyl chloride blends.

[0011] In an embodiment, the busbar has an opening, and the sensing element of the sensor member is positioned within the opening. The housing may be mechanically coupled to the busbar. The housing may have a passageway therethrough and the busbar extends through the passageway, and the housing may be mechanically coupled to the busbar. The busbar is formed of a copper, aluminum, brass, nickel, tin, silver, gold, etc., or any combination thereof.

[0012] In an embodiment, the sensing element of the sensor member is positioned proximate to an edge of the busbar. The housing may have a passageway therethrough and the busbar extends through the passageway to position the sensing element proximate to the edge.

[0013] A plurality of current sensor connectors may be coupled to the busbar. In an embodiment, the busbar has a plurality of spaced apart openings, and the sensing element of respective sensor members is positioned within respective ones of the openings. Each housing may have a passageway therethrough and the busbar extends through the passageways. In another embodiment, the sensing element of the sensor member is positioned proximate to an edge of the busbar. The busbar may have a plurality of sides, and respective ones of the sensor members are coupled to respective ones of the sides.

[0014] A method of forming the current sensor connector is provided. The method includes forming a continuous carrier web having a plurality of lead frames, each lead frame defining an opening and having a plurality of conductive contacts which extend into the opening; overmolding a substrate onto sections of each conductive contact of each lead frame, each substrate having a plurality of openings provided therethrough which exposes a portion of each conductive contact; electrically connecting a sensor member to the exposed portion of the conductive contacts of each lead frame to form a plurality of devices, each device having a sensor member; separating the devices from each other; and partially or fully embedding each substrate within an insulative housing, wherein end portions of the conductive contact extend from the respective insulative housing.BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present application is illustrated by way of example and not limited in the accompanying figures in which like reference numerals indicate similar elements and in which:

[0016] FIG. 1 depicts a perspective view of a current sensor connector in accordance with a first embodiment of the present disclosure and which is mounted on a busbar, and a mating connector;

[0017] FIG. 2 depicts a side elevation view of the current sensor connector;

[0018] FIG. 3 depicts a top plan view of the current sensor connector;

[0019] FIG. 4 depicts an end elevation view of the current sensor connector;

[0020] FIG. 5 depicts a cross-sectional view along line 5-5 of FIG. 3;

[0021] FIGS. 6 and 7 depict illustrations of the steps used to form a subassembly which forms part of the current sensor connector;

[0022] FIGS. 8 A through 8D depict perspective views of a busbar to which the current sensor connector can be coupled;

[0023] FIG. 9 depicts a side elevation view of an alternate embodiment with two current sensor connectors mounted to a busbar which is, in turn, mounted to secondary mating busbars;

[0024] FIG. 10 depicts a side elevation view of a yet a further alternate embodiment with two current sensor connectors mounted to a busbar which is, in turn, mounted to secondary mating busbars;

[0025] FIG. 11 depicts a side elevation view of another alternate embodiment with two current sensor connectors mounted to their own busbars which are, in turn, mounted to secondary mating busbars;

[0026] FIG. 12 depicts a side elevation view of yet another alternate embodiment with two current sensor connectors mounted to a busbar which is, in turn, mounted to secondary mating busbars;

[0027] FIG. 13A depicts a perspective view of another embodiment of a busbar on which a plurality of current sensor connectors can be mounted;

[0028] FIG. 13B depicts a perspective view of the busbar of FIG. 13A having a plurality of current sensor connectors mounted thereon;

[0029] FIG. 14 depicts a perspective view of a current sensor connector in accordance with a second embodiment of the present disclosure and which is mounted on a busbar;

[0030] FIG. 15 depicts a perspective view of a current sensor connector in accordance with a third embodiment of the present disclosure and which is mounted on a busbar;

[0031] FIG. 16 depicts a perspective view of a modification to the current sensor connector of FIG. 15, and shown mounted on a busbar;

[0032] FIG. 17 depicts a perspective view of a current sensor connector in accordance with another embodiment of the present disclosure and which is mounted on a busbar; and

[0033] FIG. 18 depicts a perspective view of a current sensor connector in accordance with yet another embodiment of the present disclosure and which is mounted on a busbar. DETAILED DESCRIPTION

[0034] While the disclosure may be susceptible to embodiments in different forms, it is shown in the drawings and herein which is described in detail, specific embodiments with the understanding that the present disclosure is to be considered an exemplification of the principles of the disclosure and is not intended to limit the disclosure to that as illustrated and described herein. Therefore, unless otherwise noted, features disclosed herein may be combined to form additional combinations that were not otherwise shown for purposes of brevity. It will be further appreciated that in some embodiments, one or more elements illustrated by way of example in a drawing(s) may be eliminated and / or substituted with alternative elements within the scope of the disclosure.

[0035] Directional terms such as front, rear, horizontal, vertical and the like are used for ease in explanation, and do not denote a required orientation in use.

[0036] A current sensor connector 20, 320, 420 having a sensor member 22 that uses the principle of Hall-Effect measurements of magnetic fields is provided for use with a high voltage conductive busbar 24, 24a, 24b, 24c, 24d, 24e. For example, the busbar 24, 24a, 24b, 24c, 24d, 24e is capable of carrying 2000 amps. The sensing element in the sensor member 22 is orthogonal to the electrical current (which creates magnetic flux) flowing through the busbar 24, 24a, 24b, 24c, 24d, 24e. The sensing element in the sensor member 22 may be a differential Hall-Effect sensor or a non-differential Hall-Effect current sensor, that is, the sensing element may be comprised of two sensors or a single sensor. When a differential principle of current measurement is used, the stray magnetic fields that have been known to be an issue with the use of core-based measurement methods in the past are isolated or substantially isolated. The busbar 24, 24a, 24b, 24c, 24d, 24e is conductive. The busbar may be formed of a copper, aluminum, brass, nickel, tin, silver, gold, etc., or any combination thereof. The busbar 24, 24a, 24b, 24c, 24d, 24e may be solid or a laminated structure. A mating connector 26 is couplable to the current sensor connector 20, 320, 420. As an example, the current sensor connector 20, 320, 420 may be used to measure how much energy is either going into or out of, in most cases, batteries that are used to store the energy in an electric vehicle, such as, for example but not limited to, a car, tractor, truck, boat or airplane. As another example, the current sensor connector 20, 320, 420 may be used to measure current in server racks in clouds and server farms / facilities. Because the current sensor connector 20, 320, 420 determines how much is both in the batteries for stored energy and how much the user may be getting charged by the supplier of the energy, the current sensor connector 20, 320, 420 must be very accurate overtime, temperature, and the environment within which they are operated.

[0037] The current sensor connector 20, 320, 420 includes a subassembly 30 which includes a substrate 32 onto which a laser pattern is scribed and then plated thereby forming conductive traces 34, and having the sensor member 22 mounted thereon, and plurality of conductive low voltage conductive contacts 36, shown as an example in the drawings as six pins, electrically coupled with at least a portion of the traces 34 and extending from the substrate 32. In other embodiments, the current sensor connector 20, 320, 420 may have lessthan or more than 6 output pins. In an embodiment, the subassembly 30 is formed using an Application Specific Electronics Packaging manufacturing process 250. The unique properties of Application Specific Electronics Packaging allow for the creation of the subassembly 30 that has the features of a printed circuit board and the features of an electrical connector, produced in a single, high volume, compact, and low-cost assembly. The Application Specific Electronics Packaging manufacturing process 250 is disclosed in, for example, United States Patent Nos. 10,433,428, 10,667,407, 10,905,014 and 11,503,718. The current sensor connector 20, 320, 420 further includes an insulative housing 38, 338, 438 in which the subassembly 30 is provided, and from which end portions 40 of the conductive contacts 36 extend.

[0038] Attention is particularly invited to FIG. 6 which partially illustrates the formation of the subassembly 30, and additionally to FIG. 7 which provides a flow chart showing the steps of the Application Specific Electronics Packaging manufacturing process 250.

[0039] The Application Specific Electronics Packaging manufacturing process 250 begins with Step A, shown in FIGS. 6 and 7. The Application Specific Electronics Packaging manufacturing process 250 preferably occurs between a pair of reels (not shown). In Step A, a middle portion of a continuous carrier web 200 is stamped and formed (thus removing undesired portions of the middle portion of the carrier web 200) to form a lead frame 202 with an opening 204 and to form the conductive contacts 36 which extend inwardly into the opening 204. Each conductive contact 36 has a through hole 42. The lead frame 202 is formed in a desired configuration suited for the formation of the subassembly 30. The lead frame 202 preferably includes end portions 206 (it being understood that the end portions 206 of one lead frame 202 are continuous with the end portions 206 of the adjacent lead frame 202), and a pair of stabilizing portions 208 (it being understood that stabilizing portions 208 of one lead frame 202 will also preferably act as stabilizing portions 208 of the adjacent lead frame 202), with each stabilizing portion 208 spanning the distance between the opposite end portions 206. The opposite end portions 206 and the stabilizing portions 208 thus generally form a rectangular frame which defines the opening 204 therebetween. The conductive contacts 36 are connected to one of the end portions 206.

[0040] The Application Specific Electronics Packaging manufacturing process 250 continues with Step B, shown in FIGS. 6 and 7. In Step B, the substrate 32 is overmoldedto the conductive contacts 36. Through holes 44 of the substrate 32 align with the through holes 42 of the conductive contacts 36. The substrate 32 may be formed of Acrylonitrile butadiene styrene (ABS), Polyphenylene sulfide (PPS), Syndiotactic Polystyrene (SPS), poly carbonate, poly carbonate blends, polypropylene, polypropylene blends, polyvinyl chloride (PVC or Vinyl), polyvinyl chloride blends. The substrate 32 may also advantageously be formed with a liquid crystal polymer (LCP or a thermoset material. By making the substrate 32 out of LCP’s or thermoset materials, the heat loads of the electronics can be significantly reduced in the current sensor connector 20, 320, 420. The end portions 40 of the conductive contacts 36 do not have the substrate 32 overmolded thereto. The overmolding of Step B can be performed with single or two shot processes, or any other conventional molding process.

[0041] The Application Specific Electronics Packaging manufacturing process 250 continues with Step C, shown in FIGS. 6 and 7. In Step C, patterning is performed on the substrate 32. The patterning provides for patterns 210 (which may be circuit patterns) to be formed on the upper or lower surface of the substrate 32 and in the through holes 44. The patterns 210 can be formed by any number of suitable processes, including a laser process, a plasma process (which can be a vacuum or atmospheric process), a UV process and / or a fluorination process. Depending on the process used (e.g., plasma, UV and / or fluorination), the patterning may comprise patterning (i.e., a surface treatment of) most, if not all, of the upper surface of the substrate 32. Thus, the patterns 210 may be formed on all or nearly all of the upper surface of the substrate 32.

[0042] The Application Specific Electronics Packaging manufacturing process 250 continues with Step D, shown in FIG. 7. In Step D, the patterns 210 are electroplated by applying a voltage potential to the lead frame 202 (which is electrically connected to the patterns 210 by the conductive contacts 36 and then exposing the lead frame 202, the substrate 32 and the patterns 210 to an electroplating bath). The electroplating process not only electroplates the patterns 210 and the walls forming the through holes 44 to form the traces 34, but also electroplates the lead frame 202 and the portions of the conductive contacts 36 that are not covered by the substrate 32. A slug may be formed within the through holes 44 and through holes 42 in the electroplating process. Step D can involve a single step plating process which builds up a single layer of a single material, such as copper, or caninvolve a multistep plating process which builds up multiple layers of multiple materials, such as a copper layer and a tin layer, it being understood that other suitable material could also be used. The increased thickness allows for increased current carrying capability and, in general, the electroplating process tends to create a material that has a high conductivity, such that the performance of the resultant electronic circuit traces 34 is improved.

[0043] The Application Specific Electronics Packaging manufacturing process250 continues with Step E, shown in FIG. 7. In Step E, a solder mask is applied which covers select portions of the electronic circuit traces 34 and all, or substantially all, of the exposed surfaces of the substrate 32 and solder paste is stenciled onto the exposed portions of the electronic circuit traces 34 (namely those portions not covered by the solder mask). Alternatively in Step E, a laser ablates tin that is plated over the nickel in areas around the perimeter of the components. Since tin is highly susceptible to soldering and nickel is not, the solder is prevented from flowing away from the components. The traces 34 are electrically isolated from each other by the insulative substrate 32.

[0044] The Application Specific Electronics Packaging manufacturing process250 continues with Step F, shown in FIGS. 6 and 7. In Step F, the sensor member 22 is electrically connected with at least a portion of the electronic circuit traces 34 on the upper surface of the substrate 32, which preferably occurs via soldering.

[0045] The Application Specific Electronics Packaging manufacturing process250 continues with Step G, shown in FIGS. 6 and 7. In Step G, the lead frame 202 and the portions of the conductive contacts 36 outside of the substrate 32 are punched / removed. This forms the subassembly 30. Electrical paths are formed by the respective conductive contact 36, trace 34, and the sensor member 22.

[0046] The Application Specific Electronics Packaging manufacturing process250 continues with Step H, shown in FIG. 7. In Step H, the subassembly 30 is seated within an opening in the insulative housing 38, 338, 438 and a second low pressure thermal material is partially overmolded over the subassembly 30 and the housing 38, 338, 438 to seal the interface between the subassembly 30 and the housing 38, 338, 438 and, in effect, cause the subassembly 30 and the housing 38, 338, 438 to become a one-piece component. In other embodiments, the housing 38, 338, 438 could be formed with one or more overmold steps. Alternatively, the subassembly 30 is partially potted with potting material within the openingin the insulative housing 38, 338, 438 to become a one-piece component. The end portions 40 are not overmolded or potted. Since a one-piece component is formed, leak paths for voltage are eliminated. Other suitable means for forming the one-piece component are within the scope of the present disclosure.

[0047] The housing 38, 338, 438 is formed of a high temperature material having a high comparative tracking index (CTI) of at least 300 volts. The housing 38, 338, 438 provides a packaging that is small enough to keep the current sensor connector 20, 320, 420 manageable, to have six output positions, and to meet the requirements of the automotive industry.

[0048] A first embodiment of the housing 38 of the current sensor connector 20 is shown in FIGS. 1-5. The housing 38 has a main body section 46 in which the subassembly 30 is provided, and opposite wing sections 48 extending from ends of the main body section 46. The main body section 46 has a lower section 50 in which the sensor member 22 is provided, and an upper section 52 which has an open-ended pocket 54 extending from an upper end thereof and into which the end portions 40 of the conductive contacts 36 extend and are exposed within. The pocket 54 includes side walls 56 extending to a lower wall 58. The sensor member 22 is below the pocket 54. Each wing section 48 has a through bore 60 which extends from an upper end of the respective wing section 48 to a lower end thereof. An upper section of each through bore 60 defines a pocket 62 defined by a side wall 64 and a lower wall 66. A flange 68 may extend outward from the main body section 46 and the wing sections 48 at approximately the midpoints thereof. The subassembly 30 is provided within the lower section 50 as described herein such that a one-piece component is formed, with the end portions 40 of the conductive contacts 36 extending into, and exposed within, the pocket 54.

[0049] As shown in this first embodiment, the busbar 24 is a flat bar, but it is to be understood that the busbar 24 may take a variety of shapes and does not need to be flat; the busbar 24 may be wavy, be stepped, be formed in a zig-zag shape, etc. This first embodiment of the busbar 24 has an opening 70 therein. In an embodiment as shown in FIGS. 8A and 8B, the opening 70 is a through hole which extends from an upper surface of the busbar 24 to a lower surface of the busbar 24. In an alternate embodiment as shown in FIG. 8C, the opening 70 is a through hole which extends from an upper surface of the busbar 24 to a lower surfaceof the busbar 24 and is open to one of the sides of the busbar 24. The through hole forming the opening 70 may be elongated. In yet another alternative embodiment, the through holes described herein are instead formed as recesses to form the opening 70 as shown in FIG. 8D. The recess forming the opening 70 has a side wall 70a extending from the top surface of the busbar 24 and a bottom wall 70b at the lower end of the side wall 70a. In a further alternative embodiment, the recess forming the opening 70 has an open top end and is open to one or both of the sides of the busbar 24. Like the through holes, the recess forming the opening 70 may be elongated.

[0050] The sensor member 22 is positioned within the opening 70 of the busbar 24 in a precise location in the x, y and z positions such that an accurate measurement of current flow through the busbar 24 over time and temperature is achieved. In the embodiment of FIGS. 1- 5, the lower section 50 of the main body section 46 seats with the opening 70 to provide this positioning of the sensor member 22. The current sensor connector 20 is coupled to the busbar 24 by fasteners 72, which may include threaded shanks 74 extending from enlarged heads 76, which pass through the through bores 60 in the wing sections 48 and through apertures 78 in the busbar 24. The fasteners 72 may be stainless steel. The heads 76 of the fasteners 72 seat within the pockets 62 of the wing sections 48, and washers 80 may be threaded onto the lower ends of the shanks 74 to secure the current sensor connector 20 and busbar 24 together.

[0051] The current sensor connector 20 meets creepage and clearance requirements such that the high voltages associated with the applications do not cause arcing between the conductive contacts 36 and the busbar 24. The creepage distance along the surfaces of the current sensor connector 20 are between 5mm to 50mm, wherein the creepage distance is defined between the conductive contacts 36 to the busbar 24 or to any conductive components close to or making contact with the busbar 24, such as the fasteners 72. Preferably, the creepage distance is up to 16mm. The creepage and clearance challenge is provided by features that increase the path length between the high voltage busbar 24 and the fastener heads 76 to the low voltage conductive contacts 36 within the housing 38. FIGS. 2-4 show approximate dimensions of a current sensor connector 20 that measures between 50 and 5000 Amps of current, which has example dimensions of LI of 31.83mm, L2 of 24.50mm Hl of 6.95mm, H2 of 13.80mm and W of 8.44mm. This current sensor connector 20 smaller andlighter than the prior art LEM or shunt sensors used to measure similar currents. As an example, the current sensor connector 20 approximately 9 times lighter and approximately 4 to 5 times smaller than the prior art LEM or shunt sensors used to measure similar currents.

[0052] FIGS. 8 A, 8B and 8C show embodiments of the busbar 24. The opening 70 may be fully surrounded by the busbar 24 as shown in FIGS. 8A and 8B. The opening 70 may be open to a side of the busbar 24 as shown in FIG. 8C. The side edges of the busbar 24 may have cutouts on both sides of the opening 70 as shown in FIGS. 8A and 8C, or be straight as shown in FIG. 8B. FIG. 8D depicts another embodiment of the busbar 24a which has increased thickness end portions 82 and the current sensor connector 20 seats between the increased thickness end portions 82 on a lesser thickness portion 84 of the busbar 24a provided therebetween. This embodiment of the busbar 24a can be used in a high heat application.

[0053] FIG. 9 shows an alternate embodiment in which two of the current sensor connectors 20 are mounted side-by-side, and spaced apart from each other, each of which is mounted within an opening 70 in the busbar 24b. The busbar 24b is fixedly attached to ends of secondary mating conductive busbars 86, 88. The current sensor connectors 20 may be longitudinally aligned, but may be longitudinally offset relative to each other. The busbar 24b may be coupled to the ends of secondary mating busbars 86, 88 by fasteners 90. The lower section 50 of each current sensor connector 20 extends into an opening 92 between the busbars 86, 88. In this embodiment, the secondary mating busbars 86, 88 may be flat bars. It is to be understood that the busbars 86, 88 may take a variety of shapes and do not need to be flat; the busbars 86, 88 may be wavy, be stepped, be formed in a zig-zag shape, etc. In this embodiment, the sensing element of the sensor member 22 measures the current flow through the busbars 86, 24b, 88. The two different current sensor connectors 20 are configured in this manner to optimize current sensing accuracy for two different ranges of current (e.g. high range and low range).

[0054] While a single current sensor connector 20 is shown in the opening 70 in FIGS. 1- 9, more than one current sensor connector 20 can be provided in each opening 70. As an example, FIG. 10 shows two current sensor connectors 20 in the same opening 70, but more than two current sensor connector 20 may be provided in the same opening 70.

[0055] FIG. 11 shows another alternate embodiment in which two of the current sensor connectors 20 are provided, and each is mounted within an opening 70 of a busbar 24 that are fixedly attached to the secondary mating busbars 86, 88. The busbars 24 may be coupled to the ends of the secondary mating busbars 86, 88 by fasteners (not shown). The lower section 50 of each current sensor connector 20 extends into the opening 70. In this embodiment, the secondary mating busbars 86, 88 may be flat bars. In this embodiment, the sensing element of the sensor member 22 measures a portion of the current flow through the busbars 86, 24, 88. The total busbar current can be determined by adding the value of the two current sensor members.

[0056] FIG. 12 shows yet another alternate embodiment in which two of the current sensor connectors 20 are provided, and each is mounted within an opening 94 in a busbar 24c that is fixedly attached to the ends of the secondary mating busbars 86, 88. The busbar 24c has an opening 96 which overlaps the openings 94. The openings 94 are through holes. As shown, the openings 94 extend from the top and bottom edges of the busbar 24c, but it is to be understood that the openings 94 can extend from the same edge of the busbar 24c; both openings 94 can extend from the top edge or both openings 94 can extend from the bottom edge. The openings 94 may be aligned longitudinally to each other, or displaced longitudinally from each other. The openings 94 may further be open to one of the side edges of the busbar 24c. The busbar 24c may be coupled to the ends of the mating busbar 86, 88 by fasteners 98. The lower section 50 of each current sensor connector 20 extends into the opening 96. The busbar 24c is shown as a flat bar, but it is to be understood that the busbar 24c may take a variety of shapes and does not need to be flat; the busbar 24c may be wavy, be stepped, be formed in a zig-zag shape, etc. In this embodiment, the sensing element of the sensor member 22 measures the current flow through the busbars 86, 24c, 88. The total busbar current can be determined by adding the value of the two current sensor members.

[0057] While a single current sensor connector 20 is shown in each opening 94, more than one current sensor connector 20 can be provided in each opening 94.

[0058] FIGS. 13A and 13B show a further alternate embodiment in which four of the current sensor connectors 20 are provided (only two are shown), and each is mounted within a respective opening 100 in a multi-sided busbar 24d having a central passageway 102. As shown, the busbar 24d has four sides, but three or more sides can be provided. The openings100 are through holes. The openings 100 may be aligned longitudinally to each other, or displaced longitudinally from each other. The lower section 50 of each current sensor connector 20 extends into the central passageway 102. In this embodiment, the sensing element of the sensor member 22 measures the current flow through the busbar 24d. The total busbar current can be determined by adding the value of the four current sensor members.

[0059] While a single current sensor connector 20 is shown in each opening 100, more than one current sensor connector 20 can be provided in each opening 100.

[0060] When two or more current sensor connectors 20 are provided, at least one can measure high currents and at least one can measure very low currents.

[0061] FIG. 14 shows a second embodiment of the housing 338 of the current sensor connector 320 which is used with busbar 24e. In this embodiment, the opening 70 has been eliminated. The housing 338 has a main body section 340 in which the subassembly 30 is provided, opposite wing sections 342 extending from ends of the main body section 340, and upper and lower platform sections 344, 346 extending from a side of the main body section 340. The platform sections 344, 346 are parallel to each other and spaced apart from each other such that a passageway 348 is provided therebetween. The main body section 340 has a lower section 350 in which the sensor member 22 is provided, and an upper section 352 which has an open-ended pocket 354 extending from an upper end thereof and into which the end portions 40 of the conductive contacts 36 extend and are exposed within. The pocket 354 is formed like pocket 54 and the sensor member 22 is below the pocket 354. The subassembly 30 is provided within the lower section 350 as described herein such that a one- piece component is formed, with the end portions 40 of the conductive contacts 36 extending into, and exposed within, the pocket 354.

[0062] The busbar 24e seats within the passageway 348 with the upper platform section 344 seating against an upper surface of the busbar 24e and the lower platform section 346 seating against a lower surface of the busbar 24e. The lower section 350 and the wing sections 342 sit against a side edge of the busbar 24e. This positions the sensing element of the sensor member 22 proximate to the side edge of the busbar 24e. The side edge of the busbar 24e may be linear, or may have a cutout therein in which the sensor member 22 is proximate to. Fasteners 356 extend through aligned openings in the upper platform section 344, the busbar 24e, and the lower platform section 346 to affix the housing 338 and thebusbar 24e together. The fasteners 356 may be stainless steel. The sensing element of the sensor member 22 is positioned proximate to the busbar 24e in a precise location in the x, y and z positions such that an accurate measurement of current flow through the busbar 24e over time and temperature is achieved. The current sensor connector 320 meets creepage and clearance requirements such that the high voltages associated with the applications do not cause arcing between the conductive contacts 36 and the busbar 24e. The creepage distance along the surfaces of the current sensor connector 320 are between 5mm to 50mm, wherein the creepage distance is defined between the conductive contacts 36 to the busbar 24e or to any conductive components close to or making contact with the busbar 24e, such as the fasteners 356. Preferably, the creepage distance is up to 16mm. The creepage and clearance challenge is provided by features that increase the path length between the high voltage busbar 24e and the fasteners 356 to the low voltage conductive contacts 36 within the housing 338.

[0063] While the upper and lower platform sections 344, 346 are shown as extending across the entire width of the busbar 24e, the upper and lower platform sections 344, 346 may only extend across a portion of the width of the busbar 24e, provided the position of the fasteners 356 still provide proper creepage and clearance requirements.

[0064] FIG. 15 shows a third embodiment of the housing 438 of the current sensor connector 420 which is used with busbar 24e. The housing 438 has a main body section 440 in which the subassembly 30 is provided, opposite wing sections 442 extending from ends of the main body section 440, upper and lower platform sections 444, 446 extending from a side of the main body section 440, and an end section 448 extending between the opposite ends of the upper and lower platform sections 444, 446. The platform sections 444, 446 are parallel to each other to each other. A passageway 450 is formed through the housing 438. The main body section 440 has a lower section 452 in which the sensor member 22 is provided, and an upper section 454 which has an open-ended pocket 456 extending from an upper end thereof and into which the end portions 40 of the conductive contacts 36 extend and are exposed within. The pocket 456 is formed like pocket 54 and the sensor member 22 is below the pocket 456. The subassembly 30 is provided within the lower section 452 as described herein such that a one-piece component is formed, with the end portions 40 of the conductive contacts 36 extending into, and exposed within, the pocket 456.

[0065] The busbar 24e seats within the passageway 450 with the upper platform section 444 seating against an upper surface of the busbar 24e, the lower platform section 446 seating against a lower surface of the busbar 24e, and the end section 448 seating against a side edge of the busbar 24e. The side edge of the busbar 24e may be linear, or may have a cutout therein in which the sensor member 22 is proximate to. The lower section 452 and the wing sections 442 sit against the opposite side edge of the busbar 24e. This positions the sensor member 22 proximate to the side edge of the busbar 24e in a precise location in the x, y and z positions such that an accurate measurement of current flow through the busbar 24e over time and temperature is achieved. The current sensor connector 420 meets creepage and clearance requirements such that the high voltages associated with the applications do not cause arcing between the conductive contacts 36 and the busbar 24e.

[0066] The surface of the busbar 24e which is positioned within the passageway 450 may include texturing, such as knurling, holes, indentations, bumps, etc., to assist in holding the current sensor connector 420 onto the busbar 24e such that the current sensor connector 420 is deters from movement relative to the busbar 24e under strong vibrational forces.

[0067] The housing 438 may be used in any of the applications shown in FIGS. 9-13B.

[0068] FIG. 16 shows a modification of the housing 438 in which the upper section 454 of the housing 438 is not provided, and the open-ended pocket 456 is provided in the lower section 452. The end portions 40 of the conductive contacts 36 extend into, and are exposed within, the pocket 456. The sensor member 22 is below the pocket 456 and positioned proximate to the side of the busbar 24e. While this is shown for the embodiment of the current sensor connector 420, the current sensor connectors 20, 320 can be modified in a like manner.

[0069] The mating connector 26 may be a connector that inserts into the pocket 54, 354, 456, mechanically couples to the housing 38, 338, 438 by suitable means, and electrically couples to the end portions 40, or can be a connector that is hard wired to the end portions 40.

[0070] In the embodiments shown in FIGS. 1-5, 9-16, the conductive low voltage conductive contacts 36 extend perpendicular to the busbar 24, 24a, 24b, 24c, 24d, 24e. While FIGS. 1-5, 9-16 show the exposed end portions 40 of the conductive low voltage conductive contacts 36 extending perpendicular to the busbar 24, 24a, 24b, 24c, 24d, 24e, the exposed portions 40 of the conductive low voltage conductive contacts 36 may extend in a plurality ofpositions relative to the busbar 24, 24a, 24b, 24c, 24d, 24e such as, for example, in a parallel direction to the busbar 24, 24a, 24b, 24c, 24d, 24e as shown for example in FIGS. 17 and 18, with the pocket 54, 354, 456 being formed in the suitable direction. It is to be further noted that the sensor member 22 can be inserted partially or fully into the housing 38, 338, 438 at different angles as well (i.e. into the side, into the top, into the bottom, into any surface at a non-perpendicular or inline angle), and is not limited to the same orientation shown in all of the drawings.

[0071] The high voltage conductive busbar 24, 24a, 24b, 24c, 24d, 24e can be layered onto an insulative substrate to form a circuit board.

[0072] All references, including publications, patent applications, and patents, cited herein are hereby incorporated by reference to the same extent as if each reference were individually and specifically indicated to be incorporated by reference and were set forth in its entirety herein.

[0073] The use of the terms “a” and “an” and “the” and “at least one” and similar referents in the context of describing the invention (especially in the context of the following claims) are to be construed to cover both the singular and the plural, unless otherwise indicated herein or clearly contradicted by context. The use of the term “at least one” followed by a list of one or more items (for example, “at least one of A and B”) is to be construed to mean one item selected from the listed items (A or B) or any combination of two or more of the listed items (A and B), unless otherwise indicated herein or clearly contradicted by context. The terms “comprising,” “having,” “including,” and “containing” are to be construed as open-ended terms (i.e., meaning “including, but not limited to,”) unless otherwise noted. Recitation of ranges of values herein are merely intended to serve as a shorthand method of referring individually to each separate value falling within the range, unless otherwise indicated herein, and each separate value is incorporated into the specification as if it were individually recited herein. All processes described herein can be performed in any suitable order unless otherwise indicated herein or otherwise clearly contradicted by context. The use of any and all examples, or exemplary language (e.g., “such as”) provided herein, is intended merely to better illuminate the invention and does not pose a limitation on the scope of the invention unless otherwise claimed. No language in the specification should be construed as indicating any non-claimed element as essential to the practice of the invention.

[0074] Preferred embodiments of this invention are described herein, including the best mode known to the inventors for carrying out the invention. Variations of those preferred embodiments may become apparent to those of ordinary skill in the art upon reading the foregoing description. The inventors expect skilled artisans to employ such variations as appropriate, and the inventors intend for the invention to be practiced otherwise than as specifically described herein. Accordingly, this invention includes all modifications and equivalents of the subject matter recited in the claims appended hereto as permitted by applicable law. Moreover, any combination of the above-described elements in all possible variations thereof are encompassed by the disclosure unless otherwise indicated herein or otherwise clearly contradicted by context. As can be appreciated from the various embodiments depicted herein, different features of different embodiments depicted herein can be combined together to form additional combinations. As a result, the embodiments depicted herein are particularly suitable to provide a wide range of configurations that were not all depicted individually so as to avoid repetitiveness and unnecessary duplication.

[0075] The disclosure provided herein describes features in terms of preferred and exemplary embodiments thereof. Numerous other embodiments, modifications and variations within the scope and spirit of the appended claims will occur to persons of ordinary skill in the art from a review of this disclosure.

Claims

We claim:

1. A current sensor connector coupled to a busbar and being couplable with a mating connector, comprising: an insulative housing; and a subassembly partially embedded into the housing and partially extending therefrom, the subassembly including an insulative substrate having conductive traces thereon and conductive contacts extending therefrom, and a Hall-Effect current sensor member on the insulative substrate and electrically coupled with at least a portion of the traces, wherein a sensing element of the sensor member is orthogonal to electric current flowing through the busbar, and wherein the substrate and the Hall-Effect current sensor member are partially or fully embedded in the housing, and end portions of the conductive contacts extend from the housing for coupling to the mating connector, and wherein the subassembly is formed by an Application Specific Electronics Packaging process which comprises: forming a lead frame defining an opening and having a plurality of conductive contacts which extend into the opening, overmolding a substrate onto a portion of each conductive contact, the substrate having a plurality of openings provided therethrough which exposes sections of the respective conductive contacts, forming and electroplating traces on the substrate, electrically attaching the Hall-Effect current sensor member with at least a portion of the traces, and removing the lead frame.

2. The current sensor connector of claim 1, wherein the Hall -Effect current sensor member is a differential Hall-Effect current sensor or a non-differential Hall-Effect current sensor.

3. The current sensor connector of claim 1, wherein the current sensor connector has a creepage range between 5mm to 50mm relative to any exposed conductive elements from the sensor member or the connector to the busbar or any conductive components close to or making contact with the busbar.

4. The current sensor connector of claim 1, wherein the substrate is formed of a liquid crystal polymer or a thermoset material.

5. The current sensor connector of claim 4, wherein the housing is formed of a high temperature material having a comparative tracking index of at least 300 volts.

6. The current sensor connector of claim 1, further comprising the busbar.

7. The current sensor connector of claim 6, wherein the housing is mechanically coupled to the busbar.

8. The current sensor connector of claim 6, wherein the housing has a passageway therethrough and the busbar extends through the passageway.

9. The current sensor connector of claim 8, wherein the housing is mechanically coupled to the busbar.

10. The current sensor connector of claim 6, wherein the busbar is formed of a copper, aluminum, brass, nickel, tin, silver, gold, or any combination thereof.

11. The current sensor connector of claim 6, wherein the sensing element of the sensor member is positioned proximate to an edge of the busbar.

12. The current sensor connector of claim 11, wherein the housing is mechanically coupled to the busbar.

13. The current sensor connector of claim 11, wherein the housing has a passageway therethrough and the busbar extends through the passageway.

14. The current sensor connector of claim 6, wherein the busbar has an opening, and the sensing element of the sensor member is positioned within the opening of the busbar.

15. The current sensor connector of claim 14, wherein the opening in the busbar is a through hole.

16. The current sensor connector of claim 15, further comprising a second current sensor connector in the opening in the busbar.

17. The current sensor connector of claim 15, wherein the through hole is open to a top of the busbar and to a side of the busbar.

18. The current sensor connector of claim 6, wherein the opening in the busbar is a recess.

19. The current sensor connector of claim 18, further comprising a second current sensor connector in the opening in the busbar.

20. The current sensor connector of claim 1, wherein the housing has a pocket, the end portions of the conductive contacts extending from the pocket.

21. The current sensor connector of claim 1, wherein the subassembly is partially potted within a pocket in the housing.

22. The current sensor connector of claim 1, wherein the subassembly is within a pocket of the housing, and a material is partially overmolded over the subassembly and the housing.

23. The current sensor connector of claim 1, wherein the subassembly is partially overmolded by the housing.

24. A combination comprising: a busbar; and a plurality of current sensor connectors coupled to the busbar, each current sensor connector comprising:an insulative housing; and a subassembly partially embedded into the housing and partially extending therefrom, the subassembly including an insulative substrate having conductive traces thereon and conductive contacts extending therefrom, and a Hall-Effect current sensor member on the insulative substrate and electrically coupled with at least a portion of the traces, wherein a sensing element of the sensor member is orthogonal to electric current flowing through the busbar, and wherein the substrate and the Hall-Effect current sensor member are partially or fully embedded in the housing, and end portions of the conductive contacts extend from the housing for coupling to a mating connector, and wherein each subassembly is formed by an Application Specific Electronics Packaging process which comprises: forming a lead frame defining an opening and having a plurality of conductive contacts which extend into the opening, overmolding a substrate onto a portion of each conductive contact, the substrate having a plurality of openings provided therethrough which exposes sections of the respective conductive contacts, forming and electroplating traces on the substrate, electrically attaching the Hall-Effect current sensor member with at least a portion of the traces, and removing the lead frame.

25. The combination of claim 24, wherein each Hall -Effect current sensor member is a differential Hall-Effect current sensor or a non-differential Hall-Effect current sensor.

26. The combination of claim 24, wherein each current sensor connector has a creepage range between 5mm to 50mm relative to any exposed conductive elements from the sensor member or the connector to the busbar or any conductive components close to or making contact with the busbar.

27. The combination of claim 24, wherein each substrate is formed of a liquid crystal polymer or a thermoset material.

28. The combination of claim 27, wherein the housing is formed of a high temperature material having a comparative tracking index of at least 300 volts.

29. The combination of claim 24, wherein the busbar has a plurality of spaced apart openings, and wherein the sensing element of respective sensor members is positioned within respective ones of the openings of the busbar.

30. The combination of claim 24, wherein each housing has a passageway therethrough and the busbar extends through the passageways.

31. The combination of claim 30, wherein each housing is mechanically coupled to the busbar.

32. The combination of claim 24, wherein the busbar is formed of a copper, aluminum, brass, nickel, tin, silver, gold, or any combination thereof.

33. The combination of claim 24, wherein the sensing element of the sensor member is positioned proximate to an edge of the busbar.

34. The combination of claim 33, wherein each housing has a passageway therethrough and the busbar extends through the passageways.

35. The combination of claim 24, wherein the busbar has a plurality of sides, and respective ones of the sensor members are coupled to respective ones of the sides.

36. A method of forming a current sensor connector comprising: forming a continuous carrier web having a plurality of lead frames, each lead frame defining an opening and having a plurality of conductive contacts which extend into the opening; overmolding a substrate onto sections of each conductive contact of each lead frame, each substrate having a plurality of openings provided therethrough which exposes a portion of each conductive contact; electrically connecting a sensor member to the exposed portion of the conductive contacts of each lead frame to form a plurality of devices, each device having a sensor member;separating the devices from each other; and partially or fully embedding each substrate within an insulative housing, wherein end portions of the conductive contact extend from the respective insulative housing.

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