Method of manufacturing a security device and security device

Abstract

It is disclosed a method of manufacturing a security device, the method comprising the following steps: providing a substantially flat substrate (2, 16) having a surface and a security element (8, 10, 12) in a second pattern, applying an adhesive (20) in a first pattern onto the surface, wherein the first pattern complements and / or covers the second pattern providing a substantially flat donor element (22), comprising a substrate layer (23) and a transfer layer (25), wherein the transfer layer (25) forms a surface of the donor element (22), laminating the donor element (22) with the substrate (2, 16) to build a laminated compound (26), wherein the transfer layer (25) contacts the adhesive (20), curing the laminated compound (26) for a curing time of at least 12 hours, and removing the substrate layer (23) from the laminated compound (26), leaving the transfer layer (25) only on the first pattern where the adhesive (20) has been applied.

Description

[0001] Method of manufacturing a security device and security device

[0002] The invention relates to a method of manufacturing a security device and to a security device for protecting valuable documents from forgery.

[0003] Security elements to provide a security enhancing effect are typically supported by a substrate, e.g. provided on a surface of a substrate or of a layer or multi-layer supported by the substrate. There is a class of security elements which produce a distinguishing effect in reflection. However, they are opaque in transmission. This allows counterfeiters to peel the security element off the substrate and use it for falsifications. In order to prevent forgery EP 1 254765 Al discloses a way to obfuscate the extension or contour of these security elements such that they cannot be detected in transmission.

[0004] EP 2 209944 Bl discloses a security element which comprises magnetic prints. To obfuscate the security element the magnetic prints are overprinted opaquely using a silver coloured pigment ink. Then, the magnetic prints are invisible in transmission, and a counterfeiter cannot determine the extension or contour of the magnetic prints visually. Due to the reflecting properties of the silver coloured pigment ink, the magnetic prints are even invisible in top view.

[0005] This pigment ink is very expensive. Furthermore a thick layer of the magnetic pigment ink has to be applied to guarantee the desired effect. This adds to the local thickness of the security devices which may become uneven, impair printability in later production and cause problems when stacking the security device.

[0006] It is, therefore, an object of the invention to provide an improved method for manufacturing a security device in which a thin obfuscating layer is applied to obfuscate a security element regarding extension and contour to improve forgery protection.

[0007] The invention is defined by the independent claims. The dependent claims relate to preferred embodiments.

[0008] The invention provides a method for manufacturing a security device. In a first step a substantially flat substrate having a surface and a security element is provided. The substrate can be a paper substrate or a polymer substrate. A polymer substrate is preferably made out of PET, or from other common polymer types. Polymer substrates are preferred because they are more resistant against external (for example physical or chemical) factors than paper substrates. The security element can be e.g. a print, a structured part of the surface, a foil in striped or patched shape or a combination thereof or any other security elements with a security enhancing effect. In embodiments the method includes a step of providing the security element to the substrate.

[0009] In a second step, an adhesive is applied in a first pattern onto the surface of the substrate. The adhesive is applied in a thin layer for example in a printing process, and is preferably a heat-seal lacquer. Most preferably the adhesive consists of 60 to 95% of a solvent like e.g. Ethylacetat, preferably 75 to 85% of the solvent, most preferably 80% of the solvent, and two other components (in case of 80% solvent in a rest of 20%). The first of the two other components is e.g. Permabond from Antala Chemicals, Manchester M34 2QN, United Kingdom, or Teroson from Henkel, 40191 Dusseldorf, Germany, or one of Robond HS37-220, Adcote 545S or Morprime 78HB70APC from Dow Chemical, Midland, Michigan, United States of America, or similar components. The second of the two other components is e.g. a monomeric or polymeric methylene diphenyl isocyanate (MDI), a tolu- ene diisocyanate (TDI), a modified MDI, or Mdi prepolymers. The second of the two other components can be Coreactant F854 from Dow Chemical, Midland, Michigan, United States of America. In the rest-percentage of the adhesive (20% in case of 80% of solvent), the first component is 88% of the composition and the second component is 12% of the composition.

[0010] The first pattern is structured to obfuscate the generally underlying security element by covering or complementing it. The adhesive can be applied onto the then underlying security element which has to be obfuscated. Alternatively or additionally the adhesive can be applied to the other side of the substrate or, if a multi-layer is supported by the substrate, on an inner side of the multi-layer, or between the multi-layer and the substrate. To obfuscate the security element it is necessary that the first pattern of adhesive complements and / or covers the security element, such that a pattern, different from that of the security element, is seen in transparent view. The resulting total pattern obfuscating the security element, can itself provide a security feature, e.g. show a number, a picture, a sign, an ornament, etc.

[0011] In a third step, a donor element is provided. The donor element is substantially flat without any recesses or projections. The donor element comprises a substrate layer and a transfer layer in a layer stack, wherein the transfer layer forms a surface on a side of the donor element. The substrate layer is preferably a PET substrate, or of any other polymer type. The transfer layer is a transferable reflective layer or at least opaque. In cases, where the adhesive covers the security element, the transfer layer has to be 100% opaque; in cases, where the adhesive complements the security element, the transfer layer needs not to be 100% opaque - but to match the opacity of the security element by differing not more than 20%, preferably not more than 5% in opacity. The transfer layer can be made out of aluminium, or other metals like for example chrome, copper, silver or alloys thereof. Preferably the transfer layer is a VMPET metallized polyester film from Dehui Film, Shandong, China 257091, or a metallized PET Film from Dunmore, Bristol, PA 19007, or a metallized Questar® polyester from Filmquest Group, Bolingbrook, IL 60440, or an aluminium metallized polyester foil PLTES SH from Polyplex, Noida, 201301 Gautam Budh Nagar, Uttar Pradesh, India, or a PET metallized foil from Oceanic Foil Pack, 382415, Gujarat, India.

[0012] In a fourth step, the donor element is laminated with the substrate. In this step, the adhesive directly contacts the transfer layer and both get laminated for example in a hot stamping method. Other known lamination methods are possible as well. The resulting product is a laminated compound comprising at least the substrate with the security element, the adhesive and the transfer layer. Between the substrate and the adhesive there are possibly other layers. The donor element is laminated with the substrate of temperature between 70°C and 95°C in the laminating step. Most preferably the laminating step is performed at a temperature between 85°C and 90°C (the lamination nip temperature lies between 75°C and 80°C).

[0013] In a fifth step, the laminated compound rests for a curing time of at least 12 hours. In the resting step, the laminated compound is cured. Hence, the resting step is a curing step. In a preferred embodiment the curing time in which the laminated compound is resting comprises a first period in which the laminated compound is held on a temperature from 35°C to 60°C and a following second period, in which the laminated compound is held at a temperature from 15°C to 28°C. Most preferably the curing time is at least 22 hours. For example the curing time can be 24 hours with a first period in which the laminated compound is held on a temperature from 40°C to 50°C and a fol- lowing second period in which the laminated compound is held at a temperature from 15°C to 28°C (room temperature).

[0014] In a sixth step, the substrate layer of the donor element is removed from the laminated compound. The transfer layer of the donor element, however, remains on the substrate in the first pattern, in which the adhesive was provided on the surface. In the regions where no adhesive is present no transfer layer remains on the substrate. The substrate layer is completely removed. Hence, no substrate layer remains, even not in the first pattern.

[0015] The above described method of manufacturing a security device results in a more thin obfuscating solution of the security element e.g. in transmission mode.

[0016] In a preferred embodiment, a release layer is provided between the substrate layer and the transfer layer in the layer stack of the donor element. The release layer can for example be a wax layer or an oil layer and enables the transfer layer to become transferred to the adhesive more easily.

[0017] In a preferred embodiment, the substrate is a web material. A web material is characterized by its long striped shape used e.g. as raw material in the production process of banknotes. The web material is preferably provided rolled up in a coil. In the method, the web material substrate is rolled off the coil for further processing at a web speed of 35 to 65 m / min, preferably at a web speed of 40 to 60 m / min. Preferably, the above mentioned steps are executed inline, which means that the web material is processed continuously in nonstop operation throughout the steps at the web speed of 35 to 65 m / min, preferably at the web speed of 40 to 60 m / min. Most preferably the web speed is the same in each step. In this inline process every single step is regis- tered to each other steps. Because of this, the production process time is reduced and the costs are significantly lower. Alternatively it is also possible to perform any of the steps offline (in a separate operation).

[0018] In inline operation the step of applying the adhesive is executed at the inline web speed of 35 to 65 m / min.

[0019] In a preferred embodiment the donor element is as well as the substrate a web material. As well as the web material substrate, the web material donor element is preferably provided in a coil where it is rolled up. At the beginning of the third step, the web material donor element is rolled off the coil for further processing at the web speed of 35 to 65 m / min.

[0020] After the lamination step of the web material substrate, the laminated compound is a web material as well and preferably cured by rolling it up in a coil. After the curing step, the web material laminated compound is preferably rolled off the coil for further processing at the above mentioned web speed of 35 to 65 m / min which is preferably the same as in all previous executed steps. Afterwards the substrate layer is removed at the same web speed pulling it off the substrate by the use of means having a force between 30 and 50 N, most preferably between 35 and 45 N. The removement force is applied via a winding roller which is driven by a controlled motor and which winds up the substrate, e.g. on a coil. A user can therefore adapt the removement force manually.

[0021] In a preferred embodiment, the transfer layer is opaque and before the second step, of the security element with a security enhancing effect is provided in a second pattern on the surface of the substrate. Most preferably the secu- rity element is provided in a printing process inline at the above mentioned web material speed.

[0022] The security element can comprise any known security enhancing effect. Most preferably the security element is magnetic. The magnetic security element can be for example a printed magnetic element like a magnetic block which is conventionally used in banknotes establishing a magnetic code. There can be more than one block with the same extension and contour or different extensions and / or contours. The magnetic blocks can comprise the same or different magnetic materials which differ for example in coercitivity. There can be different or mixing magnetic colour prints of two or more magnetic materials as well.

[0023] The first pattern is structured to obfuscate the second pattern by complementing or covering the second pattern such that a third pattern, different from the second pattern is seen, preferably in transparent view. Hence, the extension or the exact position and contour of the second pattern (security element) cannot be seen because it is obfuscated by the first pattern in which the adhesive is covered by the transfer layer to build the laminated compound. In this way, the second pattern is preferably obfuscated in top view as well. The resulting security device is thinner than a conventional security element, which is overprinted by a thick layer of a pigment ink. Obfuscating is preferably ensured in transmission and / or in top view.

[0024] In a preferred embodiment, an optical variable device (OVDs) in form of a stripe or patch is provided on the surface of the substrate. The second step as well as the security element providing step can be performed directly on the surface of substrate so that the OVD lies between the substrate and the adhesive. The OVD is the security element obfuscated. In embodiments, the OVD can be a thin film colour shift layer (tfCS layer) comprising an absorber layer (for example made of chrome), a dielectric layer (for example a SiOxlayer) and a reflective layer (for example an aluminium layer). In other embodiments, the OVD can be a liquid crystal colour shift layer (IcCS layer) comprising liquid crystals and / or an absorber layer (for example a black printing colour or light absorbing microstructures like for example moth eye structures). The OVD can comprise a micro relief (for example a hologram), a micro mirror, a micro prism, matt structures, micro lenses, subwavelength structures, etc. Most preferably micro relief structures and other layers like thin film colour shift layers, liquid crystal colour shift layers, aluminium layers, etc. are combined. In the OVD there can be a so- called negative text, in which the layers of the OVD are partially removed or only provided in parts of the surface. This so-called negative text can be seen by an observer in transparent view. The negative text can have a design of alphanumeric signs, ornaments, symbols or gridded pictures.

[0025] After the sixth step, there can be further processing steps. The web material can be rolled up in a coil where it is stored or transported more easily. In a following step a protective layer can be provided on the surface of the laminated compound (for example a protective lacquer layer or a protective foil). The protective layer protects the laminated compound from negative chemical or physical influence in circulation of a manufactured security device.

[0026] After the sixth step and / or after applying the protective layer onto the laminated compound, the security device can have more functional layers on the surface or on the other side of the substrate. Such layers can be for example fluorescence layers, phosphorescence layers, adhesive layers etc. The functional layers can for example have ultraviolet (UV) luminescence or infrared (IR) features. They can be fluorescent, phosphorescent or a combination thereof. They can have one or two or more colours and they can be separated or overlapping. They can be IR absorbing or IR transparent. They can have one or more different IR materials. Such IR features are e.g. known from EP 4048526 Al and WO 2023 / 285000 Al.

[0027] Another aspect of the invention is providing a security device comprising a substantially flat substrate having a security element and surface, an adhesive layer in a first pattern on the surface and a transfer layer. The transfer layer is bonded by the adhesive to the surface in the first pattern. The transfer layer may be transferred from a transfer layer material laminated to the surface of the substrate comprising the adhesive in the first pattern and pulled off again leaving only the transfer layer in the first pattern.

[0028] After curing the laminated compound, the transfer layer is bonded to the substrate by the adhesive in the first pattern. By pulling off the transfer layer material from the substrate the transfer layer remains bonded to the substrate only in the first pattern of the adhesive. When the substrate and transfer layer material are separated the laminated compound has the transfer layer on top of the adhesive, the borders of the remaining transfer layer show this in a side cut, which looks different from borders of e.g. a cutting process which would produce a clear cut border. The transfer layer is characterized by unsharp edges resulting from tearing the transfer layer off.

[0029] The remaining transfer layer can be characterized as a transfer layer element.

[0030] The security device can be used for copy protection in valuable documents, in particular banknotes, ID documents etc. Additionally the security device can be used for parts of such valuable documents like security threads or security patches.

[0031] Of course, the security device is manufactured by the method for manufacturing a security device with the above-mentioned features or in the above- mentioned embodiments.

[0032] A second pattern of an opaque security element with a security enhancing effect is provided on the surface. Most preferably the security element is magnetic. Preferably the transfer layer is opaque in transparent view. The first pattern is structured to obfuscate the second pattern by complementing or covering the second pattern such that a third pattern different from the second pattern is seen in transparent view. Therefore, the security element cannot shine through the substrate in transparent view and can be invisible in top view as well. Additionally, the transfer layer elements which obfuscate the security element are thinner than known overprinting with metallic pigments.

[0033] In the following, embodiments of the invention are described with reference to enclosed drawings which drawings also may disclose the inventive features. These embodiments serve explanatory purposes only and should not limited the invention. If embodiments comprise a particular combination of elements or components, the description should not be constructed that all of these elements or components are essential to the invention. Other embodiments can, rather, comprise alternative elements or components, less elements or components or additional elements or components. Further, it is possible to combine elements and components of different embodiments. Modifications and refinements described for a particular embodiment can also be applied to other embodiments disclosed. To avoid a necessary repeti- lions, elements corresponding to each other or having the same function and different embodiments may be shown the same reference numeral in different figures and will not be described a second time.

[0034] Fig. 1 shows a schematic drawing of a security device on a valuable document in top view on the front side;

[0035] Fig. 2A-E show examples for covering and complementing transfer layer elements;

[0036] Fig. 3 shows the method of manufacturing the security device;

[0037] Fig. 4 shows a substantially flat donor element provided above a substantially flat substrate after applying an adhesive in a first pattern onto the surface;

[0038] Fig. 5 shows a donor element and the laminated compound after the removing step;

[0039] Fig. 6 shows the laminated compound overprinted with other functional layers;

[0040] Fig. 7 shows the back side of the security device shown in Fig.l.

[0041] Fig. 1 shows a valuable document 1, comprising a substantially flat substrate 2 having a surface, in transparent view onto the front side 4 of the substrate 2. On a security thread 6 a first security element 8, a second security element 10, and a third security element 12 are provided. For obfuscating the security elements 8, 10, 12, a first transfer layer element 14 and a second transfer element 15 are provided on the surface. The transfer layer elements are bonded to the surface of the substrate 2 by an adhesive to form a first area 11 and a second area 13. The first transfer layer element 14 covers the first security element 8 and the second security element 10. The security elements 8, 10 are shown in Fig.l, but in transparent view and preferably in top view as well, an observer cannot see them - he only recognizes the transfer layer element 14 in the first area 11. In cases where the transfer layer element 14 covers the security elements 8, 10, the transfer layer element 14 has to be 100% opaque to ensure an obfuscating effect. As the first area 11 is opaque because of the opaque transfer layer element 14, the security elements 8, 10 are invisible in transparent view.

[0042] The second transfer layer element complements the third security element 12. Hence, parts of the third security element 12 can be seen by an observer in transparent view, other parts cannot. The parts of the third security element 12 which cannot be seen in transparent view are covered by the second transfer layer element 15 so that it complements the security element 12 to build up the area 13 which can be seen in transparent view. In cases, where the second transfer layer element 15 complements the security element 12 the second transfer layer element 15 and the security element 12 must not differ in opacity for more than 20%, preferably for not more than 5%.

[0043] The transfer layer elements 14, 15 cover or complement the security elements 8, 10, 12 such that the area 11, 13, which differs in its contour and / or extension from the security elements 8, 10, 12, is visible in transparent view.

[0044] Not explicit shown in Fig. 1 (as well as in the later shown figures) is the contour of the transfer layer elements 14, 15. As the transfer layer elements 14, 15 are not produced by a cutting process, the transfer layer elements 14, 15 come up with frayed edges resulting from tearing off a transfer layer 25 (the process will later be described in detail). The contour of the transfer layer elements 14, 15 is not clear, it is uneven. Fig. 1 only shows two examples of transfer layer elements 14, 15 covering or complementing the security elements 8, 10, 12. Other possible examples are shown in Fig. 2A-E.

[0045] Fig. 2A shows the first transfer layer element 14 which covers the first security element 8. The first security element has the contour of a rectangle. The first transfer layer element 14 has the contour of a triangle and has a larger extension as the first security element 8, so that the triangle shaped first transfer layer element 14 completely overlaps the first security element 8 in transparent view. Hence, the security element 8 is invisible in transparent view - only the rectangle shape of the first transfer layer element 14 can be seen by an observer in transmission. The same is true for Fig. 2B which shows a rectangle shaped first security element 8 covered by an elliptical shaped first transfer layer element 14.

[0046] The Fig. 2C to Fig. 2E show the first transfer layer element 14 complementing the first security element 8. In transparent view, parts of the first security element 8 are seen in combination with parts of the first transfer layer element 14. Hence, the extension and contour of the first security element 8 is obfuscated by the first transfer layer element 14. In Fig. 2C the rectangle shaped first transfer layer element 14 complements the rectangle shaped first security element 8 to form a contour of a rectangle in transparent view having a higher vertical extension as the first security element 8. The rectangle shaped first security element 8 is complemented by a L-shaped first transfer layer element 14 in Fig. 2D to form a contour of a rectangle in transparent view having a higher vertical and horizontal extension as the first security element 8. In Fig. 2E the first transfer layer element 14 complements the rectangle shaped first security element 8 to Form an "E" in transparent view. The combination of security elements 8, 10, 12 and transfer layer elements 14, 15 is of course not limited to these embodiments. The security element 8, 10, 12 as well as the transfer layer element 14, 15 can have any other shape, e.g. an elliptical shape, the shape of a number, an ornament, a sign, they can form a picture, etc.

[0047] The valuable document 1 shown in Fig. 1 is manufactured by a manufacturing method shown in Fig. 3. The substrate 2 is provided as a web material substrate 16 rolled up in a first coil 18. The web material substrate 16 is preferably made out of a polymer, e.g. PET or any other known polymer type. In a beginning step SO the web material substrate 16 is rolled off the first coil 18 to enable further processing, preferably at a web speed of 35 to 65 m / min, most preferably at a web speed of 40 to 60 m / min.

[0048] In a first step SI the first security element 8 with a security enhancing effect is provided on the surface of the web material substrate 16 in a printing process. Together with the second security element 10 and the third security element 12 it forms pattern on the surface of the substrate 2, e.g. an area with an optical effect, a magnetic code, etc. The security elements 8, 10, 12 are opaque in transparent view. The printing process of the security element 8, 10, 12 directly onto the web material substrate 16, is preferably executed at the web speed of 35 to 65 m / min, which is the same as the web speed in which the web material substrate 16 is provided.

[0049] At least one of the security elements 8, 10, 12 can be magnetic, preferably a magnetic block which is provided in a magnetic printing process. The security elements 8, 10, 12 can have the same or different size. The same or different materials can be used for the security elements 8, 10, 12; they can differ for example in coercitivity or colour. In a second step S2, an adhesive is applied in a printing process as an adhesive layer 20 in a first pattern onto the surface of the web material substrate 16. Preferably the adhesive is a heat-seal lacquer. The adhesive layer 20 is printed onto the substrate at the same web speed of 35 to 65 m / min as the previous steps.

[0050] In a third step S3 a substantially flat donor element is provided as a web material donor element 22 in a second coil 21. The web material donor element 22 comprises a substrate layer 23 and the transfer layer 25, wherein the transfer layer 25 forms the side of the web material donor element 22. The substrate layer 23 is a polymer layer and the transfer layer 25 is a high reflective layer, for example made out of aluminium, chrome, copper, silver or alloys thereof.

[0051] The web material donor element 22 is shown in the upper part of Fig. 4. In Fig. 4 a preferred embodiment of the web material donor element 22 is shown, in which a release layer 27 is provided between the substrate layer 23 and the transfer layer 25 of the web material donor element 22. The release layer 27 can be a wax layer or an oil layer and enables the transfer layer 25 to become transferred more easily. In the method of Fig. 3 there is a release layer 27 provided between the substrate layer 23 and the transfer layer 25 of the web material donor element 22 as well.

[0052] The web material donor element 22 is rolled off the coil 21 for further processing at the above described web speed of 35 to 65 m / min. Hence, the web material donor element 22 is provided at the same web speed as the web material substrate 16. In a fourth step S4 the web material donor element 22 is laminated with the web material substrate 16 in a hot stamping method. Therefore, the web material donor element 22 is guided above the web material substrate 16, as shown in Fig. 4. Fig. 4 in the lower part shows a web material substrate 16 on which the adhesive layer 20 is provided to cover the first security element 8 and the second security element 10. Between the web material substrate 16 and the adhesive layer 20 there are more layers provided. On the surface of the web material substrate 16, an optical variable device (OVD) 36 is applied. The OVD 36 comprises an absorber layer 38, a dielectric layer 40 and a reflective layer 42 in a layer stack. In the OVD 36 a first void 44 and a second void 46 are provided. Between the OVD 36 and the adhesive 20 a further functional layer 48 is applied.

[0053] In the fourth step S4, the adhesive layer 20 is brought in direct contact with the transfer layer 25 by pulling down the web material donor element 22 onto the surface on which the adhesive layer 20 is printed to build a laminated compound 26. The lamination process itself is executed at a temperature between 70°C and 95°C, preferably at a temperature between 85°C and 90°C (the lamination NIP temperature is between 75°C and 85°C).

[0054] In a fifth step S5 the laminated compound 26 is rolled up in a third coil 28 for curing and in a sixth step S6, the laminated compound 26 rests for a curing period of at least 12 hours, preferably at least 22 hours. In the curing step, the laminated compound 26 is held on a first temperature between 35 °C and 60°C in a first period and at a temperature between 15°C and 28°C in a following second period. Most preferably the curing time is 24 hours with a first period in which the laminated compound 26 is held at a temperature between 40°C and 50°C and a following second period in which the laminated compound 26 is held at a temperature between 15°C and 28°C (room temperature).

[0055] In a seventh step, the laminated compound 26 is rolled off the third coil 28 for further processing at the same web speed mentioned above.

[0056] In an eighth step, the substrate layer 23 is removed at the same web speed by rolling it up in a fourth coil 30. The substrate layer 23 is torn off the laminated compound 26 by the use of means having a force between 30 and 50 N, preferably between 35 and 45 N. The force can be adapted by a user.

[0057] Fig. 5 shows the web material substrate 16 (lower part of Fig. 5) and the web material donor element 22 (upper part of Fig. 5) after the removing step S8.

[0058] When removing the substrate layer 23, the transfer layer 25 remains in the first pattern, in which the adhesive layer 20 is printed onto the surface of the substrate 2. In the regions, where no adhesive layer 20 is applied, the substrate layer 23 is completely removed. Hence, no substrate layer 23 remains even in the first pattern in which the adhesive layer 20 is applied. On the web material substrate 16 a stack of the security element 8, the adhesive layer 20 and the transfer layer element 14 is applied (as shown in Fig. 5). In Fig. 3, the resulting compound after step S2 and after step S8 seems not to differ, but they differ. After step S2 only the security element 8 and the adhesive layer 20 are provided on the web material substrate 16. After step S8 the transfer layer element 14 is additionally provided.

[0059] After step S8, the web material donor element 22 comprises a first spacing 50 and a second spacing 52 resulting from tearing the substrate layer 25 off the laminated compound 26. The contours of the transfer layer elements 14, 15 and the voids 50, 52 are not clear, they are uneven having frayed edges.

[0060] In a ninth step, the web material substrate, being provided with the security element 8, the adhesive layer 20 and the transfer layer element 14, is rolled up in a fifth coil 32 for transport or storage issues. In an optional tenth step, there can be further processing methods, e.g. providing a protective layer, printing additional security elements onto the surface, etc.

[0061] Fig. 6 shows the web material substrate shown in Fig. 5 processed in further processing methods. On its surface, further functional layers are provided. E.g. an UV-layer 54 with an optical effect in UV and an IR-layer 56 with an optical effect in IR are provided on the surface. On the surface of the IR-layer 56 a protective layer, a protective layer 58, e.g. a protective foil is applied. The functional layer applied to the protective layer 58 is for example a first heat seal glue layer 60. On the other side of the web material substrate 16 a second heat seal glue layer 62 is applied. Other layer sequences of the layers or other types of functional layers are possible as well.

[0062] Fig. 7 shows the valuable document 1 shown in Fig. 1 in transparent view onto the back side 64 of the substrate 2. The first area 11 and the second area 13 are visible in transparent view as a uniform region. In case of the first area 11 because of the transfer layer element which is 100% opaque and covers the security elements 8, 10. In case of the second area 13 because of opacity of the third security element 12 and the second transfer layer element 15, which is the same or differs not more than 20%, preferably not more than 5%. l i s t o f r e f e r e n c e n u m e r a l s

[0063] 1 valuable document

[0064] 2 substrate

[0065] 4 front side

[0066] 6 security thread

[0067] 8 first security element

[0068] 10 second security element

[0069] 12 third security element

[0070] 14 transfer layer

[0071] 16 web material substrate

[0072] 18 first coil

[0073] 20 adhesive

[0074] 21 second coil

[0075] 22 donor element

[0076] 23 substrate layer

[0077] 25 transfer layer

[0078] 26 laminated compound

[0079] 27 release layer

[0080] 28 third coil

[0081] 30 fourth coil

[0082] 32 fifth coil

[0083] 36 OVD

[0084] 38 absorber layer

[0085] 40 dielectric layer

[0086] 42 reflective layer

[0087] 44 first void

[0088] 46 second void

[0089] 48 further functional layer 50 first spacing

[0090] 52 second spacing

[0091] 54 UV-layer

[0092] 56 IR-layer

[0093] 58 protective layer

[0094] 60 first heat seal glue layer

[0095] 62 second heat seal glue layer

[0096] 64 back side

[0097] 50 starting step

[0098] 51 first step

[0099] 52 second step

[0100] 53 third step

[0101] 54 fourth step

[0102] 55 fifth step

[0103] 56 sixth step

[0104] 57 seventh step

[0105] 58 eighth step

[0106] 59 ninth step

[0107] S10 tenth step

Claims

C l a i m s1. A method of manufacturing a security device, the method comprising the following steps: providing a substantially flat substrate (2, 16) having a surface and a security element (8, 10, 12) in a second pattern, applying an adhesive (20) in a first pattern onto the surface, wherein the first pattern complements and / or covers the second pattern. providing a substantially flat donor element (22), comprising a substrate layer (23) and a transfer layer (25), wherein the transfer layer (25) forms a surface of the donor element (22), laminating the donor element (22) with the substrate (2, 16) to build a laminated compound (26), wherein the transfer layer (25) contacts the adhesive (20), curing the laminated compound (26) for a curing time of at least 12 hours, and removing the substrate layer (23) from the laminated compound (26), leaving the transfer layer (25) only on the first pattern where the adhesive (20) has been applied.

2. The method according to claim 1, characterized in, that the resting time comprises a first period in which the laminated compound (26) is held on a temperature from 35°C to 60°C and a following second period in which the laminated compound (26) is held at a temperature from 15°C to 28°C.

3. The method according to claims 1 or 2, characterized in, that the resting time is at least 22 hours.

4. The method according to one of the above claims, characterized in, that in the removing step (S8), the substrate layer (23) is removed with a force of 35N to 45N.

5. The method according to one of the above claims, characterized in, that the donor element (22) is laminated with the substrate (2, 16) at a temperature between 70°C and 95°C in the laminating step (S4).

6. The method according to one of the above claims, characterized in, that the substrate (16) is a web material.

7. The method according to one of the above claims, characterized in, that the donor element (22) is a web material.

8. The method according to claims 6 or 7, characterized in, that the adhesive (20) is applied as a layer in a printing process with a web speed of 35 to 65 m / min in the applying step.

9. The method according to one of the above claims, characterized in, that in the resting step (S6), the laminated compound (26) is rolled up in a coil (28).

10. The method according to one of the claims 6 to 9, characterized in, that the substrate layer (23) is removed with a web speed of 35 to 65 m / min in the removing step (S8).

11. The method according to one of the claims 6 to 10, characterized in, that the steps (SO - S10) are executed inline, wherein the web material substrate (16) is processed continuously in non-stop operation.

12. The method according to one of the above claims, characterized in, that the transfer layer (25) and the security element (8, 10, 12) are both opaque in transparent view.

13. The method according to any of the above claims, characterized in, that the security element (8, 10, 12) is magnetic.

14. The method according to any of the above claims, characterized in, that the first pattern is structured to obfuscate the second pattern by complementing or covering the second pattern such that a third pattern (11, 13), different from the second pattern is seen in transparent view and / or reflection.

15. A security device comprising: a substantially flat substrate (2, 16) having a surface, and a security element (8, 10, 12) in a second pattern an adhesive (20) in a first pattern on the surface, wherein the first pattern complements and / or covers the second pattern, and transfer layer elements (14, 15) bonded by the adhesive (20) to the surface in the first pattern, wherein the transfer layer elements (14, 15) were transferred from a transfer layer (25) laminated to the surface of the substrate (2, 16) comprising the adhesive (20) in the first pattern and torn off again leaving only the transfer layer elements (14, 15) in the first pattern.

16. The security device according to claim 15, characterized in, that the transfer layer (25) and the security element (8, 10, 12) are both opaque in transparent view.

17. The security device according to claim 16, characterized in, that the security element (8, 10, 12) is magnetic.

18. The security element according to claims 15, 16 or 17, characterized in, that the first pattern is structured to obfuscate the second pattern by complementing or covering the second pattern such that a third pattern (11, 13) different from the second pattern is visible in transparent view and / or reflection.

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