A manipulator for optoelectronic devices and a method for manipulating such devices.

Abstract

The invention relates to a manipulation element (3) of an optoelectronic device (1) capable of emitting light in a first wavelength range, said manipulation element (3) comprising a body having a selection layer (11) made up of a photosensitive element configured to change state locally when subjected to light radiation included in the first wavelength range.The invention also relates to a method of manipulating an optoelectronic device (1) comprising: a step (E4) of applying the selection layer (11) on the manipulation member (3) and / or on at least one optoelectronic device (1); a step (E5) of bringing the manipulation member (3) into contact with the optoelectronic device (1) at the level of the selection layer (11); a step (E8) of supplying the optoelectronic device (1) with electrical energy, allowing the separation of the selection layer (11) and the optoelectronic device (1); Figure 6.

Description

Title of the invention: Organ for manipulating optoelectronic devices and method for manipulating such devices. Technical field of the invention

[0001] The present invention relates to a member for manipulating at least one optoelectronic device.

[0002] The invention also relates to a method of manipulating such an optoelectronic device. State of the art

[0003] In the field of luminous display screens, the luminous elements constituting the screen must be arranged in a matrix manner in an increasingly precise manner as the resolution of the screens increases. These luminous elements each comprise at least one light-emitting diode and are organized in the form of a multi-colored pixel or in the form of a monochrome sub-pixel.

[0004] It is known to produce light-emitting diodes on an initial support in the form of a silicon or sapphire substrate and to transfer them to a receiving support different from the initial support and intended to constitute, after this transfer, the luminous display screen.

[0005] The transfer of a large quantity of light-emitting diodes between the initial support and the screen substrate raises many technical challenges. Indeed, the selection of a large number of diodes following a determined spacing at very small distances is complex and sometimes involves the use of techniques such as thermocompression which can lead to deterioration of the light-emitting diodes. Furthermore, diodes can be naturally damaged in the general manufacturing process. Mass transfer therefore sometimes involves the transfer of previously damaged diodes which are deposited on the screen and constitute black spots on the final device.

[0006] To solve this problem, it is possible to repair or replace the defective diodes. Although this method can reduce the number of black spots, it involves additional manufacturing steps, which can increase costs and is tedious to implement.

[0007] Object of the invention

[0008] The present invention aims to propose a solution which responds to all or part of the aforementioned problems.

[0009] This aim can be achieved by implementing a manipulation member capable of manipulating at least one optoelectronic device capable of emitting light in a first wavelength range, said manipulation member comprising a body having a contact surface, and a selection layer deposited on said contact surface, the selection layer consisting of a photosensitive element, said photosensitive element being configured to change state locally when it is subjected to light radiation included in the first wavelength range, so as to vary between a first state in which the selection layer of the manipulation member adheres to the optoelectronic device, and a second state in which the selection layer of the manipulation member does not adhere to the optoelectronic device.

[0010] The previously described arrangements make it possible to provide a manipulation member configured to move optoelectronic devices via the selection layer. The selection layer can also be removed when it is illuminated by the optoelectronic device.

[0011] By “change of state” is meant a physical or chemical phenomenon which induces a structural or conformational change of the photosensitive element. For example, the change of state may correspond to a softening or hardening of the photosensitive element, or a change in solubility. The change of state may also correspond to a phase change of the photosensitive element. Thus, the photosensitive element may be configured to become liquid, or alternatively solid, or alternatively gaseous when it is subjected to light radiation included in the first wavelength range, that is to say in particular when the optoelectronic device emits light. Alternatively, the photosensitive element may be configured to become labile when it is subjected to light radiation included in the first wavelength range, that is to say in particular when the optoelectronic device emits light.Synergistically, if an optoelectronic device does not emit light, for example if it is damaged, it will not be able to emit light radiation in the first wavelength range, and therefore will not be able to change state of the selection layer.

[0012] The manipulation member may further have one or more of the following characteristics, taken alone or in combination.

[0013] According to one embodiment, the photosensitive element is a molecular glue.

[0014] According to one embodiment, the photosensitive element is a photosensitive polymer. In this case, the change of state may include a change in solubility, either by partial or total polymerization, or by partial or total depolymerization, or by other mechanisms such as photocleavage, photoaddition, fragmentation, or other.

[0015] According to one embodiment, the second state is a liquid or labile state.

[0016] According to one embodiment, the contact surface of the body has studs of contact intended to be brought into contact with said at least one optoelectronic device via the selection layer.

[0017] According to one embodiment, the contact pads are distributed over the contact surface according to a predetermined spacing corresponding to a spacing between two optoelectronic devices arranged on a sampling substrate.

[0018] According to one embodiment, the manipulation member comprises at least one cooperation notch having a shape allowing the optoelectronic device to be fitted, or having a shape complementary to the optoelectronic device. In this case, the manipulation member is configured to be able to fit with the optoelectronic device.

[0019] According to one embodiment, the manipulation member comprises a plurality of cooperation notches separated from each other by the predetermined spacing.

[0020] According to one embodiment, the predetermined spacing is defined as the spacing separating two optoelectronic devices on a receiving substrate receiving the optoelectronic devices after manipulation from the sampling substrate by means of the manipulation member, in particular a substrate for a luminous display screen. For example, the predetermined spacing may be between 50 μm and 2 mm, and more particularly substantially equal to 100 μm.

[0021] According to one embodiment, the manipulation member may comprise electronic tracks intended to be electrically connected with at least one electrode included in the optoelectronic device. For example, said at least one electrode may be a transparent conductive electrode (TCO) arranged on a functional surface of the optoelectronic device, or an interconnection pad intended to be placed in contact with electronic connections arranged on the sampling substrate or the receiving substrate. Thus, and advantageously, the manipulation member may supply electrical energy to each optoelectronic device with which it is connected via the electronic tracks. In the case where the photosensitive element is a molecular glue, said supply of the optoelectronic device by the manipulation member may advantageously be carried out through the photosensitive element.

[0022] According to one embodiment, the first wavelength range is between 190 nm and 2000 nm, more particularly between 365 nm and 800 nm, and is in particular substantially equal to 420 nm or substantially equal to 450 nm.

[0023] According to one embodiment, the optoelectronic device may comprise an electroluminescent element comprising at least one light-emitting diode (LED) capable of emitting and / or capturing light, and possibly an electronic control component associated with said at least one light-emitting diode, such as for example a transistor. In particular, each diode may comprise a first doped part intended to be brought into contact with a first electrode, a second doped part intended to be brought into contact with a second electrode, and an active part capable of changing state when an external parameter external to the active part is applied to the active part, the external parameter being able for example to consist of the application of a current. The electronic control component is in particular capable of influencing at least one external parameter associated with the active part. The electronic control component may for example be capable of modulating at least one emission parameter relating to the light radiation likely to be emitted by the active part.

[0024] According to one embodiment, the photosensitive element may comprise an organic polymer belonging to the family of polythiophenes, or certain derivatives of meta-crylates, or belonging to the family of acrylamides, siloxanes, poly-phenylenes, polystyrenes, polyvinyls, coordination polymers, or equivalent. Generally, the photosensitive polymer can be associated with a suitable photoinitiator such as DNQ (diazonaphthoquinone), ruthenium, iridium zinc complexes (RuBPy3-Tris(2,2'-bipyridine) Ruthenium-, IrPPy3 -Tris(2-phenylpyridine) Iridium, ZnTPP -Zinc Tetraphenylporphyrin-), organic fluorophore derivatives capable of forming a radical such as eosin, MPP (1-methyl-pyridinium phenyl), OBN (2-benzoylmethylenequinoline difluo-roborate), DTC (7-(dimethylamino)-4,5-dihydronaphtho-thiophene-2-car-baldehyde), BODIPY (boron-dipyrromethene) derivatives, carbazole derivatives or equivalent.

[0025] According to one embodiment, the photosensitive element may be a positive resin such as siloxane resins, or polymethacrylates.

[0026] According to one embodiment, the photosensitive element may comprise a photoinitiator configured to harden the photosensitive element or to depolymerize it when it is subjected to light radiation included in the first wavelength range.

[0027] The aim of the invention can also be achieved by implementing a method for manipulating at least one optoelectronic device from a sampling substrate, said at least one optoelectronic device being capable of emitting light radiation included in a first wavelength range when it is supplied with electrical energy, the manipulation method comprising:

[0028] - a step of providing the sampling substrate on which the at least one optoelectronic device is arranged; - a step of providing a handling member comprising a body having a contact surface; - a step of applying a selection layer to at least one element chosen from the group comprising said contact surface of the manipulation member and the at least one optoelectronic device, the selection layer consisting of a photosensitive element, said photosensitive element being configured to change state locally when it is subjected to light radiation included in the first wavelength range; - a step of bringing the manipulation member into contact with said at least one optoelectronic device at the selection layer, so as to cause the manipulation member to adhere to the optoelectronic device; - a step of supplying said at least one optoelectronic device with electrical energy, involving the emission of light radiation in the first wavelength range and the local change of state of the selection layer allowing the separation of the selection layer and the emitting optoelectronic device.

[0029] The arrangements described above make it possible to propose a method for manipulating optoelectronic devices. The presence of the selection layer makes it possible in a first case to make the manipulation member adhere to the optoelectronic device, and in a second case to allow the separation of the optoelectronic device and the manipulation member.

[0030] By “change of state” is meant a physical or chemical phenomenon which induces a structural or conformational change of the photosensitive element. For example, the change of state may correspond to a softening or hardening of the photosensitive element, or a change in solubility. The change of state may also correspond to a phase change of the photosensitive element. Thus, the photosensitive element may be configured to become liquid, or alternatively solid, or alternatively gaseous when it is subjected to light radiation included in the first wavelength range, that is to say in particular when the optoelectronic device emits light. Alternatively, the photosensitive element may be configured to become labile when it is subjected to light radiation included in the first wavelength range, that is to say in particular when the optoelectronic device emits light.Synergistically, if an optoelectronic device does not emit light, for example if it is damaged, it will not be able to emit light radiation in the first wavelength range, and will therefore not be able to change state of the selection layer. The photosensitive element may further be configured to become liquid, or alternatively solid, or alternatively gaseous when it is subjected to light radiation in the first wavelength range, that is to say in particular when the optoelectronic device emits light. Alternatively, the photo element. sensitive may be configured to become labile when subjected to light radiation in the first wavelength range, i.e. in particular when the optoelectronic device emits light. Synergistically, if an optoelectronic device does not emit light, for example if it is damaged, it will not be able to emit light radiation in the first wavelength range, and will therefore not be able to change state of the selection layer. In this way, the manipulation method makes it possible to select defective optoelectronic devices on the surface of a screen substrate or those intended to emit light characterized by a wavelength which is not included in the first wavelength range.

[0031] The manipulation method may further have one or more of the following characteristics, taken alone or in combination.

[0032] According to one embodiment, the handling method comprises a step of removing the handling member, in which the handling member is separated from the sampling substrate.

[0033] According to one embodiment, the contacting step may comprise the application of a chemical or optical activation so as to increase the adhesion of the selection layer with the manipulation member and / or with the optoelectronic device. Thus, it may be provided that the implementation of an optical activation is carried out by the emission of light radiation included in a second wavelength range strictly different from the first wavelength range.

[0034] According to one embodiment, the handling method comprises a transfer phase from the sampling substrate to a receiving substrate, in particular a substrate for a display screen, implemented after the step of bringing the handling member into contact, said transfer phase comprising:

[0035] - a step of detaching said at least one optoelectronic device from the sampling substrate, in particular by mechanical traction applied to the body of the handling member; and - a positioning step in which the contact surface of the handling member is positioned opposite a receiving surface of the receiving substrate.

[0036] According to one embodiment, the positioning step is implemented so that the contact surface of the manipulation member is positioned opposite a receiving surface of the receiving substrate, in a relative position such that the optoelectronic devices are in contact with the receiving surface of the receiving substrate.

[0037] According to one embodiment, the transfer phase is implemented before the step power supply of the electronic device.

[0038] According to one embodiment, the transfer phase is implemented after the step of powering the electronic device.

[0039] According to one embodiment, the step of supplying electrical energy to the optoelectronic device is carried out before the step of detaching said at least one optoelectronic device from the sampling substrate.

[0040] According to one embodiment, the step of supplying electrical energy to the optoelectronic device makes it possible to place the optoelectronic device selectively in an emission mode in which it emits light radiation in the first wavelength range and in an extinction mode in which it does not emit light radiation.

[0041] According to one embodiment, the sampling substrate comprises a plurality of optoelectronic devices, each optoelectronic device of the plurality of optoelectronic devices being able to be individually supplied with electrical energy.

[0042] According to one embodiment, the step of providing the sampling substrate comprises providing a light-emitting screen substrate comprising a plurality of optoelectronic devices distributed over an emission surface of the screen substrate, the emission surface of the screen substrate comprising electronic connections configured to enable each optoelectronic device of the plurality of optoelectronic devices to be individually powered, in particular during the electrical power supply step.

[0043] According to one embodiment, the handling member comprises electronic tracks configured to enable each optoelectronic device of the plurality of optoelectronic devices to be individually powered, in particular during the electrical energy supply step.

[0044] In this way, it is possible to individually power the optoelectronic devices so as to change the state of the selection layer. In other words, it is possible to selectively release each optoelectronic device from contact with the manipulation member. Thus, the arrangements described above make it possible to individually select the optoelectronic devices to be manipulated with the manipulation member. For example, this can make it possible to remove only certain predetermined optoelectronic devices from the surface of the screen substrate.

[0045] According to one embodiment, the step of supplying electrical energy is implemented selectively on one or more of the optoelectronic devices of the plurality of optoelectronic devices.

[0046] In other words, the electrical power supply step can be applied selectively to a set of optoelectronic devices selected from the plurality of optoelectronic devices, the number of optoelectronic devices in this set being greater than or equal to 1.

[0047] According to one embodiment, the step of supplying electrical energy is implemented on optoelectronic devices arranged relative to each other at a predetermined distance, in particular between 50 μm and 2 mm.

[0048] According to one embodiment, the manipulation method comprises a step of chemical treatment of the contact surface of the manipulation member to increase the chemical affinity of the manipulation member with the photosensitive element constituting the selection layer.

[0049] According to one embodiment, the chemical treatment step comprises exposing the contact surface to a plasma comprising dioxygen to generate hydroxyl bonds.

[0050] According to one embodiment, the chemical affinity may come from electrostatic interactions, or from hydrophilic / hydrophobic interactions.

[0051] According to one embodiment, the chemical treatment step may comprise starting a polymerization reaction.

[0052] According to one embodiment, the step of removing the handling member may comprise a step in which the handling member is separated from the receiving substrate.

[0053] According to one embodiment, the step of removing the manipulation member can be implemented in a configuration where the manipulation member is arranged below the optoelectronic device in the direction of gravity. In this way, when the photosensitive element is in the second state, and in particular if it is in a liquid, gaseous or labile state, it detaches from the optoelectronic device by simple gravity. In this way, the photosensitive element is detached from the optoelectronic device by gravity, making it possible not to leave any residual material on the optoelectronic device during the step of removing the manipulation member.

[0054] Brief description of the drawings

[0055] Other aspects, aims, advantages and characteristics of the invention will appear better on reading the following detailed description of preferred embodiments thereof, given by way of non-limiting example, and made with reference to the appended drawings in which:

[0056] [Fig-1] [Fig.l] is a schematic view of certain steps in the mani process pulation according to a particular embodiment of the invention.

[0057] [Fig.2] [Fig.2] is a schematic view of certain steps in the mani process pulation according to a particular embodiment of the invention.

[0058] [Fig.3] [Fig.3] is a schematic view of certain steps in the handling process- pulation according to a particular embodiment of the invention.

[0059] [Fig.4] [Fig.4] is a schematic view of certain steps in the mani process pulation according to a particular embodiment of the invention.

[0060] [Fig.5] [Fig.5] is a schematic view of certain steps in the mani process pulation according to a particular embodiment of the invention.

[0061] [Fig.6] [Fig.6] is a schematic view of certain steps in the mani process pulation according to a particular embodiment of the invention. Detailed description

[0062] In the figures and in the remainder of the description, the same references represent identical or similar elements. In addition, the different elements are not shown to scale so as to enhance the clarity of the figures. Furthermore, the different embodiments and variants are not mutually exclusive and can be combined with each other.

[0063] As illustrated in Figures 1 to 6, the invention firstly relates to a manipulation member 3 capable of manipulating at least one optoelectronic device 1 capable of emitting light in a first wavelength range, and also to a method for manipulating such an optoelectronic device 1 from a sampling substrate 9. In general, the optoelectronic device 1 is intended to be fixed on a receiving face of a receiving substrate 19, such as for example a substrate for a luminous display screen, in particular by means of a surface distribution of a plurality of such optoelectronic devices 1 on all or part of the free surface of the receiving face. In general, and as shown in Figures 1 to 3, each optoelectronic device 1 can be attached to the sampling substrate 9 by means of an adhesion layer 2. Alternatively, and as shown in [Fig.5], the optoelectronic devices 1 can be simply deposited on the sampling substrate 9, for example constituted by a sampling tray. The optoelectronic devices 1 can have at least one interconnection pad 4 intended to cooperate with electronic connections 20 arranged on the surface of the receiving substrate 19. For example, each interconnection pad 4 can be intended to be soldered to an electronic connection 20. Alternatively, the interconnection pads 4 can be intended to cooperate with electronic tracks 21 included on the handling member 3, so that the handling member 3 can supply electrical energy to the optoelectronic devices 1 to which it is electrically connected.

[0064] According to one embodiment, the optoelectronic device 1 may comprise an electroluminescent element comprising at least one light-emitting diode (LED) capable of emitting and / or capturing light, and possibly an electronic component electronic control component associated with said at least one light-emitting diode, such as for example a transistor. In particular, each diode may comprise a first doped part intended to be brought into contact with a first electrode, a second doped part intended to be brought into contact with a second electrode, and an active part capable of changing state when an external parameter external to the active part is applied to the active part, the external parameter being able for example to consist of the application of a current. The electronic control component is in particular capable of influencing at least one external parameter associated with the active part. The electronic control component may for example be capable of modulating at least one emission parameter relating to the light radiation likely to be emitted by the active part.

[0065] With reference to [Fig. 1], the manipulation member 3 comprises a body having a contact surface S2 on which is deposited a selection layer 11 consisting of a photosensitive element. The body may in particular have contact pads 5 at the contact surface S2, intended to be brought into contact with said at least one optoelectronic device 1 via the selection layer 11. The contact pads 5 may be distributed over the contact surface S2 according to a predetermined spacing DI corresponding to a spacing between two optoelectronic devices 1 arranged on a sampling substrate 9.

[0066] According to another embodiment not shown, the manipulation member 3 comprises at least one cooperation notch having a shape allowing the optoelectronic device 1 to be fitted, or having a shape complementary to the optoelectronic device 1. In this case, the manipulation member 3 is configured to be able to fit with the optoelectronic device 1. For example, the manipulation member 3 may comprise a plurality of cooperation notches separated from each other by the predetermined spacing DI.

[0067] It may in particular be provided that the predetermined spacing DI is defined as the spacing separating two optoelectronic devices 1 on a receiving substrate 19 receiving the optoelectronic devices 1 after manipulation from the sampling substrate 9 by means of the manipulation member 3, in particular a substrate for a luminous display screen. For example, the predetermined spacing DI may be between 50 μm and 2 mm, and more particularly substantially equal to 100 μm.

[0068] According to one embodiment, the manipulation member 3 may comprise electronic tracks 21 intended to be electrically connected with at least one electrode included in the optoelectronic device 1. For example, said at least one electrode may be a transparent conductive electrode (TCO) arranged on a functional surface SI of the optoelectronic device 1, or one of the pads interconnection 4 provided to be brought into contact with the electronic connections 20 arranged on the sampling substrate 9 or the receiving substrate 19. Thus, and advantageously, the handling member 3 can supply electrical energy to each optoelectronic device 1 with which it is connected via the electronic tracks 21. In the case where the photosensitive element is a molecular glue, said supply of the optoelectronic device 1 by the handling member 3 can be carried out through the photosensitive element. Thus, and advantageously, the photosensitive element is not likely to produce light interference, or interact with the light radiation generated by the optoelectronic device 1.

[0069] As indicated previously, the selection layer 11 is made up of the photosensitive element, said photosensitive element being configured to change state locally when it is subjected to light radiation included in a first wavelength range, so as to vary between a first state in which the selection layer 11 of the manipulation member 3 adheres to the optoelectronic device 1, and a second state in which the selection layer 11 of the manipulation member 3 does not adhere to the optoelectronic device 1.

[0070] By “change of state” is meant a physical or chemical phenomenon which induces a structural or conformational change of the photosensitive element. For example, the change of state may correspond to a softening or hardening of the photosensitive element. The change of state may also correspond to a phase change of the photosensitive element. Thus, the photosensitive element may be configured to become liquid, or alternatively solid, or alternatively gaseous when it is subjected to light radiation in the first wavelength range, that is to say in particular when the optoelectronic device 1 emits light. Alternatively, the photosensitive element may be configured to become labile when it is subjected to light radiation in the first wavelength range, that is to say in particular when the optoelectronic device 1 emits light.Synergistically, if an optoelectronic device 1 does not emit light, for example if it is damaged, it will not be able to emit light radiation at the first wavelength range, and will therefore not be able to change state of the selection layer 11.

[0071] According to another embodiment, the photosensitive element may comprise a photosensitive polymer. In this case, the change of state may also comprise a change in solubility, either by partial or total polymerization, or by partial or total depolymerization, or by other mechanisms such as photocleavage, photoaddition, fragmentation, or the like. For example, the photosensitive element may be a positive resin such as siloxane resins, polymethacrylates, or a family of polymers exhibiting a radical polymerization mechanism or RAFT (Reversible Addition-Fragmentation chain Transfer) type, or other polymers such as acrylamides or polyphenylenes.

[0072] According to one embodiment, the photosensitive polymer may comprise a photoinitiator configured to harden the photosensitive polymer or to depolymerize it when it is subjected to light radiation included in the first wavelength range. In particular, the first wavelength range may be between 190 nm and 2000 nm, more particularly between 365 nm and 800 nm and is in particular substantially equal to 420 nm or substantially equal to 450 nm.

[0073] The arrangements described above make it possible to propose a handling member 3 configured to move optoelectronic devices 1 via the selection layer 11. The selection layer 11 can also be removed when it is illuminated by the optoelectronic device 1.

[0074] As indicated previously, the invention also relates to a method for handling at least one optoelectronic device 1 from a sampling substrate 9, and preferably intended to be fixed on a receiving face of a receiving substrate 19, such as for example a substrate for a luminous display screen, by being distributed over all or part of the free surface of the receiving face.

[0075] With reference to [Fig. 1], the handling method comprises a step E1 of providing the sampling substrate 9 on which the at least one optoelectronic device 1 is arranged. For example, the sampling substrate 9 may comprise a plurality of optoelectronic devices 1 arranged on the surface of the sampling substrate 9 according to a first spacing DI. According to a non-limiting variant, the optoelectronic devices 1 may have dimensions of between 1 μm and 1 mm. Furthermore, the distance between optoelectronic devices 1 on the receiving face of the receiving substrate 19 is between 1 μm and 2 mm. Each optoelectronic device 1 has a functional surface SI and is capable of emitting light radiation within a first wavelength range via this functional surface SI when it is supplied with electrical energy.

[0076] The handling method also comprises a step E2 of providing a handling member 3 comprising a body having a contact surface S2, for example of the type of one of those described previously. Subsequently, a step E3 of chemical treatment of the contact surface S2 of the handling member 3 can be implemented to increase the chemical affinity of the handling member 3 with a photosensitive element configured to form a selection layer 11 during a step E4 of applying a selection layer 11. Alternatively or jointly, the step E3 of chemical surface treatment can be applied to the functional surface S1 of the optoelectronic device 1. According to a first variant non-limiting, the chemical treatment step E3 comprises exposing the contact surface S2 or the functional surface S1 to a plasma comprising dioxygen to generate hydroxyl bonds. According to a second non-limiting variant, the chemical affinity may come from electrostatic interactions, hydrophilic / hydrophobic interactions, Van der Waals interactions, or any type of weak or strong interaction. Finally, according to a third non-limiting variant, the chemical treatment step E3 may comprise starting a polymerization reaction, comprising for example the formation of radicals on the surface, to initiate the polymerization reaction.

[0077] The method then comprises said step E4 of applying the selection layer 11 to at least one element chosen from the group comprising said contact surface S2 of the manipulation member 3 and the at least one optoelectronic device 1. The selection layer 11 consists of a photosensitive element configured to change state locally when it is subjected to light radiation in the first wavelength range.

[0078] In the same way as previously, by “change of state” is meant a physical or chemical phenomenon which induces a structural or conformational change of the photosensitive element constituting the selection layer 11. For example, the change of state may correspond to a softening or a hardening of the photosensitive element. The change of state may also comprise a change in solubility either by partial or total depolymerization, or by other mechanisms such as photocleavage, photo addition, fragmentation, or other. The change of state may also correspond to a phase change of the photosensitive element. Thus, the photosensitive element may be configured to become liquid when it is subjected to light radiation at the first wavelength range, that is to say in particular when the optoelectronic device 1 emits light.Alternatively, the photosensitive element may be configured to become labile when subjected to light radiation at the first wavelength range, i.e. in particular when the optoelectronic device 1 emits light.

[0079] With reference to [Fig. 2], the manipulation member 3 is secured to the optoelectronic device 1 during a step E5 of bringing the manipulation member 3 into contact with said at least one optoelectronic device 1 at the selection layer 11. In this way the manipulation member 3 adheres to the optoelectronic device 1. Advantageously, the contacting step E5 may comprise the application of a chemical or optical activation so as to increase the adhesion of the selection layer 11 with the manipulation member 3 and / or with the optoelectronic device 1. Thus, it may be provided that the implementation optical activation is carried out by the emission of light radiation included in a second wavelength range strictly different from the first wavelength range.

[0080] As illustrated in [Fig. 3], the handling method may comprise a phase of transferring the optoelectronic device from the sampling substrate 9 to a receiving substrate 19, in particular a substrate for a display screen. This transfer phase may be implemented after step E5 of bringing the handling member 3 into contact.

[0081] The transfer phase may firstly comprise a step E6 of detaching said at least one optoelectronic device 1 from the sampling substrate 9, in particular by mechanical traction applied to the body of the handling member 3. Then, the transfer phase may comprise a positioning step E7 in which the contact surface S2 of the handling member 3 is positioned opposite a receiving surface of the receiving substrate 19, for example in a relative position such that the optoelectronic devices 1 are in contact with the receiving surface of the receiving substrate 19. The positioning step E7 may in particular comprise the cooperation of each interconnection pad 4 with electronic connections 20 arranged on the surface of the receiving substrate 19, for example by soldering.Advantageously, alignment elements, such as for example alignment marks associated with optical devices or lasers, may be provided to allow the optoelectronic devices 1 to be placed on the receiving face of the receiving substrate 19.

[0082] With reference to Figures 4 to 6, the manipulation method further comprises a step E8 of supplying said at least one optoelectronic device 1 with electrical energy, involving the emission of light radiation in the first wavelength range and the change of local state of the selection layer 11 allowing the separation of the selection layer 11 and the emitting optoelectronic device 1. Generally, the supply step E8 is implemented after the contacting step E5.

[0083] According to a first variant shown in [Fig. 4], the step E8 of supplying electrical energy to the optoelectronic device 1 is implemented after the transfer phase. In this case, during the step E6 of detaching said at least one optoelectronic device 1 from the sampling substrate 9, all the optoelectronic devices 1 are detached from the sampling substrate 9.

[0084] According to a second variant shown in [Fig. 5], the step E6 of detaching said at least one optoelectronic device 1 from the sampling substrate 9 can be implemented after the power supply step E8. According to this first variant, the step E8 of powering the optoelectronic device with electrical energy 1 is therefore implemented before the transfer phase. In this case, during step E6 of detaching said at least one optoelectronic device 1 from the sampling substrate 9, only the optoelectronic devices 1 that have not emitted light radiation in the first wavelength range are detached from the sampling substrate 9. Thus, the handling method makes it possible to remove from the sampling substrate 9 the optoelectronic devices 1 that do not emit, such as the defective optoelectronic devices 1. Alternatively, the handling method makes it possible to remove from the sampling substrate 9 the optoelectronic devices 1 that emit light radiation that is not included in the first wavelength range. Thus, the optoelectronic devices 1 detached during the detachment step E6 are not transferred during the transfer phase but are simply removed because these optoelectronic devices 1 do not work..

[0085] According to a third variant shown in [Fig. 6], the sampling substrate 9 may comprise a plurality of optoelectronic devices 1, where each optoelectronic device 1 of the plurality of optoelectronic devices 1 may be individually supplied with electrical energy. For example, the step E1 of providing the sampling substrate 9 may comprise the provision of a light-emitting screen substrate comprising a plurality of optoelectronic devices 1 distributed over an emission surface of the screen substrate, the emission surface of the screen substrate may advantageously have electronic connections 20 configured to enable each optoelectronic device 1 of the plurality of optoelectronic devices 1 to be individually supplied.In particular, the step E8 of supplying electrical energy to the optoelectronic device 1 can make it possible to place the optoelectronic device 1 selectively in an emission mode in which it emits light radiation in the first wavelength range and in an extinction mode in which it does not emit light radiation. In this way, it is possible to supply the optoelectronic devices 1 individually so as to change state of the selection layer 11. The step E8 of supplying electrical energy can therefore be implemented selectively on one or more of the optoelectronic devices 1 of the plurality of optoelectronic devices 1.

[0086] Regardless of the embodiment implemented, the arrangements described above make it possible to selectively release each optoelectronic device 1 from contact with the handling member 3. Thus, it is possible to individually select the optoelectronic devices 1 to be handled with the handling member 3. For example, this can make it possible to remove only certain predetermined optoelectronic devices 1 from the surface of the sampling substrate. For example, the step E8 of supplying electrical energy can be applied selectively to a set of optoelectronic devices 1 selected from the plurality of optoelectronic devices, the number of optoelectronic devices 1 of this set being greater than or equal to 1. For example, step E8 of supplying electrical energy can be implemented on optoelectronic devices 1 arranged relative to each other at a predetermined distance, in particular between 50 pm and 2 mm.

[0087] Finally, the handling method comprises a step E9 of removing the handling member 3, in which the handling member 3 is separated from the sampling substrate 9, or from the receiving substrate 19.

[0088] The arrangements described above make it possible to propose a method for handling optoelectronic devices 1. The presence of the selection layer 11 makes it possible in a first case to make the handling member 3 adhere to the optoelectronic device 1, and in a second case to allow the separation of the optoelectronic device 1 and the handling member 3. Advantageously, the photosensitive element is configured to become labile when it is subjected to light radiation included in the first wavelength range, that is to say in particular when the optoelectronic device 1 emits light.

[0089] Thus, the handling method can make it possible to carry out a transfer of an optoelectronic device 1 from a sampling substrate 9 to a receiving substrate 19, such as a screen substrate or a test substrate, thanks to a reversible adhesion between the handling member 3 and the optoelectronic device 1 via the selection layer 11.

[0090] Alternatively, the handling method may make it possible to remove from a sampling substrate 9, such as a screen substrate or a test substrate, optoelectronic devices 1 not emitting light radiation in the first wavelength range. This may in particular make it possible to remove defective optoelectronic devices 1 from a sampling substrate 9.

Claims

Claims

1. A handling member (3) capable of handling at least one optoelectronic device (1) capable of emitting light in a first wavelength range, said handling member (3) comprising a body having a contact surface (S2), and a selection layer (11) deposited on said contact surface (S2), the selection layer (11) consisting of a photosensitive element, said photosensitive element being configured to change state locally when it is subjected to light radiation included in the first wavelength range, so as to vary between a first state in which the selection layer (11) of the handling member (3) adheres to the optoelectronic device (1), and a second state in which the selection layer (11) of the handling member (3) does not adhere to the optoelectronic device (1).

2. Manipulation member (3) according to claim 1, in which the contact surface (S2) of the body has contact pads (5) intended to be brought into contact with said at least one optoelectronic device (1) via the selection layer (11).

3. Handling member (3) according to claim 2, in which the contact pads (5) are distributed on the contact surface (S2) according to a predetermined spacing (Dl) corresponding to a spacing between two optoelectronic devices (1) arranged on a sampling substrate (9).

4. Manipulation member (3) according to any one of claims 1 to 3, in which the first wavelength range is between 190 nm and 2000 nm, more particularly between 365 nm and 800 nm, and is in particular substantially equal to 420 nm or substantially equal to 450

5. nm. Method for manipulating at least one optoelectronic device (1) from a sampling substrate (9), said at least one optoelectronic device (1) being capable of emitting light radiation included in a first wavelength range when it is supplied with electrical energy, the manipulation method comprising: - a step (El) of providing the sampling substrate (9) on which the at least one optoelectronic device (1) is arranged; - a step (E2) of providing a manipulation member (3) comprising a body having a contact surface (S2); - a step (E4) of applying a selection layer (11) to at least one element chosen from the group comprising said contact surface (S2) of the manipulation member (3) and the at least one optoelectronic device (1), the selection layer (11) consisting of a photosensitive element, said photosensitive element being configured to change state locally when it is subjected to light radiation included in the first wavelength range; - a step (E5) of bringing the manipulation member (3) into contact with said at least one optoelectronic device (1) at the selection layer (11), so as to cause the manipulation member (3) to adhere to the optoelectronic device (1);- a step (E8) of supplying said at least one optoelectronic device (1) with electrical energy, involving the emission of light radiation in the first wavelength range and the change of local state of the selection layer (11) allowing the separation of the selection layer (11) and the emitting optoelectronic device (1).;

6. A handling method according to claim 5, comprising a step (E9) of removing the handling member (3), in which the handling member (3) is separated from the sampling substrate (9).

7. Manipulation method according to any one of claims 5 or 6, comprising a transfer phase from the sampling substrate (9) to a receiving substrate (19), in particular a substrate for a display screen, implemented after the step (E5) of bringing the manipulation member (3) into contact, said transfer phase comprising: - a step (E6) of detaching said at least one optoelectronic device (1) from the sampling substrate (9), in particular by mechanical traction applied to the body of the manipulation member (3); and - a positioning step (E7) in which the contact surface (S2) of the manipulation member (3) is positioned opposite a receiving surface of the receiving substrate (19).

8. Manipulation method according to claim 7, in which the positioning step (E7) is implemented so that the contact surface (S2) of the manipulation member (3) is positioned opposite a receiving surface of the receiving substrate (19), in a relative position such that the optoelectronic devices (1) are in contact with the receiving surface of the receiving substrate (19).

9. Manipulation method according to any one of claims 7 or 8, in which the step (E8) of supplying electrical energy to the optoelectronic device (1) is carried out before the step (E6) of detaching said at least one optoelectronic device (1) from the sampling substrate (9).

10. A handling method according to any one of claims 5 to 9, wherein the step (E8) of supplying electrical energy to the optoelectronic device (1) makes it possible to place the optoelectronic device (1) selectively in an emission mode in which it emits light radiation in the first wavelength range and in an extinction mode in which it does not emit light radiation.

11. A handling method according to any one of claims 5 to 10, wherein the sampling substrate (9) comprises a plurality of optoelectronic devices (1), each optoelectronic device (1) of the plurality of optoelectronic devices (1) being individually capable of being supplied with electrical energy.

12. A manipulation method according to claim 11, wherein the step (E8) of supplying electrical energy is carried out selectively on one or more of the optoelectronic devices (1) of the plurality of optoelectronic devices (1).

13. Manipulation method according to claim 12, in which the step (E8) of supplying electrical energy is implemented on optoelectronic devices (1) arranged relative to each other at a predetermined distance, in particular between 50 pm and 2 mm.

14. A handling method according to any one of claims 5 to 13, comprising a step (E3) of chemically treating the contact surface (S2) of the handling member (3) to increase the chemical affinity of the handling member (3) with the photosensitive element constituting the selection layer (11).

15. A handling method according to any one of claims 5 to 14, wherein the step (E1) of providing the sampling substrate (9) comprises providing a light-emitting screen substrate comprising a plurality of optoelectronic devices (1) distributed over an emission surface of the screen substrate, the emission surface of the screen substrate comprising electronic connections (20) configured to enable each of the optoelectronic devices to be individually powered. optoelectronic device (1) of the plurality of optoelectronic devices (1), in particular during the step (E8) of supplying electrical energy.

16. Manipulation method according to any one of claims 5 to 14, in which the manipulation member (3) comprises electronic tracks (21) configured to enable each optoelectronic device (1) of the plurality of optoelectronic devices (1) to be individually powered, in particular during the step (E8) of supplying electrical energy.

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