Method for manufacturing a raised printed circuit board, raised printed circuit board and vehicle lighting device.
FR3152942A1Inactive Publication Date: 2025-03-14VALEO VISION SA
Patent Information
- Application Number
- FR2023009435
- Authority / Receiving Office
- FR · FR
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-09-07
- Publication Date
- 2025-03-14
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
The invention relates to a method for manufacturing a printed circuit board. The method comprises the following steps: - supplying (401) at least one metal connector into an injection mold, the mold having a shape defining a substrate for said printed circuit board, said connector being in contact at two of its ends with the mold so as to protrude on each side of said substrate, - injection molding (402) of plastic into said mold, - printing (404) an electrical circuit on one face of the substrate, - placing (405) electronic components on the printed face of the substrate in at least one flat area, - connecting the components (406). The invention also relates to the printed circuit board thus obtained and to its use in a vehicle lighting device. Figure 4
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Citation Information
Patent Citations
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Overmolded circuit board and method
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US20130133412A1