Method for manufacturing a raised printed circuit board, raised printed circuit board and vehicle lighting device.

FR3152942A1Inactive Publication Date: 2025-03-14VALEO VISION SA
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Patent Information

Application Number
FR2023009435
Authority / Receiving Office
FR · FR
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-09-07
Publication Date
2025-03-14
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a method for manufacturing a printed circuit board. The method comprises the following steps: - supplying (401) at least one metal connector into an injection mold, the mold having a shape defining a substrate for said printed circuit board, said connector being in contact at two of its ends with the mold so as to protrude on each side of said substrate, - injection molding (402) of plastic into said mold, - printing (404) an electrical circuit on one face of the substrate, - placing (405) electronic components on the printed face of the substrate in at least one flat area, - connecting the components (406). The invention also relates to the printed circuit board thus obtained and to its use in a vehicle lighting device. Figure 4
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Citation Information

Patent Citations

  • FR2055632A5

  • Overmolded circuit board and method

    US20090154182A1

  • Method of manufacturing a molded sensor subassembly

    US20130133412A1