Resin multilayer substrate and electronic device
Patent Information
- Application Number
- JP2024038639
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-03-13
- Publication Date
- 2025-10-27
Smart Images
Figure 00000000_0000_ABST
Abstract
Description
[Technical Field]
[0001] The present invention relates to a resin multilayer substrate including a resin laminate formed by laminating a plurality of resin layers including a resin layer on which a conductor pattern is formed, and to an electronic device including the resin multilayer substrate. [Background technology]
[0002] Patent Document 1 discloses a multilayer substrate having a first region and a second region that have different thicknesses in the stacking direction due to a difference in the number of resin layers stacked.
[0003] In this way, when the number of laminated resin layers differs between the first region and the second region, a step portion is formed at the boundary between the first region and the second region. [Prior art documents] [Patent documents]
[0004] [Patent Document 1] Japanese Patent Application Publication No. 2019-16743 Summary of the Invention [Problem to be solved by the invention]
[0005] In a resin multilayer substrate having a resin laminate formed by laminating multiple resin layers, including a resin layer on which a conductor pattern is formed, regions with different thicknesses in the stacking direction are required depending on the positional relationship of each conductor pattern and the type of use.
[0006] On the other hand, in order to protect the circuits formed in the resin multilayer board or to reinforce the resin multilayer board itself, a configuration can also be adopted in which an insulating protective film is attached to the surface of the resin multilayer board via an adhesive layer, thereby covering the surface of the resin laminate with a protective film.
[0007] However, in a resin laminate in which a large step portion occurs in the thickness of the resin laminate, it is difficult to form a continuous protective film on the step portion, so a continuous protective film is coated on a region where the thickness is relatively uniform. When the resin multilayer substrate has such a structure, the end portion of the protective film is located inside instead of the outer edge of the resin multilayer substrate, so the protective film is likely to peel off.
[0008] Therefore, an object of the present invention is to provide a resin multilayer substrate that suppresses peeling of a protective film that protects the surface of a resin laminate, and an electronic device including the resin multilayer substrate.
Means for Solving the Problems
[0009] (a) A resin multilayer substrate as an example of the present disclosure includes a resin laminate formed by laminating a plurality of resin layers including a resin layer in which a conductor pattern is formed, the resin laminate has a first region, a second region, and a third region that is a region between the first region and the second region as layer direction regions, When the average thickness of the first region of the resin laminate is represented by T1, the average thickness of the second region of the resin laminate is represented by T2, and the average thickness of the third region of the resin laminate is represented by T3, these thicknesses are in the relationship of T3 < T1 < T2, a first resin material covering from the surface of the first region to the third region, a second resin material formed in the third region, and is provided with the second resin material covers a part of the first resin material and covers an end portion of the first resin material present in the third region, When the Young's modulus of the first resin material is represented by E1 and the Young's modulus of the second resin material is represented by E2, they are in the relationship of E1 < E2, When the adhesion between the first resin material and the resin laminate is represented by AD1 and the adhesion between the second resin material and the resin laminate is represented by AD2, they are in the relationship of AD2 ≧ ADI.
[0010] (b) An electronic device as an example of the present disclosure includes a resin multilayer substrate and an electronic component mounted on the resin multilayer substrate, or includes another substrate on which the resin multilayer substrate is mounted.
[0011] (c) An electronic device as an example of the present disclosure includes a resin multilayer substrate and a housing that houses the resin multilayer substrate. [Effects of the Invention]
[0012] According to the present invention, it is possible to obtain a resin multilayer substrate in which peeling of a protective film that protects the surface of a resin laminate is suppressed, and an electronic device including the resin multilayer substrate. [Brief explanation of the drawings]
[0013] [Figure 1] FIG. 1 is a cross-sectional view of a resin multilayer substrate 101A according to the first preferred embodiment. [Figure 2] FIG. 2 is a partial plan view of a resin multilayer substrate 101A according to the first preferred embodiment. [Figure 3] FIG. 3 is a cross-sectional view of the resin multilayer substrate 101B according to the first preferred embodiment. [Figure 4] FIG. 4 is a cross-sectional view of a resin multilayer substrate 102 according to the second embodiment. [Figure 5] FIG. 5 is a cross-sectional view of a resin multilayer substrate 103A according to the third preferred embodiment. [Figure 6] FIG. 6 is a cross-sectional view of a resin multilayer substrate 103B according to the third preferred embodiment. [Figure 7] FIG. 7 is a cross-sectional view of a resin multilayer substrate 104A according to the fourth preferred embodiment. [Figure 8] FIG. 8 is a cross-sectional view of a resin multilayer substrate 104B according to the fourth preferred embodiment. [Figure 9] FIG. 9 is a cross-sectional view of a resin multilayer substrate 104C according to the fourth preferred embodiment. [Figure 10] FIG. 10 is a cross-sectional view of a resin multilayer substrate 105 according to the fifth preferred embodiment. [Figure 11] FIG. 11 is a cross-sectional view of a resin multilayer substrate 106A according to the sixth preferred embodiment. [Figure 12] FIG. 12 is a cross-sectional view of a resin multilayer substrate 106B according to the sixth preferred embodiment. [Figure 13] FIG. 13 is a cross-sectional view of a resin multilayer substrate 106C according to the sixth preferred embodiment. [Figure 14] FIG. 14 is a cross-sectional view of a resin multilayer substrate 107 according to the seventh preferred embodiment. [Figure 15] FIG. 15 is a cross-sectional view of a resin multilayer substrate 108 according to the eighth preferred embodiment. [Figure 16] FIG. 16 is a cross-sectional view of a resin multilayer substrate 109 according to the ninth preferred embodiment. [Figure 17] FIG. 17 is a cross-sectional view of a resin multilayer substrate 110 according to the tenth preferred embodiment. [Figure 18] FIG. 18 is a cross-sectional view of a resin multilayer substrate 111 according to the eleventh preferred embodiment. [Figure 19] The upper part of Fig. 19 is a cross-sectional view of the resin multilayer substrate 112 according to the twelfth embodiment before bending, and the lower part of Fig. 19 is a cross-sectional view of the resin multilayer substrate 112 according to the twelfth embodiment after bending. [Figure 20] FIG. 20 is a cross-sectional view of a resin multilayer substrate 113 and an electronic device 413 according to the thirteenth preferred embodiment. [Figure 21] FIG. 21 is a cross-sectional view of a resin multilayer substrate 114 and an electronic device 414 according to the fourteenth preferred embodiment. [Figure 22] The upper part of Fig. 22 is a diagram showing the position and movement direction of a cutting blade for measuring the adhesion between the first resin material R1 and the resin laminate 10 formed on the resin multilayer substrate. The lower part of Fig. 22 is an enlarged view showing the detailed movement of the cutting blade. [Figure 23] The left part of FIG. 23 is a diagram showing the cutting position of the resin multilayer substrate, and the right part of FIG. 23 is a diagram showing the state cut along the dashed line in the left part of FIG. [Figure 24] The upper part of Fig. 24 is a cross-sectional view showing the state where the Young's modulus of the first resin material R1 is measured, and the lower part of Fig. 24 is a cross-sectional view showing the state where the Young's modulus of the second resin material R2 is measured. DETAILED DESCRIPTION OF THE INVENTION
[0014] Hereinafter, several specific examples will be given with reference to the drawings to illustrate multiple embodiments of the present invention. The same reference numerals are used for the same parts in each drawing. To facilitate explanation and understanding of the main points, the embodiments of the present invention will be shown divided into multiple embodiments for the sake of convenience. However, partial omission, substitution, or combination of the configurations shown in different embodiments is possible. From the second embodiment onwards, descriptions of matters common to the first embodiment will be omitted, and only the differences will be described. In particular, similar effects resulting from similar configurations will not be mentioned in each embodiment.
[0015] First Embodiment In the first embodiment, a resin multilayer substrate equipped with a patch antenna will be exemplified.
[0016] FIG. 1 is a cross-sectional view of a resin multilayer substrate 101A according to a first embodiment. FIG. 2 is a partial plan view of the resin multilayer substrate 101A according to the first embodiment. In the cross-sectional view, lines that appear in the cross section (appearing due to cutting) are drawn, and lines that exist behind the cross section are not shown. This also applies to each embodiment described later. Furthermore, although FIGS. 1 and 2 show a single resin multilayer substrate, in the middle of manufacturing such a single resin multilayer substrate, the substrate is a continuum of multiple resin multilayer substrates, and is separated by cutting the continuum at the final stage of the manufacturing process or immediately before the final stage. This relationship between the continuum and separation is also the same in the other figures.
[0017] The resin multilayer substrate 101A includes a resin laminate 10 formed by laminating multiple resin layers, including a resin layer on which a conductor pattern is formed. The resin laminate 10 has, as layer direction regions, a first region A1, a second region A2, and a third region A3 which is a region between the first region A1 and the second region A2.
[0018] 1, the interfaces between adjacent resin layers in the layer direction among the plurality of resin layers are not shown, and this non-illustration of layer interfaces also applies to the following embodiments.
[0019] When the average thickness of the first region A1 of the resin laminate 10 is represented by T1, the average thickness of the second region A2 of the resin laminate 10 is represented by T2, and the average thickness of the third region A3 of the resin laminate 10 is represented by T3, these thicknesses are in the relationship of T3 < T1 < T2.
[0020] As a result, a stepped portion is formed at the boundary between the first region A1 and the third region A3, and a stepped portion is formed at the boundary between the second region A2 and the third region A3.
[0021] A first resin material (protective film) R1 is attached to the resin laminate 10 from the surface of the first region A1 to the third region A3. This first resin material R1 protects and electrically insulates the conductor pattern exposed on the outer layer of the resin laminate 10.
[0022] A second resin material (reinforcing material) R2 is applied and formed in the third region A3. As a result, the second resin material R2 covers a part of the first resin material R1 (not covering the entire surface). The second resin material R2 covers the first resin material R1 from the end of the first resin material R1 attached to the third region A3 to the boundary between the third region A3 and the second region A2. It covers at least the end of the first resin material R1 attached to the third region A3.
[0023] Examples of the materials for each part are as follows.
[0024] [First resin material R1] · It is a sheet-like insulating material obtained by laminating an adhesive layer on a polyimide base material. The thickness of the polyimide base material and the thickness of the adhesive layer are arbitrary. Also, the color of the polyimide base material and the color of the adhesive layer are arbitrary.
[0025] · The Young's modulus E1 of the first resin material R1 is 3 GPa or more and less than 5 GPa.
[0026] [Second resin material R2]<x · It is a material for underfill or sidefill applications mainly composed of an epoxy resin or an acrylic resin, and the color is arbitrary.
[0027] · The Young's modulus E2 of the second resin material R2 is 5 GPa or more. For example, it is 7 GPa.
[0028] [Resin laminate 10] · Liquid crystal polymer resin or polyimide When the Young's modulus of the first resin material R1 is represented by E1 and the Young's modulus of the second resin material R2 is represented by E2, They are in the relationship of E1 < E2.
[0029] The method for measuring the Young's modulus will be described in detail after exemplifying each embodiment.
[0030] Examples of the adhesion relationship of each part are as follows.
[0031] The adhesion AD1 between the first resin material R1 and the resin laminate 10: 0.5 to 2.0 N / mm The adhesion AD2 between the second resin material R2 and the resin laminate 10: 1.0 to 3.0 N / mm The adhesion AD12 between the second resin material R2 and the first resin material R1: 0.5 to 2. N / mm The method for measuring the above adhesion will be described in detail after exemplifying each embodiment.
[0032] Here, when the adhesion between the first resin material R1 and the resin laminate 10 is represented by AD1 and the adhesion between the second resin material R2 and the resin laminate 10 is represented by AD2, it is preferably in the relationship of AD2 ≥ AD1.
[0033] A radiation electrode RE is formed on the upper surface of the second region A2 of the resin laminate 10. A terminal electrode TE is exposed on the upper surface of the first region A1 of the resin laminate 10. A ground conductor layer GL is formed on the lower surface of the resin laminate 10.
[0034] A conductor pattern SL for a signal line is formed inside the resin laminate 10. This conductor pattern SL for a signal line is a conductor pattern formed in one of the plurality of resin layers.
[0035] Furthermore, interlayer connection conductors V1 and V2 are formed inside the resin laminate 10. The interlayer connection conductor V1 extends in the stacking direction of the resin layers in the resin laminate 10 and electrically connects one end of the signal line conductor pattern SL to the radiation electrode RE. The interlayer connection conductor V2 extends in the stacking direction and electrically connects the other end of the signal line conductor pattern SL to the terminal electrode TE.
[0036] The signal line conductor pattern SL, the ground conductor layer GL, and the resin layer between the signal line conductor pattern SL and the ground conductor layer GL form a microstrip line, which connects the terminal electrode TE and the radiation electrode RE at high frequency via the microstrip line.
[0037] The radiation electrode RE, the ground conductor layer GL, and the resin laminate 10 form a patch antenna.
[0038] The various conductor patterns such as the signal line conductor pattern SL, the ground conductor layer GL, the conductor pattern partly serving as the terminal electrode TE, the interlayer connection conductors V1 and V2, and the radiation electrode RE are conductors whose main component is, for example, Cu or Ag.
[0039] When manufacturing the resin multilayer substrate 101A, the first resin material R1 is attached to the resin laminate 10 and then vacuum pressed to adhere the first resin material R1 to the resin laminate 10. The first resin material R1 is then cured by oven curing. Next, the second resin material R2 is applied and cured.
[0040] In the example shown in Fig. 2, a plurality of radiating electrodes RE are arranged in an array, and an array antenna is formed from a plurality of patch antennas. The directivity of the antenna is determined by controlling or setting the phase of the transmission signal radiated from each radiating electrode RE or the reception signal received by each radiating electrode RE. Note that the terminal electrode TE shown in Fig. 1 is not shown in Fig. 2.
[0041] In the example shown in FIG. 1, the first region A1, the second region A2, and the third region A3 are shown in an integrated state. However, the resin laminate 10 may be formed by mounting a substrate constituting the second region A2 on a multilayer substrate having the first region and the third region. The same applies to other embodiments shown hereinafter.
[0042] According to the present embodiment, since the thickness T2 of the third region A3 between the first region A1 and the second region A2 is smaller than the thickness T1 of the first region A1 and the thickness T2 of the second region A2, the third region A3 acts as a recess. Therefore, the coating amount of the second resin material R2 can be ensured in the third region A3. As a result, as the second resin material R2, for example, a resin material having a low viscosity of 40 Pa·s or less can be selected. Thus, if the second resin material R2 made of a resin material having a low viscosity is applied to the end of the first resin material R1, peeling of the end of the first resin material R1 can be effectively suppressed.
[0043] Further, according to the present embodiment, as described above, the end of the first resin material R1 attached from the first region A1 to the third region A3 is covered with the second resin material R2 in the third region, and since the relationship of AD2≧AD1 holds, even if the adhesive force of the first resin material R1 to the resin laminate 10 is relatively weak, peeling of the first resin material R1 from the resin laminate 10 can be suppressed.
[0044] Also, in FIG. 1, since the thickness T1 of the first region A1 of the resin laminate 10 is thinner than the thickness T2 of the second region A2, the X-Y plane of the first region A1 with respect to the second region A2 is easily bent around an axis parallel to the Y axis. Even if such bending stress is intentionally generated, as described above, since the relationship of E1<E2 holds, the first resin material R1 is easily deformed by the bending stress of the first region A1. As a result, the first resin material R1 easily follows the deformation of the first region A1. Therefore, when bending stress is applied to the first region A1 and the third region A3 with respect to the second region A2, displacement of the first resin material R1 with respect to the surface of the resin laminate is suppressed. Also by this, peeling of the first resin material R1 is effectively suppressed. That is, the bending resistance during bending of the first region A1 and the third region A3 with respect to the second region A2 can be enhanced.
[0045] 3 is a cross-sectional view of a resin multilayer substrate 101B according to the first preferred embodiment. The resin multilayer substrate 101B and the resin multilayer substrate 101A shown in FIG. 1 differ in the coverage of the second resin material R2.
[0046] In the resin multilayer substrate 101B shown in Fig. 3, the second resin material R2 covers the first resin material R1 from the end of the first resin material R1 to the first region A1. In other words, the second resin material R2 extends to a position where it overlaps the first region A1 of the resin laminate 10. The other configurations are as shown in Fig. 1.
[0047] The adhesion of the first resin material R1 to the resin laminate 10 may be low near the boundary between the first region A1 and the third region A3 of the resin laminate 10. According to the structure shown in Fig. 3, the second resin material R2 is present at the boundary between the first region A1 and the third region A3 of the resin laminate 10, so peeling of the first resin material R1 from the resin laminate 10 at that location can be suppressed. Furthermore, the adhesive area between the first resin material R1 and the second resin material R2 is large, so peeling of the first resin material R1 from the resin laminate 10 can be effectively suppressed.
[0048] Second Embodiment In the second embodiment, an example will be shown in which a region other than the third region exists between the first region and the second region of the resin laminate.
[0049] 4 is a cross-sectional view of a resin multilayer substrate 102 according to a second embodiment. The resin multilayer substrate 102 includes a resin laminate 10 formed by laminating multiple resin layers, including a resin layer on which a conductor pattern is formed. The resin laminate 10 has, as layer direction regions, a first region A1, a second region A2, and a third region A3 between the first region A1 and the second region A2. It also has a fourth region A4 between the first region A1 and the second region A2.
[0050] When the average thickness of the first region A1 of the resin laminate 10 is represented by T1, the average thickness of the second region A2 of the resin laminate 10 is represented by T2, the average thickness of the third region A3 of the resin laminate 10 is represented by T3, and the average thickness of the fourth region A4 of the resin laminate 10 is represented by T4, these thicknesses are in the relationship of T4 < T3 < T1 < T2.
[0051] In the example shown in FIG. 4, the first resin material (protective film) R1 is attached to the resin laminate 10 from the third region A3 to the first region A1. And the second resin material R2 covers the end portion of the first resin material R1 located in the third region A3.
[0052] Other configurations are as shown in the first embodiment. According to the second embodiment, even if there are regions with different thicknesses of the resin laminate 10 other than the third region, the coating area of the second resin material R2 can be suppressed, and cost reduction can be achieved. In addition, the same operational effects as those of the first embodiment are exhibited.
[0053] 《Third Embodiment》 In the third embodiment, an example in which the third region of the resin laminate is a region where the thickness of the resin laminate is divided into a plurality of stages is shown. Also, in the third embodiment, an example in which the configurations of the first resin material R1 and the second resin material R2 are different from those of the second embodiment is shown.
[0054] FIG. 5 is a cross-sectional view of a resin multilayer substrate 103A according to the third embodiment. The resin multilayer substrate 103A includes a resin laminate 10 formed by laminating a plurality of resin layers including a resin layer on which a conductor pattern is formed.
[0055] The resin laminate 10 has a first region A1, a second region A2, and third regions A31 and A32 that are regions between the first region A1 and the second region A2 as layer direction regions.
[0056] When the average thickness of the first region A1 of the resin laminate 10 is represented by T1, the average thickness of the second region A2 of the resin laminate 10 is represented by T2, the average thickness of one of the third regions A31 of the resin laminate 10 is represented by T31, and the average thickness of the other third region A32 of the resin laminate 10 is represented by T32, these thicknesses are in the relationship of T32 < T31 < T1 < T2. Thus, the third regions A31 and A32 are regions where the thickness of the resin laminate 10 is divided into multiple stages.
[0057] In the example shown in FIG. 5, the first resin material (protective film) R1 is attached to the resin laminate 10 from the third region A32 to the first region A1. And the second resin material R2 covers the end of the first resin material R1 located in the third region A32.
[0058] Other configurations are as shown in the first and second embodiments. In the example shown in FIG. 5, the coating area of the second resin material R2 can be suppressed, and cost reduction can be achieved. The resin multilayer substrate 103A shown in FIG. 5 also has the same operational effects as the first and second embodiments.
[0059] FIG. 6 is a cross-sectional view of a resin multilayer substrate 103B according to the third embodiment. The coverage range of the second resin material R2 is different between this resin multilayer substrate 103B and the resin multilayer substrate 103A shown in FIG. 5.
[0060] In the resin multilayer substrate 103B shown in FIG. 6, the second resin material R2 covers the first resin material R1 from the third region A32 to the first region A1. That is, the second resin material R2 extends to a position where it rides on the first region A1 of the resin laminate 10. Other configurations are as shown in FIG. 6.
[0061] Note that the resin multilayer substrate may have a structure in which the second resin material R2 covers the first resin material R1 from the third region A32 to the third region A31.
[0062] That is, in the third embodiment, the second resin material R2 is attached from the end of the first resin material R1 located at a predetermined step in the third area A31, A32 to one or more steps above the predetermined step in the third area, or from the end of the first resin material R1 to the first area A1. The other configurations are the same as those in the first and second embodiments. The third embodiment also provides the same effects as the first and second embodiments.
[0063] Fourth Embodiment In the fourth embodiment, a resin multilayer substrate in which the second resin material R2 covers the side surface portion of the second region A2 will be exemplified.
[0064] Fig. 7 is a cross-sectional view of a resin multilayer substrate 104A according to the fourth embodiment. The upper part of Fig. 8 is a cross-sectional view of a resin multilayer substrate 104B according to the fourth embodiment. The lower part of Fig. 8 is a photograph of the periphery of the second resin material R2. The structure of the resin laminate 10 is similar to that of the resin laminate 10 shown in Figs. 1 and 3 in the first embodiment.
[0065] In the examples shown in FIGS. 7 and 8, the first resin material R1 is attached to the resin laminate 10 from the third region A3 to the first region A1. In the example shown in FIG. 7, the second resin material R2 covers the third region, thereby covering the end of the first resin material R1 and also covering the side surface of the second region A2. In the example shown in FIG. 8, the second resin material R2 covers the first resin material R1 in the first region and the third region, and also covers the side surface of the second region A2. In both cases, the second resin material R2 covers the side surface of the second region A2 up to a position higher than the thickness of the first region A1.
[0066] 9 is a cross-sectional view of a resin multilayer substrate 104C according to the fourth embodiment. The structure of the resin laminate 10 is similar to that of the resin laminate 10 in the first embodiment shown in FIGS.
[0067] 9, the first resin material R1 is also attached to the resin laminate 10 from the third region A3 to the first region A1. In the example shown in FIG. 9, the second resin material R2 is provided from the first region A1 to the second region A2. That is, the second resin material R2 covers not only the entire side surface of the second region A2, but also part of the upper surface of the second region A2. Furthermore, in the example shown in FIG. 9, the second resin material R2 also covers the end of the radiating electrode RE. This structure also has the effect of suppressing peeling of the Cu foil on the upper surface of the second region A2.
[0068] In each of the resin multilayer substrates 104A, 104B, and 104C, the roughness of the side surface of the second region A2 of the resin laminate 10 is greater than the roughness of the top surface of the third region A3.
[0069] According to this embodiment, the second region A2 of the resin laminate 10 is fixed with the second resin material R2, which increases the bending resistance of the second region A2. Also, the bending resistance of the base portion of the second region A2 can be increased. This suppresses deformation of the second region A2, which in turn suppresses changes in, for example, antenna characteristics.
[0070] As described above, the roughness of the side surface of the second region A2 is greater than the roughness of the top surface of the third region A3, and therefore the adhesion between the second resin material R2 and the side surface of the second region A2 is greater than the adhesion between the second resin material R2 and the top surface of the third region A3. When the first region A1 of the resin laminate 10 is bent, stress is applied to the bonding surface between the second region A2 and the second resin material R2. However, as described above, the adhesion between the second resin material R2 and the side surface of the second region A2 is large, and therefore peeling of the second resin material R2 when the stress occurs can be suppressed.
[0071] Fifth Embodiment In the fifth embodiment, a resin multilayer substrate is shown in which the structure of the side surface and base portion of the second region A2 is different from that of the example shown in the fourth embodiment.
[0072] 10 is a cross-sectional view of a resin multilayer substrate 105 according to a fifth embodiment. The resin multilayer substrate 105 includes a resin laminate 10 formed by laminating multiple resin layers, including a resin layer on which a conductor pattern is formed. The resin laminate 10 has, as layer direction regions, a first region A1, a second region A2, and a third region A3 located between the first region A1 and the second region A2.
[0073] The side surface SS of the second region A2 is tapered upward, and the base portion RP of the second region A2 is curved. The other structures are the same as those of the resin multilayer substrate 104A shown in FIG.
[0074] According to this embodiment, by mounting a rigid substrate that constitutes the second region A2 on a flexible multilayer substrate having the first region A1 and the third region A3, it is possible to increase the bonding strength of the second region A2 to the first region A1 and the third region A3 even when forming the resin laminate 10. That is, since the adhesion between the second region A2 and the second resin material R2 in the tapered portion is high, it is possible to prevent the second region A2 from coming off the first region A1 and the third region A3.
[0075] Furthermore, since the base portion RP of the second region A2 has a curved shape, when a bending stress is applied to the third region A3, the stress applied to the base portion RP of the second region A2 is reduced, thereby suppressing the occurrence of cracks in the base portion of the second region A2.
[0076] Sixth Embodiment In the sixth embodiment, a resin multilayer substrate is exemplified, which includes a third region where the thickness of the resin laminate is divided into multiple stages, and in which the second resin material R2 covers the side surface portion of the second region A2.
[0077] 11 is a cross-sectional view of a resin multilayer substrate 106A according to a sixth embodiment. The resin multilayer substrate 106A includes a resin laminate 10 formed by laminating multiple resin layers, including a resin layer on which a conductor pattern is formed. The resin laminate 10 has, as layer direction regions, a first region A1, a second region A2, and third regions A31 and A32 located between the first region A1 and the second region A2.
[0078] Let the average thickness of the first region A1 of the resin laminate 10 be represented by T1, the average thickness of the second region A2 of the resin laminate 10 be represented by T2, the average thickness of one of the third regions A31 of the resin laminate 10 be represented by T31, and the average thickness of the other third region A32 of the resin laminate 10 be represented by T32. Then, these thicknesses are in the relationship of T32 < T31 < T1 < T2. Thus, the third regions A31 and A32 are regions where the thickness of the resin laminate 10 is divided into multiple steps.
[0079] In the example shown in FIG. 11, the first resin material (protective film) R1 is attached from the third region A32 to the first region A1 of the resin laminate 10. And the second resin material R2 covers the side surface portion of the second region A2 from the end of the first resin material R1 located in the third region A32.
[0080] FIG. 12 is a cross-sectional view of the resin multilayer substrate 106B according to the sixth embodiment. The configuration of the resin laminate 10 is the same as that shown in FIG. 11. In the example shown in FIG. 12, the first resin material (protective film) R1 is attached from the third region A31 to the first region A1 of the resin laminate 10. And the second resin material R2 covers the side surface portion of the second region A2 from the end of the first resin material R1 located in the third region A31.
[0081] FIG. 13 is a cross-sectional view of the resin multilayer substrate 106C according to the sixth embodiment. The structure of the resin laminate 10 is the same as the resin laminate 10 shown in FIGS. 1 and 3 in the first embodiment.
[0082] In the example shown in FIG. 13, the first resin material R1 is attached to the resin laminate 10 from the third region A32 to the first region A1. In the example shown in this FIG. 13, the second resin material R2 is provided from the first region A1 to the second region A2. That is, the second resin material R2 covers not only the entire side surface of the second region A2 but also a part of the upper surface of the second region A2. Also, in the example shown in FIG. 13, the second resin material R2 covers the end of the radiating electrode RE. This structure also has an effect of suppressing the peeling of the Cu foil on the upper surface of the second region A2.
[0083] According to this embodiment, since the second region A2 is fixed by the second resin material R2, the bending resistance of the second region A2 can be improved, and the bending resistance of the base portion of the second region A2 can also be improved.
[0084] In this way, even if the third region is a region in which the thickness of the resin laminate 10 is divided into multiple stages, or even if the second resin material R2 covers the surface of the first resin material R1 and the resin laminate 10 from the end of the first resin material R1 to the side of the second region A2, the same effects as those of the resin multilayer substrate shown in the fourth embodiment are achieved.
[0085] Seventh Embodiment In the seventh embodiment, a resin multilayer substrate in which the structure of the upper surface of the second region is different from the examples shown so far will be illustrated.
[0086] 14 is a cross-sectional view of a resin multilayer substrate 107 according to the seventh embodiment. The resin multilayer substrate 107 includes a third resin material R3 that covers the upper surface of the second region A2 as well as the upper surface of the radiating electrode RE formed on the upper surface of the second region A2. The third resin material R3 and the second resin material R2 are not in contact with each other. That is, a portion of the second region of the resin laminate 10 is exposed between the third resin material R3 and the second resin material R2. The third resin material R3, like the first resin material R1, is a sheet-like insulating material formed by bonding an adhesive layer to a polyimide base material, for example.
[0087] The other configuration is the same as that of the resin multilayer substrate 104A shown in FIG. 7 in the fourth embodiment.
[0088] According to this embodiment, the third resin material R3 and the second resin material R2 are not continuous, so the third resin material R3 is not affected by the bending of the first region A1 and the third region A3, thereby increasing the peeling resistance of the third resin material R3.
[0089] Eighth Embodiment In the eighth embodiment, a resin multilayer substrate in which the third resin material covers the side surface portion of the second region will be exemplified.
[0090] 15 is a cross-sectional view of a resin multilayer substrate 108 according to the eighth embodiment. In this example, a third resin material R3 is formed from the top surface to the side surface of the second region A2. The second resin material R2 is formed on the side surface of the second region to a position that covers the end of the third resin material R3. Note that by forming a rounded shape from the top surface to the side surface of the second region A2, it is easier to apply the third resin material R3 to the second region A2 of the resin laminate 10.
[0091] The other configuration is the same as that of the resin multilayer substrate 104A shown in FIG. 7 in the fourth embodiment.
[0092] According to this embodiment, the second resin material R2 covers the end portion of the third resin material R3, and therefore, the bending resistance against peeling of the third resin material R3 can also be improved.
[0093] Ninth Embodiment In the ninth embodiment, the relationship between the conductor pattern in the second region of the resin laminate and the second and third resin materials that cover the side surfaces of the second region will be illustrated.
[0094] 16 is a cross-sectional view of a resin multilayer substrate 109 according to the ninth embodiment. In the second region A2 of the resin laminate 10, a stacking direction conductor path is formed by laminating resin layers having interlayer connection conductors V1 and conductor foil in contact with the interlayer connection conductors V1. A portion of the end of the conductor foil reaches the side surface of the second region A2.
[0095] The third resin material R3 is attached to the exposed portion of the conductor foil. The second resin material R2 that covers the side surface of the second region A2 also covers the exposed portion of the conductor foil.
[0096] The other configuration is the same as that of the resin multilayer substrate 104A shown in FIG. 7 in the fourth embodiment.
[0097] According to this embodiment, inappropriate electrical conduction of the conductor pattern on the side surface of the second region A2 is prevented, and in relation to this, the size of the second region A2 in the X direction or the XY plane direction can be reduced.
[0098] Tenth Embodiment In the tenth embodiment, the relationship between the conductor pattern in the second region of the resin laminate and the second resin material that covers the side surfaces of the second region will be illustrated.
[0099] 17 is a cross-sectional view of a resin multilayer substrate 110 according to the tenth embodiment. In the second region A2 of the resin laminate 10, a stacking direction conductor path is formed by laminating resin layers having interlayer connection conductors V1 and conductor foil in contact with the interlayer connection conductors V1. A portion of the end of the conductor foil is exposed on the side surface of the second region A2.
[0100] The second resin material R2 that covers the side surface of the second region A2 covers the exposed portion of the conductor foil.
[0101] The other configuration is the same as that of the resin multilayer substrate 104A shown in FIG. 7 in the fourth embodiment.
[0102] According to this embodiment, inappropriate electrical conduction of the conductor pattern on the side surface of the second region A2 is prevented, and in relation to this, the size of the second region A2 in the X direction or the XY plane direction can be reduced.
[0103] Eleventh Embodiment In the eleventh embodiment, a resin multilayer substrate in which the first resin material and the second resin material are present at two different (separate) positions in the stacking direction of the resin layers in the resin laminate will be exemplified.
[0104] 18 is a cross-sectional view of a resin multilayer substrate 111 according to the eleventh embodiment. The resin multilayer substrate 111 includes a resin laminate 10 formed by laminating a plurality of resin layers, including a resin layer on which a conductor pattern is formed.
[0105] The resin laminate 10 has a first region A1, a second region A2, and a third region A3 as layer direction regions of the resin laminate 10. When the thickness of the first region A1 of the resin laminate 10 is represented by T1, the thickness of the second region A2 of the resin laminate 10 is represented by T2, and the thickness of the third region A3 of the resin laminate 10 is represented by T3, these thicknesses are in the relationship of T3 < T1 < T2.
[0106] A step portion is formed at the boundary between the first region A1 and the third region A3, and a step portion is formed at the boundary between the second region A2 and the third region A3.
[0107] A first resin material (protective film) R1 is attached to the resin laminate 10 from the surface of the first region A1 to the third region A3. Further, a second resin material (reinforcing material) R2 is coated within the third region A3.
[0108] As is clear from comparison with the example shown in FIG. 1, in the resin multilayer substrate 111 of the eleventh embodiment, the first resin material R1 and the second resin material R2 are present at two (separated) locations that are different in the stacking direction of the plurality of resin layers in the resin laminate 10.
[0109] According to the present embodiment, when incorporated into the housing of an electronic device, the degree of freedom in arrangement is increased, such as being able to be mounted in a limited space. Further, since it includes radiation electrodes RE in different directions from each other, it can be used as a wide-directional or two-directional antenna.
[0110] Other configurations and the effects thereof are as shown in the first embodiment. [[ID=2']]
[0111] <<12th Embodiment>> In the twelfth embodiment, a resin multilayer substrate that is bent in the first region of the resin laminate will be exemplified.
[0112] As shown in the upper part of FIG. 19, the resin multilayer substrate 112 includes a resin laminate 10 formed by laminating a plurality of resin layers each having a conductor pattern formed thereon. The resin laminate 10 has one first region A1, a second region A2, and a third region A3 as layer direction regions of the resin laminate 10. When the thickness of the first region A1 of the resin laminate 10 is represented by T1, the thickness of the second region A2 of the resin laminate 10 is represented by T2, and the thickness of the third region A3 of the resin laminate 10 is represented by T3, these thicknesses are in the relationship of T3 < T1 < T2.
[0114] A first resin material (protective film) R1 is attached to the resin laminate 10 from the surface of the first region A1 to the third region A3. Also, a second resin material (reinforcing material) R2 is coated within the third region A3.
[0115] As is clear from comparison with the example shown in FIG. 1, in the resin multilayer substrate 112 of the twelfth embodiment, the first resin material R1 and the second resin material R2 are present at two (separated) positions that are different in the layer direction of the resin laminate 10.
[0116] As shown in the lower part of FIG. 19, when the resin multilayer substrate 112 is bent 90° around an axis in the direction along the Y-axis at the center of its first region A1, the directions of the two radiating electrodes RE are arranged to be different by 90°.
[0117] According to the present embodiment, when incorporated into the housing of an electronic device, the degree of freedom in arrangement is increased, such as being able to be mounted in a limited space. Also, since it includes radiating electrodes RE1 and RE2 with different directions from each other, it can be used as an antenna with wide directivity.
[0118] [[ID=第十九]] "《The Thirteenth Embodiment》 In the thirteenth embodiment, an example of a resin multilayer substrate in which the configuration of the second region is different from the examples shown so far will be illustrated.
[0119] 20 is a cross-sectional view of a resin multilayer substrate 113 according to the thirteenth embodiment. This resin multilayer substrate 113 includes a substrate portion 10S and a mounting portion 10E mounted thereon. The substrate portion 10S and the mounting portion 10E form a second region A2. The substrate portion 10S other than the mounting region of the mounting portion 10E forms a first region A1 and a third region A3.
[0120] The substrate portion 10S and the mounting portion 10E include a plurality of resin layers, and conductor layers and interlayer connection conductors attached to predetermined resin layers among the plurality of resin layers. The conductor layers and interlayer connection conductors are conductors whose main components are, for example, Cu or Ag.
[0121] A connection conductor BM is applied to the opening of the uppermost resin layer of the substrate part 10S. The connection conductor BM is a heat-melting metal such as solder. An end of a signal line conductor pattern SL is disposed below the connection conductor BM.
[0122] A radiation electrode RE is formed on the upper part of the mounting portion 10E. A terminal electrode 6 is formed on the mounting surface (lower surface) of the mounting portion 10E. The terminal electrode 6 and the radiation electrode RE are electrically connected via an interlayer connection conductor 4 and a conductor layer 5.
[0123] The terminal electrode 6 of the mounting portion 10E is electrically connected to one end of the signal line conductor pattern SL formed on the substrate portion 10S. The terminal electrode TE and the other end of the signal line conductor pattern SL are connected in the stacking direction by the conductor layer 5 and the interlayer connection conductor 4.
[0124] In this way, a resin laminate may be formed by the substrate portion 10S and the mounting portion 10E. The other configurations are the same as those of the embodiments shown so far, such as the first embodiment.
[0125] The resin laminate may be formed of the same resin material throughout the first region A1, second region A2, and third region A3. Alternatively, the second region A2 may be formed by bonding a different type of resin substrate to the resin substrate constituting the first region A1 and third region A3. That is, the resin portion of the substrate portion 10S and the resin portion of the mounting portion 10E may be formed of different types of resin materials. However, if the resin portion of the substrate portion 10S and the resin portion of the mounting portion 10E are formed of the same type of resin material, a high bonding strength can be obtained because no interface between the different materials is formed. Whether or not the resin materials are the same can be confirmed using a Fourier transform infrared spectrophotometer (FT-IR). That is, spectra are obtained using a Fourier transform infrared spectrophotometer (FT-IR). If the spectral peaks of the mounting portion 10E and the substrate portion 10S are the same, it can be confirmed that they are made of the same type of resin material.
[0126] In addition, if the resin is a thermoplastic resin, the difference in melting point between the same type of resin material is small. Whether the resin portion of the substrate portion 10S and the resin portion of the mounting portion 10E are made of the same type of resin material can be confirmed by the endothermic peak of differential scanning calorimetry (DSC). Specifically, using a Rigaku DSC8230, the two resins are heated at a rate of 10°C / min, melted, cooled, and then heated again at 10°C / min. If the difference in melting point between the two resins is within 5°C, they can be considered to be the same type of resin material.
[0127] Fourteenth Embodiment In the fourteenth embodiment, an electronic device including a resin multilayer substrate on which electronic components are mounted and another substrate will be exemplified.
[0128] FIG. 21 is a cross-sectional view of a resin multilayer substrate 114 and an electronic device 414 according to the fourteenth preferred embodiment.
[0129] An electronic component 24 is mounted in the first region A1 of the resin laminate 10. Hatching of the electronic component 24 is omitted in the illustration.
[0130] Electronic device 414 includes another substrate 27 and, mounted thereon, a resin multilayer substrate 114. Hatching of other substrate 27 is omitted in the illustration.
[0131] The structure of the resin multilayer substrate 114 is similar to that of the resin multilayer substrate 101A shown in FIG. 1 in the first embodiment.
[0132] Fifteenth Embodiment In the fifteenth embodiment, an electronic device including a housing will be exemplified.
[0133] The electronic device according to this embodiment includes a resin multilayer substrate according to any one of the first to thirteenth embodiments, and a housing that houses the resin multilayer substrate.
[0134] The housing that houses the resin multilayer board has a size and shape that allows the resin multilayer board to be housed (built-in).
[0135] <<Method for measuring adhesion>> Adhesion strength is generally measured by a tensile test using a tensile strength tester, but to measure the adhesion strength of each part of a manufactured resin multilayer board, it is necessary to measure the horizontal force, vertical force, and vertical displacement applied to the cutting blade when cutting and peeling at an ultra-low speed from the surface to the interface using a sharp cutting blade. For example, this can be measured using a device called SAICAS manufactured by Daipla Wintes.
[0136] First, a method for measuring the adhesive force (adhesion strength) AD1 between the first resin material R1 and the resin laminate 10 shown in each embodiment will be illustrated.
[0137] The upper part of Fig. 22 is a diagram showing the position and movement direction of a cutting blade for measuring the adhesion between the first resin material R1 and the resin laminate 10 formed on the resin multilayer substrate. The lower part of Fig. 22 is an enlarged view showing the detailed movement of the cutting blade.
[0138] As shown in the upper part of FIG. 22, a sharp cutting blade is moved from the surface of the first resin material R1 to the interface with the resin laminate 10 to cut the first resin material R1 at an extremely low speed and peel it off from the resin laminate 10.
[0139] In the diagram shown at the bottom of Figure 22, first, the cutting blade is moved in two axial directions while applying a force Fv in the -Z direction and a force Fh in the +X direction, thereby cutting diagonally through the first resin material R1. When the first resin material R1 reaches a certain thickness, shearing occurs. After that, the first resin material R1 peels off from the resin laminate 10. Thereafter, the cutting blade is moved in one axial direction, the +X direction. When the cutting blade moves in this manner, the peak of the force Fh in the +X direction applied to the cutting blade can be treated as the adhesion force between the first resin material R1 and the resin laminate 10.
[0140] An example of a method for measuring the adhesive force (adhesion strength) AD2 between the second resin material R2 and the resin laminate 10 is as follows.
[0141] The left part of Fig. 23 is a diagram showing the cutting position of the resin multilayer substrate, and cutting along the dashed line results in the state shown on the right part of Fig. 23. In this state, the thickness of the second resin material R2 is the same as the thickness of the first resin material R1 shown in Fig. 22.
[0142] In the diagram shown on the right side of FIG. 23 , the cutting blade is moved in the −Z direction to cut through the second resin material R2. When the force applied to the second resin material R2 reaches a certain value, shear occurs in the second resin material R2. The second resin material R2 then peels off from the resin laminate 10. When the cutting blade moves in this manner, the peak of the force applied to the cutting blade in the −Z direction can be treated as the adhesion force between the second resin material R2 and the resin laminate 10.
[0143] <Method for measuring Young's modulus> The following is an example of a method for measuring the Young's modulus of the first resin material R1. The Young's modulus is measured by a nanoindenter test according to the standards of JIS Z 2255 and ISO 14577. For example, it can be determined from load-displacement data using a Micro Nanoindenter device manufactured by KLA.
[0144] The upper part of Figure 24 is a cross-sectional view of the first resin material R1 during measurement of its Young's modulus. A Vickers or Berkovich triangular pyramidal indenter is used as the indenter. This indenter is placed perpendicularly against the surface of the first resin material R1, and measurements are made at a depth of about 1 / 10 of the film thickness. For example, if the film thickness is 10 μm, the measurement depth is about 1 μm.
[0145] The bottom of Figure 24 is a cross-sectional view of the second resin material R2 during measurement of its Young's modulus. This shape is the state of the resin multilayer substrate shown in the top of Figure 24, cut along the dashed line. A Vickers or Berkovich triangular pyramidal indenter is used as the indenter. This indenter is placed perpendicularly to the surface of the second resin material R2, and measurements are taken at a depth of about 1 / 10 of the film thickness. For example, if the film thickness is 10 μm, the indenter depth is about 1 μm.
[0146] Various embodiments of the present invention have been presented so far, but these are all examples and are not intended to limit the scope of the present invention. Various omissions, substitutions, and modifications can be made to the embodiments of the present invention without departing from the spirit of the invention. Embodiments with such omissions, substitutions, and modifications are included within the scope and spirit of the present invention, and are also included in the scope of the invention and its equivalents as set forth in the claims of this application.
[0147] For example, in each embodiment, an example has been shown in which a radiation electrode is formed in the second region A2 of the resin laminate 10, but the electrode formed in the second region A2 is not limited to a radiation electrode.
[0148] Furthermore, in each embodiment, an example in which interlayer connection conductors are formed in the first region A1 and the second region A2 has been shown, but these interlayer connection conductors are not essential.
[0149] In each embodiment, a signal line conductor pattern SL and a ground conductor layer GL are formed to configure a microstrip line or a triplate type strip line, but the present invention is not limited to those having such a transmission line portion.
[0150] The resin multilayer substrate and electronic device of the present invention may be provided in the following embodiments.
[0151] <1> A resin laminate comprising a plurality of resin layers laminated and including a resin layer in which a conductor pattern is formed. The resin laminate has, as layer direction regions, a first region, a second region, and a third region which is a region between the first region and the second region. When the average thickness of the first region of the resin laminate is represented by T1, the average thickness of the second region of the resin laminate is represented by T2, and the average thickness of the third region of the resin laminate is represented by T3, their thicknesses are in the relationship of T3 < T1 < T2. A first resin material (protective film) covering from the surface of the first region to the third region. A second resin material (reinforcing material) formed in the third region. And comprising. The second resin material covers a part of the first resin material and covers an end portion of the first resin material present in the third region. When the Young's modulus of the first resin material is represented by E1 and the Young's modulus of the second resin material is represented by E2, they are in the relationship of E1 < E2. When the adhesion between the first resin material and the resin laminate is represented by AD1 and the adhesion between the second resin material and the resin laminate is represented by AD2, they are in the relationship of AD2 ≧ AD1. Resin multi-layer substrate.
[0152] <2> The second resin material covers the first resin material from the end portion of the first resin material to the first region. The resin multi-layer substrate according to <1>.
[0153] <3> The third region is a region where the thickness of the resin laminate is divided into a plurality of stages. The second resin material covers the first resin material from an end portion of the first resin material located at a predetermined stage of the third region to one or more stages above the predetermined stage in the third region, or from the end portion of the first resin material to the first region. The resin multi-layer substrate according to <1> or <2>.
[0154] <4> the second resin material covers the side surface of the second region up to a position higher than the thickness of the first region; <1> from <3> 1. The resin multilayer substrate according to claim 1 ,
[0155] <5> an adhesion strength between the second resin material and the side surface of the second region is greater than an adhesion strength between the second resin material and the top surface of the third region; <4> The resin multilayer substrate according to claim 1.
[0156] <6> the second resin material covers the conductive pattern reaching the side surface of the second region; <4> or <5> The resin multilayer substrate according to claim 1.
[0157] <7> a third resin material covering an upper surface of the second region; the end portion of the third resin material and the second resin material are arranged in a non-contact positional relationship. <1> from <6> 1. The resin multilayer substrate according to claim 1 ,
[0158] <8> a third resin material formed on a side surface of the second region; The second resin material covers an end portion of the third resin material on a side surface of the second region. <1> from <6> 1. The resin multilayer substrate according to claim 1 ,
[0159] <9> a third resin material covering an upper surface of the second region; The second resin material covers an end portion of the third resin material on the upper surface of the second region. <1> from <6> 1. The resin multilayer substrate according to claim 1 ,
[0160] <10> <1> from <9> and an electronic component mounted on the resin multilayer substrate, or another substrate on which the resin multilayer substrate is mounted.
[0161] <11> <1> from <9> and a housing that houses the resin multilayer substrate. [Explanation of symbols]
[0162] A1…First area A2…Second area A3…Third area A31,A32…3rd area A4…4th area BM...connecting conductor GL: Ground conductor layer R1: First resin material R2…Second resin material R3: Third resin material RE,RE1,RE2…Radiation electrode RP...Root part SL: Conductive pattern for signal lines SS…side TE...Terminal electrode V1, V2...Interlayer connecting conductor 4...Interlayer connecting conductor 5...Conductor layer 6...Terminal electrode 10...Resin laminate 10E...Installation section 10S…board part 24...Electronic components 27...Other boards 101A,101B,102,103A,103B,104A,104B,104C,105,106A,106B,106C,107,108,109,110,111,112,113,114...Resin multilayer board 414...Electronic equipment
Claims
1. a resin laminate formed by laminating a plurality of resin layers including a resin layer on which a conductor pattern is formed, the resin laminate has, as layer direction regions, a first region, a second region, and a third region which is a region between the first region and the second region; when an average thickness of the first region of the resin laminate is represented by T1, an average thickness of the second region of the resin laminate is represented by T2, and an average thickness of the third region of the resin laminate is represented by T3, the thicknesses satisfy a relationship of T3<T1<T2, a first resin material covering a surface of the first region and the third region; a second resin material formed in the third region; Equipped with the second resin material covers a part of the first resin material and covers an end portion of the first resin material present in the third region; When the Young's modulus of the first resin material is represented by E1 and the Young's modulus of the second resin material is represented by E2, a relationship of E1<E2 is satisfied, When the adhesion strength between the first resin material and the resin laminate is represented by AD1 and the adhesion strength between the second resin material and the resin laminate is represented by AD2, a relationship of AD2≧AD1 is satisfied. Resin multilayer board.
2. The second resin material covers the first resin material from an end of the first resin material to the first region. The resin multilayer substrate according to claim 1 .
3. the third region is a region in which the thickness of the resin laminate is divided into multiple stages, The second resin material covers the first resin material from an end of the first resin material located at a predetermined step in the third region to a step or more above the predetermined step in the third region, or from the end of the first resin material to the first region. The resin multilayer substrate according to claim 1 or 2.
4. the second resin material covers the side surface of the second region up to a position higher than the thickness of the first region; The resin multilayer substrate according to claim 1 or 2.
5. an adhesion strength between the second resin material and the side surface of the second region is greater than an adhesion strength between the second resin material and the top surface of the third region; The resin multilayer substrate according to claim 4.
6. the second resin material covers the conductor pattern that reaches the side surface of the second region; The resin multilayer substrate according to claim 4.
7. a third resin material covering an upper surface of the second region; the end portion of the third resin material and the second resin material are arranged in a non-contact positional relationship. The resin multilayer substrate according to claim 1 or 2.
8. a third resin material formed on a side surface of the second region; The second resin material covers an end portion of the third resin material on a side surface of the second region. The resin multilayer substrate according to claim 1 or 2.
9. a third resin material covering an upper surface of the second region; The second resin material covers an end portion of the third resin material on an upper surface of the second region. The resin multilayer substrate according to claim 1 or 2.
10. 3. An electronic device comprising the resin multilayer substrate according to claim 1 or 2 and an electronic component mounted on the resin multilayer substrate, or comprising another substrate on which the resin multilayer substrate is mounted.
11. 3. An electronic device comprising: the resin multilayer substrate according to claim 1; and a housing that houses the resin multilayer substrate.