Power module and manufacturing process

Abstract

Power module and manufacturing method Power module (1) comprising: A first housing element (10) having a first housing (12) for receiving a first chip (70; 70'; 70''), a first chip (70; 70'; 70'') at least partially received in the first housing, having electrical contacts (71, 72, 73; 71', 72', 73'; 71'', 72'', 73''), connection elements (41, 43, 45) electrically connected to the electrical contacts of the first chip, at least one insulating shim (90; 90'; 90'') arranged at least partially in the first housing so as to at least partially cover said chip, having at least one opening (91, 92; 91', 92'; 91'', 92'') providing access to at least at least one electrical contact of the chip through the shim and / or at least one track (97'') ensuring the connection with one of the connection elements and / or a capacitor. Figure for the abstract: Fig. 2

Description

Title of the invention: Power module and manufacturing method

[0001] The present invention relates to semiconductor power modules and their manufacturing methods. Prior art

[0002] Power modules generally comprise at least two electronic chips which are electrically connected to connection elements such as metal legs and may also comprise one or more capacitors which are electrically connected to the chips or to the connection elements.

[0003] Examples of power modules are disclosed in publications FR3115651, WO2018 / 024973 and US9041183.

[0004] In application WO2018 / 024973, the chips are received in housings of adapted form of a support.

[0005] Existing power modules are developed specifically for given chips and take into account the size of the chip and the location of the electrical contacts. Thus, some have screen-printed electrical tracks that depend on the arrangement of these contacts.

[0006] A disadvantage of these modules is the impossibility of using chips other than those for which the module was developed, without having to thoroughly review the manufacturing process, in particular the screen printing steps and / or the shape of the supports receiving the chips.

[0007] However, module manufacturers are sometimes exposed to supply difficulties which require them to change chip suppliers, and the redesign of the manufacturing process when changing chip model and the use of a new model which does not have the same dimensions and / or contact arrangements generates significant manufacturing delays and additional costs. Statement of the invention

[0008] Accordingly, there is a need to remedy this drawback. Summary of the invention

[0009] The invention aims to meet this need and achieves this, according to one of its aspects, by proposing a power module comprising: - A first housing element having a first housing for receiving a first chip, - a first chip at least partially received in the first housing, having electrical contacts, - connection elements electrically connected to the electrical contacts of the first chip,

[0010] at least one insulating shim arranged at least partially in the first housing so as to at least partially cover said chip, having at least one opening providing access to at least one electrical contact of the chip through the shim and / or at least one track ensuring the connection with one of the connection elements and / or a possible capacitor

[0011] Thanks to the invention, it is possible to use several chips having different dimensions and / or contact arrangements, while limiting the changes to be made to the module when switching from one chip model to another.

[0012] Indeed, different shims can be used depending on the chips to make them compatible with a large part of the constituent elements of the module, which can thus remain unchanged.

[0013] This greatly simplifies the replacement of one chip with another, because it is no longer necessary, as in the state of the art, to thoroughly review the manufacturing process.

[0014] Thus, in preferred examples of implementation of the invention, the shim is the only element that needs to be modified to allow the use of a different chip on an existing module.

[0015] The module may include: - A second housing element having a second housing for receiving a second chip, - a third housing element arranged between the first and second housing elements, having in particular at least one third housing for receiving a capacity, - a second chip at least partially received in the second housing, having electrical contacts, - connection elements electrically connected to the electrical contacts of the second chip, - at least one capacitor received at least partially in the third housing and electrically connected to at least one of the chips and / or to the connection elements. Wedge

[0016] The shim can be produced without any conductive element such as an electrical track or alternatively with at least one such conductive element.

[0017] The shim can be made of any suitable material, in particular ceramic or other, its shape being obtained by sintering, 3D printing, machining or otherwise.

[0018] The shim pre-exists when it is placed in the corresponding housing of the module.

[0019] The shape of the shim depends on the chip model associated with it.

[0020] In examples, the wedge has at least one lateral opening on one edge in which engages a corresponding connection element, electrically connected to a contact of the chip. This connection element is for example a metal electrical connection tab, with a flattened cross-section.

[0021] In examples, the shim has on two opposite longitudinal edges two respective lateral openings in which two corresponding connection elements engage electrically connected to two respective contacts of the chip. These connection elements are, for example, metal tabs extending in opposite directions of the power module. These are, for example, contacts corresponding to power terminals of a transistor, such as the source or the drain.

[0022] The connection element(s) may be soldered to the corresponding contact(s) of the chip by any means, for example using solder paste placed at the interface of the components to be soldered together.

[0023] The shim may have on an edge substantially perpendicular to the aforementioned longitudinal edges an additional opening in which an additional connection element electrically connected to a respective contact of the chip engages. This is for example a contact corresponding to a control terminal, for example a gate contact of a power transistor.

[0024] This additional connection element can be soldered directly to a corresponding contact of the chip, or alternatively the shim carries an electrical track soldered to a corresponding contact of the chip and the additional connection element is soldered to the track.

[0025] The first housing which receives the chip may have a rectangular or other shaped outline, the rectangular shape being however preferred.

[0026] The chip may not occupy the entire housing in question, when viewed from above.

[0027] When the chip occupies the entire housing in top view, the housing can allow the chip to be positioned in it, with a mounting clearance. In this case, the shim can just be superimposed on the chip without being interposed between it and one or more edges of the housing. The chip can then only have a thickness compensation role, help in positioning the connection elements and possibly also serve to make an electrical connection between a contact of the chip and a connection element which is not directly superimposed on it.

[0028] On the other hand, when the chip does not occupy the entire housing when viewed from above, the shim advantageously contributes to its positioning in the housing by being inserted between it and at least one edge of the housing.

[0029] Thus, in exemplary embodiments, the shim is longer than the chip in contact with it, and has at least one portion engaged in the housing between the chip and the housing element defining the housing receiving the chip. The shim is interposed for example on at least three sides, in particular four sides, between the chip and the housing element. housing defining the housing receiving the chip.

[0030] The shim may have a face substantially coplanar with a face of the housing element defining the housing receiving the chip in contact with the shim. Other characteristics

[0031] The third housing element may have housings for receiving connection elements positioned so as to allow them to be superimposed with electrical contacts of the second chip.

[0032] The housing elements may have holes passing through them allowing the passage of members for holding the housing elements in the assembled state, in particular screws.

[0033] The module may comprise at least one thermal transfer element in contact with an outer face of a chip, better still two thermal transfer elements each in contact with an outer face of a respective chip, this or these thermal transfer elements each preferably comprising a plate of a metal, preferably copper. Range of modules

[0034] The invention also relates to a range of power modules, comprising at least a first and a second module according to the invention, at least one of the chips of the first module being different from a corresponding chip of the other module, the two modules comprising different shims and at least identical first and second housing elements. By "different chip" it is meant that the chip model is different, by at least one of their dimensions, in particular length and / or width, and / or the arrangement of the contacts.

[0035] The connection elements may be identical, as may the third housing element. Manufacturing process

[0036] The invention also relates to a method for manufacturing a power module, in particular a module according to the invention, as defined above, this module comprising: - A lower housing element having a first housing for receiving a first chip, - a first chip at least partially received in the first housing, having electrical contacts,

[0037] the method comprising the step of: - Cover the chip present in the first housing with an insulating shim, this shim defining at least one opening superimposed on at least one electrical contact of the chip or having an electrical track to be connected to an electrical contact of the chip, in particular a track opening onto a opening of the wedge intended to receive a connection element.

[0038] In such a method, the shim can participate in the positioning of one or more connection elements relative to the chip and in the positioning of the chip in the housing, in particular when the latter is larger than the chip in top view and the latter is interposed between at least one edge of the housing and the chip, the shim being chosen from several pre-existing shims depending on the type of chip used, all these shims being adapted to be positioned in the housing of the lower housing element.

[0039] The shims are for example chosen from a set of shims comprising: - A shim of preferably substantially constant thickness, having two opposite openings on its long sides and one opening on a short side, the dimensions of the shim corresponding substantially to those of the housing of the first housing element, - a shim having two opposite openings on its long sides and one opening on a short side, the dimensions of the shim corresponding substantially to those of the housing of the first housing element, the shim having on its face facing the chip opposite lateral returns intended to be inserted each between a long side of the chip and a corresponding edge of the first housing, as well as at least one end tab intended to be inserted between a short side of the chip and a corresponding edge of the first housing, and at least one portion intended to engage in the housing between the chip and the lower housing element, on the side opposite the end tab; - a shim having two opposite openings on its long sides and one opening on a short side, the dimensions of the shim corresponding substantially to those of the housing of the first housing element, the shim having at least two portions each intended to be interposed between a short side of the shim and a corresponding edge of the housing, the shim having on its face facing the chip opposite lateral returns each intended to be interposed between a long side of the chip and a corresponding edge of the first housing, the shim further having at least one conductive track arranged to be at least partially superimposed on a contact of the chip and on a connection element.

[0040] The aforementioned openings of each wedge may be in the form of notches.

[0041] In an exemplary implementation of the invention, the method comprises the implementation: - An upper housing element having a second housing of receiving a second chip, - An intermediate housing element arranged between the upper and lower elements, - A second chip at least partially received in the second housing, having electrical contacts, - Connecting elements electrically connected to the electrical contacts of the chips, - At least one capacitor electrically connected to at least one of the chips and / or to the connection elements.

[0042] The method advantageously comprises the use of an assembly guide having at least one main housing adapted to receive at least the lower housing element. This assembly guide preferably has secondary housings adapted to receive the connection elements.

[0043] The main housing may have a bottom comprising at least one imprint for receiving a nut or a screw head, and the method may comprise the positioning in the main housing of at least one nut or a screw head before the installation therein of a lower housing element in particular.

[0044] The method may comprise positioning in the bottom of the main housing a heat transfer element, in particular a metal plate, preferably copper.

[0045] In an exemplary implementation, the method comprises the following successive steps: - The optional installation in the main housing of the nut assembly guide in the corresponding housings possibly provided at the bottom of the latter, - The installation of a heat transfer element, preferably in the form of a metal plate, in the main housing, covering the nuts where appropriate, - Installation of the lower housing element on the metal transfer element, - The placement of the first chip in the housing defined by the first housing element, - Placing the shim on the first chip, - The installation of connection elements covering at least one contact of the chip and / or a track to be electrically connected to a contact of the chip, - Installation of the intermediate housing element, - The installation of the capacity on one of the connection elements, in particular in a corresponding housing of the intermediate housing element, this capacity having a first electrical contact opposite the connection element on which it is deposited, - The installation of at least one other connection element extending at least partially opposite a second electrical contact of the capacity, - The installation on the assembly present in the main housing of the assembly guide of the upper housing element, - Installation of the second chip in the housing of the upper element of the housing, - The installation of a second heat transfer element, in particular in the form of a metal plate, preferably copper, - The assembly of the housing elements thus superimposed, using, where appropriate, screws engaged in the nuts, and - Establishing electrical contacts by welding, in particular by subjecting the assembly to a temperature causing the melting of a soldering paste present between the surfaces to be welded.

[0046] The method may include replacing one shim with another of a different shape, adapted to a different chip model.

[0047] The invention also relates to the assembly guide as such, as well as the assembly guide and all of the components of the module intended to be assembled using the guide. Brief description of the drawings

[0048] The invention may be better understood by reading the detailed description which follows, non-limiting examples of its implementation, and by examining the attached drawing, in which:

[0049] [Fig-1] [Fig. 1] is a perspective view of an example of a power module according to the invention,

[0050] [Fig.2] [Fig.2] is an exploded view of the module of [Fig.l], as well as of the guide assembly,

[0051] [Fig.3] [Fig.3] represents the assembly guide in isolation,

[0052] [Fig.4] [Fig.4] illustrates the installation of the nuts in the bottom of the housing main assembly guide,

[0053] [Fig.5] [Fig.5] illustrates the installation of the first copper plate in the main housing of the assembly guide,

[0054] [Fig.6] [Fig.6] illustrates the installation of the first housing element in the main housing of the assembly guide,

[0055] [Fig.7] [Fig.7] illustrates the placement of the first chip in the defined housing by the first housing element,

[0056] [Fig.8] [Fig.8] illustrates the installation of the shim on the first chip,

[0057] [Fig.9] [Fig.9] illustrates the installation of the first connection elements,

[0058] [Fig. 10] [Fig. 10] illustrates the installation of the intermediate housing element,

[0059] [Fig. 11] [Fig. 11] illustrates the implementation of the capacity,

[0060] [Fig. 12] [Fig. 12] illustrates the installation of the other connection elements,

[0061] [Fig. 13] [Fig. 13] illustrates the installation of the upper housing element,

[0062] [Fig. 14] [Fig. 14] illustrates the placement of the second chip in the housing of the upper housing element,

[0063] [Fig. 15] [Fig. 15] illustrates the placement of the second copper plate on the second chip,

[0064] [Fig. 16] [Fig. 16] illustrates the installation of retaining screws,

[0065] [Fig. 17] [Fig. 17] represents the wedge in isolation,

[0066] [Fig. 18] [Fig. 18] is a view similar to [Fig.7] in the case of the use of a different chip,

[0067] [Fig. 19] [Fig. 19] represents in isolation an example of a shim adapted to the chip of [Fig.18],

[0068] [Fig.20] [Fig.20] is a perspective view of the wedge of [Fig. 19] under another viewing angle,

[0069] [Fig.21] [Fig.21] is a view similar to [Fig.7] in the case of the use of a different chip,

[0070] [Fig.22] [Fig.22] represents in isolation an example of a shim adapted to the chip of the [Fig.21],

[0071] [Fig.23] [Fig.23] is a perspective view of the wedge of [Fig.22] under another viewing angle, and

[0072] [Fig.24] [Fig.24] illustrates the establishment of electrical connections between the connector elements and the chip. Detailed description

[0073] The power module 1 shown in [Fig.l] comprises three superimposed housing elements, namely a first housing element 10, lower, a second housing element 20, intermediate, and a third housing element 30, upper.

[0074] The module 1 also comprises connection elements, namely in the illustrated example metal tabs 41 and 42 extending opposite one another on a first side of the module 1, a metal tab 43 extending on the opposite side, and opposite metal tabs 44 and 45 extending from the other two sides.

[0075] The module 1 may comprise, as illustrated on its main faces, thermal transfer plates, one of which 50 is visible in [Fig.l].

[0076] The various housing elements as well as the heat transfer plates can be held by screws 60, as illustrated.

[0077] Module 1 is shown in [Fig.l] before possible encapsulation.

[0078] At least one of the housing elements, for example the lower element 10, may comprise an opening 11 allowing the injection of an insulating filling resin, called “underfiller”.

[0079] If we refer to [Fig.2], we see that the module 1 comprises first 70 and second 80 electronic chips, and at least one shim 90.

[0080] This figure also shows the lower heat transfer plate 51 and the nuts 61 in which the screws 60 engage.

[0081] A capacitor 100 can be arranged between the connection elements 41 and 42.

[0082] Chips 80 and 90 are for example power transistors, for example based of GaN; for example, the source of one is connected to the drain of the other by a midpoint, and the connection elements 41 and 42 are, for example, connected to the drain of one and to the source of the other, while the connection element 43 is connected to the midpoint. The connection elements 44 and 45 are, for example, connected to the gates of these transistors.

[0083] Capacitance 100 is for example a decoupling capacitor, the value of which is for example a few nF.

[0084] In [Fig.2], there is also shown an assembly guide 200 used during the manufacturing of module 1.

[0085] This guide 200 is for example made of plastic and can be produced with relatively coarse manufacturing tolerances by injection molding.

[0086] It may comprise a horizontal base 201 surmounted by a vertical wall 207 which defines a main housing 202 and four secondary housings 203 to 206, arranged around the main housing 202 as are the connection elements on the module.

[0087] The assembly guide has been shown in isolation in [Fig. 3]. It can be seen that the bottom of the main housing 201 has indentations 208 for receiving the nuts 61.

[0088] We will now describe in more detail, with reference to figures 4 to 17, the various constituent elements of the module as well as an example of a manufacturing method thereof.

[0089] The manufacturing process may begin, when screws are used to hold the housing elements together, by arranging the nuts 61 in the corresponding indentations 208, as illustrated in [Fig.4].

[0090] Then, as illustrated in [Fig.5], the lower plate 51 is placed in the bottom of the housing 201; this plate has holes 52 for the passage of the screws 60.

[0091] In the example considered, the plate 51 is made of copper, but it can be replaced by any suitable heat sink, for example made of another metal or a heat-conducting ceramic.

[0092] The installation of the various constituent elements of the module can be done using any suitable tool, in particular conventional “pick and place” type tools.

[0093] The lower housing element 10 can then be deposited in the housing 101.

[0094] This element 10 comprises a first central housing 12, passing through, intended to receive the first chip 70, and non-passing housings 13, 14 and 15 to receive respectively the connection elements 41, 45 and 43. These housings 13, 14 and 15 open into the housings 203, 204 and 205 of the guide 200, respectively. Holes 16 are provided for the passage of the screws 60.

[0095] [Fig.7] shows the guide 200 after the chip 70 has been placed in the housing 12.

[0096] In this example, the chip 70 has a generally parallelepiped shape whose outline in top view corresponds substantially to that of the housing 12.

[0097] The chip 70 may have electrical contacts 71, 72 and 73 on its internal face.

[0098] The wedge 90 is shown in isolation in [Fig. 17].

[0099] This has a length and width adapted to its positioning in the housing 12 with little play.

[0100] It can be made of any electrically insulating material compatible with the conditions of use, for example a ceramic or a polymer material.

[0101] The wedge 90 has two lateral openings 91 and 92 and an opening 93 at the end, in the form of notches.

[0102] Once the shim 90 is placed on the chip 70, as illustrated in [Fig.8], the contacts 71, 72 and 73 remain accessible through the openings 91, 92 and 93 respectively.

[0103] The connection elements 41 and 45 can then be placed in the housings 203 and 204, respectively, partially covering the contacts 71 and 73, as illustrated in [Fig. 9]. A solder paste can be deposited at the interface between the chip contacts and the connection elements, for subsequent soldering.

[0104] It may be useful to produce in the housings 13 and 15 reliefs 313 and 315 intended to cooperate with corresponding reliefs of the connection elements received in these housings, so as to improve the positioning and holding of the connection elements during the assembly operations. The reliefs 313 or 315 are for example in the form of bosses facing each other and the connection element then has two notches 341 or 343, visible in FIGS. 10 and 12 respectively, intended to fit onto these bosses.

[0105] Cooperating reliefs in the form of bosses and notches between the housing elements and the connection elements may exist for each of the five elements. of the module's connection, as visible in the figures, and will not be described in detail each time in the following.

[0106] Then, the intermediate housing element 20 can be placed in the housing 201 to cover the components already present.

[0107] The element 20 has holes 23 for the passage of the screws 60, and openings 24, 25 and 26 intended to receive the connection elements 44, 42 and 43 respectively.

[0108] The opening 26 provides access to the contact 72 of the chip 70.

[0109] In the step illustrated in [Fig. 11], the capacitor 100 is placed on the connection element 41, in the opening 25.

[0110] The connection element 42 can then be put in place to cover the capacity 100, as illustrated in [Fig. 12], and the capacity 100 serves as a spacer between the connection elements 41 and 42.

[0111] The connection element 43 is placed on the opposite side.

[0112] Solder paste is placed when necessary between the components to be soldered, in particular between the capacitor 100 and the connection elements 41 and 42 and between the connection element 43 and the corresponding contact 72 of the chip 70.

[0113] The connection element 44 is placed in a corresponding housing 27 of the housing element 20.

[0114] Next, the housing element 30 is placed on the previously installed connection elements, as illustrated in [Fig. 13].

[0115] The housing element 30 has a central opening 33, for example rectangular in shape, as illustrated. This opening 33 provides access to the connection elements 42, 43 and 44.

[0116] The housing element 30 has holes 32 for the passage of the screws 60.

[0117] The second chip 80 can then be arranged in the housing 33, as illustrated in [Fig. 14].

[0118] This chip 80 has contacts on its inward-facing face, which are positioned opposite the connector elements 42, 43 and 44 respectively.

[0119] A solder paste may be placed at the interface between the contacts of the chip 80 and the connection elements, so as to allow soldering during a subsequent baking step.

[0120] Once the chip 80 is in place, a second heat transfer plate 50, for example made of copper, can be placed against the chip 80, as illustrated in [Fig. 15], this plate 50 being for example identical to the first plate 51, and having, like the latter, holes for the passage of the screws 60. The latter can then be mounted and engaged on the nuts 61 present in the bottom of the main housing 202 of the guide 200, as illustrated in [Fig. 16].

[0121] Once the screws 60 are tightened, the assembly can be removed from the guide 200 and cooked in a oven at a temperature suitable for melting the solder paste and for carrying out the welds to be made between the different components of the module.

[0122] After welding, a filling resin can be injected through the orifice 11 and the assembly can be encapsulated if necessary in an encapsulating resin, leaving the connection elements accessible, as well as the copper plates where appropriate when thermal coupling to a radiator is provided.

[0123] The use of a shim 90 is advantageous, because it allows the first chip 70 to be replaced by a second 70' of a different format, without modifying the lower housing element 10, as illustrated in [Fig. 18].

[0124] In the illustrated example, the chip 70' has smaller dimensions than those of the chip 70.

[0125] The shim 90 can be replaced by a shim 90' shown in isolation in Figures 19 and 20, having openings 91', 92' and 93' like the shim 90, as well as on one face projecting portions intended to engage in the space provided between the chip 90' and the edge of the housing 12.

[0126] In the example considered, the wedge 90' ​​thus comprises two end tabs 94' located on either side of the opening 93', intended to engage between the chip 70' and the small side 12a of the housing 12.

[0127] The shim 90' also includes two side tabs 95' each configured to fit between a large side of the chip 70' and a large side 12b of the housing.

[0128] The wedge 90' ​​comprises, on the side opposite the legs 94', a heel 96' arranged to engage between the chip 70' and the other small side 12a of the housing 12.

[0129] Thus, the shim 90' is positioned precisely in the housing 12, due to its external dimensions, while maintaining the chip 70' precisely within the housing 12, at a location which is suitable for establishing electrical connections with the associated connection elements.

[0130] When the chip model used does not have the same electrical contacts as those of the other chips used, the shim may comprise at least one conductive track making it possible to electrically connect at least one corresponding contact of the chip to an associated connection element.

[0131] As an example, such a situation is illustrated in Figures 21 to 24.

[0132] [Fig. 21] shows a variant of chip 70” which is not only smaller than chip 70, just like chip 70', but which also has contacts 71”, 72” and 73” arranged differently, with in particular a contact 73” laterally offset from the connection element 45. In [Fig. 21], the connection element has been shown to illustrate this offset, although installed later.

[0133] The 90” wedge has, like the other wedges 90 and 90', housings 91”, 92” and 93”, to receive respectively the ends of the connection elements 41, 43 and 45.

[0134] The 90” wedge has reliefs allowing the 70” chip to be positioned in the housing 12, for example 95” side tabs and 96” end portions.

[0135] The 95” legs may for some extend to the adjacent end portion.

[0136] The 90'' wedge comprises a conductive track 97”, for example in the shape of an elbow as illustrated, positioned so as to overlap at one end 97a” with the contact 73”. The track 97” extends to the other end 97b” in the bottom of the housing 93”, in order to be connected to the connection element 45.

[0137] The 97” track is for example integrated into the 90” shim during the latter’s manufacturing process. This can be a metal part inserted into the ceramic or produced by injection or screen printing.

[0138] The housing elements 10, 20 and 30, as well as the shim 90, 90' or 90”, can be manufactured so as to pre-exist during assembly, in any electrically insulating material(s) compatible with the intended use, for example in a ceramic, in particular by a 3D printing or sintering process. The material is chosen to thermally resist the contact soldering operation, and the heat released during normal use of the module and the operating environment; thus the assembly can withstand a temperature of at least 150°C for example.

[0139] To make the electrical connections, a soldering paste can be used, the invention not being limited to a particular technique for establishing the electrical connections.

[0140] The invention is not limited to the examples which have just been described.

[0141] For example, the module may include more than one wedge, and in particular it is possible use a second shim to allow mounting as a second chip, chips of different sizes and / or contact implementations; if necessary, the intermediate package element is also modified to facilitate the adaptation of different chip models.

[0142] It is also possible to assemble more than two chips within a module, and to use one or more shims allowing the use of different chip models.

[0143] The housings of the package elements intended to receive the chips may have a shape other than rectangular, for example square or other. It is possible to have several housings intended to receive respective chips on the same package element, and to have one or more shims associated with these chips.

[0144] Certain connection elements, for example elements 44 and 45 connected to the gates of the transistors, can come out of the same side of the housing to facilitate control of the module.

Claims

Claims

1. Power module (1) comprising - A first housing element (10) having a first housing (12) for receiving a first chip (70; 70'; 70”), - a first chip (70; 70'; 70”) at least partially received in the first housing, having electrical contacts (71, 72, 73; 71', 72', 73'; 71”, 72”, 73”), - connection elements (41, 43, 45) electrically connected to the electrical contacts of the first chip, - at least one insulating shim (90; 90'; 90”) arranged at least partially in the first housing so as to at least partially cover said chip, having at least one opening (91, 92; 91', 92'; 91”, 92”) providing access to at least one electrical contact of the chip through the wedge and / or at least one track (97”) ensuring the connection with one of the connection elements and / or a possible capacity.

2. Module according to claim 1, comprising: - A second housing element (30) having a second housing (33) for receiving a second chip (80), - a third housing element (20) arranged between the first and second housing elements, in particular having at least one third housing (25) for receiving a capacitor (100), - a second chip (80) at least partially received in the second housing, having electrical contacts, - connection elements (42, 44) electrically connected to the electrical contacts of the second chip, - at least one capacitor (100) received at least partially in the third housing (25) and electrically connected to at least one of the chips and / or to the connection elements (41, 42).

3. Module according to claim 1 or 2, the wedge (90; 90'; 90”) having on one edge at least one lateral opening in which a corresponding connection element engages, electrically connected to a contact of the chip.

4. Module according to claim 3, the wedge having on two opposite longitudinal edges two respective lateral openings in which two corresponding connection elements engage electrically connected to two respective contacts of the chip.

5. Module according to one of claims 3 and 4, the connection element(s) being soldered to the corresponding contact(s) of the chip.

6. Module according to the preceding claim, the wedge having on an edge substantially perpendicular to the longitudinal edges an additional opening (93; 93'; 93”) in which an additional connection element electrically connected to a respective contact of the chip engages.

7. Module according to claim 6, the additional connection element being soldered to a corresponding contact of the chip.

8. Module according to claim 6, the wedge carrying an electrical track (73”) soldered to a corresponding contact of the chip and the additional connection element being soldered to the track.

9. Module according to any one of the preceding claims, the shim being longer than the chip in contact with it, and having at least one portion (96'; 96”) engaged in the housing between the chip and the housing element defining the housing receiving the chip in contact with the shim.

10. Module according to the preceding claim, the shim being interposed on at least three sides, in particular four sides, between the chip and the housing element defining the housing receiving the chip in contact with the shim.

11. Module according to any one of the preceding claims, the shim having a face substantially coplanar with a face of the housing element defining the housing receiving the chip in contact with the shim.

12. Module according to any one of the preceding claims, the intermediate housing element (20) having housings for receiving connection elements positioned so as to allow them to be superimposed with electrical contacts of the second chip.

13. Module according to any one of the preceding claims, the housing elements being crossed by holes allowing the passage of members for holding the housing elements in the assembled state, in particular screws (60).

14. Module according to any one of the preceding claims, comprising at least one thermal transfer element (50; 51) in contact with an outer face of a chip, better still two thermal transfer elements each in contact with an outer face of a respective chip, this or these thermal transfer elements each preferably comprising a plate of a metal, preferably copper.

15. Range of power modules, comprising at least a first and a second module (1) according to any one of the preceding claims, at least one of the chips of the first module being different from a corresponding chip of the other module, the two modules comprising different shims and identical housing elements (10, 20).

16. Range according to the preceding claim, the connection elements (41, 42, 43, 44, 45) being identical.

17. Method for manufacturing a power module, in particular a module (1) according to any one of the preceding claims, this module comprising: - A lower housing element (10) having a first housing for receiving a first chip, - A first chip (70; 70'; 70”) at least partially received in the first housing, having electrical contacts, the method comprising the steps consisting of: - Covering with an insulating shim (90; 90'; 90”) the chip present in the first housing, this shim defining at least one opening (91, 92; 91', 92'; 91”, 92”) superimposed on at least one electrical contact of the chip or having an electrical track (97”) to be connected to an electrical contact of the chip, in particular a track opening onto an opening of the shim intended to receive a connection element.

18. Method according to claim 17, the shim being chosen from several pre-existing shims (90; 90'; 90”) depending on the type of chip used, all these shims being adapted to be positioned in said housing of the lower package element, the shims preferably being chosen from a set of shims comprising: - A shim (90), preferably of substantially constant thickness, having two opposite openings on its long sides and one opening on a short side, the dimensions of the shim corresponding substantially to those of the housing of the first housing, - A shim (90') having two opposite openings on its long sides and one opening on a short side, the dimensions of the shim corresponding substantially to those of the housing of the first package element,the shim having on its face facing the chip opposite lateral returns intended to be inserted each between a large side of the chip and a corresponding edge of the first housing, as well as at least one end tab intended to be inserted between a small side of the chip and a corresponding edge of the first housing, and at least one, portion intended to engage in the housing between the chip and the lower housing element, on the side opposite the end tab; - A shim (90”) having two opposite openings on its long sides and one opening on a short side, the dimensions of the shim corresponding substantially to those of the housing of the first housing element, the shim having at least two portions each intended to be interposed between a short side of the shim and a corresponding edge of the housing, the shim having on its face facing the chip opposite lateral returns each intended to be interposed between a long side of the chip and a corresponding edge of the first housing, the shim further having at least one conductive track (97”) arranged to overlap at least partially a contact of the chip and a connection element.

19. Method according to one of claims 17 and 18, the method comprising the installation of: - An upper housing element (30) having a second housing (33) for receiving a second chip, - An intermediate housing element (20) arranged between the upper and lower elements, having at least a third housing for receiving a capacitor, - A second chip at least partially received in the second housing, having electrical contacts, - Connection elements electrically connected to the electrical contacts of the chips, - At least one capacitor received at least partially in the third housing and electrically connected to at least one of the chips and / or to the connection elements.

20. A method according to any one of claims 17 to 19, comprising the use of an assembly guide (200) having at least one main housing (201) adapted to receive at least the lower housing element.

21. Method according to claims 19 and 20, the assembly guide having secondary housings adapted to receive the connection elements.

22. Method according to one of claims 20 and 21, the main housing having a bottom comprising at least one imprint (208) for receiving a nut or a screw head, the method comprising the positioning in the main housing of at least one nut or a head screws before installing the first housing element in particular.

23. Method according to one of claims 20 to 22, comprising the positioning in the bottom of the main housing of a heat transfer element, in particular a metal plate, preferably copper.

24. Method according to claims 17 to 23, comprising the following successive steps: - The optional placement in the main housing of the nut assembly guide in the corresponding housings possibly provided at the bottom thereof, - The placement of a heat transfer element, preferably in the form of a metal plate, in the main housing, covering the nuts if necessary, - The placement of the lower housing element (10) on the metal transfer element, - The placement of the first chip (70; 70'; 70”) in the housing (12) defined by the first housing element, - The placement of the shim (90; 90'; 90”) on the first chip, - The placement of connection elements covering at least one contact of the chip and / or a track to be electrically connected to a contact of the chip, - The placement of the intermediate housing element (20),- The placement of the capacitor (100) on one of the connection elements, in particular in a corresponding housing of the intermediate housing element, this capacitor having a first electrical contact opposite the connection element on which it is deposited, - The placement of at least one other connection element extending at least partially opposite a second electrical contact of the capacitor (100), - The placement on the assembly present in the main housing of the assembly guide of the upper housing element (30), - The placement in the housing of the upper housing element of the second chip (80), - The placement of a second heat transfer element (50), in particular in the form of a metal plate, preferably made of copper, - The assembly of the housing elements thus superimposed, using, if necessary, screws (60) engaged in the nuts, - Establishing electrical contacts by welding.

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