Electronic equipment comprising a waterproof case, associated assembly and method

Abstract

An electronic equipment (1) comprising a sealed housing (10) comprising walls (10A, 10B, 10L) and defining an interior cavity (2) configured to receive at least one electronic card (3), at least one air flow generator (4) configured to generate a circulation of at least one air flow in the interior cavity (2) so as to allow convection cooling via the walls (10A, 10B, 10L) of the housing (10), the air flow generator (4) comprising at least one motor (41) and at least one blower (42), driven by the motor (41), configured to generate the circulation of at least one air flow in the interior cavity (2), the blower (42) being positioned in the interior cavity (2), the motor (41) being positioned outside the interior cavity (2). Abstract figure: Figure 1

Description

Title of the invention: Electronic equipment comprising a sealed housing, associated assembly and method Technical field

[0001] The present invention relates to the field of electronic equipment, particularly in the aeronautical field, more precisely the thermal management of electronic equipment.

[0002] Most electronic equipment in the aeronautical field is in the form of boxes defining an interior cavity in which several electronic cards are housed. These boxes protect the electronic cards from possible shocks, and keep the electronic cards in place. These boxes also allow several electronic cards to be connected together in order to combine their computing power, and also allow them to be connected to the aircraft's electronic network. These electronic cards generate heat during their operation that can damage their electronic components if it is not managed adequately. In addition, they can generate significant heat in the event of a malfunction, which can damage nearby cards and equipment.

[0003] It is known to ventilate the interior of a case with air coming from outside the electronic equipment. Such a solution is only possible for non-watertight electronic equipment, which is not compatible with certain electronic cards and certain standards in the aeronautical field.

[0004] For sealed electronic equipment, it is known to use liquid or air-liquid cooling. This has the disadvantage of increasing the mass of the equipment and increasing the cost of installation and maintenance.

[0005] It is also known to evacuate internal heat passively by convection via the walls of the case. Such cooling is inefficient and does not allow the internal heat generated by the electronic cards to be optimally evacuated, in particular during heating linked to a malfunction.

[0006] The invention thus aims to eliminate at least some of these drawbacks. PRESENTATION OF THE INVENTION

[0007] The invention relates to electronic equipment comprising: • A waterproof housing comprising walls and defining an interior cavity configured to receive at least one electronic card, • At least one airflow generator configured to generate a circulation of at least one airflow in the interior cavity so as to allow a convection cooling via the walls of the case, • The air flow generator comprising at least one motor and at least one blower, driven by the motor, configured to generate the circulation of at least one air flow in the interior cavity, the blower being positioned in the interior cavity, the motor being positioned outside the interior cavity.

[0008] The invention advantageously allows cooling of the interior of the housing while ensuring the sealing of said housing. The circulation of the air flow advantageously allows cooling through the interior of the housing. The invention also makes it possible to avoid generating calories in the interior cavity while limiting the dimensions of the interior cavity. This advantageously makes it possible to optimize the cooling of the interior cavity.

[0009] According to one aspect, the electronic equipment comprises at least one heat exchange device comprising an internal exchanger positioned in the interior cavity, the blower being positioned adjacent to the internal exchanger. This makes it possible to optimize the heat exchanges with the upper wall of the housing which forms a “cold” zone. This thus makes it possible to optimize the evacuation of calories from the interior cavity by convection.

[0010] According to one aspect, the electronic equipment comprises several heat exchange devices, making it possible to optimize the evacuation of calories through the walls of the housing.

[0011] According to one aspect, the internal exchanger comprises several walls, so as to create a path connecting the different blowers. This advantageously makes it possible to maximize the heat exchange between the air coming from the internal cavity and the internal exchanger.

[0012] According to one aspect, the internal exchanger is a “pin-fin” exchanger known to those skilled in the art, comprising several pins advantageously making it possible to increase the heat exchange surface of the upper wall inside the housing. The pins advantageously make it possible to generate vortices which allow better mixing of the air in the exchanger, and therefore better cooling of the air, improving the refrigeration of the electronic cards.

[0013] According to one aspect, the interior cavity comprises an upper duct delimited by a partition wall comprising at least one through opening for each blower.

[0014] According to one aspect, the internal exchanger is mounted in the upper conduit.

[0015] According to one aspect, the interior cavity defining a plurality of cooling channels arrangement, at least one blower being mounted in each cooling channel so as to generate the circulation of at least one air flow in each cooling channel. This advantageously makes it possible to cool the various components electronics in a localized manner, increasing the precision and efficiency of cooling.

[0016] According to one aspect, the interior cavity comprises a lower duct configured to fluidly connect the plurality of cooling channels. This advantageously makes it possible to efficiently control the circulation of the different air flows by controlling the air flow generators.

[0017] According to one aspect, the electronic equipment comprises a motherboard on which the electronic card is fixed, the motherboard delimiting the lower duct, the motherboard comprising passage openings. The motherboard thus fulfills a role of separator of the lower duct, which is advantageous.

[0018] According to one aspect, the electronic equipment comprises several electronic cards, each electronic card comprising at least one lateral fin, the lateral fins of adjacent electronic cards cooperating in order to delimit the lower duct. The lower duct is thus delimited by assembly during the mounting of the electronic cards in the electronic equipment.

[0019] According to one aspect, the blowers and the passage openings are arranged so as to be symmetrically opposed with respect to the center of their respective cooling channel, advantageously allowing efficient sweeping of the entire cooling channel.

[0020] Also presented is a set comprising: • electronic equipment, as presented previously, comprising a plurality of air flow generators and • a control system configured to control the plurality of airflow generators.

[0021] This assembly advantageously makes it possible to regulate the ventilation of the interior cavity, and to adapt it to current needs.

[0022] According to one aspect, the electronic equipment comprising at least one temperature sensor configured to measure at least one temperature relating to at least one electronic card, the control system is configured to control the plurality of air flow generators as a function of the measured temperature. This advantageously makes it possible to cool electronic cards in a state of overheating as a priority, and thus to extend the lifespan of the electronic equipment.

[0023] Also presented is an aircraft comprising an assembly as presented previously.

[0024] Also presented is a method of using an assembly as presented above, the plurality of airflow generators being in a nominal configuration, the method comprising steps of: • Determine at least one electronic card that is overheating, • Determine a cooling requirement for said overheated electronic card, • Modify the configuration of the plurality of airflow generators according to the determined cooling requirement. PRESENTATION OF FIGURES

[0025] The invention will be better understood on reading the description which follows, given by way of example, and referring to the following figures, given by way of non-limiting examples, in which identical references are given to similar objects.

[0026] [Fig.l] is a schematic representation of a sectional view of electronic equipment according to a first embodiment.

[0027] [Fig.2] is a schematic representation of a close-up sectional view of the assembly of an airflow generator.

[0028] [Fig. 3] is a schematic representation of a front sectional view of electronic equipment according to a first embodiment.

[0029] [Fig.4] is a schematic representation of a front sectional view of an electronic card according to a second embodiment.

[0030] [Fig.5] is a schematic representation of a front sectional view of electronic equipment according to a second embodiment.

[0031] [Fig.6] is a schematic representation of a bottom sectional view of electronic equipment through the cooling channels.

[0032] [Fig.7] is a schematic representation of a top sectional view of electronic equipment through the cooling channels.

[0033] [Fig.8] is a schematic representation of a bottom sectional view of electronic equipment through the internal exchanger.

[0034] [Fig.9] is a schematic representation of a control system for air flow generators.

[0035] [Fig. 10] is a schematic representation of the cooling of the interior cavity according to a nominal configuration.

[0036] [Fig. 11] is a schematic representation of a cooling configuration upon detection of overheating.

[0037] [Fig. 12] is a schematic representation of a cooling configuration upon detection of critical overheating.

[0038] [Fig. 13] is a schematic representation of a cooling configuration with a malfunctioning airflow generator.

[0039] It should be noted that the figures set out the invention in detail to implement the invention, said figures can of course be used to better define the invention where applicable. DETAILED DESCRIPTION OF THE INVENTION

[0040] The invention will be presented for an electronic equipment 1 of an aircraft. In this example, the electronic equipment 1 is a computer performing different functions of the aircraft, for example the determination of a flight plan or the automatic reconfiguration of a part of the electrical network of the aircraft. It goes without saying that the invention applies to an electronic equipment 1 in other technical fields.

[0041] With reference to [Fig. 1], there is shown an electronic equipment 1 comprising a sealed housing 10, hereinafter called “housing 10”, comprising walls 10A, 10B, 10L and defining an interior cavity 2 receiving several electronic cards 3. The electronic equipment 1 further comprises several air flow generators 4 for generating a circulation of at least one air flow in the interior cavity 2 so as to allow cooling by convection via the walls 10A, 10B, 10L of the housing 10.

[0042] In this example, each air flow generator 4 comprises a motor 41 and a blower 42 driven by the motor 41 via a drive shaft 43. The blower 42 is configured to generate the circulation of at least one air flow in the interior cavity 2. As illustrated in [Fig.l], the blower 42 is positioned in the interior cavity 2 while the motor 41 is positioned outside the interior cavity 2. This makes it possible to avoid generating calories in the interior cavity 2 while limiting the dimensions of the interior cavity 2 as will be presented later.

[0043] In this example, the housing 10 has a block shape, as shown in [Fig.l], defined in a reference frame (X, Y, Z) in which the X axis extends longitudinally, the Y axis extends laterally and the Z axis extends vertically. In this example, the housing 10 comprises a bottom wall 10A, two side walls 10L and a top wall 10B. The housing 10 is preferably made of aluminum alloy to ensure optimal heat convection.

[0044] In this example, the housing 10 accommodates ten electronic cards 3, but it goes without saying that it could accommodate a different number. In this example, the electronic cards 3 are flat and extend parallel to the plane X, Z but other orientations are possible. The electronic cards 3 are preferably connected to a motherboard 7 which will be presented later.

[0045] In this example, the electronic equipment 1 comprises a plurality of air flow generators 4, in particular eleven so as to optimize cooling as will be presented later. With reference to [Fig.l], the air flow generators 4 are mounted through the upper wall 10B. It goes without saying that their number could be different, preferably greater than or equal to the number of electronic cards. Ironics 3 to cool, so as to sufficiently scan all the electronic cards 3.

[0046] In this example, the upper wall 10B fulfills a privileged function for heat transfer. The upper wall 10B will also be referred to as the “cold zone”. It goes without saying that a different wall or several walls could have this privileged function.

[0047] In this example, the motor 41 is a brushless DC motor. It goes without saying that other types of motors could be used, such as variable reluctance synchronous motors, wound rotor synchronous motors, or axial or radial flux motors. As illustrated in [Fig. 2], the motor 41 ensures the sealing of the housing 10 at the upper wall 10B. An example of mounting an air flow generator 4 will be presented later with reference to [Fig. 2].

[0048] In this example, with reference to [Fig.l], the air flow generators 4 are connected to a control system S, wired or wireless, which preferably allows the air flow generators 4 to be controlled individually. A command may correspond to an activation, deactivation, a direction of rotation of the blower 42 as well as the adjustment of the rotation speed.

[0049] The air flow generated by the blower 42 advantageously makes it possible to move the air in contact with the electronic cards 3 towards the walls of the housing 10 in order to evacuate the calories by thermal convection, in particular, at the level of the “cold zone”. The positioning of the motor 41 outside the interior cavity 2 makes it possible to prevent the motor 41 from generating calories in the interior cavity 2, which makes it possible to improve the cooling of the electronic cards 3.

[0050] In this example, with reference to Figures 1 and 2, the electronic equipment 1 comprises a heat exchange device 5. The heat exchange device 5 is mounted at the upper wall 10B of the housing 10. In this example, the heat exchange device 5 forms the upper wall 10B of the housing 10. As illustrated in [Fig.l], the heat exchange device 5 comprises an internal exchanger 52 oriented towards the interior cavity 2 to capture the calories in the interior cavity 2 and an external exchanger 51 oriented towards the outside to evacuate the calories into the outside environment. It goes without saying that the heat exchange device 5 could comprise only one internal exchanger 52. This makes it possible to optimize the heat exchanges with the upper wall 10B of the housing 10. In this example, the blower 42 is positioned adjacent to the internal exchanger 52.This advantageously allows the blowers 42 to move air in contact with the “cold” zone towards the electronic cards 3 as will be presented later.

[0051] In this example, with reference to [Fig.2], the external exchanger 51 is a finned heat exchanger comprising several dissipation fins 51 A. It goes without saying that other types of exchangers would be suitable, such as a plate exchanger or a “pin-fin” exchanger. In this example, the internal exchanger 52 is a “pin-fin” heat exchanger known by its English designation “pins-fins”. The internal exchanger 52 thus comprises several pins 52A advantageously making it possible to increase the heat exchange surface of the upper wall 10B inside the housing 10. The pins 52A advantageously make it possible to generate vortices which allow better mixing of the air in the internal exchanger 52, and therefore better cooling of the air, improving the refrigeration of the electronic cards. 3.

[0052] In this example, as shown in [Fig.2], the external exchanger 51 comprises several dissipation fins 51A projecting outwards. This advantageously makes it possible to increase the heat exchange surface of the upper wall 10B, and thus to improve its heat dissipation capacity.

[0053] Still referring to [Fig. 2], in a preferred embodiment, the motor 41 of each airflow generator 4 is fixed on a dissipation fin 51A. The drive shaft 43, which connects the motor 41 to the blower 42 in the internal exchanger 52, passes through the dissipation fin 51A via a channel 510 formed in the latter so as to allow the mounting of the drive shaft 43 with a clearance in the channel 510. As illustrated in [Fig. 2], a seal 51B is positioned between the motor 41 and the dissipation fin 51A so as to seal the channel 510. This advantageously makes it possible to maintain the sealing of the housing 10 while allowing the motor 41 to be outside the housing 10.

[0054] According to another embodiment, the electronic equipment 1 comprises a second heat exchange device (not shown), preferably on the wall opposite the first heat exchange device 5. In this example, the second heat exchange device 5 would be mounted on the lower wall 10A. This advantageously makes it possible to improve the heat exchange between the interior cavity 2 and the exterior, and thus the cooling of the air flows and therefore of the electronic cards 3. Mounting in an opposite manner makes it possible to distribute the “cold zones” while allowing the equipment to be mounted next to each other.

[0055] Referring again to [Fig.l], the interior cavity 2 comprises an upper duct 71 in which the internal exchanger 52 extends. The upper duct 71 is delimited by a partition wall 9 comprising a through opening 91 for each blower 42, so as to allow the circulation of air. In other words, the partition wall 9 forms a fairing for the blowers 42. This advantageously makes it possible to control the flow rate and direction of the air flow in the upper duct 71, and thus to prioritize certain cooling channels 6, as will be presented later. In this example, the upper duct 71 is defined by the space between the internal exchanger 52 and the partition wall 9.

[0056] In this example, still with reference to [Fig.l], the interior cavity 2 defines ten cooling channels 6 extending parallel to the plane (X, Z), a blower 42 being mounted in each cooling channel 6 so as to generate the circulation of an air flow in each cooling channel 6. It goes without saying that the number of cooling channels 6 could be different. Preferably, the cooling channels 6 have a width L6 ([Fig.6]) corresponding to the spacing between two adjacent electronic cards 3. This width L6 is preferably between 7mm and 70mm.

[0057] In this example, the blowers 42 move the air cooled by the internal exchanger 52 present in the upper duct 71 towards the different cooling channels 6. Depending on the direction of rotation of a blower 42, the air flow can circulate upwards or downwards in a cooling channel 6. For the sake of clarity and conciseness, a "downward channel" is designated a cooling channel 6 in which a downward air flow Fd circulates, that is to say, coming from the "cold zone". Similarly, an "upward channel" is designated a cooling channel 6 in which an upward air flow Fa circulates, that is to say, directed towards the "cold zone".

[0058] According to one embodiment, several blowers 42, preferably two, are mounted in each cooling channel 6. This advantageously makes it possible to move more air and thus to better cool the electronic cards 3. Preferably, the blowers 42 of a cooling channel 6 are offset longitudinally.

[0059] Still with reference to [Fig.l], the interior cavity 2 further comprises a lower duct 72 configured to fluidly connect the plurality of cooling channels 6. This advantageously makes it possible to collect the hot air flows from the descending channels before discharging them into the ascending channels. According to one aspect, the electronic equipment 1 comprises a second heat exchange device 5 adjacent to the lower duct 72. This advantageously makes it possible to more effectively cool the air present in the housing 10, and therefore the electronic cards 3.

[0060] The air present in the upper duct 71 thus communicates with the lower duct 72 via the cooling channels 6. According to an embodiment shown in FIGS. 1 and 3, the motherboard 7 delimits the lower duct 72. The electronic cards 3 are fixed to the motherboard 7. With reference to [Fig. 3], the motherboard 7 comprises passage openings 21P. This advantageously makes it possible to connect the lower duct 72 to the various cooling channels 6.

[0061] According to another embodiment, shown in [Fig.5], the electronic cards 3 are inserted into the interior cavity 2 and connected to a motherboard forming the upper partition 9. Such a configuration allows for simpler maintenance of the electronic cards 3. This also advantageously makes it easier to the insertion and connection of the electronic cards 3 in the box 10.

[0062] In this example, the height of an electronic card 3 occupies the entire height between the partition wall 9 and the lower wall 10A. In order to allow a fluid connection between the cooling channels 6, each electronic card 3 comprises a through opening 31. It goes without saying that the number of through openings 31 could be different.

[0063] In order to form a lower duct 72, with reference to [Fig.4], each electronic card 3 comprises two lateral fins 32A, 32B. Once mounted in the interior cavity 2, the lateral fins 32A, 32B of adjacent electronic cards 3 cooperate in order to delimit the lower duct 72. In order to allow a fluid connection between the cooling channels 6 and the lower duct 72, at least one lateral fin 32A, 32B comprises at least one passage opening 21P. It goes without saying that an electronic card 3 could comprise only one lateral fin 32A, 32B.

[0064] With reference to Figures 5 to 7, the blowers 42 are arranged in a staggered pattern in a plane parallel to the plane (X, Y). This makes it possible to associate a blower 42 with each cooling channel 6 while optimizing the space available in the internal exchanger 52. With reference to [Fig.7], the passage openings 21P are arranged in a staggered pattern in another plane parallel to the plane (X, Y). Preferably, the passage opening 21P associated with a cooling channel 6 is positioned at a longitudinal end opposite the blower 42 associated with said cooling channel 6. This advantageously allows the air flow generated by each blower 42 to cover the entire cooling channel 6.

[0065] In this example, the motors 41 are arranged in a staggered pattern, along the same axis as their respective blowers 42. This advantageously simplifies assembly by using a straight drive shaft 43, as illustrated in [Fig.2]. It goes without saying that the motors 41 could be arranged in another manner, so as to provide flexibility to the architecture of the electronic equipment 1. This advantageously makes it possible to use the electronic equipment 1 in several different storage configurations.

[0066] With reference to [Fig.8], the upper duct 71 comprises several walls 71A, so as to create a circulation path, in particular a zigzag one, connecting the different blowers 42. According to a preferred aspect, the walls 71A belong to the internal exchanger 52. This advantageously makes it possible to maximize the heat exchange between the air in the interior cavity 2 and the internal exchanger 52. The placement of the air flow generators 4 and the walls 71A advantageously makes it possible to avoid the creation of air flow recirculation phenomena and therefore so-called “dead” zones, where the air flows in the internal exchanger 52 would come into conflict and disrupt would prevent air circulation in the housing 10.

[0067] In this example, with reference to Figures 9 and 10, the electronic equipment 1 comprises a temperature sensor 8 measuring a temperature T relative to an electronic card 3, preferably continuously. Preferably, several temperature sensors 8 measure the temperature of several electronic cards 3. According to one aspect, the electronic equipment 1 also comprises a temperature sensor 8 near each electronic component that needs to be protected from heat. In this example, the temperature sensors 8 are pre-mounted on the different electronic cards 3 and the temperature measurements are transmitted via the connection of the electronic cards 3. It goes without saying that other forms of communication could be envisaged.

[0068] With reference to [Fig.9], the invention comprises a control system S controlling the air flow generators 4 as a function of the temperatures T from three temperature sensors 8.

[0069] The control system S controls each air flow generator 4 as a function of the measured temperatures T. Preferably, the control system S is configured so as to prioritize the refrigeration of certain cooling channels 6 over others. Depending on the measured temperatures, the control system S determines a cooling requirement which may depend on the refrigeration priorities, the maximum temperatures supported by the various electronic components or others.

[0070] With reference to [Fig. 10], a default nominal configuration of the air flow generators 4 is shown in which the cooling channels are alternately traversed by a descending flow Fd and by an ascending flow Fa. The descending flow Fd is colder than the ascending flow Fa.

[0071] When a cooling channel 6 is defined as priority, the associated airflow generator 4 is configured so as to generate a downward airflow Fd. The airflow generators 4 associated with the non-priority cooling channels 6 are configured so as to generate an upward airflow Fa. This advantageously makes it possible to maintain air circulation in the housing 10 while specifically cooling the critical points inside the housing 10. This advantageously makes it possible to optimize the service life of the electronic cards 3 and the electronic equipment 1, by cooling as a priority the electronic cards 3 most important to its operation.

[0072] An example of implementation of a method of using electronic equipment 1 will now be presented.

[0073] The interior of the housing 10, in particular the different cooling channels 6, is cooled by the different air flow generators 4 in nominal configuration by fault as illustrated in [Fig. 10]. The various temperature sensors 8 continuously measure the temperatures T of the various electronic cards 3, in particular the temperatures T of the electronic components most important to the functions of the electronic cards 3. All of the electronic cards 3 are thus maintained at a temperature allowing the electronic equipment 1 to function correctly.

[0074] With reference to [Fig. 11], when one of the temperature sensors 8 detects a temperature T greater than a first admissible overheating threshold, the control system S determines the cooling channels 6 which have priority and deduces therefrom the control of the air flow generators 4 so as to cool the priority cooling channels 6 with a downward air flow Fd. It also reconfigures the other air flow generators 4 so as to ensure good circulation of the air in the housing 10. The electronic cards 3 are then cooled optimally and the latter are then protected from overheating.

[0075] In this example, the fifth electronic card 3 is overheating because its temperature T exceeds the first admissible overheating threshold. In the nominal configuration, the fifth electronic card 3 was cooled by an upward air flow Fa. In the new overheating configuration, with reference to [Fig. 11], the fifth electronic card 3 is now cooled by a downward air flow Fd.

[0076] With reference to [Fig. 12], the fifth electronic card 3 is overheating because its temperature T exceeds a second critical overheating threshold. In the new critical overheating configuration, with reference to [Fig. 12], the fifth electronic card 3 is now cooled by a downward air flow Fd while all the other cooling channels circulate an upward air flow Fa so as to increase the flow rate of the downward air flow Fd.

[0077] When the control system S determines that there is no longer any risk for the electronic cards 3, it reconfigures the air flow generators 4 to the nominal configuration. This makes it possible to have a rapid and targeted response during overheating, with significant efficiency making it possible to increase the service life of the electronic cards 3. This thus makes it possible to reduce maintenance costs and improve the reliability of the electronic equipment 1.

[0078] Preferably, with reference to [Fig. 9], the control system S is also capable of detecting a malfunction of the electronic equipment 1. With reference to [Fig. 9], the air flow generators 4 continuously transmit their operating state E4 to the control system S. The control system S is thus capable of reconfiguring the air flow generators 4 so as to take them into account. This advantageously makes it possible to continue to refrigerate the interior of the housing 10 even with a degraded operating state.

[0079] With reference to [Fig. 13], when a motor 41 of an air flow generator 4 is damaged, the blower 42 cannot generate air flow in its cooling channel 6 which is then insufficiently cooled. The control system S then adapts the configuration of the other air flow generators 4 so as to make them generate upward air flows Fa. This creates a suction creating a downward air flow Fd in the cooling channel 6 whose air flow generator 4d is damaged. This downward air flow Fd sets the blower 42 originally driven by the damaged motor 41 into rotation, and thus allows the circulation of air in the housing 10.

[0080] Thanks to the invention, in the event of overheating or malfunction, the control system S makes it possible to ensure suitable cooling which makes it possible to prioritize the cooling of one or more cooling channels.

Claims

Claims

1. Electronic equipment (1) comprising: • A sealed housing (10) comprising walls (10A, 10B, 10L) and defining an interior cavity (2) configured to receive at least one electronic card (3), • At least one air flow generator (4) configured to generate a circulation of at least one air flow in the interior cavity (2) so as to allow cooling by convection via the walls (10A, 10B, 10L) of the housing (10), • The air flow generator (4) comprising at least one motor (41) and at least one blower (42), driven by the motor (41), configured to generate the circulation of at least one air flow in the interior cavity (2), the blower (42) being positioned in the interior cavity (2), the motor (41) being positioned outside the interior cavity (2).

2. Electronic equipment (1) according to claim 1, comprising at least one heat exchange device (5) comprising an internal exchanger (52) positioned in the interior cavity (2), the blower (42) being positioned adjacent to the internal exchanger (52).

3. Electronic equipment (1) according to one of claims 1 to 2, the interior cavity (2) comprising an upper duct (71) delimited by a separating partition (9) comprising at least one through opening (91) for each blower (42).

4. Electronic equipment (1) according to one of claims 1 to 3, wherein the interior cavity (2) defines a plurality of cooling channels (6), at least one blower (42) being mounted in each cooling channel (6) so as to generate the circulation of at least one air flow in each cooling channel (6).

5. Electronic equipment (1) according to claim 4, wherein the interior cavity (2) comprises a lower conduit (72) configured to fluidically connect the plurality of cooling channels (6).

6. Electronic equipment (1) according to claim 5, wherein the electronic equipment (1) comprises a motherboard (7) on which the electronic card (3) is fixed, the motherboard (7) delimiting the lower conduit (72), the motherboard (7) comprising passage openings (21P).

7. Electronic equipment according to claim 5, the electronic equipment (1) comprising several electronic cards (3), each electronic card (3) comprising at least one lateral fin (32A, 32B), the lateral fins (32A, 32B) of adjacent electronic cards (3) cooperating in order to delimit the lower conduit (72).

8. Assembly comprising: • electronic equipment (1) according to one of claims 1 to 7 comprising a plurality of air flow generators (4) and • a control system (S) configured to control the plurality of air flow generators (4).

9. Assembly according to claim 8 wherein, the electronic equipment (1) comprising at least one temperature sensor (8) configured to measure at least one temperature (T) relating to at least one electronic card (3), the control system (S) is configured to control the plurality of air flow generators (4) as a function of the measured temperature (T).

10. Method of using an assembly according to claim 8 or 9, the plurality of air flow generators (4) being in a nominal configuration, the method comprising steps consisting of: • Determining at least one electronic card (3) in overheating, • Determining a cooling requirement for said electronic card (3) in overheating, • Modifying the configuration of the plurality of air flow generators (4) according to the determined cooling requirement.

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