Cooling system

Abstract

Title: Cooling System A cooling system (100) for at least one electronic device, including a data center server (1), the cooling system comprising: a receptacle (110) configured to receive the electronic device, this receptacle being in particular sealed to contain a dielectric fluid (30) intended to immerse, at least partially, the electronic device, a plate-type heat exchanger (4), in particular configured to define a bottom (112) of the receptacle, and comprising a circuit (14) for a heat transfer fluid (35), in particular a refrigerant, which is of the two-phase type, a control device (120) configured to regulate the flow rate of liquid-phase heat transfer fluid entering the heat transfer fluid circuit of the heat exchanger (4) as a function of a proportion of gaseous-phase heat transfer fluid at an outlet (5) of the heat transfer fluid circuit.Figure for the abbreviation: [Fig. 1].

Claims

in order to modify a section of the heat transfer fluid (35) passage in liquid phase in at least one location of the heat transfer fluid (35) circuit (14) of the heat exchanger (4).

4. Cooling system (100) according to claim 3, wherein the flow restriction member (125) is placed at an inlet (3) of the heat transfer fluid circuit (14) (35) so as to regulate the flow of liquid phase heat transfer fluid (35) entering the heat transfer fluid circuit (14) (35) of the heat exchanger (4).

5. Cooling system (100) according to claim 4, wherein the flow restriction member (125) is connected to a float (50) placed at the outlet (5) of the circuit (14).

6. Cooling system (100) according to claim 5, wherein the passage restriction member (125) is mechanically connected to the float (50), in particular by means of a mechanism comprising a lever arm (52) or a double reversing type mechanism.

7. Cooling system (100) according to claim 3, wherein the flow restriction member (150) is placed at the outlet (5) of the circuit (14).

8. Cooling system (100) according to claim 7, wherein the passage restriction member (150) is made by a float (151) or float valve configured to be able to float on the liquid phase of the heat transfer fluid (35) at the outlet (5) of the circuit (14).

9. Cooling system (100) according to claim 8, wherein the float (151) is configured to rest on a seat (56) at the outlet (5) of the circuit (14) to create a passage restriction.

10. Cooling system (100) according to any one of claims 8 or 9, wherein the float (151) has one or more orifices (154) configured to allow the passage of the gaseous phase of the heat transfer fluid (35).