ESD resins for projection stereolithography
Patent Information
- Application Number
- GB2023018702
- Authority / Receiving Office
- GB · GB
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-12-07
- Publication Date
- 2025-06-25
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Abstract
Claims
1. An ESD resin composition suitable for use as a precursor ink for projection SLA, the composition comprising at least one photocurable monomer at least one cross linking agent, and wherein the composition further comprises METAC (2-(methacryloyloxy) ethyl trimethylammonium chloride).
2. An ESD resin composition according to claim 1, wherein the photocurable monomer may comprise HEA (2-hydroxyethyl acrylate), and the cross-linking agent(s) may comprise urethane dimethacrylate, and / or polyethylene glycol dimethacrylate (PEGDMA).
3. An ESD resin composition according to claim 2, wherein the ratio of METAC to HEA is 50:50.
4. An ESD resin composition according to claim 1 or claim 2, further comprising a photo-initiator such as BAPO.
5. A process for the synthesis of a polymer from a polymeric resin suitable for use in projection SLA wherein said process comprises the following sequential steps:a) HEA is mixed with comb PDMS;b) PEG-DMA and urethane dimethacrylate are then added to the mixture;c) a photo-initiator is then added, followed by ultrasonication of the whole mixture; andd) METAC is then added and, after SLA printing and photo-irradiation, samples are UV-post-cured.
6. A polymer derived from the ESD resin composition according to any of claim 1 to claim 4.
7. Use of a polymer derived from the ESD resin as claimed in any of claims 1 to 4 for anti-static applications such as in electronic applications elastomericcompounds for gasketing and maintaining electrical connections, anti-static floorings, anti-dust coatings and in the prevention of triboelectric charge in industrial cutting and milling processes.
Citation Information
Patent Citations
Powder-containing photocurable flowable resin composition
JP1997241311A
Photo curable fluid resin composition
JP1998030002A