Images for Wafer Surface Processing Analysis System

Abstract

This image is for displaying data of a system that predicts and analyzes the processing results of a wafer etching process, and displays information such as conditions such as the type and amount of etching liquid used, and the processing results under those conditions. As shown in the reference diagram showing the usage state, a graph showing conditions such as the type and amount of etching liquid used is arranged on the left side, and a graph showing the predicted processing results is arranged on the right side. For example, when the type of etching liquid displayed on the left side is selected or the amount used is changed by operating a slide bar, the processing result on the right side changes accordingly, so that the processing result based on any condition can be predicted. In addition, when the graph showing the processing result on the right side is operated or the target processing result selection button is operated, the amount of each etching liquid used on the left side changes accordingly, so that the conditions required from the desired processing result can be predicted.

Images