Images for Wafer Surface Processing Analysis System

Abstract

This image is for displaying data of a system that predicts and analyzes the processing results of a wafer etching process, and displays information such as conditions such as the type and amount of etching liquid used, and the processing results under those conditions. As shown in the reference diagram showing the usage state, a graph showing conditions such as the type and amount of etching liquid used is arranged on the left side, and a graph showing the predicted processing results is arranged on the right side. For example, when the type of etching liquid displayed on the left side is selected or the amount of use or processing time is changed by operating a slide bar or pull-down, the processing results on the right side change accordingly, so that the processing results based on any conditions can be predicted. In addition, when the graph showing the processing results on the right side is operated, the amount of each etching liquid used on the left side changes accordingly, so that the conditions required from the desired processing results can be predicted.

Images