Orthogonal robot

Abstract

This article is an orthogonal robot that enables automated processing of coating processes such as adhesion, coating, sealing, and potting in the manufacturing processes of semiconductor products such as printed circuit boards, electronic devices, precision devices, and optical devices. As shown in the reference diagram indicating the usage state, it can eject liquid materials from the coating head of a syringe connected to a discharge valve unit that supplies pressurized air controlled by a liquid precision discharge controller (controller) to liquid materials such as cream solder, UV resin, silver paste, and epoxy resin in a liquid container (syringe) at high speed and with high precision.

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