Dicing ring attachment and detachment jig

JP1801405SActive Publication Date: 2025-06-18SCREEN HOLDINGS CO LTD
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Patent Information

Application Number
JP2024025737D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2024-12-12
Publication Date
2025-06-18
Estimated Expiration
2049-12-12

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Abstract

This article is used to install or remove a dicing ring with a wafer set thereon in a device. The dicing ring can be set on the bottom surface of this article by magnetic force, and the on / off of the magnetic force can be switched by turning the gripping part.
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