Device board for electronic component test equipment

JP1811848SActive Publication Date: 2025-10-29ADVANTEST CORP
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Patent Information

Application Number
JP2025008359D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2025-04-25
Publication Date
2025-10-29
Estimated Expiration
2050-04-25

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Abstract

This product is a device board installed in electronic component testing equipment that tests the electrical characteristics of electronic components such as semiconductor devices such as memory and CPUs (Central Processing Units).The electronic component to be tested is pressed against the socket installed in this product, and a test signal is supplied and the response is measured to determine whether the component is good or bad, or to identify any defects.As shown in the reference diagram showing the usage state, the socket board and socket guide are connected by lock pins, screws, etc., so that the socket is sandwiched between them.
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