Expanded synthetic resin particles
JP1816859SActive Publication Date: 2026-01-15JSP CORP
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Patent Information
- Application Number
- JP2025016671D
- Authority / Receiving Office
- JP · JP
- Patent Type
- Designs
- Current Assignee / Owner
- Filing Date
- 2025-08-23
- Publication Date
- 2026-01-15
- Estimated Expiration
- 2049-03-07
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Abstract
The present article is a type of expanded synthetic resin particle used as a filling material for cushioning materials and the like, or used to manufacture containers, building materials, cushioning materials, etc., by in-mold foam molding. The expanded synthetic resin particle has a thin through-hole near the center for the purpose of improving the cushioning properties and breathability of the filling, or for the purpose of maintaining or improving the fusion properties during in-mold foam molding, the strength of the molded product, and the appearance. The expanded synthetic resin particle refers to a particle made of a synthetic resin in an expanded state. The expanded synthetic resin particle of the present article may have a diameter (the length marked "D" in the "reference plan view") of 1 to 4 mm, and a through-hole diameter (the length marked "d" in the "reference plan view") of 0.05 to 0.8 mm. The ratio d / D, where d is the diameter of the through-hole and d is the through-hole diameter, may be 0.08 to 0.4. The length (the length marked "L" in the "reference front view") may be 1 to 4 mm.
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