Expanded synthetic resin particles

JP1816860SActive Publication Date: 2026-01-15JSP CORP
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Patent Information

Application Number
JP2025016672D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2025-08-23
Publication Date
2026-01-15
Estimated Expiration
2049-03-07

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Abstract

The present article is a type of expanded synthetic resin particle used as a filling material for cushioning materials and the like, and also used to manufacture containers, building materials, buffer materials, etc., by in-mold foam molding. The expanded synthetic resin particle has a thin through-hole near the center for the purpose of improving the cushioning properties and breathability of the filling, or for the purpose of maintaining or improving the fusion properties during in-mold foam molding, the strength of the molded product, and the appearance. The expanded synthetic resin particle refers to a particle made of a synthetic resin in an expanded state. The expanded synthetic resin particle of the present article may have a diameter (the length marked "D" in the "reference plan view") of 3 to 8 mm, and a through-hole diameter (the length marked "d" in the "reference plan view") of 0.3 to 2 mm. The ratio d / D of the diameter D to the through-hole diameter d is 0.08 to 0.4. The length (the length marked "L" in the "reference front view") may be 3 to 8 mm.
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