Semiconductor inspection machine

Abstract

This product is a semiconductor inspection machine for inspecting wafers on which semiconductor devices are formed for the presence or absence of defects. This product comprises a metal ring and a camera positioned in the center of the ring. When in use, the wafer is placed in the circular recess. The metal ring allows for stable placement of the wafer without bending it. Furthermore, the wafer can be securely fixed by vacuum suction through the large hole. The camera detects the emission of light in the infrared region that passes through the wafer, thereby inspecting for the presence or absence of defects in the semiconductor device. The camera is made of a material that transmits light in the infrared region and is not transparent or semi-transparent to visible light. As shown in the "Reference Diagram Showing the Usage State," the wafer position can be adjusted by sliding the support part. Furthermore, when moving the wafer, the wafer can be levitated by blowing air from the small hole, making it easy to move.

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