Protective film formation device

Abstract

To provide a protective film formation device which can form a protective film having a flat surface without exerting a load on an element.SOLUTION: A protective film formation device includes: a resin supply part for supplying a liquid curable resin R to a surface where an element of a substrate is mounted; a substrate holding part 33 for holding the substrate to which the curable resin R is supplied; a backup part 34 provided so as to face the substrate holding part 33; a tape supply part for supplying an adhesion preventive tape T between the substrate holding part 33 and the backup part 34; a pressing part 36 for pressing the substrate toward the backup part 34, pushing the curable resin R supplied to the substrate against the adhesion preventive tape T, and spreading the curable resin R onto the substrate; a curable part 37 for curing the curable resin R expanded onto the substrate; and a curable part 38 which is provided in the periphery of the backup part 34 and cures the curable resin R.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a protective film forming apparatus. [Background technology]

[0002] In recent years, development has been progressing on large-scale display devices and lighting devices in which LED modules, each equipped with an array of multiple LED elements, are arranged in multiple rows and columns on a substrate. Various modules incorporating multiple functional elements have also been developed. In such display devices, lighting devices, and modules, the elements are encapsulated with a sealing material such as a curable resin to protect them from degradation.

[0003] The resin used as the sealing material is applied in liquid form to the surface of the substrate on which the elements are mounted and then cured by heat, light, or the like. In this case, the thickness of the sealing material tends to vary between the center and the edges. In particular, controlling the thickness of the edges is difficult. Therefore, when LED modules are laid out, for example, the difference in thickness at the edges may cause unevenness, which may affect the display of the display device. Furthermore, lighting modules such as backlights may experience variations in illuminance distribution, and other modules may also be difficult to install in thin exterior packaging. To solve these problems, attempts have been made to use sheet-like sealing materials with a uniform thickness instead of liquid sealing materials. For example, the technology disclosed in Patent Document 1 uses sheet-like sealing materials with a uniform thickness for each module to make the seams between modules less noticeable. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-9937 Summary of the Invention [Problem to be solved by the invention]

[0005] However, when using a sheet-like sealing member, the sheet-like sealing member must be forced into gaps due to the unevenness of the mounted elements, requiring high pressure, which not only places a strain on the elements but also poses the risk of the elements shifting position or tipping over. On the other hand, if the pressure used to force the sealing member is insufficient, the sealing member may not fully penetrate the gaps between the elements, potentially resulting in an inability to protect the elements. Furthermore, if the thickness of the sheet-like sealing member is thin relative to the height of the elements, the unevenness of the elements may cause the surface of the sealing member to become uneven. These effects are particularly significant when the thicknesses of the elements placed within the module are different.

[0006] An object of the present invention is to provide a protective film forming apparatus that can form a protective film with a flat surface without placing a burden on an element. [Means for solving the problem]

[0007] The protective film forming apparatus of the present invention includes a resin supply unit that supplies a liquid curable resin to a surface of a substrate on which elements are mounted, a substrate holding unit that holds the substrate to which the curable resin has been supplied, a backup unit that is provided opposite the substrate holding unit, a tape supply unit that supplies anti-adhesion tape between the substrate holding unit and the backup unit, a pressing unit that presses the substrate toward the backup unit, presses the curable resin supplied to the substrate against the anti-adhesion tape, and spreads the curable resin over the substrate, a first curing unit that hardens the curable resin that has been spread over the substrate, and one or both of a second curing unit and a third curing unit that are provided around the backup unit and harden the curable resin, wherein the second curing unit is provided around the backup unit and the third curing unit is provided inside the backup unit. [Effects of the Invention]

[0008] The protective film forming apparatus of the present invention can form a protective film with a flat surface without placing a burden on the element. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 2 is a side view showing the workpiece of the first embodiment. [Figure 2] FIG. 2 is a side view showing the protective film forming apparatus of the first embodiment. [Figure 3] 2 is a front view showing a curing unit and its periphery in the protective film forming apparatus of the first embodiment. FIG. [Figure 4] FIG. 2 is a perspective view showing a substrate holding part of the first embodiment. [Figure 5] 2A to 2C are three-view diagrams showing a substrate holding section of the first embodiment. [Figure 6] 5A to 5C are diagrams illustrating a protective film formation flow according to the first embodiment. [Figure 7] FIG. 2 is a block diagram showing a control device according to the first embodiment. [Figure 8] 4 is a flowchart showing a procedure for forming a protective film according to the first embodiment. [Figure 9] FIG. 10 is a front view showing a contact portion of another embodiment. [Figure 10] FIG. 4 is a front view showing the hardened portion of each embodiment. [Figure 11] 1A and 1B are plan and side views showing heaters or irradiation units of the curing unit of each embodiment, and examples of arrangement thereof. [Figure 12] 10A and 10B are diagrams illustrating a method for controlling a heater or an irradiation unit when pressed in each embodiment. [Figure 13] 10A to 10C are diagrams illustrating a protective film formation flow according to another embodiment. [Figure 14] 10A and 10B are front views of the protection forming device showing the peeling operation of the adhesion preventive tape in each embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] (A) First embodiment A first embodiment of the present invention (hereinafter referred to as the present embodiment) will be specifically described with reference to the drawings. First, a protective film forming target and the protective film will be described, and then a protective film forming apparatus will be described. Note that each drawing is a schematic diagram of the present embodiment.

[0011] [Protective film formation target] 1(A), the workpiece 1 on which the protective film is formed in this embodiment includes a support substrate 11, a flexible substrate 12 supported on one surface of the support substrate 11, and light-emitting elements 13 mounted in an array on the surface of the flexible substrate 12. After the formation of a protective film 2 (described later), the support substrate 11 is peeled off from the workpiece 1, and the workpiece 1 is arranged in a matrix of multiple rows and multiple columns to form a display device.

[0012] The support substrate 11 is, for example, a glass substrate. The flexible substrate 12 is made of, for example, polyimide, and is supported on one surface of the support substrate 11. After the light-emitting element 13 is mounted, a protective film 2 is formed on the flexible substrate 12, and the support substrate 11 is removed, thereby becoming a substrate that supports the light-emitting element 13. The light-emitting element 13 is, for example, an LED element, and is mounted on the surface of the flexible substrate 12. The light-emitting element 13 in this embodiment is, in particular, an LED element on the order of micrometers, and its height is, for example, 25 μm.

[0013] [Protective film] As shown in FIG. 1B, a protective film 2 that seals the light-emitting elements 13 is formed on the workpiece 1. The protective film 2 is a film formed by curing a liquid curable resin R. The curable resin R is, for example, a thermosetting resin that is cured by heat. The initial viscosity of the curable resin R is, for example, 4000 mPa·s. The curable resin R is supplied to the surface of the workpiece 1 on which the light-emitting elements 13 are provided and spread over the workpiece 1 as described below. The curable resin R spread over the workpiece 1 is then cured to form the protective film 2 on the workpiece 1. The thickness of the protective film 2 is, for example, 50 to 300 μm. The protective film 2 is not formed on the entire surface of the workpiece 1, and is not formed on the outer periphery of the workpiece 1. The outer periphery where the protective film 2 is not formed, i.e., the portion outside the protective film formation region, is a portion that will be cut off in a subsequent process and will not function as a module, or a portion for connection terminals to the outside of the module. This portion outside the protective film forming region is used to allow protrusion when forming the protective film 2 and to hold the workpiece 1.

[0014] [Protective film forming device] [composition] The protective film forming device 3 supplies a curable resin R to the workpiece 1, spreads the curable resin R over the workpiece 1, and hardens the resin R to form a protective film 2 on the workpiece 1. 2 and 3 , the protective film forming apparatus 3 includes an inversion unit 31 that holds the workpiece 1 delivered from outside and inverts the workpiece 1 after the curable resin R is supplied to it; a resin supply unit 32 that supplies the curable resin R to one side of the workpiece 1; a substrate holding unit 33 that receives the workpiece 1 with the curable resin R supplied from the inversion unit 31 and holds it in an inverted state; a backup unit 34 that faces the substrate holding unit 33; a tape supply unit 35 that supplies anti-adhesion tape T between the substrate holding unit 33 and the backup unit 34 to prevent the curable resin R from adhering to the backup unit 34; a pressing unit 36 ​​that presses the other side of the workpiece 1 toward the backup unit 34 and presses the curable resin R against the backup unit 34 via the anti-adhesion tape T; and curing units 37, 38, and 39 that harden the curable resin R to form a protective film 2 on the workpiece 1. The protective film forming apparatus 3 also includes a control device 8 that controls each of these components.

[0015] In FIG. 3, the pressing direction of the pressing unit 36 ​​against the workpiece 1 is the Z direction, the feeding direction of the adhesion prevention tape T by the tape supply unit 35 in a plane perpendicular to the Z direction is the X direction, and the direction perpendicular to the Z direction and the X direction is the Y direction. The Y direction is the direction penetrating the paper in the figure. For example, if the protective film forming device 3 is installed so that the Z direction is vertical, the XY plane is a horizontal plane. In this case, the Z direction is the height direction, and the installation surface side is called the down side and the opposite side is called the up side. In other words, down is the direction of gravity. Furthermore, the rotation direction parallel to the XY plane is called the θ direction, and the rotation direction parallel to the YZ plane is called the α direction.

[0016] As shown in FIG. 2, the reversing unit 31 holds the workpiece 1, which has been transported from the outside by a transport means (not shown), with the side on which the light-emitting element 13 is mounted, i.e., the side on which the curable resin R is supplied, facing upward. After the curable resin R has been supplied to the workpiece 1, the reversing unit 31 reverses the workpiece 1 so that the side on which the curable resin R has been supplied faces downward, and transfers it to the substrate holding unit 33. After the protective film 2 has been formed on the workpiece 1, the reversing unit 31 receives the workpiece 1 from the substrate holding unit 33, reverses it, and returns it to its original position. After the protective film 2 has been formed and the workpiece 1 has been returned to its original position, it is collected from the reversing unit 31 by a transport means (not shown) that transports the workpiece 1 from the protective film forming device 3 to the outside.

[0017] The reversing unit 31 includes an arm 311 that holds the workpiece 1 from the support substrate 11 side, for example, by vacuum suction, and an XYZ movement mechanism 312 that supports the arm 311 and moves the arm 311 in the X, Y, and Z directions. The arm 311 is, for example, a rectangular parallelepiped arm extending in a direction parallel to the XY plane. One end of the arm 311 has a suction hole for holding the workpiece 1. The suction hole is connected to a pneumatic circuit (not shown), and the arm 311 adsorbs and holds the workpiece 1 by the negative pressure generated by the pneumatic circuit. The arm 311 also releases the held workpiece 1 by releasing the negative pressure. The arm 311 is also rotatable in the α direction by a drive mechanism 311a provided at the other end, and the workpiece 1 held by the suction hole is reversed 180°. The XYZ movement mechanism 312 is, for example, composed of a motor, a linear guide, a ball screw, etc., and moves the arm 311 in the X, Y, and Z directions.

[0018] The resin supply unit 32 is connected to a resin supply device (not shown) including, for example, a liquid feeder, a valve, etc., and dispenses liquid curable resin R from a nozzle 32a. In this embodiment, the nozzle 32a is provided above the inversion unit 31 and faces the surface of the workpiece 1 held by the inversion unit 31 on which a protective film is formed, i.e., the surface on which the light-emitting element 13 is mounted. The resin supply unit 32 is movable in the X, Y, and Z directions by a drive mechanism (not shown), and can supply liquid curable resin R to any location on the surface of the workpiece 1 held by the inversion unit 31 on which the light-emitting element 13 is mounted. Therefore, the curable resin R dispensed from the nozzle 32a is supplied to the surface of the workpiece 1 on which the light-emitting element 13 is mounted.

[0019] The substrate holding unit 33 holds the workpiece 1 to be transferred between the inverting unit 31. As shown in FIG. 2, the substrate holding unit 33 is provided at a position where the workpiece 1 can be transferred between the inverting unit 31 and the substrate holding unit 33, for example, at a position aligned with the inverting unit 31 in the Y direction. The substrate holding unit 33 is supported by a guide (not shown) and disposed above the backup unit 34 so as to be vertically movable while remaining parallel to the backup unit 34. The substrate holding unit 33 is also biased in a direction away from the backup unit 34 by a spring unit 332a, which is an elastic member having elasticity. In other words, the substrate holding unit 33 is supported by the spring unit 332a and disposed at a distance from the backup unit 34.

[0020] The substrate holding unit 33 has a pair of legs 332. The legs 332 are members that protrude downward from the lower surface of the substrate holding unit 33. In other words, they extend toward the backup unit 34. The lower ends of the legs 332 are connected via spring portions 332a to an upper surface 341a of a base 341 of the backup unit 34, which will be described later.

[0021] As shown in FIGS. 4 and 5 , the substrate holding unit 33 is a frame. Specifically, the substrate holding unit 33 is a plate-shaped member with an opening at the center of the frame corresponding to the size of the workpiece 1, and a stepped portion 331 provided in this opening holds the workpiece 1. The stepped portion 331 is provided to protrude from the inner surface of the opening so as to narrow the lower side of the opening. The upper surface of this protruding portion abuts against the outer periphery of the workpiece 1, thereby holding the workpiece 1. Therefore, the upper surface of the stepped portion 331 is also referred to as the substrate holding surface 331a below. As described above, the protective film 2 is not formed on the entire surface of the workpiece 1, but is formed in a predetermined region. That is, there is a protective film formation region, which is the region where the protective film 2 should be formed. Therefore, the protective film 2 is formed on the workpiece 1 by curing the curable resin R spread in the protective film formation region. This protective film formation region is set according to the size of the workpiece 1. The opening in the substrate holding unit 33 corresponding to the size of the workpiece 1 is an opening that includes at least the protective film formation region. In other words, it is an opening through which the area where the curable resin R is spread onto the workpiece 1 can be seen.

[0022] The lower surface of the portion connecting the pair of legs 332 of the substrate holding part 33 forms a contact part 333 that contacts the anti-adhesion tape T held by the backup part 34, which will be described later. As will be described later, the anti-adhesion tape T is supplied between the substrate holding part 33 and the backup part 34, between the pair of legs 332 and the spring part 332a provided at the lower end of the legs 332. Therefore, when the substrate holding part 33 is pressed down toward the backup part 34 against the biasing force of the spring part 332a, the contact part 333 contacts the backup part 34 via the anti-adhesion tape T, thereby serving as a stopper that stops the substrate holding part 33. The contact surface of the contact part 333 is lower than the substrate holding surface 331a. That is, the distance from the backup part 34 to the substrate holding surface 331a is greater than the contact surface of the contact part 333. The heightwise (Z-direction) distance between the contact part 333 and the substrate holding surface 331a is set to the required thickness of the protective film 2. This creates a predetermined gap between the substrate holding surface 331a and the surface of the anti-adhesion tape T, so that when the workpiece 1 is held on the substrate holding surface 331a, a predetermined gap is created between the surface of the workpiece 1 to which the curable resin R is supplied and the surface of the anti-adhesion tape T.

[0023] The backup unit 34 is provided opposite the substrate holding unit 33 and is a member that receives, via anti-adhesion tape T, the surface of the workpiece 1 that is pressed by the pressing unit 36 ​​and that has been supplied with the curable resin R. The backup unit 34 includes a base 341 and a holding member 342 that is provided on an upper surface 341a of the base 341 and that holds the anti-adhesion tape T. The base 341 is a base for the backup unit 34 and a platform that supports the holding member 342. The holding member 342 is detachably supported by the base 341. The holding member 342 has a flat surface that comes into contact with the curable resin R via the anti-adhesion tape T. The anti-adhesion tape T prevents the curable resin R from coming into direct contact with the holding member 342 and sticking thereto.

[0024] The holding member 342 is, for example, a breathable, porous plate-like member in which interconnected microscopic spaces are densely and uniformly formed overall, and is made of sintered ceramics or sintered metal. Therefore, the holding member 342 of this embodiment has microscopic pores distributed almost evenly across its entire surface. The holding member 342 is also connected to a pneumatic circuit (not shown), and the breathable, porous holding member 342 can apply negative pressure to its surface by the negative pressure generated by the pneumatic circuit. This allows the holding member 342 to adsorb and hold the anti-adhesive tape T. Furthermore, the holding member 342 releases the held anti-adhesive tape T when this negative pressure is released. Because the holding member 342 of this embodiment is breathable and porous as described above, microscopic pores are distributed almost evenly across its entire surface. When negative pressure is applied to the backside of the holding member 342, negative pressure is generated in all of these microscopic pores, allowing the entire surface to adsorb and hold the anti-adhesive tape T.

[0025] As shown in FIG. 3 , the tape supply unit 35 includes a supply reel 351 and a recovery reel 352 disposed at positions sandwiching the substrate holding unit 33 in the X direction, and supplies the adhesion-preventing tape T between the workpiece 1 held by the substrate holding unit 33 and the holding member 342 of the backup unit 34. The supply reel 351 is detachable and freely rotatable, and a braking force is applied to its rotation by a tension mechanism (not shown). The recovery reel 352 is detachable and freely rotatable, and is driven to rotate by a motor (not shown). The adhesion-preventing tape T is wound around the supply reel 351, unwound by the rotation of the recovery reel 352, and wound onto the recovery reel 352 for recovery. That is, the adhesion-preventing tape T is fed onto the holding member 342 of the backup unit 34 through cooperation between the supply reel 351 and the recovery reel 352. In addition, tape support parts TS are provided on both sides of the backup unit 34 in the path along which the adhesion prevention tape T fed from the supply reel 351 is wound onto the recovery reel 352. The tape support parts TS support the adhesion prevention tape T at a height at which the adhesion prevention tape T fed to the holding member 342 of the backup unit 34 is fed so that it comes into slight contact with or has a gap with the upper surface 342a of the holding member 342.

[0026] The anti-adhesion tape T prevents the curable resin R, supplied to the side of the workpiece 1 where the light-emitting element 13 is mounted, from adhering to the holding member 342 of the backup unit 34 when the pressing unit 36 ​​presses the curable resin R against the backup unit 34. The anti-adhesion tape T is a tape that is liquid-repellent to the curable resin R, and is, for example, a tape with a silicone coating on the surface of a base material made of PET (polyethylene terephthalate). This weakens the adhesive force that occurs when the curable resin R hardens after the protective film is formed, acting on the anti-adhesion tape T, making it easier to peel the anti-adhesion tape T from the workpiece 1.

[0027] In addition, the width of the adhesion prevention tape T is preferably wider than the width of the holding member 342 so that the curable resin R can wrap around the adhesion prevention tape T and prevent adhesion to the holding member 342. Furthermore, according to research by the inventors, if the adhesion prevention tape T is too thin, the adhesion prevention tape T will warp or wrinkle when the curable resin R is pressed against it or when it is heated, and this warping or wrinkled state will be transferred to the curable resin R, causing distortion and unevenness on the surface of the protective film 2 formed by the cured curable resin R. Furthermore, there were cases where the unevenness on the surface of the backup section 34 was transferred. Therefore, the thickness of the adhesion prevention tape T is preferably thicker, and is preferably 190 μm or thicker, for example.

[0028] However, if the thickness of the adhesion prevention tape T is too thick, the length that can be wound around the supply reel 351 or the recovery reel 352 will be shortened, resulting in the need to frequently replace the supply reel 351 or the recovery reel 352. Furthermore, the flexibility of the adhesion prevention tape will be lost, which may make it difficult to supply the adhesion prevention tape T parallel to the holding member 342 or may prevent the adhesion prevention tape T from adhering to the holding member 342. Therefore, the thickness of the adhesion prevention tape T is selected taking into consideration heat resistance, flexibility, and surface hardness so that the adhesion prevention tape T will not warp or wrinkle or will not transfer the irregularities on the surface of the backup section 34 when the curable resin R is pressed against it or when it is heated.

[0029] The pressing unit 36 ​​is a plate-like member that presses the workpiece 1 held by the substrate holding unit 33 and presses the substrate holding unit 33 against the adhesion prevention tape T. The pressing unit 36 ​​is provided opposite the backup unit 34, facing the substrate holding unit 33. The pressing unit 36 ​​has a flat pressing surface that faces the workpiece 1. The pressing unit 36 ​​is also lowered or raised by a drive mechanism (not shown) configured, for example, by a cylinder. As a result, the pressing unit 36 ​​presses down the workpiece 1 held by the substrate holding unit 33 and presses the curable resin R supplied to the workpiece 1 against the surface of the adhesion prevention tape T held by the backup unit 34. At this time, the curable resin R supplied to the workpiece 1 is spread between the surface of the adhesion prevention tape T and the workpiece 1.

[0030] More specifically, as shown in FIG. 6C, the pressure of the pressing unit 36 ​​presses down the substrate holding unit 33 via the workpiece 1, causing the spring portion 332a of the leg portion 332 connected to the backup unit 34 of the substrate holding unit 33 to contract. By contracting the spring portion 332a, the leg portion 332 shortens the distance from the substrate holding surface 331a of the substrate holding unit 33 to the adhesion preventing tape T. The substrate holding unit 33, pressed down by the pressing unit 36, stops when the abutment portion 333 abuts against the surface of the adhesion preventing tape T held by the holding member 342 of the backup unit 34. At this time, the distance from the surface of the adhesion preventing tape T held by the holding member 342 to the surface of the workpiece 1 onto which the curable resin R is supplied (substrate holding surface 331a) is, for example, 50 to 300 μm, and the curable resin R spreads into this gap. Therefore, this distance corresponds to the height of the protective film 2 formed by the curable resin R curing. This distance is determined according to the required height (thickness) of the protective film 2. In other words, this distance is the predetermined gap between the surface of the workpiece 1 to which the curable resin R is supplied and the surface of the adhesion prevention tape T. This distance is also set by the substrate holding part 33 abutting against the backup part 34 via the adhesion prevention tape T. As described above, the outer periphery of the surface of the workpiece 1 to which the curable resin R is supplied abuts against the substrate holding surface 331a. The abutment part 333 is the lower surface of the part connecting the pair of legs 332 of the substrate holding part 33, and the distance from the surface (contact surface) that abuts against the backup part 34 to the substrate holding surface 331a is the height of the abutment part 333 (shown as L in FIG. 5). Therefore, the height of the abutment part 333 is the distance from the surface of the adhesion prevention tape T held by the holding member 342 to the surface of the workpiece 1 to which the curable resin R is supplied (substrate holding surface 331a), and is the height of the protective film 2. Therefore, the height of the contact portion 333 is set according to the required height (thickness) of the protective film 2.

[0031] In this way, when the substrate holding part 33 is pressed by the pressing part 36, the contact part 333 makes contact to ensure a predetermined gap between the surface of the workpiece 1 to which the curable resin R has been supplied and the surface of the adhesion prevention tape T. The contact part 333 is the back surface (backup side surface, undersurface) of the part of the substrate holding part 33 that straddles the backup part 34. The contact surface of the contact part 333 may be the entire part that straddles the backup part 34, or it may be provided on only a part of it.

[0032] The curing units 37, 38, and 39 cure the curable resin R spread on the workpiece 1 by the pressing unit 36, thereby forming a protective film 2 on the workpiece 1. In this embodiment, since the curable resin R is a thermosetting resin, the curing units 37, 38, and 39 are heaters that generate heat by applying a voltage, for example. The curing unit 37 (first curing unit) is provided inside the pressing unit 36. As a result, heat from the curing unit 37 is transferred to the curable resin R via the pressing unit 36 ​​and the support substrate 11 and flexible substrate 12 of the workpiece 1, thereby curing the curable resin R. The curing units 38 (second curing units) are provided in pairs, for example, at positions sandwiching the holding member 342 in the Y direction. That is, the curing units 38 heat the curable resin R from the outer periphery of the workpiece 1. The curing section 39 (third curing section) is provided inside the base 341 of the backup section 34, and heats the curable resin R from below via the holding member 342 and the adhesion prevention tape T.

[0033] The control device 8 is a device that controls the protective film forming device 3. The control device 8 is configured, for example, by a dedicated electronic circuit or a computer that operates according to a predetermined program. That is, the control device 8 controls the operation of the protective film forming device 3 by controlling the operation of the reversing unit 31, the resin supply unit 32, the backup unit 34, the tape supply unit 35, the pressing unit 36, the curing units 37, 38, and 39, etc.

[0034] As shown in Figure 7, the control device 8 includes a reversing unit control unit 81, a resin supply control unit 82, a tape suction control unit 83, a tape supply amount control unit 84, a pressing control unit 85, a hardening control unit 86, a memory unit 87, a setting unit 88, and an input / output control unit 89.

[0035] The reversing unit control unit 81 controls the suction and reversing operations of the arm 311 of the reversing unit 31 and the movement operation of the XYZ movement mechanism 312. The resin supply control unit 82 controls the amount of curable resin R supplied to the surface of the workpiece 1 on which the light-emitting element 13 is provided, as well as the supply timing and supply position. The amount of curable resin R supplied is determined by the size of the workpiece 1, i.e., the size of the area where the protective film is formed (protective film formation area) and the thickness of the protective film. The curable resin R can be supplied in a dotted or linear manner. There can be one or more dots or lines, and the supply amount for each dot and line is determined by the number of dots or lines. The spreading state of the curable resin R is observed in advance, and the position and supply amount for each dot and line are determined so that the entrapment of air bubbles and overflow from the protective film formation area are within the allowable range. Control is performed according to the supply state determined in this way.

[0036] The tape suction control unit 83 controls the air pressure circuit connected to the backup unit 34, thereby controlling the suction operation of the holding member 342 to suction the adhesion prevention tape T. For example, before the curable resin R supplied to the workpiece 1 is pressed against the holding member 342, the adhesion prevention tape T is suctioned to the holding member 342. This causes the adhesion prevention tape T to adhere closely to the entire surface of the holding member 342, preventing wrinkles from forming on the adhesion prevention tape T when the contact portion 333 of the substrate holding unit 33 comes into contact with the adhesion prevention tape T or when the adhesion prevention tape T is heated to harden the curable resin R. This prevents wrinkles from being transferred to the protective film 2. After the hardening of the curable resin R on the workpiece 1 is complete, the tape suction control unit 83 releases the adhesion prevention tape T from suction and releases the adhesion prevention tape T from the holding member 342 before the workpiece 1 leaves the backup unit 34. The tape supply amount control unit 84 controls the feeding of the adhesion prevention tape T. For example, after the formation of the protective film on one workpiece 1 is completed, the adhesion prevention tape T is fed out, and the portion pressed against the curable resin R is replaced with an unused portion. In this way, the tape supply amount control unit 84 is controlled in cooperation with the tape suction control unit 83.

[0037] The pressing control unit 85 controls a drive mechanism (not shown) provided in the pressing unit 36. For example, the pressing unit 36 ​​is lowered at a predetermined speed, thereby causing the pressing unit 36 ​​to press the surface of the workpiece 1 on the side to which the curable resin R has not been supplied, and causing the workpiece 1 held by the substrate holding unit 33 to face the backup unit 34 at a predetermined distance against the biasing force of the spring unit 322a. Similarly, after the protective film 2 is formed, the pressing unit 36 ​​is raised so as to move away from the workpiece 1.

[0038] In this control, the curing speed of the curable resin R, i.e., the speed at which the curable resin R is cured, is controlled. In accordance with the fact that the curable resin R is a thermosetting resin, the curing control unit 86 of this embodiment controls the temperature of the curing unit 37 so that the curing temperature is the curing temperature required to thermally cure the curable resin R. The curing control unit 86 controls the curing units 37, 38, and 39 to cure the curable resin R. In this control, the curing speed of the curable resin R, i.e., the speed at which the curable resin R is cured, is controlled. In accordance with the fact that the curable resin R is a thermosetting resin, the curing control unit 86 of this embodiment controls the temperature of the curing unit 37 so that the curing temperature is the curing temperature required to thermally cure the curable resin R. In addition, the curing control unit 86 controls the temperatures of the curing units 38 and 39 so that the temperatures are sufficient to support the curing unit 37.

[0039] In the case of thermosetting resins, when they are heated from their initial state (i.e., at room temperature) to the temperature at which curing begins (curing initiation temperature), their viscosity decreases and their fluidity increases. At the curing initiation temperature, gelation begins, viscosity increases, and fluidity decreases. As the curing temperature approaches, gelation progresses, viscosity increases, and the resin finally hardens (solidifies). Therefore, heating below the curing initiation temperature can increase the fluidity of the curable resin R. When controlled to heat below this curing initiation temperature, the curable resin R does not harden. In other words, the curing rate can be said to be zero. Heating the curable resin R at a curing temperature above the curing initiation temperature can decrease the fluidity of the curable resin R. Furthermore, the curable resin R can be hardened. When controlled to heat above the curing initiation temperature, the curing of the curable resin R progresses, and the curing rate is increased. In this way, the curing rate of the curable resin R can be controlled.

[0040] In this embodiment, the curing control unit 86 preheats the curing units 37, 38, and 39 to a temperature (first temperature) lower than the temperature at which the curable resin R hardens. This also raises the temperatures of the pressing unit 36 ​​and the holding member 342. In this state, the workpiece 1 is sandwiched between the pressing unit 36 ​​and the backup unit 34. As a result, the curable resin R supplied to the workpiece 1 is heated and spreads. Then, while the curable resin R is spreading on the workpiece 1, the curing control unit 86 controls the temperatures of the curing units 37, 38, and 39 so that the temperatures rise to the temperature (second temperature) at which the curable resin R hardens. In this way, control is performed to increase the speed at which the curable resin R hardens. Note that the temperatures of the curing units 37, 38, and 39 can be set individually. Furthermore, the temperatures can be changed at individual timings.

[0041] The memory unit 87 stores information necessary for control in this embodiment. Information stored in the memory unit 87 includes position coordinates such as the position of each component, the heating temperatures of the curing units 37, 38, and 39, and the amount of adhesion prevention tape T fed out. The setting unit 88 is a processing unit that sets information in the memory unit 87 in accordance with input. The input / output control unit 89 is an interface that controls signal conversion and input / output between each unit to be controlled.

[0042] An input device 91 and an output device 92 are connected to the control device 8. The input device 91 is input means such as a switch, touch panel, keyboard, or mouse that allows an operator to operate the protective film forming device 3 via the control device 8. The operator can use the input device 91 to input various pieces of information to be set in the memory unit 87. The output device 92 is output means such as a display, lamp, or meter that makes information for checking the status of the device visible to the operator. For example, the output device 92 can display an input screen for information from the input device 91.

[0043] [Effect] Next, an example of the operation of this embodiment will be described with reference to FIGS. 6 and 8. FIG. 8 is a flowchart showing the procedure for forming the protective film 2. As a premise, the workpiece 1, to which the curable resin R has not yet been supplied from a conveying means (not shown), is carried into the protective film forming apparatus 3, and the reversing unit 31 of the protective film forming apparatus 3 adsorbs and holds the workpiece 1 from the support substrate 11 side using the arm 311. Also, the tape supply amount control unit 84 supplies the anti-adhesion tape T onto the backup unit 34. Furthermore, the curing control unit 86 heats the curing unit 37 to a standby temperature, which is a first temperature, for example, 120°C. The curing units 38 and 39 are heated to, for example, 100°C. The first temperature is preferably lower than the curing temperature of the curable resin R. More preferably, the first temperature is lower than the curing initiation temperature (gelation initiation temperature) of the curable resin R.

[0044] Under the control of the resin supply control unit 82, the nozzle 32a of the resin supply unit 32 supplies the curable resin R to the surface of the workpiece 1 on which the light-emitting element 13 is provided (step S01). The curable resin R is supplied to one or more locations on the workpiece 1, for example, in a dotted or linear pattern. As a result, when the workpiece 1 is pressed and spread by the pressing unit 36, a protective film 2 is formed in a predetermined protective film formation region. The curable resin R is supplied inside the outer periphery of the workpiece 1. After the curable resin R has been supplied, under the control of the reversing unit control unit 81, the reversing unit 31 uses the arm 311 to reverse the workpiece 1 180°, so that the surface onto which the curable resin R has been supplied faces downward, and uses the XYZ movement mechanism 312 to move the workpiece 1 above the substrate holding unit 33. Alternatively, the XYZ movement mechanism 312 may previously move the arm 311 to a position where the reversed position is above the substrate holding unit 33, and the reversing unit 31 may then move the arm 311 to this position.

[0045] Next, with the workpiece 1 above the substrate holding unit 33, as shown in FIG. 6A, the arm 311 is lowered to bring the workpiece 1 into contact with the substrate holding surface 331a of the step portion 331 in the opening of the substrate holding unit 33, and the suction of the workpiece 1 is released, thereby transferring the workpiece 1 to the substrate holding unit 33 (step S02). The workpiece 1 is held by the substrate holding unit 33 with the surface onto which the curable resin R is supplied facing downward and its outer periphery abutting the substrate holding surface 331a of the step portion 331. The curable resin R also faces the surface of the adhesion prevention tape T held by the backup unit 34 through the opening of the substrate holding unit 33. Because the curable resin R is supplied inside the outer periphery of the workpiece 1, it does not adhere to the substrate holding surface 331a, but faces the adhesion prevention tape T, which will be described later, through the opening of the substrate holding unit 33. After the inversion unit 31 receives and delivers the workpiece 1, the XYZ movement mechanism 312 causes the arm 311 to retreat from above the substrate holding unit 33.

[0046] Next, as shown by the dotted arrow in FIG. 6(B), the tape suction control unit 83 controls a pneumatic circuit (not shown) to suction and hold the adhesion prevention tape T on the holding member 342 (step S03). Subsequently, as shown in FIG. 6(C), the pressure control unit 85 lowers the pressing unit 36 ​​from above the substrate holding unit 33, causing the flat pressing surface of the pressing unit 36 ​​to press the side of the workpiece 1 on which the curable resin R has not been applied. The pressed workpiece 1 presses the substrate holding surface 331a with which it abuts, causing the substrate holding unit 33 to descend together with the workpiece 1. The pressing unit 36 ​​continues to press the workpiece 1 together with the substrate holding unit 33, sandwiching the workpiece 1 between the pressing unit 36 ​​and the holding member 342 of the backup unit 34 (step S04). At this time, the curable resin R supplied to the workpiece 1 is pressed against the surface of the adhesion prevention tape T held by the holding member 342 and spreads in the X and Y directions between the workpiece 1 and the adhesion prevention tape T. Furthermore, the spring portions 332a of the legs 332 contract, and the contact portions 333 of the substrate holding portion 33 come into contact with the adhesion prevention tape T held by the holding members 342 of the backup portion 34, ensuring a predetermined distance between the surface of the workpiece 1 on which the curable resin R has been supplied and the surface of the adhesion prevention tape T. In other words, the curable resin R spreads over this distance.

[0047] As described above, the curing section 37 provided inside the pressing section 36 is heated in advance to a first temperature of 120°C. Therefore, since the pressing section 36 is also heated to 120°C, this heat is transferred to the curable resin R via the support substrate 11 and flexible substrate 12 of the workpiece 1 that the pressing section 36 contacts and presses. The curing section 39 is also heated in advance to a first temperature of 100°C. Therefore, since the base 341 and holding member 342 of the backup section 34 are also heated to 100°C, this heat is transferred to the curable resin R via the anti-adhesion tape T. Although the curable resin R is heated, it does not harden, but spreads over the workpiece 1 in a highly fluid state. At this time, the curing section 38 is also heated to 100°C, and assists the curing sections 37 and 39 to adjust the curing speed of the curable resin R.

[0048] Furthermore, the curing control unit 86 controls the curing units 37, 38, and 39 to heat up to 170°C, which is the second temperature at which the curable resin R of this embodiment thermally hardens. As a result, as shown in FIG. 6(D), the curing of the curable resin R spread on the workpiece 1 is completed, and the protective film 2 is formed (step S05). Thus, heating at 100°C hardens the curable resin R to aid in its spreading, while the curing units 38 and 39, especially the curing unit 38, harden to promote hardening of the resin's side surfaces and prevent overflow. Therefore, the temperatures of the curing units must be raised in accordance with the temperature rise of the curable resin R, and it is advantageous to set them to the curing temperature from the beginning. However, if the curing units 37 and 39 are initially heated to the curing temperature of 170°C, the curable resin R will harden before it has fully spread, so it is not preferable to heat them to that temperature. Furthermore, the curing unit 39 does not need to be fixed at 100°C; it can be set to a fixed temperature or raised to an appropriate temperature depending on the characteristics of the curable resin R. Furthermore, since the curing section 38 heats from a separate side, it can be set to 170° C. from the beginning. Also, either or both of the curing sections 38 and 39 can be used in combination with the curing section 37.

[0049] After the protective film 2 is formed, the pressing control unit 85 raises the pressing unit 36, and the tape suction control unit 83 releases the suction and holding of the adhesion prevention tape T by the holding member 342 (step S06). As the pressing unit 36 ​​rises, the substrate holding unit 33, which had been pressed together with the workpiece 1 against the pressing unit 36, rises due to the biasing force of the spring unit 332a. Furthermore, the step portion 331 of the substrate holding unit 33 pushes the workpiece 1 upward. At this time, since the adhesion prevention tape T is in close contact with the protective film 2 formed on the workpiece 1, the adhesion prevention tape T also tends to be pulled upward. This is because the adhesion prevention tape T is pressed against the protective film 2 by atmospheric pressure and therefore adheres to the protective film 2.

[0050] On the other hand, tension is applied to the adhesion prevention tape T by the tension mechanism of the supply reel 351. Furthermore, tape support parts TS are provided on both sides of the backup part 34, so that the adhesion prevention tape T is prevented from being pulled up along with the workpiece 1. Therefore, as shown in FIG. 14 , a force is applied to the adhesion prevention tape T, pulling it upward with the tape support parts TS as a fulcrum. However, since the tension acting on the adhesion prevention tape T and the tape support parts TS resist this force, the protective film 2 attached to the adhesion prevention tape T is peeled off from its edge as the workpiece 1 rises. Finally, as shown in FIG. 6(E), the protective film 2 is completely peeled off from the adhesion prevention tape T (step S07). After the protective film 2 is peeled off, the recovery reel 352 is rotated and driven to take up the adhesion prevention tape T by the length of the holding member 342, and new adhesion prevention tape T is supplied to the holding member 342 (step S08).

[0051] Finally, as shown in FIG. 6(F), under the control of the reversing unit control unit 81, the XYZ movement mechanism 312 moves the arm 311 of the reversing unit 31 above the substrate holding unit 33, and holds the workpiece 1 on which the protective film 2 has been formed from the side of the support substrate 11 (step S09). Next, the reversing unit 31 uses the XYZ movement mechanism 312 to pick up the workpiece 1 from the substrate holding unit 33, retracts it from above, and reverses the arm 311 (step S10). This allows the workpiece 1 on which the protective film 2 has been formed to be obtained. After this, the workpiece 1 on which the protective film 2 has been formed is carried out of the protective film forming apparatus 3 by a transport means (not shown).

[0052] [effect] The effects of the first embodiment having the above-described configuration are as follows. (1) The protective film forming apparatus 3 of this embodiment includes a resin supply unit 32 that supplies liquid curable resin R to the surface of the substrate on which elements are mounted, a substrate holding unit 33 that holds the substrate to which the curable resin R has been supplied, a backup unit 34 that is provided opposite the substrate holding unit 33, a tape supply unit 35 that supplies anti-adhesion tape T between the substrate holding unit 33 and the backup unit 34, a pressing unit 36 ​​that presses the substrate toward the backup unit 34, presses the curable resin R supplied to the substrate against the anti-adhesion tape T, and spreads the curable resin R onto the substrate, a curing unit 37 that hardens the curable resin R spread onto the substrate, and a curing unit 38 that is provided around the backup unit 34 and hardens the curable resin R.

[0053] This allows a protective film with a flat surface to be formed without placing a burden on the elements. In other words, because the liquid curable resin R is pressed against the elements mounted on the workpiece 1, the pressure applied to the elements is relatively low, reducing the risk of damaging the elements. It also reduces the risk of the elements being displaced or toppling over. Furthermore, because the curable resin R, which serves as a sealing material, can be easily filled into the gaps between the elements, it reduces the risk of insufficient sealing. Furthermore, because the liquid curable resin R is pressed against the holding member 342 of the flat backup section 34 and hardened, a protective film 2 with a flat surface can be formed without being affected by the unevenness of the elements mounted on the workpiece 1.

[0054] (2) In this embodiment, a pair of curing units 38 are provided at positions sandwiching the backup unit 34. The curing units 38 prevent the curable resin R spreading on the workpiece 1 from spilling out from the formation area of ​​the protective film 2 or from the edge of the workpiece 1 or the anti-adhesion tape T. In other words, the curing units 38 heat the curable resin R from the side surface of the workpiece 1, thereby curing the curable resin R before it spills out.

[0055] In particular, when spreading the curable resin R in the protective film formation region, heating the curable resin R to a first temperature and reducing its viscosity increases its fluidity and spreads faster. This also allows the curable resin R to reach the boundary of the protective film formation region more quickly. In other words, the curable resin R can be spread quickly in the region where the protective film 2 is formed. However, this also increases the risk of the curable resin R spilling out of the protective film formation region. However, by raising the temperature outside the protective film formation region to a second temperature in the curing unit 38, the curing of the curable resin R progresses, and its viscosity increases. This prevents the curable resin R from spilling out of the protective film formation region. In particular, by reducing the fluidity of the curable resin R near the outside of the protective film formation region, spillage can be more reliably prevented. This temperature increase in the curing unit 38 can be performed independently or in cooperation with the curing units 37 and 39. This more effectively prevents spillage. It also shortens the curing time.

[0056] (3) A curing unit 39 for curing the curable resin R is provided inside the backup unit 34. This allows the curable resin R to be heated not only from above but also from below, thereby shortening the curing time of the curable resin R. In particular, when the curable resin R spreads to the protective film formation region and is then cured, the curing unit 39 alone or in cooperation with the curing units 37 and 38 can raise the temperature of the curable resin R and promote curing of the curable resin R. Furthermore, as the protective film 2 is repeatedly formed, the temperature of the backup unit 34 gradually rises due to the heat from the curing unit 37. This could cause the cured state of the curable resin R to become unstable. In this embodiment, the curing unit 39 provided inside the backup unit 34 can control the backup unit 34 to a constant temperature, thereby stabilizing the cured state of the curable resin R. Furthermore, a drop in the temperature of the backup unit 34 can be prevented when the substrate holding unit 33 abuts against it. This stabilizes the cured state of the curable resin R.

[0057] (4) The abutting portion 333, located at a predetermined distance (a height separated by a predetermined distance L) from the height of the substrate holding surface 331a, abuts against the backup portion 34, thereby ensuring a gap through which the curable resin R can spread, based on the height of the substrate holding surface 331a. That is, a gap through which the curable resin R can spread can be ensured between the surface of the workpiece 1 on which the elements are mounted and the surface of the anti-adhesion tape T, based on the height of the surface on which the elements of the workpiece 1 are mounted. This allows the thickness of the protective film 2 to be constant, regardless of variations in the thickness of the workpiece 1 (the thickness of the support substrate 11 + the thickness of the flexible substrate 12). In addition, the predetermined gap, which is the thickness of the protective film 2, is formed as the height from the height of the substrate holding surface 331a to the abutting portion 333. That is, the predetermined gap, which is the thickness of the protective film 2, is determined by the shape of the substrate holding portion 33. Therefore, unlike, for example, when adjusting the gap width that is the thickness of the protective film 2 depending on the degree of pressing force, there is no need to precisely control the pressing force, making control easier. Also, Since the curable resin R can be spread and filled into gaps of a specified interval and then cured, a protective film can be formed with no variation in film thickness in the area where the protective film 2 is to be formed, compared to when the curable resin R is applied and cured in an open state.

[0058] (5) In this embodiment, the anti-adhesion tape T is interposed between the backup part 34 and the workpiece 1, preventing the hardening resin R from directly adhering to the backup part 34. This prevents a portion of the protective film 2 from remaining on the backup part 34 when peeled off, which can interfere with subsequent formation of the protective film 2. Furthermore, even if the surface of the holding member 342 of the backup part 34 has some irregularities, these are absorbed by the anti-adhesion tape T, preventing them from affecting the surface of the hardening resin R. In other words, even if foreign matter adheres to the surface of the holding member 342, the anti-adhesion tape T absorbs the irregularities caused by the foreign matter, preventing them from being transferred to the surface of the protective film. Furthermore, since the surface roughness of the holding member 342 does not need to be extremely small, the holding member 342 can be prepared inexpensively. Even if openings are provided to suction and hold the anti-adhesion tape T on the holding member 342, the openings can be prevented from being transferred. This also applies to suppressing the effects of fine openings that appear on the surface of the holding member 342 when the holding member 342 is made of a porous material.

[0059] (6) The curing control unit 86 controls the curing unit 37 to harden the curable resin R. In particular, it controls the speed at which the curable resin R is hardened. More specifically, it controls the speed at which the curable resin R is hardened by the curing unit 37 while the curable resin R is spreading on the substrate. In this embodiment, the curing unit 37 is heated to a first temperature in advance, and is controlled to a second temperature higher than the first temperature. This controls the speed at which the curable resin R is hardened (curing speed) in two stages. This allows the curable resin R to be sufficiently spread on the workpiece 1 and then hardened to form the protective film 2. In this way, because the curing control unit 86 controls the curing speed of the curable resin R in two stages, the curable resin R can be quickly and reliably spread into the gap between the workpiece 1 and the adhesion prevention tape T formed by the contact unit 333, and the time until the curing of the curable resin R is completed can be shortened. The control of the curing speed of the curable resin R is not limited to the two-stage control described above, but may be performed in small increments or continuously. The protective film formation region may be divided into multiple areas such as the inner region and the outer edge, and the control may be performed by dividing the protective film formation region into multiple areas. Furthermore, these may be combined to achieve more precise control of the curing speed.

[0060] (7) The curing control unit 86 heats the curing unit 37 to a standby temperature, which is the first temperature, for example, 120°C, and heats the curing units 38 and 39 to a standby temperature, for example, 100°C. By heating the curing unit 37 in advance, the pressing unit 36 ​​can be preheated, and when pressing the curable resin R, the temperature can be raised to a temperature that promotes the spreading of the curable resin R without having to be heated again.

[0061] (8) The substrate holder 33 holds the substrate with the surface onto which the curable resin R is supplied facing downward. As a result, the liquid curable resin R supplied to the workpiece 1 spreads downward due to gravity, reducing the area of ​​contact with the anti-adhesion tape T in the initial stage of pressing. The curable resin R is gradually pushed outward to a predetermined distance, thereby reducing the risk of air bubbles being trapped in the curable resin R as it spreads over the workpiece 1. While spreading the curable resin R in a reduced-pressure space could be considered to prevent such bubbles from being trapped, this is not necessary, and no large-scale equipment such as a vacuum chamber or an evacuable cavity is required, thereby reducing the associated cost increase. In addition, the workpiece 1 in this embodiment is not enclosed by a member when pressed, but is pressed from above while open to the atmosphere. As a result, any gas present between the workpiece 1 and the anti-adhesion tape T is easily pushed outward as the curable resin R spreads, thereby reducing the risk of air bubbles being trapped in the curable resin R as it spreads.

[0062] (9) The resin supply unit 32 further includes an inverting unit 31 that supplies the curable resin R to the substrate from above, inverts the substrate to which the curable resin R has been supplied, and transfers the substrate to the substrate holding unit 33 with the surface of the substrate to which the curable resin R has been supplied facing downward. This allows the curable resin R to be supplied from above, making it easier to adjust the supply amount compared to when the curable resin R is supplied from below. For example, when the curable resin R is supplied from below, gravity may pull the curable resin R toward the nozzle 32a of the resin supply unit 32 depending on the viscosity of the curable resin R, which may result in an unintended decrease in the supply amount.

[0063] (10) The backup unit 34 further includes a holding member 342 that adsorbs and holds the tensioned adhesion prevention tape T. This allows the adhesion prevention tape T to be adsorbed and held across its entire surface without any wrinkles, so that even in a situation where the adhesion prevention tape T shrinks when the curable resin R is spread or hardened, it is possible to reduce the occurrence of wrinkles in the adhesion prevention tape T. This reduces the possibility of these wrinkles being transferred to the protective film 2.

[0064] (11) The holding member 342 is breathable and porous. Therefore, the openings on the surface for suction are very small, and there is little risk that the unevenness of the surface caused by the openings will be transferred to the protective film 2 via the anti-adhesion tape T. Furthermore, the anti-adhesion tape T can be evenly adsorbed and held over the entire surface of the holding member 342, so that it can be maintained in a wrinkle-free state.

[0065] (12) On both sides of the backup unit 34 in the X direction, tape support units TS are provided above the adhesion prevention tape T. This makes it easy to peel off the adhesion prevention tape T that has adhered to the protective film 2 formed on the workpiece 1 from the protective film 2. This is because the adhesion prevention tape T is pressed down by the tape support units TS, and the adhesion prevention tape T is peeled off from the outer periphery of the protective film 2.

[0066] (13) The hardening resin R is a thermosetting resin, and the hardening unit 37 is a heater. This makes it possible to easily adjust the hardened state by adjusting the temperature at which the hardening resin R is heated.

[0067] (14) The hardening portion 37 is provided inside the pressing portion 36. This allows the device to be made smaller.

[0068] (B) Second embodiment A second embodiment of the present invention will now be described. In the first embodiment, the curable resin R is a thermosetting resin that is cured by heat. In the second embodiment, however, the curable resin R is a photocurable resin that is cured by light. Accordingly, the curing unit 37 is a light irradiator rather than a heater. For example, the photocurable resin can be an ultraviolet curable resin, and the light can be ultraviolet light. In this case, the light irradiator is an ultraviolet light source. The ultraviolet light source can be an LED or lamp that can irradiate ultraviolet light. The photocurable resin begins to harden when exposed to light of a wavelength that hardens the resin. The curing of the photocurable resin progresses gradually. That is, the viscosity of the photocurable resin changes. The rate of hardening varies depending on the intensity and duration of the irradiated light. The curing control unit 86 controls the intensity and irradiation time of the light irradiated by the curing unit 37. When the curable resin R spreads, the amount of energy of the irradiated light is changed by changing the light intensity and irradiation time, thereby achieving an optimal viscosity for spreading the curable resin R over the protective film formation region.

[0069] More specifically, if the viscosity of the curable resin R is suitable for spreading in its initial state, light irradiation is initiated after the curable resin R has spread over the entire protective film formation region, which is a predetermined area, to harden the curable resin R. If the viscosity of the curable resin R is low and not suitable for spreading in its initial state, the required viscosity is adjusted by irradiating the curable resin R with weak light intensity, for a short time, or from a distance when spreading begins. The amount of light energy irradiated onto the curable resin R at this time is designated as a first energy amount. Then, when the curable resin R reaches the outer edge of the protective film formation region or its vicinity, light irradiation is performed with the required intensity and duration to further harden the curable resin R. Once the curable resin R has spread throughout the protective film formation region and spreading has finished, light irradiation is performed with an intensity and duration sufficient to completely harden the curable resin R, thereby completing the hardening of the curable resin R. The amount of light energy irradiated to completely harden the curable resin R is designated as a second energy amount. This second energy amount is greater than the first energy amount. By doing so, it is possible to shorten the spreading time, suppress the overflow from the protective film formation area, and shorten the curing time. Furthermore, a light irradiation device may be provided as the curing units 38 and 39. The same effects as those of the above-described curing units 38 and 39 can be obtained.

[0070] The light from the curing unit 37 is irradiated onto the curable resin R via the pressing unit 36 ​​and the substrate of the workpiece 1. Therefore, the light path of the curing unit 37, the pressing unit 36, and the substrate is made of a material that transmits at least light of a wavelength that cures the photocurable resin R.

[0071] By irradiating light toward the substrate holder 33 from a distance, the viscosity of the curable resin R can be adjusted to an appropriate viscosity for spreading when pressing the resin begins. At this time, the light intensity and time as well as the reaching intensity change depending on the distance, so the viscosity can also be adjusted by the height position of the curing part. This makes it possible to shorten the spreading time and prevent the resin from spilling out of the protective film formation area.

[0072] In the second embodiment, the curing unit 37 may have multiple irradiation units, such as UV light sources, that emit light. In this case, similar to the heater in the first embodiment, it is preferable to arrange the irradiation units concentrically in a matrix (rows, rows, or columns) or frame-like configuration, as shown in 411 in FIG. 11 . When multiple irradiation units are provided, irradiation of each irradiation unit may be controlled individually or as a group as needed. For example, when the curable resin R is spreading, partial irradiation may be performed to mix areas with increased viscosity and areas with the original viscosity, thereby controlling the spreading speed and spread. At this time, after a predetermined time has elapsed, irradiation may be performed by an irradiation unit different from the previous irradiation unit, thereby increasing the viscosity of the areas that were not previously irradiated with light at different times. For example, multiple irradiation units may be fully irradiated to increase the viscosity of the curable resin R as it spreads over the entire protective film formation area to be sealed. Furthermore, at this time, the irradiation intensity may be partially varied. For example, when or just before the curable resin R spreads and reaches the outer edge of the protective film formation area of ​​the workpiece 1, irradiation is performed only on the outer edge of the protective film formation area, or the irradiation intensity is increased (the amount of energy (illuminance x time) is increased) to prevent overflow. This type of irradiation control can be performed in the same way as the heater in the first embodiment (see Figure 12). The timing of irradiation may be detected by an image sensor, laser sensor, etc. to detect the resin, or may be determined in advance by experiment, etc. By controlling multiple irradiation units in this way, overflow can be suppressed without hindering the removal of voids. The light intensity and irradiation range may be controlled by providing a light guide lens or a cylindrical reflector at the irradiation section of the UV light source or the like.

[0073] (C) Other embodiments The present invention is not limited to the above-described embodiments, and in the implementation stage, the components can be modified and embodied without departing from the spirit of the invention. Furthermore, various inventions can be formed by appropriately combining multiple components disclosed in the above-described embodiments. For example, some components may be omitted from all the components shown in the embodiments. Furthermore, components from different embodiments may be appropriately combined. Specifically, the following other embodiments are also included.

[0074] (1) In the above embodiment, the resin supply unit 32 supplies the curable resin R from above the workpiece 1. However, this is not limited to this. For example, if the viscosity of the curable resin R is such that it does not drip due to gravity, and if the curable resin R ejected from the nozzle 32a does not drip and adhere to the nozzle 32a, reducing the amount of curable resin R supplied, the curable resin R may be supplied from below the workpiece 1. In this case, the inversion unit 31 holds the workpiece 1 so that the surface of the workpiece 1 on which the light-emitting element 13 is mounted faces downward from the beginning. The inversion unit 31 can transfer the workpiece 1, with the curable resin R supplied on the downward-facing surface, to the substrate holding unit 33 in that state. Therefore, there is no need to provide an inversion mechanism, and the inversion unit 31 can be simplified. Furthermore, since the workpiece 1 to which the curable resin R has been supplied does not need to be inverted, the state of the supplied curable resin R is not affected by centrifugal force. Furthermore, since time for inversion is not required, the takt time can be shortened. Furthermore, since no space is required for inversion, the distance between the substrate holding unit 33 and the pressing unit 36 ​​can be narrowed. This not only allows the device to be made more compact, but also shortens the movement time of the pressing unit 36, thereby shortening the takt time. Furthermore, by rotating the arm 311 of the inversion unit 31 by θ instead of α, the workpiece 1 can be delivered to the substrate holding unit 33 with the surface onto which the curable resin R has been supplied facing downward. In this case, the horizontal movement for delivery can be performed by rotating by θ, which simplifies the movement mechanism.

[0075] (2) In the above embodiment, the holding member 342 is a porous member with countless randomly arranged holes, but this is not limiting. It is sufficient if the member has sufficient breathability to hold the anti-adhesion tape T, and the size and shape of the openings ensuring breathability do not extend beyond the anti-adhesion tape T and affect the curable resin R. For example, the holding member 342 may be a metal plate with countless holes.

[0076] (3) In the above embodiment, the anti-adhesion tape T is held by suction via the holding member 342. However, if the situation is such that the anti-adhesion tape T will not shrink when the curable resin R is spread or hardened, the anti-adhesion tape T does not need to be held by suction. For example, if the anti-adhesion tape is thick and does not easily deform or shrink, if the material of the anti-adhesion tape makes it difficult to deform or shrink, or if the heating temperature for hardening is low and the anti-adhesion tape does not easily deform or shrink, the anti-adhesion tape does not need to be held by suction.

[0077] (4) In the above embodiment, a pair of curing units 38 are provided at positions sandwiching the backup unit 34 in the Y direction, but this is not limited thereto. The curing units 38 may be provided anywhere, such as around the backup unit 34, as long as the curable resin R spreading on the workpiece 1 can be heated from the side and cured to prevent it from spilling out of the workpiece 1. The number of curing units 38 is also not particularly limited. Furthermore, the third curing unit, the curing unit 39, is not essential to the present invention, and embodiments not including the curing unit 39 are also encompassed within the present invention.

[0078] (5) In the above embodiment, the legs 332 are members extending from the underside of the substrate holding part 33 and equipped with the springs 332a at their lower ends. However, this is not limiting. As long as the substrate holding part 33 is supported at a distance from the backup part 34 and is provided so as to be movable toward and away from the backup part 34, the springs 332a may be provided anywhere on the substrate holding part 33 other than the legs 332. The springs 332a may also be made of an elastic material such as rubber. Alternatively, they may be air cylinders that support the substrate holding part 33 and move up and down. When the substrate holding part 33 is pressed by the pressing part 36 and moves toward the backup part 34, the air pressure is controlled so as not to impede its movement. Instead of the springs 332a, the air cylinders function as a drive unit that lifts the substrate holding part 33 to peel the protective film 2 from the adhesion prevention tape T.

[0079] (6) In the above embodiment, the contact portion 333 on the lower surface of the substrate holding unit 33 contacts the adhesion prevention tape T, which is stretched over and held by the holding member 342, to form the required gap. However, as shown in FIG. 9 , a predetermined gap similar to that of the above embodiment may be secured by providing a leg portion 343 erected on the upper surface 341a of the base 341 and abutting the upper portion of the leg portion 343 against the leg portion 332 of the substrate holding unit 33 pressed by the pressing unit 36. Furthermore, the contact portion 333 may be used instead of the leg portion 332. In this manner, the substrate holding unit 33 contacts the backup unit 34, preventing the substrate holding unit 33 from descending. The gap distance between the workpiece 1 and the adhesion prevention tape T, which corresponds to the height of the protective film 2, is set by the erected leg portion 343 and the substrate holding unit 33 contacting the leg portion 343. Therefore, the portion where the substrate holding unit 33 contacts the backup unit 34 is included in the contact portion. That is, in this embodiment, the combination of the leg 332 and the leg 343 erected on the base 341, or the combination of the abutment portion 333 and the leg 343 erected on the base 341, is considered to be the abutment portion. Therefore, when the leg 332, which is a part of the substrate holding unit 33, or the abutment portion 333, abuts against the leg 343, which is a part of the backup unit 34, the abutment portion, which is a combination of these, forms a predetermined gap. In this case, the thickness of the protective film 2 can be determined by the position where the leg 343 erected on the base 341 abuts against the substrate holding unit 33. In other words, since the thickness can be determined by the distance from the base 341 of the erected leg 343 to the substrate holding unit 33 abutting against it, it is only necessary to replace the leg 343 erected on the base 341 to adjust the thickness of the protective film 2 as needed, and the thickness of the protective film 2 can be easily changed.

[0080] (7) In the above embodiment, it is not necessary to form the required gap by the contact of the contact portion 333. The movement of the pressing portion 36 can be controlled to set the gap distance between the workpiece 1 and the adhesion prevention tape T, which corresponds to the height of the protective film 2. In this case, there is no need to prepare the contact portion 333 or the leg portion 343. This makes it easy to set the thickness of the protective film 2 using the module.

[0081] (8) In the above embodiment, the element mounted on the flexible substrate 12 of the work 1 is the light-emitting element 13, but this is not limiting and any element may be used. For example, it may be a computing element, a memory element, an imaging element, or an electronic component such as a resistor or capacitor. A module may also be a combination of these elements. Furthermore, the support substrate 11 and the flexible substrate 12 may be an integrated substrate.

[0082] (9) In the above embodiment, the pressing unit 36 ​​may have a suction hole connected to a pneumatic circuit (not shown) in the center of the surface that contacts the workpiece 1. By using the negative pressure generated by this pneumatic circuit to adsorb the workpiece 1 to the flat surface of the pressing unit 36, thermal deformation of the workpiece 1 due to heating can be suppressed. Regardless of the material of the workpiece 1, thermal deformation occurs when heated. This is particularly noticeable when the workpiece 1 is thin. For example, even if the outer periphery of the workpiece 1 is clamped, if the central portion is unsupported and free, it is prone to thermal deformation. On the other hand, in this embodiment, deformation can be suppressed by suctioning and holding the central portion of the workpiece 1 with the pressing unit 36.

[0083] (10) In the above embodiment, the curing unit 37 is provided inside the pressing unit 36, but this is not limited thereto. The curing unit 37 may be provided as a separate unit from the pressing unit 36 ​​and be movable up and down. For example, as shown in FIG. 10 , by providing the curing unit 37 above the pressing unit 36 ​​and moving the curing unit 37 toward and away from the pressing unit 36, the workpiece 1 can be heated or irradiated with light through the pressing unit 36, as in the above embodiment, to harden the curable resin R. Also, as shown in FIG. 13 , the pressing unit 36 ​​can be a pair of rail-shaped or square frame-shaped members that press the outer periphery of the workpiece 1, and the curing unit 37 can be slid up and down inside the members to directly heat the workpiece 1 and harden the curable resin R.

[0084] (11) When the curing unit 37 is separate from the pressing unit 36, the temperature of the curing unit 37 may be controlled to change when the curing unit 37 comes into contact with the pressing unit 36, during contact, or before contact. By changing the heating temperature in this way, the rate at which the curable resin R is cured can be changed, and the spreading and curing of the curable resin R can be optimized. For example, the curing control unit 86 may control the curing unit 37 to the curing temperature of the thermosetting curable resin R in advance, and then gradually move the curing unit 37 closer to the workpiece 1 while the pressing unit 36 ​​presses the workpiece 1, thereby gradually changing the temperature to which the workpiece 1 is heated. In other words, the curing unit 37 is gradually moved closer to the workpiece 1, thereby gradually heating the workpiece 1. Furthermore, by intermittently moving the curing unit 37 closer to the pressing unit 36, the workpiece 1 can be heated in stages. In this way, the fluidity of the curable resin R during spreading can be controlled, and if the curable resin R tends to spill outside the protective film formation area, the curable resin R can be cured so as to prevent this spill. Furthermore, since spreading and curing can be performed simultaneously, the time required for the curable resin R to be completely cured can be shortened. This type of control can also be applied when the above-mentioned heating is replaced by light irradiation.

[0085] (11) In the above embodiment, the pressing unit 36 ​​has a flat surface that presses the entire workpiece 1. However, the shape of the pressing unit 36 ​​is not limited to this, and any shape may be used as long as it can press the workpiece 1 and sandwich it with the substrate holder 33. For example, as shown in FIG. 13 , the pressing unit 36 ​​may be a pair of rail-shaped or square frame-shaped members that press the outer periphery of the workpiece 1, with the curing unit 37 sliding through an opening within the pressing unit 36 ​​so that it can move up and down. In this case, the curing unit 37 can directly apply heat or light for curing to the workpiece 1 without using the pressing unit 36. This allows for more efficient curing. Therefore, the time required for the curable resin R to be completely cured can be shortened. Furthermore, the fluidity of the curable resin R during spreading can be more accurately controlled, and the curable resin R can be cured so as to more effectively prevent it from spilling outside the protective film formation area. Furthermore, when light is used for curing as described in the second embodiment, the pressing unit 36 ​​does not need to be a light-transmitting member.

[0086] (12) In the above embodiment, the pressing unit 36 ​​provided above presses the workpiece 1 held by the substrate holding unit 33 against the backup unit 34 provided below, but this is not limited to this. For example, the pressing unit 36 ​​provided below may press the workpiece 1 held by the substrate holding unit 33 against the backup unit 34 provided above. In this case, the backup unit 34 does not press the workpiece 1 directly, but presses the substrate holding unit 33 from below. Furthermore, the pressing unit 36 ​​provided on the side may press the workpiece 1 held by the substrate holding unit 33 against the backup unit 34 provided on the side.

[0087] (13) In the second embodiment, when the pressing unit 36 ​​including the cured portion 37 moves from a distant position toward the substrate holding unit 33, the start of light irradiation can be replaced with heating. Either method can achieve the same effect as the second embodiment. [Explanation of symbols]

[0088] 1 Work 11 Support substrate 12 Flexible PCB 13 Light-emitting element 2 Protective film 3 Protective film forming device 31 Reversal section 311 Arm 312 XYZ movement mechanism 32 Resin supply section 33 Board holding part 331 Step 331a Board holding surface 332 Legs 332a Spring part 333 Contact part 34 Backup Department 341 Foundation 341a Top surface of base 341 342 Retaining member 342a Upper surface of the holding member 342 343 Legs 35 Tape supply section 351 Supply Reel 352 Recovery Reel 36 Pressing section 37, 38, 39 Hardened part 401 Base 402 Contact plate 411 Heater or UV light source 412 Heater or UV light source OFF 413 Heater or UV light source ON 8 Control Device 81 Reversing unit control unit 82 Resin supply control unit 83 Tape suction control unit 84 Tape supply amount control unit 85 Pressing control section 86 Curing control section 87 Memory section 88 Settings 89 Input / Output Control Unit R curable resin T Anti-adhesive tape TS tape support part

Claims

1. a resin supply unit that supplies a liquid curable resin to the surface of the substrate on which the elements are mounted; a substrate holder that holds the substrate to which the curable resin has been supplied; a backup unit provided opposite the substrate holding unit; a tape supply unit that supplies an anti-adhesion tape between the substrate holding unit and the backup unit; a pressing unit that presses the substrate toward the backup unit, presses the curable resin supplied to the substrate against the adhesion prevention tape, and spreads the curable resin over the substrate; a first curing unit that cures the curable resin; a second curing section and / or a third curing section that are provided around the backup section and that cure the curable resin; the second hardened portion is provided around the backup portion, the third hardened portion is provided inside the backup portion. Protective film forming device.

2. a contact portion that forms a predetermined gap between the surface of the substrate to which the curable resin has been supplied and the surface of the adhesion preventive tape when the pressing portion presses the substrate and the substrate holding portion comes into contact with the backup portion; The protective film forming apparatus according to claim 1 .

3. the substrate holding part holds the substrate with the surface of the substrate on which the curable resin has been supplied facing downward, and has an opening through which an area where the curable resin is to be spread on the substrate is visible. The protective film forming apparatus according to claim 1 .

4. the resin supply unit supplies the curable resin to the substrate from above the substrate; a reversing unit that reverses the substrate onto which the curable resin has been supplied and transfers the substrate to the substrate holding unit in a state where the surface of the substrate onto which the curable resin has been supplied faces downward, The protective film forming apparatus according to claim 1 .

5. the substrate holder is supported by an elastic member or an air cylinder; The protective film forming apparatus according to claim 1 .

6. The backup unit further includes a holding member that holds the adhesion prevention tape. The protective film forming apparatus according to claim 1 .

7. The holding member is breathable and porous. The protective film forming apparatus according to claim 6 .

8. a supply reel and a recovery reel are disposed in the tape supply unit at positions sandwiching the substrate holding unit; a tape support section provided on both sides of the backup section in a path along which the adhesion prevention tape fed from the supply reel is wound onto the recovery reel; The anti-adhesion tape is supported by the tape support portion at a height at which it is fed out so as to be in slight contact with or have a gap with the backup portion. The protective film forming apparatus according to claim 1 .

9. the curable resin is a thermosetting resin, the first curing unit, the second curing unit, and the third curing unit are heaters; The protective film forming apparatus according to claim 1 .

10. the curable resin is a photocurable resin, the first curing unit, the second curing unit, and the third curing unit are light irradiation devices; The protective film forming apparatus according to claim 1 .

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