Forming method, forming system, and article manufacturing method

Abstract

To provide an improved method for separating a plate from a cured layer in a flattened / imprint system.SOLUTION: A method of shaping a surface comprises the steps of: dispensing a formable material onto a substrate held by a substrate chuck; contacting a plate held by a plate chuck assembly with the formable material to form a film; curing the film to form a cured layer; initiating a separation front between the cured layer and the plate; tilting the plate chuck assembly and / or the substrate chuck in a direction away from the initial separation point, thereby propagating the separation front; applying a force to the plate chuck assembly and / or the substrate chuck; tilting the plate chuck assembly and / or the substrate chuck away from the other while maintaining or increasing the tilt, until the separation front completely propagates around the cured layer; and continuing to apply the force, until the plate does not contact the cured layer.SELECTED DRAWING: Figure 7B

Description

[Technical Field]

[0001] The present disclosure relates to substrate processing, and more particularly to plate chuck assemblies used in planarizing or imprinting surfaces in semiconductor manufacturing. [Background technology]

[0002] Planarization and imprinting techniques are useful in manufacturing semiconductor devices. For example, the process for creating semiconductor devices involves repeatedly applying and removing material to and from a substrate. This process produces a layered substrate with irregular height variations (i.e., topography), and as more layers are added, the substrate height variations can increase. The height variations negatively impact the process of adding additional layers to the layered substrate. Apart from that, semiconductor substrates (e.g., silicon wafers) themselves are not always perfectly flat and can contain initial surface height variations (i.e., topography). One way to address this issue is to planarize the substrate during the build-up process. Various lithographic patterning methods benefit from patterning on a planar surface. In ArFi laser-based lithography, planarization reduces the impact of depth-of-focus (DOF) limitations and improves critical dimension (CD) and critical dimension uniformity. In extreme ultraviolet lithography (EUV), planarization improves feature placement and reduces the impact of DOF limitations. In nanoimprint lithography (NIL), planarization improves feature filling and CD control after pattern transfer.

[0003] Planarization techniques, sometimes referred to as inkjet-based adaptive planarization (IAP), involve dispensing a variable droplet pattern of a polymerizable material between a substrate and a superstrate, where the droplet pattern varies depending on the substrate topography. The superstrate is then contacted with the polymerizable material, after which the material is polymerized on the substrate and the superstrate is removed. Improved planarization techniques, including IAP techniques, are desirable, for example, to improve whole-wafer processing and semiconductor device manufacturing.

[0004] One step in a planarization / imprint method involves separating a plate (i.e., a superstrate or template) from a stiffening layer. In some planarization and imprint systems, separating the plate from the stiffening layer can be difficult. In particular, in planarization / imprint systems that include a plate chuck assembly with a flexible portion for holding the plate, it can be difficult to separate the plate from the stiffening layer without damaging the stiffening layer. There is a need in the art for an improved method for separating a plate from a stiffening layer, especially in planarization / imprint systems in which the plate is held by a flexible portion of the plate chuck assembly. Summary of the Invention

[0005] A method of shaping a surface includes dispensing a formable material onto a substrate held by a substrate chuck; contacting a plate held by a plate chuck assembly with the formable material, thereby forming a film of the formable material between the plate and the substrate; curing the film of formable material to form a hardened layer between the plate and the substrate; inducing a separation front between the hardened layer and the plate at an initial separation point; and, while the plate is held by the flexure, moving at least one of the plate chuck assembly and the substrate chuck to the tilting the plate chuck assembly and the substrate chuck away from an initial separation point, thereby propagating the separation front circumferentially around the periphery of the hardened layer, applying a force to at least one of the plate chuck assembly and the substrate chuck in a direction away from the other while maintaining or increasing the tilt of at least one of the plate chuck assembly and the substrate chuck until the separation front has propagated around the entire periphery of the hardened layer, and continuing to apply a force to at least one of the plate chuck assembly and the substrate chuck in a direction away from the other until the plate is no longer in contact with the hardened layer. The plate chuck assembly includes a flexible portion having a central opening and a cavity formed by the flexible portion, and the plate is held by the flexible portion by reducing pressure within the cavity.

[0006] The molding system includes a plate chuck assembly for holding a plate, the plate chuck assembly including a flexible portion having a central opening and a cavity formed by the flexible portion, the plate being held by the flexible portion by reducing pressure within the cavity; a substrate chuck for holding a substrate; a fluid dispenser for dispensing a formable material onto the substrate; a curing system for curing the formable material beneath the plate to form a hardened layer on the substrate; a separation initiator configured to induce a separation front between the hardened layer and the plate at an initial separation point; and a positioning system, the positioning system being configured to position the plate. While the plate is held by the flexible portion, tilt at least one of the plate chuck assembly and the substrate chuck in a direction away from the initial separation point, thereby propagating the separation front circumferentially around the periphery of the hardened layer, and while maintaining or increasing the tilt of at least one of the plate chuck assembly and the substrate chuck, apply a force to at least one of the plate chuck assembly and the substrate chuck in a direction away from the other until the plate no longer contacts the hardened layer.

[0007] A method for manufacturing an article includes dispensing a formable material onto a substrate held by a substrate chuck; contacting a plate held by a plate chuck assembly with the formable material, thereby forming a film of the formable material between the plate and the substrate; the plate chuck assembly including a flexible portion having a central opening and a cavity formed by the flexible portion, the cavity being held by the flexible portion by reducing pressure within the cavity; hardening the film of formable material to form a hardened layer between the plate and the substrate; inducing a separation front between the hardened layer and the plate at an initial separation point; and contacting the plate held by the flexible portion. tilting at least one of the plate chuck assembly and the substrate chuck away from the initial separation point, thereby propagating the separation front circumferentially around the periphery of the hardened layer; applying a force to at least one of the plate chuck assembly and the substrate chuck in a direction away from the other while maintaining or increasing the tilt of at least one of the plate chuck assembly and the substrate chuck until the separation front has propagated around the entire periphery of the hardened layer; continuing to apply a force to at least one of the plate chuck assembly and the substrate chuck in a direction away from the other until the plate is no longer in contact with the hardened layer; and processing the hardened formable material to produce an article.

[0008] These and other objects, features, and advantages of the present disclosure will become apparent from a consideration of the following detailed description of exemplary embodiments of the present disclosure in conjunction with the accompanying drawings and the appended claims. [Brief explanation of the drawings]

[0009] So that the features and advantages of the present disclosure may be understood in detail, a more particular description of the embodiments of the present disclosure may be had by reference to the embodiments illustrated in the accompanying drawings. It should be noted, however, that the accompanying drawings illustrate only typical embodiments of the present disclosure and therefore should not be considered as limiting the scope of the present disclosure, since the present disclosure may admit of other equally effective embodiments.

[0010] [Figure 1] 1 is a schematic diagram illustrating an example of a planarization system according to one aspect of the present disclosure.

[0011] [Figures 2A-2C] 1A-1C illustrate schematic cross-sectional views of an exemplary planarization process according to aspects of the present disclosure.

[0012] [Figure 3A] FIG. 2 is a bottom view of an exemplary plate chuck assembly according to a first embodiment of the present disclosure.

[0013] [Figure 3B] FIG. 3B is a top view of the plate chuck assembly of FIG. 3A.

[0014] [Figure 3C] FIG. 3C is a cross-sectional view taken along line 3C-3C in FIG. 3B.

[0015] [Figure 3D] FIG. 3D shows an enlarged portion of FIG. 3C.

[0016] [Figure 3E] FIG. 3D is a perspective view of enlarged portion 3D of FIG. 3C.

[0017] [Figure 3F] FIG. 3F is a cross-sectional view taken along line 3F-3F in FIG. 3B.

[0018] [Figure 3G] FIG. 3G shows an enlarged portion 3G of FIG. 3F.

[0019] [Figure 3H] FIG. 3B is a side perspective view of an enlarged portion 3G of FIG. 3F.

[0020] [Figure 3I] FIG. 3B is a bottom perspective view of an enlarged portion 3G of FIG. 3F.

[0021] [Figure 4] FIG. 3C is an exploded view of the plate chuck assembly of FIGS. 3A-3F.

[0022] [Figure 5A] FIG. 5A is a cross-sectional view taken along line 5A-5A in FIG. 3B.

[0023] [Figure 5B] FIG. 5B shows an enlarged portion 5B of FIG. 5A.

[0024] [Figure 5C] FIG. 5B is a side perspective view of an enlarged portion 5B of FIG. 5A.

[0025] [Figure 5D] FIG. 5D is a cross-sectional view taken along line 5D-5D in FIG. 3B.

[0026] [Figure 5E] FIG. 5E shows an enlarged portion 5E of FIG. 5D.

[0027] [Figure 5F] FIG. 5B is a side perspective view of the enlarged portion 5E of FIG. 5D.

[0028] [Figure 6] 10 is a schematic diagram of an exemplary plate chuck assembly according to a second embodiment of the present disclosure.

[0029] [Figure 7A] 1 is a flowchart of an exemplary planarization method according to aspects of the present disclosure.

[0030] [Figure 7B] 4 is a flow chart of an exemplary method for separating a superstrate from a stiffening layer.

[0031] [Figures 8A-8R] 7B, 7C, and 7D are schematic cross-sectional views of the planarization method of FIG. 7A, including the separation method of FIG. 7B, according to one embodiment.

[0032] [Figure 9] FIG. 7B is a top view schematic of a method for separating the superstrate from the stiffening layer.

[0033] [Figure 10A] 7C is a timing diagram illustrating the Z-dimension position of the plate chuck assembly in the method of separating the superstrate from the stiffening layer of FIG. 7B.

[0034] [Figure 10B] 7C is a timing diagram illustrating tilting of the plate chuck assembly in a method of separating the superstrate from the stiffening layer of FIG. 7B.

[0035] [Figure 11] 7C is a top schematic view of a method of separating the superstrate from the stiffening layer of FIG. 7B according to another exemplary embodiment.

[0036] [Figure 12A] 12 is a timing diagram illustrating the Z-dimension position of the plate chuck assembly in a method of separating the superstrate from the stiffening layer of FIG. 7B according to the exemplary embodiment of FIG. 11.

[0037] [Figure 12B] 12 is a timing diagram illustrating tilting of a plate chuck assembly in a first direction in a method of separating a superstrate from the hardening layer of FIG. 7B according to the exemplary embodiment of FIG. 11.

[0038] [Figure 12C]12 is a timing diagram illustrating tilting of the plate chuck assembly in a second direction in a method of separating the superstrate from the hardening layer of FIG. 7B according to the exemplary embodiment of FIG. 11.

[0039] The present disclosure will now be described in detail in connection with exemplary embodiments and with reference to the drawings. It is intended that changes and modifications can be made to the described exemplary embodiments without departing from the true scope and spirit of the subject disclosure as defined by the appended claims. DETAILED DESCRIPTION OF THE INVENTION

[0040] Flattening System 1 illustrates an exemplary system for shaping a surface according to one aspect of the present disclosure. The system for shaping a surface can be, for example, a planarization system or an imprint system. The exemplary embodiment described herein is a planarization system 100. However, these concepts are also applicable to imprint systems. Thus, while terminology throughout this disclosure focuses primarily on planarization, it should be understood that the present disclosure is also applicable to corresponding imprint-related terminology.

[0041] The planarization system 100 is used to planarize a film on a substrate 102. In the case of an imprint system, the imprint system is used to form a pattern on a film on the substrate. The substrate 102 may be coupled to a substrate chuck 104. The substrate chuck 104 may be, but is not limited to, a vacuum chuck, a pin-type chuck, a groove-type chuck, an electrostatic chuck, an electromagnetic chuck, or the like.

[0042] The substrate 102 and the substrate chuck 104 may be further supported by a substrate positioning stage 106. The substrate positioning stage 106 may provide translational and / or rotational motion along one or more of the x-axis, y-axis, z-axis, θ-axis, ψ-axis, and φ-axis. The substrate positioning stage 106, the substrate 102, and the substrate chuck 104 may also be positioned on a base (not shown). The substrate positioning stage may be part of a positioning system.

[0043] Spaced apart from the substrate 102 is a superstrate 108 (also referred to herein as a plate) having a working surface 112 facing the substrate 102. In the context of an imprint system, the plate is a template instead of a superstrate, and the template has a patterned surface. The superstrate 108 can be formed from materials including, but not limited to, fused silica, quartz, silicon, organic polymers, siloxane polymers, borosilicate glass, fluorocarbon polymers, metals, hardened sapphire, and the like. In one embodiment, the superstrate is readily transparent to UV light. The working surface 112 is generally the same area size as, or slightly smaller than, the surface of the substrate 108.

[0044] The superstrate 108 may be coupled to or held by a superstrate chuck assembly 118 (also referred to herein as a plate chuck assembly), which will be described in more detail below. In the case of an imprint system, the plate chuck assembly may also be referred to as a template chuck assembly. The superstrate chuck assembly 118 may be coupled to a planarization head 120, which is part of a positioning system. In the context of an imprint system, the planarization head may be referred to as an imprint head. The planarization head 120 may be movably coupled to the bridge. The planarization head 120 may include one or more actuators, such as a voice coil motor, a piezoelectric motor, a linear motor, a nut and screw motor, etc., configured to move the superstrate chuck 118 relative to the substrate 102 in at least the z-axis direction and potentially in other directions (e.g., the x-axis, y-axis, θ-axis, ψ-axis, and φ-axis).

[0045] The planarization system 100 may further include a fluid dispenser 122. The fluid dispenser 122 may also be movably coupled to the bridge. In one embodiment, the fluid dispenser 122 and the planarization head 120 share one or more of all positioning components. In an alternative embodiment, the fluid dispenser 122 and the planarization head move independently of one another. The fluid dispenser 122 is used to deposit droplets of a liquid formable material 124 (e.g., a photocurable polymerizable material) onto the substrate 102, with the volume of the deposited material varying across an area of ​​the substrate 102 based at least in part on its topographical profile. Different fluid dispensers 122 may use different techniques to dispense the formable material 124. If the formable material 124 is jettable, an inkjet-type dispenser may be used to dispense the formable material. For example, thermal inkjet, microelectromechanical systems (MEMS)-based inkjet, valve jet, and piezoelectric inkjet are common technologies for dispensing jettable liquids.

[0046] The planarization system 100 may further include a curing system including a radiation source 126 that directs actinic energy, such as UV radiation, along an exposure path 128. The planarization head 120 and substrate positioning stage 106 may be configured to position the superstrate 108 and the substrate 102 in overlay with the exposure path 128. The radiation source 126 delivers actinic energy along the exposure path 128 after the superstrate 108 contacts the moldable material 124. FIG. 1 illustrates the exposure path 128 when the superstrate 108 is not in contact with the moldable material 124. This is depicted for illustrative purposes so that the relative positions of the individual components can be easily identified. Those skilled in the art will understand that the exposure path 128 does not substantially change when the superstrate 108 contacts the moldable material 124.

[0047] Planarization system 100 may further include a camera 136 positioned to view the extent of moldable material 124 when superstrate 108 contacts moldable material 124 during the planarization process. An optical axis 138 of the image field of the field camera is shown in FIG. 1 . As shown in FIG. 1 , planarization system 100 may include one or more optical elements (e.g., a dichroic mirror, a beam combiner, a prism, a lens, a mirror, etc.) that combine actinic radiation with light detected by camera 136. Camera 136 may include one or more of a CCD, a sensor array, a line camera, and a photodetector, configured to collect light at wavelengths indicative of contrast between areas under superstrate 108 in contact with moldable material 124 and areas under superstrate 108 that are not in contact with moldable material 124. Camera 136 may be configured to provide images of the extent of moldable material 124 under superstrate 108 and / or separation of superstrate 108 from the cured moldable material 124. Camera 136 can also be configured to measure interference fringes, which change as moldable material 124 spreads across the gap between work surface 112 and the substrate surface.

[0048] The planarization system 100 may be coordinated, controlled, and / or directed by one or more processors 140 (controllers) that communicate with one or more components and / or subsystems, such as the substrate chuck 104, the substrate positioning stage 106, the superstrate chuck assembly 118, the planarization head 120, the fluid dispenser 122, the radiation source 126, and / or the camera 136. The processor 140 may operate based on instructions in a computer-readable program stored in non-transitory computer memory 142. The processor 140 may be or include one or more of a CPU, an MPU, a GPU, an ASIC, an FPGA, a DSP, and a general-purpose computer. The processor 140 may be a general-purpose controller or a general-purpose computing device configured to be a controller. Examples of non-transitory computer-readable memory include, but are not limited to, RAM, ROM, CDs, DVDs, Blu-Rays, hard disk drives, network attached storage (NAS), intranet-connected non-transitory computer-readable storage devices, and internet-connected non-transitory computer-readable storage devices. All of the steps of the methods described herein may be performed by processor 140.

[0049] During operation, the planarizing head 120, the substrate positioning stage 106, or both vary the distance between the superstrate 108 and the substrate 102 to define a desired space (a bounded physical extent in three dimensions) to be filled with the moldable material 124. For example, the planarizing head 120 can be moved toward the substrate and apply a force to the superstrate 108 to cause the superstrate to contact and spread the droplet of moldable material 124, as further detailed herein.

[0050] Flattening method The planarization method includes the steps shown generally in FIGS. 2A-2C. As shown in FIG. 2A, formable material 124 is dispensed onto substrate 102 in the form of droplets. As discussed above, the substrate surface has some topography, which may be known based on previous processing operations or may be measured using a profilometer, AFM, SEM, or an optical surface profiler based on optical interference effects, such as the Zygo NewView 8200. The local volume density of the deposited formable material 124 varies depending on the substrate topography. Then, superstrate 108 is placed in contact with formable material 124. In the context of an imprint system, a patterned template is brought into contact with the deposited formable material 124.

[0051] FIG. 2B illustrates a post-contact step after the superstrate 108 has fully contacted the moldable material 124 but before the polymerization process is initiated. As the superstrate 108 contacts the moldable material 124, the droplets merge to form a film 144 of moldable material that fills the space between the superstrate 108 and the substrate 102. Preferably, the filling process occurs uniformly so that no air or bubbles are trapped between the superstrate 108 and the substrate 102 to minimize unfilled defects. The polymerization process, or curing, of the moldable material 124 can be initiated by actinic radiation (e.g., UV radiation). For example, the radiation source 126 of FIG. 1 can provide actinic radiation to cure, solidify, and / or crosslink the film 144 of moldable material, defining a hardened planarization layer 146 on the substrate 102. Alternatively, the curing of the film 144 of moldable material can be initiated using heat, pressure, a chemical reaction, other types of radiation, or any combination thereof. Upon curing, a planarization layer 146 is formed, and the superstrate 108 can be separated therefrom. Figure 2C shows the cured planarization layer 146 on the substrate 102 after separation of the superstrate 108. The substrate and cured layer can then undergo additional known steps and processes for device (article) fabrication, including, for example, patterning, curing, oxidation, layer formation, deposition, doping, planarization, etching, formable material removal, dicing, bonding, and packaging. The substrate can be processed to fabricate multiple articles (devices).

[0052] 3A to 5F show an example of a superstraight chuck assembly 118 according to a first embodiment. Fig. 8 shows a superstraight chuck assembly 518 according to a second embodiment.

[0053] FIG. 3A shows a bottom view of the superstraight chuck assembly 118. FIG. 3B shows a top view of the superstraight chuck assembly 118. FIG. 3C shows a cross section taken along line 3C-3C of FIG. 3B. FIG. 3D shows an enlarged portion 3D of FIG. 3C. FIG. 3E shows a perspective view of the enlarged portion 3D of FIG. 3C.

[0054] As shown in FIGS. 3A-3E, the superstraight chuck assembly 118 may include a member 130, preferably having a ring shape. The member 130 may include a flexible portion 134. The size of the flexible portion 134 of the member 130 may vary during the planarization process, as described in more detail below. In exemplary embodiments, the thickness of the member 130, including the flexible portion 134, may be 0.2-5 mm, or 0.3-2 mm. In exemplary embodiments, the length of the flexible portion 134 at its shortest point during processing (i.e., the state shown in FIGS. 7A-7F, discussed below) may be 10-200 mm, or 20-75 mm. The ratio of the length of the flexible portion to the thickness of the flexible portion may be 1000:1 to 2:1. In one embodiment, the ratio of the length of the flexible portion to the thickness of the flexible portion may be 5:1 to 200:1. A thicker material with a low modulus of elasticity will be as flexible as a thinner material with a high modulus of elasticity. The member 130 can be made of a material having a modulus of elasticity (Young's modulus) of 1 to 210 GPa, 50 to 150 GPa, or 60 to 100 GPa. In one exemplary embodiment, the modulus of elasticity can be 70 GPa. The member 130 may or may not be made of a transparent material that allows UV light to pass through. That is, the member 130 may or may not be made of a material that is opaque to UV light. The member 130 can be made of plastic (e.g., acrylic), glass (e.g., fused silica, borosilicate), metal (e.g., aluminum, stainless steel), or ceramic (e.g., zirconia, sapphire, alumina). The member 130 can further have a modulus of elasticity of 0.01 to 5 Pa·m 3 , 0.1 to 4 Pa·m 3 , 0.5 to 3 Pa·m 3 , or 1.0 to 2 Pa·m 3The bending stiffness of the superstrate 108 or the flexible portion 134 of the member 130 may be 0.01:1 to 5:1, 0.05:1 to 4:1, 0.1:1 to 3:1, or 0.5:1 to 1:1, preferably less than 1:1. The following equation (1) defines the bending stiffness D: In equation (1), H is the thickness of the superstrate 108 or the flexible portion 134 of the member 130, v is the Poisson's ratio of the material of the superstrate 108 or the flexible portion 134 of the member 130, and E is the Young's modulus of the material of the superstrate 108 or the flexible portion 134 of the member 130. For example, the bending stiffness of the superstrate may be 2.12, and the bending stiffness of the flexible portion 134 of the member 130 may be 0.29, 0.68, 0.82, or 2.30 Pa·m 3 Additionally, the ratio of the bending stiffness of the flexible section 134 of the member 130 to the bending stiffness of the superstrate 108 can be 0.14:1, 0.32:1, 0.39:1, or 1.09:1.

number

[0055] The member 130 may further include a first cavity 148 (FIGS. 3D, 3E, 3I, 5C, 5F, 7A-7J) configured to retain a portion of the superstrate 108 in the flexible portion 134 of the member 130. The first cavity 148 may be an annular cavity concentrically surrounding the central opening 132. The first cavity 148 may be disposed adjacent to the inner edge 133 of the member. The first cavity 148 may be formed as a recess in the flexible portion 134.

[0056] The superstrate chuck assembly 118 may further include an optically transparent member 150 covering the central opening 132 of the member 130. In one exemplary embodiment, the optically transparent member 150 preferably has a high UV light transmittance and is transparent to UV light. That is, the material composition of the optically transparent member 150 may be selected so that the UV light used to cure the moldable material passes through the optically transparent member 150. In one embodiment, if the optically transparent member 150 transmits UV light, the optically transparent member may be made of a material that transmits more than 80% of light having a wavelength between 310 and 700 nm (i.e., UV light and visible light), such as sapphire or quartz glass. In another exemplary embodiment, the optically transparent member does not need to be transparent to UV light. If the optically transparent member does not need to be transparent to UV light, the optically transparent member may be made of a material that transmits more than 80% of light in the 400 to 700 nm (e.g., visible light), such as glass or borosilicate. That is, if there is no need to transmit UV light, the light-transmitting member 150 still needs to transmit visible light.

[0057] As best seen in FIGS. 3C, 3D, and 3E, the superstraight chuck assembly 118 may include a second cavity 152 defined by the member 130 and the optically transparent member 150. More specifically, the lower surface of the optically transparent member 150 and the upper surface of the spaced apart member 130 together define the second cavity 152. The second cavity 152 may be further defined by an inner wall of the support ring 188. Also, as best seen in FIGS. 3C, 3D, and 3E, the superstraight chuck assembly 118 may further include a fluid path 154 communicating with the second cavity 152 for pressurizing the second cavity 152. As used herein, pressurization includes both positive and negative pressure. The fluid path 154 may also be used to vent the second cavity 152 to the atmosphere. The fluid pathway 154 may include components that both allow the second cavity 152 to be selectively pressurized positively or negatively. In the illustrated example, the fluid pathway 154 includes a first port 156 connectable to a pressurized source (not shown). The first port 156 may be connected to the pressurized source via, for example, tubing (not shown). The first port 156 includes a first passage 158 in communication with a second passage 160, a first end 162 of the second passage 160 connected to the first passage 158, and a second end 164 of the second passage 160 connected to the second cavity 152. Thus, when the first port 156 is connected to the pressurized source, a positive pressure can be applied to pressurize the second cavity 152 via the first fluid pathway 154. One or more additional fluid pathways having the same structure as the fluid pathway 154 described above may be implemented. For example, as best seen in FIG. 3C, an additional fluid path 155 having the same structure as fluid path 154 may be positioned diametrically opposite fluid path 154 .

[0058] The superstrate can be retained by the flexible portion 134 by reducing the pressure within the first cavity 148. One way to reduce the pressure within the first cavity 148 is to apply a vacuum to the first cavity. To provide a vacuum to the first cavity 148 of the member 130, the superstrate chuck assembly 118 can further include a passage 166 (also referred to herein as a vacuum passage) in communication with the first cavity 148. If there is already a pressure differential within the assembly relative to the atmosphere surrounding the assembly, the passage 166 can be used as a way to reduce the pressure within the first cavity without being coupled to a vacuum. The vacuum passage 166 is best shown in FIGS. 3G, 3H, and 3I. As described in more detail below, the vacuum passage 166 can begin at the first passage 172 and terminate at the through-hole 186. FIG. 3F shows a cross-section taken along line 3F-3F of FIG. 3B. FIG. 3G shows an enlarged portion 3G of FIG. 3F. FIG. 3H shows a side perspective view of an enlarged portion 3G of FIG. 3F. FIG. 3I shows a bottom perspective view of an enlarged portion 3G of FIG. 3F. The vacuum path 166 may include components that together enable the first cavity 148 to apply a vacuum to the superstrate 108. In the illustrated exemplary embodiment, the vacuum path 166 includes a second port 168 connectable to a vacuum source (not shown) and a routing tube 170 connecting the second port 168 to the first cavity 148. The second port 168 may be connected to the vacuum source via, for example, a tube (not shown). The second port 168 includes a first passage 172 in communication with a second passage 174, a first end 176 of the second passage 174 connecting to the first passage 172 and a second end 178 of the second passage 174 connecting to the routing tube 170. The routing tube 170 may be a flexible tube having a first end 180 that connects to the second end 178 of the second passage 174 of the second port 168 and a second end 182 that connects to a fitting 184, such as a pneumatic fitting. The fitting 184 also connects to a through-hole 186 formed through the flexible portion 134 of the member 130 and leading to the first cavity 148.That is, by being connected to both the routing tube 170 and the through-hole 186, the fitting 184 directs vacuum suction downward into the first cavity 148 through the through-hole 186. Thus, when the second port 168 is connected to a vacuum source, a vacuum can be applied to the first cavity 148 to provide a suction force that can couple the region of the superstrate 108 below the first cavity 148 with the flexible portion 134.

[0059] One or more additional vacuum paths may be implemented, each having the same structure as the vacuum path 166 described above, with each vacuum path communicating with the same first cavity 148 and / or a corresponding additional first cavity (not shown) formed in the member 130. The additional first cavity or cavities may be concentrically disposed around the first cavity 148. That is, the additional first cavities may be concentrically disposed around the central opening 132, but may be disposed at a greater radial distance from the inner edge 133 than the illustrated first cavity 148. In one embodiment, the inner diameter of the member 130 may be smaller, and / or the first cavity 148 may have additional lands. For example, as best seen in FIG. 3F , an additional vacuum path 167 having the same structure as the vacuum path 166 may be disposed diametrically opposite the vacuum path 166. The additional first cavity or cavities can be used to help separate the superstrate from the stiffening layer as part of the planarization process described in more detail below. In another embodiment, additional cavities or vacuum cavities allow the same superstrate chuck assembly 118 to be used with different sized superstrates.

[0060] In another embodiment, the first cavity 148 and vacuum path 166 can be replaced with another mechanism for coupling the member 130 to the superstrate. For example, the cavity / vacuum mechanism can include an electrode that applies an electrostatic force. Another option is mechanical latching, where a mechanical structure on the underside of the member 130 can mate (provide a good, tight, and / or appropriate fit) with the superstrate.

[0061] The superstrate chuck assembly 118 may further include a support ring 188. The support ring 188 does not need to be made of a transparent material that allows UV light to pass through. That is, the support ring 188 may be constructed of a material that is opaque to UV light. The support ring 188 may be constructed of plastic (e.g., acrylic), glass (e.g., fused silica, borosilicate), metal (e.g., aluminum, stainless steel), or ceramic (e.g., zirconia, sapphire, alumina). In an exemplary embodiment, the support ring 188 may be constructed of the same material as the member 130.

[0062] FIG. 4 illustrates an exploded view in which the support ring 188 is shown separated from the member 130 and the optically transparent member 150. As best shown in FIG. 4, the support ring 188 may include a generally circular body 190 defining an open central region 192. The outer periphery of the support ring 188 may be uniform. The inner periphery of the support ring 188 may include a step 194 providing a receiving surface 196 for receiving the optically transparent member 150. That is, as best seen in FIGS. 3D, 3E, 3G, 3H, and 3I, the optically transparent member 150 may be positioned on the light-receiving surface 196 of the step 194, thereby covering the central region 192. The optically transparent member 150 may be secured onto the light-receiving surface 196 with an adhesive or the like. In this manner, when the light-transmitting member 150 is placed / fixed on the light-receiving surface 196, the second cavity 152 is defined by the lower surface of the light-transmitting member, the inner surface of the support ring 188 (more specifically, the inner surface of the step 194), and the upper surface of the member 130.

[0063] The member 130 may be coupled to the underside of the support ring 188 using coupling members (not shown), such as screws, nuts / bolts, adhesive, or the like. The coupling members are preferably positioned adjacent the outer edge 191 of the support ring 188 and adjacent the outer edge 131 of the member 130. If the coupling members are screws, they preferably pass through the member 130 adjacent the outer edge 131 and into the support ring 188 adjacent the outer edge 191, such as through a plurality of receiving holes 189 (FIGS. 3E, 3H, 3I, 4, 5C, 5F). If the coupling members are adhesive, they are preferably positioned between the member 130 adjacent the outer edge 131 and the support ring 188 adjacent the outer edge 191. In this manner, the upper surface of the member 130 is secured in contact with the outer edge 131 and the underside of the circular body 190 of the support ring 188 adjacent the outer edge 191. Additional surface area of ​​the member 130 may be selectively coupled to the support ring 188 as part of the planarization process. The method of selectively coupling the additional surface area of ​​member 130 to support ring 188 is described in more detail below.

[0064] As shown in Figures 3C, 3D, and 3E, all or a portion of the above-described fluid path 154 and / or additional fluid path 155 may be included within support ring 188. Also, as shown in Figures 3F, 3G, 3H, and 3I, all or a portion of vacuum path 166 and / or additional vacuum path may be included within support ring 188. More specifically, a portion of first port 156, first passage 158, second passage 160, first end 162, and second end 164 of fluid path 154 may be included within support ring 188, while a portion of second port 168, first passage 172, second passage 174, first end 176, and second end 178 of vacuum path 166 may be included within support ring 188. However, as best shown in Figures 3G and 3H, routing tube 170 may be external to support ring 188. Thus, in addition to supporting the optically transparent member 150 and member 130, the support ring 188 can also provide a path / structure for the fluid and vacuum paths. In an alternative embodiment, there is no routing tube 170 and the vacuum passes through a port in the support ring 188 via a channel from the non-flexible portion 135 of member 130 to the flexible portion 134 of member 130 to the first cavity 148.

[0065] The superstrate chuck assembly 118 may further include an additional vacuum path that allows for selectively securing the member 130 to the underside of the support ring 188. While the vacuum flow path described above communicates with the first cavity 148 of the member 130, the additional vacuum path that allows for selectively securing the member 130 to the underside of the support ring 188 is an annular cavity within the support ring 188 that opens to the underside of the support ring 188. Figures 5A-5C show an example of a first vacuum path 200 that is used to selectively secure the member 130 to the support ring 188. Figures 5D-5F show an example of a second vacuum path 202 that is used to selectively secure the member 130 to the support ring 188.

[0066] FIG. 5A shows a cross-section taken along line 5A-5A of FIG. 3B. FIG. 5B shows an enlarged portion 5B of FIG. 5A. FIG. 5C shows a side perspective view of the enlarged portion 5B of FIG. 5A. The first vacuum path 200 may include components that apply a vacuum suction force to the upper surface of the member 130 to further secure the member 130 to the lower surface of the support ring 188. In the illustrated exemplary embodiment, the first vacuum path 200 includes a first port 204 connectable to a vacuum source (not shown). The first port 204 of the vacuum path 200 may be connected to the vacuum source via, for example, tubing (not shown). As best seen in FIGS. 5B and 5C, the first port 204 of the vacuum path 200 includes a first passage 206 connected to a second passage 208, which is connected to a third cavity 210. 5B and 5C , the first passage 206 may be oriented vertically and direct a vacuum downward, the second passage 208 of the vacuum path 200 may be oriented horizontally and direct a vacuum radially, and the third cavity 210 of the vacuum path 200 may be oriented vertically and direct a vacuum downward. The third cavity 210 of the vacuum path 200 may connect to a first annular cavity 212 having an open end facing downward toward the member 130. Thus, when the first port 204 of the vacuum path 200 is connected to a vacuum source and the upper surface of the member 130 contacts the lower surface of the support ring 188, a vacuum may be applied to the first annular cavity 212 of the vacuum path 200, securing the member 130 to the support ring 188 via the first vacuum path 200.

[0067] FIG. 5D shows a cross section taken along line 5D-5D of FIG. 3B. FIG. 5E shows an enlarged portion 5E of FIG. 5D. FIG. 5F shows a side perspective view of the enlarged portion 5E of FIG. 5D. The second vacuum path 202 can include components that apply a vacuum suction force together to the upper surface of the member 130 to secure the member 130 to the lower surface of the support ring 188. In the illustrated exemplary embodiment, the second vacuum path 202 includes a second port 214 that is connectable to a vacuum source (not shown). The second port 214 of the second vacuum path 202 can be connected to the vacuum source via, for example, tubing (not shown). As best seen in FIGS. 5E and 5F, the second port 214 of the second vacuum path 202 includes a first passage 216 connected to a second passage 218, which is connected to a third cavity 220. 5E and 5F , the first passage 216 of the second vacuum path 202 may be oriented vertically to direct the vacuum downward, the second passage 218 of the second vacuum path 202 may be oriented horizontally to direct the vacuum radially, and the third cavity 220 of the second vacuum path 202 may be oriented vertically to direct the vacuum downward. The third cavity 220 of the second vacuum path 202 may be connected to a second annular cavity 222 having an open end facing downward toward the member 130. Thus, when the second port 214 of the second vacuum path 202 is connected to a vacuum source and the upper surface of the member 130 contacts the lower surface of the support ring 188, a vacuum may be applied to the first annular cavity 212 of the second vacuum path 202, securing the member 130 to the support ring 188 via the second vacuum path 202.

[0068] 5B and 5C with FIGURES 5E and 5F, the first annular cavity 212 is located radially inward relative to the second annular cavity 222. That is, the first annular cavity 212 is radially closer to the second cavity 152 than the second annular cavity 222. Because the first annular cavity 212 and the second annular cavity 222 are in different radial locations, each cavity applies a suction force to a different annular portion of the upper surface of the member 130. Furthermore, because the first annular cavity 212 and the second annular cavity 222 each communicate with a vacuum source via a separate flow path (i.e., the first annular cavity 212 is part of the first flow path 200, and the second annular cavity 222 is part of the second flow path 202), a vacuum may be applied to each cavity independently. For example, if a vacuum is applied only to the second annular cavity 212, the suction force may be applied only to the portion of the upper surface of the member 130 that contacts the second annular cavity 212. On the other hand, if a vacuum is applied simultaneously to both the first annular cavity 212 and the second annular cavity 222, the suction force will be applied to a larger area of ​​the upper surface of the member 130, i.e., the portion of the upper surface of the member 130 that contacts the first annular cavity 212 and the portion of the upper surface of the member 130 that contacts the second annular cavity 222.

[0069] As shown in FIGS. 3C-3I and 5A-5F, the support ring 188 may include additional annular cavities 224 that can apply vacuum to the member 130 in the same manner as described above. That is, each of the additional annular cavities 224 may be connected to a vacuum source via a port and a connecting cavity. The additional annular cavities 224 may be radially spaced apart. The number of additional annular cavities 224 may be selected to optimally control how much of the surface area of ​​the member 130 is suctioned under the support ring 188. For example, the number of annular cavities may be 1 to 10, 3 to 7, or 4 to 6. As shown in the figures, the annular cavities may be of various sizes. The ratio of the cross-sectional area of ​​one annular cavity to the cross-sectional area of ​​another annular cavity may be 10:1 to 1:1, 8:1 to 4:1, or 5:1 to 3:1. Some of the annular cavities may have the same size and shape. The annular cavities may have a rectangular or square cross-sectional shape. The support ring 188 may further include lands 226 between adjacent annular cavities. The lands 226 are portions of the support ring that contact the top surface of the member 130.

[0070] While the exemplary embodiment of the superstraight chuck assembly 118 includes the support ring 188 as a structural element separate from the member 130, in another embodiment, the member may be a single piece of structure including a portion shaped like the member and a portion shaped like the support ring. In other words, in such an embodiment, there is no separate support ring; instead, there is a single, continuous structure with a thick portion resembling the support ring and a thin portion resembling the flexible portion of the support ring. In such an embodiment, because there is no separate support ring and member, there is no need for an annular cavity or for ports and cavities providing a vacuum path. Rather, in this embodiment, there may only be a fluid path leading to the second cavity (i.e., equivalent to fluid path 154) and possibly a vacuum path leading to the flexible portion of the member (i.e., equivalent to vacuum path 166). FIG. 6 shows a schematic cross-section of such another embodiment of a superstraight chuck assembly 618.

[0071] 6 , in an additional exemplary embodiment, a superstraight chuck assembly 618 is similar to the superstraight chuck assembly 118, except that instead of a member coupled to a support ring, the superstraight chuck assembly 618 includes a single member 630 having both the structure of the support ring of the first exemplary superstraight chuck assembly 118 and some of the structure found on the support ring 188 of the first exemplary superstraight chuck assembly 118. That is, the member 630 similarly preferably has a ring shape and may include a central opening 632, a flexible portion 634, and a first cavity 648 configured to hold the superstraight 108 to the flexible portion 634. The superstraight chuck assembly 618 similarly may further include an optically transparent member 650 covering the central opening 632, where the optically transparent member 650 is the same as the optically transparent member 150 of the first embodiment. The superstraight chuck assembly 618 may also include a second cavity 652 and a fluid path (not shown) in communication with the second cavity 652 for pressurizing the second cavity 652. The flow path 654 may be the same as the flow path 154 of the first exemplary embodiment. The superstraight chuck assembly 618 may further include a vacuum path (not shown) in communication with the first cavity 648, the same as in the first embodiment.

[0072] Instead of a support ring, member 630 may further include a support portion 688. Support portion 688 may have essentially the same structure as support ring 188 of the first exemplary embodiment, except that there is no annular cavity because the support portion is part of member 630 rather than a separate, connected component. As in the first embodiment, support portion 688 includes a circular body defining an open central region, and the inner periphery of support portion 688 includes a step 694 that provides a receiving surface for receiving optically transparent member 650.

[0073] Similar to the first exemplary embodiment, the member 630 may include a non-flexible portion 635 and a flexible portion 634. However, in the superstraight chuck assembly 618, the length of the non-flexible portion 635 is defined by the support portion 688, and therefore the support portion 688 is an integral part of the member 630. For similar reasons, the flexible portion 634 is fixed. That is, the thicker support portion 688 of the member 630 is inflexible, while the thinner flexible portion 634 is flexible. Thus, the superstraight chuck assembly 618 is similar to the check assembly 118 of the first embodiment, except for the ability to change the length of the flexible and non-flexible portions of the member as part of the planarization method. Furthermore, because the member 630 includes the support portion 688, in the superstraight chuck assembly 618, the second cavity 652 is specifically defined by the flexible portion 634. The data for the member 630 may be the same material as the member 130 or the support ring 188 described above, including the same modulus of elasticity. The thickness of flexible portion 634 of member 630 may be the same as the thickness of member 130 described above with respect to the previous embodiment. The length of flexible portion 634 of member 630 may be the same as the length of flexible portion 134 at its shortest length, as described in detail above with respect to the previous embodiment. The length ratio of flexible portion 634 of member 630 may be the same as the length-to-thickness ratio of member 130 described in detail above with respect to the previous embodiment.

[0074] The operation of the superstraight chuck assembly 618 as part of the molding process will now be described with reference to FIGS. 7A-12C. FIG. 7A shows a flowchart of a planarization method 700, which is an example of a molding process. FIG. 7B shows a flowchart of a separation method 702, including more details of the separation step S710. The molding process may also be an imprint method, using a patterned template instead of a superstraight. FIGS. 8A-8R show cross-sectional schematic views of the planarization method 700 and separation method 702 using the superstraight chuck assembly 618 of the second embodiment. While the superstraight chuck assembly 618 is shown in an exemplary manner, the method may also be performed using the superstraight chuck assembly 118 of the first embodiment.

[0075] The method begins at step S702, where a substrate 102 having a droplet of moldable material 124 dispensed thereon is positioned beneath a superstrate 108 coupled with member 630 of superstrate chuck assembly 618. Thus, prior to performing step S702, a droplet of moldable material is dispensed onto the substrate in the manner described above. This state is illustrated in FIG. 8A, which shows a schematic cross-section of a substrate 102 having dispensed moldable material 124 disposed beneath a superstrate 108 held by superstrate chuck assembly 618.

[0076] Prior to performing step S702, the superstrate chuck assembly 618 is prepared by applying a vacuum to the first cavity 648 of the member 630, contacting the first cavity 648 with the upper surface of the superstrate 108, thereby coupling the superstrate 108 to the member 630. If there are multiple vacuum cavities (e.g., two) within the flexible portion 634 of the member 630, in one embodiment, less than all of the vacuum cavities (e.g., only one) may have a vacuum applied during step S702. For example, in one embodiment, only the first cavity, which is radially outermost relative to the central opening 632, may have a vacuum applied. However, in another embodiment, all of the vacuum cavities (e.g., two) may have a vacuum applied during step S702.

[0077] As shown in FIG. 8A , in one embodiment, the second cavity 652 may not yet be positively pressurized when the substrate 102 is placed under the superstrate 108. In another embodiment, to improve throughput, the second cavity 652 may be pre-pressurized with positive pressure before the substrate 102 is placed under the superstrate 108. Furthermore, during the calibration step prior to the moment shown in FIG. 8A , a negative pressure may be applied to the second cavity 652 using a fluid path (not shown, equivalent to the fluid path 154 of the superstrate chuck assembly 118 of the first embodiment). In the state shown in FIG. 8A , the pressure P in the second cavity is preferably equal to atmospheric pressure, but may also be positively or negatively pressurized. The substrate chuck 104 may also include a separation initiator 110. In one exemplary embodiment, the separation initiator 110 may be a push pin. The separation initiator 110 may reside in a passageway extending through the superstrate chuck 104. The separation initiator 110 is configured to move upwardly as part of a method of separating the superstrate 108 from the stiffening layer 146, which will be described below.

[0078] The method then proceeds to step S704, where the second cavity 652 of the superstraight chuck assembly 618 is pressurized with a positive pressure. FIG. 8B shows a schematic cross-section of the superstraight chuck assembly 618 after the second cavity 652 has been pressurized. The second cavity 652 may be pressurized by applying a positive pressure P through a fluid path (not shown, equivalent to the fluid path 154 of the superstraight chuck assembly 118 of the first embodiment). The amount of pressure P may be selected to be sufficient to bend the superstraight 108 to the desired curvature, as shown in FIG. 8B. The pressure P may be set to 0.1 to 10 kPa. Simultaneously, vacuum suction is applied to the first cavity 648. Thus, during step S704, the member 630 remains attached to the superstraight 108 through the first cavity 648. 8B , the flexible portion 634 of the member 630 may bend / bend as well due to the positive pressure P and the bending of the superstrate 108. The second cavity 652 may be positively pressurized to a pressure P before moving the superstrate chuck assembly 618 toward the substrate 102 or as the superstrate chuck assembly 618 moves toward the substrate 102. If the pressurization occurs while the superstrate chuck assembly 618 moves toward the substrate 102, the target pressure should be reached before the superstrate 608 contacts the moldable material 124.

[0079] The method continues at step S706, where the superstrate 108 is contacted with the droplet of moldable material 124 on the substrate 102 to form the film layer 144. FIG. 8C shows a schematic cross-section of the superstrate chuck assembly 618 just before the curved superstrate 108 contacts the droplet of moldable material 124. As shown in FIG. 8C, the positive pressure P is still maintained and vacuum suction is still applied to the first cavity 148 until this moment. In one embodiment, the pressure P within the second cavity 652 increases as the superstrate 108 conforms to the moldable material 124 to maintain the desired curvature. Applicants have determined that as the non-conforming area of ​​the superstrate decreases, more pressure is required to maintain a particular superstrate curvature. As the contact area of ​​the superstrate increases during step S706, the contact area of ​​the superstrate begins to conform to the shape of the superstrate below the contact area, while the portion of the superstrate outside the contact area is the non-conforming area where curvature needs to be controlled. Maintaining this curvature is important to minimize air bubble entrapment, which can lead to unfilled defects. In one embodiment, the curvature just beyond the conforming portion (contact area) of the superstrate is controlled. In other words, the curvature of the superstrate in an annular region just outside the contact area is controlled. In one embodiment, the desired superstrate curvature profile in this annular region is controlled while the moldable material spreads beneath the contact area. This may require that the pressure P be maintained and / or increased during step S706. In one embodiment, the superstrate 108 is "flat" (conforms to the shape of the substrate 102) after the moldable material stops spreading.

[0080] FIG. 8D shows a schematic cross section of the superstraight chuck assembly 618 as it continues to move downward toward the substrate 102, forming the film 144. As shown in FIG. 8D , as the superstraight chuck assembly 618 continues to move the superstraight 108 downward, a film 144 of moldable material 124 begins to form in the region between the center of the superstraight 108 and the substrate 102. Concurrent with this action, the positive pressure P within the second cavity 652 can be maintained or increased so that the superstraight 108 maintains a desired curvature in the region of the superstraight that closely conforms to the moldable material as it is pressed against the moldable material 124. Preferably, the pressure P is increased. That is, as seen in FIG. 8D compared to FIG. 8C , the superstraight 108 has a smaller arc than that of FIG. 8D so that the region of the superstraight that attempts to conform to the moldable material maintains a desired curvature. At the same time, the flexible portion 634 of the member 630 also has a flatter shape in FIG. 8D compared to FIG. 8C as it now begins to flatten along with the superstrate 108.

[0081] FIG. 8E shows a schematic cross-section of the superstrate chuck assembly 618 at a point where the superstrate 108 has been further pressed toward the substrate 102. As seen in FIG. 8E, as the superstrate 108 continues to be pressed downward, the film 144 of moldable material 124 spreads further along the surface of the substrate 102 toward the edge. The positive pressure P is further increased or maintained to maintain the desired curvature in the areas of the substrate that closely conform to the moldable material. Preferably, the pressure P is further increased. Thus, as the superstrate 108 continues to be pressed downward toward the substrate 102, the superstrate 108 continues to bend to maintain the desired curvature in the areas of the substrate that conform to the moldable material. That is, the superstrate 108 in FIG. 8E has a smaller arc than FIG. 8D so that the areas of the superstrate that attempt to conform to the moldable material maintain the desired curvature. At the same time, the flexible portion 634 also continues to flatten relative to FIGS. 8C and 8D. That is, the flexible portion 634 is flatter in FIG. 8E than in FIG. 8D. Vacuum suction is still applied to first cavity 648 throughout the position shown in Figures 8D and 8E.

[0082] FIG. 8F shows a schematic cross-section of the superstrate chuck assembly 618 at the point where the superstrate 108 has been fully pressed against the moldable material 124, such that the membrane 144 is fully formed. As shown in FIG. 8F, the superstrate 108 has been pressed until it is flat again. That is, the superstrate 108 no longer has an arc or is substantially free of arc. Similarly, the flexible portion 634 of the member 630 is flat or substantially free of flex. The positive pressure in the second cavity 652 at this point is either completely removed or vented to the atmosphere. Vacuum suction is still applied to the first cavity 648, such that the moment shown in FIG. 8E is prior to curing and prior to the separation process described below.

[0083] The method then proceeds to step S708, where the formed film 144 located between the superstrate 108 and the substrate 102 is cured. FIG. 8G shows a schematic cross-section of the superstrate chuck assembly 618 during the curing step of step S708 according to a first embodiment. In the first exemplary embodiment, the curing step may be performed in the manner described above using a curing system. The radiation source 126 may, for example, emit UV radiation that is directed through the optically transparent member and the superstrate 108, each of which transmits the UV radiation. In one embodiment, the member 630 may be transparent to UV radiation so as not to interfere with the curing process. In another embodiment, the member 630 need not be transparent to UV radiation. If the member 630 is opaque to UV radiation, the member 630 must be moved relative to the multi-layer structure (substrate 102, uncured moldable material 124, and superstrate 108) while the uncured moldable material 124 of the multi-layer combination is cured during step S708. In this first embodiment, when UV radiation passes through the optically transparent member 150, the optically transparent member 150 may be made of a material that transmits 80% or more of light having wavelengths between 310 and 700 nm (e.g., UV and visible light), such as sapphire or fused silica. After exposure to UV radiation, the film 144 of moldable material is cured, thereby forming a hardened cured layer 146. During the curing process, the pressure P within the second cavity 652 may remain at atmospheric pressure, and a vacuum may still be applied to the first cavity 648.

[0084] 8H and 8I show a schematic cross-section of the superstrate chuck assembly 618 during the curing step of step S708 according to the second embodiment. In the second exemplary embodiment, as shown in FIG. 8H, the superstrate 108 is first released from the member 630. Therefore, at this point, the vacuum applied to the first cavity 648 is terminated. After the superstrate 108 is released from the member 630, the superstrate 108 / film 144 / substrate 102 / substrate chuck 104 combination can be moved to another location via the stage. As shown in FIG. 8I, once the superstrate 108 / film 144 / substrate 102 / substrate chuck 104 combination is in the other location, the curing process can be performed. As with the first embodiment, curing can be performed by exposing the film 144 to UV light through the superstrate 108. However, because the superstrate 108 / film 144 / substrate 102 / substrate chuck 104 combination is in a different position and no longer coupled to the superstrate chuck assembly 118, the UV light does not need to pass through either the light-transmitting member 650 or the member 630. In this second embodiment, if the UV radiation does not pass through the light-transmitting member, the light-transmitting member 650 may be comprised of a material that transmits 80% or more of light with wavelengths between 400 and 700 nm (i.e., visible light, not UV light), such as glass, borosilicate, etc., and need not be comprised of a UV-light-transmitting material. After curing is complete, the superstrate 108 / cured film 146 / substrate 102 / substrate chuck 104 combination can be placed back under the superstrate chuck assembly 618.

[0085] The method then proceeds to step S710, where the superstrate 108 is separated from the stiffening layer 146. Details of the method 702 for separating the superstrate 108 from the stiffening layer 146 are shown in the flowchart of FIG. 7B. FIGS. 8J-8R show schematic cross-sectional views of the superstrate chuck assembly 118 corresponding to the steps of the separation method 702 shown in the flowchart of FIG. 7B. FIG. 9 shows a schematic top view of the superstrate 108 / stiffening layer 146 / substrate 102 / substrate chuck 104 combination corresponding to the steps of the separation method shown in the flowchart of FIG. 7B. FIG. 10A is a timing diagram illustrating the Z-dimensional position of the plate chuck assembly 618 during the method for separating the superstrate 108 702 from the stiffening layer 146 of FIG. 7B. FIG. 10B is a timing diagram illustrating the tilt of the plate chuck assembly during the method for separating the superstrate 108 from the stiffening layer of FIG. 7B, according to the exemplary embodiment of FIGS. 8J-8R and 9.

[0086] Prior to commencing the method of separating the superstrate 108 from the stiffening layer 146, the superstrate 108 / stiffening layer 146 / substrate 102 / substrate chuck 104 combination may be positioned (i.e., unbonded) below the superstrate chuck assembly 618. Alternatively, the superstrate 108 / stiffening layer 146 / substrate 102 / substrate chuck 104 combination may already be coupled to the superstrate chuck assembly 618. The first step is shown in FIG. 8J, which corresponds to the curing embodiment shown in FIGS. 8H and 81, i.e., the curing embodiment where curing occurs in-situ. After curing is complete, the superstrate 108 / stiffening layer 146 / substrate 102 / substrate chuck 104 combination is positioned below the superstrate chuck assembly 618. In the case of the stiffening embodiment shown in FIG. 8G, the superstrate 108 has not been separated from the superstrate chuck assembly 618; therefore, the superstrate 108 / stiffening layer 146 / substrate 102 / substrate chuck 104 combination is still coupled to the superstrate chuck assembly 618. In either case, this same moment in time is represented diagrammatically by state 902 in FIG. 9. As shown in FIG. 9, the separation process has not yet begun at position 902, so there is no sign of separation between the superstrate 108 and the stiffening layer 146. That is, at position 902 in FIG. 9, only unseparated portion 903 is present, and no separated portion is present. Furthermore, as shown in FIGS. 8A-8J, the separation method has not yet begun, so the separation initiator 110 is in a retracted position. That is, throughout the steps shown in FIGS. 8A-8J, the separation initiator 110 has not yet been actuated into contact with the superstrate 108.

[0087] The method for separating the superstrate 108 from the stiffening layer 146 begins at step S712, which creates a separation front between the stiffening layer 146 and the superstrate 108 at an initial separation point 802. FIG. 8K shows a schematic cross-section of the superstrate chuck assembly 618 over the superstrate 108 / stiffening layer 146 / substrate 102 / substrate chuck 104 combination at the moment step S712 is performed to create the separation front at the initial separation point 802. At this point, the position of the superstrate chuck assembly 618 relative to the superstrate in the Z dimension is shown in FIG. 8K as Z pos As shown in Figure 8K, at Z position Z pos is defined as the distance between the top surface of the substrate chuck 104 and the midpoint of the member 650 of the superstrate chuck assembly 618.

[0088] As shown in FIG. 8K, the initiation of the separation front can be accomplished by actuating the separation initiator 110 from a retracted position to an extended position. In the extended position shown in FIG. 8K, the tip of the separation initiator 110 contacts the superstrate 108 at the lower edge of the superstrate 108, pushing the edge of the superstrate 108 away from the stiffening layer 146. That is, the force with which the separation initiator 110 moves upward and contacts the lower edge of the superstrate 108 is sufficient to separate the edge of the superstrate 108 from the edge of the stiffening layer 146. Position 904 in FIG. 9 shows a schematic top view of the initial separation point 802. As shown in FIG. 9, at position 904, this initiation of the separation front results in a small separated region 905 and a large non-separated region 906. The ratio of the separated region 905 to the non-separated region 906 can be between 1:200 and 1:50.

[0089] The method then proceeds to step S714, where the plate chuck assembly 618 and / or substrate chuck 104 are tilted away from the initial separation point 802 while the superstrate 108 is held by the flexures 634. To accomplish this, the superstrate 108 / stiffening layer 146 / substrate 102 / substrate chuck 104 combination is coupled to the superstrate chuck assembly 618. In the illustrated embodiment, where stiffening occurs at different locations, the method includes the bonding step shown in FIG. 8L. That is, in the illustrated embodiment, after the separation front is triggered at the initial separation point, there is a step of coupling the superstrate 108 / stiffening layer 146 / substrate 102 / substrate chuck 104 combination to the superstrate chuck assembly 618. At the moment shown in FIG. 8L, the superstrate chuck assembly 618 has been lowered in the Z direction relative to the movement shown in FIG. 8K so that the flexures 634 contact the superstrate 108. Thus, the Z in FIG. 8L pos is Z in Figure 8K pos is smaller than.

[0090] Position 907 shown in Figure 9 is in the same state as shown in Figure 8L. Thus, at position 907, only bonding has occurred, so there is no change in the amount of separation. As shown in Figure 9, at position 907, the same separation region 905 and the same non-separation region 906 as at position 904 still exist. Therefore, the ratio of separation region 905 to non-separation region 906 has not changed from position 904.

[0091] If curing occurs while the superstrate 108 / membrane layer 144 / substrate 102 / substrate chuck 104 combination remains bonded to the superstrate chuck assembly 618, there is no bonding step because the superstrate 108 / stiffening layer 146 / substrate 102 / substrate chuck 104 combination is already bonded to the superstrate chuck assembly 618 when the separation front is triggered at the initial separation point 802. In either case, the method will eventually reach the position shown in FIG. 8L. Thus, if curing occurs while the superstrate 108 / membrane layer 144 / substrate 102 / substrate chuck 104 combination remains bonded to the superstrate chuck assembly 618, the step of activating the separation initiator 110 occurs while the superstrate 108 / membrane layer 144 / substrate 102 / substrate chuck 104 combination is still bonded to the superstrate chuck assembly 618.

[0092] FIG. 8M illustrates the initiation of tilting away from the initial separation point 802 as part of step S714. In the illustrated embodiment, the superstrate chuck assembly 618 is tilted. However, in other embodiments, the substrate chuck 104 may be tilted. In yet other embodiments, both may be tilted. When both are tilted, the two tilt in opposite directions. As shown in FIG. 8M, the tilt θ t can be applied by rotating the superstraight chuck assembly 618 counterclockwise in the direction of the X-axis (θX). When the rotation is about the X-axis (θX), the tilt is tx Counterclockwise rotation about the X-axis (θX) causes the portion of the superstrate 108 located at the initial separation point 802 to be lifted upward. The same principle can be applied when the separation point is on the opposite side of the superstrate 108 (i.e., on the opposite side of the Y-axis from the illustrated embodiment). In this case, tilt θ t8M, the coupling between the superstrate 108 and the superstrate chuck assembly 618 is maintained during tilting by maintaining a vacuum applied to the cavity 648. In the illustrated embodiment of FIG. 8M, there is no movement of the superstrate chuck assembly 618 in the Z dimension, and therefore the Z axis of FIG. pos is Z in Figure 8L pos is the same as

[0093] Position 908 in Figure 9 shows a schematic top view of the separation corresponding to the state shown in Figure 8M. By performing tilting, as shown in Figure 9, the separation front of the superstrate 108 from the stiffening layer 146 begins to propagate along the periphery of the substrate, thus providing a separated region 909 and a non-separated region 910. The ratio of the separated region 909 to the non-separated region 910 can be 1:150 to 1:10.

[0094] slope θ t The magnitude of the angle can be between 0.01 milliradians and 10 milliradians relative to the horizontal Y-axis and the horizontal plane of the cross-sectional view.

[0095] Next, the separation method proceeds to step S716, where the slope θ t While maintaining or increasing Z, a force F is applied to the superstrate chuck assembly 618 and / or the substrate chuck 104 in a direction away from each other. Application of force F results in Z pos Figure 8N shows that Z pos 6 illustrates an exemplary embodiment at a moment when a force F is being applied to the superstrate chuck assembly 618 in an upward direction along the Z axis to increase the tilt θ t 8N compared to FIG. 8M. That is, in the illustrated embodiment, a force F is applied to the plate chuck assembly 618 away from the substrate chuck 104 while the substrate chuck 104 is stationary, resulting in a force Z pos increases, and the slope θ t is maintained from the previous step. However, in another embodiment, the same Z posTo achieve the lift, a force F can be applied downward in the Z direction to the substrate chuck 104 while the plate chuck assembly 618 is stationary. In yet another embodiment, forces can be applied to both the superstraight chuck assembly 618 and the substrate chuck 104. In that case, one force is applied downward in the Z direction to the substrate chuck 104, and another opposite force is applied upward in the Z direction to the superstraight chuck assembly 618, thereby creating the same Z force. pos The forces are opposite to each other so that an increase is achieved. t Instead of maintaining the slope θ t Increasing the slope θ t is the slope of the previous stage θ t It can be increased by 0.01 to 10 milliradians.

[0096] Location 911 in Figure 9 shows a schematic top view of the separation corresponding to the moment shown in Figure 8N. As shown in Figure 9, Z pos As a result of the upward force F to increase, the separation front continues to propagate further along the circumference of the substrate 102, thus providing a separated region 912 and a non-separated region 913. The separated region 912 at position 911 is smaller than the non-separated region 913 at position 911. The ratio of the separated region 912 to the non-separated region 913 can be 1:50 to 1:4.

[0097] The separation method 702 then proceeds to step S718, where a force F is continuously applied to the plate chuck assembly and / or the substrate chuck in a direction away from one another, thereby increasing Z until the plate is no longer in contact with the hardened layer. pos That is, in one exemplary embodiment, simply continuing to apply force F may be sufficient to completely separate the superstrate 108 from the stiffening layer 146. FIG. 8O illustrates the effect of force F being applied to the plate chuck assembly 618 in an upward direction along the Z axis. pos 8O shows an exemplary embodiment of the instant when the slope β tis kept constant from the previous step. As shown in Figure 8O, the slope θ t With continued application of force F while maintaining force F, separation between the superstrate 108 and stiffening layer 146 begins to reach a point radially opposite along the circumference of the substrate 102 from the initial separation point 802. At this point, a separation front occurs at a point opposite the initial separation point 802 (i.e., the separation front is very close to the edge of the opposite end), but the propagation of the separation front at the initial separation point 802 has increased much more toward the center of the substrate 102. For example, the ratio of the radial distance of separation from the edge R1 of the initial separation point 802 to the radial distance of separation from the radially opposite point R2 can be between 10:1 and 2:1.

[0098] Position 914 in Figure 9 shows a schematic top view of the separation corresponding to the state shown in Figure 8O. As shown in Figure 9, a continuous upward force F is applied to the Z pos Increasing the slope β t By maintaining the force F, the separation front continues to propagate further along the circumference of the substrate 102, creating a separation region 915 and a non-separation region 916. Although the separation region 915 at position 914 has propagated completely around the circumference of the substrate 102, the separation front is much farther toward the center of the substrate 102 relative to the initial separation point 802. Thus, at position 914, the separation region 915 is smaller than the non-separation region 916. The ratio of the separation region 915 to the non-separation region 916 can be between 1:20 and 1:2. As mentioned above, the force F can also be applied continuously downward on the substrate chuck 104 instead of upward on the superstrate chuck assembly 618, or both opposing forces can be applied continuously at the same time to achieve the same result.

[0099] In one exemplary embodiment, continued application of force F is sufficient to continue propagating the separation front until the entire superstrate 108 has completely separated from the entire stiffening layer 146, in which case the method skips to the moment shown in Figures 8R and 9 at position 923. However, in the illustrated exemplary embodiment, an additional intermediate step is shown that further improves separation.

[0100] The first additional intermediate step is shown in FIG. 8P. In the first additional step, the plate chuck assembly 618 and / or the substrate chuck 104 are tilted toward the initial separation point 802 while continuing to apply force F. In the illustrated embodiment, the superstrate chuck assembly 618 is tilted. However, in other embodiments, the substrate chuck 104 may be tilted. In yet other embodiments, both may be tilted. If both are tilted, they may be tilted in opposite directions.

[0101] As shown in FIG. 8P, the tilt θ t can be changed by rotating the superstraight chuck assembly 618 about the X-axis (θX) in a direction opposite to the direction of tilt in FIGS. 8M-8O. t The direction of rotation is clockwise in the illustrated exemplary embodiment. By rotating clockwise about the X-axis (θX), a significant portion of the superstrate 108 located opposite the initial separation point 802 is lifted upward. That is, by applying a tilt in the opposite direction, the separation front starts from the opposite side of the initial separation point 802 and propagates toward the center of the substrate 102. Position 917 in Figure 9 shows a schematic top view of the separation corresponding to the situation shown in Figure 8P. As shown in Figure 9, when the reverse tilt θ t By performing this, the delamination of the superstrate 108 from the cured layer 146 propagates toward the center of the substrate 102, resulting in a delaminated region 918 and a non-delaminated region 919. The delaminated region 918 at location 917 will be larger than the delaminated region 915 at location 914. The ratio of the delaminated region 918 to the non-delaminated region 919 can be between 1:3 and 4:1.

[0102] Reverse slope θ t The magnitude of can be 0.01 to 10 milliradians relative to the horizontal Y axis and the horizontal plane shown in the cross-sectional view.

[0103] A second additional intermediate step is shown in Figure 8Q. In the second additional step, Z posWhile continuing to apply upward force F to further increase F, the plate chuck assembly 618 and / or the substrate chuck 104 are no longer tilted. In the illustrated embodiment, the plate chuck assembly 618 is no longer tilted. However, in another embodiment, if the substrate chuck 104 was previously tilted, the substrate chuck 104 is no longer tilted in the second additional step. In yet another embodiment, where both were previously tilted, both the substrate chuck assembly 618 and the substrate chuck 104 are no longer tilted in the second additional step.

[0104] As shown in FIG. 8Q, after the tilt is removed, the superstraight chuck assembly 618 returns to a parallel orientation with respect to the superstraight chuck 104, i.e., θ t is 0. By removing the tilt and continuing to apply force F, the separation front continues to propagate toward the center of the substrate 102 for the entire periphery of the substrate 102. Position 920 in Figure 9 shows a schematic top view of the separation corresponding to the situation shown in Figure 8Q. As shown in Figure 9, the tilt θ t By removing and continuing to apply force F, the separation front of superstrate 108 from stiffening layer 146 propagates significantly toward the center of substrate 102, thus providing a separated region 921 and a small non-separated region 922. Separated region 921 at location 920 is many times larger than non-separated region 922 at location 920. The ratio of separated region 921 to non-separated region 922 can be between 50:1 and 500:1.

[0105] Continuing with the second additional step without tilt and continuing to apply force F, eventually reaches the moment shown in FIG. 8R. FIG. 8R illustrates the moment when separation of step S710 / separation method 702 is complete, immediately after top layer 108 has completely released from stiffening layer 146. As shown in FIG. 8R after separation is complete, superstrate chuck assembly 618 retains superstrate 108, and substrate 102 retains stiffening layer 146. Position 923 in FIG. 9 illustrates a schematic top view of the separation corresponding to the state shown in FIG. 8R. As shown in FIG. 9, after superstrate 108 has completely separated from stiffening layer 146, only separated region 924 remains, and no unseparated region remains.

[0106] 8A. Planarization process 700 can then be initiated again with another substrate. Planarization process 700 can be repeated many times, on the order of tens of thousands. When it is desirable to remove superstrate 108 from superstrate chuck assembly 618 (e.g., after a predetermined number of planarization processes are completed or if some other indicator suggests that the superstrate should be replaced), the vacuum applied to first cavity 148 can be released.

[0107] The separation method 702 described above, including the process of lifting and tilting the superstraight chuck assembly 618 in Figures 8J-8R and 9, is illustrated in the timing charts of Figures 10A and 10B. The horizontal axis of the timing charts of Figures 10A and 10B indicates the start of the separation process, with t0 representing the start of the separation process and t1-t5 representing different stages of the process. f is the moment when the process is completed. Each of t0 to t5 is displayed in FIGS. 8J-8R and 9 at the corresponding time. Specifically, as shown in the figures, t0 corresponds to FIG. 8J, position 902, t1 corresponds to FIG. 8K, position 904, t2 corresponds to FIG. 8L, position 907, t3 corresponds to FIG. 8M, position 908, t4 corresponds to FIG. 8O, position 914, and t5 corresponds to FIG. 8R, position 923. The process t f The termination of occurs after t5, i.e., after complete separation.

[0108] FIG. 10A shows the relative position of the superstrate chuck assembly 618 in the Z direction during the separation process (Z pos 8J-8R, where curve 1002 represents the Z pos The dashed line 1004 represents the relative position (Z pos ) from time t0 to time t1. pos ) is constant, and Z from time t1 to t2 pos decreases, and Z from time t2 to t3 pos is constant, and Z from time t3 to t4 pos increases, and from t5 to t f Z up to pos is constant. Line 1004 shows a similar Z pos 10 shows another embodiment having a curve, represented by line 1004, where Z pos decreases from t0 to t1, remains constant from t1 to t2, increases slightly from t2 to t3, and finally reaches the terminal t5 after t f It can continue to increase towards Z pos The decrease in t from t0 to t1 represents the lowering of the superstrate chuck assembly 618 to mate with the superstrate 108 before actuating the separation initiator 110 at t1. f Z towards pos The increase in indicates that the superstraight chuck assembly 618 can continue lifting after separation is complete at t5.

[0109] FIG. 10B shows the relative tilt θ around the X-axis (θX) during the separation process. t 8J-8R, where line 1006 represents the tilt θ of the superstraight chuck assembly 618 according to the exemplary embodiment of FIGS. t Dashed line 1008, dotted line 1010, and dash-dotted line 1012 represent the tilt θ of the alternative embodiment, respectively. tAs can be seen in FIG. 10B, in an embodiment where t is constrained to a line 1006, the time from t to t is represented by a slope θ t is constant, and the time from t2 to t3 is the slope θ t increases, and the time from t3 to t4 is t is constant, and the time from t4 to t5 is the slope θ t decreases, then becomes negative and returns to 0, and from t5 to the terminal t f Inclination θ t is constant. The negative drop between t4 and t5 represents the switch from the counterclockwise tilt to the clockwise tilt as described above, with zero tilt representing parallel.

[0110] Line 1008 has a similar slope θ t 10 shows another embodiment having a curved line, indicated by line 1008, with a slope θ t may increase from t3 to t4, and then from t4 to t5 follow a pattern similar to the embodiment represented by line 1006. t Instead of simply maintaining the slope θ from t3 to t4, t Increasing the slope θ from t4 to t5 may aid in separation in some circumstances. t 1006, except that the change in θ never falls below zero. Thus, in these embodiments, there is no clockwise tilt. Furthermore, line 1010 has a slope θ 1012 that is greater than that of line 1012. t This shows that the change is rapid.

[0111] 11 shows a top schematic view of another exemplary embodiment of a method for separating a superstrate from a stiffening layer. The process shown in FIG. 11 is similar to the process of FIG. 9, except that a second axis of rotation (θy) is implemented as part of the separation. That is, in the embodiment of FIG. 11, tilt θ about the X-axis (θx) is performed during the tilt process, similar to the first embodiment. tx The tilt θ is not only around the X axis, but also around the Y axis (θY). ty12A-12C show timing diagrams similar to those shown in FIGS. 10A and 10B. FIG. 12A shows the same Z position (Z pos ) is performed around the X-axis (θX). tx , and FIG. 12C shows a line 1204 representing a tilt θ performed around the Y axis (θY). ty Each figure shows a line 1206 representing t0 to t, similar to FIGS. 10A and 10B. f 11A-11C. Figure 11 includes timing notations that correspond to the times shown in the timing charts of Figures 12A-12C. As shown in Figure 11, position 1102 corresponds to t0, position 1104 corresponds to t1, position 1107 corresponds to position t2, position 1108 corresponds to t3, position 1125 corresponds to t4, and position 1123 corresponds to t5.

[0112] Figure 11 shows positions similar to the embodiment of Figure 9. Positions 1102, 1104, 1107, and 1108 are the same as the corresponding positions in Figure 9. That is, at position 1102, the separation process has not yet begun. At position 1104, the separation initiator 110 has been activated to initiate separation. At position 1107, the superstrate chuck assembly 618 is coupled to the superstrate. At position 1108, the tilt θ about the X axis is tx is implemented in the same manner as in the embodiment of Figure 9. However, after position 1108, the tilt θ tx The timing chart and the slope θ of FIG. 12C ty The separation methods are different, as best shown by the timing diagrams.

[0113] As shown in FIG. 12B, from time t2 to time t3, which corresponds to the position 1107 to the position 1108 in FIG. 11, the tilt θ ty The tilt θ txFrom time t3 to time t4, which corresponds to positions 1108, 1111, 1114, 1117, and 1125 in FIG. tx and the inclination θ ty As shown in FIGS. 12A and 12B, the tilt θ tx Once it reaches its maximum value, it starts decreasing parabolically (or with another smooth curve) with a slope of θ ty starts increasing parabolically (or with another smooth curve) from 0. The slope θ tx decreases until it reaches a negative value (e.g., switches to a clockwise tilt), and then begins to increase until it returns to a positive value (e.g., switches to a counterclockwise tilt). Finally, before reaching t4, the tilt θ tx decreases again until it reaches 0 (i.e., no slope). At the same time, the slope θ ty After a period of increase, the tilt θ begins to decrease (e.g., switching from counterclockwise to clockwise tilt or vice versa) until it finally reaches a negative value. ty begins to increase until it reaches 0 (i.e., no slope) just before time t4. Therefore, at time t4, the slope θ tx and the inclination θ ty are both 0 (i.e., no tilt). From time t4 to t5, the f The slope disappears until Z pos The lifting period from time t4 to t5 includes position 1122 in Figure 11. Thus, separation is complete at time t5, which corresponds to position 1123 in Figure 11.

[0114] Similar to FIG. 9, the locations shown in FIG. 11 illustrate the propagation of separation by following the separation method. Thus, similar to FIG. 9, each location shows how much separation there is at various moments in the process. At location 1102, only non-separated region 1103 exists. At location 1104, there is a separated portion 1105 and a non-separated region 1106. At location 1107, there is a separated region 1105 and a non-separated region 1106. At location 1108, there is a separated region 1109 and a non-separated region 1110. At location 1111, there is a separated region 1112 and a non-separated region 1113. At location 1114, there is a separated region 1115 and a non-separated region 1116. At location 1117, there is a separated region 1118 and a non-separated region 1119. At location 1125, there is a separated region 1126 and a non-separated region 1127. Location 1120 includes a separation region 1121 and a non-separation region 1122. Location 1123 includes only a separation region 1124 and no non-separation region. The area ratio of non-separation region to separation region at locations 1104, 1107, and 1108 in FIG. 11 is the same as that at locations 904, 907, and 908 in FIG. 9, respectively. The ratio of separation region 1112 to non-separation region 1113 at location 1111 can be 1:40 to 1:4. The ratio of separation region 1115 to non-separation region 1116 at location 1114 can be 1:10 to 3:4. The ratio of separation region 1118 to non-separation region 1119 at location 1117 can be 1:4 to 4:1. The ratio of separation region 1126 to non-separation region 1127 at location 1125 can be 1:3 to 5:1. The ratio of separation regions 1121 to non-separation regions 1122 at location 1121 can be between 50:1 and 500:1.

[0115] By performing the above-described separation method 702 as part of the planarization / imprint process, the plate can be removed from the stiffening layer without substantially damaging the stiffening layer.

[0116] Further modifications of the various embodiments and alternative embodiments will be apparent to those skilled in the art in light of the foregoing description. Accordingly, this description is to be construed as illustrative only. It is understood that the forms shown and described herein are to be construed as exemplary of embodiments. Elements and materials may be substituted for those shown and described herein, components and methods may be reversed, and certain features may be utilized independently, all as will become apparent to those skilled in the art after having the benefit of this description.

Claims

A molding method having a step of bringing a moldable material dispensed onto a substrate held by a substrate chuck into contact with a plate held by a plate chuck assembly, and forming a cured layer in which a film of the moldable material is cured between the plate and the substrate, wherein the plate chuck assembly includes a flexible portion having a central opening, and the molding method includes a step of starting separation between the cured layer and the plate at an initial separation point, while the plate is held by reducing the pressure in a cavity formed by the flexible portion, inclining at least one of the plate chuck assembly and the substrate chuck, thereby propagating the separation circumferentially along the periphery of the cured layer from the initial separation point, while the separation propagates along the entire circumference of the cured layer, applying a force in a direction away from the other to at least one of the plate chuck assembly and the substrate chuck while inclining at least one of the plate chuck assembly and the substrate chuck, characterized by comprising: **Claim 2** The molding method according to claim 1, further comprising a step of inclining at least one of the plate chuck assembly and the substrate chuck toward the initial separation point after applying the force. **Claim 3** The molding method according to claim 1, further comprising a step of increasing an amount of inclination of at least one of the plate chuck assembly and the substrate chuck while applying the force. **Claim 4** The molding method according to claim 1, wherein inclining at least one of the plate chuck assembly and the substrate chuck includes inclining the plate chuck assembly. **Claim 5** The molding method according to claim 1, wherein inclining at least one of the plate chuck assembly and the substrate chuck includes inclining the substrate chuck. **Claim 6** The molding method according to claim 1, wherein applying the force to at least one of the plate chuck assembly and the substrate chuck includes applying the force to the plate chuck assembly. **Claim 7** The method of molding according to claim 6, wherein the force applied to the plate chuck assembly is a force in a direction away from the substrate chuck.

8. The method of molding according to claim 6, wherein the plate chuck assembly moves in a direction away from the substrate chuck by the force applied to the plate chuck assembly.

9. The method of molding according to claim 1, further comprising a step of releasing the plate from the plate chuck assembly before the hardening.

10. The method of molding according to claim 9, further comprising a step of holding the plate with the plate chuck assembly after the hardening.

11. The method of molding according to claim 10, wherein the step of starting the separation is performed after the hardening and before holding the plate with the plate chuck assembly.

12. The method of molding according to claim 10, wherein the step of starting the separation is performed after the hardening and after holding the plate with the plate chuck assembly.

13. The method of molding according to claim 11, wherein the inclination of at least one of the plate chuck assembly and the substrate chuck includes an inclination of 0.01 to 10 milliradians with respect to the horizontal plane.

14. The method of molding according to claim 1, wherein the step of starting the separation includes bringing a push pin into contact with the plate.

15. The method of molding according to claim 14, wherein the push pin passes through the substrate chuck.

16. The method of molding according to claim 1, further comprising a step of additionally inclining at least one of the plate chuck assembly and the substrate chuck in a direction perpendicular to the direction of the separating inclination.

17. The method of molding according to claim 16, further comprising a step of decreasing the amount of the separating inclination while increasing the amount of the additional inclination in the step of additionally inclining.

18. The method of molding according to claim 1, wherein the plate is a super straight having a flat surface or a template having a patterned surface.

19. A molding system, A plate chuck assembly for holding a plate, including a flexible portion having a central opening, a substrate chuck for holding a substrate, a fluid dispenser for dispensing a formable material onto the substrate, a curing system for curing the formable material under the plate to form a cured layer on the substrate, a separation initiator configured to initiate separation between the cured layer and the plate at an initial separation point, a positioning system, and the positioning system tilts at least one of the plate chuck assembly and the substrate chuck while the plate is held by reducing the pressure in a cavity formed by the flexible portion, thereby propagating separation circumferentially along the periphery of the cured layer from the initial separation point, while separation propagates along the entire circumference of the cured layer, a force is applied in a direction away from the other to at least one of the plate chuck assembly and the substrate chuck while tilting at least one of the plate chuck assembly and the substrate chuck, characterized in that it is a molding system.

20. An article manufacturing method having a step of bringing a formable material dispensed onto a substrate held by a substrate chuck into contact with a plate held by a plate chuck assembly, and forming a cured layer in which a film of the formable material is cured between the plate and the substrate, the plate chuck assembly includes a flexible portion having a central opening, the article manufacturing method includes a step of initiating separation between the cured layer and the plate at an initial separation point, while the plate is held by reducing the pressure in a cavity formed by the flexible portion, tilts at least one of the plate chuck assembly and the substrate chuck, thereby propagating circumferentially along the periphery of the cured layer from the initial separation point, while separation propagates along the entire circumference of the cured layer, while tilting at least one of the plate chuck assembly and the substrate chuck, a force is applied in a direction away from the other to at least one of the plate chuck assembly and the substrate chuck, processing the cured layer to manufacture an article, characterized in that it is an article manufacturing method.

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