Power module for producing structure-borne sound, device for detecting avt delamination having such power module, and method for detecting avt delamination

Abstract

To overcome such disadvantages that additional components are used and temperature measurements via temperature-sensitive parameters are potentially susceptible to interference.SOLUTION: Provided is a power module (100) for producing structure-borne sound. In the power module (100), a control unit (101) is situated on a first substrate (102), the first substrate (102) is situated on at least one first power semiconductor (103) and on at least one second power semiconductor (104), a first metal connection (105) electrically connects the first substrate (102) and the second substrate (107), and a second metal connection (108) is situated below the second substrate (107). The second substrate (107) has a piezoelectric material and the control unit (101) is set up to excite the piezoelectric material of the second substrate (107). Thus, a structure-borne sound signal is produced.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a power module for generating solid-borne sound, an AVT peeling detection device provided with such a power module, and an AVT peeling detection method.

Background Art

[0002] Power modules are affected by aging in packaging technology (AVT). It is known to determine the joint temperature in order to determine the aging process. In this case, the temperature-sensitive parameters captured via the evaluation circuit are evaluated.

[0003] In this regard, additional components are used, and there is a drawback that the temperature measurement via the temperature-sensitive parameters is potentially vulnerable to interference.

Summary of the Invention

Problems to be Solved by the Invention

[0004] The problem of the present invention is to overcome this drawback.

Means for Solving the Problems

[0005] A power module for generating solid-borne sound has a control unit and a first substrate, and the control unit is arranged on the first substrate. The power module further has at least one first power semiconductor and at least one second power semiconductor, and the first substrate is arranged on at least one first power semiconductor and at least one second power semiconductor. The power module has a first metal connection part, a second substrate, and a second metal connection part. The first metal connection part electrically connects the first substrate and the second substrate, and the second metal connection part is arranged under the second substrate. According to the present invention, the second substrate has a piezoelectric material, and the control unit is adapted to excite the piezoelectric material of the second substrate, whereby a solid-borne sound signal is generated.

[0006] The advantage of this is that the solid-borne sound is generated within the power module. In other words, the generation of solid-borne sound is integrated into the module. In one variant, the second substrate contains AMB ceramic.

[0007] In this regard, the lower cost is an advantage. In a further form, the control unit includes an ASIC. The advantage of this is that the control unit is designed for a specific application.

[0008] In one variant, the first substrate includes LTCC. In this regard, the advantage of LTCC is that it allows for high integration density and intelligent power modules can be easily manufactured.

[0009] The AVT delamination detection device includes a power module and a MEMS sensor according to the present invention. According to the present invention, the MEMS sensor is positioned laterally away from the control unit on a first substrate of the power module, the MEMS sensor is adapted to capture the generated solid-borne sound signal, and the control unit is adapted to compare the captured solid-borne sound signal with a reference value, and AVT delamination is recognized when the captured solid-borne sound signal exceeds the reference value.

[0010] The advantage of this is that detection is performed within the module, that is, without external components. The AVT delamination detection method according to the present invention, using the AVT delamination detection device according to the present invention, includes the generation of a solid-borne sound signal by a signal transmitted by a control unit and the capture of the solid-borne sound signal by a MEMS sensor. The method further includes the control unit comparing the solid-borne sound signal with a reference value and recognizing AVT delamination when the captured solid-borne sound signal exceeds the reference value.

[0011] In one modified form, the signal has the resonant frequency of the second substrate. The advantage of this method is that it is less susceptible to interference. Further advantages will become apparent from the following description of exemplary embodiments or dependent claims.

[0012] The present invention will be described below based on preferred embodiments and accompanying drawings. [Brief explanation of the drawing]

[0013] [Figure 1] This figure shows a power module for generating solid-borne sound. [Figure 2] This is a diagram showing an AVT peeling detection device. [Figure 3] This figure shows the AVT peeling detection method. [Modes for carrying out the invention]

[0014] Figure 1 shows a power module 100 for generating solid-borne sound. The power module 100 includes a control unit 101, a first substrate 102, at least one first power semiconductor 103, at least one second power semiconductor 104, a first metal connector 105, a second substrate 107, and a second metal connector 108. The second substrate 107 includes a piezoelectric material, such as AlN. Alternatively, the second substrate 107 includes an AMB ceramic. The second substrate 107 is placed on the second metal connector 108, which functions as a second electrode. The first metal connector 105 is placed on the second substrate 107, which functions as a first electrode. The first power semiconductor 103 and the second power semiconductor 104 are placed on the second substrate 107. A first substrate 102, which functions as a carrier substrate, is arranged on the first power semiconductor 103 and the second power semiconductor 104. A control unit 101 is arranged on the first substrate 102. The control unit 101 includes, for example, an ASIC and is adapted to excite the piezoelectric material of the second substrate 107, thereby generating a solid-borne sound signal. In other words, in the case of an AlN thickness of 0.2 mm, by applying a signal with sufficient amplitude, particularly a sine wave signal or a square wave signal, at, for example, up to 100 V, the second substrate 107 functions as a thickness oscillator and generates a solid-borne sound signal. This solid-borne sound signal may represent propagation time information, amplitude information, frequency information, or phase information. The first substrate is, for example, LTCC. A second metal connector 108 is arranged on a cooling structure 110, and the second metal connector 108 and the cooling structure 110 are connected by a solder layer 109. The cooling structure 110 may be formed as a cooling plate or as a cooling body having a comb-shaped structure. A cooling liquid 111 is located beneath the cooling structure 110.

[0015] The power module 100 is applied, for example, when cleaning the comb-shaped structure of the cooling structure 110. Alternatively, the power module 100 is used to detect AVT delamination.

[0016] This power module is used within a drive inverter or as an individual component. Figure 2 shows the AVT delamination detection device 200. This device 200 includes the power module from Figure 1. In Figure 2, the symbols of elements with the same function as in Figure 1 are such that the last two digits are the same as in Figure 1. In addition, the device 200 has a MEMS sensor 212 positioned laterally spaced relative to the control unit 201 on the first substrate 202. The MEMS sensor 212 and the control unit 201 are electrically connected, for example, by bonding connections. The MEMS sensor 212 is adapted to capture solid-borne sound signals. The control unit 201 is adapted, on the one hand, to excite the piezoelectric material on the second substrate 207, thereby generating a solid-borne sound signal, and on the other hand, to evaluate the solid-borne sound signal captured by the MEMS sensor. In this regard, the control unit 201 is adapted to compare the captured solid-borne sound signal, which includes propagation time information, frequency information, amplitude information, or phase information, with a reference value. AVT delamination is recognized when the captured solid-borne sound signal exceeds the reference value.

[0017] Figure 3 shows the AVT delamination detection method 300 using the apparatus according to the present invention from Figure 2. This method 300 starts with the generation of a solid-state sound signal from a second substrate, in particular a sinusoidal or square wave signal, which is transmitted by a control unit. In the next step 320, the solid-state sound signal is captured by a MEMS sensor. In the next step 330, the captured solid-state sound signal is compared by the control unit to a reference value. The reference value can be constructed, for example, by end-of-line measurement, finite element simulation, or laboratory measurement. If the captured solid-state sound signal exceeds the reference value, AVT delamination is recognized in the next step 340. If the captured solid-state sound signal is less than the reference value, the method 300 is terminated or restarted from step 310.

[0018] In one exemplary embodiment, the signal has the resonant frequency of the second substrate. [Explanation of Symbols]

[0019] 100 Power module 101 Control unit 102 First substrate 103 First power semiconductor 104 Second power semiconductor 105 First metal connection part 107 Second substrate 108 Second metal connection part 109 Solder layer 110 Cooling structure 111 Coolant 200 AVT peeling detection device 201 Control unit 202 First substrate 207 Second substrate 212 MEMS sensor 300 AVT peeling detection method 310 Step 320 Next step 330 Next step 340 Next step

Claims

1. A power module (100) for generating structure-borne sound, comprising: a control unit (101) and a first substrate (102), wherein the control unit (101) is arranged on the first substrate (102); At least one first power semiconductor (103) and at least one second power semiconductor (104), wherein a first substrate (102) is arranged on the at least one first power semiconductor (103) and at least one second power semiconductor (104); a first metal connection (105), a second substrate (107), and a second metal connection (108), wherein the first metal connection (105) electrically connects the first substrate (102) and the second substrate (107), and the second metal connection (108) is disposed below the second substrate (107); In a power module (100) comprising: The power module (100) is characterized in that the second substrate (107) has a piezoelectric material, and the control unit (101) is adapted to excite the piezoelectric material of the second substrate (107), thereby generating a structure-borne sound signal.

2. The power module (100) of claim 1, wherein the second substrate (107) comprises an AMB ceramic.

3. The power module (100) of claim 1, wherein the control unit (101) comprises an ASIC.

4. The power module (100) of claim 1, wherein the first substrate comprises LTCC.

5. 5. An AVT exfoliation detection device (200) comprising a power module (100) and a MEMS sensor (212) according to any one of claims 1 to 4, wherein the MEMS sensor (212) is arranged on the first substrate (102) laterally spaced apart from the control unit (101), the MEMS sensor (212) is adapted to capture the generated structure-borne sound signal, the control unit (101) is adapted to compare the captured structure-borne sound signal with a reference value, and an AVT exfoliation is recognized when the captured structure-borne sound signal exceeds the reference value.

6. 6. A method (300) for detecting AVT detachment using the apparatus (200) of claim 5, comprising: - generating a structure-borne sound signal of the second substrate by a sinusoidal signal transmitted by the control unit (310); - Capturing the structure-borne sound signal by the MEMS sensor (320); - comparing (330) the structure-borne sound signal with a reference value by the control unit; - recognizing (340) the AVT detachment when the captured structure-borne sound signal exceeds the reference value.

7. 7. The method (300) of claim 6, wherein the sinusoidal signal has a resonant frequency of the second substrate.

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