Foreign substance inspection method, foreign substance inspection device, and method for manufacturing article

Abstract

To improve throughput in foreign substance inspection.SOLUTION: A foreign substance inspection method is for performing foreign substance inspection of arranging an object on a stage, and detecting the presence or absence of a foreign substance on an inspection area of the object, while driving at least one of the stage and a light projection unit projecting inspection light on the object, and the method includes: a first inspection process of inspecting the foreign substance in the inspection area; a cleaning process of cleaning the inspection area; and a second inspection process of inspecting the foreign substance in the inspection area cleaned in the cleaning process. In the second inspection process, in a first area of the inspection area where the foreign substance is detected in the first inspection process, the relative velocity between the stage and the light projection unit is set to a first velocity, and in a second area of the inspection area where the foreign substance is not detected in the first inspection process, the relative velocity is set to a second velocity faster than the first velocity.SELECTED DRAWING: Figure 7

Description

Technical Field

[0001] The present invention relates to a foreign matter inspection method, a foreign matter inspection apparatus, and a method for manufacturing an article.

Background Art

[0002] Semiconductor devices and liquid crystal devices are manufactured using a lithography process in which a pattern of a master is transferred to a photosensitive material coated on a substrate. In an exposure apparatus used in this lithography process, if foreign matter such as dust or dirt adheres to the master, an image of the foreign matter is transferred to the photosensitive material together with the pattern of the master, which may induce defects in the device. Therefore, a foreign matter inspection apparatus for inspecting foreign matter adhering to the master can be used.

[0003] A foreign matter inspection apparatus can detect foreign matter by projecting light onto an inspection area on a master and receiving scattered light from the foreign matter. Also, a method has been proposed in which the master is placed on a stage and foreign matter inspection is performed while scanning the stage, so that foreign matter inspection is performed over the entire inspection area. When performing foreign matter inspection while scanning the stage in this way, it is necessary to scan the stage while suppressing the speed to such an extent that foreign matter can be detected, so a lot of time is required to inspect the entire inspection area.

[0004] Patent Document 1 discloses that in order not to reduce the throughput of device manufacturing, the inspection area of foreign matter inspection performed once is divided, and foreign matter inspection is performed a plurality of times in accordance with the substrate replacement time (the time during which the lithography process is not performed).

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] Foreign object inspection is generally performed repeatedly until no foreign objects are detected in the inspection area. For example, in Patent Document 1, if a foreign object is detected in a certain inspection area, a cleaning process is performed and then the foreign object inspection is performed again across the entire inspection area. Therefore, subsequent foreign object inspections require the same inspection time as the first one.

[0007] Therefore, the present invention aims to provide a foreign object inspection device that is advantageous for improving throughput in foreign object inspection. [Means for solving the problem]

[0008] To achieve the above objective, a foreign object inspection method as one aspect of the present invention is a foreign object inspection method that involves placing an object on a stage and driving at least one of the stage and a light-emitting unit that emits inspection light onto the object to detect the presence or absence of foreign objects on an inspection area of ​​the object, comprising: a first inspection step of inspecting the foreign objects in the inspection area; a cleaning step of cleaning the inspection area; and a second inspection step of inspecting the foreign objects in the inspection area that has been cleaned in the cleaning step, wherein in the second inspection step, the relative speed between the stage and the light-emitting unit is set to a first speed in the first area of ​​the inspection area where the foreign objects were detected in the first inspection step, and the relative speed is set to a second speed that is faster than the first speed in the second area of ​​the inspection area where the foreign objects were not detected in the first inspection step. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a foreign object inspection method that is advantageous for improving throughput in foreign object inspection. [Brief explanation of the drawing]

[0010] [Figure 1] This is a schematic diagram showing the configuration of the exposure apparatus. [Figure 2] This is a diagram showing the configuration of a foreign object inspection device. [Figure 3]This is a diagram showing an example of an inspection map. [Figure 4] This flowchart shows the steps involved in the first foreign object inspection. [Figure 5] This graph shows the drive speed of the stage during the first foreign object inspection process. [Figure 6] This flowchart shows the steps involved in the second and subsequent foreign object inspections. [Figure 7] This graph shows the drive speed of the stage during the second and subsequent foreign object inspection processes. [Figure 8] This figure shows the foreign object inspection process in the third embodiment. [Modes for carrying out the invention]

[0011] Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. In each drawing, the same reference numeral is used for identical components, and redundant descriptions are omitted.

[0012] <First Embodiment> Figure 1 is a schematic diagram showing the configuration of the exposure apparatus EXP in this embodiment. In this embodiment, the coordinate system is defined as the XY plane on which the substrate P is placed, and the Z direction being perpendicular to the XY plane. Furthermore, within the XY plane, the scanning direction for scanning the substrate P is defined as the Y direction, and the non-scanning direction perpendicular to the scanning direction is defined as the X direction.

[0013] The exposure apparatus EXP in this embodiment is a lithography apparatus used in the photolithography process, which is a manufacturing process for devices such as semiconductor devices and flat panel displays (FPDs). The exposure apparatus EXP exposes a substrate P through a master plate M on which a pattern has been formed, and performs an exposure process to transfer the pattern of the master plate M to the substrate P. The exposure apparatus EXP may employ a so-called step-and-scan method, in which scanning exposure is performed while the master plate M and the substrate P are scanned in synchronous manner. However, it is not limited to this method, and the exposure process may also be performed using other exposure methods such as a step-and-repeat method.

[0014] The exposure apparatus EXP includes an illumination optical system IL, a reticle stage MS that holds a reticle M, a projection optical system PO, a substrate stage PS that holds a substrate P, a foreign object inspection device 100, and a foreign object removal device 101. The exposure light irradiated from a light source (e.g., a high-pressure mercury lamp or an LED) not shown in the figure is condensed onto the reticle M by the illumination optical system IL.

[0015] The projection optical system PO is an optical system for projecting a pattern formed on the reticle M onto the substrate P coated with a photosensitive material to transfer the pattern. In the present embodiment, a projection optical system using an Offner-type optical system is assumed. In the case of an Offner-type optical system, the reticle M is irradiated with an arc-shaped illumination area in order to secure a good image area. Also, the irradiation shape of the exposure light reaching the substrate P is also an arc shape.

[0016] The foreign object inspection device 100 is an inspection device that detects the presence or absence of foreign objects on an inspection area (e.g., an area where a pattern for transferring to the substrate P is formed) on the reticle M. The foreign object removal device 101 is a cleaning device that cleans the inspection area for the purpose of removing foreign objects if there are foreign objects on the inspection area of the reticle M. The foreign object inspection device 100 and the foreign object removal device 101 each have a stage for holding the reticle M, and the reticle M can be transported to each stage using, for example, a transport hand not shown in the figure.

[0017] FIG. 2 is a diagram showing the configuration of the foreign object inspection device 100. The foreign object inspection device 100 includes a light projecting unit 200, a light receiving unit 201, a photoelectric conversion unit 202, a display unit 203, a control unit 204, a storage unit 205, an input unit 206, and a stage 207. As shown in FIG. 2, the foreign object inspection device 100 performs foreign object inspection while scanning the inspection area of an object (the reticle M in the present embodiment) mounted on the stage 207 in the Y direction.

[0018] The light projecting unit 200 projects inspection light obliquely onto the inspection area of the object. The light receiving unit 201 receives scattered light from foreign matter generated when the inspection light is projected. The photoelectric conversion unit 202 converts the light received by the light receiving unit 201 into a signal. The signal generated by the photoelectric conversion unit 202 is input to the control unit 204, and the presence or absence of foreign matter is determined.

[0019] In addition, the light projecting unit 200 is configured to extend in the X direction. Since the inspection light from the light projecting unit 200 irradiates the area in the X direction of the inspection area in a lump, there is no need to scan the stage 207 in the X direction. Also, the light receiving unit 201 is configured to extend in the X direction. The light receiving unit 201 can be a line sensor that detects the amount of light on a straight line in the X direction. By driving the stage 207 in the Y direction, foreign matter inspection can be performed over the entire inspection area.

[0020] The control unit 204 can set the target speed for driving the stage 207 and serves as a drive control unit that controls the driving of the stage 207. Also, the control unit 204 aggregates the input signals, determines the exact position and size of the foreign matter, and generates an inspection map. The inspection map generated by the control unit 204 can be stored in the storage unit 205. Also, in the control unit 204, the inspection area can be determined by setting the area in which foreign matter inspection is desired in the input unit 206. By setting not to include the area where the presence or absence of foreign matter does not affect the manufactured device in the inspection area, unnecessary foreign matter inspection can be omitted. That is, appropriate setting of the inspection area contributes to an improvement in throughput in foreign matter inspection.

[0021] The display unit 203 can display information (the inspection map in this embodiment) indicating the position where the foreign matter stored in the storage unit 205 adhered.

[0022] Figure 3 shows an example of an inspection map generated by the control unit 204. The inspection map divides the inspection area into small sections and displays the detected foreign objects in each section. If the control unit 204 determines that a foreign object is present, it is displayed as "P" as shown in Figure 3. The size of the divided sections is, for example, about 1 to 5 mm grid, but can be set as appropriate. The size of the foreign object (e.g., particle size) may also be displayed.

[0023] Next, the operation flow of the foreign object inspection device 100 and the foreign object removal device 101 will be explained with reference to Figure 4. Figure 4 is a flowchart showing a series of steps in the first foreign object inspection, where the inspection map is not stored in the memory unit 205. Each step in the flowchart shown in Figure 4 is executed by control of the control unit 204.

[0024] In step S100, the original plate M to be inspected for foreign objects is transported onto the stage of the foreign object inspection device 100.

[0025] In step S101, a foreign object inspection is performed in the inspection area. At this time, the control unit 204 sets the target speed of the stage 207 as the first speed and controls the drive of the stage 207 so that the drive of the stage 207 is at the first speed. Here, the first speed is, for example, the highest speed at which the foreign object inspection can be accurately performed. The first speed can be determined by the conditions of the foreign object inspection, for example, by the particle size of the foreign object to be determined as a foreign object, the parameters of the inspection light, etc. The first speed can be, for example, a speed of about 5 mm / second to 20 mm / second.

[0026] Figure 5 is a graph showing the drive speed of the stage 207 set by the control unit 204. The horizontal axis of the graph represents the coordinates in the Y direction of the inspection area (Y=1 to 23), and the vertical axis represents the drive speed of the stage 207 set by the control unit 204. As shown in Figure 5, the stage 207 is set to a drive speed of the first speed. However, immediately after the start of driving and immediately after the end of driving, the stage 207 is driven at a speed in the range of 0 or greater and less than or equal to the first speed.

[0027] In step S102, the control unit 204 generates an inspection map as shown in Figure 3 and stores it in the storage unit 205. Steps S101 and S102 together are also referred to as the foreign object inspection process.

[0028] In step S103, the control unit 204 determines whether or not there are foreign objects in the inspection area. A threshold is set in advance for determining foreign objects, and objects with a particle size larger than the threshold are determined to be foreign objects. If foreign objects are determined to be present in the inspection area, the process proceeds to step S104. If no foreign objects are determined to be present in the inspection area, the foreign object inspection is completed, and the original plate M is transported to the original plate stage MS of the exposure apparatus EXP.

[0029] In step S104, the original plate M is transported to the foreign matter removal device 101. In step S105, the foreign matter removal device 101 performs cleaning aimed at removing foreign matter from the original plate M (cleaning process). The foreign matter removal (cleaning) by the foreign matter removal device 101 removes foreign matter from the original plate M by, for example, blowing gas onto the original plate M. In step S105, the foreign matter removal device 101 drives the stage on which the original plate M is placed while blowing gas onto the original plate M, so that foreign matter is removed from the entire inspection area. The method of foreign matter removal is not limited to this and may be implemented by other methods, or gas may be blown only on the areas where foreign matter is attached according to the inspection map generated by the control unit 204 of the foreign matter inspection device 100.

[0030] Even after the cleaning process in step S105 described above is performed, some foreign matter may remain. If a master plate M in such a state is used in the exposure apparatus EXP, there is a risk that defects may occur in the manufactured devices, potentially leading to a decrease in yield. Therefore, it is desirable that a second foreign matter inspection be performed by the foreign matter inspection apparatus 100 after the foreign matter removal in step S105 to confirm whether the foreign matter has been removed from the master plate M.

[0031] However, if each step in the flowchart shown in Figure 4 is executed again, the second foreign object inspection step (second inspection step) takes about the same amount of time as the first foreign object inspection step (first inspection step), which can lead to a decrease in throughput in foreign object inspection. Therefore, in this embodiment, a foreign object inspection method is described that can improve throughput in foreign object inspection by shortening the time required for the second foreign object inspection step compared to the time required for the first foreign object inspection step.

[0032] In this embodiment, in order to shorten the time required for the second foreign object inspection process, the target speed of stage 207 is set to the first speed for the area where foreign objects were detected in the first foreign object inspection process (hereinafter referred to as the first area). On the other hand, for the area where foreign objects were not detected in the first foreign object inspection process (hereinafter referred to as the second area), the target speed of stage 207 is set to the second speed, which is faster than the first speed. This makes it possible to shorten the time required for the second foreign object inspection. The second speed is, for example, more than twice as fast as the first speed and can be a speed of about 25 mm / second to 100 mm / second. Alternatively, foreign object inspection may be performed only in the first area where foreign objects were detected in the first foreign object inspection process, and foreign object inspection may not be performed in the second area where foreign objects were not detected in the first foreign object inspection process. In such a case, the second speed may be, for example, more than five times faster than the first speed.

[0033] Next, a series of steps in the second and subsequent foreign object inspections in this embodiment will be described with reference to Figure 6. Figure 6 is a flowchart showing a series of steps in the second and subsequent foreign object inspections.

[0034] In step S200, the original plate M to be inspected for foreign objects is transported onto the stage of the foreign object inspection device 100.

[0035] In step S201, the control unit 204 reads out the information (inspection map) regarding the location of foreign objects stored in the memory unit 205 during the first foreign object inspection. For example, in the inspection map shown in Figure 3, the first region is the area with coordinates Y=6 to 8 and Y=22 to 23, and the second region is the area with coordinates Y=1 to 5 and Y=9 to 21.

[0036] In step S202, the control unit 204 sets the speed at which the stage 207 is driven in the first and second regions. At this time, the target speed of the stage 207 is set to the first speed in the first region, and the target speed of the stage 207 is set to the second speed in the second region.

[0037] Figure 7 is a graph showing the drive speed of stage 207 in the case of the inspection map shown in Figure 3. The horizontal axis of the graph represents the coordinates in the Y direction of the inspection area, and the vertical axis represents the drive speed of stage 207 set by the control unit 204. As shown in Figure 7, the drive speed is set to the first speed in the first area. As mentioned above, the first speed is the highest speed at which foreign object inspection can be performed accurately, and foreign object inspection can be performed accurately at speeds below the first speed. The drive speed is set to the second speed in the second area.

[0038] As shown in Figure 7, the drive speed is set to the first speed at coordinates Y=6 to 8. At this time, the speed may be slower than the first speed at coordinates Y=6 to 8, but it is preferable to set it to the first speed because the throughput will decrease. Furthermore, the drive speed is set to be less than or equal to the first speed at coordinates Y=22 to 23. The reason for setting the speed to be slower than the first speed at coordinates Y=22 to 23 is that it is preferable for the drive speed to be 0 when scanning of the inspection area is completed (Y=23).

[0039] Furthermore, the drive speed is set to gradually decrease before Y=6 so that it reaches the first speed at Y=6. The reason for this setting is that if the speed is faster than the first speed at Y=6, it may not be possible to perform accurate foreign object inspection. Similarly, the setting to gradually decrease the speed before Y=22 is for the same reason. Immediately after Y=8, the drive speed is set to increase from the first speed to the second speed. The drive speed profile of stage 207 shown in Figure 7 is just an example; it should be set so that the speed is below the first speed in the first region and reaches the second speed in the second region.

[0040] Let's return to the explanation of the flowchart in Figure 6. In step S203, the foreign object inspection is performed according to the drive speed of the stage 207 set in step S202. Steps S204 to S207 are the same as steps S102 to S105 in Figure 4, so their explanation is omitted. If a foreign object is detected in the second foreign object inspection, the foreign object inspection is performed again, and each step in Figure 6 is carried out until no foreign objects are detected.

[0041] Furthermore, in subsequent foreign object inspections, the system may further include a display step in which information related to the foreign object inspection is displayed on the display unit 203. This display step can display information indicating the location within the inspection area where a foreign object was detected in the first inspection step. The system may also further include an input step for inputting information related to the foreign object inspection. The inspection area may be determined by setting the area in which the foreign object inspection is to be performed on the input unit 206.

[0042] Here, we compare the graph in Figure 5 with the graph in Figure 7. In Figure 7 (the second foreign object inspection process), the foreign object inspection is performed at the second speed in the second region, so the throughput for foreign object inspection can be improved compared to Figure 5 (the first foreign object inspection process). For example, in the inspection map example shown in Figure 3, the time required for the first foreign object inspection, which was about 100 to 200 seconds, can be reduced to about 20 to 40 seconds for the second foreign object inspection. In addition, since the foreign object inspection and removal are repeated until the foreign object is completely removed, a decrease in the yield of the manufactured devices can be suppressed. Therefore, the foreign object inspection method of this embodiment can improve throughput while suppressing a decrease in yield.

[0043] (modified version) In the foreign object inspection method for the second and subsequent inspections in this embodiment, it is assumed that no foreign objects will adhere to areas where no foreign objects were detected in the previous inspection. Given this assumption, some users may prefer the foreign object inspection method described above in order to improve throughput. This mode will be referred to as the first mode below.

[0044] On the other hand, in subsequent foreign object inspections, there is a possibility that foreign objects may adhere to areas where they were not detected in the previous inspection. In such cases, some users may prefer not to perform the foreign object inspection described above. This mode will be referred to as the second mode below.

[0045] In this modified example, a foreign object inspection device 100 can be provided in which the user can select between a first mode and a second mode. The user can select which of the first and second modes to apply at the input unit 206, and this setting can be stored in the storage unit 205. The display unit 203 may also display whether the currently applied mode is the first mode or the second mode.

[0046] <Second Embodiment> In the first embodiment, an example was described in which the inspection was performed across the entire inspection area during the first foreign object inspection. In this embodiment, an example is described in which the foreign object inspection is interrupted when a foreign object is detected and the process moves to the cleaning process.

[0047] Assuming that foreign matter is present in the inspection area according to the inspection map shown in Figure 3, if foreign matter is detected at coordinate Y=6, the foreign matter inspection process is interrupted at that point, and the inspection for foreign matter from Y=7 onwards is not performed, and the process moves to the cleaning process. In the cleaning process, the area is cleaned so that the foreign matter at coordinate Y=6 is removed.

[0048] Subsequently, another foreign object inspection is performed. At this time, in the region of coordinates Y=1 to 5 (second region) where no foreign objects were detected in the previous foreign object inspection, the control unit 204 controls the drive speed of the stage 207 to the second speed. Also, in Y=6 (first region) and in the region where the previous foreign object inspection was not performed, the control unit 204 controls the drive speed of the stage 207 to the first speed.

[0049] The above describes an example where the foreign object inspection is terminated midway if a foreign object is detected during the first inspection, but this is not the only example. In other words, if a foreign object is detected during at least one of the first foreign object inspection (first inspection step) or the second or subsequent foreign object inspections (second inspection step), the foreign object inspection may be terminated without inspecting the areas of the inspection area that have not yet been inspected for foreign objects.

[0050] In this embodiment, the above process is repeatedly performed until no foreign matter is detected across the entire inspection area. By terminating the foreign matter inspection as soon as the presence of foreign matter is detected during the inspection, throughput can be further improved compared to the first embodiment. Furthermore, since the foreign matter inspection and removal are repeated until the foreign matter is completely removed, a decrease in the yield of manufactured devices can be suppressed. Therefore, the foreign matter inspection method of this embodiment can improve throughput while suppressing a decrease in yield.

[0051] <Third Embodiment> In the first and second embodiments, a foreign object inspection device 100 that performs foreign object inspection while scanning the inspection area of ​​an object in the Y direction was described. In this embodiment, an inspection method is described in which an object is placed on a stage 207 and the stage 207 is driven in steps to perform foreign object inspection. In this embodiment, in the second inspection step, foreign object inspection of areas where no foreign objects were detected in the first inspection step is omitted. Content not described in this embodiment follows the first embodiment.

[0052] The inspection process in this embodiment will be explained using Figure 8. Figure 8 is a schematic diagram showing the first inspection process for foreign object inspection in this embodiment. In this embodiment, the stage 207 is driven to the inspection position, and the foreign object inspection is performed when the stage 207 is stationary, that is, when the speed of the stage 207 is zero.

[0053] As shown in Figures 8(a) to 8(f), the object on the stage 207 is divided into multiple regions for inspection. In the example in Figures 8(a) to 8(f), the object is divided into six regions, and foreign matter inspection is performed in six step drives. Also, in Figures 8(a) to 8(f), the location where foreign matter is attached on the original plate M (object) is indicated by P, and it is assumed that foreign matter is attached to regions 3 and 5 in the first inspection step. In the first inspection step, the stage is driven in the order of region 1, region 2, region 3, region 4, region 5, and region 6 relative to the light projection unit 200 to inspect for foreign matter. After the first inspection step is completed, a cleaning step is performed. After the cleaning step is performed, the process moves to the second inspection step. In the second inspection step, the stage is driven in step only in the regions where foreign matter was detected in the foreign matter inspection results of the first inspection step, and foreign matter inspection is performed. In other words, foreign matter inspection is omitted in regions where no foreign matter was detected. In this embodiment, foreign object inspection only requires two step drives in regions 3 and 5 where foreign objects were detected in the first inspection step. Therefore, although six step drives are normally required, foreign object inspection can be performed with only two step drives, thus shortening the foreign object inspection time. If foreign objects are found in the second or subsequent inspections, they can be similarly inspected in the third and subsequent inspections.

[0054] Furthermore, since the foreign matter inspection and removal process is repeated until the foreign matter is completely removed, a decrease in the yield of manufactured devices can be suppressed. Therefore, the foreign matter inspection method of this embodiment can improve throughput while suppressing a decrease in yield.

[0055] Although this invention has been described as a method of driving the stage 207, the inspection may also be performed by driving (scanning) the light-emitting unit 200 instead of the stage 207. Alternatively, both the stage 207 and the light-emitting unit 200 may be driven. In other words, the foreign object inspection can be performed while driving at least one of the stage 207 and the light-emitting unit 200. In the above description, the speed of the stage 207 was described as being driven to a first speed or a second speed, but it is sufficient that the relative speed between the stage 207 and the light-emitting unit 200 be controlled to be the first speed or a second speed. The light-receiving unit 201 can be driven together with the light-emitting unit 200 so as not to change its relative position relative to the light-emitting unit 200.

[0056] <Embodiment for manufacturing an article> The method for manufacturing articles according to embodiments of the present invention is suitable for manufacturing articles such as flat panel displays (FPDs), semiconductor devices, sensors, and optical elements. The method for manufacturing articles according to this embodiment includes a foreign matter inspection step in the inspection area of ​​the original plate using the foreign matter inspection method described above (original plate inspection step), and a transport step in which the original plate after the original plate inspection step is transported to an exposure apparatus. Furthermore, the method for manufacturing articles according to this embodiment includes a step of forming a latent image pattern on a photosensitive material coated on a substrate by exposure using the above exposure apparatus to obtain an exposed substrate (exposure step), and a step of developing the exposed substrate on which the latent image pattern was formed in the above step to obtain a developed substrate (development step). Moreover, this manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The method for manufacturing articles according to this embodiment is advantageous compared to conventional methods in at least one of the performance, quality, productivity, and production cost of the articles.

[0057] Although preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of its essence. [Explanation of Symbols]

[0058] 100 Foreign object inspection device 101 Foreign matter removal device 204 Control Unit (Drive Control Unit) 205 Storage section 207 Stages

Claims

1. 1. A foreign body inspection method for inspecting an object for foreign bodies on an inspection area thereof while driving at least one of the stage and a light projecting unit that projects inspection light onto the object, the method comprising: a first inspection step of inspecting the inspection area for the foreign matter; a cleaning step of cleaning the inspection area; a second inspection step of inspecting the inspection area cleaned in the cleaning step for foreign matter, a second inspection step of detecting a foreign body from the stage and the light projecting unit, the second inspection step being performed by setting the relative speed between the stage and the light projecting unit to a first speed in a first area of ​​the inspection area in which the foreign body was detected in the first inspection step, and setting the relative speed to a second speed faster than the first speed in a second area of ​​the inspection area in which the foreign body was not detected in the first inspection step.

2. 2. The method according to claim 1, wherein in the second inspection step, foreign matter inspection is carried out only in the first region.

3. 2. The foreign body inspection method according to claim 1, wherein in the first inspection step, the relative speed is equal to or lower than the first speed.

4. 2. The foreign body inspection method according to claim 1, wherein the first inspection step and the second inspection step inspect for the presence or absence of the foreign body based on an amount of scattered light that is produced when the inspection light is projected onto the object and scattered by the foreign body.

5. 2. The foreign matter inspection method according to claim 1, wherein, if the foreign matter is detected in at least one of the first inspection process and the second inspection process, the inspection is terminated without inspecting an area of ​​the inspection area that has not been inspected for foreign matters.

6. The method further comprises a display step of displaying information regarding the foreign body inspection on a display unit, 2. The foreign matter inspection method according to claim 1, wherein the display step displays information indicating a position in the inspection area where the foreign matter is detected in the first inspection step.

7. Further comprising an input step of inputting information regarding foreign body inspection, 2. The foreign substance inspection method according to claim 1, wherein the inspection area is determined by setting an area for performing foreign substance inspection via an input unit.

8. 2. The method of claim 1, wherein the second speed is at least twice as fast as the first speed.

9. A foreign body inspection method for detecting the presence or absence of a foreign body on an inspection area of ​​an object by driving at least one of the stage and a light projecting unit that projects inspection light onto the object, the method comprising: a first inspection step of inspecting the inspection area for the foreign matter; a cleaning step of cleaning the inspection area; a second inspection step of inspecting the inspection area cleaned in the cleaning step for foreign matter, In the second inspection step, an inspection of a region in which the foreign matter is not detected in the first inspection step is omitted; a first inspection step and a second inspection step for inspecting the presence or absence of the foreign matter based on an amount of scattered light that is scattered by the foreign matter when the inspection light is projected onto the object, the second inspection step being characterized in that

10. 10. The foreign matter inspection method according to claim 9, wherein the first inspection step and the second inspection step are performed while driving at least one of the stage and the light projecting unit.

11. 10. The foreign body inspection method according to claim 9, wherein the first inspection step and the second inspection step include driving at least one of the stage and the light projector to an inspection position, and inspecting the foreign body while the relative speed between the stage and the light projector is zero.

12. 1. A foreign body inspection apparatus for inspecting an object for foreign bodies on an inspection area thereof while driving at least one of a stage and a light projecting unit that projects inspection light onto the object, the foreign body inspection apparatus comprising: a drive control unit that drives at least one of the stage and the light projecting unit; A storage unit that stores the position of the foreign object detected by the foreign object inspection, a drive control unit that, when the position of the foreign object is stored in the memory unit, sets the relative speed between the stage and the light projector to a first speed in a first area of ​​the inspection area where the foreign object is detected, and sets the relative speed to a second speed faster than the first speed in a second area of ​​the inspection area where the foreign object is not detected.

13. 1. A foreign body inspection apparatus for inspecting an object for foreign bodies on an inspection area of ​​the object by driving at least one of the stage and a light projecting unit that projects inspection light onto the object, the foreign body inspection apparatus comprising: a drive control unit that drives at least one of the stage and the light projecting unit; A storage unit that stores the position of the foreign object detected by the foreign object inspection, When the position of the foreign object is stored in the storage unit, the drive control unit omits inspection of an area in which the foreign object is not detected, and a light scattering unit that detects the presence or absence of the foreign matter based on an amount of light scattered by the foreign matter when the inspection light is projected onto the object;

14. 12. An exposure apparatus that transfers a pattern of an original onto a substrate, using an original that has been inspected for foreign bodies by the foreign body inspection method according to claim 1.

15. a master inspection step of inspecting the master for foreign matter by the foreign matter inspection method according to any one of claims 1 to 11; a transport step of transporting the original after the original inspection step to an exposure device; an exposure step of transferring the pattern of the original transported in the transport step onto a substrate to obtain an exposed substrate; a developing step of developing the exposed substrate to obtain a developed substrate, A method for manufacturing an article, comprising the steps of: manufacturing an article from the developed substrate.

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