Image capturing apparatus
Patent Information
- Application Number
- JP2022004479
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2022-01-14
- Publication Date
- 2024-12-16
- Estimated Expiration
- 2042-01-14
AI Technical Summary
Existing imaging devices with image blur correction mechanisms face challenges in efficiently dissipating heat without increasing the driving load on movable parts and without requiring the imaging element to move to a special position.
An imaging device with a movable section having an imaging element, a fixed section, a first metal member, and a heat dissipation unit that moves between contact and separation positions, allowing heat transfer via a heat-conducting member without affecting the imaging element's movement.
Effective heat dissipation from the imaging element is achieved without increasing the drive load or requiring the imaging element to move to a special position, ensuring continuous image capture.
Smart Images
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Abstract
Description
Technical Field
[0005] , ,
[0001] The present invention relates to an imaging device in which an imaging element can swing, and particularly to a technique for dissipating heat from the imaging element.
Background Art
[0002] The market introduction of imaging devices equipped with an imaging element shift type shake correction mechanism is being actively promoted. In addition, due to the increase in the number of pixels and the increase in the readout speed of the imaging element, the temperature of the imaging element tends to rise. Therefore, in an imaging device equipped with an imaging element shift type shake correction mechanism, an imaging element unit capable of efficiently dissipating heat from the imaging element is required.
[0003] In response to such requirements, for example, Patent Document 1 discloses a configuration in which a ring-shaped metal member is disposed near the imaging element unit, the imaging element unit and the metal member are connected by a flexible member, and heat is dissipated from the metal member. Further, Patent Document 2 discloses a configuration in which a heat dissipation member is disposed around an imaging element unit provided with a shake correction mechanism, and the heat generated in the imaging element is transmitted to the heat dissipation member by driving the shake correction mechanism to bring the imaging element unit into contact with the heat dissipation member.
Prior Art Documents
Patent Documents
[0004]
Patent Document 1
Patent Document 2
Summary of the Invention
Problems to be Solved by the Invention
[0005] However, in the technology disclosed in Patent Document 1, the image sensor unit and the metal member are connected by a flexible member, so the elasticity of the flexible member becomes a driving load when the image sensor is oscillated. Also, in the technology disclosed in Patent Document 2, when the image sensor unit is brought into contact with the heat dissipation member, the image sensor unit is moved outside the image shake correction area during imaging, so imaging cannot be performed until the image sensor unit is returned to the image shake correction area.
[0006] The present invention aims to provide an imaging device that can actively dissipate heat from an image sensor without increasing the driving load of a movable part having an image sensor, and without moving the image sensor to a special position. [Means for solving the problem]
[0007] The imaging apparatus according to the present invention comprises a movable part having an image sensor, a fixed part that holds the movable part so as to be swingable in a plane perpendicular to the imaging optical axis, a first metal member connected to the movable part, and a heat dissipation unit attached to the fixed part, wherein the heat dissipation unit has a contact member that is movable in the direction of the imaging optical axis between a contact position and a separation position with respect to the first metal member, and a heat conductive member that connects the contact member and a predetermined member, and when the contact member is in the contact position, the heat generated by the image sensor is transmitted to the predetermined member via the first metal member, the contact member and the heat conductive member. [Effects of the Invention]
[0008] According to the present invention, heat can be actively dissipated from the image sensor without increasing the driving load of the movable part having the image sensor, and without moving the image sensor to a special position. [Brief explanation of the drawing]
[0009] [Figure 1] This is a block diagram showing the schematic configuration of a digital camera according to an embodiment. [Figure 2]This is an exploded perspective view of the imaging unit and its vicinity. [Figure 3] This is a perspective view showing the arrangement of the imaging unit, retaining plate, and printed circuit board. [Figure 4] This is a cross-sectional view of the heat dissipation unit in the first embodiment. [Figure 5] This is a cross-sectional view of the heat dissipation unit in the second embodiment. [Figure 6] This is a cross-sectional view of the heat dissipation unit in the third embodiment. [Figure 7] This is a cross-sectional view of another heat dissipation unit in the third embodiment. [Modes for carrying out the invention]
[0010] Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
[0011] Figure 1 is a block diagram showing the schematic configuration of a digital camera 100, which is an example of an imaging device according to the embodiment. The digital camera 100 includes a shooting lens 20, a shutter 12, a distance measuring control unit 66, an aperture control unit 65, a shutter control unit 68, an imaging unit 200, a gyroscope 82, a system control unit 50, a memory 52, an image processing unit 60, a thermometer 58, and an operating member 80. The digital camera 100 also includes a display unit 54, a timer 56, a power switch 84, a power control unit 86, a battery 88, and a storage medium 500.
[0012] The photographic lens 20 has multiple lens groups, including at least an AF lens 24, and an aperture 26. The imaging unit 200 has an image sensor unit 230 (see Figure 2), an image sensor image shake correction unit 240 (hereinafter referred to as "image shake correction unit 240"), and an image sensor heat dissipation unit 250 (hereinafter referred to as "heat dissipation unit 250"). The image sensor unit 230 has an image sensor 231.
[0013] The photographic lens 20 forms an image of incident light onto the imaging surface of the image sensor 231. The aperture 26 adjusts the amount of light incident on the image sensor 231. The shutter 12 controls the amount of exposure to the image sensor 231 by opening and closing. The image sensor 231 is a photoelectric conversion element such as a CCD sensor or CMOS sensor that converts an optical image into an electrical signal. The light beam incident on the photographic lens 20 is guided to the image sensor 231 via the aperture 26 and shutter 12, and is formed as an optical image on the imaging surface of the image sensor 231.
[0014] In accordance with commands from the system control unit 50, the distance measuring control unit 66 controls the movement of the AF lens 24 in the optical axis direction, the aperture control unit 65 controls the driving of the aperture 26, and the shutter control unit 68 controls the opening and closing operation of the shutter 12.
[0015] The gyro 82 detects the amount of shake (direction and magnitude of shake) of the digital camera 100. The image shake correction unit 240 performs image shake correction using an image sensor shift method, correcting image shake by driving the image sensor 231 in a plane at least perpendicular to the optical axis according to the amount of shake detected by the gyro 82. The heat dissipation unit 250 suppresses the temperature rise of the image sensor 231 by receiving heat from the image sensor 231 under imaging conditions where the amount of heat generated by the image sensor 231 is large (in other words, imaging conditions where power consumption is large).
[0016] The system control unit 50, which consists of a CPU and the like, controls the overall operation of the digital camera 100 by executing a predetermined program stored in the memory 52. For example, the system control unit 50 controls the shutter 12, AF lens 24, and aperture 26 based on the calculation results performed by the image processing unit 60 on the image data acquired by the image sensor 231, and performs AF processing and AE processing. The system control unit 50 is also used as a determination means to determine whether or not various operations of the digital camera 100 can be performed.
[0017] The memory 52 includes a ROM that stores constants, variables, programs, etc. for the operation of the system control unit 50, and a RAM that is used for program expansion and temporary data storage. Further, the memory 52 stores the holding state of the imaging element unit 230 by the image blur correction unit 240. The thermometer 58 measures the temperatures of the heat generating components installed inside the digital camera 100, including the imaging element 231.
[0018] The operation member 80 is composed of buttons, switches, etc. for instructing the system control unit 50 to select and set various functions, perform shooting operations, image playback displays, etc. The power switch 84 switches the on / off of the power supply of the digital camera 100. The power control unit 86 is composed of a battery detection circuit, a DC / DC converter, a switch circuit for switching the energization block, etc. The battery 88 supplies power to the digital camera 100. The power control unit 86 detects the type and remaining amount of the battery 88, and supplies the necessary voltage to each part including the storage medium 500 for the necessary period based on the detection result and the instruction of the system control unit 50. The storage medium 500 is detachable from the digital camera 100 and stores image data such as captured images.
[0019] <First Embodiment> FIG. 2 is a perspective view showing the schematic configuration of the imaging unit 200, the holding sheet metal 300 and the printed circuit board 310 arranged on the back side of the imaging unit 200. As described above, the imaging unit 200 is generally composed of an imaging element unit 230, an image blur correction unit 240, and a heat radiation unit 250.
[0020] A retaining plate 300 (the third metal member in the first embodiment), positioned on the rear side of the imaging unit 200, holds the printed circuit board 310 and is connected (fixed) to a housing (not shown) of the digital camera 100. Various electrical and electronic components, including a system control unit 50 and an image processing unit 60, are mounted on the printed circuit board 310. The image sensor unit 230 and the printed circuit board 310 are electrically connected by a flexible circuit board 280, and the image signal output from the image sensor 231 is transmitted to the printed circuit board 310 via the flexible circuit board 280. The retaining plate 300 is not connected (linked) to the imaging unit 200.
[0021] Next, the configuration of the image shake correction unit 240 and the heat dissipation unit 250, which constitute the imaging unit 200, will be described. Figure 3 is an exploded perspective view of the imaging unit 200, and the viewing direction of the imaging unit 200 is different in Figure 3(a) and Figure 3(b).
[0022] The imaging unit 200 has a structure in which an image sensor unit 230, which is a movable part, is movably sandwiched between a front plate 210 and a rear plate 220, which constitute a fixed part. The front plate 210 and the rear plate 220 are made of metal plates. The rear plate 220 is fixed to a housing (not shown) of the digital camera 100. The front plate 210 is fixed to the rear plate 220 with the image sensor unit 230 in between.
[0023] The image sensor unit 230 includes an image sensor 231 and an image sensor holder 232 that holds the image sensor 231. Three balls 242 are positioned between the image sensor holder 232 and the back plate 220 around the image sensor 231, surrounding the imaging optical axis (not shown). The three balls 242 are rotatable, and as a result, the image sensor unit 230 is held between the front plate 210 and the back plate 220 so as to be able to swing in a plane perpendicular to the imaging optical axis.
[0024] Multiple magnets 244 are arranged on the rear plate 220, and multiple coils 246 are arranged on the image sensor holder 232 so as to face the magnets 244. Power is supplied to the coils 246 from a power supply circuit (not shown), and the repulsive and attractive forces generated by the interaction between the magnetic field generated in the coils 246 and the magnetic field of the magnets 244 are used to control the oscillation of the image sensor unit 230. Generally, the image shake correction unit 240 is controlled so that the image sensor unit 230 is maintained at the center position of imaging, and is also controlled to move the image sensor unit 230 in a direction that cancels out the image shake of the digital camera 100 caused by the photographer.
[0025] A metal plate 248 is positioned on the front (front side) of the coil 246, and the magnet 244 attracts the metal plate 248, maintaining the image sensor holder 232 and the back plate 220 in contact with the ball 242. This sets the flange back position of the image sensor 231 within the digital camera 100 to a specified position.
[0026] The heat dissipation unit 250 will be described in detail below with reference to Figures 3 and 4. As shown in Figure 3, the heat dissipation unit 250 includes an image sensor cooling plate 252, a heat dissipation base 254, a graphite sheet 264, an image sensor heat dissipation rubber 256, and a heat dissipation plate 262. In the following description, the image sensor cooling plate 252 will be referred to as "cooling plate 252" and the image sensor heat dissipation rubber 256 will be referred to as "heat dissipation rubber 256".
[0027] The cooling plate 252 (the first metal member in the first embodiment) has legs 252a, 252b, and 252c. The image sensor holder 232 is also provided with holding parts 232a, 232b, and 232c. Note that the legs 252c are hidden by the rear plate 220 in Figure 3(b) and are therefore not shown. The cooling plate 252 is fixed to the image sensor holder 232 by fastening the legs 252a to 252c to the holding parts 232a to 232c with screws. In this way, the heat generated in the image sensor 231 is transferred to the cooling plate 252 via the image sensor holder 232.
[0028] The heat dissipation base 254 holds the gear 257, cam 258, motor 259, and heat transfer plate 260, and is fixed to the rear plate 220. The graphite sheet 264 is a heat conductive member held between the heat transfer plate 260 and the heat dissipation rubber 256 (contact member) and connected to the heat dissipation plate 262. The heat dissipation rubber 256 is preferably made of a material that is elastic and has high thermal conductivity (high thermal conductivity).
[0029] The heat dissipation plate 262 (the second metal member in the first embodiment) is positioned on the rear side of the heat dissipation base 254 and is fixed to the rear side plate 220 together with the heat dissipation base 254. Here, the connector 280a of the flexible substrate 280 is connected to the connector 231a of the image sensor 231. The flexible substrate 280 is pulled out from the connection point with the connector 231a to the rear side of the heat dissipation unit 250, straddling the upper side of the heat dissipation unit 250 in the direction of the imaging optical axis. Therefore, the heat dissipation base 254 and the heat dissipation plate 262 are fixed to the rear side plate 220 in the lateral direction.
[0030] By energizing the motor 259 and driving it, the heat dissipation rubber 256 can be moved in the optical axis direction between a contact position and a separation position from the cooling plate 252. In other words, the drive of the motor 259 causes the heat dissipation rubber 256 to move back and forth in the optical axis direction from the cooling plate 252 via the gear 257, cam 258, heat transfer plate 260, and graphite sheet 264, making contact with and separating from the cooling plate 252.
[0031] Figure 4 is a cross-sectional view of the heat dissipation unit 250 in the first embodiment. More specifically, Figure 4(a) shows a state in which the heat from the cooling plate 252 has not been transferred to the heat dissipation rubber 256. Figure 4(b) shows a state in which the heat from the cooling plate 252 has been transferred to the heat dissipation rubber 256.
[0032] In the state shown in Figure 4(a), where the heat dissipation rubber 256 is not in contact with the cooling plate 252, the heat dissipation unit 250 does not become a driving load for the movable image sensor unit 230, allowing the image shake correction unit 240 to function fully.
[0033] On the other hand, in the state shown in Figure 4(b), where the heat dissipation rubber 256 is in contact with the cooling plate 252, the heat from the image sensor 231 is transferred to the back plate 220 via the cooling plate 252, the heat dissipation rubber 256, the graphite sheet 264, and the heat dissipation plate 262. In this way, the heat generated by the image sensor 231 can be transferred to the back plate 220 via the heat dissipation unit 250, making it possible to suppress the temperature rise of the image sensor 231. In the state shown in Figure 4(b), the heat dissipation rubber 256 is in contact with the cooling plate 252, making it virtually impossible to move the image sensor unit 230. In other words, when the heat dissipation unit 250 is operating, the drive of the image shake correction unit 240 is restricted. However, since the image sensor unit 230 is held at the center position for imaging, imaging can be performed. Note that the image sensor unit 230 does not need to be held at the center position for imaging; it is sufficient if it is held within the imaging range. The imaging range is the position where vignetting does not occur due to a component positioned in front of the image sensor 231. Furthermore, by holding the image sensor unit 230 within the imaging range, even in a configuration where imaging is not performed when the heat dissipation unit 250 is operating, imaging can be performed immediately after the heat dissipation unit 250 is deactivated.
[0034] Furthermore, when the heat dissipation rubber 256 is in contact with the cooling plate 252, it is desirable that the heat dissipation rubber 256 is pressed against the cooling plate 252 to enhance adhesion and efficiently transfer heat. In this embodiment, heat transfer is performed by contact between the cooling plate 252 and the heat dissipation rubber 256, but the graphite sheet 264 and the heat dissipation rubber 256 may be swapped. In that case, the heat dissipation rubber 256 is made movable between a pressing position where the graphite sheet 264 is in close contact with the cooling plate 252 and a separated position away from the cooling plate 252. The heat dissipation rubber 256 then functions as a pressing member that presses the graphite sheet 264 against the cooling plate 252 when in the pressing position, causing it to be in close contact with the cooling plate 252. In this case, the heat dissipation rubber 256 is required to have elasticity, but it is not necessarily required to use a material with high thermal conductivity. Furthermore, in this configuration, the frictional resistance is lower than in the configuration where the heat dissipation rubber 256 is in contact with the cooling plate 252, making it possible to move the image sensor unit 230 while the graphite sheet 264 is in contact with the cooling plate 252. In other words, although the driving load is greater than in the non-contact configuration, it is possible to drive the image shake correction unit 240 and perform imaging.
[0035] In this embodiment, the heat dissipation plate 262 is in thermal contact with the rear plate 220. However, if the heat dissipation plate 262 is not provided, the graphite sheet 264 can be in contact with the rear plate 220.
[0036] <Second Embodiment> The heat dissipation unit according to the second embodiment, like the heat dissipation unit 250 in the first embodiment, transfers the heat generated by the image sensor 231 to the back plate 220, but in the second embodiment, heat is further transferred to the retaining sheet metal 300.
[0037] Figure 5 is a cross-sectional view of the heat dissipation unit in the second embodiment, and corresponds to Figure 4(b). In the heat dissipation unit of the second embodiment, the graphite sheet 266 is placed between the heat transfer plate 260 and the heat dissipation rubber 256 and connected to the retaining sheet metal 300.
[0038] The motor 259 drives the heat dissipation rubber 256 to move back and forth between a contact position and a separated position relative to the cooling plate 252 via the gear 257, cam 258, heat transfer plate 260, and graphite sheet 266. The heat from the cooling plate 252 is transferred to the retaining sheet metal 300 via the heat dissipation rubber 256 and graphite sheet 266.
[0039] In other words, compared to the first embodiment, the second embodiment transfers the heat generated by the image sensor 231 not only to the back plate 220 but also to the retaining sheet metal 300. Here, since the retaining sheet metal 300 is not connected to the imaging unit 200, it can be made into a relatively large metal component. In this way, it becomes possible to obtain a greater effect in suppressing the temperature rise of the image sensor 231.
[0040] <Third Embodiment> The heat dissipation unit according to the third embodiment transfers the heat generated by the image sensor 231 and the heat generated by the printed circuit board 310 to the retaining sheet metal 300.
[0041] Figure 6 is a cross-sectional view of the heat dissipation unit in the third embodiment, and corresponds to Figure 4(b). The configuration of the heat dissipation unit in the third embodiment that is equivalent to the configuration of the heat dissipation unit in the second embodiment will not be explained.
[0042] The heat dissipation unit in the third embodiment includes a substrate heat dissipation plate 268 (second metal member in the third embodiment), a graphite sheet 270, and a substrate heat dissipation rubber 272 (second contact member). The substrate heat dissipation plate 268 holds the heat dissipation rubber 256 (first contact member) and is held on the heat dissipation base 254 so as to be movable in the imaging optical axis direction. The graphite sheet 270 connects the substrate heat dissipation plate 268 to the retaining sheet metal 300 (third metal member in the first embodiment). The substrate heat dissipation rubber 272 is attached to the substrate heat dissipation plate 268 between the substrate heat dissipation plate 268 and the printed circuit board 310 so as to transfer heat from the printed circuit board 310 to the graphite sheet 270.
[0043] Driven by the motor 259, the heat dissipation rubber 256 (first contact member) can move back and forth between a contact position and a separated position with respect to the cooling plate 252 (first metal member in the third embodiment) via the gear 257, cam 258, and substrate heat dissipation plate 268. At this time, the substrate heat dissipation plate 268 moves back and forth integrally with the heat dissipation rubber 256, and simultaneously with their movement, the substrate heat dissipation plate 268 and the substrate heat dissipation rubber 272 move back and forth integrally with respect to the printed circuit board 310. When the heat dissipation rubber 256 is in the contact position with respect to the cooling plate 252, the substrate heat dissipation rubber 272 also comes into contact with the printed circuit board 310.
[0044] When the heat dissipation rubber 256 comes into contact with the cooling plate 252, the heat generated by the image sensor 231 is transferred to the retaining sheet metal 300 via the cooling plate 252, the heat dissipation rubber 256, the substrate heat dissipation plate 268, and the graphite sheet 270. Similarly, when the substrate heat dissipation rubber 272 comes into contact with the printed circuit board 310, the heat generated by the heat-generating components is transferred to the retaining sheet metal 300 via the printed circuit board 310, the substrate heat dissipation rubber 272, and the graphite sheet 270. When the substrate heat dissipation rubber 272 is in contact with the printed circuit board 310, it is desirable that the substrate heat dissipation rubber 272 is pressed against the printed circuit board 310 to improve adhesion and efficiently transfer heat.
[0045] Thus, in the third embodiment, the heat generated by the image sensor 231 can be transmitted to the retaining sheet metal 300, and the heat generated by the printed circuit board 310 can also be transmitted to the retaining sheet metal 300, making it possible to suppress the temperature rise of the image sensor 231 and the printed circuit board 310.
[0046] In the third embodiment of the heat dissipation unit, heat transfer from the image sensor 231 and the printed circuit board 310 to the retaining sheet metal 300 was performed simultaneously. However, heat transfer from the image sensor 231 and the printed circuit board 310 to the retaining sheet metal 300 may be performed in stages. For example, as shown in Figure 7, the thickness of the heat dissipation rubber 256 and the substrate heat dissipation rubber 272 can be adjusted. Then, when the substrate heat dissipation plate 268 is moved and the substrate heat dissipation rubber 272 comes into contact with the printed circuit board 310, the heat dissipation rubber 256 is configured not to come into contact with the cooling plate 252. Subsequently, when the substrate heat dissipation plate 268 is moved further and the substrate heat dissipation rubber 272 is deformed, the heat dissipation rubber 256 comes into contact with the cooling plate 252, thereby enabling heat transfer to the printed circuit board 310 before that of the image sensor 231.
[0047] Furthermore, by reversing the thickness relationship between the heat dissipation rubber 256 and the substrate heat dissipation rubber 272, heat transfer from the image sensor 231 can occur before that of the printed circuit board 310. Alternatively, instead of adjusting the thickness of the heat dissipation rubber 256 and the substrate heat dissipation rubber 272, the shape of the substrate heat dissipation plate 268 can also be adjusted to achieve gradual heat transfer from the image sensor 231 and the printed circuit board 310 to the retaining plate 300. Similar effects can be obtained by changing the arrangement and dimensions of other components. In other words, by maintaining the position of the substrate heat dissipation plate 268 while only one of the substrate heat dissipation rubbers 272 or 256 is in contact, it is possible to transfer heat from only one of the image sensor 231 or the printed circuit board 310 to the retaining plate 300.
[0048] Incidentally, in general, imaging devices such as digital cameras have heat dissipation paths from the printed circuit board 310 to prevent the temperature of the exterior (not shown) of the digital camera 100 from rising under normal imaging conditions. However, under imaging conditions where electrical components such as the system control unit 50 mounted on the printed circuit board 310 become hot, it may be desirable to increase the number of heat dissipation paths. The heat dissipation unit in the third embodiment has the effect of suppressing localized temperature rises inside the digital camera 100 by increasing the heat dissipation paths from the printed circuit board 310 to the retaining plate 300.
[0049] Although the present invention has been described in detail above based on its preferred embodiments, the present invention is not limited to these specific embodiments, and various forms that do not depart from the spirit of the invention are also included in the present invention. Furthermore, each of the embodiments described above is merely one embodiment of the present invention, and it is possible to combine each embodiment as appropriate. [Explanation of symbols]
[0050] 100 Digital Cameras 200 imaging units 220 Rear side plate 231 Image sensor 250 Heat dissipation unit 252 Cooling Plate 256 Heat dissipation rubber 262 Heat dissipation plate 264,266,270 Graphite Sheets 268 Circuit board heat dissipation plate 272 Circuit board heat dissipation rubber 300 retaining sheet metal 310 Printed Circuit Board
Claims
1. A movable part having an imaging element; a fixed portion that holds the movable portion so as to be swingable within a plane perpendicular to an imaging optical axis; A first metal member connected to the movable part; a heat dissipation unit attached to the fixed portion, The heat dissipation unit includes: a contact member arranged to be movable in an imaging optical axis direction between a contact position and a spaced position with respect to the first metal member; a heat conductive member connecting the contact member and a predetermined member, An imaging device characterized in that, when the contact member is in the contact position, heat generated by the imaging element is transferred to the specified member via the first metal member, the contact member, and the thermal conduction member.
2. 2. The imaging device according to claim 1, wherein the contact member has elasticity and thermal conductivity.
3. 3. The imaging device according to claim 1, wherein the imaging element is capable of capturing an image with the contact member in the contact position.
4. 4. The imaging device according to claim 1, wherein the predetermined member is the fixed portion.
5. the heat dissipation unit has a second metal member attached to the fixing portion, 4. The imaging device according to claim 1, wherein the predetermined member is the second metal member.
6. a third metal member that is held by a housing of the imaging device and is not connected to the movable portion and the fixed portion; The imaging device according to claim 1 , wherein the predetermined member is the third metal member.
7. A movable part having an imaging element; a fixed portion that holds the movable portion so as to be swingable within a plane perpendicular to an imaging optical axis; A first metal member connected to the movable part; a heat dissipation unit attached to the fixed portion, The heat dissipation unit includes: a first contact member arranged to be movable in an imaging optical axis direction between a contact position with respect to the first metal member and a spaced position; a second metal member disposed to face the first metal member in the imaging optical axis direction, and connected to the first contact member so as to be movable integrally with the first contact member in the imaging optical axis direction; a third metal member that is held by a housing of the imaging device and is not connected to the movable portion and the fixed portion; a thermal conductive member connecting the second metal member and the third metal member; A substrate on which heat generating components are mounted; a second contact member disposed on the second metal member and contacting the substrate when the first contact member is in the contact position; An imaging device characterized in that, when the first contact member is in the contact position, heat generated by the imaging element is transferred to the third metal member via the first metal member, the first contact member, the second metal member and the thermal conductive member, and heat generated by the heat-generating component is transferred to the third metal member via the substrate, the second contact member and the thermal conductive member.
8. 8. The imaging device according to claim 7, wherein the first contact member and the second contact member have elasticity and thermal conductivity.
9. 9. The imaging device according to claim 7, wherein an image can be captured by the imaging element in the state where the first contact member is in the contact position.
10. 10. The imaging device according to claim 1, wherein the heat conductive member is a graphite sheet.
11. A first unit having an image sensor and movable in a direction perpendicular to an image pickup optical axis; A heat dissipation member; a second unit including a thermally conductive sheet member arranged to be aligned with the first unit in a direction parallel to the imaging optical axis and connected to the heat dissipation member; An imaging device characterized in that the thermally conductive sheet member is held movably in a direction parallel to the imaging optical axis between a first position where the thermally conductive sheet member contacts a flat portion of the first unit and a second position where the thermally conductive sheet member is spaced from the first unit.
12. The imaging device according to claim 11, characterized in that imaging is possible with the imaging element when the thermally conductive sheet member is in the first position.
13. An imaging device as described in claim 11 or 12, characterized in that the thermally conductive sheet member is a graphite sheet.
14. An imaging device as described in any one of claims 11 to 13, characterized in that the first position is farther from the imaging element in a direction parallel to the imaging optical axis than the second position.
15. An imaging device as described in any one of claims 11 to 14, characterized in that the second unit is arranged between the imaging element and the flat plate portion in a direction parallel to the imaging optical axis.
16. An imaging device as described in any one of claims 11 to 15, characterized in that the first unit is movable relative to the second unit in a direction perpendicular to the imaging optical axis.
17. An imaging device as described in any one of claims 11 to 16, characterized in that the thermally conductive sheet member is movable between the first position and the second position by driving a motor possessed by the second unit.