Model based dynamic positional correction for digital lithography tools

Abstract

To provide photolithography systems, and methods for correcting positional errors in photolithography systems.SOLUTION: When a photolithography system is first started, the system enters a stabilization period. During the stabilization period, positional readings and data, such as temperature, pressure, and humidity data, are collected as the system prints or exposes a substrate. A model is created based on the collected data and the positional readings. The model is then used to estimate errors in subsequent stabilization periods, and the estimated errors are dynamically corrected during the subsequent stabilization periods.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001]

[0001] Embodiments of the present disclosure generally relate to photolithography systems and methods for correcting positional errors in photolithography systems.

Background Art

[0002]

[0002] Photolithography is widely used in the manufacture of display devices such as semiconductor devices and liquid crystal displays (LCDs). In many cases, large-area substrates are used in the manufacture of LCDs. LCDs, or flat panels, are commonly used in active matrix displays such as computers, touch panel devices, personal digital assistants (PDAs), mobile phones, and television monitors. Generally, a flat panel may include a layer of liquid crystal material that forms pixels sandwiched between two plates. When power from a power source is applied across the liquid crystal material, the amount of light passing through the liquid crystal material is controlled at the pixel locations, enabling the generation of an image.

[0003]

[0003] Generally, microlithography techniques are used to create electrical features incorporated as part of a liquid crystal material layer that forms pixels. According to this technique, a photosensitive photoresist is typically applied to at least one surface of a substrate. Next, a pattern generator exposes selected areas of the photosensitive photoresist with light as part of a pattern, causing a chemical change in the photoresist in the selected areas to prepare for subsequent material removal and / or material addition processes to create electrical features in these selected areas.

[0004]

[0004] However, the tools used in such microlithography techniques may take more than eight hours to stabilize the printing and patterning behavior, during which time the patterning of the photoresist may become non-uniform due to various influences such as thermal fluctuations. The tools include numerous heat sources and components with different conductivity and heat capacity, each of which can cause fluctuations that result in non-uniform patterning and negatively affect the reproducibility of total pitch and overlay correction.

[0005]

[0005] In order to continue providing consumers with display devices and other devices at prices they demand, new equipment, approaches, and systems are needed to accurately and cost-effectively fabricate patterns on substrates such as large-area substrates. [Overview of the Initiative]

[0006]

[0006] The disclosure generally relates to a photolithography system and a method for correcting positional errors in a photolithography system. When a photolithography system is first started, the system enters a stabilization period. During the stabilization period, as the system prints or exposes the substrate, positional readings and data such as temperature, pressure, and humidity are collected. A model is created based on the collected data and positional readings. The model is then used to estimate errors in subsequent stabilization periods, and the estimated errors are dynamically corrected during subsequent stabilization periods.

[0007]

[0007] In one embodiment, the method includes starting a photolithography system and entering a stabilization period; collecting data and position readings while the photolithography system is printing during the stabilization period; creating a model based on the data and position readings; and using the model to dynamically correct estimation errors during subsequent stabilization periods.

[0008]

[0008] In another embodiment, the method includes starting a photolithography system and entering a stabilization period, and collecting temperature data and position readings while the photolithography system is printing during the stabilization period. Temperature data is collected during heating and cooling periods. The model further includes creating a model based on the temperature data and position readings, calibrating the model, using the calibrated model to estimate errors in subsequent stabilization periods, and dynamically correcting the estimated errors in subsequent stabilization periods.

[0009]

[0009] In yet another embodiment, the method includes starting a photolithography system and entering a stabilization period; collecting temperature data and position readings while the photolithography system is printing during the stabilization period; creating a model based on the temperature data and position readings; forming an optimization problem for determining the heat capacity and transfer coefficient of the photolithography system; using the model and the optimization problem to estimate errors in subsequent stabilization periods; and dynamically correcting the estimated errors during subsequent stabilization periods.

[0010]

[0010] In order that the above-mentioned features of the present disclosure may be understood in detail, a more specific description of the present disclosure, which has been briefly summarized above, can be obtained by reference to embodiments, some of which are shown in the accompanying drawings. However, it should be noted that the accompanying drawings show only exemplary embodiments and should not be considered to limit the scope, and other equally valid embodiments may be permitted. [Brief explanation of the drawing]

[0011] [Figure 1A] This is a perspective view of a photolithography system according to one embodiment. [Figure 1B] This is a perspective view of a photolithography system according to another embodiment. [Figure 2]This is a schematic perspective view of an image projection device according to an embodiment disclosed herein. [Figure 3] This specification describes a method for modeling and calibrating system behavior to estimate positional perturbations occurring during a stabilization period, according to embodiments disclosed herein. [Figure 4A] An exemplary graph of data measurements according to embodiments disclosed herein is shown. [Figure 4B] An exemplary graph of data measurements according to embodiments disclosed herein is shown. [Figure 4C] An exemplary graph of data measurements according to embodiments disclosed herein is shown. [Figure 4D] An exemplary graph of data measurements according to embodiments disclosed herein is shown. [Figure 4E] An exemplary graph of data measurements according to embodiments disclosed herein is shown. [Figure 4F] An exemplary graph of data measurements according to embodiments disclosed herein is shown. [Figure 5] This specification shows alignment configurations of a first bridge component and a second bridge component, each having a plurality of eyes positioned thereon, according to embodiments disclosed herein. [Figure 6A] The following are illustrative graphs of data measurements and position readings at a stage speed of 200 mm / second according to embodiments disclosed herein. [Figure 6B] The following are illustrative graphs of data measurements and position readings at a stage speed of 200 mm / second according to embodiments disclosed herein. [Figure 6C] The following are illustrative graphs of data measurements and position readings at a stage speed of 200 mm / second according to embodiments disclosed herein. [Figure 7A] The following are illustrative graphs of data measurements and position readings at a stage speed of 100 mm / second according to embodiments disclosed herein. [Figure 7B]An exemplary graph of data measurement values and position readings at a stage speed of 100 mm / second according to an embodiment disclosed in this specification is shown. [Figure 7C] An exemplary graph of data measurement values and position readings at a stage speed of 100 mm / second according to an embodiment disclosed in this specification is shown.

Best Mode for Carrying Out the Invention

[0012]

[0019] For ease of understanding, the same reference numbers are used to denote the same elements common to the figures, where possible. It is contemplated that the elements and features of one embodiment may be beneficially incorporated into other embodiments without further recitation.

[0013]

[0020] The present disclosure generally relates to a photolithography system and a method for correcting position errors in a photolithography system. When the photolithography system is first started, the system enters a stabilization period. During the stabilization period, position readings and data such as temperature, pressure, and humidity data are collected while the system is printing or exposing the substrate. Based on the collected data and position readings, a model is created. Next, the model is used to estimate errors in subsequent stabilization periods, and the estimated errors are dynamically corrected during subsequent stabilization periods.

[0014]

[0021] Figure 1A is a perspective view of a photolithography system 100 according to an embodiment disclosed herein. The system 100 includes a base frame 110, a slab 120, a stage 130, and a processing apparatus 160. The base frame 110 rests on the floor of the manufacturing facility and supports the slab 120. A passive air isolator 112 is positioned between the base frame 110 and the slab 120. In one embodiment, the slab 120 is a monolithic piece of granite, and the stage 130 is positioned on the slab 120. A substrate 140 is supported by the stage 130. Multiple holes (not shown) are formed in the stage 130 through which multiple lift pins (not shown) can extend. In some embodiments, the lift pins rise to an extended position to receive the substrate 140, for example, from one or more transfer robots (not shown). One or more transfer robots are used to load and unload the substrate 140 from the stage 130.

[0015]

[0022] The substrate 140 includes any suitable material used as part of a flat panel display, such as an alkaline earth borosilicate. In other embodiments, the substrate 140 is made of other materials. In some embodiments, the substrate 140 has a photoresist layer formed thereon. The photoresist is highly radiation-sensitive. A positive photoresist includes portions of the photoresist that become soluble in a photoresist developer applied to the photoresist after a pattern is written into the photoresist when exposed to radiation. A negative photoresist includes portions of the photoresist that become insoluble in a photoresist developer applied to the photoresist after a pattern is written into the photoresist when exposed to radiation. The chemical composition of the photoresist determines whether the photoresist is a positive photoresist or a negative photoresist. Examples of photoresists include, but are not limited to, at least one of diazonaphthoquinone, phenol formaldehyde resin, poly(methyl methacrylate), poly(methylglutarimide), and SU-8. In this way, a pattern is created on the surface of the substrate 140 to form an electronic circuit.

[0016]

[0023] System 100 includes a pair of supports 122 and a pair of tracks 124. The pair of supports 122 is disposed on the slab 120. In one embodiment, the slab 120 and the pair of supports 122 are a single piece of material. The pair of tracks 124 is supported by the pair of supports 122, and the stage 130 moves in the x direction along the tracks

[0017]

[0024] The processing apparatus 160 includes a support 162 and a processing unit 164. The support 162 is positioned on a slab 120 and includes an opening 166 for a stage 130 to pass under the processing unit 164. The processing unit 164 is supported by the support 162. In one embodiment, the processing unit 164 is a pattern generator configured to expose a photoresist in a photolithography process. In some embodiments, the pattern generator is configured to perform a maskless lithography process. The processing unit 164 includes a plurality of image projection devices (shown in Figure 2). In one embodiment, the processing unit 164 includes as many as 84 image projection devices. Each image projection device is located within a case 165. The processing apparatus 160 is useful for performing maskless direct patterning.

[0018]

[0025] During operation, the stage 130 moves in the x-direction from a loading position to a processing position as shown in Figure 1A. The processing position is one or more positions of the stage 130 as it passes under the processing unit 164. During operation, the stage 130 is lifted by multiple air bearings (not shown) and moves along a pair of tracks 124 from the loading position to the processing position. Multiple vertical guide air bearings (not shown) are connected to the stage 130 and positioned adjacent to the inner walls 128 of each support 122 to stabilize the movement of the stage 130. The stage 130 also moves in the y-direction by moving along the tracks 150 to process and / or index the substrate 140. The stage 130 is capable of independent operation and can scan the substrate 140 in one direction and step in the other.

[0019]

[0026] The measurement system measures the X and Y lateral position coordinates of each stage 130 in real time so that each of the multiple image projection devices can accurately pinpoint the location of the pattern being written on the photoresist-covered substrate. The measurement system also provides real-time measurements of the angular position of each stage 130 around the vertical or z axis. The angular position measurements can be used by a servo mechanism to keep the angular position constant during scanning, or to apply corrections to the position of the pattern being written on the substrate 140 by the image projection device 270, as shown in Figure 2. These techniques can be used in combination.

[0020]

[0027] Figure 1B is a perspective view of a photolithography system 190 according to an embodiment disclosed herein. System 190 is similar to system 100. However, system 190 includes two stages 130. Each of the two stages 130 is capable of independent operation and can scan the substrate 140 in one direction and step in the other. In some embodiments, while one of the two stages 130 is scanning the substrate 140, the other of the two stages 130 is unloading the exposed substrate and loading the next substrate to be exposed.

[0021]

[0028] Figures 1A and 1B show two embodiments of a photolithography system, but other systems and configurations are also intended herein. For example, a photolithography system including any appropriate number of stages is also intended.

[0022]

[0029] Figure 2 is a schematic perspective view of an image projection device 270 according to one embodiment, useful for a photolithography system such as System 100 or System 190. The image projection device 270 includes one or more spatial light modulators 280, an alignment and inspection system 284 including a focus sensor 283 and a camera 285, and a projection optical system 286. The components of the image projection device vary depending on the spatial light modulator used. Spatial light modulators include, but are not limited to, micro-LEDs, digital micromirror devices (DMDs), liquid crystal displays (LCDs), and vertical-cavity surface-emitting lasers (VCSELs).

[0023]

[0030] During operation, the spatial light modulator 280 is used to modulate one or more properties, such as amplitude, phase, or polarization, of the light projected onto a substrate, such as the substrate 140, through the image projection device 270. The alignment and inspection system 284 is used for alignment and inspection of the components of the image projection device 270. In one embodiment, the focus sensor 283 includes multiple lasers that are directed to pass through the lens of the camera 285 and back through the lens of the camera 285, and are imaged on the sensor to detect whether the image projection device 270 is in focus. The camera 285 is used to image the substrate, such as the substrate 140, to ensure that the alignment of the image projection device 270 and the photolithography system 100 or 190 is correct or within a predetermined tolerance. The projection optical system 286, such as one or more lenses, is used to project light onto the substrate, such as the substrate 140.

[0024]

[0031] When the photolithography systems 100 and 190 are first started, they enter a stabilization period. The stabilization period is the time it takes for the system's printing and patterning behavior to stabilize (i.e., the time it takes for the system to fully warm up). During the stabilization period of the photolithography systems 100 and 190, various influences and fluctuations occur, such as thermal fluctuations, which can negatively affect the reproducibility of total pitch and overlay correction. In some cases, due to these various influences and fluctuations, it may take more than 8 hours for the photolithography systems 100 and 190 to stabilize their printing and patterning behavior. Furthermore, each system 100 and 190 contains numerous heat sources and components with different conductivity and thermal capacity, each of which can contribute to fluctuations, making it difficult to closely monitor the systems 100 and 190.

[0025]

[0032] During the stabilization period, systems 100 and 190 can be used to expose the substrate with precision and accuracy by utilizing model-based software correction to compensate for errors that occur during the stabilization period. The behavior of systems 100 and 190 can be modeled and calibrated to estimate potential variations that occur during the stabilization period, as shown in Figure 3 below, thereby improving the reproducibility of total pitch and overlay correction. Next, the model can be used to correct overlay and total pitch errors during subsequent stabilization periods of systems 100 and 190. By utilizing this model for dynamic position correction, costly hardware solutions can be eliminated or reduced. Furthermore, since position correction is applied to the digital mask, this model can be used for dynamic position correction.

[0026]

[0033] Figure 3 shows a method 300 for modeling and calibrating system behavior to estimate positional perturbations occurring during a stabilization period, according to embodiments disclosed herein. Method 300 can be used with photolithography systems 100 and 190 in Figures 1A and 1B, respectively.

[0027]

[0034] Method 300 begins with step 302, in which the photolithography system is started and enters a stabilization period. During the stabilization period, the printing and patterning behavior of the system may be unstable due to various influences and fluctuations such as variations in heat, pressure, and / or humidity. The stabilization period is the time it takes for the printing and patterning behavior of the system to stabilize (i.e., the time it takes for the system to fully warm up).

[0028]

[0035] In step 304, data and position readings are collected while the photolithography system is printing or exposing the substrate during the stabilization period. Data is continuously collected as the system aligns and exposes the substrate to simulate a production line. In one embodiment, the data collected is temperature data. Temperature data can be collected using one or more temperature sensors placed near components of the tool, such as encoders, whose temperature is known to fluctuate during heating and cooling. For example, about 20 temperature sensors can be placed on the photolithography tool to collect and monitor the temperatures of components such as the chuck, encoder, and bridge / riser.

[0029]

[0036] To collect position readings, alignment marks on a calibration plate or substrate (shown in Figure 5) can be periodically captured throughout the stabilization period. The calibration plate can be used as a reference during the stabilization period. Additionally or alternatively, changes in encoder counts relative to the interferometer reading used as a reference may be further periodically recorded. Then, position changes relative to the reference used are recorded.

[0030]

[0037] The pattern printing position on the substrate or calibration plate may be unintentionally disturbed due to thermal effects and fluctuations that occur during the stabilization period. Therefore, perturbations in position readings on the substrate or calibration plate can be directly related to temperature fluctuations. Other influences such as pressure and humidity can also cause perturbations in position readings. In such cases, sensors configured to collect pressure data, humidity data, etc., can be used instead of, or in addition to, the temperature sensor. However, we will use thermal effects as an example throughout this discussion.

[0031]

[0038] Figures 4A to 4F show examples of graphs of data measurements and position readings. Figures 4A to 4F are merely examples of data measurements and are not intended to be limiting. Figure 4A shows the change in Celsius temperature of the bridge and riser components in the system over a period of time at a stage speed of 200 mm / sec. Figure 4B shows the corresponding position marks along the y-axis in micrometers detected during heating of the bridge and riser components at a stage speed of 200 mm / sec, which illustrates position perturbation due to thermal effects. Figure 4C shows the change in Celsius temperature of the first bridge component, the second bridge component, and the riser components in the system over a period of time at a stage speed of 100 mm / sec. Figure 4D shows the corresponding position marks along the y-axis in micrometers detected during heating of the bridge and riser components at a stage speed of 100 mm / sec, which further illustrates y-axis position perturbation due to thermal effects. Figure 4E shows the temperature readings in Celsius for the master and slave motors that move the stage within the photolithography system over a certain period. Figure 4F shows the position marks detected along the x and y axes during the cooling period over a certain period. Figures 4A to 4F demonstrate that the behavior of the system during stabilization can be mathematically represented.

[0032]

[0039] Figure 5 shows an alignment configuration 500 according to one embodiment, comprising a first bridge component 504 and a second bridge component 506, each having a plurality of eyes 508 positioned on it. The alignment configuration 500 can be used to collect data for the graphs shown in Figures 4A to 4F above, and for the graphs shown in Figures 6A to 6C and 7A to 7C below. The first bridge component 504 and the second bridge component 506 are positioned on a substrate or plate 502. The plate 502 includes a plurality of alignment marks 510. Although 32 alignment marks 510 are shown, any number of alignment marks can be used. Furthermore, although two bridge components 504 and 506 are shown, additional bridge components may be used in the photolithography system, and each bridge component 504 and 506 may have more than four eyes positioned on it. The alignment configuration 500 may include an exposure unit having a camera (not shown) used to collect position readings.

[0033]

[0040] Figures 6A–6C show exemplary graphs of data measurements and position readings at a stage speed of 200 mm / second. Figures 7A–7C show exemplary graphs of data measurements and position readings at a stage speed of 100 mm / second. Figures 6A–6C and 7A–7C are merely examples of data measurements and are not intended to be limiting. The temperature and position data shown in the graphs of Figures 6A–6C and 7A–7C can be collected or measured using any number of temperature sensors and any number of position markers placed on the plate.

[0034]

[0041] Figures 6A and 7A show position marks detected along the x-axis in micrometers over a certain period of time during the stabilization period, indicating x-axis position perturbations due to thermal effects. Figures 6B and 7B show the temperatures in Celsius measured at two different locations on the system chuck over a certain period of time during the stabilization period. Figures 6C and 7C show the temperatures in Celsius of the system's first encoder, second encoder, and third encoder over a certain period of time during the stabilization period.

[0035]

[0042] In step 306, a model is created based on the collected data and location readings. The model may include more than one subset of the data, such as a model created to take into account the effects of temperature, pressure, and / or humidity. When creating the model, it is assumed that the system is linear or weakly nonlinear. The model may use effective heat capacity and transfer coefficient as model parameters. The model may further take into account that the system operates iteratively. The data graphed in one or more of Figures 4A–4F, Figures 6A–6C, and Figures 7A–7C may be used independently or in combination to help create the model.

[0036]

[0043] Furthermore, dynamic eye-to-eye and / or bridge-to-bridge models can be incorporated into the model being created. The model can capture variations in the eye centers relative to each other, or drift in separation between bridges such as the first and second bridge components 504, 506 and eye 508 in Figure 5. Dynamic eye-to-eye and / or bridge-to-bridge models can be empirical models, and the model parameters can be calibrated based on experimental results.

[0037]

[0044] Steps 302 and 304 may be repeated one or more times to collect a larger amount of data to be used to create the model. The model may be a cascaded transient model in which positional errors can be correlated with multiple sensor readings. The transient response of each component is determined by the component's thermal capacity or thermal mass and heat transfer characteristics. This empirical model of the cascade can then be used to represent the thermal effects of the system.

[0038]

[0045] The model is formed using the following variables or parameters: the position (x,y) where the position reading should be during the stabilization period without thermal influence, the position (x',y') where the position reading actually is due to thermal influence, an approximation of the perturbation of the position reading (Δx,Δy) (i.e., the difference between the position reading without thermal influence and the position reading with thermal influence), the initial temperature (T0), and the temperature change from the initial temperature reading (ΔT). In one embodiment, at least the initial temperature (T0) and the temperature change from the initial temperature reading (ΔT) must be known in order to form the model. Equations 1 to 4 can be used to estimate the position where the position reading actually is due to thermal influence. TIFF2023126759000002.tif39170

[0039]

[0046] In equations 3 and 4, Φ is the spatial mode, and α is the model transformation between temperature and the overall position change. The position perturbation (Δx, Δy) is formulated as a function of all temperature sensor readings, including both previous and current readings.

[0040]

[0047] In step 308, the model is calibrated. Model calibration may include continuously operating the photolithography system to model the stabilization period and keeping the photolithography system idle after the stabilization period to model the cooling period. The model is further calibrated by forming an optimization problem. The optimization problem is formed to obtain model parameters that minimize the overall cost function (C) (shown in Equation 7 below). The cost is defined as the sum of the differences between measured values ​​and model predicted values ​​at multiple temperature conditions representing multiple positions (x,y) and transitions. The optimization problem can be formed to minimize the cost function.

[0041]

[0048] The optimization problem is formed to determine multiple heat capacities and transfer coefficients of the system during the stabilization period. The input to the optimizer is the collected temperature readings and corresponding position errors at multiple locations. The output to the optimizer is a set of heat capacities and transfer coefficients. The optimizer can minimize the difference between the measured position on the substrate and the model-estimated position. The model can be calibrated using equations 5-7. Equations 5 and 6 are used for the model's prediction error, where x' meas and y' meas is the measured position change due to thermal effects. Equation 7 is the cost function, where K is the number of data points collected and L is the number of parameters calibrated. TIFF2023126759000003.tif36170

[0042]

[0049] In step 310, the calibrated model is used to estimate errors during the subsequent stabilization period, and these estimated errors are dynamically corrected. After the model is calibrated, it can be used during the subsequent stabilization period to correct for predicted position errors and perturbations due to thermal effects. As stated above, thermal effects are just one type of effect or variation that may be considered and are not intended as an exclusive example. Estimated position errors during the stabilization period can be corrected by dynamically modifying the digital mask of the photolithography system on the fly, rather than by any correction or modification made to the physical photolithography system itself. The correction of estimated position errors may be a dynamic digital correction applied plate by plate or substrate by substrate during exposure to the digital mask.

[0043]

[0050] The calibrated model can be further used to monitor the stability of the photolithography system. An alignment model that models the alignment of the digital mask can be formed based on the calibrated model. The alignment model can then be compared to the alignment of the digital mask during subsequent stabilization periods. The similarity metric can be used to determine whether the subsequent stabilization period is the same as the initial stabilization period used to create the model (i.e., whether the same positional perturbations occur in the subsequent stabilization period as in the initial stabilization period). The similarity metric can be used to determine the stability of the system by determining whether the same positional perturbations occur repeatedly. If the system is stable, the same errors occur repeatedly at the same point in time during the stabilization period, making it easier to estimate potential positional errors.

[0044]

[0051] In at least one embodiment, the model may be a machine learning model with model guidance, such as a neural network, or a problem. For example, if a large amount of data is available, a photolithography system can use multiple sensors and a large amount of data to pre-compensate for frequently occurring positional perturbations or errors before they occur during the subsequent stabilization period. The system can use the data, sensors, and / or model to estimate or determine frequently occurring errors and compensate for potential errors before they occur. After compensating for frequently occurring perturbations or errors, the system can further compare the current printing position to the model to determine whether the compensation has actually corrected the potential errors and make additional adjustments as needed. Thus, instead of correcting errors on the fly when they occur, the system can use machine learning algorithms to pre-compensate for potential errors before they occur.

[0045]

[0052] Using the methods described above, the behavior of a photolithography system can be accurately modeled and calibrated to estimate positional perturbations occurring during the stabilization period, thereby improving the reproducibility of total pitch and overlay corrections. The model can then be used to adjust the digital mask, allowing for on-the-fly correction of overlay and total pitch errors during the system's subsequent stabilization period. Furthermore, if a large amount of data is available to the system, it can use a machine learning model with model guidance to proactively compensate for potential positional perturbations or errors before they occur.

[0046]

[0053] By utilizing this model for dynamic position correction, costly hardware solutions can be eliminated or reduced. Since position correction is applied to a digital mask, this model is easily usable for dynamic position correction. Furthermore, because the model is a software-based solution, new model formats can be developed to include new influences that were not previously included or covered, or to include additional sensors that were not initially available. In this way, photolithography systems can be precisely utilized for the exposure of plates or substrates during their stabilization periods.

[0047]

[0054] While the foregoing is directed toward embodiments of the present disclosure, other further embodiments of the present disclosure can be devised without departing from its basic scope, the scope of which is determined by the following claims.

Claims

1. A photolithography system, comprising: one or more stages, each stage configured to support one substrate or one calibration plate; a plurality of temperature sensors disposed in the photolithography system and configured to collect temperature data; a projection device disposed above the one or more stages and configured to print on one or more substrates or one or more calibration plates; wherein the photolithography system is configured to: enter a stabilization period; print on one or more substrates during the stabilization period; and dynamically correct an estimated positional error of alignment marks on the one substrate or the one calibration plate using a model created and calibrated during one or more previous stabilization periods while printing the one or more substrates or the one or more calibration plates during the stabilization period, wherein the correction of the estimated positional error is a dynamic correction applied for each substrate or each calibration plate. A photolithography system.

2. During the one or more previous stabilization periods, the photolithography system is further configured to collect the data including the temperature data collected using the plurality of temperature sensors and the position readings of the alignment marks when the projection device prints on one or more substrates or one or more calibration plates, and to collect the data and the position readings for creating the model based on the position readings of the alignment marks. The photolithography system according to claim 1.

3. The model is formed using each parameter of the following group: the position where the position readings should be without thermal influence during the one or more previous stabilization periods, the position where the position readings actually are due to thermal influence, an approximation of the perturbation of the position readings, the initial temperature of the photolithography system, and the measured temperature change from the initial temperature after a predetermined time has elapsed. The photolithography system according to claim 2. **Claim 4**: The photolithography system according to claim 2, wherein the temperature data is collected during the heating and cooling periods of the one or more previous stabilization periods. **Claim 5** A plurality of pressure sensors arranged in the photolithography system and configured to collect pressure data, wherein the collected data includes the pressure data, and a pressure sensor; The photolithography system according to claim 2, further comprising: a plurality of humidity sensors arranged in the photolithography system and configured to collect humidity data, wherein the collected data includes the humidity data. **Claim 6** The photolithography system according to claim 1, wherein the model is a cascade transition model. **Claim 7** The photolithography system according to claim 1, wherein when printing the one or more substrates during the stabilization period, the dynamic correction enhances at least one of accuracy and precision. **Claim 8** A photolithography system, comprising: One or more stages, each stage configured to support one substrate or one calibration plate; A plurality of temperature sensors arranged in the photolithography system and configured to collect temperature data; A projection device arranged above the one or more stages and configured to print on one or more substrates or one or more calibration plates; The photolithography system is configured to: Enter a stabilization period; Estimate a positional error of alignment marks on the one substrate or the one calibration plate during the stabilization period using a model created and calibrated during one or more previous stabilization periods; Print one or more substrates during the stabilization period; and Dynamically correct the estimated positional error of the alignment marks using the calibrated model during the stabilization period while printing the one or more substrates or the one or more calibration plates, wherein the correction of the estimated positional error is a dynamic correction applied for each substrate or each calibration plate. Claim 9 During the one or more previous stabilization periods, the photolithography system collects data including the temperature data collected using the plurality of temperature sensors when the projection apparatus prints on one or more substrates or one or more calibration plates during the one or more previous stabilization periods, and collects position readings of the alignment marks, creates a model based on the data and the position readings, calibrates the model, The photolithography system according to claim 8, further configured to perform the above. Claim 10 The model is formed using each parameter of the following group: the position where the position readings should be during the one or more previous stabilization periods without thermal effects, the position where the position readings actually are due to thermal effects, an approximation of the perturbation of the position readings, the initial temperature of the photolithography system, and the measured temperature change from the initial temperature after a predetermined time has elapsed. The photolithography system according to claim 9. Claim 11 A plurality of pressure sensors arranged in the photolithography system and configured to collect pressure data, wherein the collected data includes the pressure data, and pressure sensors, A plurality of humidity sensors arranged in the photolithography system and configured to collect humidity data, wherein the collected data includes the humidity data. The photolithography system according to claim 9, further comprising humidity sensors. Claim 12 The temperature data is collected during the heating and cooling periods of the one or more previous stabilization periods. The photolithography system according to claim 9. Claim 13 When printing the one or more substrates during the stabilization period, the dynamic correction enhances at least one of accuracy and precision. The photolithography system according to claim 8. Claim 14 The model is a cascade transient model. The photolithography system according to claim 8. Claim 15 A photolithography system, One or more stages, each stage being configured to support one substrate or one calibration plate. One or more stages, A plurality of temperature sensors arranged in the photolithography system and configured to collect temperature data; A projection device arranged above the one or more stages and configured to print on one or more substrates or one or more calibration plates; The photolithography system; Entering a stabilization period; Using a model and an optimization problem to estimate the positional error of alignment marks on the one substrate or the one calibration plate during the stabilization period, wherein the model and the optimization problem are created during one or more previous stabilization periods, and the optimization problem determines the heat capacity and transfer rate of the photolithography system, estimating the positional error of the alignment marks; Printing one or more substrates during the stabilization period; and Dynamically correcting the estimated positional error of the alignment marks using the model and the optimization problem during the stabilization period while printing the one or more substrates or the one or more calibration plates, wherein the correction of the estimated positional error is a dynamic correction applied for each substrate or each calibration plate, dynamically correcting the estimated positional error of the alignment marks; A photolithography system configured to perform the above.

16. During the one or more previous stabilization periods, the photolithography system Collecting data including the temperature data collected using the plurality of temperature sensors and the positional reading values of the alignment marks when the projection device prints on one or more substrates or one or more calibration plates during the one or more previous stabilization periods; Forming the optimization problem to determine the heat capacity and transfer rate of the photolithography system; Creating the model based on the data and the positional reading values; The photolithography system according to claim 15, further configured to perform the above.

17. The photolithography system according to claim 16, wherein the model is formed using each parameter of the following group: the position where the position reading value should be during the one or more previous stabilization periods without thermal influence, the position where the position reading value actually is due to thermal influence, an approximation of the perturbation of the position reading value, the initial temperature of the photolithography system, and the measured temperature change from the initial temperature after a predetermined time has elapsed.

18. A plurality of pressure sensors arranged in the photolithography system and configured to collect pressure data, wherein the collected data includes the pressure data, and the pressure sensors, A plurality of humidity sensors arranged in the photolithography system and configured to collect humidity data, wherein the collected data includes the humidity data, and further includes humidity sensors, the photolithography system according to claim 16.

19. The photolithography system according to claim 16, wherein the temperature data is collected during the heating period and the cooling period of the stabilization period.

20. When printing the one or more substrates during the stabilization period, dynamic correction enhances at least one of accuracy and precision, the photolithography system according to claim 15.

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