Substrate holding device, substrate holding method, and lithography device

Abstract

To provide a substrate holding device capable of shortening the time required to determine whether suction assistance for a substrate is necessary.SOLUTION: A substrate holding device that includes a holding portion that attracts and holds a substrate, pushes a warped portion of the substrate on the holding portion toward the holding portion, and can absorb the substrate includes a determination portion that determines whether to push the warped portion of the substrate toward the holding portion on the basis of first information including information related to the deformability of the substrate and second information including information related to the amount of warpage of the substrate.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a substrate holding apparatus, a substrate holding method and a lithographic apparatus. [Background technology]

[0002] In the manufacturing process of semiconductor devices, liquid crystal display devices, etc., a substrate holding device is used that sucks and holds a substrate by reducing the pressure in the space between the back surface of the substrate and the substrate holding device. This type of device may not be able to suck the substrate when the substrate is warped.

[0003] Patent Documents 1 and 2 disclose substrate holding devices that perform suction assistance so that substrates can be adsorbed even if they are warped. The device described in Patent Document 1 determines whether suction assistance is necessary based on the suction state of the substrate. If the substrate cannot be adsorbed even after the space between the back surface of the substrate and the device is depressurized, it determines that suction assistance is necessary, and performs suction assistance by pushing the warped portion of the substrate toward the device when depressurizing the space to reduce the amount of warping. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 6122299 [Patent Document 2] Patent No. 4513960 Summary of the Invention [Problem to be solved by the invention]

[0005] In the method of Patent Document 1, since an operation of sucking the substrate is performed in order to determine whether or not suction assistance is required, it takes time to determine whether or not suction assistance is required.

[0006] SUMMARY OF THE PRESENT DISCLOSURE An object of the present invention is to provide a substrate holding device capable of shortening the time required to determine whether or not assistance in suctioning a substrate is required. [Means for solving the problem]

[0007] In order to achieve the above-mentioned object, one aspect of the present invention provides a substrate holding device having a holding portion for adsorbing and holding a substrate, and capable of pushing a warped portion of the substrate on the holding portion toward the holding portion and adsorbing the substrate, the substrate holding device being characterized in having a judgment portion that judges whether or not to push the warped portion of the substrate toward the holding portion based on first information including information related to the ease of deformation of the substrate and second information including information related to the amount of warping of the substrate.

[0008] Further objects or other aspects of the present invention will become apparent from the embodiments described below with reference to the drawings. Effect of the Invention

[0009] According to the present invention, it is possible to reduce the time required to determine whether or not assistance in suctioning a substrate is required. [Brief description of the drawings]

[0010] [Figure 1] 1 is a schematic view showing a configuration of a substrate processing apparatus in a first embodiment. [Diagram 2] FIG. 1 is a diagram showing a configuration of a substrate holding device in a first embodiment. [Diagram 3] 3A to 3C are diagrams illustrating a configuration of a holding section in the first embodiment. [Figure 4] 3 is an example of a database stored in a storage unit in the first embodiment. [Diagram 5] 5 is a flowchart for determining whether or not suction assistance for a substrate is required in the first embodiment. [Figure 6] 6 is a detailed flowchart of a process for determining whether or not assistance with suction of a substrate is required in the first embodiment. [Figure 7] 6 is a detailed flowchart of a process for determining whether or not assistance with suction of a substrate is required in the first embodiment. [Figure 8] 4 shows an example of an arrangement of a plurality of measurement positions for measuring the amount of warpage of a substrate in the first embodiment. [Figure 9] 4 is an example of a comparison table between similarities and weighting coefficients α in the first embodiment. [Figure 10] 13 is an example of adjusting the suction force and suction timing of the exhaust port in the second embodiment. [Figure 11] 13 is a flowchart showing a process for determining a suction assistance method in the second embodiment. [Figure 12] 10 is a flowchart of a method for manufacturing an article in a third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Note that the following embodiment does not limit the invention according to the claims. Although the embodiment describes a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0012] In addition, in this specification and drawings, directions are basically indicated by an XYZ coordinate system in which the vertical direction is the Z axis and the horizontal plane perpendicular to the vertical direction is the XY plane, and the axes are mutually orthogonal. However, if there is an XYZ coordinate system depicted in each drawing, that coordinate system takes precedence.

[0013] A specific configuration will be described below for each embodiment.

[0014] First Embodiment FIG. 1 is a schematic diagram showing the configuration of a substrate processing apparatus 1 in this embodiment. In this embodiment, the substrate processing apparatus 1 is a projection exposure apparatus that exposes a pattern of an original (mask, reticle) onto a substrate via a projection optical system by a step-and-repeat method or a step-and-scan method. However, the substrate processing apparatus 1 is not limited to a projection exposure apparatus. For example, the substrate processing apparatus 1 may be a drawing apparatus that draws on a substrate using an electron beam or an ion beam, etc., to form a pattern on the substrate. The substrate processing apparatus 1 may also be another lithography apparatus, for example, an imprint apparatus that forms a pattern on the substrate by molding an imprint material on the substrate using a mold. Alternatively, the substrate processing apparatus 1 may be another apparatus for processing a substrate such as a semiconductor wafer or a glass plate, such as an ion implantation apparatus, a development apparatus, an etching apparatus, a film formation apparatus, an annealing apparatus, a sputtering apparatus, or a deposition apparatus. The substrate processing apparatus 1 may also be a planarization apparatus that planarizes a composition on a substrate using a flat plate.

[0015] The substrate processing apparatus 1 includes an illumination optical system 11 for irradiating light, a projection optical system 14, a reticle stage 13 for holding a reticle 12, a substrate holding device 2 including a pressing unit 60, a holding unit (adsorption unit) 20, and a control unit (determination unit) 18, and a stage 16. The reticle 12 is an original plate having a pattern (e.g., a circuit pattern) to be transferred to a surface of, for example, quartz glass, formed of chrome. The substrate 15 is, for example, single crystal silicon, and when the substrate processing apparatus 1 is an exposure apparatus, the substrate 15 transported to the substrate processing apparatus 1 has a photosensitive material (resist) applied on its surface. The stage 16 is configured so that the holding unit 20 is placed thereon and can move in the XY directions.

[0016] In the substrate processing apparatus 1, exposure light from a light source (not shown) passes through an illumination optical system 11 and illuminates a reticle 12 held on a reticle stage 13. The light transmitted through the reticle 12 passes through a projection optical system 14 and is irradiated onto a substrate 15. At this time, an image of the pattern formed on the reticle 12 is formed on the surface of the substrate 15. The substrate processing apparatus 1 exposes a shot area on the substrate 15 in this manner, and performs similar exposure on each of a plurality of shot areas.

[0017] The pressing unit 60 is an auxiliary member for assisting suction when the substrate 15 cannot be held even if the space between the holding unit 20 and the substrate 15 is decompressed due to the substrate 15 being warped. When suction assistance is required, the pressing unit 60 (auxiliary member) presses (presses) the warped portion of the substrate 15 toward the holding unit. By having a stage in which the pressing unit 60 presses the warped portion of the substrate 15 toward the holding unit, it is possible to eliminate warping of the substrate 15 or reduce the amount of warping of the substrate 15 to bring it closer to a flat shape. Then, even if the substrate 15 is warped on the holding unit, the holding unit 20 can suction and hold the substrate 15. The pressing unit 60 is, for example, a flat plate as described in Patent Document 1, or a tool having a shape with multiple pins as described in Patent Document 2, and moves to the upper side of the holding unit 20 and the substrate 15 when pressing is performed when suction assistance is required to hold the substrate 15. Here, the control unit 18 controls the stage 16 and the members that move the pressing unit 60 so that the relative positions of the position of the substrate 15 and the position where the pressing unit 60 applies pressure coincide with each other in the Z-axis direction. The control unit 18 then controls the pressing unit 60 to lower (move downward) by a preset amount of lowering so that the pressing unit 60 presses the substrate 15 (pushes it toward the holding unit 20). The amount of lowering at this time is preset by the user, and for example, the amount of lowering (movement) may be the length obtained by subtracting the thickness of the substrate 15 from the distance in the Z-axis direction between the position when the pressing unit 60 starts the pressing operation and the surface of the holding unit 20 that holds the substrate 15. The user inputs the amount of lowering of the pressing unit 60 from an input unit, which will be described later.

[0018] 2 is a diagram showing the configuration of the substrate holding device 2 in this embodiment. The substrate holding device 2 in this embodiment includes a holding unit 20 that holds a substrate, an information acquiring unit 17, a control unit (determining unit) 18, a storage unit 19, and a pressing unit 60. The information acquiring unit 17 acquires first information (third information) including one or more pieces of information related to the thickness, outer diameter, and material of the substrate, which are characteristics of the substrate 15, and second information (fourth information) including information related to the amount of warping of the substrate 15. Here, the first information (third information) is also information related to the ease of deformation of the substrate. The information related to the material may be information on the type or hardness of the substrate 15.

[0019] Here, examples of the thickness, outer diameter, material, and amount of warping of the substrate 15 in this embodiment will be described. First, the thickness of the substrate 15 in this embodiment may be, for example, the thickness of the substrate 15 itself before the photosensitive material is applied, or may be a thickness including the thickness of the substrate 15 and the photosensitive material after the photosensitive material is applied. Alternatively, the thickness measured at a predetermined location of the substrate 15 (for example, the center of the substrate 15) may be used, or if the thickness of the substrate 15 can be known in advance from information on the previous process, that thickness may be used. The outer diameter of the substrate 15 may be, for example, the outer diameter at a position that does not include a position that serves as a mark for alignment such as an orientation flat or a notch, or the length of a perpendicular line to the orientation flat that passes through the center position of the substrate 15 may be used. For example, the hardness may be measured and the measurement result may be used for the material of the substrate 15, or a name such as "silicon" may be used and an evaluation value determined in advance based on the hardness or the like may be used for each material, and the evaluation value may be used as the material. The amount of warping of substrate 15 may be, for example, the difference in position in the Z direction between a predetermined position of substrate 15 determined in advance by the user and a reference position when substrate 15 is placed in a predetermined position. Although examples of the thickness, outer diameter, material, and amount of warping of substrate 15 have been described above, the method of determining the thickness, outer diameter, material, and amount of warping of substrate 15 is not limited to the above examples, and it is sufficient that the method of determining the thickness, outer diameter, material, and amount of warping of substrate 15 is the same for each substrate.

[0020] In this embodiment, information including one or more pieces of information related to the thickness, outer diameter, and material of the substrate 15 to be currently adsorbed is described as first information. Information including one or more pieces of information related to the thickness, outer diameter, and material of another substrate stored in the storage unit 19 that is not the substrate 15 to be currently adsorbed is described as third information. Information including information related to the amount of warping of the substrate 15 to be currently adsorbed is described as second information. Information including information related to the amount of warping of another substrate stored in the storage unit 19 that is not the substrate 15 to be currently adsorbed is described as fourth information.

[0021] The information acquiring unit 17 may be configured to include an input unit, and a user may input the first information (third information) and the second information (fourth information) from the input unit. In this case, the input unit is, for example, disposed on the outer surface of a chamber (not shown) surrounding the substrate processing apparatus 1, and connected to the storage unit 19. The information acquiring unit 17 may also include a laser displacement meter or an interferometer for acquiring the second information, and the information acquiring unit 17 may measure the amount of warping of the substrate 15 and directly acquire the second information. Alternatively, the storage unit 19 may acquire the first information and the second information (the third information and the fourth information) directly, without going through the information acquiring unit 17. For example, the storage unit 19 may acquire the information by being notified by a separate device (for example, a device used in a process immediately before the substrate processing apparatus 1), a separate storage device, or a host system, by wire or wirelessly. The host system is, for example, a system through which information is transmitted and received between the substrate processing apparatus 1 and a separate device or system.

[0022] Here, an example of a method for measuring the amount of warpage of the substrate 15 will be described. The substrate 15 is supported by a support portion (not shown) smaller than the outer diameter of the substrate 15, with the center of the substrate 15 as a fulcrum. Then, a laser displacement meter or interferometer arranged at a position not in contact with the substrate 15, below or above the substrate 15, and near the outer periphery of the substrate 15 measures the distance between the substrate 15 and the laser displacement meter or interferometer. For example, when the substrate 15 is warped in a convex shape and the laser displacement meter or interferometer is arranged below the substrate 15, the distance between the laser displacement meter or interferometer and the substrate 15 is shorter than that of a substrate that is not warped. On the other hand, when the substrate 15 is warped in a concave shape and the laser displacement meter or interferometer is arranged below the substrate 15, the distance between the laser displacement meter or interferometer and the substrate 15 is longer than that of a substrate that is not warped. The substrate 15 is rotated by the support portion, and the laser displacement meter or interferometer measures the distance between each of a plurality of points along the circumferential direction near the outer periphery of the substrate 15 and the laser displacement meter or interferometer. Then, the control unit 18 derives the difference between the measured distance and the reference distance, and the derived result is regarded as the amount of warping of the substrate 15. Here, the reference distance may be, for example, a distance measured by a laser displacement meter or an interferometer at a flat, unwarped position of the substrate 15. Note that in this embodiment, an example has been shown in which the distance measured by a laser displacement meter or an interferometer at a predetermined position in the substrate surface is regarded as the amount of warping, but, for example, the inclination angle of the substrate 15 may be measured by a sensor, and this inclination angle may be regarded as the amount of warping. In this case, when the substrate 15 is not warped and is nearly flat, the inclination angle is close to 0 degrees, and the more the substrate 15 is warped, the larger the inclination angle becomes.

[0023] FIG. 3 is a diagram showing the configuration of the holding unit 20 in this embodiment. FIG. 3(a) is a diagram showing the holding unit 20 as an example of this embodiment as viewed from above. The holding unit 20 in this embodiment includes boundaries (also called boundary parts or banks) 21-23, exhaust ports 31-33 for discharging the sucked gas, and substrate transfer pin lifting ports 37-39. By having a plurality of exhaust parts with exhaust ports, the suction of the substrate can be controlled for each exhaust port, and the substrate can be suctioned in a shape close to a desired shape. In addition, the three regions divided by the boundaries 21-23 are vacuum suction regions 25-27. In this embodiment, the boundaries 21-23 are each annular in shape, and the vacuum suction region is divided into the vacuum suction regions 25-27 by these boundaries. Specifically, the vacuum suction region is divided into three regions: a circular vacuum suction region 25, a circular vacuum suction region 26 surrounding the vacuum suction region 25, and a circular vacuum suction region 27 surrounding the vacuum suction region 26. The exhaust port 31 mainly exhausts the gas in the vacuum suction region 25, the exhaust port 32 mainly exhausts the gas in the vacuum suction region 26, and the exhaust port 33 mainly exhausts the gas in the vacuum suction region 27.

[0024] Here, the configuration of the holding unit 20 shown in FIG. 3(a) is one example of this embodiment, and the numbers, shapes, and arrangements of the vacuum suction areas 25-27, the exhaust ports 31-33, the boundaries 21-23, and the substrate transfer pin lifting and lowering ports 37-39 are not limited to these. For example, the boundaries 21-23 do not have to be annular, and the boundary 23 does not necessarily have to be located on the outer periphery of the holding unit 20. For example, the boundary 23 may be located at a position closer to the center than the outer periphery of the holding unit 20. The shape (divided shape) of each of the multiple regions constituting the vacuum suction area does not have to be a circle or annular shape, and for example, each region may be rectangular, and the divided shape may be a shape other than a circle, annular, or rectangular.

[0025] FIG. 3(b) is an explanatory diagram showing a cross-sectional view of the holding unit 20 including a line segment A-A' in the X direction parallel to the ZX plane shown in FIG. 3(a) and a schematic diagram of an exhaust system for vacuum suction. In FIG. 3(b), the substrate transfer pin lifting openings 37-39 are openings for lifting and lowering the substrate transfer pins 40 when transferring the substrate 15 between the substrate transfer hand (not shown). The substrate transfer hand places the substrate 15 on the substrate transfer pins 40 that have been lifted from the substrate transfer pin lifting openings 37-39. After the substrate transfer hand retreats, the substrate transfer pins 40 are lowered to place the substrate 15 on the holding unit 20. The substrate transfer pins 40 may not be driven, but the holding unit 20 may be lowered and raised to place the substrate 15 on the holding unit 20.

[0026] As shown in FIG. 3(b), the vacuum suction regions 25-27 are filled with a large number of small projections (pins) for supporting the substrate 15 during suction. The exhaust ports 31-33 are connected to vacuum pumps 51-53. The pressure sensors 54-56 arranged in the gas flow paths from the exhaust ports 31-33 respectively measure the pressure of the flow paths, thereby indirectly measuring the pressure of the vacuum suction regions 25-27. The control unit 18 controls the vacuum pumps 51-53 based on the measurement values ​​of the pressure sensors 54-56, and causes the substrate 15 to be suctioned to the holder 20. Note that the configuration of the pressure sensors 54-56 for measuring the pressure of each vacuum suction region shown in FIG. 3(b) is an example of this embodiment, and the pressure sensors 54-56 may be arranged in the minimum necessary system, not in the entire exhaust port system, and are not limited to this.

[0027] The storage unit 19 stores the information acquired by the information acquisition unit 17 and the information acquired when the substrate 15 is adsorbed to the holder 20. The information acquired when the substrate 15 is adsorbed to the holder 20 includes fifth information including information related to the adsorption state when the holder 20 adsorbs the substrate, and sixth information including information related to the presence or absence of adsorption assistance when the substrate is adsorbed (whether the warped portion of the substrate is pressed or not). The fifth information may be information on whether the holder 20 has completed holding the substrate, or may be information on the measured values ​​of the pressure sensors 54 to 46. When the fifth information is information on the measured values ​​of the pressure sensors 54 to 56, the fifth information includes the result (information) of the control unit 18 determining whether the substrate has been held. Specifically, the fifth information includes the result (information) of the control unit 18 comparing the measured values ​​of the pressure sensors 54 to 56 with a threshold value preset by the user and determining whether the holder 20 has completed holding the substrate according to the comparison result. For example, when the measurement values ​​of the pressure sensors 54-56 are based on atmospheric pressure, if the absolute values ​​of the measurement values ​​of each sensor are equal to or greater than the threshold, it is determined that the holding part 20 has adsorbed and completed holding the substrate. If the absolute value of any of the measurement values ​​of the pressure sensors 54-46 is less than the threshold, it is determined that the holding part 20 has not completed holding the substrate.

[0028] Here, the control based on the information stored in the memory unit 19 of the control unit 18 will be described. The memory unit 19 stores a database including a plurality of sets of previously stored third to sixth information (substrate information), and also stores the first information and the second information of the substrate 15 to be sucked this time. The control unit 18 refers to this database based on the first information and the second information to determine whether or not suction assistance is required (whether or not the warped portion of the substrate 15 is pressed toward the holder 20 by the pressing unit 60), and controls the operation when sucking the substrate 15 based on the determination. Then, the new fifth and new sixth information (additional fifth and sixth information) obtained when the substrate 15 to be sucked this time is sucked, and the first and second information are newly added to the database as a set. In other words, the necessity of suction assistance for the first substrate is determined based on the database (first determination step). Then, based on the database to which the substrate information when the first substrate is adsorbed (first adsorption process) has been added, it is determined whether or not adsorption assistance is required for a second substrate different from the first substrate (second determination process), and the second substrate is adsorbed (second adsorption process).

[0029] FIG. 4 is an example of a database stored in the storage unit 19 in this embodiment. In the example of FIG. 4, the third information, which is information on the thickness, outer diameter, and material of the substrate, and the fourth information, which is information on the amount of warping of the substrate, are stored. Then, linked to the third and fourth information, the fifth information, which is information related to the suction state when the substrate is sucked, and the sixth information, which is information related to the presence or absence of suction assistance when the substrate is sucked, are stored. In the example of FIG. 4, six sets of substrate information are stored, but this substrate information is appropriately updated every time the substrate is sucked and held, and the number of stored sets can be increased. The control unit 18 determines whether or not suction assistance is required based on the database as shown in FIG. 4.

[0030] In this embodiment, the control unit 18 and the memory unit 19 control the substrate holding device 2 and store information, but they may also control the exposure process performed in the substrate processing apparatus 1 and store information on the exposure process history. In other words, it is possible to adopt a configuration in which a control unit (main control unit) that controls the entire substrate processing apparatus 1 also controls the substrate holding device 2, which is one of the multiple units that make up the substrate processing apparatus 1. It is also possible to adopt a configuration in which a memory unit (main memory unit) of the substrate processing apparatus 1 stores information related to the substrate holding device 2. The control unit 18 in this embodiment also serves as a determination unit that determines whether or not assistance is required for suction of the substrate 15.

[0031] FIG. 5 is a flow chart of the determination of the necessity of suction assistance for the substrate in this embodiment. First, the control unit 18 determines whether the warpage amount included in the second information of the substrate 15 to be sucked this time is equal to or greater than a threshold (S10). Here, the threshold is set in advance by the user, and the user may set it based on an experimental value, or if the threshold can be derived from a design value, it may be set based on the derived value. In step S10, if the warpage amount is equal to or greater than the threshold, the control unit 18 performs suction assistance to suck the substrate 15 (S11), and ends the process. If the warpage amount is less than the threshold, the control unit 18 determines whether there is substrate information including information that matches the first information and second information of the substrate 15 to be sucked this time among the substrate information stored in the storage unit 19 (S12). If there is substrate information including information (third information and fourth information) that matches the first information and second information of the substrate 15 to be sucked this time, the control unit 18 determines whether there is a need for suction assistance based on the substrate information including the matching information (S13), and ends the process. If there is no substrate information including information that matches the first information and second information of the substrate 15 to be currently adsorbed, it is determined whether there is substrate information including information that matches the first information of the substrate 15 to be currently adsorbed (S14). If there is substrate information including information that matches the first information of the substrate 15 to be currently adsorbed, it is determined whether or not suction assistance is required based on the substrate information including the matching information (S15), and the process ends. If there is no substrate information including information that matches the first information of the substrate 15 to be currently adsorbed, it is determined whether or not suction assistance is required based on substrate information similar to the first information (S16). A method for identifying similar substrate information will be described later. In this way, the control unit 18 determines whether or not suction assistance is required based on the first information and the second information.

[0032] 6 and 7 are detailed flowcharts of the determination of whether or not suction assistance is required for the substrate 15 in this embodiment, and are more detailed descriptions of the flowchart shown in FIG. 5. In FIG. 6, the control unit 18 determines whether or not the amount of warping included in the second information of the substrate 15 to be sucked this time is equal to or greater than a threshold (S110). Here, the threshold is set in advance by the user, and the user may set the threshold based on an experimental value, or if the threshold can be derived by simulation from design values ​​such as the suction force when the substrate holding device 2 sucks the substrate 15, the derived threshold may be set. In step S110, if the amount of warping is equal to or greater than the threshold, the control unit 18 determines that suction assistance is required (it is necessary to push the warped portion of the substrate 15 toward the holding unit 20), and proceeds to step S200.

[0033] If the amount of warpage is less than the threshold in step S110, it is determined whether or not there is any board information having third information and fourth information whose values ​​match the first information and second information of board 15 to be currently adsorbed among the board information stored in storage unit 19 (S120). If there is any matching board information, it is determined whether or not the fifth information of the matching board information indicates that holding of the board has been completed (S130).

[0034] If it is determined in step S130 that the fifth information indicates that the substrate has been held, then the substrate of the substrate information having the third information and the fourth information, whose numerical values ​​match the first information and the second information of the substrate 15 to be adsorbed this time, has been previously held. Therefore, it can be seen that the substrate can be adsorbed under the same suction assistance conditions as the substrate that has been previously held. Here, adsorption under the same suction assistance conditions includes, for example, when the substrate has been previously held without suction assistance, the substrate 15 to be adsorbed this time is also adsorbed without suction assistance. Therefore, the substrate 15 is adsorbed and held by the holder 20 under the same conditions as the sixth information of the substrate information, whose first information, second information, third information, and fourth information of the substrate 15 to be adsorbed this time, stored in the memory unit 19, match (S140). Then, the control unit 18 determines whether the substrate 15 has been adsorbed (S150).

[0035] On the other hand, if it is determined in step S130 that the fifth information does not indicate that holding of the substrate has been completed, this means that holding of the substrate having the third information and fourth information that match the first information and second information of the substrate 15 to be adsorbed this time was not completed in the past. Therefore, the control unit 18 performs control to perform suction assistance to adsorb the substrate 15 (S200), and determines whether or not the substrate 15 has been adsorbed (S150).

[0036] If it is determined in step S150 that the substrate 15 cannot be adsorbed, the control unit 18 determines whether or not the substrate 15 has been adsorbed by performing suction assistance (S180). If the substrate 15 cannot be adsorbed by performing suction assistance, there is an abnormality in the substrate 15 or the substrate holding device 2, so the control unit 18 stores this as an error (S190) and ends the process. If an error is stored in step S190 and the process ends, the substrate 15 is automatically or manually discharged outside the substrate processing device 1 without being subjected to substrate processing by the substrate processing device 1. Here, the control unit 18 may, after storing this as an error in the storage unit 19, display error information on a display unit (not shown) or the like or may notify the user of the occurrence of the error by an alarm sound. If the substrate 15 cannot be adsorbed without performing suction assistance in step S180, the control unit 18 controls the substrate 15 to be adsorbed by performing suction assistance (S200).

[0037] If the substrate can be adsorbed in step S150, the control unit 18 judges whether the storage unit 19 stores substrate information in which the first information, second information, fifth information, and sixth information of the substrate 15 adsorbed this time all match the third to sixth information (S160). If the substrate information is stored in step S160, there is no need to store the same information, and the process ends without storing new information. If the substrate information in which the first information, second information, fifth information, and sixth information of the substrate 15 all match the third to sixth information is not stored, the information of the substrate 15 adsorbed this time is added to the information stored in the storage unit 19, and the database is updated. Specifically, the storage unit 19 stores the first information, second information, fifth information, and sixth information of the substrate 15 adsorbed this time as a new set of the third to sixth information (substrate information) (S170), and the process ends. If the process ends with the substrate 15 appropriately held by the holder 20, the substrate 15 is subjected to substrate processing (for example, exposure processing).

[0038] In step S120, if the database stored in storage unit 19 does not contain substrate information including third information and fourth information that match the first information and second information of substrate 15 to be currently adsorbed, the substrate information stored in storage unit 19 is compared with the first information of substrate 15. Specifically, it is determined whether or not there is substrate information whose third information matches the first information of substrate 15 to be currently adsorbed among the multiple pieces of substrate information stored in storage unit 19 (S210).

[0039] When it is determined that there is substrate information whose third information among the substrate information stored in the storage unit 19 matches the first information of the substrate 15 to be currently adsorbed, an evaluation value S is derived. Specifically, the evaluation value S is derived based on the fourth information among the substrate information having the third information matching the first information of the substrate 15 to be currently adsorbed and the second information of the substrate 15 to be currently adsorbed (S270). Note that a specific method of deriving the evaluation value S in step S270 will be described later. Then, the control unit 18 selects the substrate information A with the smallest evaluation value S (S280).

[0040] Next, the control unit 18 judges whether or not the fifth information of the substrate information A indicates that the substrate has been held (S290). If it is judged in step S290 that the substrate has been held, it means that the substrate has been held at the time when the substrate information A was stored, and it is found that the substrate 15 should be adsorbed under the same suction assistance conditions as those of the substrate information A. Therefore, the substrate 15 is adsorbed and held by the holder 20 under the same conditions (with or without suction assistance) as those of the sixth information of the substrate information A (S300), and the process proceeds to step S150. If it is judged in step S290 that the fifth information of the substrate information A does not indicate that the substrate has been held, it means that the substrate corresponding to all of the information of the third to sixth information of the substrate information A has not been held in the past. Therefore, the control unit 18 judges that it is necessary to perform suction assistance to adsorb the substrate 15, and the process proceeds to step S200.

[0041] In step S210, the control unit 18 may determine that no substrate information whose third information matches the first information of the substrate 15 to be currently adsorbed is stored in the storage unit 19. In this case, two or more pieces of substrate information having third information similar to the first information of the substrate 15 to be currently adsorbed (hereinafter also referred to as "similar substrate information") are selected from the plurality of substrate information stored in the storage unit 19 (S220).

[0042] Here, a method for identifying third information similar to the first information will be described. The user preselects an item for determining the similarity from among the items included in the first information (e.g., the thickness of the board), and sets a threshold for evaluating the difference between the first information and the third information for the selected item. Then, the difference between the first information and the third information for the selected item is obtained, and if the obtained difference is equal to or greater than the threshold, the first information and the third information are deemed not to be similar. If the obtained difference is less than the threshold, the first information and the third information are deemed to be similar, and board information having this third information is selected as similar board information.

[0043] In addition, a plurality of items for determining the degree of similarity may be provided, and in such a case, the third information having a greater number of items in which the difference between the first information and the third information is less than the threshold among the plurality of items is determined to be the third information similar to the first information. Here, the number of items in which the difference between the first information and the third information is less than the threshold when determining that they are similar is set in advance by the user. For example, in a case where the first information and the third information have three pieces of information on the thickness, outer diameter, and material of the board, the number of items to be determined to be similar is set to 2, and if there are two or more items in which the difference between the first information and the third information is less than the threshold, the third information is determined to be similar to the first information.

[0044] As explained above, the smaller the difference between the first information and the third information in a specific item related to the ease of deformation of the board, the higher the similarity can be considered. Alternatively, the more items among a plurality of items related to the ease of deformation of the board that have differences between the first information and the third information less than a threshold value, the higher the similarity can be considered. Similar board information can be selected by judging the similarity as explained above.

[0045] Then, for each of the selected plurality of pieces of substrate information, an evaluation value S is derived based on the fourth information weighted according to the third information and the second information of the substrate 15 to be currently adsorbed (S230). Note that a specific weighting method and a method of deriving the evaluation value S will be described later. Next, of the selected plurality of pieces of substrate information, substrate information B having the smallest evaluation value S is selected (S240). The control unit 18 determines whether or not the fifth information of substrate information B indicates that holding of the substrate has been completed (S250).

[0046] If it is determined in step S250 that the fifth information of substrate information B indicates that holding of the substrate has been completed, this means that holding of the substrate has been completed at the time substrate information B was stored, and it is clear that substrate 15 should be adsorbed under the same suction assistance conditions as those of substrate information B. Therefore, substrate 15 is adsorbed and held by holder 20 under the same conditions (with or without suction assistance) as those of the sixth information of substrate information B (S260), and the process proceeds to step S150.

[0047] If it is determined in step S250 that the fifth information in the substrate information B does not indicate that the substrate has been completely held, this means that the substrate corresponding to all of the third to sixth information in the substrate information B has not been completely held in the past. Therefore, the control unit 18 determines that it is necessary to perform suction assistance to suction the substrate 15, and the process proceeds to step S200.

[0048] Next, a method for deriving the evaluation value S in step S270 will be described. In step S270, based on the fourth information of the substrate information having the same third information as the first information of the substrate 15 to be adsorbed this time, which is stored in the storage unit 19, and the second information of the substrate 15 to be adsorbed this time, the evaluation value S is derived by the following formula (1). S = Σ|Hp-Hp'| (1)

[0049] In formula (1), Hp is the distance between the substrate 15 and the laser displacement meter or interferometer at the measurement position p, which is included in the second information of the substrate 15 to be currently adsorbed.

[0050] Moreover, Hp' is the distance between the substrate and the laser displacement meter or interferometer at the measurement position p included in the fourth information of the substrate information having the third information having the same information as the first information of the substrate 15 to be adsorbed this time. The second information and the fourth information have data at a plurality of measurement positions p, and the measurement positions p exist in n places, pi (i = 1 to n). FIG. 8 is an example of the arrangement of a plurality of measurement positions p for measuring the amount of warping of the substrate in this embodiment. For example, as shown in FIG. 8, the plurality of measurement positions p are arranged at a predetermined interval on a virtual circle having a diameter 2r (a radius r), and in the example of FIG. 8, the measurement positions p are arranged in eight places. Then, in formula (1), the total value of the difference in distance at each of the n places is calculated. Moreover, the evaluation value S calculated in formula (1) calculates the difference in distance at each measurement position p between the second information of the substrate 15 to be adsorbed this time and the fourth information in the stored substrate information, regardless of the sign of the difference in distance, whether positive or negative. Therefore, the difference in distance at each measurement position p in formula (1) is calculated using an absolute value.

[0051] The substrate having the substrate information for which the evaluation value S based on this formula (1) is the smallest is the substrate information for the substrate most similar to the substrate 15 to be adsorbed this time. Therefore, in step S280, the substrate information A for which the evaluation value S is the smallest is selected.

[0052] Next, a method of weighting the parameters of the fourth information according to the third information in step S230 and a method of deriving the evaluation value S will be described. In step S230, weighting is applied to the fourth information of the substrate information having third information similar to the first information of the substrate 15 to be currently adsorbed stored in the storage unit 19. Then, based on the weighted fourth information and the second information of the substrate 15 to be currently adsorbed, the evaluation value S is derived by the following formula (2). S = Σ|Hp-α×Hp'| (2)

[0053] In formula (2), Hp is the distance between the substrate 15 and the laser displacement meter or interferometer at the measurement position p included in the second information of the substrate 15 to be currently adsorbed, as in formula (1). Also, Hp' is the distance between the substrate 15 and the laser displacement meter or interferometer at the measurement position p included in the fourth information of the substrate information having the third information similar to the first information of the substrate 15 to be currently adsorbed. α is a weighting coefficient (hereinafter, referred to as a weighting coefficient) determined by the third information. The value of α is determined in the range of 0<α≦1. The second information and the fourth information have data at a plurality of measurement positions p, and there are n measurement positions p, pi (i=1 to n). The plurality of measurement positions p are arranged, for example, as shown in FIG. 8. Then, in formula (2), the total value of the difference in distance at each of the n positions is calculated. Also, the evaluation value S calculated in formula (2) is calculated by calculating the difference in distance at each measurement position p between the second information of the substrate 15 to be currently adsorbed and the fourth information in the stored substrate information, regardless of the positive or negative sign of the difference in distance. Therefore, the difference in distance at each measurement position p in equation (2) is calculated using the absolute value.

[0054] Here, a method for determining the weighting coefficient α will be described. The weighting coefficient α is determined by the similarity of the third information of the comparison target (substrate information similar to the first information of the substrate 15 to be currently adsorbed) to the first information of the substrate 15 to be currently adsorbed. The similarity is determined as described above, and the smaller the difference between the first information and the third information, the higher the similarity. For example, if the user selects the substrate thickness as the weighting criterion, when the similarity between the first information of the substrate 15 to be currently adsorbed and the third information of the comparison target is high, that is, the smaller the difference between the substrate thickness of the first information and the substrate thickness of the third information, the closer the weighting coefficient α becomes to 1.

[0055] On the other hand, when the similarity between the first information of the substrate 15 to be adsorbed this time and the third information to be compared is low, the weighting coefficient α is close to 0. The method of determining the weighting coefficient α is, for example, a user creates a comparison table of the similarity and the weighting coefficient α in a specific item (for example, the thickness of the substrate) and determines the weighting coefficient α using the comparison table based on the similarity. FIG. 9 is an example of a comparison table of the similarity and the weighting coefficient α in this embodiment. The example of FIG. 9 shows a comparison table of the difference T between the first information and the third information indicating the difference in thickness between the substrates, the similarity, and the weighting coefficient α. However, the example of the comparison table is not limited to the example of FIG. 9. For example, in the example of FIG. 9, the difference T is classified by range, and the weighting coefficient α is determined by the similarity according to the corresponding range of the difference T, but the difference T does not have to be classified by range, and a comparison table in which the similarity and the weighting coefficient α are described for each difference T may be used.

[0056] The weighting coefficient α can also be determined by considering the similarity of each of a plurality of parameters common to the first information and the second information. For example, when weighting is performed by considering the thickness, outer diameter, and material of the substrate, a weighting coefficient a related to the thickness of the substrate, a weighting coefficient b related to the outer diameter, and a weighting coefficient c related to the material are first determined. The weighting coefficients a, b, and c are determined in the same manner as the method for determining the weighting coefficient α described above. Then, the weighting coefficient α is derived by equation (3). α = a × b × c (3)

[0057] The substrate information for which the evaluation value S based on the formulas (2) and (3) is the smallest is the substrate information for the substrate that is most similar to the substrate 15 to be adsorbed this time. Therefore, in step S240, the substrate information B for which the evaluation value S is the smallest is selected.

[0058] According to this embodiment, since it is possible to determine whether suction assistance is required based on the information stored in storage unit 19 without performing an operation to suck the substrate in order to determine whether suction assistance is required, the time required for determining whether suction assistance is required can be shortened. Also, in this embodiment, storage unit 19 newly stores substrate information (third to sixth information) of a substrate for which a new suction operation has been performed, thereby updating the information stored in storage unit 19. Note that the third information and fourth information are the first information and second information of substrate 15, respectively. This allows the information used as a basis for determining whether suction assistance is required to be updated as appropriate, thereby making it possible to more appropriately determine whether suction assistance is required.

[0059] In this embodiment, the substrate 15 is held by reducing the pressure in the space between the substrate 15 and the holder 20, but the substrate holding device of this embodiment and the second embodiment described below may be configured to hold the substrate 15 by electrical force. For example, the device may have a similar configuration to a holding device also known as an electrostatic chuck.

[0060] <Second embodiment> In addition to the features of the first embodiment, this embodiment is characterized in that it determines whether or not to implement either or both of the suction assistance for adjusting the suction force and the suction assistance for adjusting the timing of suction (suction timing) for each of the exhaust ports 31 to 33.

[0061] The effectiveness of adjusting the suction force at each exhaust port will be described. For example, in order to adsorb a convex-shaped substrate 15 as shown in FIG. 10, suction is performed from all exhaust ports with the suction force (a) required to adsorb the convex portion. In this case, suction is also performed with the suction force (a) on the vacuum adsorption area 27, which is a non-warped portion of the substrate 15. As described above, the vacuum adsorption areas 25-27 are filled with many small protrusions for supporting the substrate 15 during adsorption, and when suction is performed with excessive suction force, the substrate 15 is pressed against the many small protrusions, thereby reducing the flatness of the substrate 15. In other words, in order to hold the warped substrate 15 on the holder 20 while maintaining its flatness, it is necessary to adjust the suction force of each exhaust port according to the warped position and the amount of warping of the substrate 15.

[0062] FIG. 10 is an example of adjusting the suction force and suction timing of the exhaust ports 31 to 33 in this embodiment. For example, in a state where a laser displacement meter or interferometer is disposed under the substrate 15, if the distance between the laser displacement meter or interferometer and the substrate 15 is shorter than that of a substrate that is not warped, it is found that the substrate 15 is warped in a convex shape. FIG. 10 shows an example in which the holding unit 20 adsorbs and holds such a convexly warped substrate 15. When adsorbing and holding the convexly warped substrate 15 by adjusting the suction force, it is necessary to set the suction force (a) in the vacuum adsorption region 25, which is a position corresponding to the warped position of the substrate 15, to be the strongest. And, it is preferable that the suction force (c) in the vacuum adsorption region 27, which is a position corresponding to a relatively unwarped position of the substrate 15, is weaker than the suction force (a). Therefore, assuming that the suction forces for sucking gas from exhaust ports 31-33 are suction force (a), suction force (b), and suction force (c), respectively, control unit 18 adjusts the suction forces so that suction force (a)>suction force (b)>suction force (c). The strength of the suction force of each exhaust port is set according to the amount of warping of substrate 15, which is calculated from the difference between the distance between the laser displacement meter or interferometer and substrate 15 and a reference distance. By adjusting the suction force according to the warped position and amount of warping of substrate 15 in this way, holding unit 20 can hold substrate 15 even if substrate 15 is warped.

[0063] Next, the effectiveness of adjusting the suction timing at which each exhaust port starts suction will be described. For example, suppose that suction is performed simultaneously from each exhaust port to suction the substrate 15 having a convex shape as shown in FIG. 10. In this case, the vacuum suction region 27, which is a non-warped portion of the substrate 15, completes suction of the substrate 15 earlier than the vacuum suction region 25 and the vacuum suction region 26. Here, if suction is performed from each exhaust port until suction of the convex portion of the substrate 15 is completed, the substrate 15 is pressed against the many small protrusions in the vacuum suction regions 25-27 as described above when suction is performed for an excessive suction time. This reduces the flatness of the substrate 15. In other words, in order to hold the warped substrate 15 on the holder 20 while maintaining its flatness, it is necessary to adjust the suction timing (suction time) of each exhaust port according to the warped position and amount of warping of the substrate 15.

[0064] In the example of FIG. 10, when the substrate 15 warped in a convex shape is adsorbed and held by adjusting the suction timing, it is necessary to set the suction timing in the vacuum adsorption area 25, which is a position corresponding to the warped position of the substrate 15, to the earliest. In addition, it is preferable to set the suction timing in the vacuum adsorption area 27, which is a position corresponding to a relatively unwarped position of the substrate 15, to the latest. Therefore, the control unit 18 adjusts the suction timing for sucking gas from the exhaust ports 31 to 33 so that suction is started in the order of the exhaust port 31 (vacuum adsorption area 25), the exhaust port 32 (vacuum adsorption area 26), and the exhaust port 33 (vacuum adsorption area 27). The suction timing of each exhaust port is set according to the amount of warping of the substrate 15 calculated from the difference between the distance between the laser displacement meter or interferometer and the substrate 15 and the reference distance. By adjusting the suction timing according to the warped position and amount of warping of the substrate 15 in this way, the holding unit 20 can hold the substrate 15 even if the substrate 15 is warped.

[0065] When one or both of the adjustment of the suction force and the adjustment of the suction timing for each exhaust port are adopted as suction assistance when sucking gas through each of the exhaust ports 31 to 33, the substrate information must also include that information. Specifically, the sixth information including information related to the presence or absence of suction assistance when the substrate is sucked is made to include information related to the suction force and suction timing of each of the exhaust ports 31 to 33 in the suction operation for the substrate.

[0066] In addition, the suction assistance (method) may be any one of pressing the warped portion by the pressing portion 60, adjusting the suction force of each of the exhaust ports 31-33, and adjusting the suction timing of each of the exhaust ports 31-33, or a combination of two or more of them.

[0067] 11 is a flow chart for determining a suction assist method in this embodiment. When the control unit 18 determines to perform suction assistance, it determines whether or not a suction assist method has already been determined (S410).

[0068] The case where the suction assist method has already been determined refers to the case where the control unit 18 determines in steps S140, S260, and S300 shown in Figures 6 and 7 that the substrate 15 is to be suctioned under the same conditions as the sixth information stored in the storage unit 19. If the suction assist method has already been determined, there is no need to determine the suction assist method, and the process ends.

[0069] If the suction assist method has not been determined, that is, if it is determined that the fifth information does not indicate that the holding of the substrate is completed, the control unit 18 determines whether or not to perform pressing by the pressing unit 60 (S420). If pressing by the pressing unit 60 is to be performed, the control unit 18 determines whether or not it is possible to cause the holding unit 20 to suction and hold the substrate 15 only by pressing by the pressing unit 60 (S430). Here, the determination in step S430 is made based on the amount of warping, and for example, if the amount of warping is equal to or greater than the threshold A, it is determined that it is impossible to cause the holding unit 20 to suction and hold the substrate 15 only by pressing. If it is determined that it is possible to cause the holding unit 20 to suction and hold the substrate 15 only by pressing by the pressing unit 60, the suction assist method is determined to be pressing by the pressing unit 60 (S470), and the process ends.

[0070] If it is determined that the substrate 15 cannot be adsorbed and held by the holder 20 only by the pressure of the pressing unit 60, it is determined whether or not to adjust the suction force for sucking the gas from the exhaust ports 31 to 33 (S440). If the suction force for sucking the gas from the exhaust ports 31 to 33 is to be adjusted, the control unit 18 determines whether the substrate 15 can be adsorbed and held by the holder 20 only by adjusting the pressing force and suction force by the pressing unit 60 (auxiliary method A) or by adjusting the suction force (auxiliary method B) (S450). Here, the determination in step S450 is based on the amount of warping, and for example, if the amount of warping is equal to or greater than a threshold value B, it is determined that the substrate 15 cannot be adsorbed and held by the holder 20 only by adjusting the pressing force and suction force (auxiliary method A). Also, for example, if the amount of warping is equal to or greater than a threshold value C, it is determined that the substrate 15 cannot be adsorbed and held by the holder 20 only by adjusting the suction force (auxiliary method B).

[0071] If it is determined that the substrate 15 can be adsorbed and held by the holder 20 by adjusting the pressure and suction force by the pressing unit 60, or by adjusting the suction force alone, the adsorption auxiliary method is determined to be auxiliary method A or auxiliary method B (S470), and the process ends. If it is determined in step S450 that the substrate 15 cannot be adsorbed and held by the holder 20, it is determined whether or not to adjust the suction timing for sucking in gas from the exhaust ports 31-33 (S460), the adsorption auxiliary method is determined (S470), and the process ends.

[0072] The control unit 18 determines the suction assist method based on the substrate information stored in the storage unit 19 through the above-mentioned judgment. As a result, if the substrate is hard and has a large amount of warping, three types of suction assistance are performed at the same time: pressing the warped portion, adjusting the suction force of each exhaust port, and adjusting the suction timing of each exhaust port. On the other hand, if the substrate is soft and has a small amount of warping, suction assistance is performed only by adjusting the suction timing of each exhaust port.

[0073] As an alternative method for determining the suction assist method of this embodiment, there is a method in which the user predetermines a threshold for each of the first information and the second information, and determines the suction assist method by comparing each threshold with the corresponding information. For example, the user predetermines a first threshold for the amount of warping, and a second threshold for the thickness of the substrate 15. When the amount of warping of the substrate 15 is equal to or greater than the first threshold and the thickness of the substrate 15 is equal to or greater than the second threshold, three suction assist methods, namely, pressing against the warped portion, adjusting the suction force of each exhaust port, and adjusting the suction timing of each exhaust port, are performed in combination. When the amount of warping of the substrate 15 is equal to or greater than the first threshold and the thickness of the substrate 15 is less than the second threshold, two suction assist methods, namely, pressing against the warped portion and adjusting the suction force of each exhaust port, are performed in combination. When the amount of warping of the substrate 15 is less than the first threshold and the thickness of the substrate 15 is equal to or greater than the second threshold, two suction assist methods, namely, adjusting the suction force of each exhaust port and adjusting the suction timing of each exhaust port, are performed in combination. When the amount of warping of the substrate 15 is less than the first threshold value and the thickness of the substrate 15 is less than the second threshold value, only the adjustment of the suction timing of each exhaust port is performed as the suction assistance method.

[0074] <Third embodiment> The present embodiment is characterized in that an article is manufactured using the substrate holding device described in the first and second embodiments.

[0075] 12 is a flow chart of a method for manufacturing an article in this embodiment. A holding step S510 is performed in which a determination is made as to whether or not suction assistance is required when holding substrate 15 using the substrate holding device described in the first and second embodiments, and substrate 15 is held by holding part 20 based on the determination result. Then, a forming step S520 is performed in which a pattern is formed on the substrate held in the holding step, and a manufacturing step S530 is performed in which an article is manufactured from the substrate on which the pattern has been formed in the forming step.

[0076] Products manufactured by this manufacturing method include, for example, semiconductor IC elements, liquid crystal display elements, color filters, MEMS, etc. Moreover, steps S510 and S520 and a part of step S530 constitute the front-end process in this manufacturing method.

[0077] In the formation process, for example, a substrate (silicon wafer, glass plate, etc.) on which a photosensitive material is applied onto a pattern material is exposed by an exposure device (lithography device) to form a latent image pattern in the photosensitive material of the substrate.

[0078] The manufacturing process includes, for example, pre-processing including development of a substrate (photosensitive material) on which a latent image pattern has been formed, etching of the pattern material of the developed substrate, resist peeling, etc., and post-processing including dicing, bonding, packaging, etc. According to this manufacturing method, it is possible to manufacture an article by a method with higher productivity per unit time than conventional methods.

Claims

1. A substrate holding device having a holding part for adsorbing and holding a substrate, in the substrate holding device capable of pushing the substrate on the holding part toward the holding part side and adsorbing the substrate, characterized in that it has a determination part for determining to push the substrate toward the holding part side based on first information including information related to the ease of deformation of the substrate and second information including information related to the amount of warpage of the substrate.

2. The substrate holding device according to claim 1, wherein the determination part determines whether or not to push the substrate toward the holding part side based on the first information and the second information.

3. The substrate holding device according to claim 1, wherein the information related to the ease of deformation of the substrate includes at least one of the thickness of the substrate, the outer diameter of the substrate, and the material of the substrate.

4. It has a storage part for storing information related to other substrates, The substrate holding device according to claim 1, wherein the determination part determines to push the substrate toward the holding part side based on the information related to the other substrates.

5. The storage part stores third information including information related to the ease of deformation of the other substrates, fourth information including information related to the amount of warpage of the other substrates, fifth information including information related to the adsorption state of the other substrates, and sixth information including information related to whether or not the other substrates have been pushed toward the holding part side, The substrate holding device according to claim 4, wherein the determination part determines to push the substrate toward the holding part side based on the first information and the second information, and the third information, the fourth information, the fifth information, and the sixth information.

6. The substrate holding device according to claim 1, wherein when the amount of warpage is equal to or greater than a threshold value, the substrate is pushed toward the holding part side without determination by the determination part.

7. The substrate holding device according to claim 1, wherein the amount of warpage is obtained based on the distance to the substrate measured by a laser displacement meter or an interferometer.

8. One or both of the first information and the third information and the second information and the fourth information are notified by wire or wirelessly from a device separate from the substrate holding device, a storage device separate from the storage device of the substrate holding device, or a host system. The substrate holding device according to claim 5, characterized in that.

9. The holding part has a plurality of exhaust ports for the adsorption, The substrate holding device according to claim 1, wherein the determination unit determines to adjust the suction force when sucking gas through each of the plurality of exhaust ports, together with the determination to press the substrate.

10. The holding unit has a plurality of exhaust ports for the adsorption, The substrate holding device according to claim 1, wherein the determination unit determines to adjust the timing of sucking gas through each of the plurality of exhaust ports, together with the determination to press the substrate.

11. The holding unit has a plurality of exhaust ports for the adsorption, The information related to the adsorption state in the fifth information includes information on the measured values of pressure sensors arranged in the gas flow paths from each of the plurality of exhaust ports when the substrate is adsorbed to the holding unit, or information on whether the adsorption of the substrate is completed or not formed according to the information on the measured values of the pressure sensors. The substrate holding device according to claim 5, characterized in that it comprises.

12. In a substrate holding method having a step of pressing a substrate on a holding unit toward the holding unit side and adsorbing the substrate by the holding unit, A substrate holding method, characterized by having a step of determining to press the substrate toward the holding unit side based on information related to the ease of deformation of the substrate and information related to the amount of warpage of the substrate.

13. The substrate holding method according to claim 12, wherein the material of the substrate is the type or hardness of the substrate.

14. In a substrate holding method of adsorbing a substrate by a holding unit A first determination step of determining whether or not to perform adsorption assistance when adsorbing the first substrate based on first information including information related to at least one of the thickness of the first substrate, the outer diameter of the first substrate, and the material of the first substrate, and second information including information related to the amount of warpage of the first substrate; A first adsorption step of adsorbing the first substrate by the holding unit in a state without the adsorption assistance or in a state with the adsorption assistance based on the determination result of the first determination step, A second determination step of determining whether or not to perform adsorption assistance when adsorbing the second substrate based on first information including information related to at least one of the thickness of the second substrate different from the first substrate, the outer diameter of the second substrate, and the material of the second substrate, second information including information related to the amount of warping of the second substrate, third information including the first information and the second information of the first substrate and information related to the adsorption state when the first substrate is adsorbed, and fourth information including information related to the presence or absence of the adsorption assistance when the first substrate is adsorbed; A second adsorption step of adsorbing the second substrate by the holding unit in a state where there is no adsorption assistance or in a state where there is adsorption assistance based on the determination result of the second determination step; A substrate holding method characterized by comprising the steps of:

15. A set of a plurality of information including the first information of the first substrate, the second information of the first substrate, the third information of the first substrate, and the fourth information of the first substrate is stored in a storage unit as substrate information of the first substrate, The substrate holding method according to claim 14, characterized in that a set of a plurality of information including the first information of the second substrate, the second information of the second substrate, third information including information related to the adsorption state when the second substrate is adsorbed, and fourth information including information related to the presence or absence of the adsorption assistance when the second substrate is adsorbed is stored in the storage unit as substrate information of the second substrate.

16. A set of a plurality of information including the first information of the first substrate, the second information of the first substrate, the third information of the first substrate, and the fourth information of the first substrate is stored in a storage unit as substrate information of the first substrate, The substrate holding method according to claim 14, characterized in that the substrate information of the first substrate is selected from among a plurality of pieces of substrate information stored in the storage unit as substrate information including information that matches the first information and the second information of the second substrate, or substrate information including information that matches the first information of the second substrate, or substrate information including information that is similar to the first information of the second substrate, and the second determination step is performed using the substrate information of the first substrate.

17. The adsorption assistance in the method for holding a substrate according to claim 14 includes at least one of pressing the first substrate or the second substrate on the holding portion toward the holding portion side, adjusting the suction force of each of a plurality of exhaust ports disposed in the holding portion for adsorbing the substrate, and adjusting the timing of starting suction from each of the plurality of exhaust ports.

18. A lithography apparatus for forming a pattern on a substrate, comprising: a substrate holding device according to any one of claims 1 to 11; an optical system that irradiates light onto the substrate held by the substrate holding device; A lithography apparatus, characterized by comprising the above.

19. The lithography apparatus according to claim 18, further comprising a pressing portion that presses the substrate.

20. A method for manufacturing an article, comprising: a holding step of determining the necessity of adsorption assistance when holding a substrate using a substrate holding device according to any one of claims 1 to 11, and holding the substrate on the holding portion with or without adsorption assistance based on the determination result; a forming step of forming a pattern on the substrate held in the holding step; a manufacturing step of manufacturing an article from the substrate on which the pattern has been formed in the forming step. A method for manufacturing an article, characterized by comprising the above.

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