Measurement device, lithography device, article production method and measurement method

Abstract

To provide a beneficial technique for detecting the position of a diagonal mark.SOLUTION: A measurement device for measuring the position of a mark includes: an imaging unit for capturing the mark; and a processing unit for detecting the position of the mark based on the image of the mark provided by the imaging unit. The image of the mark includes a periodic arrangement of plural lines parallel to an inclined direction, which is tilted relative to a first direction. The processing unit determines the period of the plural lines in a second direction, which is orthogonal to the first direction, based on the image, and determines the position of the mark in the first direction based on signals from plural regions of the identical phase range, each extracted from plural periods in the second direction within the image.SELECTED DRAWING: Figure 10

Description

[Technical field]

[0001] The present invention relates to a measurement apparatus, a lithography apparatus, an article manufacturing method, and a measurement method. [Background technology]

[0002] Lithography apparatuses such as exposure apparatuses and imprint apparatuses may be used to manufacture articles such as semiconductor devices. In the lithography apparatuses, marks that may be called alignment marks or the like may be used to measure the position of a substrate, the position of an original, the relative alignment between the substrate and the original, and the shape of a shot area of ​​a substrate. One type of alignment mark is an oblique mark. An oblique mark is a mark that has a constant line width and space width and is inclined at a constant angle with respect to the coordinate axes of a measurement coordinate system. A method for detecting the position of an oblique mark includes a detection method that uses the intensity of interference light when light diffracted by the mark passes through a diffraction grating (Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 4913169 Publication Summary of the Invention [Problem to be solved by the invention]

[0004] In measuring the position of a mark consisting of lines and spaces extending in a direction parallel to the coordinate axis, a one-dimensional waveform is generated by integrating the light amount of the image of the mark in a direction perpendicular to the detection direction, and the position of the mark can be determined by performing a center of gravity calculation process on the one-dimensional waveform. However, when the position of the oblique mark is measured according to this method, even if an attempt is made to obtain a one-dimensional waveform from the image of the mark, the contrast between the mark portion and the blank portion cannot be accurately expressed.

[0005] An object of the present invention is to provide an advantageous technique for detecting the position of an oblique mark. [Means for solving the problem]

[0006] One aspect of the present invention relates to a measurement device that measures a position of a mark, the measurement device comprising an imaging unit that images the mark, and a processing unit that detects the position of the mark based on an image of the mark provided by the imaging unit, the image of the mark including a periodic arrangement of a plurality of lines parallel to a tilt direction tilted with respect to a first direction, the processing unit determining a period of the plurality of lines in a second direction perpendicular to the first direction based on the image, and determining the position of the mark in the first direction based on signals of a plurality of regions in the same phase range that are respectively extracted from the plurality of periods in the second direction of the image. Effect of the Invention

[0007] According to the present invention, an advantageous technique is provided for detecting the position of the diagonal marks. [Brief description of the drawings]

[0008] [Figure 1] 1 is a diagram showing a schematic configuration of an exposure apparatus as a first embodiment of a lithography apparatus. [Diagram 2] 4 is a diagram showing a schematic image of an alignment mark captured by an imaging element of the alignment detection system; FIG. [Diagram 3] FIG. 2 is a diagram showing a schematic diagram of a two-dimensional model MD1 of an XY mark and an image IMG1 of an alignment mark MA1. [Figure 4] 1A and 1B are diagrams for explaining a general method for detecting the position of an alignment mark. [Diagram 5] 10A and 10B are diagrams for explaining exemplary problems involved in detecting the positions of oblique marks; [Figure 6] 1A and 1B are diagrams for explaining a position detection method in which a detection module determines the position of a diagonal mark based on an image of the diagonal mark provided by an alignment detection system. [Figure 7] FIG. [Figure 8]11A and 11B are diagrams illustrating a method for determining a plurality of measurement regions (a plurality of regions). [Figure 9] FIG. [Figure 10] FIG. [Figure 11] FIG. 13 is a diagram illustrating a plurality of measurement areas (a plurality of areas) determined for detecting the Y-direction position of an image of a diagonal mark, and a one-dimensional integrated waveform. [Figure 12] FIG. 13 is a diagram illustrating an example of a diagonal mark formed by dotted lines. [Figure 13] FIG. [Figure 14] 8A to 8C are views for explaining a position detection method according to a second embodiment. [Figure 15] 8A to 8C are views for explaining a position detection method according to a second embodiment. [Figure 16] 11A and 11B are diagrams illustrating a method for determining a plurality of measurement regions (a plurality of regions). [Figure 17] FIG. 13 is a diagram illustrating the synthesis of two integrated waveforms. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0010] In this disclosure, directions are described according to the XYZ coordinate system for convenience. Usually, the negative direction of the Z axis is vertically downward, but this is not limited to this. The direction parallel to the X axis is the X direction or X axis direction, the direction parallel to the Y axis is the Y direction or Y axis direction, and the direction parallel to the Z axis is the Z direction or Z axis direction. In this disclosure, the first direction and the second direction may be the X direction and the Y direction, respectively, or the Y direction and the X direction, respectively. The first direction and the second direction are different from each other and are perpendicular to each other.

[0011] A measurement apparatus according to one aspect of the present disclosure is incorporated in a lithography apparatus that transfers a pattern of an original onto a substrate, and another aspect of the present disclosure relates to such a lithography apparatus. The lithography apparatus may be, for example, an exposure apparatus, an imprint apparatus, or an electron beam drawing apparatus. In the present disclosure, the mark may be a structure including a pattern whose position can be detected by the measurement apparatus. In the present disclosure, the oblique mark is a mark having a configuration in which a plurality of lines parallel to a direction inclined with respect to a predetermined direction (for example, the X direction or the Y direction) are periodically arranged. The lines may be a structure that is continuous in one direction, such as a solid line, or may be a structure that is discontinuous, such as a dotted line or a dashed line, but can be recognized as a structure that is continuous in one direction by information processing.

[0012] First Embodiment FIG. 1 shows a schematic configuration of an exposure apparatus 100 as a first embodiment of a lithography apparatus according to the present disclosure. The exposure apparatus 100 incorporates an alignment detection system OA and a detection module PDM as a first embodiment of a measurement apparatus according to the present disclosure. The exposure apparatus 100 aligns a reticle R, which is an original, and a wafer W, which is a substrate, and then irradiates the reticle R with exposure light using an illumination system IL to transfer a pattern of the reticle R onto a photosensitive material on the wafer W using a projection optical system PO. The wafer W is mounted on a stage STG that is movable in the XYZ directions via a chuck CH that holds the wafer W. The position of the stage STG is measured by an interferometer IF. The controller HP drives or positions the stage STG by controlling a drive mechanism (not shown) based on the measurement result of the position of the stage STG. Driving or positioning the stage STG can also be understood as driving or positioning the wafer W.

[0013] A plurality of alignment marks (also simply referred to as marks) MA are arranged on the wafer W in order to perform alignment of the wafer W, etc. The alignment detection system OA optically detects the alignment marks MA. The alignment detection system OA functions as an imaging unit that images the alignment marks MA. When the alignment detection system OA detects the alignment marks MA, the stage STG is driven so that the alignment marks MA are within the detection range of the alignment detection system OA.

[0014] The alignment detection system OA may include an optical system such as an illumination light source LI and an objective lens OL. Illumination light emitted from the illumination optical system LI is reflected by a half mirror M via the optical system to illuminate the alignment mark MA. The reflected and scattered light from the alignment mark MA forms an optical image of the alignment mark MA on an imaging surface of an imaging element S such as a CCD image sensor or a CMOS image sensor via the optical system, and this is captured as an image IMG by the imaging element S. FIG. 2 shows a schematic diagram of an image IMG of the alignment mark MA1 captured by the imaging element S of the alignment detection system OA. The imaging element S transfers the image IMG to the control unit HP. The control unit HP has a detection module PDM, which detects the position of the alignment mark MA on the wafer W by processing the image IMG. The detection module PDM functions as a processing unit that detects the position of the alignment mark MA based on the image of the alignment mark MA provided by the alignment detection system OA functioning as an imaging unit. In addition, the position of the alignment mark (mark) MA and the position of the image of the alignment mark (mark) MA detected by the alignment detection system OA are mutually convertible (transformable) positions, so they are described as mutually equivalent information. In other words, the position of the alignment mark (mark) MA is equivalent to the position of the image of the alignment mark (mark) MA detected by the alignment detection system OA.

[0015] The detection module PDM may be incorporated in the alignment detection system OA. The alignment detection system OA and the detection module PDM may be understood as a measurement device. The control unit HP controls the exposure of the wafer W while controlling the stage STG based on the array design information of the multiple shot areas on the wafer W input in advance, the position detection result of the alignment mark MA, and the position information of the stage STG obtained from the interferometer IF. The control unit HP may be configured, for example, by a PLD (abbreviation of Programmable Logic Device) such as an FPGA (abbreviation of Field Programmable Gate Array), or an ASIC (abbreviation of Application Specific Integrated Circuit), or a general-purpose or dedicated computer with a program built in, or a combination of all or part of these. The detection module PDM may be a software module incorporated in the control unit HP. Alternatively, the detection module PDM may be configured by a PLD such as an FPGA, or an ASIC, or a general-purpose or dedicated computer with a program built in, or a combination of all or part of these.

[0016] Here, a method for detecting the position of the XY mark MA1, which is a general alignment mark, will be described with reference to FIG. 3 and FIG. 4. The detection module PDM performs a rough inspection process for roughly detecting the position of the XY mark MA1, and then a precise inspection process for precisely detecting the position of the XY mark MA1. In the rough inspection process, the detection module PDM performs template matching using a two-dimensional model MD1 (template) of the XY mark for the image IMG1. The detection module PDM can determine the center of the two-dimensional model MD1 when the two-dimensional model MD1 and the image IMG1 of the XY mark MA1 overlap most as the rough inspection center (X0, Y0). In the precise inspection process, the detection module PDM first sets measurement regions WIN_X and WIN_Y in the image IMG1 of the XY mark MA1 based on the rough inspection center (X0, Y0) obtained in the rough inspection process, as exemplified in FIG. 4. In the detailed inspection process, the detection module PDM further generates one-dimensional integrated waveforms WA_X and WA_Y by integrating the light amount in a direction perpendicular to the detection direction in the measurement regions WIN_X and WIN_Y. In the detailed inspection process, the detection module PDM further performs a center of gravity calculation process on the integrated waveforms WA_X and WA_Y, thereby determining the center position (X1, Y1) of the XY mark MA1 in the image IMG1.

[0017] However, as illustrated in FIG. 5, when the alignment mark is the oblique mark MA2, when the measurement areas WIN_X and WIN_Y are set and an integrated waveform is generated in the same manner as described above, waveforms WA_X' and WA_Y' are obtained. In the waveforms WA_X' and WA_Y', the contrast between the mark portion and the blank portion (portion other than the mark portion) is not correctly expressed, so the position of the oblique mark MA2 cannot be determined. Therefore, the detection module PDM can determine the measurement area based on the line width L, space width S, and angle α that the line and space make with the measurement coordinates, which are extracted from the image of the oblique mark MA2, as described below. Here, the line width L and space width S are the line width and space width in the measurement coordinates (detection direction). The oblique mark MA2 includes a periodic arrangement of a plurality of lines parallel to the inclination direction inclined with respect to the detection direction (first direction). Therefore, the image of the oblique mark MA2 also includes a periodic arrangement of a plurality of lines parallel to the inclination direction inclined with respect to the detection direction (first direction). The periodicity of the multiple lines is observed in both the detection direction (first direction) and the second direction perpendicular to the detection direction (first direction). From another perspective, the periodicity of the multiple lines is observed in both the X direction and the Y direction. The detection module PDM may also obtain the line width L, space width S, and angle α of the diagonal mark MA2 from design information of the diagonal mark MA2. The design information of the diagonal mark MA2 may also be stored in a memory unit (not shown) of the control unit HP, or may be obtained from an external information processing device (not shown).

[0018] 6 shows a position detection method in which the detection module PDM determines the position of the oblique mark based on an image of the oblique mark provided by the alignment detection system OA. First, in step S001, a rough detection process is performed to roughly detect the position of the mark. Specifically, the detection module PDM can determine the rough detection center (X0, Y0) of the image of the oblique mark by performing template matching using a two-dimensional model (template) of the oblique mark for the image of the oblique mark provided by the alignment detection system OA.

[0019] Next, in steps S002 to S004, a precision inspection process is performed to precisely detect the position of the mark. Specifically, in step S002, the detection module PDM determines a plurality of measurement regions according to the line width L, space width S, and angle α of the oblique mark based on the rough inspection center (X0, Y0) obtained in the rough inspection process. The plurality of measurement regions are a plurality of regions in the same phase range, as described later. Next, in step S003, the detection module PDM generates an integrated waveform for the plurality of measurement regions in a procedure described later, and in step S004, the detection module PDM detects (determines) the position of the oblique mark based on this integrated waveform.

[0020] A method for determining a plurality of measurement regions in step S002, i.e., a plurality of regions in the same phase range, will be described with reference to FIG. 7. Here, the width of each measurement region WIN_O to be determined is T, and the interval between adjacent measurement regions WIN_O is I. In the example of FIG. 7, the position of the oblique mark is detected in the "detection direction". Here, the detection direction may be defined as the first direction, and the direction perpendicular to the detection direction (first direction) may be defined as the second direction. The width T of the measurement region WIN_O is the dimension of the measurement region WIN_O in the second direction perpendicular to the detection direction (first direction). Moreover, the interval I between adjacent measurement regions WIN_O is the distance in the second direction between the measurement regions WIN_O adjacent to each other in the second direction. The detection module PDM can calculate the width T and the interval I according to Equation 1 and Equation 2, respectively.

[0021] T=S×tanα (Formula 1) I = L × tan α (Equation 2)

[0022] The detection module PDM can set multiple measurement areas WIN_XO based on the width T, interval I, and rough inspection center (X0, Y0). Fig. 8 illustrates multiple measurement areas WIN_XO when the detection direction (first direction) is the X direction. If the center coordinates of the measurement area WIN_XO located at the nth position from the rough inspection center (0th position) are (X0, Y0n), Y0n based on the rough inspection center can be determined as shown in Equation 3. Y0n = Y0 + (T + I) n ...(Formula 3)

[0023] Here, in the image of the oblique mark, T+I is the period of multiple lines in a second direction perpendicular to the detection direction (first direction). Therefore, the process of determining, calculating or identifying T+I can be understood as a process of determining the period of multiple lines in the second direction in the image of the oblique mark. Also, determining multiple measurement areas WIN_XO according to Equation 3 can be understood as a process of extracting signals of multiple measurement areas (multiple areas) in the same phase range from the image of the oblique mark.

[0024] Furthermore, when the imaging element S is tilted by an angle θ (-90°<θ<90°) with respect to the measurement coordinates as shown in Fig. 9(a), this angle θ is taken into consideration and equations 1 and 2 are rewritten as equations 4 and 5. Equations 4 and 5 are the width T' and interval I' corrected by the angle θ. Fig. 9(b) shows an enlarged view of a portion 900 of Fig. 9(a).

[0025]

number

[0026]

number

[0027] The generation of the integrated waveform in step S003 will be described with reference to Fig. 10. As illustrated in Fig. 10, in step S002, a plurality of measurement areas WIN_XO arranged in a second direction perpendicular to the detection direction (first direction) (here, X direction) of the image of the oblique mark MA2 can be determined. In step S003, the detection module PDM generates a one-dimensional integrated waveform WA_XO by integrating the light amounts in the plurality of measurement areas WIN_XO in the second direction perpendicular to the detection direction (first direction). This one-dimensional integrated waveform WA_XO accurately represents the line width L and space width S of the oblique mark MA2.

[0028] The detection module PDM can also perform the above-mentioned measurement area determination process (S002) and accumulation process (S003) for the Y direction of the image of the diagonal mark MA2. Fig. 11 illustrates a plurality of measurement areas WIN_YO and a one-dimensional accumulated waveform WA_YO determined to detect the position of the image of the diagonal mark MA2 in the Y direction.

[0029] In step S004, the detection module PDM performs a center of gravity calculation process on the one-dimensional integrated waveforms WA_XO, WA_YO obtained from the oblique mark to determine the center position (X2, Y2) of the image of the oblique mark MA2. That is, in this embodiment, the detection module PDM determines the period of multiple lines in a second direction perpendicular to the first direction based on the image of the oblique mark. Also, the detection module PDM determines the position of the oblique mark in the first direction based on signals of multiple regions in the same phase range extracted from multiple periods in the second direction of the image of the oblique mark.

[0030] In the above embodiment, a one-dimensional integrated waveform is generated and processed from a two-dimensional image captured by the image sensor S, but a one-dimensional integrated waveform may be acquired while scanning a mark using a light quantity sensor. In this case, the scanning range corresponds to the above-mentioned detection measurement area.

[0031] The oblique mark illustrated in the above embodiment is a mark that constitutes lines and spaces, and the line portion has a structure in which the line portion is continuous in one direction like a solid line, but the line portion may be discontinuous like a dotted line or a chain line. Even in such a case, it can be recognized as a structure that is continuous in one direction by information processing in the detection module PDM. Figure 12 illustrates an oblique mark constituted by dotted lines.

[0032] The integration width T or T' and the integration interval I or I' may be adjusted by subtracting or adding a fixed amount so as to maximize the detection accuracy.

[0033] Let T' and I' calculated using Equation 4 and Equation 5 be the initial values ​​T0 and I0 for the integration width and integration interval, and the accuracy of the position detected using T0 and I0 be R(T0,I0). Determine fixed correction values ​​η and ξ (η and ξ are real numbers) for the integration width and integration interval, respectively. Using this correction value and variables p and q (p and q are integers), the measurement accuracy can be expressed as R(T0+pη,I0+qξ). When -P≦p≦P and -Q≦q≦Q are set using the constants P and Q, respectively, find p´ and q´ that maximize R, and then determine T=T0+p´η and I=I0+q´ξ to be used in the measurement.

[0034] When an integrated waveform is generated for each of a plurality of measurement regions, comparing an integrated waveform in a measurement region close to the rough inspection center with an integrated waveform in a measurement region far from the rough inspection center may result in differences in intensity and phase due to the influence of noise, etc., as shown in Fig. 13. In such cases, the other integrated waveforms may be adjusted to match the integrated waveform close to the rough inspection center by shrinking or expanding them in the measurement direction or weighting the signal intensity.

[0035] <Second embodiment> Hereinafter, a second embodiment of the present disclosure will be described. Matters not mentioned as the second embodiment may follow the first embodiment. In the second embodiment, a plurality of first measurement regions are determined according to the first embodiment, and a first integrated waveform is generated using the plurality of first measurement regions. In addition, in the second embodiment, a plurality of second measurement regions may be determined so that a second integrated waveform having a different phase (for example, an opposite phase) from the first integrated waveform is obtained, and a second integrated waveform may be generated using the plurality of second measurement regions. Furthermore, in the second embodiment, the first integrated waveform and the second integrated waveform are phase-adjusted so that the phases of both are matched, and then the first integrated waveform and the second integrated waveform are synthesized to obtain one synthesized integrated waveform, and the position of the mark may be detected based on the synthesized integrated waveform.

[0036] FIG. 14 shows a process of the second embodiment in which the detection module PDM determines the position of the oblique mark based on an image of the oblique mark provided by the alignment detection system OA. Steps S101 to S103 are the same as steps S001 to S003 in FIG. 6. First, in step S101, a rough inspection process is performed to roughly detect the position of the mark. Specifically, the detection module PDM can determine the rough inspection center (X0, Y0) of the image of the oblique mark by performing template matching using a two-dimensional model (template) of the oblique mark for the image of the oblique mark provided by the alignment detection system OA. Next, in step S102, the detection module PDM determines a plurality of first measurement regions based on the rough inspection center (X0, Y0) obtained in the rough inspection process and the line width L, space width S, and angle α extracted from the image of the oblique mark. Next, in step S103, the detection module PDM generates a first integrated waveform based on the plurality of first measurement regions.

[0037] In step S104, the detection module PDM determines a plurality of second measurement regions different from the plurality of first measurement regions according to the line width L, space width S, and angle α of the oblique mark based on the rough inspection center (X0, Y0). Next, in step S105, the detection module PDM generates a second integrated waveform based on the plurality of second measurement regions.

[0038] In step S106, the detection module PDM adjusts the first integrated waveform and the second integrated waveform so that their phases match, and then adds them together to generate a composite integrated waveform. In step S107, the detection module PDM detects (determines) the position of the oblique mark based on this composite integrated waveform.

[0039] As illustrated in FIG. 15, a first integrated waveform WA_XO is generated using a plurality of first measurement areas WIN_XO, and a second integrated waveform WA_XO' is generated using a plurality of second measurement areas WIN_XO' that are in phase with the plurality of first measurement areas WIN_XO (for example, in opposite phase). The first integrated waveform WA_XO and the second integrated waveform WA_XO' are signals obtained from the same mark. Therefore, one composite integrated waveform can be obtained by synthesizing the first integrated waveform WA_XO and the second integrated waveform WA_XO' after performing phase adjustment so that the phases of the two are matched. For example, when the first integrated waveform WA_XO and the second integrated waveform WA_XO' are in opposite phase to each other, the phase of one of them may be inverted and added to the other. The accuracy of mark position detection can be improved by determining the position of the mark based on such a composite integrated waveform.

[0040] Here, the process performed in step S104 will be described in more detail. As in the first embodiment, the second measurement area WIN_XO' is determined from the rough inspection center (X0, Y0). As illustrated in FIG. 16, if the center coordinates of the second measurement area WIN_XO' located at the m-th position from the rough inspection center (0th position) are (X0, Y0m), Y0m based on the rough inspection center can be determined as shown in Equation 6. Here, in step S104, as illustrated in FIG. 17, a plurality of second measurement areas can be determined so that the second waveform WA_XO' is an inverse-phase waveform shifted by (L+S) / 2 from the first waveform WA_XO in the measurement direction.

[0041] Y0m=Y0+(T+I)·(m-1) / 2···(Formula 6) In step S105, the detection module PDM generates a second waveform WA_XO' based on the multiple second measurement regions WIN_XO'. In step S106, the second waveform WA_XO' is inverted and added to the first waveform WA_XO to obtain a composite waveform WA_XO(X). A similar process can be performed for the Y direction. In step S107, the detection module PDM performs a center of gravity calculation process using the composite waveform obtained in step S106 to obtain the precision inspection center of the mark. <Product manufacturing method> Hereinafter, a method for manufacturing an article using the above-mentioned lithography apparatus will be described. The method for manufacturing an article may include a transfer step of transferring a pattern of an original onto a substrate by a lithography apparatus such as the above-mentioned exposure apparatus, and a processing step of processing the substrate that has been subjected to the transfer step to obtain an article.

[0042] <Disclosures> The present specification and drawings include the following disclosure: (Item 1) A measuring device for measuring a position of a mark, an imaging unit that images the mark; a processing unit that detects a position of the mark based on an image of the mark provided by the imaging unit, the image of the mark includes a periodic array of lines parallel to a tilt direction tilted relative to a first direction; the processing unit determines a period of the plurality of lines in a second direction perpendicular to the first direction based on the image, and determines a position of the mark in the first direction based on signals of a plurality of regions in the same phase range that are respectively extracted from the plurality of periods in the second direction of the image. A measuring device characterized by: (Item 2) the processing unit determines a period of the plurality of lines in the first direction based on the image, and determines a position of the mark in the second direction based on signals of a plurality of second regions in the same phase range that are respectively extracted from the plurality of periods in the first direction of the image. 2. The measuring device according to item 1, (Item 3) The processing unit determines the plurality of regions based on line widths, space widths, and angles of the plurality of lines extracted from the image. 2. The measuring device according to item 1, (Item 4) the processing unit performs a rough inspection process for roughly detecting the position of the mark, and then a precise inspection process for precisely detecting the position of the mark, and determines the position of the mark in the first direction based on signals of a plurality of regions in the same phase range in the precise inspection process. 4. The measuring device according to any one of items 1 to 3, (Item 5) The processing unit performs the rough detection process by template matching. 5. The measuring device according to item 4, (Item 6) the processing unit obtains a one-dimensional integrated waveform by integrating signals of a plurality of regions in the same phase range in the second direction, and determines a position of the mark in the first direction based on the one-dimensional integrated waveform. 2. The measuring device according to item 1, (Item 7) The processing unit determines the plurality of regions based on line widths, space widths, and angles of the plurality of lines extracted from the image. 7. The measuring device according to item 6, (Item 8) the processing unit determines a position of the mark in the first direction based on a first signal obtained from a plurality of regions of a first identical phase range each extracted from the plurality of periods in the second direction of the image, and a second signal obtained from a plurality of regions of a second identical phase range each extracted from the plurality of periods in the second direction of the image, The phase of the first signal and the phase of the second signal are different from each other. 8. The measuring device according to any one of items 1 to 7, (Item 9) the processing unit determines the position of the mark in the first direction based on a signal obtained by combining the first signal and the second signal after performing phase adjustment so that the phases of the first signal and the second signal match. 9. The measuring device according to item 8, characterized in that (Item 10) The phase of the first signal and the phase of the second signal are opposite to each other. are in opposite phase to each other, 9. The measuring device according to item 8, characterized in that (Item 11) the processing unit determines the position of the mark in the first direction based on a signal obtained by inverting the phase of one of the first signal and the second signal and adding the inverted phase to the other of the first signal and the second signal. 11. The measuring device according to item 10, (Item 12) the first signal is a one-dimensional integrated waveform signal obtained by integrating signals of a plurality of regions in the first identical phase range in the second direction, The second signal is a one-dimensional integrated waveform signal obtained by integrating signals of a plurality of regions in the second same phase range in the second direction. 9. The measuring device according to item 8, characterized in that (Item 13) the first signal is a one-dimensional integrated waveform signal obtained by integrating signals of a plurality of regions in the first identical phase range in the second direction, The second signal is a one-dimensional integrated waveform signal obtained by integrating signals of a plurality of regions in the second same phase range in the second direction. 12. The measuring device according to item 11, (Item 14) A lithography apparatus for transferring a pattern of an original onto a substrate, comprising: 14. A lithographic apparatus comprising the measurement device of any one of items 1 to 13 configured to measure a position of a mark on a substrate. (Item 15) A transfer step of transferring a pattern of a master to a substrate by the lithography apparatus according to item 14; a processing step of obtaining an article by processing the substrate that has been subjected to the transfer step; A method for manufacturing an article, comprising: (Item 16) 1. A method for measuring a position of a mark including a periodic array of a plurality of lines parallel to a tilt direction tilted with respect to a first direction, comprising: determining a period of the plurality of lines in a second direction perpendicular to the first direction based on an image of the mark, and determining a position of the mark in the first direction based on signals of a plurality of regions in the same phase range that are respectively extracted from the plurality of periods in the second direction of the image; A measuring method comprising:

[0043] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0044] PDM: detection module (processing section), MA1: alignment mark, MA2: alignment mark (diagonal mark), WIN_XO: measurement area, WA_XO: integrated waveform, (X2, Y2): center position of diagonal mark, OA: alignment detection system (imaging section)

Claims

1. A measuring device for measuring the position of a mark, An imaging unit for capturing the aforementioned mark, The system includes a processing unit that detects the position of the mark based on an image of the mark provided by the imaging unit, The image of the mark includes a periodic arrangement of multiple lines parallel to the inclination direction, which are inclined with respect to the first direction. The processing unit determines the position of the mark in the first direction based on the signals of multiple regions of the image. The plurality of regions are determined based on the period of the plurality of lines in a second direction perpendicular to the first direction. A measuring device characterized by the following features.

2. The aforementioned plurality of regions are regions within the same phase range of the period of the plurality of lines in the second direction. The measuring device according to feature 1.

3. The processing unit determines the position of the mark in the second direction based on the signals of a plurality of second regions of the image. The plurality of second regions are determined based on the period of the plurality of lines in the first direction. The measuring device according to feature 1.

4. The processing unit determines the position of the mark in the second direction based on the signals of a plurality of second regions of the image. The plurality of second regions are determined based on the period of the plurality of lines in the first direction, and are regions within the same phase range of the period of the plurality of lines in the first direction. The measuring device according to feature 2.

5. The processing unit determines the plurality of regions based on the line width, space width, and angle of the plurality of lines extracted from the image. The measuring device according to feature 1.

6. The processing unit performs a rough detection process to roughly detect the position of the mark, followed by a fine detection process to precisely detect the position of the mark, and in the fine detection process, determines the position of the mark in the first direction based on the signals of multiple regions within the same phase range. The measuring device according to feature 2.

7. The processing unit performs the rough inspection process by template matching. The measuring device according to claim 6.

8. The processing unit obtains a one-dimensional integrated waveform by integrating the signals from multiple regions of the same phase range in the second direction, and determines the position of the mark in the first direction based on the one-dimensional integrated waveform. The measuring device according to feature 2.

9. The processing unit determines the plurality of regions based on the line width, space width, and angle of the plurality of lines extracted from the image. The measuring device according to feature 8.

10. The processing unit determines the position of the mark in the first direction based on a first signal obtained from a plurality of regions of a first identical phase range extracted from the period of the plurality of lines in the second direction of the image, and a second signal obtained from a plurality of regions of a second identical phase range extracted from the period of the plurality of lines in the second direction of the image. The phases of the first signal and the phases of the second signal are different from each other. The measuring device according to feature 1.

11. The processing unit determines the position of the mark in the first direction based on a signal obtained by combining the phases of the first signal and the second signal after adjusting their phases so that their phases match. The measuring device according to claim 10.

12. The phases of the first signal and the second signal are in opposite phases to each other. The measuring device according to claim 10.

13. The processing unit determines the position of the mark in the first direction based on a signal obtained by inverting the phase of one of the first signal and the second signal and adding it to the other of the first signal and the second signal. The measuring device according to feature 12.

14. The first signal is a one-dimensional integrated waveform signal obtained by integrating signals from multiple regions of the first same phase range in the second direction. The second signal is a one-dimensional integrated waveform signal obtained by integrating signals from multiple regions of the same second phase range in the second direction. The measuring device according to claim 10.

15. The first signal is a one-dimensional integrated waveform signal obtained by integrating signals from multiple regions of the first same phase range in the second direction. The second signal is a one-dimensional integrated waveform signal obtained by integrating signals from multiple regions of the same second phase range in the second direction. The measuring device according to feature 13.

16. A lithography apparatus for transferring the pattern of an original plate onto a substrate, A lithography apparatus characterized by comprising a measuring device according to any one of claims 1 to 15, configured to measure the position of a mark on a substrate.

17. A transfer step of transferring the pattern of the master plate onto a substrate using the lithography apparatus described in claim 16, A processing step to obtain an article by processing the substrate that has undergone the transfer step, A method for manufacturing articles, characterized by including the following:

18. A measurement method for measuring the position of a mark that includes a periodic arrangement of multiple lines parallel to the inclination direction and inclined with respect to a first direction, Based on the signals from multiple regions of the image of the mark, the position of the mark in the first direction is determined. The plurality of regions are determined based on the period of the plurality of lines in a second direction perpendicular to the first direction. A measurement method characterized by the following.

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