Electronic part management method and electronic part storage body

Abstract

To provide an electronic part management method and an electronic part storage body that can realize various management forms at least on the manufacturer side for a storage body in which multiple electronic parts are stored.SOLUTION: A method includes: manufacturer steps which consist of a step in which multiple electronic parts are stored in a storage body that stores the electronic parts and is provided with an RFID tag, a step in which at least one piece of manufacturer-side information about the electronic parts stored in the storage body is written onto the RFID tag, and a step in which the storage body is shipped in which the manufacturer information is written onto the RFID tag and multiple electronic components are stored; and user steps which consist of a step in which the shipped storage body is received, a step in which the manufacturer information written in the RFID tag is imported, a step in which electronic circuit boards are prepared, and a step in which, based on the imported manufacturer information, the electronic parts are arranged on the electronic circuit boards.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a method for managing electronic components and a container for electronic components. [Background technology]

[0002] Conventionally, component manufacturers who manufacture small electronic components such as semiconductor chips and capacitor chips store a plurality of manufactured electronic components in one storage case, and transport and store them in the factory, and then ship the storage case to a set manufacturer. Known storage case forms include a carrier tape that holds electronic components one by one and is wound on a reel, a magazine that stores electronic components in an aligned state, a bulk case that stores electronic components in a loose, i.e., bulk, case, and bagging method (see, for example, Patent Document 1). Meanwhile, a technology is known for managing the manufacturing of goods, in which an RFID tag is attached to an individual to be managed, and a wireless tag system that reads ID information preset on the RFID tag is used (see, for example, Patent Document 2). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2005-324839 A [Patent Document 2] JP 2002-358494 A Summary of the Invention [Problem to be solved by the invention]

[0004] As electronic components become significantly smaller, it is considered to manage a large number of electronic components by using a container as a management object. However, the above-mentioned Patent Documents 1 and 2 do not mention the management of containers in various forms, and there is room for improvement.

[0005] The present invention aims to provide a method for managing electronic components and a housing for electronic components that enables at least the manufacturer to realize a variety of management forms for a housing that stores a plurality of electronic components. [Means for solving the problem]

[0006] The method for managing electronic components of the present invention comprises manufacturer-side steps carried out at a manufacturer facility that manufactures electronic components, the manufacturer-side steps including the steps of storing a plurality of electronic components in a storage body that stores the plurality of electronic components and has an RFID tag, writing at least one piece of manufacturer-side information related to the electronic components stored in the storage body to the RFID tag, and shipping the storage body in which the manufacturer-side information is written to the RFID tag and which stores a plurality of electronic components; and user-side steps carried out at a user facility that uses electronic components, the user-side steps including the steps of receiving the shipped storage body, reading the manufacturer-side information written to the RFID tag, preparing an electronic circuit board, and arranging the electronic components on the electronic circuit board based on the read-in manufacturer-side information.

[0007] The electronic component storage container of the present invention stores a plurality of electronic components produced by a manufacturer, is equipped with an RFID tag on which at least one manufacturer's information related to the electronic components is recorded, and is provided with the steps of the manufacturer managing product information of the electronic components based on the manufacturer's information, and the user of the electronic components placing the electronic components on an electronic circuit board based on the manufacturer's information. Effect of the Invention

[0008] According to the present invention, it is possible to provide a method for managing electronic components and a storage unit for electronic components that allows at least the manufacturer to realize a variety of management forms for a storage unit that stores a plurality of electronic components. [Brief description of the drawings]

[0009] [Figure 1] FIG. 2 is a perspective view illustrating an electronic component and a bulk case according to the embodiment. [Diagram 2] FIG. 1 is a plan view showing an RFID tag according to an embodiment. [Diagram 3] FIG. 2 is a diagram showing a method for managing electronic components according to the embodiment, and is a diagram showing the flow of electronic components between a component manufacturer and a set manufacturer. [Figure 4] 2 illustrates a hardware configuration for managing electronic components provided by a component manufacturer and an assembled product manufacturer according to an embodiment. [Diagram 5] FIG. 1 is a perspective view showing an example of a method for reading information from an RFID tag on a bulk case at a parts manufacturer. [Figure 6] FIG. 1 is a perspective view showing an example of a method for reading information from an RFID tag of a bulk case picked up from a storage location at a parts manufacturer. [Figure 7] FIG. 1 is a perspective view showing a bulk case to which a label has been attached by a parts manufacturer. [Figure 8] FIG. 1 is a perspective view showing an example of a packaging method for multiple bulk cases when shipping the bulk cases. [Figure 9] FIG. 13 is a perspective view showing a case where an RFID tag is read during transportation of multiple bulk cases packed at the time of shipment. [Figure 10] FIG. 11 is a perspective view showing another method for reading an RFID tag at the time of shipment. [Figure 11] FIG. 11 is a perspective view showing a bulk case on which an identification sticker has been affixed by a set manufacturer. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, embodiments will be described with reference to the drawings. Fig. 1 shows a bulk case 20 as a storage body according to this embodiment, and electronic components 10 stored in the bulk case 20. Fig. 2 shows an example of the configuration of an RFID tag 30 provided in the bulk case 20. Fig. 3 shows a flow in which multiple bulk cases 20 containing multiple electronic components 10 are shipped from component manufacturer G, which manufactures electronic components 10, and the shipped multiple bulk cases 20 are received by set manufacturer S for use. Fig. 4 shows a hardware configuration for managing electronic components 10 provided by component manufacturer G and set manufacturer S, respectively. Component manufacturer G is an example of a manufacturer-side facility. Set manufacturer S is an example of a user-side facility that uses electronic components 10.

[0011] 1, the bulk case 20 is a box formed into a thin rectangular parallelepiped shape from a rigid body such as resin. The bulk case 20 stores, for example, thousands to tens of thousands of electronic components 10 in a loose, i.e. bulk, state. The bulk case 20 includes an RFID tag 30. The RFID tag 30 is formed of a long, thin adhesive sticker, and is attached to one end surface of the bulk case 20 or stored within the bulk case 20.

[0012] The electronic component 10 according to this embodiment is a capacitor, an inductor, or the like, and is a small electronic component having a rectangular parallelepiped shape with a longitudinal length of, for example, 1.2 mm or less.

[0013] As shown in FIG. 2, the RFID tag 30 is a passive transponder having a rectangular resin sheet 30a as a base material, an RFID chip 30b consisting of a semiconductor integrated circuit, and a plurality of antennas 30c for communicating with external devices. The RFID chip 30b and the antenna 30c are attached to the sheet 30a. The RFID tag 30 may be a type in which the RFID chip 30b and the antenna 30c are embedded in the sheet 30a. It may also be a type that includes a power supply unit. The RFID chip 30b includes a CPU, a memory, a communication circuit, and the like. The RFID tag 30 of this embodiment has a unique ID.

[0014] The RFID tag 30 can be of a type in which the memory cannot be rewritten (RO: Read Only), can be rewritten once (WORM: Write Once Read Many), can be rewritten (R / W: Read and Write), etc. When the RFID tag 30 is of the RO or WORM type, the amount of information that can be written is less than that of the R / W type, but the cost is lower.

[0015] 3, the parts manufacturer G is equipped with a writer unit 40 capable of writing manufacturer information, which is information on the part manufacturer G's side, to the RFID tag 30 equipped on the bulk case 20, a reader unit 42 that reads the manufacturer information recorded on the RFID tag 30 equipped on the bulk case 20, and a database server 44. Note that the writer unit 40 and the reader unit 42 may be integrated into a reader / writer unit.

[0016] The writer unit 40 includes a plurality of RFID writers 41 capable of writing information contactlessly. Each of the plurality of RFID writers 41 is disposed at a predetermined location in the factory of the parts manufacturer G. The RFID writer 41 writes and records the manufacturer information read from the database server 44 to the RFID tag 30 contactlessly. The reader unit 42 includes a plurality of RFID readers 43 capable of reading the manufacturer information contactlessly. Each of the plurality of RFID readers 43 is disposed at a predetermined location in the factory of the parts manufacturer G. The information read by the RFID reader 43 is input to the database server 44.

[0017] The set maker S includes a writer unit 50 capable of writing user information, which is information on the part of the set maker S, to the RFID tag 30 provided in the bulk case 20, a reader unit 52 that reads the manufacturer information and user information recorded in the RFID tag 30 provided in the bulk case 20, a database server 54, and a mounter 56. If the RFID tag 30 is of the WORM type, the writer unit 50 may be omitted.

[0018] The writer unit 50 includes a plurality of RFID writers 51 capable of writing information contactlessly. Each of the plurality of RFID writers 51 is disposed at a predetermined location in the factory of the set manufacturer S. The RFID writer 51 writes and records predetermined user-side information from the user-side information held by the database server 54 into the RFID tag 30. The reader unit 52 includes a plurality of RFID readers 53 capable of reading the manufacturer-side information and the user-side information contactlessly. Each of the plurality of RFID readers 53 is disposed at a predetermined location in the factory of the parts manufacturer G. The information read by the RFID reader 53 is input to the database server 54.

[0019] The mounter 56 includes a plurality of component supply devices 57. A bulk case 20 is set in each component supply device 57, and electronic components 10 in the bulk case 20 are supplied to each component supply device 57. Each component supply device 57 is a device that incorporates at least one electronic component 10 into an electronic device set.

[0020] Parts manufacturer G stores multiple electronic components 10 manufactured in its factory in bulk cases 20, transports and stores the electronic components 10, and ships them to set manufacturer S. Set manufacturer S receives multiple bulk cases 20 and uses mounter 56 to assemble electronic components 10 stored in bulk cases 20 into an electronic device set.

[0021] The electronic device sets that are manufactured by set manufacturer S include, for example, information terminal devices such as smartphones and tablets, or components such as electronic circuit boards that make up such devices.

[0022] The database server 44 on the part manufacturer G side and the database server 54 on the set manufacturer S side can be connected to a cloud 60 on the internet. The cloud 60 is an example of a server. A part of the information stored in the database server 44 on the part manufacturer G side is also stored in the cloud 60 on the internet. A part of the information stored in the database server 54 on the set manufacturer S side is also stored in the cloud 60 on the internet. By both accessing the cloud 60, the part manufacturer G and the set manufacturer S can share information with each other.

[0023] The component manufacturer G performs the packaging process, inspection process, and shipping process of the electronic component 10. The set manufacturer S performs the receiving process of the electronic component 10, and the manufacturing process including storage and removal, and the processing process. Hereinafter, the flow of the electronic component 10 between the component manufacturer G and the set manufacturer S will be described with reference to FIG.

[0024] (Manufacturer step at parts manufacturer G) In the packaging process, a plurality of manufactured electronic components 10 are stored in a bulk case 20 (step S101). A plurality of pieces of manufacturer-side information related to the stored electronic components 10, which are set or held by the component manufacturer G, are recorded by a predetermined RFID writer 41 on the RFID tag 30 of the bulk case 20 storing the plurality of electronic components 10 (step S102). The manufacturer-side information recorded on the RFID tag 30 includes the lot number of the electronic components 10, the quantity of the electronic components 10 stored in the bulk case 20, product information related to the electronic components 10, environmental information related to the electronic components 10, the ID number of the bulk case 20, the inspection number of the electronic components 10, and the like. Depending on the type of electronic component 10, a moisture sensitivity level (MSL) is recorded. The MSL is a level that indicates the risk of a phenomenon in which volume expansion occurs due to evaporation of moisture contained in the electronic components 10, leading to failure.

[0025] Next, a specific RFID reader 43 reads the information recorded on the RFID tag 30 of one bulk case 20, for example a unique ID (inherent ID) (step S103). The above-mentioned manufacturer information recorded on the RFID tag 30 is associated with each bulk case 20, and this information is stored in the database server 44. To read the information on the RFID tag 30, for example, as shown in Fig. 5, the RFID tag 30 of the bulk case 20 placed on a table 61 is read by the RFID reader 43 installed on the table 61.

[0026] The bulk cases 20, whose unique IDs have been read from the RFID tags 30, are transported within the factory and stored in a prescribed storage location (step S104). Then, until the next inspection and processing step, for example, inventory information management within the factory, location management based on the movement route, crime prevention management, etc. are performed based on the manufacturer information recorded on the RFID tags 30. Inventory information management, location management, and crime prevention management are performed based on information read by an RFID reader 43 installed within the factory. The RFID reader 43 is installed, for example, at a gate installed in an aisle or an entrance to a room, and reads the manufacturer information recorded on the RFID tag 30 when a bulk case 20 passes through.

[0027] Inventory information management involves managing inventory by checking whether or not the bulk case 20 is stored in a specified storage location. For example, when passing through a gate installed at the entrance to the specified storage location, the RFID tag 30 is read by the RFID reader 43 installed at the gate, and it is confirmed that the bulk case 20 is in stock.

[0028] Location management involves keeping track of the location of the bulk case 20 within the factory at all times as the bulk case 20 is transported within the factory by passing through multiple gates and entering and exiting specified rooms.

[0029] Security management involves, for example, when a bulk case 20 is taken outside the factory without confirmation of shipment by, for example, an RFID tag 30, determining that it has not been shipped via a regular route, and measures such as issuing a warning are taken.

[0030] In the inspection and shipping process, the bulk case 20 is picked from the storage location (step S105), and then the manufacturer information recorded on the RFID tag 30 is read (step S106).

[0031] 6, for example, a bulk case 20 is picked from a storage location 62 such as a storage shelf and placed on a transport cart 63, and the manufacturer information recorded on the RFID tag 30 on the cart 63 is read by an RFID reader 43 via a sensor 64. The RFID reader 43 is installed at an appropriate location on the cart 63. As a result, the fact that the bulk case 20 is to be shipped is input to a database server 44. When the bulk case 20 is farther away than the readable distance of the RFID reader 43, it is advisable to read the manufacturer information recorded on the RFID tag 30 via the sensor 64 that is in close proximity to the bulk case 20 in this manner.

[0032] The part number used by set manufacturer S, the order number from set manufacturer S, the factory number of parts manufacturer G, the date of manufacture, the vendor number, etc. are written by RFID writer 41 onto the RFID tag 30 of the picked bulk case 20 as new manufacturer-side information (step S107).

[0033] In this embodiment, as shown in Fig. 7, a label 71 is attached to the bulk case 20 (step S108). At least one of the manufacturer information written in the RFID tag 30 or other manufacturer information required at the time of shipment is printed on the label 71. The manufacturer information printed on the label 71 can be visually confirmed. The label 71 may include at least one of a one-dimensional barcode and a two-dimensional barcode linked to the manufacturer information.

[0034] The unique ID of the RFID tag 30 of each bulk case 20 is read by the RFID reader 43, and the bulk case 20 is inspected (step S109).

[0035] The inspected bulk cases 20 are packed into boxes and shipped to the set manufacturer S (step S110). For example, as shown in Fig. 8, a predetermined number of bulk cases 20 are stored in one exterior box 81, and the multiple exterior boxes 81 are stored in a double-stacked state in one outer transport box 82, and the multiple outer transport boxes 82 are further loaded on a pallet 83.

[0036] The exterior box 81 may be equipped with an RFID tag 31. Furthermore, the transport outer box 82 may be equipped with an RFID tag 32. Furthermore, the pallet 83 may be equipped with an RFID tag 33. In this way, information about the stored bulk cases 20 for each exterior box 81, each transport outer box 82, and each pallet 83 is recorded in the respective RFID tags 31, 32, and 33, and can be linked to the multiple packed bulk cases 20 for collective management.

[0037] When a plurality of outer transport boxes 82 are loaded onto a pallet 83 as described above, the pallet 83 is transported to a shipping location by a forklift 65 as shown in Fig. 9. When the forklift 65 passes through a gate 66, an RFID reader 43 reads the RFID tags 31, 32, and 33 via a sensor 64 disposed at the gate 66, thereby enabling shipping management to be performed to confirm that a plurality of bulk cases 20 linked to the RFID tags 31, 32, and 33 have been shipped.

[0038] Fig. 10 shows another mode for reading the RFID tag 30 at the time of shipment. In Fig. 10, an exterior box 81 housing a bulk case 20 being transported on a transport platform 67 is transported through a tunnel-shaped gate 68, while an RFID reader 43 reads the RFID tag 30 via a sensor 64 provided at the gate 68.

[0039] Returning to FIG. 4, the flow of the electronic component 10 on the set manufacturer S side will be described.

[0040] (User step at Set Maker S) At the beginning of the receiving process, the bulk case 20 is received at the set manufacturer S (step S111). The RFID tag 30 of the received bulk case 20 is read by a predetermined RFID reader 53 on the set manufacturer S side (step S112). This allows receiving management to confirm that the bulk case 20 has been received, and inspection of the electronic components 10 to be performed. If any defects are found during the inspection process, the bulk case 20 may be returned to the component manufacturer G.

[0041] Predetermined user information required by the set manufacturer S is written as additional information into the RFID tag 30 of each of the received bulk cases 20 (step S113). In addition, identification information used by the set manufacturer S is written as additional information into each RFID tag 30.

[0042] 11, an identification sticker 72 unique to the set manufacturer S is attached to the bulk case 20 (step S114). The identification sticker 72 is a sticker having one of a single color such as red, blue, or yellow, and may be attached to the label 71. Depending on the color of the identification sticker 72, a different procedure is performed on the bulk case 20 within the set manufacturer S. For example, a production line, a production order, and the like are selected depending on the color of the identification sticker 72.

[0043] At the set manufacturer S, when the bulk case 20 is stored in a designated storage location before moving on to the manufacturing process, or picked from the storage location and transported, the set manufacturer S can read the manufacturer information and user information on the RFID tag 30, just like the parts manufacturer G, and perform inventory information management, location management, crime prevention management, etc.

[0044] In the manufacturing process, the bulk cases 20 are delivered to a mounter 56 that places electronic components 10 on electronic circuit boards of electronic device sets, and are set in a component supply device 57. In each component supply device 57, the RFID tag 30 of the bulk case 20 is read and the components are verified (step S115). For example, if a bulk case 20 that stores a component that does not fit the component supply device 57 is set, the component supply device 57 does not operate, the bulk case 20 is removed from the component supply device 57, and the next bulk case 20 is set.

[0045] The electronic components 10 are supplied one by one from the bulk case 20 set in the component supply device 57 to the mounter 56, and the electronic components 10 are mounted on an electronic circuit board (step S116). When all of the electronic components 10 in the bulk case 20 have been mounted, the empty bulk case 20 is removed from the component supply device 57 and discarded (step S117). The empty bulk case 20 may be returned to the component manufacturer G for reuse.

[0046] In the process after the manufacturing process, for example, the bulk case 20 in which the electronic components 10 remain is stored in a predetermined location as an intermediate inventory. In this case, the RFID tag 30 of the bulk case 20 is read by the RFID reader 53, and the remaining amount of the bulk case 20 is managed as intermediate inventory (step S118).

[0047] In addition, during the processing process, by reading the RFID tag 30 on the bulk case 20, it is possible to perform production trend management based on the type of electronic components 10 used and the quantity of electronic device sets being manufactured, as well as security management of the bulk case 20. The additional information in step S113 and the user-side information required in step S118 may be stored in the cloud 60. In addition, the additional information stored in the cloud 60 in step S113 and the user-side information required in step S118 may be made accessible to the parts manufacturer G. By making it accessible to the parts manufacturer G, the parts manufacturer G can grasp the specifications and inventory information of the set manufacturer S, and therefore can predict the requests of the set manufacturer S in advance and can flexibly respond to the requests of the set manufacturer S. The data stored on the cloud 60 may be stored using a blockchain. By using a blockchain, it becomes difficult to tamper with the data stored on the cloud 60, and the reliability of the data stored on the cloud 60 is increased.

[0048] According to the embodiment described above, the following effects are achieved. The method for managing electronic components 10 in this embodiment includes manufacturer-side steps performed by a component manufacturer G that manufactures electronic components 10, including the steps of storing a plurality of electronic components 10 in a bulk case 20 serving as a storage body that stores a plurality of electronic components 10 and has an RFID tag 30, writing at least one piece of manufacturer-side information related to the electronic components 10 stored in the bulk case 20 to the RFID tag 30, and shipping the bulk case 20 in which the manufacturer-side information has been written to the RFID tag 30 and in which a plurality of electronic components 10 are stored; and user-side steps performed by a set manufacturer S, serving as a user facility that uses electronic components 10, including the steps of receiving the shipped bulk case 20, reading the manufacturer-side information written in the RFID tag 30, preparing an electronic circuit board, and arranging the electronic components 10 on the electronic circuit board based on the read-in manufacturer-side information.

[0049] As a result, for bulk cases 20 storing a plurality of electronic components 10, various forms of management can be realized at least on the part manufacturer G side by utilizing the RFID tag 30 provided on the bulk case 20. In this embodiment, various forms of management can also be realized on the set manufacturer S side, into which bulk cases 20 equipped with RFID tags 30 are received, by utilizing the RFID tag 30. Furthermore, by utilizing the RFID tag 30, consistent management of parts can be achieved from the part manufacturer G to the set manufacturer S.

[0050] In this embodiment, the manufacturer information recorded on the RFID tag 30 is at least one of the lot number of the electronic component 10, the quantity of electronic components 10 stored in the bulk case 20, product information regarding the electronic component 10, environmental information regarding the electronic component 10, the ID number of the bulk case 20, the inspection number of the electronic component 10, etc.

[0051] This allows management of electronic components 10 for each bulk case 20 in terms of the quantity of electronic components 10, product information about the electronic components 10, environmental information about the electronic components 10, the ID number of the bulk case 20, the inspection number of the electronic components 10, etc.

[0052] In this embodiment, the manufacturer information recorded on the RFID tag 30 further includes the part number used by the set manufacturer S, the order number from the set manufacturer S, the factory number of the parts manufacturer G, the date of manufacture, the vendor number, etc.

[0053] This makes it possible to manage electronic components 10 for each bulk case 20 in terms of the part number used by the set manufacturer S, the order number from the set manufacturer S, the factory number of the parts manufacturer G, the date of manufacture, the vendor number, etc. Also, it is possible to record the history of information on electronic components used in an electronic device set.

[0054] In this embodiment, the user step allows additional information to be written to the RFID tag 30 .

[0055] This allows the set manufacturer S to newly add necessary information to the RFID tag, and allows the set manufacturer S to perform management using the RFID tag 30.

[0056] In this embodiment, the additional information written by the set manufacturer S to the RFID tag 30 includes a unique ID used by the set manufacturer S.

[0057] This allows the set manufacturer S to link the bulk case 20 to the database server 54 and perform individual identification and tracking management for each bulk case 20 .

[0058] In this embodiment, the manufacturer-side step includes a step of saving the manufacturer-side information written to the RFID tag 30 by the component manufacturer G and the additional information written to the RFID tag 30 by the set manufacturer S in a database server 44 in a cloud 60 on the Internet, and also includes a step of saving in a database server 54 at the component manufacturer G and the set manufacturer S, and the component manufacturer G and the set manufacturer S are able to read the manufacturer-side information and the additional information from the database servers 44 and 54.

[0059] As a result, the component manufacturer G and the set manufacturer S can learn each other's information by accessing the cloud 60. Therefore, for example, the component manufacturer G can grasp the inventory status of the electronic components 10 at the set manufacturer S and perform predictive operations such as appropriately adjusting the manufacturing pace of the electronic components 10.

[0060] In this embodiment, the manufacturer side step includes a step of reading manufacturer side information from database server 44 .

[0061] This allows the electronic components 10 to be managed for each bulk case 20 based on the unique information provided by component manufacturer G, which is recorded in database server 44. It is not necessary to use database server 44, and all information exchange may be performed via RFID tags.

[0062] The bulk case 20 serving as a storage body in this embodiment stores a plurality of electronic components 10 manufactured by a component manufacturer G, which is the manufacturer, and is equipped with an RFID tag 30 on which at least one piece of manufacturer information relating to the electronic components 10 is recorded. The process includes a step in which component manufacturer G manages product information for the electronic components 10 based on the manufacturer information, and a step in which set manufacturer S, which is the user of the electronic components 10, places the electronic components 10 on an electronic circuit board based on the manufacturer information.

[0063] As a result, by using the RFID tag 30, multiple parts stored in the bulk case 20 can be managed in a consistent manner from the parts manufacturer G to the set manufacturer S.

[0064] Although the embodiment has been described above, the present invention is not limited to the above-described embodiment, and the present invention includes modifications and improvements within the scope of the present invention that can achieve the object of the present invention. [Explanation of symbols]

[0065] 10. Electronic Components 20 Bulk case (storage unit) 30 RFID tags 60 Cloud (Server) G Parts manufacturer (manufacturing facility) S Set manufacturer (user facility)

Claims

1. A manufacturer step performed at a manufacturer facility that manufactures electronic components, comprising: storing a plurality of electronic components in a storage container that stores the plurality of electronic components and includes an RFID tag; writing at least one piece of manufacturer information related to the electronic components housed in the housing to the RFID tag; storing the manufacturer information written on the RFID tag in a server at the manufacturer facility; a manufacturer-side step including a step of shipping the housing in which the manufacturer-side information is written to the RFID tag and a plurality of electronic components are housed; A user-side step performed at a user-side facility that uses the electronic component, receiving the shipped container; reading the manufacturer information written in the RFID tag; providing an electronic circuit board; and a user-side step including a step of placing the electronic component on the electronic circuit board based on the read manufacturer-side information, The user-side step includes a step of writing additional information to the RFID tag; The user side step includes a step of storing the additional information written in the RFID tag in the server at the user side facility; The electronic component management method, wherein the manufacturer-side information and the additional information can be read from the server at the manufacturer-side facility and the user-side facility.

2. A manufacturer step performed at a manufacturer facility that manufactures electronic components, comprising: storing a plurality of electronic components in a storage container that stores the plurality of electronic components and includes an RFID tag; writing at least one piece of manufacturer information related to the electronic components housed in the housing to the RFID tag; a manufacturer-side step including a step of shipping the housing in which the manufacturer-side information is written to the RFID tag and a plurality of electronic components are housed; A user-side step performed at a user-side facility that uses the electronic component, receiving the shipped container; reading the manufacturer information written in the RFID tag; providing an electronic circuit board; and a user-side step including a step of placing the electronic component on the electronic circuit board based on the read manufacturer-side information, In the manufacturer step, a label is attached to the storage body on which at least one piece of manufacturer information written in the RFID tag is printed.

3. 3. The method for managing electronic components according to claim 1, wherein the manufacturer information is at least one of a lot number of the electronic component, an inspection number of the electronic component, and an ID number of the container.

4. 3. The electronic component management method according to claim 1, wherein the manufacturer information includes a part number used at the user facility, an order number from the user, a factory number of the manufacturer, a manufacturing date, and a vendor number.

5. The method for managing electronic components according to claim 1 , wherein the additional information includes a unique ID used at the user facility.

6. 6. The method for managing electronic parts according to claim 1, wherein said manufacturer-side step includes a step of reading said manufacturer-side information from a database.

7. storing a plurality of electronic components manufactured by a manufacturer; an RFID tag on which at least one piece of manufacturer-side information relating to the electronic component is recorded; a step of managing product information of the electronic component on the manufacturer side based on the manufacturer side information; a step in which a user of the electronic component places the electronic component on an electronic circuit board based on the manufacturer's information, A container for electronic components is affixed with a label on which at least one piece of manufacturer information written in the RFID tag is printed.

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