Surface shape measuring device and surface shape measuring method

The device miniaturizes surface shape measurement for specular reflective surfaces by using direct illumination and imaging without a half mirror, enhancing measurement accuracy and reducing device size.

JP2024168264APending Publication Date: 2024-12-05RESONAC CORP +1

Patent Information

Application Number
JP2023084778
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-05-23
Publication Date
2024-12-05

AI Technical Summary

Technical Problem

Existing surface shape measuring devices for specular reflective surfaces are either large in size due to oblique illumination or require a demultiplexing and multiplexing optical system using a half mirror, which increases the device's dimensions.

Method used

A surface shape measuring device that irradiates a specular reflective surface with a first pattern light, captures a second pattern of light reflected by the surface using an imaging unit, and processes the image to determine the surface shape, without requiring oblique illumination or a half mirror-based optical system, thus allowing for miniaturization.

Benefits of technology

The device can be made smaller and more compact while effectively measuring the surface shape of specular reflective surfaces, reducing measurement errors and simplifying image processing.

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Abstract

To provide a surface shape measuring device for a specular surface that can be miniaturized.SOLUTION: A surface shape measuring device is the surface shape measuring device for a specular surface and comprises: an irradiation unit which emits first pattern light to a specular surface; an imaging unit which images second pattern light being the light passing through the irradiation unit after the first pattern light emitted from the irradiation unit is reflected on the specular surface; and a processing unit which acquires a positional deviation amount of the second pattern light from a prescribed position in the photographed image by the imaging unit and outputs information related to the surface shape of the specular surface obtained from the positional deviation amount.SELECTED DRAWING: Figure 1
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Description

[Technical field]

[0001] The present disclosure relates to a surface profile measuring apparatus and a surface profile measuring method. [Background technology]

[0002] For example, Patent Document 1 discloses an apparatus that reflects a pattern displayed on the surface of a target with a specular reflecting surface, records an image of the reflected light, and measures the shape of the specular reflecting surface based on the positional relationship between the image of the reflected light and the pattern. Patent Document 2 discloses an apparatus that includes a half mirror that splits light from an illumination unit between the optical path of a camera and the surface of the object, and captures the reflected light from the surface of the object that has passed through the half mirror with a camera for inspection, in order to inspect a surface of an object that is close to a mirror surface. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2010-197391 A [Patent Document 2] JP 2004-354283 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, the device described in Patent Document 1 may become large because it illuminates a pattern from an oblique direction on the specular reflecting surface to be measured and records an image obtained by the illumination light reflected by the surface to be measured.The device described in Patent Document 2 may become large because it places a splitting and multiplexing optical system using a half mirror between the specular reflecting surface and an imaging unit such as a camera.

[0005] An object of the present disclosure is to provide a surface shape measuring device for a specular reflective surface that can be made compact, and a surface shape measuring method using the same. [Means for solving the problem]

[0006] A surface shape measuring device according to one embodiment of the present disclosure is a surface shape measuring device for a specular reflective surface, and includes an irradiation unit that irradiates a first pattern light onto the specular reflective surface, an imaging unit that images a second pattern light, which is light that transmits through the irradiation unit after the first pattern light irradiated from the irradiation unit is reflected by the specular reflective surface, and a processing unit that obtains an amount of positional deviation from a predetermined position of the second pattern light in an image captured by the imaging unit, and outputs information regarding the surface shape of the specular reflective surface obtained from the amount of positional deviation. Effect of the Invention

[0007] According to the embodiments of the present disclosure, it is possible to provide a surface shape measuring device for a specular reflective surface that can be miniaturized, and a surface shape measuring method using the same. [Brief description of the drawings]

[0008] [Figure 1] 1 is a diagram illustrating a schematic diagram of an overall configuration of a surface profile measuring apparatus according to an embodiment. [Diagram 2] FIG. 2 is a diagram illustrating a configuration of an irradiation unit according to an embodiment. [Diagram 3] FIG. 2 is a diagram illustrating the angle of view of a telecentric lens. [Figure 4] FIG. 2 is a diagram illustrating the angle of view of a non-telecentric lens. [Diagram 5] FIG. 13 is a diagram showing an arrangement of a plurality of subjects with different subject distances. [Figure 6] 6 is a diagram showing an image of the subject in FIG. 5 captured using a telecentric lens. [Figure 7] 6 is a diagram showing an image of the subject in FIG. 5 captured using a non-telecentric lens. [Figure 8] FIG. 2 is a diagram illustrating a schematic view of an irradiation unit when a telecentric lens is used. [Figure 9] FIG. 2 is a diagram illustrating a schematic view of an irradiation unit when a non-telecentric lens is used. [Figure 10]FIG. 2 is a block diagram showing a hardware configuration of a processing unit according to the embodiment. [Figure 11] FIG. 2 is a block diagram showing a functional configuration of a processing unit according to the embodiment. [Figure 12] 13A and 13B are diagrams illustrating captured images of second pattern light according to the embodiment. [Figure 13] FIG. 13 is an enlarged view of region IV in FIG. [Figure 14] 10A to 10C are diagrams illustrating an amount of positional deviation of a second patterned light according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In each drawing, the same components are given the same reference numerals, and duplicated explanations will be omitted as appropriate.

[0010] The embodiments shown below are examples of a surface profile measuring device and a surface profile measuring method for embodying the technical ideas of the present disclosure, and the present disclosure is not limited to the embodiments shown below. The dimensions, materials, shapes, relative positions, etc. of the components described below are intended to be illustrative, and not to limit the scope of the present disclosure, unless otherwise specified. In addition, the sizes and positional relationships of the components shown in the drawings may be exaggerated to clarify the explanation.

[0011] <Configuration Example of Surface Profile Measuring Apparatus 100> 1 is a diagram illustrating an example of the overall configuration of a surface profile measuring apparatus 100 according to an embodiment. The surface profile measuring apparatus 100 is an apparatus that measures the surface profile of a specular reflecting surface S. The specular reflecting surface S corresponds to an object to be measured by the surface profile measuring apparatus 100. As shown in FIG. 1, the surface profile measuring apparatus 100 has an irradiation unit 1, an imaging unit 2, a lens 3, and a processing unit 4.

[0012] The irradiation unit 1 irradiates a first pattern light L1 onto a specular reflection surface S. The imaging unit 2 images a second pattern light L2, which is light that is transmitted through the irradiation unit 1 after the first pattern light L1 irradiated from the irradiation unit 1 is reflected by the specular reflection surface S.

[0013] More specifically, the first pattern light L1 is irradiated onto the specular reflecting surface S in a direction substantially along the normal line S0 of the specular reflecting surface S. The first pattern light L1 from the irradiation unit 1 is reflected by the specular reflecting surface S in a direction substantially along the normal line S0 of the specular reflecting surface S. The second pattern light L2 is light that is transmitted through the irradiation unit 1 after the first pattern light L1 irradiated from the irradiation unit 1 is reflected by the specular reflecting surface S. After transmitting through the irradiation unit 1, the second pattern light L2 further transmits through the lens 3 to reach the imaging plane 21 of the imaging unit 2. The imaging unit 2 captures an image of the second pattern light L2 that has reached the imaging plane 21.

[0014] The lens 3 is disposed between the irradiation unit 1 and the imaging unit 2. The lens barrel 31 houses the lens 3 inside. The lens 3 substantially forms an image of the second pattern light L2 on the imaging surface 21 of the imaging unit 2. The number of lenses constituting the lens 3, their arrangement, the number of lens surfaces, the shape of the lens surfaces, the lens material, and the like can be appropriately selected depending on the specifications of the surface profile measuring apparatus 100, etc.

[0015] The lens 3 may be a telecentric lens. This telecentric lens will be described in detail later with reference to Figs. 6 to 12. The imaging unit 2 can capture an image of the second pattern light L2 that is reflected by the specular reflecting surface S and then transmitted through the lens 3.

[0016] The processing unit 4 receives the captured image from the imaging unit 2. The processing unit 4 obtains the amount of positional deviation of the second pattern light L2 from a predetermined position in the captured image by the imaging unit 2, and outputs information about the surface shape of the specular reflecting surface S obtained from the amount of positional deviation.

[0017] Here, a method for acquiring information about the surface shape of the specular reflecting surface S by the surface shape measuring device 100 will be described. The pattern contained in the second pattern light L2, which is obtained when the irradiated first pattern light L1 is reflected by the specular reflecting surface S, which is an ideal flat surface, is approximately the same as the pattern contained in the first pattern light L1. On the other hand, the pattern contained in the second pattern light L2, which is obtained when the irradiated first pattern light L1 is reflected by the specular reflecting surface S, which has a shape error with respect to the ideal flat surface, is misaligned with respect to the pattern contained in the first pattern light L1, resulting in a distorted pattern. The misalignment of the second pattern light L2 with respect to the first pattern light L1 corresponds to the shape error of the specular reflecting surface S with respect to the ideal flat surface.

[0018] The surface profile measuring apparatus 100 acquires an amount of distortion of a pattern included in the second pattern light L2 relative to a pattern included in the first pattern light L1, i.e., an amount of positional deviation of the second pattern light L2 relative to the first pattern light L1, in an image of the second pattern light L2 captured by the imaging unit 2. The surface profile measuring apparatus 100 acquires information on the surface profile of the specular reflecting surface S as a deviation of the specular reflecting surface S relative to an ideal flat surface, based on the amount of positional deviation of the second pattern light L2 relative to the first pattern light L1. The surface profile measuring apparatus 100 can output the acquired information on the surface profile of the specular reflecting surface S as a surface profile measurement result of the specular reflecting surface S.

[0019] The position of the first pattern light L1, which is the reference for the positional deviation of the second pattern light L2, corresponds to a "predetermined position." Prior to measuring the specular reflection surface S to be measured, the surface profile measuring device 100 acquires a reference captured image corresponding to the captured image of the first pattern light L1 by capturing an image of the second pattern light L2 reflected by a reference specular reflection surface having an ideal flat surface using the imaging unit 2. The position of the pattern included in the reference captured image corresponds to the position of the first pattern light L1 and corresponds to the "predetermined position." The surface profile measuring device 100 can acquire the amount of positional deviation of the second pattern light L2 from the predetermined position by comparing the pattern included in the image captured by the imaging unit 2 of the second pattern light L2 reflected by the specular reflection surface S to be measured with the pattern included in the reference captured image.

[0020] The processing unit 4 outputs the measurement results of the surface shape of the specular reflecting surface S to an external device. Examples of the external device include an external PC (Personal Computer), a display device, a storage device, and a communication device that communicates with an external server or the like via a network.

[0021] Here, for example, in a surface shape measuring device that uses the second pattern light L2 that is reflected by the specular reflecting surface S and does not pass through the irradiation unit 1, the irradiation unit and the imaging unit are arranged in a direction inclined, i.e., oblique, with respect to the normal line S0 of the specular reflecting surface S, so the device may become large. Alternatively, for example, in a surface shape measuring device that arranges a splitting and multiplexing optical system using a half mirror between the specular reflecting surface and the imaging unit, the device may become large.

[0022] In this embodiment, the surface profile measuring device 100 captures the second pattern light L2, which is light transmitted through the irradiation unit 1, by the imaging unit 2 after the first pattern light L1 irradiated from the irradiation unit 1 is reflected by the specular reflection surface S. The surface profile measuring device 100 measures the surface profile of the specular reflection surface S based on this captured image. In this embodiment, the irradiation unit 1 and the imaging unit 2 are not arranged in a direction inclined with respect to the normal line S0 of the specular reflection surface S, so that it is possible to provide a surface profile measuring device 100 that can be made smaller than the case where the irradiation unit and the imaging unit are arranged in a direction inclined with respect to the normal line S0 of the specular reflection surface S. In addition, in this embodiment, a splitting and multiplexing optical system using a half mirror is not arranged between the specular reflection surface S and the imaging unit 2, so that it is possible to provide a surface profile measuring device 100 that can be made smaller than the case where a splitting and multiplexing optical system using a half mirror is arranged between the specular reflection surface S and the imaging unit 2. From the viewpoint of miniaturizing the surface profile measuring device 100, it is preferable that the irradiation unit 1 and the imaging unit 2 are arranged on the normal line S0 of the specular reflection surface S. From the viewpoint of miniaturizing the surface profile measuring apparatus 100, it is more preferable that the center 10 of the irradiation unit 1 and the center 20 of the imaging unit 2 are disposed on the normal line S0 of the specular reflection surface S. Note that, in this embodiment, the lens 3 does not necessarily have to be provided. The above-mentioned effects can be obtained even when the lens 3 is not provided.

[0023] <Configuration example of irradiation unit 1> 2 is a diagram illustrating an example of a detailed configuration of the irradiation unit 1. As illustrated in FIG. 2, the irradiation unit 1 has a light source 12, a light guide plate 13, a light emitting unit 14, and a light blocking unit 15.

[0024] The light source 12 may be an LED (Light Emitting Diode) or the like. The light source 12 is disposed at a position where light emitted from the light source 12 can enter the inside of the light guide plate 13. The irradiation unit 1 may have one or more light sources 12 outside the light guide plate 13. In the example shown in FIG. 2, the irradiation unit 1 has a pair of light sources 12 disposed on both sides of the light guide plate 13.

[0025] The light guide plate 13 has a light incident surface 131, a first main surface 132, and a second main surface 133. The light incident surface 131 intersects with each of the first main surface 132 and the second main surface 133. The first main surface 132 and the second main surface 133 are substantially parallel. Note that "substantially parallel" means that they may be deviated from parallel by 10 degrees or less.

[0026] The light guide plate 13 guides the light emitted from the light source 12 and incident inside through the light incident surface 131. The light guide plate 13 can guide the incident light while totally reflecting it at each of the first main surface 132 and the second main surface 133. For example, the light source 12 can be an LED that emits white light.

[0027] Light-emitting section 14 is disposed on the surface of light guide plate 13, and is a section that emits fluorescence when light guided by light guide plate 13 is incident thereon. Light-emitting section 14 may be disposed inside light guide plate 13, rather than on the surface of light guide plate 13. For example, light-emitting section 14 can be disposed on the surface of light guide plate 13 by printing light-emitting section 14 on the surface of light guide plate 13.

[0028] The irradiation unit 1 can irradiate the first pattern light L1 emitted from the light emitting unit 14 onto the specular reflection surface S.

[0029] The pattern included in the first pattern L1 may be a dot pattern. The irradiation unit 1 can irradiate the specular reflection surface S with the first pattern light L1 including the dot pattern by arranging a plurality of light emitting units 14 on the light guide plate 13 so that each of the light emitting units 14 forms a dot, using the fluorescence emitted from each of the plurality of light emitting units 14. In other words, the dot-shaped light emitting units 14 can emit fluorescence when light guided inside the light guide plate 13 is incident thereon, and project bright points on the surface of the specular reflection surface S. The amount of positional deviation of the second pattern L2 from a predetermined position is obtained for each of the plurality of dot patterns included in the second pattern L2. By using a dot pattern for the first pattern light L1, the surface shape measuring device 100 can easily calculate the amount of positional deviation of the dots of the second pattern light L2 from a predetermined position by image processing.

[0030] The light-shielding section 15 is disposed on the side of the light-emitting section 14 disposed on the light guide plate 13 where the imaging section 2 is located. For example, if the fluorescence emitted from the light-emitting section 14 directly enters the imaging section 2 without passing through the specular reflection surface S, a measurement result that does not reflect the specular reflection surface S will be obtained, resulting in a measurement error. By blocking the fluorescence emitted from the light-emitting section 14 with the light-shielding section 15, the surface profile measuring apparatus 100 can prevent the fluorescence from directly entering the imaging section 2 and reduce measurement errors.

[0031] The multiple light-shielding portions 15 are arranged in a dot pattern on the surface of the light guide plate 13 in accordance with the multiple light-emitting portions 14 arranged in a dot pattern. The multiple light-shielding portions 15 correspond one-to-one to the multiple light-emitting portions 14. From the viewpoint of improving the light-shielding property, it is preferable that the area of ​​each of the light-shielding portions 15 is larger than the area of ​​each of the light-emitting portions 14.

[0032] In this embodiment, the shape of each of the light-emitting unit 14 and the light-shielding unit 15 in a plan view is circular, and if the diameter of the light-shielding unit 15 is A and the diameter of the light-emitting unit 14 is B, then 1.05×B≦A≦1.15×B may be satisfied. By satisfying the above condition, the surface profile measuring apparatus 100 can preferably prevent the light emitted from the light-emitting unit 14 from directly entering the imaging unit 2, and reduce measurement errors.

[0033] Furthermore, when the size of the reflected light from the specular reflective surface S is approximately equal to the size of the dot-shaped light emitting elements 14, the reflected light is blocked by the dot-shaped light blocking portions 15, and the dot pattern cannot be imaged by the imaging unit 2. However, in the surface profile measuring device 100, the reflected light from the specular reflective surface S has a slight spread compared to the light irradiated onto the specular reflective surface S. Therefore, the reflected light can leak from the periphery of the dot-shaped light blocking portions 15 or be diffracted at the edges of the dot-shaped light blocking portions 15, and thereby enter the imaging surface 21 of the imaging unit 2. Therefore, the surface profile measuring device 100 can measure the surface profile of the specular reflective surface S even when the size of the reflected light from the specular reflective surface S is approximately equal to the size of the dot-shaped light emitting elements 14.

[0034] <Effects of telecentric lenses> With reference to Figs. 3 to 9, the operation of the lens 3 when it is a telecentric lens will be described. Fig. 3 is a diagram showing a typical angle of view of a telecentric lens. Fig. 4 is a diagram showing a typical angle of view of a non-telecentric lens. A non-telecentric lens means a lens that is not a telecentric lens. Fig. 5 is a diagram showing an arrangement of a plurality of subjects with different subject distances. Fig. 6 is a diagram showing an image captured of the subject in Fig. 5 using a telecentric lens. Fig. 7 is a diagram showing an image captured of the subject in Fig. 5 using a non-telecentric lens. Fig. 8 is a diagram showing a typical irradiation unit when a telecentric lens is used. Fig. 9 is a diagram showing a typical irradiation unit when a non-telecentric lens is used.

[0035] In this embodiment, from the viewpoint of reducing the influence of fluctuations in the distance between the irradiation unit 1, the imaging unit 2, and the specular reflection surface S on the surface shape measurement, it is preferable to use a telecentric lens for the lens 3.

[0036] Lens 3, which is a telecentric lens, has an angle of view of 0 degrees as shown in Fig. 3. Therefore, in the surface profile measuring device, it is possible to eliminate changes in the captured image due to parallax, and reduce the effect of parallax on surface profile measurement, compared to the case where lens 3x, which is a non-telecentric lens as shown in Fig. 4, is used.

[0037] Also, as shown in FIG. 5, assume that the first subject S1 and the second subject S2, which are approximately equal in size, are located at different subject distances relative to the imaging unit, and the first subject S1 and the second subject S2 are imaged by the imaging unit. As shown in FIG. 6, when the lens 3, which is a telecentric lens, is used, the sizes of the first subject S1 and the second subject S2 in the captured image are approximately equal. On the other hand, as shown in FIG. 7, when the lens 3x, which is a non-telecentric lens, is used, the subjects located farther away are small and the subjects located closer are large, so that the sizes of the first subject S1 and the second subject S2 in the captured image differ depending on the subject distance. The difference in the size of the subject depending on the distance in the captured image may affect the surface shape measurement. When a telecentric lens is used for the lens 3, the change in the size of the subject in the captured image depending on the subject distance can be reduced, and therefore the effect of the subject distance on the surface shape measurement can be reduced.

[0038] As shown in FIG. 8, when the lens 3, which is a telecentric lens, is used, the angle of view is 0 degrees, so that the surface profile measuring device 100 can measure the surface profile of the entire specular reflection surface S using the irradiation unit 1 having a size similar to that of the specular reflection surface S. On the other hand, as shown in FIG. 9, when the lens 3x, which is a non-telecentric lens, is used, an irradiation unit 1 larger than the specular reflection surface S may be required. By using the lens 3, which is a telecentric lens, the surface profile measuring device 100 can reduce the size of the irradiation unit 1 and provide a surface profile measuring device 100 that can be miniaturized. By using the lens 3, which is a telecentric lens, the surface profile measuring device 100 can reduce changes in the captured image due to changes in optical magnification and lens distortion according to the subject distance. Therefore, the surface profile measuring device 100 does not require processing to correct the optical magnification and lens distortion, and can simplify the calculation processing for surface profile measurement.

[0039] <Configuration example of processing unit 4> (Hardware configuration example) 10 is a block diagram showing an example of a hardware configuration of the processing unit 4. The processing unit 4 is constructed by, for example, a computer. The processing unit 4 has a CPU (Central Processing Unit) 401, a ROM (Read Only Memory) 402, a RAM (Random Access Memory) 403, a connection I / F (Interface) 404, and a communication I / F 405. These are connected to each other via a system bus A so as to be able to communicate with each other.

[0040] The CPU 401 executes control processing including various kinds of arithmetic processing. The ROM 402 stores programs used to drive the CPU 401, such as an IPL (Initial Program Loader). The RAM 403 is used as a work area for the CPU 401. The I / F 404 is an interface for connecting the processing unit 4 to various kinds of external devices. The external devices here include the imaging unit 2, etc.

[0041] The communication I / F 405 is an interface for communicating with an external device via a communication network, etc. For example, the processing unit 4 connects to the Internet via the communication I / F 405 and communicates with an external device via the Internet.

[0042] In addition to the above configuration, the processing unit 4 may have a HDD / SSD (Hard Disk Drive / Solid State Drive) etc. The HDD / SSD stores various information such as programs, captured images acquired by the imaging unit 2, etc.

[0043] (Example of functional configuration) The functional configuration of the processing unit 4 will be described with reference to Figs. 11 to 14. Fig. 11 is a block diagram showing an example of the functional configuration of the processing unit 4. Fig. 12 is a diagram showing a captured image of the second patterned light L2. Fig. 13 is an enlarged view of region IV in Fig. 12. Fig. 14 is a diagram for explaining the positional deviation amount of the second patterned light L2.

[0044] 11, the processing unit 4 has a positional deviation amount acquiring unit 41, a shape acquiring unit 42, and an output unit 43. The functions of the positional deviation amount acquiring unit 41 and the shape acquiring unit 42 can be realized by a processor such as a CPU 401 executing processing defined in a program stored in a non-volatile memory such as a ROM 402. The function of the output unit 43 can be realized by a connection I / F 404 or a communication I / F 405. Note that some of the above functions of the processing unit 4 may be realized by an external device such as a PC or a server, or may be realized by distributed processing between the processing unit 4 and the external device.

[0045] The positional deviation amount acquisition unit 41 acquires the positional deviation amount from a predetermined position of the second pattern light L2 in the captured image by the imaging unit 2. As shown in Figs. 12-13, the captured image Im includes a dot pattern. Each of the multiple dots D is formed by fluorescent light emitted from the light emitting unit 14 included in the irradiation unit 1 shown in Fig. 2. If the specular reflection surface S has a shape error with respect to an ideal flat surface, the position of each of the multiple dots D will be shifted from the corresponding predetermined position. The shift in the position of each of the multiple dots D will distort the pattern formed by the multiple dots D. For example, the positional deviation amount acquisition unit 41 can acquire, by calculation, the positional deviation amount Δp of the center of gravity position of each of the multiple dots D with respect to the coordinates of multiple "predetermined positions" that are predetermined on the captured image Im.

[0046] 11, the shape acquisition unit 42 acquires information about the surface shape of the specular reflecting surface S, which is obtained from the positional deviation amount Δp obtained by the positional deviation amount acquisition unit 41. As shown in FIG 14, the angle θ between the irradiation light L11 irradiated to the specular reflecting surface S and the reflected light L21 of the irradiation light L11 on the specular reflecting surface S is obtained by the following formula (1). Note that in formula (1), the distance L is the distance between the irradiation unit 1 and the specular reflecting surface S.

[0047]

number

[0048] Further, the amount of change z in plane height for each dot is obtained from the predetermined arrangement interval pd of the dot pattern by the following formula (2).

[0049]

number

[0050] 11, the shape acquisition unit 42 can acquire the height change amount z as information regarding the surface shape of the specular reflective surface S using the above formulas (1) and (2). The shape acquisition unit 42 calculates the height change amount z of each of the multiple dots included in the captured image Im2 from the position with the least amount of change in the second pattern L2 shown in the captured image Im2 toward the outside. This allows the shape acquisition unit 42 to acquire the height change amount z of the entire specular reflective surface S as information regarding the surface shape. The output unit 43 outputs the height change amount z of the entire specular reflective surface S acquired by the shape acquisition unit 42 to an external device.

[0051] Although the preferred embodiments have been described in detail above, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the claims.

[0052] The ordinal numbers, quantities, and other numbers used in the description of the embodiments are all provided as examples to specifically explain the technology of the present invention, and the present invention is not limited to the exemplified numbers. Furthermore, the connection relationships between the components are provided as examples to specifically explain the technology of the present invention, and do not limit the connection relationships that realize the functions of the present invention.

[0053] According to the present disclosure, the surface profile measuring device can be made smaller, making measurements easier and expanding the range of application of surface profile measurement.

[0054] Aspects of the present disclosure are, for example, as follows. <1> The surface shape measuring device has an irradiation unit that irradiates a first pattern light onto the specular reflective surface, an imaging unit that images a second pattern light, which is light that transmits through the irradiation unit after the first pattern light irradiated from the irradiation unit is reflected by the specular reflective surface, and a processing unit that obtains a positional deviation amount of the second pattern light from a predetermined position in an image captured by the imaging unit, and outputs information regarding the surface shape of the specular reflective surface obtained from the positional deviation amount. <2> the irradiation unit includes one or more light sources; a light guide plate having a light incident surface, a first main surface, and a second main surface, the light guide plate guiding light emitted from the one or more light sources and incident through the light incident surface; and a light emitting unit disposed either inside or on a surface of the light guide plate, the light emitting unit emitting fluorescence when the light guided by the light guide plate is incident on the light emitting unit, and irradiates the first pattern light formed including the fluorescence emitted from the light emitting unit. <1> 2 is a surface shape measuring apparatus according to the first embodiment. <3> the illumination unit has a light-shielding unit on a side of the light-emitting unit disposed on the light guide plate where the imaging unit is located; <2> 2 is a surface shape measuring apparatus according to the first embodiment. <4> The shape of each of the light emitting portion and the light blocking portion in a plan view is circular, and when the diameter of the light blocking portion is A and the diameter of the light emitting portion is B, 1.05×B≦A≦1.15×B is satisfied. <3> 2 is a surface shape measuring apparatus according to the first embodiment. <5> The pattern included in the first pattern light is a dot pattern. <1> From the above <4> 1 is a surface profile measuring apparatus according to any one of the above items. <6> a telecentric lens disposed between the irradiation unit and the imaging unit, the imaging unit capturing an image of the second pattern light that has been reflected by the specular reflection surface, transmitted through the irradiation unit, and further transmitted through the telecentric lens; <1> From the above <5> 1 is a surface profile measuring apparatus according to any one of the above items. <7> A surface shape measuring method using a surface shape measuring device for a specular reflective surface, in which the surface shape measuring device irradiates a first pattern light onto the specular reflective surface using an irradiation unit, images a second pattern light, which is light that transmits through the irradiation unit after the first pattern light irradiated from the irradiation unit is reflected by the specular reflective surface, using an imaging unit, obtains an amount of positional deviation of the second pattern light from a predetermined position in the image captured by the imaging unit using a processing unit, and outputs information regarding the surface shape of the specular reflective surface obtained from the amount of positional deviation. [Explanation of symbols]

[0055] 1…Irradiation unit 12...Light source 13...Light guide plate 131...Light incidence surface 132…First main surface 133…Second main surface 14…Light emitting part 15…Shading part 2. Imaging unit 20…center 21…imaging surface 3. Lens 31...Lens barrel 4. Processing section 41... Position deviation amount acquisition unit 42...Shape acquisition section 43...Output section 401...CPU 402...ROM 403...RAM 404...Connection I / F 405…Communication I / F 100...Surface shape measuring device A…System bus D…dot Im…Image capture L…Distance L1…First pattern light L11…Irradiation light L2: Second pattern light L21…Reflected light pd…Layout interval S…Specular reflective surface S1, S2…Subject S0...Normal Δp: Position deviation amount θ…Angle

Claims

1. An apparatus for measuring the surface shape of a specular reflective surface, comprising: an irradiation unit that irradiates the specular reflection surface with a first pattern light; an imaging unit that images a second pattern light, which is light that is transmitted through the irradiation unit after the first pattern light irradiated from the irradiation unit is reflected by the specular reflection surface; a processing unit that acquires an amount of positional deviation from a predetermined position of the second pattern light in an image captured by the imaging unit, and outputs information regarding the surface shape of the specular reflecting surface obtained from the amount of positional deviation.

2. The irradiation unit includes: one or more light sources; a light guide plate having a light incident surface, a first main surface, and a second main surface, the light guide plate guiding light emitted from the one or more light sources and incident through the light incident surface; a light-emitting section that is disposed inside or on a surface of the light-guiding plate and emits fluorescent light when light guided by the light-guiding plate is incident thereon; The surface shape measuring instrument according to claim 1 , wherein the first pattern of light is formed by including fluorescence emitted from the light emitting section.

3. The surface shape measuring apparatus according to claim 2 , wherein the irradiation unit has a light shielding unit on a side of the light emitting unit arranged on the light guide plate where the imaging unit is located.

4. The light-emitting portion and the light-shielding portion each have a circular shape in a plan view, 4. The surface shape measuring apparatus according to claim 3, wherein, assuming that the diameter of said light-shielding portion is A and the diameter of said light-emitting portion is B, 1.05×B≦A≦1.15×B is satisfied.

5. 3. The surface shape measuring instrument according to claim 1, wherein the pattern included in the first pattern light is a dot pattern.

6. a telecentric lens disposed between the irradiation unit and the imaging unit; 3 . The surface shape measuring apparatus according to claim 1 , wherein the imaging section images the second pattern light that has been reflected by the specular reflecting surface, transmitted through the irradiation section, and further transmitted through the telecentric lens. 4 .

7. A method for measuring a surface shape of a specular reflective surface using a surface shape measuring device, comprising: The surface profile measuring device includes: an irradiation unit irradiating the specular reflection surface with a first pattern of light; an imaging unit captures an image of a second pattern of light, which is the first pattern of light irradiated from the irradiation unit, reflected by the specular reflection surface, and then transmitted through the irradiation unit; A surface shape measuring method, in which a processing unit acquires an amount of positional deviation from a predetermined position of the second pattern light in an image captured by the imaging unit, and outputs information regarding the surface shape of the specular reflecting surface obtained from the amount of positional deviation.

Citation Information

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