Imprint apparatus, imprint method, and article manufacturing method

Abstract

To provide an imprint device which is advantageous in improving overlay accuracy.SOLUTION: In an imprinting apparatus, a mold having a pattern formed thereon and an imprinting material coated on a substrate are brought into contact with each other, thereby forming the pattern of the imprinting material on the substrate. The imprinting apparatus includes a fixed portion, an imprinting head having a movable portion base connected to the fixed portion via a first flexible member, a mold holding member that holds the mold, and a second flexible member that connects the movable portion base and the mold holding member to each other, a first driving mechanism that drives the imprinting head to bring the mold held by the mold holding member into contact with the imprinting material on the substrate held by the substrate holding portion, a control unit that controls the first driving mechanism, and a first measuring device that measures the amount of distortion or deformation of the second flexible member, or the relative position of the mold holding member or the mold with respect to the movable portion base.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to an imprint apparatus, an imprint method, and a method for manufacturing an article. [Background technology]

[0002] As demand for miniaturization of semiconductor devices and MEMS (Micro Electro Mechanical Systems) continues, in addition to conventional photolithography technology, attention is being paid to a microfabrication technology in which uncured resin on a substrate is molded to form a resin pattern on the substrate. This technology, also known as imprint technology, is capable of forming fine structures on the order of a few nanometers on a substrate.

[0003] In imprint technology, one of the methods for hardening the imprint material is the photo-curing method, in which the imprint material supplied (placed) on the substrate is brought into contact with a mold and irradiated with light such as ultraviolet light to harden the imprint material, and the mold is then separated from the hardened imprint material to form a pattern of the imprint material on the substrate.

[0004] In addition to miniaturization, imprinting apparatuses that use such imprinting technology are also required to have high overlay accuracy for patterns that are formed stepwise on a substrate. For example, imprinting apparatuses are being considered for use in the manufacture of semiconductor devices with a half pitch of about 32 nm. In this case, according to the International Technology Roadmap for Semiconductors (ITRS), an overlay accuracy of 6.4 nm is required. To achieve such high overlay accuracy, it is necessary to strictly control the relative positions (horizontal and vertical positions) of the substrate and the mold.

[0005] In the imprinting apparatus, when the imprinting material on the substrate and the mold are brought into contact with each other (the mold is pressed against the imprinting material), alignment is performed to align the relative positions of the substrate and the mold. Specifically, horizontal alignment is achieved by moving the substrate horizontally relative to the mold via the substrate stage so that the alignment marks on both the substrate and the mold overlap. Vertical alignment is achieved by adjusting the pressing force of the mold against the imprinting material on the substrate via an actuator that drives the mold vertically. Horizontal alignment errors result in shifts and rotational component deviations, while vertical alignment errors cause distortion of the substrate or the mold. Therefore, in the imprinting apparatus, it is necessary to align the relative positions of the substrate and the mold on the order of nm in both the horizontal and vertical directions. With regard to distortion, the flatness of the holding surfaces (holding members) that hold the substrate and mold is also an important factor. If the flatness is low, a difference will occur in the amount of deformation between the substrate and the mold, resulting in reduced overlay accuracy.

[0006] Furthermore, in an imprint apparatus, there is a possibility that a relative positional deviation may occur between a holding member that holds a mold and a holding member that holds a substrate due to deformation and vibration caused by an external force from a driving unit in the apparatus, the propagation of floor vibration from outside the apparatus, etc. Therefore, the structure of the imprint apparatus is as follows: It is necessary to maintain high rigidity

[0007] Furthermore, since an imprint apparatus needs to guarantee high overlay accuracy for a long period of time, it is also required that the alignment accuracy does not change over time.

[0008] Therefore, as a technique for controlling (managing) the pressing force of the mold against the imprint material on the substrate, for example, there is a technique for measuring and controlling the pressing force from the driving output (current value) of the actuator. The driving output of the actuator includes the resistance force due to the mounting rigidity and the preload spring, etc., and the pressing force of the mold against the imprint material on the substrate. However, if the thrust constant changes due to heat or aging of the actuator, the relationship between the driving output of the actuator and the pressing force of the mold against the imprint material on the substrate changes. In addition, since tubes, cables, preload springs, etc. are connected to the holding member (driving side) that holds the mold and its peripheral members (fixed side), these become the driving resistance. If such driving resistance changes over time, it affects the pressing force predicted from the driving output of the actuator, which causes a decrease in the overlay accuracy. Patent documents 1 and 2 have been proposed as other techniques for controlling the pressing force of the mold against the imprint material on the substrate. [Prior art documents] [Patent documents]

[0009] [Patent Document 1] Patent No. 4688872 [Patent Document 2] JP 2011-79249 A Summary of the Invention [Problem to be solved by the invention]

[0010] In Patent Document 1, a chuck body that holds the mold is coupled to a flexure, which is coupled to an orientation system that controls the movement of the mold. Three actuators are connected at intervals around the orientation system, which drives an imprint head having a chuck body. In such a structure, the pressing force needs to be controlled by the output of the actuator, for example, the amount of change in current. However, the pressing force is easily changed due to changes in the reaction force of the flexure or changes in the tension of the cables and tubes connected to the mold holder, which generates an undesirable force between the mold and the substrate, degrading the overlay accuracy.

[0011] Patent Document 2 discloses a transfer device having a pressure detection sensor that detects the pressure when pressing a substrate with a mold. According to this, the pressure can be measured directly by the pressure detection sensor. However, a relatively large force is required when contacting the mold with the imprint material on the substrate or when releasing the mold, and high-precision control using a small force is required during hardening. For this reason, it is difficult to achieve high-precision control with a wide measurement range as in Patent Document 2.

[0012] The present invention has been made in view of the above circumstances, and has an exemplary object to provide an imprint apparatus that is advantageous in improving overlay accuracy. [Means for solving the problem]

[0013] In order to achieve the above-mentioned object, an imprinting apparatus as one aspect of the present invention is an imprinting apparatus that forms a pattern of imprinting material on a substrate by contacting a mold on which a pattern has been formed with an imprinting material applied to a substrate, and is characterized in having an imprinting head having a fixed part, a movable part base connected to the fixed part via a first flexible member, a mold holding member that holds the mold, and a second flexible member that connects the movable part base and the mold holding member, a first driving mechanism that drives the imprinting head to bring the mold held by the mold holding member into contact with the imprinting material on a substrate held by the substrate holding part, a control unit that controls the first driving mechanism, and a first measuring instrument that measures the amount of distortion or deformation of the second flexible member, or the relative position of the mold holding member or the mold relative to the movable part base. Effect of the Invention

[0014] According to the present invention, for example, it is possible to provide an imprint apparatus that is advantageous in improving overlay accuracy. [Brief description of the drawings]

[0015] [Figure 1] FIG. 1 is a schematic diagram showing the configuration of an imprint apparatus 1. [Diagram 2] FIG. 1 is a schematic diagram showing the structure of an imprint head according to a first embodiment. [Diagram 3] FIG. 4 is a schematic diagram illustrating a flexible portion. [Figure 4] 5 is a flowchart showing an operation sequence of the imprint process according to the first embodiment. [Diagram 5] 1A to 1C are schematic diagrams illustrating deformation when a force is applied to a mold during imprinting. [Figure 6] FIG. 6 is a cross-sectional view showing the structure of an imprint head according to a second embodiment. [Figure 7] FIG. 11 is a cross-sectional view showing the structure of an imprint head according to a third embodiment. [Figure 8] FIG. 11 is a cross-sectional view showing the structure of an imprint head according to a fourth embodiment. [Figure 9] FIG. 13 is a cross-sectional view showing the structure of an imprint head according to a fifth embodiment. [Figure 10] 1A to 1C are diagrams for explaining a method for manufacturing an article. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0017] <Configuration of imprint device> First, the configuration of an imprinting apparatus according to an embodiment of the present invention will be described. FIG. 1 is a schematic diagram showing the configuration of an imprinting apparatus 1. The imprinting apparatus 1 in this embodiment is a processing apparatus that transfers a concave-convex pattern of a mold onto a wafer (substrate) that is a substrate to be processed, which is used in a semiconductor device manufacturing process, and is an apparatus that adopts a photocuring method among imprinting techniques. In the following figures, the Z axis is taken parallel to the irradiation axis of ultraviolet light 10 onto the mold 3, the X axis is taken in the direction in which the wafer 5 moves relative to a mold holding member 12 (described later) in a plane perpendicular to the Z axis, and the Y axis is taken in a direction perpendicular to the X axis. The imprinting apparatus 1 of this embodiment includes an illumination system unit 2, an imprinting head 4 that holds the mold 3, a wafer stage 6 that holds the wafer 5, a coating device 7, a mold transport device 8, and a control device 9.

[0018] The illumination system unit 2 is an illumination means for irradiating the mold 3 with ultraviolet light 10 during the imprint process, and functions as an irradiation section. Specifically, the illumination system unit 2 irradiates the imprint material 14 with ultraviolet light 10, which is energy for curing, while the mold 3 and the imprint material 14 on the wafer 5 are in contact with each other. The illumination system unit 2 includes a light source 20 and a plurality of optical elements for adjusting the ultraviolet light 10 emitted from the light source 20 to light appropriate for the imprint process.

[0019] The mold 3 has a rectangular outer periphery and has protrusions 3b of several tens of microns on the surface facing the wafer 5, and a predetermined pattern (e.g., a concave-convex pattern such as a circuit pattern) is formed three-dimensionally on the protrusions 3b. The surface of the concave-convex pattern is processed to a high degree of flatness in order to maintain close contact with the surface of the wafer 5. The mold 3 has a recessed portion 3a (cavity), and when the mold 3 is brought into contact with the imprint material 14 on the wafer 5, the recessed portion 3a is pressurized to expand and deform, thereby shortening the time it takes for the imprint material 14 to fill the concave-convex pattern. The material of the mold 3 is quartz or another material that is capable of transmitting ultraviolet light.

[0020] The imprint head 4 is fixed to a bridge platen 32 supported by a base platen 31. The imprint head 4 includes a mold holding member 12 that attracts and holds the mold 3 by an adsorption force or an electrostatic force. The imprint head 4 also includes an imprint actuator 13 (first drive mechanism). The imprint actuators 13 are arranged at three positions in the horizontal direction centered on the mold 3 held by the mold holding member 12. The imprint actuators 13 drive the mold holding member 12 in the Z-axis and tilt directions to press the mold 3 against the imprint material 14 applied (supplied) on the wafer 5. The imprint actuators 13 are preferably linear motors. As a guide for the imprint drive, leaf springs (first flexible parts) 16 are provided near each actuator. The leaf springs 16 are structured to have flexibility in the Z direction and to maintain rigidity in other directions. This enables the imprint drive while preventing deterioration of the overlay accuracy due to vibration. Note that the imprinting here refers to the operation of pressing (bringing into contact) the mold 3 against the imprint material 14 applied onto the wafer 5.

[0021] The wafer 5 is a substrate to be processed, which may be, for example, a single crystal silicon substrate or an SOI (Silicon on Insulator) substrate, and an imprint material 14 to be a molding portion is applied to the surface to be processed.

[0022] The wafer stage 6 is a substrate holding member that holds the wafer 5 and can move freely within the XY plane in the imprint apparatus 1. A linear motor can be used as an actuator for driving the wafer stage 6, but there is no particular limitation. A wafer holding member 15 is disposed on the wafer stage 6 and holds the wafer 5 by vacuum suction.

[0023] The dispenser 7 is a coating unit that applies an uncured imprint material 14 onto the wafer 5.

[0024] The imprint material 14 is a curable composition (sometimes called uncured resin) that is cured by applying curing energy. Electromagnetic waves, heat, etc. are used as the curing energy. For example, light such as infrared rays, visible light, and ultraviolet rays, whose wavelengths are selected from the range of 10 nm or more and 1 mm or less, is used as the electromagnetic waves. In this embodiment, an example in which ultraviolet rays 10 are used as the curing energy will be described. That is, in this embodiment, the imprint material 14 is an ultraviolet curing resin that is cured by receiving ultraviolet rays 10 from the illumination system unit 2. The imprint material 14 is appropriately selected depending on the type of semiconductor device to be manufactured. The imprint material 14 may be a thermoplastic or thermosetting resin.

[0025] The curable composition is a composition that is cured by irradiation with light or by heating. The photocurable composition that is cured by irradiation with light contains at least a polymerizable compound and a photopolymerization initiator, and may contain a non-polymerizable compound or a solvent, as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal mold release agent, a surfactant, an antioxidant, a polymer component, and the like.

[0026] The mold transport device 8 is a transport means for transporting the mold 3 and placing the mold 3 on the mold holding member 12.

[0027] In the imprint process, the alignment scope 18 observes the alignment marks provided on the wafer 5 and the mold 3. In normal imprinting, the mold 3 is pressed against the imprint material 14 applied on the wafer 5. The relative horizontal positions of the wafer 5 and the mold 3 when they are pressed are measured by the alignment scope 18 provided in the imprint head 4, which measures the overlap of the alignment marks provided on both. Alignment is performed by controlling the position of the wafer stage 6 so that the relative horizontal positions of the wafer 5 and the mold 3 are the desired positions.

[0028] The control device 9 is a control means that controls the operation and adjustment of each component of the imprint apparatus 1 based on the measurement values ​​of each detector. That is, the control device 9 functions as a control unit. Specifically, the control device 9 controls the drive of the imprint actuator 13 based on the value of a displacement sensor 17 described later. Although not shown, the control device 9 is composed of a computer having a storage means such as a magnetic storage medium, a sequencer, etc., connected to each component of the imprint apparatus 1 by a line, and includes a CPU (Central Processing Unit). The control device 9 executes control of each component by a program or sequence. The control device 9 may be configured as an integral part of the imprint apparatus 1, or may be configured to be installed in a location separate from the imprint apparatus 1 and controlled remotely.

[0029] First Embodiment Next, an imprint apparatus according to a first embodiment of the present invention will be described. Fig. 2 is a schematic diagram showing the structure of an imprint head 4 according to the first embodiment. Fig. 2(A) is a cross-sectional view showing the structure of the imprint head 4 according to the first embodiment. Fig. 2(B) is a top view showing the structure of the imprint head 4 according to the first embodiment.

[0030] The mold holding member 12 is connected to a movable base 19. The movable base 19 is connected to a fixed portion 33 that fixes the imprint head to a bridge base 32 via a leaf spring 16. The mold holding member 12 adsorbs and holds the mold 3 at the mold adsorption portion 12a. A pipe 21 is a gas pipe that connects the vacuum path to the mold adsorption portion 12a. A pipe 22 is a path for adjusting the pressure on the back surface of the mold 3, and is a gas pipe that connects a pressure adjustment valve and the dug portion 3a. A glass lid 23 is provided on the upper part of the mold holding member 12 to form a closed space (cavity space) in the dug portion 3a and to transmit ultraviolet light 10 to the pattern portion formed on the protrusion portion 3b.

[0031] The mold holding member 12 has a plurality of flexible parts (second flexible parts) 12b that are flexible in the Z direction. The flexible parts 12b connect the movable part base 19 and the mold holding member 12. In this embodiment, the flexible parts 12b are arranged at three locations in the horizontal direction centered on the mold 3 held by the mold holding member 12, and at positions that overlap with the stamp actuator 13 when viewed from the mold direction. The flexible parts 12b have a hollow part 12c inside, and the pipes 21 and 22 can be maintained by arranging the pipes 21 and 22 in the space inside the hollow part 12c. It is desirable that the flexible parts 12b are also easily bent only in the Z direction like the leaf spring 16, and rigidity is maintained in other directions. Note that, although the flexible parts 12b are shown as being integral (same member) with the mold holding member 12 in FIG. 2, they may be connected to each other by a separate member.

[0032] The displacement sensor 17 is a measuring instrument (first measuring instrument) that measures the relative position of the mold holding member 12 or the mold 3 with respect to the movable base 19, and is a position detector.

[0033] Here, the flexible portion 12b will be described with reference to FIG. 3. FIG. 3 is a schematic diagram for explaining the flexible portion 12b. FIG. 3(A) is a first example of a cross section of the flexible portion 12b and the hollow portion 12c. In FIG. 3(A), the cross-sectional shape of the flexible portion 12b is a rectangle in the outer shape and the hollow portion 12c. FIG. 3(B) is a second example of a cross section of the flexible portion 12b and the hollow portion 12c. In FIG. 3(B), the cross-sectional shape of the flexible portion 12b is a hexagon in the outer shape and the hollow portion 12c. In both cases, the flexible portion 12b is thin and formed to surround the hollow portion 12c, and can bend with a weak force in the imprinting direction (-Z direction). This flexibility is higher than that of the leaf spring 16. In other words, the rigidity of the flexible portion 12b is lower than that of the leaf spring 16. As shown in Fig. 3(A), it is advantageous in terms of ease of manufacture when the outer shape of the cross-sectional shape of the flexible portion 12b and the hollow portion 12c are rectangular, whereas it is advantageous in terms of ease of bending when the outer shape of the cross-sectional shape of the flexible portion 12b and the hollow portion 12c are hexagonal, as shown in Fig. 3(B).

[0034] Next, the operation of the imprint apparatus 1 will be described. Fig. 4 is a flowchart showing the operation sequence of the imprint process according to the first embodiment. Specifically, this figure shows the operation sequence when the imprint apparatus 1 forms a pattern that will become a concave-convex layer on a plurality of wafers 5 through imprint process. Each operation (step) shown in this flowchart can be executed under the control of the control device 9. Note that the same mold 3 is used in one lot including the plurality of wafers 5.

[0035] First, in S101, the mold 3 is transported by the mold transport device 8 to a position directly below the mold holding member 12, and the mold 3 is mounted on the mold holding member 12. In other words, the mold 3 is held by the mold holding member 12.

[0036] Next, in S102, the wafer 5 is transferred to the wafer stage 6 by a wafer transfer device (not shown), and the wafer 5 is placed on the wafer stage 6. In other words, the wafer 5 is held by the wafer stage 6.

[0037] In S103, the wafer stage 6 is moved to a coating position of the imprint material, specifically, directly below the coating device 7. Then, in S104, the coating device 7 coats the wafer 5 with the imprint material 14.

[0038] In S105, the wafer 5 is moved to the imprint position below the imprint head 4. Specifically, the wafer stage 6 is moved so that the shot to be imprinted is located directly below the mold 3.

[0039] In S106, the mold 3 is brought into contact (imprinted) with the imprint material 14 on the wafer 5. Before the mold 3 comes into contact with the imprint material 14 on the wafer 5, the internal pressure of the carved portion 3a is applied in a pressurized state of several tens of Newtons. When the imprint material 14 is filled into the protruding portion 3b on which the mold pattern is formed, the internal pressure and the imprinting force (force in the direction towards the wafer 5) are weakened so that the internal pressure approaches a gauge pressure of 0 and the imprinting force approaches 0 Newtons.

[0040] In S107, the positions of the mark on the mold 3 and the mark on the wafer 5 are measured by the alignment scope 18, and the position adjustment (alignment) is performed by the wafer stage 6 so that they are at the desired positions.

[0041] Here, the process of S107 according to this embodiment will be described in detail with reference to FIG. 5. FIG. 5 is a schematic diagram for explaining deformation when a force is applied to the mold 3 during imprinting. When a force 40 in the +Z direction is applied by imprinting, the periphery of the mold 3 also moves in the +Z direction starting from the flexible portion 12b. By measuring this amount of movement with the displacement sensor 17, the force applied to the mold 3 during imprinting can be calculated. That is, in S107, the driving amount of the imprint actuator 13 is controlled based on the amount of change from the value of the displacement sensor 17 before the mold 3 and the imprint material 14 on the wafer 5 come into contact with each other. The relationship between the imprinting force and the amount of displacement at the measurement position may be obtained in advance, and the output of the imprint actuator 13 may be controlled using this relationship. In the imprinting operation, the imprint material 14 once applied to the wafer 5 is spread by applying a relatively large force (several tens of N), and the force is gradually weakened. At the same time, alignment of the wafer 5 and the mold 3 is performed, and this force is made close to zero immediately before irradiation with the ultraviolet light 10. At this time, the output of the displacement sensor 17 at no load is set as a target value, and the output of the imprint actuator 13 is controlled so that it becomes the no-load value. Alternatively, the output of the displacement sensor 17 at no load may be used as a reference and controlled as a target value. It is preferable that the value of the displacement sensor 17 is the target value when the illumination unit 2 starts irradiating the ultraviolet light 10. By performing such control, it is possible to minimize distortion of the protrusions 3b of the mold 3 and transfer a highly accurate pattern onto the wafer.

[0042] Furthermore, since high precision control is not required for the driving operation before irradiation with ultraviolet light 10, such as the operation of lowering the imprint head 4, the output may be directly controlled using the driving output (current value) of the imprint actuator 13. In other words, midway through the operation of bringing the mold 3 into contact with the imprint material 14 on the wafer 5, the control of the driving of the imprint actuator 13 is switched from control based on the current value of the imprint actuator 13 to control based on the value of the displacement sensor 17. By using such control, the load on the control can be reduced.

[0043] Returning to FIG. 4, in S108, the control device 9 judges whether the mold 3 and the wafer 5 have reached the target positional relationship, that is, whether the alignment has been completed. It also judges whether the value of the displacement sensor 17 has reached the target value. If the alignment has been completed and the value of the displacement sensor 17 has not reached the target value (No), S108 is repeated. On the other hand, if the alignment has been completed and the value of the displacement sensor 17 has reached the target value (No), the process proceeds to S109.

[0044] In S109, the illumination unit 2 irradiates the imprint material 14 on the wafer 5 with ultraviolet light 10 to cure the imprint material 14.

[0045] After the irradiation is completed, in S110, the imprint actuator 13 drives the imprint head 4 to move the mold 3 in a direction to lift it up, and the mold 3 is separated (peeled off) from the imprint material 14 on the wafer 5. The operation of S110 is called demolding.

[0046] In S111, it is determined whether there is a next shot to be continuously imprinted. That is, it is determined whether there is an unprocessed shot on the wafer 5. If there is an unprocessed shot (YES), the processes of S103 to S110 are repeated. On the other hand, if there is no unprocessed shot (NO), the process proceeds to S112.

[0047] In S112, the wafer 5 after the imprint processing is collected. Specifically, the wafer 5 is carried out by the wafer transfer device.

[0048] In S113, it is determined whether or not there is an unprocessed wafer 5. If there is an unprocessed wafer 5 (YES), the processes of S102 to S110 are repeated. On the other hand, if there is no unprocessed wafer 5 (NO), the process proceeds to S114.

[0049] When the imprint process is completed for all the wafers 5 in the lot, the mold 3 is collected in S115. Specifically, the mold 3 is carried out by the mold carrying device 8. Then, the series of processes is completed.

[0050] In this embodiment, the displacement sensor 17 and the imprint actuator 13 are disposed at three locations spaced at intervals of approximately 120° with respect to the center of the mold 3. The displacement sensor 17 and the imprint actuator 13 are disposed at positions (orientations) where they overlap when viewed from the center of the mold 3, preferably in the same direction. For this reason, the displacement sensor 17 can be correlated with the output of the imprint actuator 13, including the inclination. However, this is not limited when the degree of freedom in placement is limited, and the sensors may be disposed at four locations.

[0051] Furthermore, the flexible portion 12b may be provided inside the cavity space, but is preferably provided outside the cavity space, because when provided outside the cavity space, it is less likely to be deformed by the pressure inside the cavity space.

[0052] Here, in order to make the wiring and piping less susceptible to resistance changes when the flexible section 12b is deformed by the imprinting force, it is also important to arrange the wiring and piping in the opposite direction to the mold 3 (the movable section base 19 side) from the flexible section 12b. Also, since the output of the displacement sensor 17 is affected by the weight of each part and external disturbances, it is necessary to measure the output in advance when no imprinting force is applied, and use the amount of change from the state when no imprinting force is applied during imprinting for control.

[0053] In addition, in the present embodiment, an example in which the displacement sensor 17 is used has been described, but the present invention is not limited to this as long as it is possible to measure the relative position of the mold holding member 12 or the mold 3 with respect to the movable base 19. For example, an angle sensor (angle detector) may be used instead of the displacement sensor 17.

[0054] As described above, according to this embodiment, it is possible to improve the overlay accuracy between the mold and the substrate.

[0055] Second embodiment Next, an imprinting apparatus according to a second embodiment of the present invention will be described. FIG. 6 is a cross-sectional view showing the structure of an imprinting head 4a according to the second embodiment. In this embodiment, a strain gauge 24 is used instead of the displacement sensor 17. The strain gauge 24 is a measuring instrument (first measuring instrument) that measures the amount of strain or deformation of the flexible portion 12b. By adhering the strain gauge 24 to a portion where the strain increases when the flexible portion 12b is deformed, for example, a portion of the flexible portion 12b where the cross-sectional area is greatly reduced relative to the mold adsorption portion 12a, the detection sensitivity can be increased. When the strain gauge 24 is used instead of the displacement sensor 17, it is less expensive and requires less space than the first embodiment.

[0056] The flexible portion 12b is also deformed by the pressure of the hollow portion 12c. In other words, since the output of the strain gauge 24 is affected by the adhesion of the mold 3 and the pressure of the carved portion 3a, the output is measured in advance when no imprinting force is applied. Then, when imprinting, the amount of change from the state when no imprinting force is applied must be used to control the imprint actuator 13.

[0057] Third embodiment Next, an imprinting apparatus according to a third embodiment of the present invention will be described. Fig. 7 is a cross-sectional view showing the structure of an imprinting head 4b according to the third embodiment. In this embodiment, a fixing member 25 (holding mechanism) is used to temporarily fix (hold) the mold holding member 12.

[0058] Fixed member 25 is fixed to movable part base 19 and adsorbs and holds a part of mold holding member 12 located on the mold center side of flexible part 12b. Fixed member 25 has adsorption part 25a for adsorbing and holding a part of mold holding member 12. Adsorption part 25a adsorbs and holds a part of mold holding member 12 by vacuum adsorption.

[0059] A large force of several tens of Newtons is required for the imprinting operation in which the mold 3 is pressed against the imprint material 14 on the wafer 5, and for the releasing operation in which the mold 3 is lifted and peeled off from the imprint material 14 on the wafer 5. The fixing member 25 prevents the flexible portion 12b from being damaged by that force. Alternatively, the movement of the mold suction portion 12a is suppressed in order to increase the responsiveness of the imprinting operation and the releasing operation. Specifically, the control device 9 causes the suction portion 25a of the fixing member 25 to hold a part of the mold holding member 12 by vacuum suction during the imprinting operation or the releasing operation. According to this embodiment, it is possible to reduce damage to the flexible portion 12b and improve throughput.

[0060] (Fourth embodiment) Next, an imprinting apparatus according to a fourth embodiment of the present invention will be described. FIG. 8 is a cross-sectional view showing the structure of an imprinting head 4c according to the fourth embodiment. The imprinting apparatus of this embodiment has a magnification correction mechanism 11. The magnification correction mechanism 11 applies a compressive force from the side of the mold 3 using an actuator (not shown), changes the pattern shape on the mold 3, and makes the shape and magnification closer to the existing pattern on the wafer 5. The magnification correction mechanism 11 has a flexible member 27 (third flexible member) that extends in the horizontal direction and is flexible in the imprinting direction, and is configured so that no force in the vertical direction is generated on the mold 3. The magnification correction mechanism 11 is fixed to a fixed portion 29 on the opposite side of the mold 3 with respect to the flexible portion 12b. A strain gauge 28 (second measuring device) is attached near the flexible member 27, and the strain gauge 28 measures the amount of strain or deformation generated near the flexible member 27. In this configuration, when an imprinting force is generated, a strain is generated in the flexible member 27 as well as in the flexible portion 12b. That is, strain is output to both the strain gauges 24 and 28. If a compressive force is applied in advance by the magnification correction mechanism 11, a strain due to the compressive force may also be applied, in which case the imprint actuator 13 is controlled using the difference between the strain output when only the compressive force is applied and the output when the imprint force is applied.

[0061] In this way, the imprinting force during ultraviolet irradiation, i.e., the drive amount of the imprinting actuator 13, is controlled based on the outputs of both the strain gauges 24 and 28. By using this type of control, even in an imprinting apparatus having a magnification correction mechanism 11, it is possible to adjust the imprinting force with high precision and to perform imprinting with little deformation of the mold 3.

[0062] Fifth embodiment Next, an imprinting apparatus according to a fifth embodiment of the present invention will be described. Fig. 9 is a cross-sectional view showing the structure of an imprinting head 4d according to the fifth embodiment. The imprinting apparatus of this embodiment has an actuator 26 (second driving mechanism) in addition to the imprinting actuator 13. The actuator 26 can apply a force to the mold holding member 12 in the Z direction in which the flexible portion 12b is likely to bend.

[0063] The actuator 26 is disposed on the mold center side with respect to the flexible portion 12b, and can generate a force or displacement in the imprinting direction on a part of the mold holding member 12. The control device 9 controls the actuator 26 to correct the position of the mold holding member 12 when the illumination unit 2 starts irradiating with ultraviolet light 10. That is, after the imprinting actuator 13 moves the mold 3 a certain distance relative to the wafer 5, the actuator 26 is used for fine adjustment (correction) during ultraviolet light irradiation. According to this embodiment, more dynamic control of the imprinting force is possible.

[0064] <Embodiment of the article manufacturing method> The pattern of the cured product formed by using the imprinting apparatus is used permanently on at least a part of various articles, or temporarily when manufacturing various articles. The articles include electric circuit elements, optical elements, MEMS, recording elements, sensors, and molds. Examples of the electric circuit elements include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensors, and FPGA. Examples of the molds include molds for imprinting.

[0065] The pattern of the cured product is used as it is as at least a part of a component of the article, or is used temporarily as a resist mask, which is removed after etching or ion implantation in a substrate processing step.

[0066] Next, a specific method for manufacturing the article will be described. As shown in Fig. 10(A), a substrate 1z such as a silicon wafer having a workpiece 2z such as an insulator formed on its surface is prepared, and then a composition 3z is applied to the surface of the workpiece 2z by an inkjet method or the like. Here, a state in which the composition 3z in the form of multiple droplets is applied onto the substrate is shown.

[0067] As shown in Fig. 10(B), the imprinting mold 4z is placed facing the composition 3z on the substrate with the side on which the concave-convex pattern is formed. As shown in Fig. 10(C), the substrate 1z to which the composition 3z is applied is brought into contact with the mold 4z, and pressure is applied. The composition 3z fills the gap between the mold 4z and the workpiece 2z. When light is irradiated through the mold 4z in this state as energy for curing, the composition 3z is cured.

[0068] As shown in Fig. 10(D), after the composition 3z is cured, the mold 4z and the substrate 1z are separated, and a pattern of the cured product of the composition 3z is formed on the substrate 1z. In this cured product pattern, the concave portions of the mold correspond to the convex portions of the cured product, and the convex portions of the mold correspond to the concave portions of the cured product, that is, the concave-convex pattern of the mold 4z is transferred to the composition 3z.

[0069] As shown in FIG. 10(E), when etching is performed using the pattern of the cured material as an etching-resistant mask, the portion of the surface of the workpiece 2z where there is no cured material or where only a thin portion remains is removed, forming a groove 5z. As shown in FIG. 10(F), when the pattern of the cured material is removed, an article having grooves 5z formed on the surface of the workpiece 2z can be obtained. Here, the pattern of the cured material is removed, but it may be used as an interlayer insulating film included in a semiconductor element or the like, that is, a component of an article, without being removed after processing. Note that, although an example of using a mold for transferring a circuit pattern with a concave-convex pattern has been described as the mold 4z, a mold (flat template) having a flat portion without a concave-convex pattern may also be used.

[0070] <Other embodiments> Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist of the present invention.

[0071] The present invention can also be realized by a process in which a program for implementing one or more of the functions of the above-described embodiments is supplied to a system or device via a network or a storage medium, and one or more processors in a computer of the system or device read and execute the program. The present invention can also be realized by a circuit (e.g., ASIC) for implementing one or more of the functions.

[0072] The disclosure of this embodiment includes the following configuration. (Configuration 1) An imprinting apparatus that brings a mold on which a pattern is formed into contact with an imprinting material applied onto a substrate to form a pattern of the imprinting material on the substrate, comprising: an imprint head having a fixed part, a movable part base connected to the fixed part via a first flexible member, a mold holding member that holds the mold, and a second flexible member that connects the movable part base and the mold holding member; a first driving mechanism that drives the imprint head to bring the mold held by the mold holding member into contact with the imprint material on the substrate held by a substrate holding part; A control unit that controls the first drive mechanism; a first measuring device that measures an amount of distortion or deformation of the second flexible member, or a relative position of the mold holding member or the mold with respect to the movable part base.

[0073] (Configuration 2) The imprint apparatus according to configuration 1, wherein the control unit controls driving of the first driving mechanism based on a value of the first measuring device.

[0074] (Configuration 3) The imprint apparatus described in configuration 1 or 2, characterized in that the control unit controls the drive amount of the first drive mechanism at the time of the contact based on the amount of change from the value of the first measuring instrument before the contact.

[0075] (Configuration 4) The method further includes an irradiation unit that irradiates the imprint material on the substrate with energy for hardening while the mold and the imprint material on the substrate are in contact with each other, The imprint apparatus described in any one of configurations 1 to 3, characterized in that the control unit controls the first drive mechanism so that the value of the first measuring instrument becomes a target value when the irradiation unit starts to irradiate the energy.

[0076] (Configuration 5) a second driving mechanism that is disposed on a side of the second flexible portion in a direction toward a center of the mold and is capable of generating a force or a displacement on a part of the mold holding member in a driving direction of the imprint head at the time of the contact; The imprint apparatus according to configuration 4, wherein the control unit controls the second drive mechanism to correct the position of the mold holding member at the time when the irradiation unit starts to irradiate the energy.

[0077] (Configuration 6) 6. The imprint apparatus according to any one of configurations 1 to 5, wherein the first measuring device is any one of a strain gauge, an angle detector, and a position detector that measures the relative position.

[0078] (Configuration 7) The imprinting apparatus described in any one of configurations 1 to 6, characterized in that the second flexible member has a hollow portion, and a gas pipeline for inflating the mold by suction or pressure is disposed within the hollow portion.

[0079] (Configuration 8) 8. The imprint apparatus of configuration 7, wherein the cross-sectional shape of the second flexible member is a rectangular or hexagonal outer shape and the cavity.

[0080] (Configuration 9) the first driving mechanism is disposed at three locations in a horizontal direction around the mold held by the mold holding member, An imprint apparatus described in any one of configurations 1 to 8, characterized in that the second flexible member is arranged in three locations horizontally around the mold held by the mold holding member, and in a position that overlaps with the first driving mechanism when viewed from the direction of the mold.

[0081] (Configuration 10) The imprint apparatus described in any one of configurations 1 to 9, characterized in that the control unit switches control of the drive of the first driving mechanism from control based on the current value of the first driving mechanism to control based on the value of the first measuring instrument during the operation of contacting the imprint material on the substrate.

[0082] (Configuration 11) a holding mechanism that is fixed to the movable portion base, that is disposed on the second flexible portion toward the mold center, and that holds by suction a part of the mold holding member; The imprinting apparatus described in any one of configurations 1 to 10, characterized in that the control unit causes the holding mechanism to adsorb and hold a portion of the mold holding member at the time of contact or during a demolding operation to peel the mold from the imprinting material on the substrate after the contact.

[0083] (Configuration 12) 12. The imprint apparatus according to any one of configurations 1 to 11, wherein the second flexible member has a stiffness lower than a stiffness of the first flexible member.

[0084] (Configuration 13) a magnification correction mechanism for applying a compressive force from a side surface of the mold; a third flexible member extending horizontally from the magnification correction mechanism and flexible in the direction of contact; a second measuring device for measuring an amount of strain or deformation in the vicinity of the third flexible member; 13. The imprint apparatus of any one of configurations 1 to 12, wherein the control unit controls driving of the first driving mechanism based on the value of the first measuring instrument and the value of the second measuring instrument.

[0085] (Configuration 14) An imprinting apparatus described in any one of configurations 1 to 13, characterized in that the second flexible member is positioned outside a cavity space for deforming the mold when the mold is brought into contact with the imprinting material on the substrate.

[0086] (Method 1) An imprinting method for forming a pattern of an imprint material on a substrate by contacting a mold on which a pattern has been formed with an imprint material applied onto the substrate, the method comprising the steps of: an imprint head having a movable part base connected via a first flexible member to a fixed part, a mold holding member that holds the mold, and a second flexible member that connects the movable part base and the mold holding member, is driven using a first driving mechanism to bring the mold held by the mold holding member into contact with the imprint material on the substrate held by a substrate holding part; measuring an amount of strain or deformation of the second flexible member, or a relative position of the mold holding member or the mold with respect to the movable portion base; An imprint method comprising controlling driving of the first driving mechanism based on a value of the measurement.

[0087] (Method 2) forming a pattern on a substrate using the imprint apparatus according to any one of configurations 1 to 14; A processing step of processing the substrate on which the pattern has been formed in the forming step, A method for manufacturing an article, comprising manufacturing an article from the substrate processed in the processing step. [Explanation of symbols]

[0088] 1 Imprinting device 3. Mold 4 Imprint head 5 Wafer 9 Control device 12b Flexible part 13 Imprint actuator 16 Leaf spring 17 Displacement Sensor 19 Movable base

Claims

1. An imprint apparatus for forming a pattern of an imprint material on a substrate by bringing a mold with a pattern formed on it into contact with an imprint material applied to the substrate, An imprint head comprising a fixed part, a movable part base connected to the fixed part via a first flexible member, a mold holding member for holding the mold, and a second flexible member connecting the movable part base and the mold holding member, which is flexible in a first direction, A first drive mechanism drives the imprint head in the first direction to bring the mold held by the mold holding member into contact with the imprint material on the substrate held by the substrate holding member, A control unit that controls the first drive mechanism, An imprint apparatus characterized by having a first measuring instrument that measures the relative position of the mold holding member or the mold with respect to the movable base by measuring the amount of strain or deformation of the second flexible member, or the amount of movement of the second flexible member in the first direction, caused by the movement of the second flexible member in the first direction.

2. The imprint apparatus according to claim 1, characterized in that the control unit controls the drive of the first drive mechanism based on the value of the first measuring instrument.

3. The imprint apparatus according to claim 1, characterized in that the control unit controls the amount of drive of the first drive mechanism at the time of contact based on the amount of change from the value of the first measuring instrument before the contact.

4. The mold is in contact with the imprint material on the substrate, and the device further includes an irradiation unit that irradiates the imprint material on the substrate with curing energy. The imprint apparatus according to claim 1, characterized in that the control unit controls the first drive mechanism so that the value of the first measuring instrument becomes the target value when the irradiation unit starts irradiating with the energy.

5. The second flexible member is positioned on the side of the mold toward the center, and has a second drive mechanism capable of generating force or displacement in the driving direction of the imprint head at the time of contact with a part of the mold holding member, The imprint apparatus according to claim 4, characterized in that the control unit controls the second drive mechanism to correct the position of the mold holding member at the start of irradiation of the energy by the irradiation unit.

6. The imprint apparatus according to claim 1, characterized in that the first measuring instrument is any of a strain gauge, an angle detector, and a position detector for measuring the relative position.

7. The imprint apparatus according to claim 1, characterized in that the second flexible member has a cavity, and a gas pipeline for inflating the mold by adsorption or pressurization is arranged within the cavity.

8. The imprint apparatus according to claim 7, characterized in that the cross-sectional shape of the second flexible member is square or hexagonal in its outer shape and the cavity portion.

9. The first drive mechanism is arranged in three locations horizontally around the mold held by the mold holding member, The imprint apparatus according to claim 1, characterized in that the second flexible member is arranged at three locations in the horizontal direction with respect to the mold held by the mold holding member, and at positions that overlap with the first drive mechanism when viewed from the direction of the mold.

10. The imprint apparatus according to claim 1, characterized in that the control unit switches the control of the first drive mechanism from control based on the current value of the first drive mechanism to control based on the value of the first measuring instrument during the operation of bringing the imprint material on the substrate into contact with the first drive mechanism.

11. It is fixed to the movable base, positioned on the side of the second flexible member toward the center of the mold, and has a holding mechanism that suction-holds a part of the mold holding member, The imprint apparatus according to claim 1, characterized in that the control unit causes the holding mechanism to adsorb and hold a part of the mold holding member when making contact or when performing a demolding operation to peel the mold away from the imprint material on the substrate after the contact.

12. The imprint apparatus according to claim 1, characterized in that the rigidity of the second flexible member is lower than the rigidity of the first flexible member.

13. A magnification correction mechanism for applying compressive force from the side of the mold, A third flexible member extending horizontally from the magnification correction mechanism and flexible in the direction of contact, It includes a second measuring instrument for measuring the amount of strain or deformation near the third flexible member, The imprint apparatus according to claim 1, characterized in that the control unit controls the driving of the first drive mechanism based on the value of the first measuring instrument and the value of the second measuring instrument.

14. The mold with the pattern formed on it is brought into contact with the imprint material applied to the substrate. an imprint method for forming a pattern of the imprint material on the substrate, An imprint head having a movable base connected to a fixed part via a first flexible member, a mold holding member for holding the mold, and a second flexible member connecting the movable base and the mold holding member and being flexible in a first direction, is driven using a first drive mechanism to bring the mold held by the mold holding member into contact with the imprint material on the substrate held by the substrate holding part. The amount of strain or deformation of the second flexible member, or the relative position of the mold holding member or the mold with respect to the movable base, is measured. An imprint method characterized by controlling the drive of the first drive mechanism based on the measured value.

15. A forming step of forming a pattern on a substrate using the imprint apparatus described in claim 1, The process includes processing the substrate on which the pattern has been formed in the forming step, A method for manufacturing an article, characterized by manufacturing an article from the substrate processed in the processing step.

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