High frequency amplifier module and communication system

Abstract

To provide a high frequency amplifier module capable of reducing an adverse effect such as an oscillation phenomenon caused by a loop of electromagnetic noise between amplifiers while suppressing influences on a signal line.SOLUTION: A high frequency amplifier module 10 comprises a plurality of amplifiers 120, and amplifies a high frequency signal. The high frequency amplifier module 10 comprises: a first amplifier 120a; and a second amplifier 120b that is positioned at a post-stage of the first amplifier 120a and further amplifies a signal amplified by the first amplifier 120a. The high frequency amplifier module 10 also comprises a partition wall unit 200c that separates a first region including the first amplifier 120a from a second region including the second amplifier 120b to cut off electromagnetic noise. The high frequency amplifier module 10 further comprises a coaxial connector 100 that is provided at the partition wall unit 200c, is connected to the first amplifier 120a and the second amplifier 120b via signal lines 110 to cut off electromagnetic noise.SELECTED DRAWING: Figure 2A

Description

[Technical field]

[0001] The present invention relates to a high-frequency amplifier module and a communication system. [Background technology]

[0002] Conventionally, technologies have been proposed for amplifying and transmitting high-frequency signals. Patent Document 1 discloses a multistage amplifier for microwave bands that reduces mutual interference caused by radiation from each amplifier. The multistage amplifier disclosed in Patent Document 1 adds only through holes that penetrate to the earth surface of the inner layer between amplifiers on the same surface and a metal case with a partition wall, thereby realizing a shielding effect between amplifiers on the same surface and reducing mutual interference. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 9-238033 Summary of the Invention [Problem to be solved by the invention]

[0004] The metal case (metal wall) used in the multistage amplifier disclosed in Patent Document 1 is formed to contact the board in order to shield electromagnetic noise, but due to roughness of the metal surface or warping of the board, a gap will be formed between the metal case and the board. For example, in a system that handles high-frequency signals of 25 GHz or more, if there is a gap between the metal case and the board, electromagnetic noise will leak. When multiple amplifiers are used, if electromagnetic noise generated in the amplifier on the output side of the signal due to this leakage wraps around to the signal input terminal of the amplifier on the input side, the electromagnetic noise will be amplified by the multiple amplifiers. When the strength P of this wraparound electromagnetic noise is P×G≧1 in the total gain G of the amplifiers, the amplified noise will repeat the loop of wrapping around from the output side to the amplifier on the input side again, causing problems such as oscillation. In addition, when a radio wave absorbing sheet or radio wave absorbing ink is applied to prevent electromagnetic noise between the cases, problems occur in that the signal line connecting each amplifier is short-circuited with the signal line and GND, or the impedance changes, deteriorating the characteristics of the signal line.

[0005] The present invention has been made in view of the problems associated with the conventional techniques, and an object of the present invention is to provide a high-frequency amplifier module that is capable of reducing adverse effects such as oscillation caused by electromagnetic noise radiated from each amplifier reaching other amplifiers while suppressing effects on signal lines. [Means for solving the problem]

[0006] A radio frequency amplifier module according to an embodiment of the present invention is a radio frequency amplifier module that has a plurality of amplifiers and amplifies a radio frequency signal, and includes a first amplifier, a second amplifier that is located downstream of the first amplifier and further amplifies the signal amplified by the first amplifier, a partition that separates a first area including the first amplifier from a second area including the second amplifier and blocks electromagnetic noise, and a coaxial connector that is provided in the partition and connected to the first amplifier and the second amplifier via signal lines, respectively, and blocks electromagnetic noise.

[0007] A communication system according to an aspect of the present invention includes the above-described high-frequency amplifier module in at least one of an optical transmitter or an optical receiver, and includes the above-described high-frequency amplifier module in the optical receiver. Effect of the Invention

[0008] According to the present invention, it is possible to provide a high-frequency amplifier module that can reduce adverse effects such as oscillation caused by electromagnetic noise radiated from each amplifier reaching other amplifiers while suppressing the effects on signal lines. [Brief description of the drawings]

[0009] [Figure 1] 1 is a diagram showing a configuration of a communication system to which a high-frequency amplifier module according to an embodiment of the present invention is applied. [Figure 2A] 1 is a diagram showing a configuration of a high-frequency amplifier module according to a first embodiment. [Figure 2B] 2A and 2B are diagrams illustrating a substrate of the high-frequency amplifier module according to the first preferred embodiment of the present invention. [Figure 3A] 3 is a cross-sectional view of the high-frequency amplifier module taken along the line IIIA-IIIA of FIG. 2A. [Figure 3B] 1A and 1B are diagrams illustrating a configuration of a coaxial connector according to an embodiment of the present invention. [Figure 4A] 2B is a cross-sectional view of the high-frequency amplifier module taken along the cross section IVA-IVA of FIG. 2A. [Figure 4B] 4 is a cross-sectional view of the high-frequency amplifier module taken along the line IVB-IVB of FIG. 2A. [Figure 5A] FIG. 11 is a diagram showing a configuration of a high-frequency amplifier module according to a second embodiment. [Figure 5B] 10A and 10B are diagrams illustrating a substrate of a high-frequency amplifier module according to a second embodiment. [Figure 6A] 5B is a cross-sectional view of the high-frequency amplifier module taken along the VIA-VIA cross section of FIG. 5A. [Figure 6B] 5B is a cross-sectional view of the high-frequency amplifier module taken along the line VIB-VIB of FIG. 5A. [Figure 7] 11A and 11B are diagrams illustrating a high-frequency amplifier module according to a third embodiment. [Figure 8] 1 is a diagram showing a configuration in which a high-frequency amplifier module according to an embodiment of the present invention is provided in an optical receiver. [Figure 9A] 9 is a top view showing the configuration of the optical receiver shown in FIG. 8. [Figure 9B] 9B is a cross-sectional view of the high-frequency amplifier module taken along the line IXB-IXB of FIG. 9A. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] The high-frequency amplifier module 10 according to this embodiment will be described in detail below with reference to the drawings. Note that the dimensional ratios in the drawings are exaggerated for the convenience of explanation and may differ from the actual ratios. In addition, in the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals.

[0011] Fig. 1 is a diagram showing the configuration of a communication system 1 to which a high-frequency amplifier module 10 according to this embodiment is applied. As shown in Fig. 1, the communication system 1 is composed of, for example, an optical transmitter 11 that converts a signal received from an antenna 14 into an optical signal and transmits the optical signal to an optical fiber 13, and an optical receiver 12 that receives the optical signal received via the optical fiber 13.

[0012] In this embodiment, the high-frequency amplifier module 10 may be provided in an optical transmitter 11 to amplify a signal received via an antenna 14 and send it to a laser 15 that emits an optical signal. The high-frequency amplifier module 10 may also be provided in an optical receiver 12 to receive an optical signal and amplify an electrical signal converted from the optical signal by a photodiode 16 (PD).

[0013] 1, the high-frequency amplifier module 10 has a multi-stage configuration that includes a plurality of amplifiers 120 and amplifies high-frequency signals. Hereinafter, a detailed configuration of the high-frequency amplifier module 10 that includes a plurality of amplifiers 120 will be described.

[0014] (First embodiment) Fig. 2A is a top view showing the configuration of a high-frequency amplifier module 10 according to the first embodiment. In the example shown in Fig. 2A, a configuration in which a first amplifier 120a and a second amplifier 120b are connected is shown typically. The second amplifier 120b is located after the first amplifier 120a, and further amplifies the signal amplified by the first amplifier 120a. Hereinafter, when there is no need to distinguish between the first amplifier 120a and the second amplifier 120b, they will simply be referred to as "amplifier 120".

[0015] 2A, the first amplifier 120a and the second amplifier 120b are provided in a first region and a second region separated by a bulkhead 200c, respectively. The first amplifier 120a and the second amplifier 120b are electrically connected via a coaxial connector 100 provided in the bulkhead 200c.

[0016] Moreover, amplifier 120 receives a signal via signal line 110 provided on substrate 210 and outputs the amplified signal. Signal line 110 and coaxial connector 100 are connected via coaxial connector pins 101a and 101b.

[0017] In this specification, as shown in Fig. 2A, the direction in which the regions of the high-frequency amplifier module 10 are connected (the longitudinal direction in Fig. 2A) is defined as the X-axis direction, and the short-side direction is defined as the Y-axis direction. The direction perpendicular to the plane (XY plane) formed by the X-axis direction and the Y-axis direction is defined as the Z-axis direction. That is, in the example shown in Fig. 2A, the direction perpendicular to the substrate 210, that is, the depth direction of the drawing, is defined as the Z-axis direction.

[0018] A signal line 110 and a GND 140 are provided on the front and back surfaces of the substrate 210. Fig. 2B shows a top view of Fig. 2A with the amplifier 120, the coaxial connector 100, the bulkhead 200c, the power line 130, and the signal line 110 omitted.

[0019] In this embodiment, the coaxial connector 100 is a general connector such as SMPM or SMP that is compatible with high frequencies of 20 GHz or more. The coaxial connector 100 is configured in such a way that a coaxial connector joint 100c is sandwiched between coaxial connector exteriors 100a and 100b. The type of the coaxial connector 100 does not limit the configuration of this embodiment, and any coaxial connector 100 that is compatible with high frequencies of 20 GHz or more, such as SMA, SMB, MCX, or MMCX, may be used.

[0020] Fig. 3A is a cross-sectional view of the radio-frequency amplifier module 10 taken along the IIIA-IIIA cross section of Fig. 2A. The radio-frequency amplifier module 10 according to the first embodiment is sandwiched between an upper case 200a and a lower case 200b in the vertical direction (Z-axis direction) of Fig. 3A. The radio-frequency amplifier module 10 also has a partition wall 200c formed along the Y-axis direction at a position in the X-axis direction where the coaxial connector 100 is provided.

[0021] In this embodiment, the upper case 200a, the lower case 200b, and the partition wall 200c are made of a metal that blocks electromagnetic noise. Hereinafter, when there is no need to distinguish between the upper case 200a, the lower case 200b, and the partition wall 200c, they will be simply referred to as the "metal case 200."

[0022] 3A, the substrate 210 has the GND 140 formed on the lower surface side in the Z-axis direction, and the signal line 110 provided on a part of the upper surface. Furthermore, surface roughness or substrate warpage is formed between the lower case 200b or the bulkhead 200c and the coaxial connector 100 or the GND 140. Furthermore, due to the surface roughness or substrate warpage, a gap is formed between the upper case 200a, the lower case 200b, or the bulkhead 200c and the coaxial connector 100 or the GND 140.

[0023] The high-frequency amplifier module 10 according to this embodiment fills this gap with a radio wave absorbing sheet 201a or radio wave absorbing ink 201b that removes electromagnetic noise, thereby making it possible to reduce adverse effects such as an oscillation phenomenon that occurs due to an electromagnetic noise loop between the amplifiers 120 (see FIG. 4A). Furthermore, the high-frequency amplifier module 10 according to this embodiment uses a coaxial connector 100 to prevent the radio wave absorbing sheet 201a or radio wave absorbing ink 201b from adhering to the signal line 110, making it possible to suppress effects on the signal line 110, such as a deterioration in the characteristics of the signal line 110.

[0024] Fig. 3B is a diagram for explaining the configuration of the coaxial connector 100 according to this embodiment. As shown in Fig. 3B, the coaxial connector 100 used in the high-frequency amplifier module 10 according to this embodiment has a coaxial connector joint inner pin 102 and coaxial connector pins 101a and 101b applied therein. This allows the coaxial connector 100 to exchange signals between areas in which the amplifiers 120 are provided and which are separated by the partition wall 200c.

[0025] Fig. 4A is a cross-sectional view of the high-frequency amplifier module 10 taken along the IVA-IVA cross section of Fig. 2A. As shown in Fig. 4A, a radio wave absorbing sheet 201a and a radio wave absorbing ink 201b are filled in the gaps between the upper case 200a and the lower case 200b and the coaxial connector 100 and the GND 140. This makes it possible for the high-frequency amplifier module 10 to reduce adverse effects such as an oscillation phenomenon caused by an electromagnetic noise loop between the amplifiers 120.

[0026] 4A, the use of the coaxial connector 100 prevents the radio wave absorbing sheet 201a and the radio wave absorbing ink 201b from adhering to the coaxial connector pin 101 electrically connected to the signal line 110. This makes it possible for the high-frequency amplifier module 10 according to this embodiment to suppress effects on the signal line 110, such as deterioration of the characteristics of the signal line 110 and the coaxial connector pin 101.

[0027] 4B is a cross-sectional view of the high-frequency amplifier module 10 taken along the line IVB-IVB in FIG. 2A. As shown in FIG. 4B, in a portion of the high-frequency amplifier module 10 where the coaxial connector 100 is not provided, the partition wall 200c can block electromagnetic noise. As shown in FIG. 4B, the gaps between the upper case 200a, the lower case 200b, and the partition wall 200c and the GND 140 are filled with a radio wave absorbing sheet 201a or a radio wave absorbing ink 201b. This can reduce adverse effects such as an oscillation phenomenon caused by an electromagnetic noise loop between the amplifiers 120.

[0028] As described above, the high-frequency amplifier module 10 according to the first embodiment is a high-frequency amplifier module 10 that includes a plurality of amplifiers 120 and amplifies a high-frequency signal. The high-frequency amplifier module 10 includes a first amplifier 120a and a second amplifier 120b that is located after the first amplifier 120a and further amplifies the signal amplified by the first amplifier 120a. The high-frequency amplifier module 10 also includes a partition wall 200c that separates a first area including the first amplifier 120a from a second area including the second amplifier 120b and blocks electromagnetic noise. The high-frequency amplifier module 10 also includes a coaxial connector 100 that is provided in the partition wall 200c, is connected to the first amplifier 120a and the second amplifier 120b via signal lines 110, and blocks electromagnetic noise.

[0029] As a result, the high-frequency amplifier module 10 according to the first embodiment can prevent the radio wave absorbing sheet 201a and the radio wave absorbing ink 201b from adhering to the coaxial connector pin 101 electrically connected to the signal line 110 by shielding electromagnetic noise with the case at the coaxial connector 100 portion. Therefore, the high-frequency amplifier module 10 according to the present embodiment can suppress the influence on the signal passing through the signal line 110. Furthermore, the high-frequency amplifier module 10 can reduce adverse effects such as oscillation phenomenon caused by electromagnetic noise loop between the amplifiers 120 by filling the gap between the metal case 200, the coaxial connector 100, and the GND 140 with the radio wave absorbing sheet 201a and the radio wave absorbing ink 201b. That is, the high-frequency amplifier module 10 according to the first embodiment can reduce adverse effects such as oscillation phenomenon caused by electromagnetic noise loop between the amplifiers 120 while suppressing the influence on the signal line 110.

[0030] Second embodiment As described above, one specific embodiment has been described, but the above-described embodiment is merely an example and is not intended to limit the embodiments. For example, in the above-described embodiment, a form in which the substrate 210 and the GND 140 are sandwiched between the partition wall 200c and the lower case 200b has been exemplified. Here, a configuration different from that of the first embodiment will be described for the high-frequency amplifier module 10 according to the second embodiment, which is formed in such a configuration that the substrates 210 in the regions in which the amplifiers 120 are provided are isolated.

[0031] Fig. 5A is a top view showing the configuration of a high-frequency amplifier module 10 according to the second embodiment. Note that the top view shown in Fig. 5A is the same as the top view of the high-frequency amplifier module 10 according to the first embodiment shown in Fig. 2A.

[0032] FIG. 5B shows a diagram in which the amplifier 120, the coaxial connector 100, the bulkhead 200c, the power line 130, and the signal line 110 are omitted from the top view of FIG. 5A. In the example shown in FIG. 5B, the length of the GND 140 in the horizontal direction (X-axis direction) in FIG. 5B is shorter than the length of the GND 140 in the horizontal direction (X-axis direction) in FIG. 2A. This is because the second embodiment is configured to fit the bulkhead 200c from the top and bottom directions (Z-axis direction) in order to block electromagnetic noise. Therefore, while the first embodiment is configured to join the substrates 210 in each region in the horizontal direction (X-axis direction), the second embodiment is configured to separate the substrates 210 in each region in the horizontal direction (X-axis direction). That is, the substrate 210 in the first region and the substrate 210 in the second region of the high-frequency amplifier module 10 according to the second embodiment are isolated by the bulkhead 200c.

[0033] Fig. 6A is a cross-sectional view of the high-frequency amplifier module 10 taken along the VIA-VIA cross section of Fig. 5A. Fig. 6B is a cross-sectional view of the high-frequency amplifier module 10 taken along the VIB-VIB cross section of Fig. 5A. As shown in Figs. 6A and 6B, in the second embodiment, the substrate 210 and the GND 140 are configured to be spaced apart from each other in regions, as compared with the configuration in the first embodiment shown in Figs. 4A and 4B. As a result, the high-frequency amplifier module 10 according to the second embodiment has fewer gaps between the substrate 210 and the metal case 200, making it possible to more effectively block electromagnetic noise and reduce adverse effects such as oscillation caused by electromagnetic noise loops between the amplifiers 120.

[0034] (Third embodiment) Next, a third embodiment will be described. In the following description, when the same reference numerals as those in the first and / or second embodiment are used, they indicate the same configuration as the first and / or second embodiment, and the preceding description will be referred to unless otherwise specified. Here, a configuration different from that of the first and / or second embodiment will be described for the high-frequency amplifier module 10 according to the third embodiment, which is capable of better shielding electromagnetic noise in the partition wall 200c that isolates the area in which the amplifier 120 is provided.

[0035] The diagram shown in Fig. 7 is a cross-sectional view of a radio-frequency amplifier module 10 according to the third embodiment. The radio-frequency amplifier module 10 according to the third embodiment has the same top view as the radio-frequency amplifier modules 10 according to the first and second embodiments, and is similar to the top views in Fig. 2A and Fig. 5A, and therefore is not shown here. Fig. 7 is a cross-sectional view of the radio-frequency amplifier module 10 according to the third embodiment taken along the VIB-VIB cross section in Fig. 5A.

[0036] In the high-frequency amplifier module 10 in the third embodiment, the partition wall 200c isolating the first and second regions is formed by an upper partition wall having a convex portion 200d along a predetermined direction, and a lower partition wall having a concave portion 200e along the predetermined direction. The upper partition wall and the lower partition wall according to the third embodiment are fitted together at the convex portion 200d and the concave portion 200e along the predetermined direction. In this embodiment, the convex portion 200d and the concave portion 200e are formed along the Y-axis direction in the cross section shown in FIG. 7. That is, the predetermined direction corresponds to the Y-axis direction in the example shown in FIG. 7.

[0037] In the example shown in Fig. 7, the partition wall portion 200c isolating the first region and the second region is formed by an upper partition wall having a convex portion 200d and a lower partition wall having a concave portion 200e. However, the configuration of the convex portion 200d and the concave portion 200e is not limited to the configuration shown in Fig. 7. For example, the partition wall portion 200c isolating the first region and the second region may be formed by an upper partition wall having a concave portion 200e and a lower partition wall having a convex portion 200d.

[0038] That is, the partition portion 200c separating the first and second regions of the high-frequency amplifier module 10 according to the third embodiment is formed of an upper partition and a lower partition. One of the upper partition and the lower partition has a concave portion 200e, and the other of the upper partition and the lower partition has a convex portion 200d, and the upper partition and the lower partition are fitted together at the concave portion 200e and the convex portion 200d.

[0039] As a result, in the high-frequency amplifier module 10 according to the third embodiment, the upper and lower bulkheads are more firmly joined together, which makes it possible for the high-frequency amplifier module 10 according to the third embodiment to better block electromagnetic noise than the high-frequency amplifier module 10 according to the second embodiment, thereby reducing adverse effects such as oscillation phenomena caused by electromagnetic noise loops between the amplifiers 120.

[0040] (Other embodiments) Although the embodiments have been described in detail with reference to the drawings, the present embodiments are not limited to the contents described in the above embodiments. The components described above include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the configurations described above can be appropriately combined. Various omissions, substitutions, or modifications of the configurations can be made without departing from the spirit of the embodiments.

[0041] FIG. 8 is a diagram showing an example of a case where the high-frequency amplifier module 10 according to this embodiment is applied to an optical receiver 12. The optical receiver 12 includes a photodiode 16 (PD) that converts an optical signal received from an optical fiber 13 into an electric signal, and a capacitor chip 17 and an inductor chip 18 that configure a bias T circuit for operating the photodiode 16. The optical receiver 12 also includes a high-frequency amplifier module 10 in a stage following the capacitor chip 17. In the example shown in FIG. 8, an example is shown in which an amplifier 120 is provided on each of three substrates 210a, 210b, and 210c. In the example shown in FIG. 8, the substrates 210a, 210b, and 210c are provided separately from each other, and an example is shown in which the configuration of the second or third embodiment described above is realized.

[0042] FIG. 9A is a top view showing the configuration of the optical receiver 12 shown in FIG. 8. FIG. 9B is a cross-sectional view of the high-frequency amplifier module 10 taken along the line IXB-IXB in FIG. 9A. The optical signal received from the optical fiber 13 is transmitted through the lens mirror member 16a and the wire bonding 16b, and converted into an electric signal. In this way, by applying the high-frequency amplifier module 10 to the optical receiver 12, in a module including a plurality of amplifiers 120, it is possible to reduce adverse effects such as oscillation caused by electromagnetic noise loops between the amplifiers 120 while suppressing effects on the signal line 110. Similarly, by providing the high-frequency amplifier module 10 in the optical transmitter 11, it is possible to realize a communication system 1 capable of reducing adverse effects such as oscillation caused by electromagnetic noise loops between the amplifiers 120 while suppressing effects on the signal line 110.

[0043] The features of the high-frequency amplifier module 10 and the communication system 1 will be described below.

[0044] The high-frequency amplifier module 10 according to the first embodiment includes a plurality of amplifiers 120 and amplifies a high-frequency signal. The high-frequency amplifier module 10 includes a first amplifier 120a and a second amplifier 120b that is located after the first amplifier 120a and further amplifies the signal amplified by the first amplifier 120a. The high-frequency amplifier module 10 also includes a partition wall 200c that separates a first area including the first amplifier 120a from a second area including the second amplifier 120b and blocks electromagnetic noise. The high-frequency amplifier module 10 also includes a coaxial connector 100 that is provided in the partition wall 200c, is connected to the first amplifier 120a and the second amplifier 120b via signal lines 110, and blocks electromagnetic noise.

[0045] According to the above configuration, the high-frequency amplifier module 10 uses the coaxial connector 100, and thus it is possible to prevent the radio wave absorbing sheet 201a and the radio wave absorbing ink 201b from adhering to the coaxial connector pin 101 electrically connected to the signal line 110. As a result, the high-frequency amplifier module 10 according to this embodiment is able to suppress the influence on the signal passing through the signal line 110. Furthermore, by filling the gap between the metal case 200, the coaxial connector 100, and the GND 140 with the radio wave absorbing sheet 201a and the radio wave absorbing ink 201b, the high-frequency amplifier module 10 is able to reduce adverse effects such as an oscillation phenomenon caused by an electromagnetic noise loop between the amplifiers 120. That is, the high-frequency amplifier module 10 according to the first embodiment is able to reduce adverse effects such as an oscillation phenomenon caused by an electromagnetic noise loop between the amplifiers 120 while suppressing the influence on the signal line 110.

[0046] The substrate 210 in the first region and the substrate 210 in the second region of the high-frequency amplifier module 10 according to the second embodiment may be separated by a partition wall 200c.

[0047] According to the above configuration, the high-frequency amplifier module 10 has fewer gaps between the substrate 210 and the metal case 200, making it possible to better block electromagnetic noise and reduce the adverse effects of oscillations and other phenomena caused by electromagnetic noise loops between the amplifiers 120.

[0048] The partition portion 200c separating the first and second regions of the high-frequency amplifier module 10 according to the third embodiment may be formed of an upper partition and a lower partition. One of the upper partition and the lower partition may have a concave portion 200e along a predetermined direction. The other of the upper partition and the lower partition may have a convex portion 200d along the predetermined direction. Furthermore, the upper partition and the lower partition may be fitted together at the convex portion 200d and the concave portion 200e along the predetermined direction.

[0049] According to the above-described configuration, the high-frequency amplifier module 10 has the upper and lower bulkheads joined more firmly, making it possible to block electromagnetic noise and reduce adverse effects such as oscillation phenomena caused by electromagnetic noise loops between the amplifiers 120.

[0050] The communication system 1 according to the fourth aspect includes the above-mentioned high-frequency amplifier module 10 in at least one of the optical transmitter 11 and the optical receiver 12.

[0051] According to the above configuration, the communication system 1 is provided with the high-frequency amplifier module 10 in at least one of the optical transmitter 11 and the optical receiver 12, thereby making it possible to reduce adverse effects such as oscillation phenomena caused by electromagnetic noise loops between the amplifiers 120 while suppressing the effects on the signal line 110. [Explanation of symbols]

[0052] 1. Communication Systems 10 High frequency amplifier module 11 Optical transmitter 12 Optical Receiver 13. Optical Fiber 14 Antenna 15 Laser 16 Photodiode 16a Lens mirror parts 16b Wire Bonding 17 Capacitor Chip 18 Inductor Chip 100 Coaxial Connector 100a, 100b coaxial connector housing 100c coaxial connector joint 101, 101a, 101b coaxial connector pins 102 Coaxial connector joint inner pin 110 Signal line 120 Amplifier 130 Power line 140 GND 200 Metal Case 200a Upper case 200b Lower case 200c Bulkhead 200d convex part 200e concave part 201a Radio wave absorbing sheet 201b Radio-wave absorbing ink 210, 210a, 210b, 210c substrate

Claims

1. A high frequency amplifier module having a plurality of amplifiers for amplifying a high frequency signal, A first amplifier; a second amplifier located downstream of the first amplifier and further amplifying the signal amplified by the first amplifier; a partition wall that separates a first region including the first amplifier from a second region including the second amplifier and blocks electromagnetic noise; a coaxial connector provided in the bulkhead and connected to the first amplifier and the second amplifier via a signal line, respectively, and blocking the electromagnetic noise.

2. 2. The high-frequency amplifier module according to claim 1, wherein the substrate in the first region and the substrate in the second region are separated by the partition wall.

3. the partition portion isolating the first region and the second region includes an upper partition and a lower partition, one of the upper partition wall and the lower partition wall has a concave portion along a predetermined direction, the other of the upper partition wall and the lower partition wall has a convex portion along the predetermined direction, 3. The high frequency amplifier module according to claim 2, wherein said upper bulkhead and said lower bulkhead are fitted together at said concave portion and said convex portion along said predetermined direction.

4. A communication system comprising at least one of an optical transmitter and an optical receiver, the high-frequency amplifier module according to any one of claims 1 to 3.

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