Nano-micron semiconductor integrated circuit

Abstract

To solve a problem in which there is a demand for smaller semiconductor integrated circuits, but current manufacturing methods have limitations, making it necessary to create new manufacturing methods.SOLUTION: Instead of using metal wire or liquid materials as materials for electronic circuits, nanopowder is manufactured by finely powdering good conductors such as carbon-based conductors, and used as the material.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention relates to an application technology of semiconductor integrated circuits and nanopowder processing technology. [Background technology]

[0002] Semiconductor integrated circuit manufacturing technology

[0003] Nano powder processing technology (fine powder processing technology) Summary of the Invention [Problem to be solved by the invention]

[0004] Semiconductor integrated circuits, used in computers and a variety of electrical appliances, have become increasingly miniaturized. However, while there is a demand for even smaller circuits (miniaturization), there is a limit to how far the circuits can be miniaturized using current manufacturing methods (production technologies). [Means for solving the problem]

[0005] Conventional methods for manufacturing semiconductor integrated circuits involve using metals such as copper as the material for the electronic circuits, which are the pathways for electricity, and stretching them into thin, thread-like shapes. However, there were limitations to how thin the wire could be processed. There were issues with making the wire too thin, as it would break, and with the electrical conductivity of copper, even the slightest gap meant that electricity would not flow. To address this issue, carbon-based conductors such as carbon isotopes are used to create nanopowders through fine powder processing. This material is then affixed to a circuit board to create an electronic circuit. The nanopowder makes it possible to create circuits with dimensions that were previously difficult to fabricate, and because carbon isotopes are far more conductive than copper, electricity can pass through even tiny gaps between the powder particles (electrons can jump between the gaps). In addition, if volcanic ash, which has properties similar to carbon-based conductors, is processed into nanopowder and used, production costs can be reduced. Furthermore, by applying optical film technology to these nanopowders and turning infrared blocking materials into nanopowders, and mixing them in the right proportions, a cooling effect against Joule heat can be obtained. In this way the problem is solved.

Claims

1. A method of using nanopowder of carbon-based conductors such as carbon isotopes as materials for the electronic circuits of semiconductor integrated circuits, rather than metals such as copper and aluminum that have been mainly used in the past. Conventional electronic circuits in semiconductor integrated circuits were manufactured by inserting thin, thread-like wires (such as copper wires) made from metals such as copper into a circuit board and fixing them in place, or by printing a liquid material made from a metal such as aluminum in a liquid state onto a circuit board. In contrast, this method involves fixing nanopowder, which is made by micronizing carbon-based conductors such as carbon isotopes, which have higher conductivity than copper, a highly conductive metal, to a nano-level, to a circuit board to create electronic circuits. (Carbon-based good conductors are considered to be organic conductors that contain a lot of carbon, and so include coal.) (There are several methods for fixing nanopowder to a circuit board, such as adhesive, static electricity, and laser burning, but the manufacturing method is not limited.)

2. A method of using volcanic ash, which is not a carbon-based good conductor (organic material) but has similar properties, as a material for the electronic circuits of semiconductor integrated circuits. A method of producing electronic circuits by fixing nanopowder made from volcanic ash, which has been finely processed to the nano level, to a circuit board.

3. A method for using an optical film for blocking infrared rays as described in claim 1 or claim 2, or a nanopowder made by processing a material with the same chemical composition as said film into a fine powder form, in an appropriate ratio (mixed nanopowder), as a material for the electronic circuits of a semiconductor integrated circuit.

4. A component or device using the method according to claim 1, 2 or 3.

5. A service or business using the part or device according to claim 4.