Frame cassette
The frame cassette design with a resin sheet and varying groove widths, along with an elastic member, addresses the issue of frame unit flapping and wafer shocks by securely accommodating frames, enhancing stability and preventing collisions.
Patent Information
- Application Number
- JP2023096920
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-06-13
- Publication Date
- 2024-12-25
AI Technical Summary
Frame units in semiconductor manufacturing cassettes can flap during transportation, causing shocks between wafers due to vertical swinging, and existing solutions with slide mechanisms are complex and costly.
A frame cassette design with an opening for wafer accommodation, featuring a resin sheet fixation, a frame receiving part with varying groove widths, and an elastic member to restrict frame movement, preventing collisions and shaking.
The design effectively suppresses frame unit shaking and prevents wafer shocks by guiding and restricting frame movement within the cassette, even during transportation errors.
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Figure 2024178635000001_ABST
Abstract
Description
[Technical field]
[0001] The present invention relates to a frame cassette. [Background technology]
[0002] A frame cassette used in a later stage of the semiconductor device manufacturing process is formed by opposing a pair of side panels each having a number of storage shelves formed thereon and connecting the upper ends and lower ends of the pair of side panels with upper and lower connecting members, respectively.
[0003] In such a frame cassette, a frame unit in which an annular frame and a wafer are integrated with each other via an adhesive tape is stored. The front of the frame cassette is opened, and the frame unit is stored in a plurality of storage shelves through this opening. [Prior art documents] [Patent documents]
[0004] [Patent Document 1] JP 2015-82588 A Summary of the Invention [Problem to be solved by the invention]
[0005] In the frame cassette described above, the side of the annular frame of the frame unit abuts against the slide wall to prevent the frame unit from jumping out. However, if the frame cassette swings up and down during transportation, the frame unit stored in the storage shelf may flap and give an impact to the wafers (the upper and lower wafers may come into contact with each other).
[0006] As a mechanism for preventing the annular frame from flapping up and down, a frame cassette is known that is provided with a frame restricting portion that switches between an open state and a closed state by sliding up and down.
[0007] However, in a frame cassette equipped with such a mechanism, the mechanism is complicated, which increases the manufacturing cost and makes the slide mechanism susceptible to damage. An object of the present invention is to suppress shaking of a frame unit without using a complex structure such as a slide mechanism. [Means for solving the problem]
[0008] The frame cassette of the present invention (the present frame cassette) is a frame cassette capable of accommodating a plurality of frame units formed by accommodating wafers in an opening in the center of a frame, and fixing a resin sheet to one side of the frame and fixing the wafers thereto, the frame cassette including a pair of side wall portions in which a plurality of accommodating grooves are arranged opposite each other, the groove width being greater than or equal to the thickness of the frame, a ceiling portion connecting the upper portions of the pair of side wall portions, a bottom portion connecting the lower portions of the pair of side wall portions, an entrance / exit portion formed by the pair of side wall portions, the ceiling portion and the bottom portion, which allows the frame unit to be inserted and removed, and a back portion provided on the opposite side of the entrance / exit portion to prevent the frame unit from falling off, the accommodating grooves being formed so that the groove width narrows from the entrance / exit portion side toward the back portion.
[0009] In this frame cassette, the storage groove may comprise a frame receiving portion provided on the entrance / exit portion side, having a constant groove width, for receiving a frame, a frame defining portion provided on the rear side, having a constant groove width narrower than the groove width of the frame receiving portion, for defining the movement of the frame, and a sloping portion provided between the frame receiving portion and the frame defining portion, the groove width narrowing from the frame receiving portion side toward the frame defining portion side, and the sloping portion may be formed to connect the frame receiving portion and the frame defining portion.
[0010] In this frame cassette, the accommodating groove may be provided with an elastic member at the portion where the groove width is narrowest, and the elastic member may suppress movement of the frame when the frame is inserted into the accommodating groove. Effect of the Invention
[0011] In this frame cassette, the storage groove formed in the side wall is formed so that the groove width narrows from the entrance / exit side toward the back. Therefore, when the frame unit is stored in the storage groove from the entrance / exit side, the frame unit is first inserted into the wide groove part of the storage groove. Therefore, it is possible to prevent the frame of the frame unit from colliding with the upper and lower components (e.g., shelf boards) of the storage groove in this frame cassette due to a transport error of the frame unit.
[0012] In addition, on the rear side of this frame cassette, the frame is accommodated in the narrow portion of the accommodation groove. This limits the movement of the frame. This makes it possible to prevent the frame units accommodated in the accommodation groove from shaking. This makes it possible to prevent adjacent frame units accommodated in adjacent accommodation grooves from coming into contact with each other and causing shocks to the wafers. [Brief description of the drawings]
[0013] [Figure 1] FIG. 2 is a perspective view showing a configuration of a cutting device. [Diagram 2] FIG. 2 is a perspective view showing a configuration of a frame cassette. [Diagram 3] FIG. 11 is a perspective view showing the configuration of the frame cassette from a different angle. [Figure 4] 4 is a perspective view showing a configuration of a side wall portion of the frame cassette. FIG. [Diagram 5] FIG. 2 is a plan view showing a configuration of a frame cassette. [Figure 6] 5A and 5B are explanatory diagrams showing the configuration of a storage groove formed in a side wall portion. [Figure 7] 7(a) and 7(b) are explanatory views showing a state in which the frame unit is accommodated in the accommodation groove shown in FIG. [Figure 8]FIG. 8(a) is an explanatory diagram showing another configuration of the accommodating groove formed in the side wall portion, and FIG. 8(b) is an explanatory diagram showing a state in which a frame unit is inserted into the accommodating groove shown in FIG. 8(a). [Figure 9] 9(a) and 9(b) are explanatory diagrams showing a state in which the frame unit is accommodated in the accommodation groove shown in FIG. 8(a). [Figure 10] FIG. 4 is an explanatory diagram showing the arrangement of elastic members. [Figure 11] 11(a) and 11(b) are explanatory views showing a state in which a frame unit is accommodated in an accommodating groove having an elastic member. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0014] The cutting device 1 shown in FIG. 1 is an example of a processing device that processes a wafer 100 shown in FIG. 2, in this embodiment, the wafer 100 is a disk-shaped semiconductor wafer, and has a lattice-shaped dividing lines 102 on its surface. Devices 104 are formed in each of the regions defined by the dividing lines 102.
[0015] In this embodiment, the wafer 100 is handled in the state of a frame unit 110. The frame unit 110 includes a ring-shaped frame 111 having an opening 112 in the center, the wafer 100, and an adhesive resin sheet 113. The frame unit 110 is formed by accommodating (placing) the wafer 100 in the opening 112 of the frame 111, and fixing the resin sheet 113 to one side of the frame 111 and fixing the wafer 100 thereto. That is, the frame unit 110 is formed by integrating the frame 111 and the wafer 100 accommodated (placed) in the opening 112 of the frame 111 with the resin sheet 113.
[0016] The configuration of the cutting device 1 shown in FIG. 1 will be described below.
[0017] 1, the cutting device 1 includes a support table 8. On the -Y direction side of the support table 8, a cassette stage 2 is provided on which a frame cassette 10 capable of accommodating a plurality of frame units 110 is placed.
[0018] The support stage 8 is provided with a transport mechanism 3 for transporting the frame unit 110, a cutting mechanism 4 for cutting the wafer 100 on the frame unit 110, and a cleaning mechanism 5 for cleaning the wafer 100 after cutting.
[0019] The transport mechanism 3 is configured to be able to remove the frame unit 110 from the frame cassette 10, transport the removed frame unit 110 toward the cutting mechanism 4 and the cleaning mechanism 5, and store the frame unit 110 in the frame cassette 10.
[0020] The control unit 7 executes various processes and performs overall control of each component of the cutting device 1. For example, the control unit 7 controls the transport mechanism 3 to transport the frame unit 110. The control unit 7 also controls the cutting mechanism 4 to perform cutting processing on the wafer 100. Furthermore, the control unit 7 controls the cleaning mechanism 5 to clean the wafer 100.
[0021] Here, the configuration of the frame cassette 10 used in the cutting device 1 will be described. 2 and 3, the frame cassette 10 includes a pair of side walls 11, a generally plate-shaped ceiling portion 12 connecting upper portions of the pair of side walls 11, and a generally plate-shaped bottom portion 13 connecting lower portions of the pair of side walls 11. The ceiling portion 12 has a handle 121 on its upper portion. An operator can hold the frame cassette 10 by using this handle 121.
[0022] As shown in FIG. 4, the side wall portion 11 has a plurality of accommodation grooves 21 for accommodating the frame units 110 therein.
[0023] That is, a plurality of elongated plate-like shelves 22 are provided at predetermined intervals in the Z-axis direction on the inner wall of the side wall portion 11. The space between two adjacent shelves 22 forms a storage groove 21. The groove width of this storage groove 21 (i.e., the space between two adjacent shelves 22) is formed to be equal to or larger than the thickness of the frame 111 of the frame unit 110.
[0024] 2 and 3, in the frame cassette 10, a pair of side walls 11 having such storage grooves 21 are disposed opposite each other. Therefore, the storage grooves 21 of the side walls 11 are also disposed opposite each other. Therefore, in the frame cassette 10, both ends of the frame 111 of the frame unit 110 are supported by the pair of storage grooves 21 disposed opposite each other in the pair of side walls 11, thereby making it possible to store the frame unit 110.
[0025] 2, 3, and 5, the frame cassette 10 is configured so that the frame unit 110 is accommodated in the accommodation groove 21 of the side wall portion 11 from the +Y direction side. That is, in the frame cassette 10, an entrance / exit portion 14 that allows the frame unit 110 to be inserted and removed and is formed by a pair of side wall portions 11, a ceiling portion 12, and a bottom portion 13 on the +Y direction side is formed.
[0026] 2 and 5, the frame cassette 10 is provided with a back portion 15 on the -Y direction side of the side wall portion 11 (opposite the entrance / exit portion 14) for preventing the frame unit 110 from falling off the storage groove 21. That is, the frame unit 110 stored in the storage groove 21 is prevented from protruding from the storage groove 21 in the -Y direction and falling off by the frame 111 abutting against the back portion 15.
[0027] 6, the accommodating groove 21 of the side wall 11 is formed so that the groove width narrows from the entrance / exit section 14 side toward the back section 15. That is, the accommodating groove 21 includes a frame defining section 25 close to the back section 15, and a frame inserting section 26 which is a section on the entrance / exit section 14 side of the frame defining section 25.
[0028] The frame defining portion 25 is a portion having a substantially constant groove width. The frame defining portion 25 is configured to have a groove width slightly wider than the frame 111 of the frame unit 110, and is capable of defining (limiting) the movement (motion) of the frame 111.
[0029] Frame insertion section 26 is a section provided on the entrance / exit section 14 side that receives frame 111 of frame unit 110 (a section into which frame 111 is inserted). Here, as shown in Fig. 6, lower surface 221 of shelf section 22 on the upper side of frame insertion section 26 is processed so as to become thinner toward entrance / exit section 14. In other words, at the upper part of frame insertion section 26, lower surface 221 of shelf section 22 is formed so as to slope downward from the entrance / exit section 14 side toward the back section 15 side. For this reason, the groove width of frame insertion section 26 narrows from the entrance / exit section 14 side toward the back section 15.
[0030] In the frame cassette 10 having such a configuration, the frame unit 110 is accommodated in the accommodation groove 21 of the side wall portion 11 from the entrance / exit portion 14 side by an operator or the transport mechanism 3 (see FIG. 1), as shown in FIG. 7(a). At this time, the frame 111 of the frame unit 110 may come into contact with the inclined lower surface 221 of the shelf portion 22 on the upper part of the frame insertion portion 26. In this case, the frame unit 110 is guided (guided) by this lower surface 221 and advances inside the accommodation groove 21 toward the back portion 15 side (-Y direction side).
[0031] 7(b), a part of the frame 111 enters the frame defining portion 25 of the side wall portion 11 and is accommodated in the frame defining portion 25. Then, when the frame 111 abuts against the back portion 15 arranged on the -Y direction side of the frame defining portion 25, accommodation of the frame unit 110 in the frame cassette 10 (accommodation groove 21) is completed.
[0032] As described above, in the frame cassette 10 of this embodiment, the storage groove 21 formed in the side wall portion 11 has a frame insertion portion 26 with a relatively wide groove width formed on the entrance / exit portion 14 side, and a frame defining portion 25 with a relatively narrow groove width formed on the back portion 15 side, and is formed so that the groove width narrows from the entrance / exit portion 14 side toward the back portion 15.
[0033] For this reason, in this embodiment, when the frame unit 110 is accommodated in the accommodation groove 21 from the entrance / exit section 14 side, the frame unit 110 is first inserted into the frame insertion section 26, which is the wide portion of the groove. For this reason, it is possible to prevent the frame 111 of the frame unit 110 from colliding with the side surfaces of the shelf sections 22 located above and below the accommodation groove 21 due to a conveyance error of the frame unit 110.
[0034] Moreover, on the rear portion 15 side of the frame cassette 10, the frame 111 is accommodated in the frame defining portion 25, which is a portion with a narrow groove width. As a result, the movement of the frame 111 is regulated (restricted) by the frame defining portion 25. This makes it possible to suppress the frame units 110 accommodated in the accommodation grooves 21 from swinging in the arrangement direction of the frame units 110 (the direction perpendicular to the extension direction of the accommodation grooves 21; in the state shown in FIG. 6, the Z-axis direction). This makes it possible to suppress the adjacent frame units 110 accommodated in the adjacent accommodation grooves 21 from coming into contact with each other, which would cause an impact on the wafers 100.
[0035] In addition, an operator may remove the frame unit 110 from the wafer 100 to perform an inspection or measurement. In this case, the operator may place the frame cassette 10 vertically (place the frame unit 110 in a direction such that the accommodation groove 21 extends in the vertical direction). In this case, since the resin sheet 113 is prone to bending, conventionally, the frame units 110 may come into contact with each other. In this regard, in the present embodiment, a part of the frame 111 of the frame unit 110 is accommodated in the narrow frame defining portion 25 in the accommodation groove 21, so that even when the frame cassette 10 is placed vertically, it is possible to effectively prevent the adjacent frame units 110 from coming into contact with each other.
[0036] In the frame cassette 10 of this embodiment, the storage groove 21 of the side wall portion 11 has a frame defining portion 25 having a relatively narrow and approximately constant groove width, and a frame insertion portion 26 having a relatively wide groove width, and the groove width of the frame insertion portion 26 narrows from the entrance / exit portion 14 side toward the back portion 15 side.
[0037] In this regard, the housing groove 21 does not need to have the frame defining portion 25, which is a portion having a relatively narrow and substantially constant groove width, so long as it has a portion such as the frame insertion portion 26 that narrows from the entrance / exit portion 14 toward the back portion 15. Even in this case, the movement of the frame 111 of the frame unit 110 can be restricted by the narrow groove width portion on the back portion 15 side of the housing groove 21, thereby suppressing the shaking of the frame unit 110.
[0038] The housing groove 21 may have a configuration as shown in Figures 8(a) and 8(b). The housing groove 21 shown in these figures has the frame defining portion 25 described above, and has a frame receiving portion 27 and an inclined portion 28 instead of the frame inserting portion 26.
[0039] 8(a), the frame receiving portion 27 is provided on the entrance / exit portion 14 side, has a substantially constant groove width, and is a portion that receives the side wall portion 11 of the frame unit 110. The groove width of the frame receiving portion 27 is wider than the groove width of the frame defining portion 25.
[0040] The frame defining portion 25 has a substantially constant groove width narrower than the groove width of the frame receiving portion 27, is provided on the back portion 15 side, and defines (limits) the movement (motion) of the frame 111 in the frame unit 110 as described above.
[0041] The inclined portion 28 is provided between the frame receiving portion 27 and the frame defining portion 25, and is a portion where the groove width narrows from the frame receiving portion 27 side toward the frame defining portion 25 side. The inclined portion 28 is formed so as to connect the frame receiving portion 27 and the frame defining portion 25.
[0042] That is, inclined portion 28 is configured to have the same groove width as frame receiving portion 27 on the frame receiving portion 27 side, while having the same groove width as frame defining portion 25 on the frame defining portion 25 side. And, at the upper part of inclined portion 28, lower surface 221 of shelf portion 22 is formed so as to slope downward from the frame receiving portion 27 side toward the frame defining portion 25 side. For this reason, the groove width of frame insertion portion 26 narrows from the frame receiving portion 27 side toward the frame defining portion 25 side (from the entrance / exit portion 14 side toward the back portion 15 side).
[0043] In the frame cassette 10 having such a configuration, the frame unit 110 is accommodated in the accommodation groove 21 of the side wall portion 11 from the entrance / exit portion 14 side by an operator or the transport mechanism 3 (see FIG. 1), as shown in FIG. 9(a). At this time, the frame 111 of the frame unit 110 enters from the frame receiving portion 27 and may come into contact with the inclined lower surface 221 of the shelf portion 22 on the upper part of the inclined portion 28. In this case, the frame unit 110 is guided (guided) by this lower surface 221 and advances inside the accommodation groove 21 toward the back portion 15 side (-Y direction side).
[0044] 9(b), a part of the frame 111 enters the frame defining portion 25 of the side wall portion 11 and is accommodated in the frame defining portion 25. Then, when the frame 111 abuts against the back portion 15 arranged on the -Y direction side of the frame defining portion 25, accommodation of the frame unit 110 in the frame cassette 10 (accommodation groove 21) is completed.
[0045] Even in this configuration, when the frame unit 110 is accommodated in the accommodation groove 21 from the entrance / exit section 14 side, the frame unit 110 is first inserted into the frame receiving section 27 having a wide groove width. This makes it possible to prevent the frame 111 of the frame unit 110 from colliding with the side surfaces of the shelf sections 22 located above and below the accommodation groove 21 due to a conveyance error of the frame unit 110.
[0046] Moreover, on the rear part 15 side of the frame unit 110, a part of the frame 111 is accommodated in a narrow frame regulating part 25. As a result, the movement of the frame 111 is regulated (limited) by the frame regulating part 25, so that the frame units 110 accommodated in the accommodation grooves 21 can be prevented from shaking in the arrangement direction. Therefore, it is possible to prevent adjacent frame units 110 from coming into contact with each other and giving an impact to the wafers 100.
[0047] In this embodiment, by lengthening the frame defining portion 25 in the housing groove 21, the movement of the frame unit 110 can be more effectively restricted.
[0048] 10 and 11(a), the accommodation groove 21 may be provided with an elastic member 29 in the frame defining portion 25, which is the portion where the groove width is narrowest. This elastic member 29 may be provided in only the accommodation groove 21 of one of the pair of side wall portions 11, or may be provided in the accommodation grooves 21 of both side wall portions 11. The elastic member 29 suppresses movement of the frame 111 of the frame unit 110 when the frame 111 is inserted into the accommodation groove 21.
[0049] 11(b), the elastic member 29 elastically deforms upon contact with the portion of the frame 111 housed in the frame defining portion 25. This allows the elastic member 29 to more firmly define the movement of the frame 111. This makes it possible to more effectively prevent the frame unit 110 housed in the housing groove 21 from shaking. This makes it possible to more effectively prevent adjacent frame units 110 from coming into contact with each other and giving an impact to the wafer 100. In this configuration, it is preferable that the frame 111 be firmly supported by the frame defining portion 25 and the elastic member 29 of the accommodating groove 21 so that the accommodated frame unit 110 does not fall out of the entrance / exit portion 14 even when the entrance / exit portion 14 side of the frame cassette 10 is facing downward.
[0050] 11(a) shows an example in which the elastic member 29 is provided in the frame defining portion 25, which is the narrowest portion of the housing groove 21 (housing groove 21 having frame defining portion 25, frame receiving portion 27, and inclined portion 28) shown in Fig. 8(a). In this regard, the elastic member 29 may be provided in the narrowest portion of the housing groove 21 (housing groove 21 having frame insertion portion 26) shown in Fig. 6 (for example, frame defining portion 25).
[0051] 2 and the like, the adhesive resin sheet 113 of the frame unit 110 may be a normal adhesive tape or a glue-free tape that does not have an adhesive layer. When a glue-free tape is used as the resin sheet 113, the frame 111 and the wafer 100 can be fixed to the resin sheet 113 by, for example, thermocompression bonding or the like. [Explanation of symbols]
[0052] 1: cutting device, 2: cassette stage, 3: transport mechanism, 4: cutting mechanism, 5: cleaning mechanism, 7: control unit, 8: support base, 10: frame cassette, 11: side wall portion, 12: ceiling portion, 13: bottom, 14: entrance / exit, 15: back, 21: storage groove, 22: shelf, 25: frame defining portion, 26: frame inserting portion, 27: frame receiving portion, 28: inclined portion, 29: elastic member, 100: wafer, 102: division line, 104: device, 110: frame unit, 111: frame, 112: opening, 113: resin sheet, 121: Handle, 221: Bottom surface
Claims
1. A frame cassette capable of accommodating a plurality of frame units formed by accommodating a wafer in a frame having an opening at a center thereof and accommodating the wafer in the opening, and fixing a resin sheet to one surface of the frame and fixing the wafer thereto, a pair of side walls in which a plurality of accommodation grooves are disposed opposite to each other, the groove width of the accommodation groove being equal to or larger than the thickness of the frame; a ceiling portion connecting upper portions of the pair of side walls; a bottom portion connecting lower portions of the pair of side wall portions; an entrance / exit section formed by the pair of side wall sections, the ceiling section, and the bottom section, which allows the frame unit to be inserted and removed; a back portion provided on the opposite side of the entrance / exit portion to prevent the frame unit from falling off; The housing groove is formed so that the groove width narrows from the entrance / exit portion side toward the back portion. Frame cassette.
2. The receiving groove is a frame receiving portion provided on the entrance / exit portion side, having a constant groove width, for receiving a frame; a frame defining portion provided on the rear side, having a constant groove width narrower than the groove width of the frame receiving portion, and defining the movement of the frame; a sloped portion provided between the frame receiving portion and the frame defining portion, the sloped portion having a groove width narrowing from the frame receiving portion side toward the frame defining portion side, The inclined portion is formed to connect the frame receiving portion and the frame defining portion.
2. The frame cassette according to claim 1.
3. The receiving groove is provided with an elastic member at a portion where the groove width is narrowest, The elastic member suppresses movement of the frame when the frame is inserted into the receiving groove.
3. A frame cassette according to claim 1 or 2.
Citation Information
Patent Citations
Wafer cassette
JP2015082588A
