Controlling semiconductor manufacturing equipment in a mixed reality environment

Abstract

Various embodiments herein relate to a mixed reality (MR) control platform that operates a semiconductor manufacturing tool in an MR environment and displays data associated with the semiconductor manufacturing tool. In some embodiments, the MR control platform comprises an MR control system and an MR headset. The MR control system can acquire sensor data representative of sensor output from the semiconductor manufacturing tool. The MR control system is associated with the semiconductor manufacturing tool and can determine operational information based on the sensor data. The MR control system can cause the operational information to be transmitted to the MR headset. The MR headset can receive the operational information associated with the semiconductor manufacturing tool from the MR control system. The MR headset can cause the MR environment to render content associated with the operational information and one or more control features.

Description

[Technical field]

[0001] Incorporation by Reference A PCT application is being filed contemporaneously herewith as a part of this application, and each application identified in that contemporaneously filed PCT application to which this application claims benefit or priority is hereby incorporated by reference in its entirety for all purposes. [Background technology]

[0002] Semiconductor manufacturing equipment can be very complex and can also be physically large and / or include opaque walls, which can make it difficult to determine the status of the equipment from visual inspection. Status information associated with the operation of the semiconductor manufacturing equipment (e.g., current operational status, current sensor values, etc.) may typically be presented on a display screen, such as a display screen attached to the semiconductor manufacturing equipment.

[0003] The background description provided herein is intended to provide a general overview of the contents of the present disclosure. Work by the currently named inventors within the scope of what is described in this Background section, as well as aspects of the description that may not otherwise be regarded as prior art at the time of filing, are not admitted, expressly or impliedly, as prior art against the present disclosure. Summary of the Invention

[0004] Disclosed herein are systems, methods, and media for operating a semiconductor manufacturing tool in a mixed reality (MR) environment and displaying data associated with the semiconductor manufacturing tool in the MR environment.

[0005] According to some embodiments, an MR control platform is provided for operating a semiconductor manufacturing tool in an MR environment and displaying data associated with the semiconductor manufacturing tool. In some embodiments, the MR control platform includes an MR control system including one or more processors and instructions stored in one or more memories of the MR control system and executed to cause the one or more processors of the MR control system to obtain sensor data representative of sensor output from the semiconductor manufacturing tool, determine operational information associated with the semiconductor manufacturing tool and based at least in part on the sensor data, and transmit the operational information associated with the semiconductor manufacturing tool to the MR headset over a wireless communication channel in response to the wireless communication channel being established with the MR headset; and an MR headset including one or more processors and instructions stored in one or more memories of the MR headset and executed to cause the one or more processors of the MR headset to establish a wireless communication channel with the MR control system, receive from the MR control system the operational information associated with the semiconductor manufacturing tool, and render content associated with the operational information and the one or more control features in the MR environment.

[0006] In some embodiments, the instructions stored in the one or more memories of the MR headset, when executed, further cause the one or more processors of the MR headset to identify a wireless access point associated with the MR control system and a password associated with the wireless access point, and establish a wireless communication channel by connecting to the wireless access point using the password.

[0007] In some embodiments, the instructions stored in the one or more memories of the MR headset, when executed, further cause the one or more processors of the MR headset to obtain image data via a camera associated with the MR headset, identify a machine-readable code in the image data, decode the machine-readable code to retrieve encrypted information, and decrypt the encrypted information using key information stored in the memory of the MR headset, wherein the decrypted information identifies the wireless access point by including an identifier and a password for the wireless access point.

[0008] In some embodiments, the rendered content includes user interface elements that indicate sensor values ​​contained in the sensor data acquired by the MR control system.

[0009] In some embodiments, the instructions stored in the one or more memories of the MR headset, when executed, further cause the one or more processors of the MR headset to receive user input indicating that the user interface elements are to be fixed in spatial coordinates with respect to the semiconductor manufacturing tool, identify a group of spatial coordinates within a coordinate system fixed with respect to the semiconductor manufacturing tool, the group of spatial coordinates indicating boundaries of the user interface elements with respect to the fixed spatial coordinates, identify a physical position and orientation of the MR headset relative to the coordinate system, and modify the presentation of the user interface elements based on the physical position and orientation of the MR headset with respect to the fixed spatial coordinates.

[0010] In some embodiments, the instructions stored in the one or more memories of the MR headset, when executed, further cause the one or more processors of the MR headset to identify a physical location and orientation of the MR headset, and the content is rendered based on the physical location and orientation of the MR headset. In some embodiments, the physical location and orientation of the MR headset is identified with respect to a semiconductor manufacturing tool.

[0011] In some embodiments, the operational information includes positions of one or more internal elements of the semiconductor manufacturing tool, and the rendered content includes a three-dimensional representation of the positions of the one or more internal elements of the semiconductor manufacturing tool over time, and the three-dimensional representation of the positions of the one or more internal elements of the semiconductor manufacturing tool is rendered based on the physical position and orientation of the MR headset relative to the semiconductor manufacturing tool.

[0012] In some embodiments, the instructions stored in the one or more memories of the MR control system, when executed, further cause the one or more processors of the MR control system to transmit three-dimensional model information associated with the semiconductor manufacturing tool to the MR headset, and the instructions stored in the one or more memories of the MR headset, when executed, further cause the one or more processors of the MR headset to receive and render the three-dimensional model information, and a three-dimensional representation of a position of the one or more internal elements is rendered based on the three-dimensional model information for the semiconductor manufacturing tool. In some embodiments, the one or more internal elements include at least one of a wafer support, a showerhead, one or more lift pins, one or more wafers, one or more slit valves, a robotic arm, an indexer, a carousel, or any combination of two or more thereof.

[0013] In some embodiments, the instructions stored in the one or more memories of the MR headset, when executed, further cause the one or more processors of the MR headset to receive one or more input signals associated with operational instructions for the semiconductor manufacturing tool and, in response to receiving the one or more input signals, to transmit the operational instructions to the MR control system, and the instructions stored in the one or more memories of the MR control system, when executed, further cause the one or more processors of the MR control system to receive the operational instructions from the MR headset and transmit commands to alter a state of the semiconductor manufacturing tool or a digital twin representing the semiconductor manufacturing tool via a communications interface configured to be communicatively connected to the semiconductor manufacturing tool.

[0014] In some embodiments, the sensor data includes virtual sensor data generated by the digital twin, and the instructions stored in the memory of the MR control system cause one or more processors of the MR control system to receive the virtual sensor data from the digital twin. In some embodiments, the instructions stored in the one or more memories of the MR control system, when executed, further cause the one or more processors of the MR control system to send three-dimensional model information associated with the semiconductor manufacturing tool to the MR headset, and the instructions stored in the one or more memories of the MR headset, when executed, further cause the one or more processors of the MR headset to render content based on an orientation of the MR headset and the three-dimensional model information, the rendered content including content indicative of a state of the digital twin. In some embodiments, the instructions stored in the one or more memories of the MR headset, when executed, further cause the one or more processors of the MR headset to identify an updated orientation of the MR headset and update the rendered content based on the updated orientation of the MR headset.

[0015] In some embodiments, the instructions stored in the one or more memories of the MR headset further cause the one or more processors of the MR headset to receive input indicating second operation information associated with the semiconductor manufacturing tool, the second operation information being at least partially different from the operation information, send a request for the second operation information to the MR control system, and render second content associated with the second operation information in response to receiving the second operation information from the MR control system, the instructions stored in the one or more memories of the MR control system further cause the one or more processors of the MR control system to receive a request for the second operation information, and in response to receiving the request, send the second operation information to the MR headset.

[0016] According to some embodiments, an MR headset configured to control a semiconductor manufacturing tool in an MR environment is provided. In some embodiments, the MR headset includes one or more processors, a display coupled to the one or more processors, one or more cameras, and one or more memories storing computer-executable instructions that, when executed, cause the one or more processors to establish a wireless communication channel with an MR control system of the semiconductor manufacturing tool, receive operational information associated with the semiconductor manufacturing tool from the MR control system, and render content associated with the operational information and one or more control features in the MR environment.

[0017] In some embodiments, the instructions, when executed, further cause the one or more processors to identify a wireless access point associated with the MR control system and a password associated with the wireless access point, and initiate establishment of a wireless communication channel by connecting to the wireless access point using the password. In some embodiments, the instructions, when executed, further cause the one or more processors to obtain image data via a camera of the one or more cameras, identify a machine-readable code in the image data, decode the machine-readable code to retrieve encrypted information, and decrypt the encrypted information using key information stored in the memory, where the decrypted information identifies the wireless access point by including an identifier and a password for the wireless access point.

[0018] In some embodiments, the instructions, when executed, further cause the one or more processors to identify a physical position and orientation of the MR headset based on data from one or more sensors of the MR headset, and the content is rendered from a viewpoint based on the identified physical position and orientation of the MR headset.

[0019] In some embodiments, the instructions, when executed, further cause the one or more processors to receive an input indicative of second operation information associated with the semiconductor manufacturing tool, the second operation information being at least partially different from the operation information, send a request for the second operation information to the MR control system, receive the second operation information from the MR control system, and render second content associated with the second operation information. In some embodiments, the input indicative of the second operation information indicates a selection of a selectable input included in a menu rendered by the MR headset. In some embodiments, the input indicative of the second operation information is generated based on an image capture of a machine-readable code identifying the second operation information. In some embodiments, the rendered content includes a user interface element presenting sensor data obtained from one or more sensors of the semiconductor manufacturing tool, the sensor data corresponding to the requested second operation information. In some embodiments, the instructions, when executed, further cause the one or more processors to receive a second input indicating that the user interface element is fixed in spatial coordinates with respect to the semiconductor manufacturing tool, identify a group of spatial coordinates within the coordinate system fixed with respect to the semiconductor manufacturing tool, the group of spatial coordinates indicating a boundary of the user interface element with respect to the fixed spatial coordinates, identify a physical position and orientation of the MR headset with respect to the coordinate system, and modify the presentation of the user interface element based on the physical position and orientation of the MR headset with respect to the fixed spatial coordinates.

[0020] In some embodiments, the instructions, when executed, further cause the one or more processors to receive three-dimensional model information associated with the semiconductor manufacturing tool as part of the motion information, identify a physical position and orientation of the MR headset relative to the semiconductor manufacturing tool, and render a three-dimensional representation of one or more elements of the semiconductor manufacturing tool based on 1) the three-dimensional model information and 2) the physical position and orientation of the MR headset relative to the semiconductor manufacturing tool as part of the rendered content associated with the motion information in the MR environment. In some embodiments, the motion information includes a position of one or more internal elements of the semiconductor manufacturing tool over time, and the rendered content includes a representation of a position of the one or more internal elements of the semiconductor manufacturing tool over time relative to the semiconductor manufacturing tool. In some embodiments, the one or more internal elements include at least one of a wafer support, a showerhead, one or more lift pins, one or more wafers, one or more slit valves, a robotic arm, an indexer, or a carousel. In some embodiments, the instructions, when executed, further cause the one or more processors to generate one or more three-dimensional images representing the one or more internal elements using the three-dimensional model information, and render the content by causing the MR headset to render the one or more three-dimensional images based on the position of the one or more internal elements relative to the semiconductor manufacturing tool.

[0021] In some embodiments, the instructions when executed further cause the one or more processors to receive three-dimensional model information associated with the semiconductor manufacturing tool as part of the operational information; and render content based on the three-dimensional model information, wherein the rendered content includes content indicative of a state of a component digital twin represented by the three-dimensional model information, wherein the digital twin represents the semiconductor manufacturing tool.

[0022] According to some embodiments, an MR control system is provided that includes one or more processors and one or more memory devices that store computer-executable instructions that, when executed, cause the one or more processors to establish a wireless communication channel with an MR headset, obtain sensor data representative of sensor output from a semiconductor manufacturing tool, determine operational information for the semiconductor manufacturing tool based on the sensor data, and transmit the operational information to the MR headset over the communication channel.

[0023] In some embodiments, the MR control system is in communication with the digital twin, and the sensor data includes virtual sensor data obtained from the digital twin. In some embodiments, the operational information includes an indication of a state of the digital twin. In some embodiments, the instructions further cause the one or more processors to transmit three-dimensional model information associated with at least a portion of the semiconductor manufacturing tool to the MR headset, and the MR headset renders content indicative of the state of the digital twin based on the three-dimensional model information.

[0024] In some embodiments, the MR control system is in communication with a semiconductor manufacturing tool, and the sensor data includes sensor data obtained from one or more physical sensors of the semiconductor manufacturing tool. In some embodiments, the operational information includes a state of the semiconductor manufacturing tool.

[0025] In some embodiments, the instructions, when executed, further cause the one or more processors to determine a position of one or more internal elements of the semiconductor manufacturing tool over time, and the operational information includes information indicative of a position of the one or more internal elements of the semiconductor manufacturing tool over time relative to the semiconductor manufacturing tool. In some embodiments, the instructions, when executed, further cause the one or more processors to transmit three-dimensional model information associated with at least a portion of the semiconductor manufacturing tool including at least one of the one or more internal elements, and the three-dimensional model information is used by the mixed reality headset to render a representation of the one or more internal elements based on the three-dimensional model information.

[0026] In some embodiments, the instructions, when executed, further cause the one or more processors to receive a request from the MR headset for second motion information that is at least partially different from the motion information, and to transmit the requested second motion information to the MR headset.

[0027] According to some embodiments, a method for controlling a semiconductor manufacturing tool via an MR session is provided, the method including establishing, by the MR headset, a wireless communication channel with an MR control system; acquiring, by the MR control system, sensor data representative of sensor output from the semiconductor manufacturing tool; determining, by the MR control system, operational information associated with the semiconductor manufacturing tool and based at least in part on the sensor data; transmitting, in response to the wireless communication channel established by the MR control system and with the MR headset, the operational information associated with the semiconductor manufacturing tool to the MR headset via the communication channel; receiving, by the MR headset, the operational information associated with the semiconductor manufacturing tool from the MR control system; and rendering, by the MR headset, content associated with the operational information and the one or more control features in an MR environment.

[0028] In some embodiments, the method further includes identifying, by the MR headset, a wireless access point associated with the MR control system and a password associated with the wireless access point, and connecting to the wireless access point using the password. In some embodiments, the method further includes acquiring image data via a camera associated with the MR headset, identifying a machine-readable code in the image data, decoding the machine-readable code to retrieve encrypted information, and decrypting the encrypted information using key information stored in a memory of the MR headset, where the decrypted information includes an identifier and a password for the wireless access point.

[0029] In some embodiments, the rendered content includes user interface elements that indicate sensor values ​​included in the sensor data acquired by the MR control system. In some embodiments, the method further includes receiving, by the MR headset, user input indicating that the user interface elements are to be fixed in spatial coordinates with respect to the semiconductor manufacturing tool, identifying a group of spatial coordinates within a coordinate system fixed with respect to the semiconductor manufacturing tool, the group of spatial coordinates indicating a boundary of the user interface elements with respect to the fixed spatial coordinates, identifying a physical position and orientation of the MR headset with respect to the coordinate system, and modifying the presentation of the user interface elements based on the physical position and orientation of the MR headset with respect to the fixed spatial coordinates.

[0030] In some embodiments, the method further includes identifying a physical location and orientation of the MR headset, and the content is rendered based on the physical location and orientation of the MR headset. In some embodiments, the physical location and orientation of the MR headset is identified with respect to the semiconductor manufacturing tool.

[0031] In some embodiments, the operational information includes a position of one or more internal elements of the semiconductor manufacturing tool, and the rendered content includes a three-dimensional representation of a position of the one or more internal elements of the semiconductor manufacturing tool over time, the three-dimensional representation of the position of the one or more internal elements of the semiconductor manufacturing tool being rendered based on a physical position and orientation of the MR headset relative to the semiconductor manufacturing tool. In some embodiments, the method further includes transmitting, by the MR control system, three-dimensional model information associated with the semiconductor manufacturing tool as part of the operational information, and receiving, by the MR headset, the three-dimensional model information, the three-dimensional representation of the position of the one or more internal elements being rendered based on the three-dimensional model information relative to the semiconductor manufacturing tool. In some embodiments, the one or more internal elements include at least one of a wafer support, a showerhead, one or more lift pins, one or more wafers, one or more slit valves, a robotic arm, an indexer, or a carousel.

[0032] In some embodiments, the method further includes receiving, by the MR headset, one or more input signals associated with operation instructions for the semiconductor manufacturing tool; transmitting the operation instructions to the MR control system in response to receiving the one or more input signals; receiving, by the MR control system, the operation instructions from the MR headset; and transmitting, by the MR control system, commands to alter a state of the semiconductor manufacturing tool or a digital twin representing the semiconductor manufacturing tool via a communications interface configured to be communicatively coupled to the semiconductor manufacturing tool.

[0033] In some embodiments, the sensor data includes virtual sensor data generated by the digital twin, and instructions stored in a memory of the MR control system cause one or more processors of the MR control system to receive the virtual sensor data from the digital twin. In some embodiments, the method further includes transmitting, by the MR control system, three-dimensional model information associated with the semiconductor manufacturing tool to the MR headset, and causing, by the MR headset, to render content based on an orientation of the MR headset and the three-dimensional model information, where the rendered content includes content indicative of a state of the digital twin. In some embodiments, the method further includes identifying an updated orientation of the MR headset, and updating the rendered content based on the updated orientation of the MR headset.

[0034] In some embodiments, the method further includes receiving, by the MR headset, input indicating second operation information associated with the semiconductor manufacturing tool, the second operation information being at least partially different from the operation information; sending, by the MR headset, a request for the second operation information to the MR control system; receiving, by the MR control system, the request for the second operation information; sending, by the MR control system, the second operation information to the MR headset in response to receiving the request; and rendering, by the MR headset, second content associated with the second operation information in response to receiving the second operation information from the MR control system.

[0035] According to some embodiments, one or more non-transitory computer-readable media are provided that include instructions that, when executed by one or more processors, cause the one or more processors to perform a method for controlling a semiconductor manufacturing tool via an MR session. In some embodiments, the method includes establishing, by the MR headset, a wireless communication channel with an MR control system, obtaining, by the MR control system, sensor data representative of sensor output from the semiconductor manufacturing tool, determining, by the MR control system, operational information associated with the semiconductor manufacturing tool and based at least in part on the sensor data, transmitting, in response to the wireless communication channel established by the MR control system and with the MR headset, the operational information associated with the semiconductor manufacturing tool to the MR headset via the communication channel, receiving, by the MR headset, the operational information associated with the semiconductor manufacturing tool from the MR control system, and rendering, by the MR headset, content associated with the operational information and the one or more control features in the MR environment.

[0036] In some embodiments, the method further includes identifying, by the MR headset, a wireless access point associated with the MR control system and a password associated with the wireless access point, and connecting to the wireless access point using the password. In some embodiments, the method further includes acquiring image data via a camera associated with the MR headset, identifying a machine-readable code in the image data, decoding the machine-readable code to retrieve encrypted information, and decrypting the encrypted information using key information stored in a memory of the MR headset, where the decrypted information includes an identifier and a password for the wireless access point.

[0037] In some embodiments, the rendered content includes user interface elements that indicate sensor values ​​included in the sensor data acquired by the MR control system. In some embodiments, the method further includes receiving, by the MR headset, user input indicating that the user interface elements are to be fixed in spatial coordinates with respect to the semiconductor manufacturing tool, identifying a group of spatial coordinates within a coordinate system fixed with respect to the semiconductor manufacturing tool, the group of spatial coordinates indicating a boundary of the user interface elements with respect to the fixed spatial coordinates, identifying a physical position and orientation of the MR headset with respect to the coordinate system, and modifying the presentation of the user interface elements based on the physical position and orientation of the MR headset with respect to the fixed spatial coordinates.

[0038] In some embodiments, the method further includes identifying a physical location and orientation of the MR headset, and the content is rendered based on the physical location and orientation of the MR headset. In some embodiments, the physical location and orientation of the MR headset is identified with respect to the semiconductor manufacturing tool.

[0039] In some embodiments, the operational information includes a position of one or more internal elements of the semiconductor manufacturing tool, and the rendered content includes a three-dimensional representation of a position of the one or more internal elements of the semiconductor manufacturing tool over time, the three-dimensional representation of the position of the one or more internal elements of the semiconductor manufacturing tool being rendered based on a physical position and orientation of the MR headset relative to the semiconductor manufacturing tool. In some embodiments, the method further includes transmitting, by the MR control system, three-dimensional model information associated with the semiconductor manufacturing tool as part of the operational information, and receiving, by the MR headset, the three-dimensional model information, the three-dimensional representation of the position of the one or more internal elements being rendered based on the three-dimensional model information relative to the semiconductor manufacturing tool. In some embodiments, the one or more internal elements include at least one of a wafer support, a showerhead, one or more lift pins, one or more wafers, one or more slit valves, a robotic arm, an indexer, or a carousel.

[0040] In some embodiments, the method further includes receiving, by the MR headset, one or more input signals associated with operation instructions for the semiconductor manufacturing tool; transmitting the operation instructions to the MR control system in response to receiving the one or more input signals; receiving, by the MR control system, the operation instructions from the MR headset; and transmitting, by the MR control system, commands to alter a state of the semiconductor manufacturing tool or a digital twin representing the semiconductor manufacturing tool via a communications interface configured to be communicatively coupled to the semiconductor manufacturing tool.

[0041] In some embodiments, the sensor data includes virtual sensor data generated by the digital twin, and instructions stored in a memory of the MR control system cause one or more processors of the MR control system to receive the virtual sensor data from the digital twin. In some embodiments, the method further includes transmitting, by the MR control system, three-dimensional model information associated with the semiconductor manufacturing tool to the MR headset, and causing, by the MR headset, to render content based on an orientation of the MR headset and the three-dimensional model information, where the rendered content includes content indicative of a state of the digital twin. In some embodiments, the method further includes identifying an updated orientation of the MR headset, and updating the rendered content based on the updated orientation of the MR headset.

[0042] In some embodiments, the method further includes receiving, by the MR headset, input indicating second operation information associated with the semiconductor manufacturing tool, the second operation information being at least partially different from the operation information; sending, by the MR headset, a request for the second operation information to the MR control system; receiving, by the MR control system, the request for the second operation information; sending, by the MR control system, the second operation information to the MR headset in response to receiving the request; and rendering, by the MR headset, second content associated with the second operation information in response to receiving the second operation information from the MR control system. [Brief description of the drawings]

[0043] [Figure 1A] FIG. 1A is a schematic top view of components of a semiconductor manufacturing tool, according to some embodiments. [Figure 1B] FIG. 1B is a schematic perspective view of components of a semiconductor manufacturing tool, according to some embodiments.

[0044] [Diagram 2]FIG. 2 is an exemplary schematic diagram of an MR control platform for controlling a semiconductor manufacturing tool using an MR rendering device, such as an MR headset, in accordance with some embodiments.

[0045] [Figure 3A] FIG. 3A is a flow chart illustrating an example process for establishing a communication channel between a MR headset and an MR control system. [Figure 3B] FIG. 3B is a flow chart illustrating an exemplary process for establishing a communication channel between a MR headset and an MR control system.

[0046] [Figure 4] FIG. 4 is an information flow diagram for controlling a semiconductor manufacturing tool, according to some embodiments.

[0047] [Figure 5A] FIG. 5A is a flow chart illustrating an example process for rendering user interface elements indicative of operational information of a semiconductor manufacturing tool via a MR headset, according to some embodiments. [Figure 5B] FIG. 5B is a flowchart illustrating an example process for rendering user interface elements indicative of operational information of a semiconductor manufacturing tool via a MR headset, according to some embodiments.

[0048] [Figure 6A] FIG. 6A is an exemplary view from the perspective of an MR headset associated with one or more steps of the process shown in FIGS. 5A and 5B, according to some embodiments. [Figure 6B] FIG. 6B is an exemplary view from the perspective of an MR headset associated with one or more steps of the process shown in FIGS. 5A and 5B, according to some embodiments. [Figure 6C]FIG. 6C is an exemplary view from the perspective of an MR headset associated with one or more steps of the process shown in FIGS. 5A and 5B, according to some embodiments. [Figure 6D] FIG. 6D is an exemplary view from the perspective of an MR headset associated with one or more steps of the process shown in FIGS. 5A and 5B, according to some embodiments. [Figure 6E] FIG. 6E is an exemplary view from the perspective of an MR headset associated with one or more steps of the process shown in FIGS. 5A and 5B, according to some embodiments.

[0049] [Figure 7] FIG. 7 illustrates an example of a configuration interface for configuring information rendered by a MR headset, according to some embodiments.

[0050] [Figure 8A] FIG. 8A is a flow chart illustrating an exemplary process for rendering a representation of an internal element / component of a semiconductor manufacturing tool via an MR headset, according to some embodiments. [Figure 8B] FIG. 8B is a flow chart illustrating an exemplary process for rendering a representation of an internal element / component of a semiconductor manufacturing tool via an MR headset, according to some embodiments.

[0051] [Figure 9A] FIG. 9A illustrates a process chamber in an exemplary view, according to some embodiments.

[0052] [Figure 9B] FIG. 9B is an exemplary view of a 3D image of an internal element / component rendered in an AR, VR, or MR environment, according to some embodiments.

[0053] [Figure 10]FIG. 10 is a schematic diagram of an example system for rendering semiconductor manufacturing tool operational information from a digital twin of a semiconductor manufacturing tool, in accordance with some embodiments.

[0054] [Figure 11A] FIG. 11A is a flowchart illustrating an example process for rendering content associated with a digital twin of a semiconductor manufacturing tool, according to some embodiments. [Figure 11B] FIG. 11B is a flowchart illustrating an example process for rendering content associated with a digital twin of a semiconductor manufacturing tool, according to some embodiments.

[0055] [Figure 12] FIG. 12 illustrates an example computer system that may be used to implement certain embodiments described herein. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0056] overview A system, method, and non-transitory computer-readable medium for controlling a semiconductor manufacturing tool in a MR environment are provided.

[0057] Semiconductor manufacturing equipment can be very complex and can also be physically large and / or include opaque walls, which can make it difficult to determine the status of the equipment from a visual inspection. Status information associated with the operation of the semiconductor manufacturing equipment (e.g., current operational status, current sensor values, etc.) may typically be presented on a display screen, such as a display screen mounted on the semiconductor manufacturing equipment. However, due to the size of the semiconductor manufacturing equipment, it may be difficult for an operator (e.g., a process engineer, equipment maintenance personnel, etc.) to view / access such a display screen while viewing and interacting with various portions of the semiconductor manufacturing equipment that are not in close proximity to the display screen. For example, if a display screen is mounted on the front of the semiconductor manufacturing equipment, when the operator moves to the rear of the tool to perform maintenance, the display screen is no longer visible to the operator.

[0058] According to some embodiments of the present disclosure, a mixed reality (MR) rendering device, such as an MR headset, may be used to render information associated with a semiconductor manufacturing tool and enable an operator to control such a tool. A semiconductor manufacturing tool may be large in size or dimensions and include multiple components. Some of the semiconductor manufacturing tools may have opaque walls. For example, a semiconductor manufacturing tool may include one or more process chambers in which wafers undergo processing. Thus, it may be difficult to determine operational information associated with the semiconductor manufacturing tool, such as the positions of various internal elements of the semiconductor manufacturing tool, current sensor data associated with sensor outputs of the semiconductor manufacturing tool, etc. By rendering such operational information and device control user interfaces in an MR environment, the MR headset enables an operator (e.g., a process engineer, technician, or other user) to conveniently view the operational information and control the semiconductor manufacturing tool.

[0059] For example, in some embodiments, operational information, such as an indication of current sensor values, may be displayed in the MR environment, allowing an operator wearing the MR headset to view current sensor values, interact with a control system for the semiconductor manufacturing tool, etc., while inspecting the semiconductor manufacturing tool from different sides. As another example, in some embodiments, a three-dimensional representation of internal elements of the semiconductor manufacturing tool may be rendered by the MR headset based on the position or orientation of the MR headset relative to the semiconductor manufacturing tool, thereby allowing the operator to see inside the semiconductor manufacturing tool. By rendering operational information in the MR environment, the systems, methods, and computer products described herein may improve the operation of the semiconductor manufacturing tool by reducing repair times, reducing tool downtime, improving access to sensor data, etc.

[0060] Displaying equipment information and enabling system control in a mobile MR environment provides technical advantages and solutions that cannot be achieved with conventional semiconductor control platforms. Conventional semiconductor manufacturing tool control platforms are often linked to only one tool, and the control platform is displayed on a single monitor attached to the tool, or in some cases, transmitted to a remote display such as a service tablet. The amount of information and control that can be displayed at any given time is often limited to the screen size and resolution. This means that if an operator is accessing the tool through a conventional control platform, the operator can only evaluate a subset of the information and control functions per screen. This limitation makes comprehensive tool diagnostics very difficult and inefficient. An operator inspecting multiple components within a tool must continually navigate in and out of multiple function tabs while remembering the data in each tab. Furthermore, even when information is transmitted to a remote display, the information is not location specific. For example, an operator standing behind a tool would be viewing a control panel for the entire system, not a control panel related to the component in front of him. Furthermore, the graphical user interface (GUI) of conventional control platforms is not programmed to allow for situation-based user customization. That is, operators often cannot customize the on-screen display to display only information and controls related to a set of sub-components that they deem relevant. Moreover, even if some customization is permitted, such features are limited by the display interface; that is, only a set of GUI elements can be modified at a designated screen location. Furthermore, traditional control platforms lack the ability to render and animate internal components in three-dimensional (3D) graphics, which would help operators visualize system problems in a holistic manner by considering the activity of adjacent components along with information associated with the component of interest.

[0061] The embodiments of the present disclosure improve the control platform of semiconductor manufacturing tools by introducing a fully customizable control mechanism to provide unlimited display and control environments and allow the operator to create a context-based control GUI. Furthermore, the embodiments of the present disclosure allow one device (e.g., an MR headset) to simultaneously view and control multiple tool sub-components. The embodiments of the present disclosure also allow access to component-specific information and controls from different sides of the tool. For example, when a user is looking at a process chamber, the embodiments of the present disclosure display all relevant tool information and controls associated with that process chamber. These are just a few examples. Other advantages and technical improvements are further described in various embodiments of the present disclosure.

[0062] FIG. 1A illustrates a schematic diagram of a top view of components of an exemplary semiconductor manufacturing tool 100, according to some embodiments.

[0063] Semiconductor manufacturing tool 100 includes a load port 104. Load port 104 is a platform or receptacle that receives a Front Opening Unified Pod (FOUP), such as FOUP 102. A FOUP can accommodate wafers (e.g., 20 wafers, 25 wafers, 30 wafers, etc.). The wafers may be arranged in a stack within the FOUP. In some embodiments, each wafer within the FOUP may be placed on a separate shelf that extends inwardly from the walls of the FOUP. The FOUP may be a plastic container (e.g., an injection molded plastic container, etc.).

[0064] Each FOUP may have a door or other opening that mounts to an equipment front-end module (EFEM) 106. The EFEM 106 may have a corresponding door that allows a wafer to be passed from the FOUP to the EFEM 106. The FOUPs may dock to the EFEM 106 via the load port 104. The EFEM 106 may include one or more wafer handling robots. In some embodiments, the EFEM 106 may be an enclosed volume such that the internal elements of the EFEM 106 (e.g., the one or more wafer handling robots) are not visible from outside the EFEM 106.

[0065] The semiconductor manufacturing tool 100 includes a load lock 108 (e.g., an air lock) for transferring wafers out of a vacuum transfer module (VTM) 110. The vacuum transfer module 110 may be a large chamber connected to one or more process chambers (e.g., process chamber 112). The vacuum transfer module 110 may also be connected to the load lock 108 and a buffer station 114. The vacuum transfer module 110 may be held at a subatmospheric pressure, i.e., a vacuum, such that the process chambers 112 may also be held at a subatmospheric pressure, allowing wafers to be passed therebetween through the vacuum transfer module without having to increase or decrease the pressure in the process chambers 112.

[0066] As shown in FIG. 1, semiconductor manufacturing tool 100 includes ten process chambers in process chamber 112 arranged in a rectangular shape. However, it should be noted that the number of process chambers and the arrangement of the process chambers in FIG. 1 are shown merely as examples, and semiconductor manufacturing tool 100 may include a greater or lesser number of process chambers, which may be arranged in various configurations (e.g., square, hexagonal, etc.). In some embodiments, processing chamber 112 may include an inductively coupled plasma (ICP) chamber or a conductively coupled plasma (CCP) chamber. Processing chamber 112 may perform, for example, a conductive etch process or a dielectric etch process.

[0067] Although not shown in FIG. 1, various components or elements may be located below or near each process chamber, such as pumps, vacuum lines, exhaust lines, vertical lift actuators for moving the pedestal up and down within the process chambers, etc.

[0068] The buffer station 114 is a temporary storage space for wafers within the vacuum transfer module 110. For example, wafers may be stored in the buffer station 114 during transfer to a different one of the process chambers 112. In some embodiments, the buffer station 114 may have heating and / or cooling capabilities.

[0069] In some embodiments, the semiconductor manufacturing tool 100 includes a control station 116 for controlling the state of the semiconductor manufacturing tool 100, initiating or altering processes performed by the semiconductor manufacturing tool 100, etc. The control station 116 may include a controller 130, a hardware interface 132, a user interface 134, and / or a memory 136. In some embodiments, the controller 130 may send commands to the semiconductor manufacturing tool 100 via the hardware interface 132. In some embodiments, commands may be received by the controller 130 via the user interface 134. In some embodiments, the controller 130 is a general-purpose computer / processor. In some embodiments, the controller 130 is a dedicated computer / processor configured to interact with or direct a specific set of sensors and programs within the semiconductor manufacturing tool 100. In some embodiments, the control station 116 is capable of interfacing with an MR control system, as described herein.

[0070] FIG. 1B illustrates a perspective schematic view of components of semiconductor manufacturing tool 100, according to some embodiments.

[0071] As shown, the semiconductor manufacturing tool 100 includes a gas box 152. The gas box 152 may include various components such as valves, piping, mass flow controllers, etc. for delivering process gases to the process chamber 112. The gas box 152 may further include a radio frequency generator and / or a remote plasma generator.

[0072] The semiconductor manufacturing tool 100 includes a lift box 154. The lift box 154 can be used to raise and / or lower the gas box 152, for example, to move the gas box 152 closer to and / or away from the process chamber 112.

[0073] Various sensors associated with the semiconductor manufacturing tool (e.g., temperature sensors, pressure sensors, position sensors, motion sensors, etc.) may be used to collect sensor data 156 associated with the semiconductor manufacturing tool. The sensor data 156 may include time series data collected at any suitable frequency. The sensor data 156 may include a collection of data from multiple types of sensors and sensors mounted at multiple locations or positions on the semiconductor manufacturing tool 100.

[0074] FIG. 2 illustrates an exemplary schematic diagram of an MR control platform for controlling a semiconductor manufacturing tool using an MR rendering device, such as an MR headset, in accordance with some embodiments.

[0075] As shown, the MR control system 202 is in communication with the semiconductor manufacturing tool 204. The communication between the MR control system 202 and the semiconductor manufacturing tool 204 may use a Transmission Control Protocol (TCP) based protocol, an Internet Protocol (IP) based protocol, or the like. The communication may be wired or wireless. In some embodiments, the MR control system communicates directly with a control system of the semiconductor manufacturing tool, such as the controller 130 shown in FIG. 1A. In some embodiments, the MR control system communicates directly with various components within the semiconductor manufacturing tool via a hardware interface, such as the hardware interface 132 shown in FIG. 1A.

[0076] The MR control system 202 can be configured to execute semiconductor tool control software that provides instructions to the semiconductor manufacturing tool 204 that cause the semiconductor manufacturing tool 204 to perform various operations. For example, with reference to FIG. 1A , the MR control system 202 can send instructions to the controller 130 of the semiconductor manufacturing tool 100. These operations can include initiating a particular fabrication process or operation, setting or modifying various settings, moving certain movable components (e.g., a robotic arm, showerhead, indexer, carousel, pedestal, etc.), moving wafers, etc. In some embodiments, the MR control system 202 can receive operational information from the semiconductor manufacturing tool 204. For example, the MR control system 202 can receive information indicative of sensor values ​​of one or more sensors associated with the semiconductor manufacturing tool 204, status or position information associated with various components of the semiconductor manufacturing tool 204, etc.

[0077] The MR control system 202 communicates with the MR headset 206. In some embodiments, the MR control system 202 is configured to transmit operational information to the MR headset 206 over an established wireless communication channel.

[0078] In some embodiments, the MR headset 206 can send messages / commands to the MR control system 202. For example, in some embodiments, the MR headset 206 can send messages including operation instructions that are sent to the semiconductor manufacturing tool 204 via the MR control system 202. The structure of the MR headset 206 is not limited to head-mounted gear. The MR headset 206 may be MR projection glasses or a wearable MR projection device that can cast / project an image onto a display surface at a certain distance from the operator.

[0079] In some embodiments, one or more three-dimensional (3D) models 208 of the semiconductor manufacturing tool 204 are used to render the content, which is then displayed using the MR headset 206. In some embodiments, the three-dimensional model 208 may include three-dimensional modeling information of various components or internal elements of the semiconductor manufacturing tool 204. The 3D modeling information may include, but is not limited to, spatial coordinates, spatial relationships, object modeling geometry (i.e., polygons and their vertices), shaders, object-specific rendering algorithms, clipping, and texture filters. Exemplary components or internal elements may include a robot arm (including its subassemblies), lift pins, slit valves, showerheads, wafer supports (e.g., pedestals, chucks, etc.), indexers, carousels, exterior walls of a process chamber, etc. In addition, the three-dimensional model 208 may include three-dimensional modeling information associated with a wafer being processed, e.g., a model of the wafer. In some embodiments, the three-dimensional model 208 may be formatted based on computer-aided design (CAD) information (e.g., as an OBJ format file, as an FBX format file, etc.) and / or in other similar formats.

[0080] In some embodiments, the three-dimensional models 208 may be stored in a memory of the MR headset 206 and / or in a memory of the MR control system 202. Additionally or alternatively, in some embodiments, the three-dimensional models 208 may be stored in a server 210, which is configured to provide one or more of the three-dimensional models 208 to the MR headset 206 and / or the MR control system 202 in response to a request. In some cases, it may be desirable to store 3D model information for a particular tool in the MR control system 202, so that any MR headset can directly obtain the 3D modeling information upon connection with the MR control system 202. In some embodiments, the 3D model 208 is capable of rendering an object in either two dimensions (2D) or 3D, depending on the type of object. For example, the 3D model 208 may render the physical features of an internal component in 3D while rendering graphical user interface (GUI) elements and numerical data in 2D. Both the 2D and 3D renderings may be displayed on a single screen.

[0081] Semiconductor manufacturing tool operation information rendered in an MR environment can be used for a variety of purposes.

[0082] For example, as shown and described below in connection with FIGS. 5A, 5B, and 6A-6E, user interface elements indicative of sensor data, operational states, etc. of a physical semiconductor manufacturing tool may be rendered in an MR environment, such that the physical environment (which may include at least a portion of the physical semiconductor manufacturing tool) is visible even during the presentation of the user interface elements. Such rendering may also be referred to as augmented reality rendering, or AR, where virtually rendered objects may graphically overlay or annotate a projection of the physical environment. In some embodiments, the visibility of graphical user interface (GUI) elements may be configured or modified. For example, a user interface element may be configured such that the user interface element remains visible in the MR environment as the wearer of the MR headset moves around the physical environment by configuring the user interface element to be fixed to a position in the field of view of the MR headset. As another example, a user interface element may be configured such that the position of the user interface element is fixed in a predetermined position with respect to the physical environment, such that the user interface element or a portion of the user interface element becomes invisible as the field of view (FOV) changes. For example, an operator may "anchor" a GUI element in the MR environment to a component behind the tool. Such GUI elements disappear from the operator's FOV when the operator moves away from the back side of the tool (e.g., moves in front of the tool), but when the operator moves back again, the operator can see the fixed GUI elements again.

[0083] As another example, as shown and described below in connection with FIGS. 8A, 8B, 9A, and 9B, 3D images representing the internal elements of a semiconductor manufacturing tool can be rendered in an MR environment. Thus, the MR headset may render a view that overlays the 3D images of those components such that the locations of the 3D representations of those components appear to be located in the same real-world locations as their corresponding physical counterparts are located, even if the physical counterparts are not visible (e.g., because they are in a sealed chamber). Such a presentation would, in effect, enable the wearer of the MR headset to see inside the semiconductor manufacturing tool without physically opening it. The ability to render objects in a semiconductor manufacturing process, such as the location of a robot arm in the semiconductor manufacturing tool, the location of a wafer being fabricated in the semiconductor manufacturing tool, and the location of a showerhead in a process chamber, would help engineers perform more comprehensive diagnostics because the data is no longer isolated. Rather, they are displayed as a whole, including their interactions with adjacent components.

[0084] MR environment A mixed reality (MR) environment may generally refer to a visualization space in which digital objects and / or digital visualizations are presented or rendered. It should be understood that an MR environment, as used herein, generally encompasses both an augmented reality (AR) environment and a virtual reality (VR) environment. In an AR environment, digital objects and / or digital visualizations may be presented to appear overlaid on a projection or view of an actual physical environment. In contrast, in a VR environment, digital objects and / or digital visualizations may be presented within a completely virtual environment.

[0085] In some embodiments, the MR environment is realized through the use of an MR headset. Examples of commercially available MR headsets include, but are not limited to, MICROSOFT HOLOLENS, SAMSUNG HMD ODYSSEY, MAGIC LEAP ONE, OCULUS RIFT, HTC VIVE, and VALVE INDEX. However, it should be understood that embodiments of the present disclosure can be implemented on any suitable MR rendering device that can interact and / or communicate with a semiconductor manufacturing tool.

[0086] An MR headset may have various cameras and / or sensors configured to provide information useful for rendering an MR environment. For example, various cameras may be used to obtain images of different angles or fields of view (FOVs), which may be used to determine the orientation of the headset wearer relative to other objects in the physical space. As another example, various sensors (e.g., accelerometers, gyroscopes, proximity sensors, etc.) may be used to determine the position of the headset wearer's head, the location of the wearer relative to another object or fixed reference frame, the current movement of the headset wearer, etc. It should be understood that any suitable conventional technique for identifying position and / or orientation information may be used in conjunction with the techniques described herein. Additionally, suitable application programming interfaces (APIs) for modifying the position of digital objects rendered by the MR headset based on the position and / or orientation of the MR headset may be used in conjunction with the techniques described herein. For example, a particular headset-specific API for solving the location of the headset (e.g., Location Solver API), a particular headset-specific API for determining the direction of headset movement (e.g., Directional Solver API), and a particular headset-specific API for capturing objects around the headset (e.g., Spatial Awareness Mesh API) may be integrated.

[0087] The MR headset can present user interface elements or other content described herein as "selectable." When rendered in the MR environment, such graphical user interface (GUI) elements or other content can be selected by the user by pointing, tapping, moving, etc., a virtual object in the MR environment where the selectable element or content is presented. In some embodiments, the user can interact with the GUI elements via a handheld controller associated with the MR headset, eye-tracking capabilities (e.g., the user's gaze may be tracked by one or more cameras, and if the user's attention is directed to the location of a user interface element for a predetermined period of time, the MR headset can determine that the user has selected that user interface element), or voice commands.

[0088] Referring back to FIG. 2 , at a high level, after the MR headset 206 establishes a connection with the semiconductor manufacturing tool 204 via the MR control system 202, the MR headset 206 renders a GUI for controlling and displaying information associated with the semiconductor tool 204. During operation, an operator can view various information associated with the semiconductor manufacturing tool via the MR headset 206 and issue commands to control various internal components such as a robot arm or a gas box. In some embodiments, location-specific information can be displayed automatically, and the operator can modify and configure the GUI without being limited to a single screen. In some embodiments, the MR control system 202 is integrated within the semiconductor manufacturing tool 204 and serves as one of the functions of the tool controller. In some embodiments, the MR control system 202 is external to the tool's controller and communicates with the tool's controller via a wired connection or wirelessly. The MR headset 206 can be connected to the MR control system 202 (or directly to the tool's controller) via a wired connection or wirelessly.

[0089] Establishing a communication channel between the MR headset and the MR control system Before an MR headset can be used to receive operational information from or provide operational instructions to a semiconductor manufacturing tool, the MR headset must first establish a communication channel with the semiconductor manufacturing tool. There may be many ways in which such a communication channel may be established, and the present disclosure is not limited to any particular such technique.

[0090] According to some embodiments, once a communication channel is established, messages / commands can be sent between the MR headset and the MR control system over the communication channel. For example, such messages can include operational information sent from the MR control system to the MR headset. As another example, such messages can include messages sent from the MR headset to the MR control system that correspond to operational instructions sent from the MR control system to a physical semiconductor manufacturing tool or a digital twin. In general, the digital twins described herein are virtual replicas of a physical semiconductor manufacturing tool with similar controls and programs.

[0091] In some embodiments, the MR control system may have a wireless communication interface (e.g., WiFi, BLUETOOTH, etc.). In some embodiments, to operate in conjunction with the MR control system, the MR headset may require a connection to a wireless access point that is used by the MR control system to provide the wireless network provided by the MR control system. In some embodiments, the MR control system does not broadcast the access point information, e.g., to prevent devices that receive the broadcast access point information from attempting to connect to the access point. In some embodiments, the MR control system encrypts the access point information, and the encrypted information can be retrieved, decrypted, and used by the MR headset to connect to the access point.

[0092] For example, in some embodiments, the encrypted access point information may be encoded in a machine-readable code. The MR headset may obtain the access point information by decoding the machine-readable code and decrypting the encrypted information. In other words, in some embodiments, the MR headset may store a decryption key that is used to decrypt the encrypted information embedded in the machine-readable code. By encrypting the access point information in the machine-readable code and storing the decryption key in the MR headset, attempts to authenticate to the access point of devices other than the MR headset that scan the machine-readable code may be prevented.

[0093] The presentation of the machine-readable code can be either static or dynamic. Examples of machine-readable codes include, but are not limited to, Quick Response (QR) codes, MAXICODE codes, DATA MATRIX codes, Code 128 codes, etc.

[0094] 3A illustrates an example of a process 300 for establishing a communication channel between an MR headset and an MR control system. In some embodiments, the blocks of process 300 may be performed by the MR headset. Note that in some embodiments, the blocks of process 300 illustrated in FIG. 3A may be performed in various orders, or in the case of two or more blocks, simultaneously. Additionally, in some embodiments, one or more blocks of process 300 may be omitted.

[0095] At 302, the MR headset receives a command to initiate communication with the MR control system. The command can be received in any suitable manner. For example, the command may correspond to the selection or interaction of a user interface element, e.g., a "connect" button control or menu item rendered by the MR headset, detection of a particular spoken comment (e.g., "connect") via the microphone of the MR headset, detection of a particular gesture by the wearer of the MR headset, image scanning via a camera of the MR headset, etc. As another example, in some embodiments, the command may correspond to the capture of a particular machine-readable code. In some embodiments, the particular machine-readable code may be affixed to or displayed by a semiconductor manufacturing tool or device in communication with the MR control system. In yet another example, the command may correspond to the receipt of a physical input by a button, switch, toggle, or other physical input device communicatively coupled to the MR headset or a portion thereof.

[0096] At 304, the MR headset acquires image data using a camera of the MR headset. For example, the camera of the MR headset may be configured to capture image data in response to receiving an instruction that image data be captured. Such an instruction may be transmitted in response to receiving an explicit user input and / or in response to the MR headset determining that a machine-readable code is within the field of view of the camera.

[0097] At 306, the MR headset identifies a machine-readable code in the image data acquired at 304. For example, the MR headset can process the image data and identify one or more regions of the image that include a machine-readable code. As another example, the MR headset can identify a portion of the image data (e.g., a finder pattern in the image data, an alignment pattern in the image data, etc.) that serves as a fiducial or fiducial mark to facilitate determining the orientation, location, and / or distance of the machine-readable code relative to the camera of the MR headset, as well as decoding the machine-readable code. In some embodiments, location information of a particular machine-readable tag (printed or rendered machine-readable code such as a QR code) is embedded within the machine-readable code. That is, upon scanning the machine-readable code, the scanning device (e.g., the MR headset) can determine its location and orientation with respect to the semiconductor manufacturing tool. In some embodiments, the MR headset uses the tag location information to determine its approximate location around the semiconductor manufacturing tool and adjusts the orientation of the field of view using its camera.

[0098] At 308, the MR headset decodes the machine-readable code and retrieves the encrypted communication information. For example, the MR headset can determine the encoding format associated with the machine-readable code, for example, by identifying a portion of the image data that indicates the encoding format (e.g., by identifying a mode indicator that indicates a data type of the data in the machine-readable code). Continuing with this example, the MR headset can then decode the machine-readable code based on the encoding format. The encoding format may indicate whether the information encoded in the machine-readable code includes alphanumeric characters, numbers, Chinese characters, etc. In some embodiments, the MR headset can retrieve the encrypted communication information by generating a series of characters that correspond to the encrypted communication information based on the encoding format. For example, if the encoding format indicates that the data type includes alphanumeric characters, the series of characters may be a series of alphanumeric characters.

[0099] At 310, the MR headset decrypts the encrypted communication information to obtain decrypted communication information. The decrypted communication information may include access point information. For example, the access point information may include wireless (e.g., WiFi, BLUETOOH, etc.) network information such as a service set identifier (SSID), a wireless network password, etc.

[0100] In some embodiments, the MR headset can decrypt the encrypted communication information using a decryption key stored in the memory of the MR headset. In some embodiments, such a decryption key can be stored in the memory of the MR headset during configuration of the MR headset. For example, a set of decryption keys can be downloaded or activated when an operator logs into a verified account via the MR headset.

[0101] In some embodiments, the algorithm used to encrypt and decrypt communication information may be a symmetric algorithm, such as the Data Encryption Standard (DES) algorithm, the Triple Data Encryption Standard (3DES), or the Advanced Encryption Standard (AES). In some embodiments, the algorithm used to encrypt and decrypt communication information may be an asymmetric algorithm, such as public key cryptography, Rivest-Shamir-Adleman (RSA) cryptography, etc. In some embodiments, different communications or messages may use one or more of the different encryption / decryption algorithms.

[0102] At 312, the MR headset connects to the access point using the decrypted communication information. For example, the MR headset can transmit a password to the access point in association with the network identifier to be authenticated. After connecting to the access point, the MR headset can communicate with the MR control system.

[0103] In some embodiments, at 314, the MR headset receives user authentication information corresponding to a user account, such as a username, password information, etc. In some embodiments, 314 occurs before other steps of process 300. In some embodiments, the user account may be a user account associated with a wearer of the MR headset to interact with the MR control system. For example, in some embodiments, the user account may be associated with one or more permission levels, and the permission levels may govern whether the user is permitted to perform various actions to interact with the MR control system or the semiconductor manufacturing tool. In some embodiments, such actions may include sending various operation instructions to the physical semiconductor manufacturing tool. In some embodiments, such operation instructions may include causing a component of the physical semiconductor manufacturing tool to change a position, starting an operation, changing the value of a set point or other parameter, etc. In some embodiments, the permission level associated with the user account may be used by the MR control system to block execution of operation instructions that are not permitted based on the permission level of the user account.

[0104] In some embodiments, permissions may be stored based on a user's role associated with a user account within an organization. Examples of such roles include "process engineer," "technician," and the like. For example, all users with a "process engineer" role specified in their user account may be provided with permissions to interact with the MR control system to enable them to adjust various parameters related to aspects of how a particular semiconductor manufacturing process is performed, but such users may not be provided with permissions to interact with the MR control system to enable them to initiate maintenance procedures, such as, for example, causing the MR control system to open a maintenance access door, initiate a calibration routine, etc. Conversely, a user with a "maintenance technician" role may be provided with permissions that enable them to perform maintenance-related tasks related to a semiconductor manufacturing tool, but do not enable them to modify parameters related to how a particular semiconductor process is performed using the tool.

[0105] In some embodiments, the user authentication information may include a username and / or user identification information (e.g., a password, a PIN, biometric information, etc.) that identifies or verifies the identity of a user associated with a user account.

[0106] In some embodiments, the indication of the username may be received via the MR headset. For example, in some embodiments, the MR headset may be configured to render a list of stored usernames (e.g., as a drop-down menu). An operator wearing the MR headset is able to select a username from the list of stored usernames. In some embodiments, the MR control system may send to the MR headset a list of stored usernames associated with a particular semiconductor manufacturing tool.

[0107] In some embodiments, the user identification information may be received via explicit user input via the MR headset. For example, a password or PIN may be received via a user interface rendered by the MR headset. Alternatively, in some embodiments, the user identification information may be captured automatically by the MR headset. For example, in some embodiments, biometric data, such as retinal image data, may be captured automatically by a camera in the MR headset.

[0108] It should be noted that in some embodiments, both the username and user identity may be used to authenticate a user to a user account. Alternatively, in some embodiments, the user identity may be used to both identify the username and authenticate the user, such as when biometric data is used as the user identity. For example, a retinal image may act similarly to a fingerprint to uniquely identify a user, such that a retinal image may serve as an indication of both a username and a user identity that may be used to authenticate the individual.

[0109] In some embodiments, at 316, the MR headset authenticates the user to the user account using the user authentication information. In some embodiments, 316 is performed after 314 but before one or more steps of process 300. For example, the MR headset can authenticate the user to the MR headset using the user authentication information and / or the user identification information. The user credentials can then be transmitted to the MR control system. As another example, in some embodiments, the MR headset can transmit the user authentication information to the MR control system, which can then authenticate the user by matching the received user authentication information with user authentication information stored by the MR control system.

[0110] Once a user is authenticated to a user account, the user may be permitted to perform actions and / or view content via the MR headset as indicated by the permissions associated with the user account. In some embodiments, a user may be able to control and view the status of multiple different semiconductor manufacturing tools via their user account. In some embodiments, the multiple different semiconductor manufacturing tools are of different types, such as different etch and deposition tools.

[0111] In some embodiments, blocks 314 and 316 may be omitted. For example, in some embodiments, a communication channel between the MR headset and the MR control system may be established without authenticating a user of the MR headset to a particular user account.

[0112] 3B illustrates an example of a process 350 for establishing a communication channel between an MR headset and an MR control system. The blocks of process 350 may be performed by the MR control system. Note that in some embodiments, the blocks of process 350 illustrated in FIG. 3B may be performed in various orders, and in the case of some blocks, may be performed simultaneously. Additionally, in some embodiments, one or more blocks of process 350 may be omitted.

[0113] At 352, the MR control system receives a request to provide the machine-readable code. The request may be received from the MR headset. For example, in some embodiments, the MR headset may send the request for the machine-readable code in response to a selectable button or input being selected on the MR headset, as described above in connection with block 302 of FIG. 3A.

[0114] At 354, the MR control system causes the machine-readable code to be presented, for example, on a display screen associated with the MR control system. As discussed above in connection with FIG. 3A, the machine-readable code may include information associated with an access point used by the MR control system to provide access to the wireless network provided by the MR control system. For example, the information may include encrypted communication information such as an identifier for the access point, a password associated with the access point, etc.

[0115] In some embodiments, the MR control system determines that the MR headset has connected to the access point at 356. For example, in some embodiments, the MR control system may determine that the MR headset has been authenticated to the access point using a password included in the information encoded in the machine-readable code. In some embodiments, block 356 may be omitted.

[0116] In some embodiments, at 358, the MR control system receives an indication from the MR headset that a user of the MR headset has been authenticated to a user account. In some embodiments, a user account can be associated with various permissions or access restrictions, as described above in connection with blocks 314 and 316 of FIG. 3A. In some embodiments, the MR control system is capable of receiving an indication of a particular user account. In some embodiments, the MR control system can determine the permissions or access restrictions associated with the user account.

[0117] Using a Mixed Reality (MR) Headset with an MR Control System After a communication channel between the MR headset and the MR control system for a particular semiconductor manufacturing tool is established, the MR headset can be used to interact with the MR control system of the semiconductor processing tool, for example, to render or display a user interface and / or operational data for the semiconductor processing tool.

[0118] 4 illustrates an example of an information flow diagram 400 for controlling a semiconductor tool in a MR environment, according to some embodiments. As shown, the blocks of information flow diagram 400 are performed by an MR headset and an MR control system. Note that in some embodiments, the blocks of information flow diagram 400 illustrated in FIG. 4 may be performed in various orders, and in the case of some blocks, may be performed simultaneously. Additionally, in some embodiments, one or more blocks of information flow diagram 400 may be omitted.

[0119] At 402, the MR headset establishes a communication channel with an MR control system configured to operate a semiconductor manufacturing tool. The MR control system can communicate with a physical semiconductor manufacturing tool, as described above in connection with FIG. 2. Additionally or alternatively, the MR control system can communicate with a digital twin of the physical semiconductor manufacturing tool, as described below in connection with FIG.

[0120] The communication channel can enable the MR headset to send and receive messages between the MR control system. Exemplary protocols that may be used in connection with the communication channel include MQ Telemetry Transport (MQTT), Hypertext Transfer Protocol (HTTP), etc. It should be noted that more detailed techniques for establishing such a communication channel are shown and described above in connection with Figures 3A and 3B.

[0121] In some embodiments, the MR headset determines the physical position and / or orientation of the MR headset at 404. Note that in some embodiments, block 404 may be omitted.

[0122] The physical position and / or orientation of the MR headset can be based on information obtained by the headset from one or more cameras in the MR headset and / or one or more sensors in the MR headset (e.g., accelerometers, gyroscopes, proximity sensors, etc.).

[0123] In some embodiments, the physical position and / or orientation may include a position and / or orientation relative to a reference frame that is fixed with respect to the physical environment. In some embodiments, the reference frame may be determined based on various fiducials or fiducial marks in the physical environment that may be detected, for example, by one or more cameras or sensors of the MR headset. Such fiducials or fiducial marks may correspond to various physical landmarks in the physical environment. Examples of physical landmarks include parts or features of a physical semiconductor manufacturing tool, machine-readable codes attached to parts of a physical semiconductor manufacturing tool, etc. In some such embodiments, the position and / or orientation relative to the physical landmarks may be determined based on image data captured using a camera of the MR headset that includes at least some of the physical landmarks.

[0124] In some embodiments, at 406, the MR headset requests operational information for the semiconductor manufacturing tool from the MR control system. In some embodiments, the MR headset can request the operational information based on user input received via the MR headset. In some embodiments, the MR headset can share its physical / orientation position determined at 404 with the MR control system. For example, as shown in connection with FIGS. 5A and 6A-6E and described below, the user input may correspond to a selection of one or more user interface elements rendered by the MR headset. As another example, as shown in connection with FIGS. 5A and 7 and described below, the user input may correspond to capturing (e.g., via a camera of the MR headset) image data associated with a machine-readable code that has been pre-associated with a particular set of operational information.

[0125] Note that in some embodiments, block 406 may be omitted, for example, if the MR control system automatically transmits certain operation information (e.g., without responding to a request from the MR headset), block 406 may be omitted.

[0126] At 408, the MR control system acquires sensor data representing sensor outputs from the semiconductor manufacturing tool. The sensor data may include sensor data from temperature sensors, pressure sensors, position sensors (e.g., encoders, etc.), motion sensors (e.g., accelerometers, etc.), or any other type of sensor associated with the semiconductor manufacturing tool. The sensor data may include multiple sensor values ​​acquired over a range of time points. The sensor data may include sensor outputs from multiple sensors that may be of different types and / or associated with different components or elements of the semiconductor manufacturing tool.

[0127] At 410, the MR control system transmits the motion information obtained at 408 to the MR headset.

[0128] In some embodiments, the operational information may be based at least in part on sensor data representing sensor output from the semiconductor manufacturing tool. For example, in some embodiments, the operational information may be the sensor data acquired in block 408, or a portion of the sensor data acquired in block 408. As another example, in some embodiments, the operational information may include a state of one or more components of the semiconductor manufacturing tool determined based on the sensor data. For example, the operational information may include an indication of the state of a particular component (e.g., whether a valve is open or closed, the current position of a robot arm, the current speed at which the robot arm is moving, the current gas flow rate, the current pressure in a module, temperature information, etc.), etc. As yet another example, in some embodiments, the operational information may include the state of one or more wafers being fabricated, such as whether a wafer is in a particular process chamber, whether a wafer is clamped to or unclamped from an electrostatic chuck, etc.

[0129] In some embodiments, the operational information may include an indication of a current status of the semiconductor manufacturing tool or one or more components of the semiconductor manufacturing tool. For example, the operational information may indicate a current process or recipe step being performed. As another example, the operational information may indicate an error status of a particular component. In some embodiments, the error status may be determined based on the sensor data obtained in block 408. For example, the error status may be determined based on a determination that a value received by a particular sensor is outside of a normal operating range. In some embodiments, the error status may be determined based on the operational status of the sensor. For example, an alarm may be generated if one or more sensors send information with an irregular frequency or send information that indicates a contradictory or highly unlikely operating state of the tool (e.g., indicating that the pressure is very high but also indicating that the airlock is open).

[0130] At 412, the MR headset receives operational information regarding the semiconductor manufacturing tool from the MR control system. The operational information may be received via a communication channel established between the MR headset and the MR control system, as described in block 402.

[0131] At 414, the MR headset causes content associated with the semiconductor manufacturing tool and / or one or more control features to be rendered. The content may be based on the operational information received at block 412. For example, as shown in connection with FIGS. 5A and 6C-6E and described below, the content may include one or more user interface elements, such as a display window with specific control tabs specific to components within the physical semiconductor manufacturing tool. The content may further include operational information (e.g., sensor values, current operational states, etc.) associated with one or more components within the physical semiconductor manufacturing tool. As another example, as shown in connection with FIGS. 8A, 9A, and 9B and described below, the content may include a rendering of one or more internal elements of the physical semiconductor manufacturing tool presented as an overlay on top of a visible portion of the physical semiconductor manufacturing tool. As yet another example, as shown in connection with FIG. 11A and described below, the content may include a three-dimensional rendering of a component or element of the digital twin rendered by the MR headset in the MR environment.

[0132] In some embodiments, the content can include one or more control features. A control feature can be a selectable user interface element that, when selected, causes an operational instruction to be sent from the MR headset to the MR control system. The MR control system can then cause the semiconductor manufacturing tool to send commands that cause the semiconductor manufacturing tool to change state based on the operational instruction. Examples of operational instructions can include initiating a particular process or a simulation of a particular process, setting or modifying a particular parameter or setting value, etc.

[0133] It should be noted that the transmission of the operation command may depend on permissions associated with a user account associated with the MR headset and tool control product. In some embodiments, such permissions may be stored in association with the user account. For example, in some embodiments, an operation command (e.g., an instruction to cause a semiconductor manufacturing tool operated by the MR control system to perform an operation) may be suppressed or blocked in response to a determination that a user associated with the user account is not authorized to perform the corresponding operation. In some embodiments, the MR control system may prohibit the execution of an unauthorized operation command based on the permissions associated with the user account. Additionally or alternatively, in some embodiments, the MR headset may prohibit the transmission of an unauthorized operation command to the MR control system based on the permissions.

[0134] Rendering user interface elements showing semiconductor manufacturing tool operational information in a mixed reality environment After establishing a communication channel between the MR headset and the MR control system, the MR headset and the MR control system can be used to render representations of user interface elements indicative of semiconductor manufacturing tool operational information in the MR environment and / or corresponding to control features associated with the semiconductor manufacturing tool. The user interface elements may be rendered in the MR environment, and possibly in the AR environment, such that the physical semiconductor manufacturing tool can be seen behind and / or around the virtual user interface elements. Such interface presentations enable a wearer of the MR headset to access current operational information and / or control features associated with the semiconductor manufacturing tool, for example, while viewing various components of the semiconductor manufacturing tool and moving around the physical environment in which the tool is located.

[0135] The MR headset can receive operational information from the MR control system, e.g., indicative of sensor values, status information of various components, etc. The sensor values, status information, etc. can be received by the MR control system from a semiconductor manufacturing tool. The MR headset can then cause user interface elements indicative of the received operational information to be rendered in the MR environment. For example, the user interface elements may be rendered such that the physical environment is visible behind and around the user interface elements. Additionally, the MR headset can render the user interface elements such that they can be resized and / or repositioned by the wearer of the MR headset. For example, the user interface elements can be "virtually" grabbed, pinched, etc. by the user to reposition and resize them.

[0136] Additionally, a user interface element, such as a display panel, may be configured to be fixed in a predetermined position relative to a particular frame of reference. For example, a user interface element may be configured to be positioned by a wearer of the MR headset in a particular position relative to another user interface element. That is, if a first interface element moves, the second interface element moves as well and maintains its position relative to the first interface element. As another example, a particular user interface element may include one or more positioning elements that can be selected by a wearer of the MR headset that indicate a frame of reference to which the particular user interface element is fixed.

[0137] As another example, a user interface element may be configured to be positioned at a particular fixed location with respect to a projection of a physical / real-world environment. As an example, if a user interface element (e.g., an information display panel) is positioned at a particular fixed location with respect to the physical environment, the MR headset may determine whether a group of spatial coordinates that define the boundaries of the user interface element are within the field of view (FOV) of the MR headset. Continuing with this example, in response to determining that a group of spatial coordinates that define the boundaries of the user interface element are not within the current FOV of the MR headset, the user interface element becomes invisible from the current FOV. As a particular example, if a user interface (UI) element is fixed at a position 30 degrees to the left of a fiducial mark in the physical environment (e.g., an edge or corner of a physical manufacturing tool, an edge or corner of a particular machine-readable code affixed to an exterior portion of the physical manufacturing tool, etc.), the MR headset may identify spatial coordinates that define the boundaries of the user interface element with respect to the physical environment. Continuing with this particular example, if the MR headset rotates 180 degrees and is no longer looking 30 degrees to the left of the fiducial mark in the physical environment (and thus no longer facing the position to which the user interface element is configured to be fixed), the MR headset may determine that the spatial coordinates that define the boundaries of the user interface element are no longer present within the MR headset's current field of view (after rotating 180 degrees), and therefore will not display the user interface element within the current field of view. In this particular example, if the MR headset is only partially rotated away from the fiducial mark (e.g., 90 degrees to the left), the UI element will still be present within the new field of view, but its position relative to the new field of view will have changed (e.g., it will move from the left side of the screen to the right side of the screen).

[0138] As yet another example, a user interface (UI) element may be configured to be positioned at a particular fixed location with respect to the field of view of the MR headset. As one example, such a UI element may "follow" the wearer of the MR headset as the wearer moves around the physical environment or changes orientation within the MR environment. As a particular example, if a UI element is configured to be positioned 30 degrees to the left of the center of the field of view, the UI element may remain in that position regardless of the position and / or orientation of the MR headset with respect to the physical environment.

[0139] 5A, 5B, 6A-6E, and 7 relate to rendering UI elements showing operational information and / or control features in a MR environment. FIG. 5A illustrates an example of a process 500 that may be implemented by a MR headset. FIG. 5B illustrates an example of a process 550 that may be implemented by a MR control system. FIGs. 6A-6E illustrate example views from the perspective of a wearer of a MR headset associated with one or more steps illustrated in FIGS. 5A and 5B. FIG. 7 illustrates an example configuration interface for configuring information rendered by a MR headset.

[0140] Referring to FIG. 5A, an example process 500 for rendering user interface elements indicative of operational information of a semiconductor manufacturing tool and receiving operational instructions to be performed by the semiconductor manufacturing tool is shown, according to some embodiments. The blocks of the process 500 may be performed by an MR headset. In the following, one or more steps of the process 500 are described with the example fields of view shown in FIGS. 6A-6E. It should be noted that the blocks of the process 500 may be performed in an order not shown in FIG. 5A. Additionally or alternatively, in some embodiments, one or more blocks of the process 500 may be omitted.

[0141] At 502, the MR headset establishes a communication channel with an MR control system configured to operate a semiconductor manufacturing tool. In some embodiments, 502 is implemented using the description associated with FIG. 3A.

[0142] After the MR headset establishes a communication channel with the MR control system, a user interface is rendered in the AR environment according to some embodiments of the present disclosure. Figure 6A shows an example view 600 from the perspective of an operator wearing the MR headset after the communication channel is established.

[0143] As shown, the view 600 can include one or more UI elements rendered in the AR environment, such as a menu panel 602 and a motion information selection input 604, according to certain embodiments of the present disclosure. In some embodiments, selection of an element in the menu panel 602 allows the user to adjust one or more settings, such as the appearance of UI elements presented by the MR headset, the volume level of sounds presented using the MR headset, etc. In some embodiments, selection of the motion information selection input 504 can cause content reflecting different sets of motion information to be presented through the MR headset. Note that the virtual UI elements are presented overlaid on top of a projection of the physical environment as the physical environment is seen in the view 600. Although the view 600 shows the UI elements overlaid on top of a background projection of the physical environment, in some embodiments, the UI elements may be presented in the same plane as the background projection or projections. That is, the UI elements appear to be next to one or more projected background components. In some embodiments, one or more UI elements may be present and associated with different components projected within the field of view. For example, one or more sub-components in the background of view 600 may have menu panels presented next to them, via a master toggle or automatically, to enable component-specific views and / or controls. In some embodiments, the UI elements are opaque so as to completely block the details of the background components they overlay. In some embodiments, one or more UI elements may have different degrees of transparency ranging from cloudy to almost completely transparent. Using UI elements with various degrees of transparency allows the user interface to be more immersive, thus improving the operational efficiency of the semiconductor tool. Such information and control panels are presented graphically in a single view, eliminating the need for an operator to look up where the sub-components are located within the internal component (or what components are around the component of interest).

[0144] In some embodiments, selection of UI element 605 may fix control panel 601 (including, for example, UI elements 602 and 604) with respect to the location of the semiconductor manufacturing tool in the physical environment.

[0145] 5, in some embodiments, at 504, the MR headset identifies a physical location and / or orientation of the MR headset. In some embodiments, the physical location and / or orientation may be with respect to a physical semiconductor manufacturing tool or a portion of a physical semiconductor manufacturing tool. For example, the physical location and / or orientation of the MR headset may be determined with respect to a machine-readable code affixed to the portion of the physical semiconductor manufacturing tool, with respect to a physical landmark or a fiducial marker of the physical semiconductor manufacturing tool (e.g., a particular screw, a particular edge of a wall, etc.), or the like.

[0146] The physical position and / or orientation of the MR headset may be determined using one or more cameras and / or one or more sensors (e.g., accelerometers, gyroscopes, etc.) of the MR headset. In some embodiments, the physical position and / or orientation of the MR headset may be determined by updating a previously determined physical position and / or orientation based on the direction and speed of movement indicated by the one or more cameras and / or one or more sensors.

[0147] It should be noted that in some embodiments, block 504 may be omitted. For example, if the user interface element is presented without regard to the field of view of the MR headset, the MR headset may not use the physical position and / or orientation information. Thus, in some embodiments, block 504 may be omitted.

[0148] In some embodiments, at 506, the MR headset receives a first input requesting specific operational information associated with the semiconductor manufacturing tool to be displayed. Note that in some embodiments, the operational information may be grouped into various / multiple sets of operational information. A set of operational information may include data (e.g., sensor data) associated with similar components or elements. For example, a set of operational information may include sensor outputs from pressure sensors associated with various airlocks of a semiconductor manufacturing tool. In another example, a set of operational information may include multiple sensor outputs from a single processing chamber of a semiconductor manufacturing tool. In another example, a set of operational information may include multiple sensor outputs from similar one or more sensors for multiple processing chambers of a semiconductor manufacturing tool, e.g., the same pedestal temperature sensor present in each processing chamber of a semiconductor manufacturing tool.

[0149] In some embodiments, the one or more inputs can include capturing (via the camera of the MR headset) image data that includes a machine-readable code associated with a set of operational parameters, such as a QR code affixed to a process chamber or displayed on a display screen of a semiconductor manufacturing tool. In some such embodiments, the machine-readable code may be affixed to an external portion of the semiconductor manufacturing tool and / or presented via a display of a device that executes the MR control system. If the input includes capturing image data that includes a machine-readable code, the MR headset can decode the machine-readable code and obtain an identifier embedded within the machine-readable code. In some embodiments, the identifier is uniquely associated with a particular set of operational parameters for at least one or more components of the semiconductor manufacturing tool with which the MR control system is communicating.

[0150] Additionally or alternatively, in some embodiments, the input may include selection of one or more selectable inputs of a user interface element rendered by the MR headset (e.g., a command tab displayed on a virtual control panel).

[0151] For example, referring back to FIG. 6A, in response to selection of the motion information selection input 604, a virtual panel showing a set of available motion information may be rendered via the MR headset.

[0152] FIG. 6B illustrates an example view 620 that includes an I / O card list 606 (which may be referred to as a menu 606) of available sets of operational information. Note that the "I / O cards" (rectangular panels listed under the I / O card list 606) illustrated in FIG. 6B each correspond to a set of operational information. It is understood that these I / O cards are presented as an example and may be referenced using different names to associate different functions or features within a semiconductor manufacturing tool. As shown, the I / O card list 606 illustrates a set of available controls corresponding to "Airlock Analog Input," "Platform Status," "Door Secure Close," and "Platform Pressure." Note that the set of available operational information illustrated in the I / O card list 606 is presented merely as an example and other sets of operational information may be presented in the menu in addition to or instead of those illustrated in FIG. 6B. Additionally, the I / O card list 606 may be updated based on one or more user selections. For example, the I / O card list 606 may correspond to a multi-level menu structure such that the controls presented in association with the I / O card list 606 change as the multi-level menu structure is traversed. As a more detailed example, the I / O card list 606 may initially present various controls that correspond to "parent level" options. Continuing with this more detailed example, in response to selecting a particular control from a parent level of options, the I / O card list 606 may expand to show sub-level controls or information that correspond to "child level" options nested under the selected parent level option.

[0153] The I / O card list 606 further includes a "Follow Me" input 607. In some embodiments, when the "Follow Me" input 607 is selected, the I / O card list 606 remains fixed at a particular display position in the operator's field of view, regardless of changes in the position and orientation of the MR headset. For example, if the I / O card list 606 is initially presented at a position 30 degrees to the left of the center position of the MR headset's field of view and the "Follow Me" input 607 is selected, the I / O card list 606 may continue to be presented 30 degrees to the left of the center of the field of view, even as the position / orientation of the MR headset changes. In some embodiments, the display size and resolution of the UI elements (e.g., the I / O card list 606) remain the same whether the operator moves closer to or farther away from a target object in the background. In some embodiments, when the UI elements are commanded not to follow or to be fixed in space relative to the projected background, the display size and resolution of the UI may change depending on the operator's distance to the target object in the background. For example, as the operator steps back from the target object, the display size of a UI element (e.g., I / O card list 606) may decrease. Conversely, as the operator approaches the target object, the display size of the UI element may increase up to a predetermined size limit. Note that any user interface element (e.g., a display panel) rendered by a MR headset may include such a "follow me" feature.

[0154] As shown, the exemplary view 620 includes a connection panel 622. In some embodiments, connecting to an MR control system can be facilitated by, for example, entering an Internet Protocol (IP) address or computer name of a particular control system. In some embodiments, the MR headset can connect to multiple MR control systems in-session via the connection panel 622. As described above in connection with FIG. 2, the connection may be via MQTT, HTTP, Extensible Messaging and Presence Protocol (XMPP), Constrained Application Protocol (CoAP), or other protocols.

[0155] 5A, in some embodiments, at 508, the MR headset can request a set of operational information from the semiconductor manufacturing tool from the MR control system. If the input received at block 506 is a selection of one or more selectable user interface elements, the MR headset can request the indicated set of operational information by sending an identifier of the selected user interface element to the MR control system. For example, if the selected user interface element corresponds to "platform pressure" from the menu of available sets of operational information shown in FIG. 6B, the MR headset can send a command to the MR control system that the "platform pressure" element was selected from the menu.

[0156] If the input received at block 506 is image data including a machine-readable code, such as a QR code scan, the MR headset can transmit a decoded identifier retrieved from the machine-readable code to the MR control system. In some embodiments, upon receiving a command from the MR headset, the MR control system can identify a set of operational information associated with the identifier.

[0157] At 510, the MR headset receives operational information from the MR control system.

[0158] It should be noted that in some embodiments, blocks 506 and 508 may be omitted. For example, in some embodiments, the MR headset may receive a stream of operational information at block 510 that is sent by the MR control system to the MR headset without a request by the MR headset. Such streamed operational information may include information regarding the operational status of a semiconductor manufacturing tool where it is deemed important that content associated with the operational status be presentable by the MR headset, regardless of whether the content has been explicitly requested by the wearer of the MR headset. Such operational status information may include information indicating an error state of one or more components, a hazardous condition, connectivity or signal strength / errors, information regarding user permissions, location-specific operational instructions (e.g., rules associated with a particular plant), and the like.

[0159] After receiving the operational information at 510, the MR headset displays and presents the received operational information to the user at 512. In some embodiments, the MR headset can present a UI element that can include one or more text boxes, virtual gauges, virtual meters, virtual indicators (such as virtual indicator lights, checkboxes, radio buttons, etc.), or other elements that reflect the data or information received at 510. It should be noted that the data or information presented in the user interface element can be substantially real-time data or information. For example, the data or information can correspond to current or recent sensor values ​​of a sensor associated with a semiconductor manufacturing tool, e.g., data that is presented to the user as soon as it is available to the MR headset (there may be some delay due to transmission delays between when one or more values ​​are obtained and when the values ​​are ultimately received by the MR headset).

[0160] In some embodiments, the received set of operational information may be formatted by the MR headset in any suitable manner. For example, a UI notification indicating that a sensor value or component state is in an error or abnormal state may be presented in a visual manner indicating such status (e.g., presented in red, flashing or illuminated to draw attention to the error state, etc.). As another example, a UI notification indicating that a sensor value or component state is currently powered on or available may be presented in a visual manner indicating such status (e.g., presented in green, presented in association with a check mark, etc.).

[0161] An exemplary view of how operational information is displayed via an MR headset is shown in FIG. 6C. In FIG. 6C, view 630 shows an I / O card 608 displaying received operational information regarding pressures associated with various components of a semiconductor manufacturing tool (e.g., pressures of one or more process chambers, pressures of one or more airlocks, etc.). The I / O card 608 is a pop-up panel linked to a "Platform Pressure" control shown in the parent I / O card list 606. In some embodiments, the I / O card 608 is displayed in response to selection of one or more controls on the parent I / O card list 606 (e.g., a check box in the "Platform Pressure" control). As shown, the I / O card 608 includes descriptions of the various components in the semiconductor manufacturing tool and their associated pressure value meters 610, and indicates the pressures detected for the various components. In some embodiments, the units of measurement can be changed, which changes the value displayed on the pressure value meters 610. In some embodiments, a UI panel (e.g., I / O card 608) can have one or more nested sub-components, such that clicking on one displayed component will expand the list and open a description of the sub-component and associated sensor values. In some embodiments, the components displayed in the UI window (e.g., I / O card 608 or I / O card list 606) are preconfigured and fixed. In some embodiments, the components displayed in the UI window are dynamic. That is, in some embodiments, the MR headset or MR control system can use certain conditions or rules to determine which components should be displayed near the top of the list (i.e., dynamically rank the display order), hidden, or displayed on the first or second page of the display if the list is very long. Such conditions or rules can include, but are not limited to, considerations regarding the location of the MR headset, the physical proximity of the MR headset to one or more areas of the tool, the utilization, failure probability, or criticality of one or more components or sub-components to a particular process.For example, when an operator is looking directly into a process chamber, the UI window may list pressure information for components that are physically closer to the operator before components that are physically farther from the operator.

[0162] FIG. 6D illustrates an example view 640 including an I / O card 612 that displays the current status of multiple components in respective status boxes 614. For example, FIG. 6D illustrates that Airlock 1 is "Pumping" and AtmArm (Atmospheric Arm) is "Standby." Similar to the functionality described with respect to FIG. 6C, the listing order of the components can be pre-configured or dynamic. Additionally, the status boxes 614 may be updated frequently (e.g., real-time status check updates at set intervals) or may be updated based on the occurrence of an event.

[0163] Referring back to process 500 of FIG. 5A, at 514, the MR headset can optionally update the UI elements based on the position or orientation of the MR headset or based on particular UI element presentation settings.

[0164] In some embodiments, the presentation of the UI elements may be updated based on user input received through the MR headset. In some embodiments, the size of the UI elements may be modified based on user input that resizes the UI elements. For example, the UI elements may be enlarged in size in response to receiving a particular user input (e.g., pinching or pulling the UI element). As another more detailed example, the position or orientation of a portion of the UI elements may be modified based on the received user input. As a particular example, in some embodiments, a user may move a UI element by grabbing the UI element and positioning the UI element at a different location in the MR environment. In some embodiments, the user may also change the orientation of one or more UI elements in the MR environment with respect to the user's field of view. For example, in some embodiments, the user may tilt the UI window by pushing one side of the UI window away from the user's field of view, causing the UI window to swing open (or away) from the user's field of view like a door hinged on one side. While certain objects are rendered in two dimensions (2D), such as the UI window shown in FIG. 6C, embodiments of the present invention allow these objects to be moved in three-dimensional (3D) space, as shown in the examples above. Such a capability increases customization options for the GUI of semiconductor manufacturing / fabrication tools, thereby allowing operators to rapidly build scenario-based UIs. In some embodiments, UI windows and panels may be rendered in 3D.

[0165] As another example, the position or orientation of a UI element may be updated based on changes in the position or orientation of the MR headset. For example, if a UI element is set to be fixed in a certain position relative to the physical environment, the user interface element may be rendered at a different position or angle relative to the user's viewing angle based on the position or orientation of the MR headset.

[0166] In some embodiments, the presentation of the motion information can be updated based on updates received from the MR control system. For example, the sensor value meter shown in FIG. 6C can be updated to show more recently received sensor data.

[0167] In some embodiments, the presentation of user interface elements may be updated based on a combination of user input, changes in the position or orientation of the MR headset, and / or updated motion information.

[0168] With reference to FIG. 6E, an exemplary view 650 shows that the status box 614 of the I / O card 612 previously shown in FIG. 6D is updated in response to a command issued to the semiconductor tool. As shown, the state of Airlock 1 is changed in box 615 to indicate that the state of Airlock 1 has changed from "Pumped" (as in FIG. 6D) to "Vented" (as in FIG. 6E). In some embodiments, the command is issued from the MR headset. In some embodiments, the command is issued from a system independent of the MR headset and MR control (e.g., from the on-board control of the semiconductor manufacturing tool).

[0169] 5A, in some embodiments, block 514 may be omitted. For example, if no user input is received to change the position, size, or orientation of a user interface element, no updated motion information is received, and the position or orientation of the MR headset has not changed, the presentation of the user interface element may remain unchanged. Thus, in such examples, block 514 may be omitted.

[0170] In some embodiments, the MR headset loops back to block 504 and identifies the updated physical position and / or orientation of the MR headset. The MR headset can then continue to receive the motion information and present user interface elements that indicate the motion information.

[0171] Following steps 512 or 514, process 500 optionally moves to block 516, where the MR headset can receive a second input corresponding to an operational instruction or command to the semiconductor manufacturing tool. Examples of operational instructions / commands include, but are not limited to, starting or stopping a particular process or step of a process, changing the state of a particular component (e.g., starting to vent a particular airlock, closing a particular door, etc.), etc.

[0172] In some embodiments, the second input may be received by the MR headset as a selection of a control feature to be rendered by the MR headset. For example, the control feature may correspond to a push button to initiate execution of an operational instruction (e.g., a push button indicating "start venting"). In some embodiments, the second input may be an operational instruction given via a voice command. In some embodiments, the control feature may be rendered based on the process / component being accessed. For example, when a user clicks on platform pressure while viewing a particular process chamber, the MR headset may generate "pump" and "vent" controls along with status and / or pressure values ​​associated with the particular process chamber.

[0173] At 518, the MR headset transmits the received commands or operation instructions to the MR control system. The MR control system can then cause the semiconductor manufacturing tool to perform the activities received from the operation instructions.

[0174] 5B illustrates an example process 550 executable by an MR control system of the present disclosure to control a semiconductor manufacturing / fabrication tool in an MR environment, according to some embodiments. The steps of process 550 may be performed by the MR control system. Note that the steps of process 550 may be performed in an order not shown in FIG. Additionally or alternatively, in some embodiments, one or more steps of process 550 may be omitted.

[0175] At 552, the MR control system acquires sensor data representative of sensor output from the semiconductor manufacturing tool. The sensor data may be sensor output from any sensor in the semiconductor manufacturing tool, such as a temperature sensor, a pressure sensor, a light sensor, a position sensor, a motion sensor (e.g., an accelerometer, a gyroscope, etc.), or a combination thereof. The sensor data may be acquired from multiple sensors, where the multiple sensors are different types of sensors and / or associated with different components of the semiconductor manufacturing tool.

[0176] At 554, the MR control system can receive a request for operational information from an MR headset or other control platform (e.g., an on-board control system of a semiconductor manufacturing tool). As described above in connection with blocks 506 and 508 of FIG. 5A, the request may be received, for example, via selection of a user interface element rendered on the MR headset, via capture of a machine-readable code by the MR headset, via an operator's voice command to the MR headset. In some embodiments, block 554 may be omitted. For example, block 554 may be omitted if the MR control system continuously or periodically transmits a stream of operational information regardless of whether the operational information was explicitly requested by the MR headset.

[0177] At 556, the MR control system transmits the motion information to the MR headset based at least in part on the sensor data acquired in step 552. In some embodiments, the MR control system can identify the motion information based on the request received in step 554. For example, the MR control system can identify a set of motion information associated with the machine-readable code captured by the MR headset.

[0178] At 558, the MR control system can receive commands or operational instructions from the MR headset or other control platform to be performed by the semiconductor manufacturing tool. As discussed above in connection with block 516 of FIG. 5A, the operational instructions may correspond to starting or stopping a particular process or step of a process, changing the state of a particular component, etc.

[0179] At 560, in some embodiments, the MR control system causes a tool command to be sent to the semiconductor manufacturing tool that changes a state of the semiconductor manufacturing tool, the command being based on the command or operation instruction received in step 558. In some embodiments, the MR control system sends the tool command over a wired connection. In some embodiments, the MR control system sends the tool command wirelessly.

[0180] In some embodiments, the set of operational information may be configured via a user interface. Such a user interface may be presented by the MR control system to configure the set of operational information to be presented by an MR headset in communication with the MR control system. In some embodiments, the set of operational information may be configured by selecting one or more variables for inclusion in the set of operational information. Each variable may represent an operational state or a sensor output of a physical semiconductor manufacturing tool, and the value of the variable may be transmitted to an MR headset in communication with the MR control system.

[0181] 7 shows an example configuration interface 700 that can be used to configure information and UI elements rendered in a MR headset, according to some embodiments. Referring back to FIG. 2, in some embodiments, the configuration interface 700 can be accessed through the MR control system 202, the MR headset 206, the server 210, or an on-board control system of a semiconductor tool.

[0182] As shown, the configuration interface 700 may include a group identifier 702 that indicates a particular set of tool functions or features. In the illustrated example, the group identifier 702 indicates "Platform Pressure," which corresponds to the "Platform Pressure" shown in the I / O card list 606 of FIG. 6B.

[0183] The configuration interface 700 further includes a panel 704 that shows variables that are available for inclusion in the set of tool functions or features. For example, the panel 704 includes a variable 706 named "airlock1 / airlock1-slot1out / disableevents." In addition, the panel 704 may include, for each variable, an alias for the variable. For example, an alias 708 for the variable 706 is "AirLock1-slot1outDisableEvents."

[0184] In some embodiments, each variable included in panel 704 may be associated with a variable update parameter 710. In some embodiments, the variable update parameter can be set to either a "status variable" or a "controllable variable." A "status variable" generally refers to a variable or value that is a measurement or measurement state that cannot be modified by the user. In contrast, a "controllable variable" generally refers to a variable or value that can be set by the user.

[0185] The configuration interface 700 includes an add button 712. In response to selecting the add button 712, the variables selected in panel 704 may be included in a selected variables panel 714. The selected variables panel 714 indicates the variables selected to be associated with the group identifier 702.

[0186] In some embodiments, the set of variables selected in the variable panel 714 may be associated with a machine-readable code, such as the QR code shown in FIG. 7. In some embodiments, the machine-readable code may be selected or generated within the configuration interface 700. The QR code 716 is one example of a machine-readable code programmed to be associated with a set of variables in the variable panel 714. For example, each set of variables selected using the configuration interface 700 may be assigned a unique group identifier (e.g., 702), which may then be encoded into a machine-readable code. In operation, the MR headset may scan the machine-readable code generated by the configuration interface 700 and open a list of functions or features that are linked to the underlying variables and that are recognized by the MR control system. In this manner, the MR headset may request data associated with the set of functions or features associated with that identifier from the MR control system.

[0187] In some embodiments, the machine-readable code may be associated with multiple different types of display functions and capabilities, such as displaying an I / O card or I / O card list as shown in FIGS. 6A-6E, opening related information associated with the function of interest (e.g., procedure manuals, maintenance information logs, etc.). In some embodiments, the machine-readable code may store a hyperlink associated with each menu option that opens the associated hyperlink when selected. In some embodiments, the machine-readable code may be linked to multiple menu options that point to different records of instructions within the MR control system. For example, if the machine-readable code is associated with "platform pressure," scanning the machine-readable code may cause the MR headset to open a GUI that presents options for viewing variables associated with the identifier "platform pressure" (e.g., an I / O card having airlock 1 and airlock 2, such as I / O card 608 in FIG. 6C), or may open other related documents, such as procedure manuals associated with one or more airlocks, maintenance information associated with one or more airlocks, etc. The documents may be in any suitable format, such as a markup language (e.g., HTML, XML, etc.), a portable document format (PDF) document, etc.

[0188] Rendering the state of internal components using a mixed reality headset In some embodiments, representations of the state, or state over time, of internal components of a semiconductor manufacturing tool (e.g., robotic arms, lift pins, slit valves, wafer supports, indexers, carousels, showerheads, wafers in production, etc.) may be rendered using an MR headset in an MR environment. Indeed, such representations may appear to enable a wearer of an MR headset to "see inside" a closed semiconductor manufacturing tool and see internal components of interest that may not be visible from the exterior walls of the semiconductor manufacturing tool without disassembling the tool.

[0189] For example, the representation of the internal component may correspond to the position of the internal component and / or the movement of the internal component. The representation may include a 3D image, a sequence of 3D images, or an animation depicting one or more internal components. The 3D image, or the sequence of 3D images, may be rendered with a size and / or orientation based at least in part on one or more of the position, orientation, and distance of the MR headset to the internal component of interest or a particular fiducial mark on the semiconductor manufacturing tool. The position, orientation, and / or distance of the MR headset to the component of interest or fiducial mark may be determined in part by one or more location sensors in the MR headset. In some embodiments, an estimated or near real-time actual position of the component of interest (e.g., a robotic arm for moving a wafer) is rendered according to position data received from one or more sensors in the semiconductor manufacturing / fabrication tool.

[0190] FIGURE 8A illustrates an example process 800 for rendering a representation of an internal element / component of a semiconductor manufacturing tool by an MR headset, according to some embodiments. FIGURE 8B illustrates an example process 850 for providing and obtaining information for rendering a representation of an internal element / component of a semiconductor by an MR control system, according to certain embodiments. FIGURES 9A and 9B illustrate example views of a 3D representation of a process chamber, according to some embodiments.

[0191] 8A, in some embodiments, the blocks of process 800 may be performed by an MR headset. Note that in some embodiments, the blocks of process 800 shown in FIG. 8A may be performed in various orders, and one or more of these blocks may be performed simultaneously. Additionally, in some embodiments, one or more blocks of process 800 may be omitted. In some embodiments, process 800 may be performed after a communication channel between an MR headset and an MR control system is established.

[0192] At 802, the MR headset obtains 3D model information associated with at least a portion of the semiconductor manufacturing tool. As described above in connection with FIG. 2, the 3D model information can be stored in the MR headset, the MR control system, or a system in communication with the MR headset or the MR control system, such as an external server. The 3D model information can include, but is not limited to, 3D images of multiple components, associated geometric shapes (e.g., polygons and their vertices), associated color or texture information, associated coordinate information, lighting information (e.g., indicating the location and / or position of shadows), and the like.

[0193] In some embodiments, the 3D model information may be stored in one or more computer-readable storage media (e.g., memory) of the MR headset. In such embodiments, the 3D model information may be retrieved by the MR headset from one or more of these computer-readable storage media. In some embodiments, the 3D model information may be stored in one or more computer-readable storage media (e.g., memory) of the MR control system. In such embodiments, the relevant 3D model information may be provided by the MR control system to the MR headset as needed to render the 3D content. In some embodiments, the 3D modeling information may be stored in multiple devices. For example, the coordinate information may be stored in the MR control system, while the geometric shape information is stored in the MR headset.

[0194] At 804, the MR headset identifies its position and orientation relative to one or more fiducial marks of the semiconductor manufacturing tool according to some embodiments. One or more physical features of the semiconductor manufacturing / fabrication tool can serve as the fiducial marks. The MR headset can use one or more on-board cameras or one or more on-board sensors to determine its relative position relative to the semiconductor manufacturing / fabrication tool. For example, image data acquired by one or more cameras can be used to identify the position of a fiducial mark (e.g., a physical landmark) of the semiconductor manufacturing tool. In some embodiments, the position of a machine-readable code affixed to an external portion of the semiconductor manufacturing tool can be used by the MR headset to determine its relative position and orientation. In some embodiments, the relative position can be identified relative to a fiducial or fiducial mark present in the physical environment, the fiducial or fiducial mark being an external physical landmark of the semiconductor manufacturing tool (e.g., a particular screw, a particular wall, etc.) or a machine-readable code affixed to an external portion of the semiconductor manufacturing tool.

[0195] The one or more fiducial marks used to obtain the relative position of the semiconductor manufacturing tool with respect to the MR headset may correspond to known positions or locations within the three-dimensional model information. The fiducial marks may thus be used to enable a three-dimensional (3D) representation of the component to be positioned, oriented, and / or scaled within the field of view (FOV) of the MR headset, such that the 3D representation is overlaid where the physical component would be within the FOV and is presented within the FOV of the MR headset at a scale that matches the scale that the real-world counterpart would have if seen from the perspective of the MR headset.

[0196] At 806, the MR headset receives motion information from the MR control system indicating the position, or position over time, of one or more internal elements / components of the semiconductor manufacturing tool. For example, the motion information may indicate element / component position information (e.g., position of a robotic arm, position of an indexer or carousel, position of lift pins, position of a showerhead, etc.) relative to a reference frame that correlates or is associated with the physical semiconductor manufacturing tool. As another example, the motion information may indicate element movement information (e.g., speed and direction) relative to a reference frame that correlates or is associated with the physical semiconductor manufacturing tool.

[0197] In some embodiments, the operational information may include sensor data for elements such as pressure data, temperature data, etc. In some such embodiments, the operational information may further indicate an abnormal or error condition identified based on the sensor data. For example, the operational information may indicate that the MR control system has determined that certain sensor data is abnormal because it is outside of normal ranges, or that a certain element is in an error state. In some embodiments, position or rotational encoder information may be used to determine positional and / or movement information for one or more internal elements / components. For example, the position of a robotic arm may be determined based on one or more rotational encoders indicating the amount of rotation of each joint of the robotic arm, and based on the known length of each arm link.

[0198] In some embodiments, the operational information may indicate information about one or more wafers being fabricated. For example, the operational information may indicate the location of a wafer in a particular process chamber, whether a particular wafer is currently clamped or unclamped on a chuck, etc.

[0199] In some embodiments, the MR headset may determine the position, or position over time, of the internal element / component based on sensor data transmitted by the MR control system. In some embodiments, the MR headset may receive the position, or position over time, from the MR control system. In some embodiments, the MR headset may receive initial position information from the MR control system and use a script to determine subsequent positions over time based on the initial position information.

[0200] At 808, the MR headset renders one or more internal elements / components in the MR, AR, or VR environment. The position, or position over time, of the one or more internal elements / components may be rendered based on the 3D model information and based on the relative position of the MR headset with respect to the semiconductor manufacturing tool. An example of a view rendered through a MR headset that includes a representation of one or more internal elements is shown and described below in connection with FIG. 9B.

[0201] In some embodiments, the 3D model information can be used to generate one or more 3D images. In some embodiments, each image corresponds to an internal element or a portion of an internal element to be rendered. In some embodiments, each of the one or more 3D images may be generated such that an orientation, positioning, and / or sizing of the 3D model in the image corresponds to a viewpoint of the MR headset with respect to the semiconductor manufacturing tool, the viewpoint being determined based on a relative position of the MR headset with respect to the semiconductor manufacturing tool.

[0202] In some embodiments, when two or more 3D images are generated, the two or more 3D images may be rendered in sequence, such that the sequence of two or more 3D images may appear as an animation.

[0203] In some embodiments, the one or more 3D images may be generated and rendered based on a script that generates positions of various elements represented by the one or more 3D images. For example, if the one or more 3D images represent a robotic arm, the script may be used to identify one or more positions of the robotic arm. In another example, if the robotic arm is moving, the script may be used to identify a series of positions of the robotic arm at a series of time points. The positions of the various elements may be generated by the script based on known manner in which the elements move. For example, the positions of the robotic arm may be generated based on known manner in which various links of the robotic arm rotate around one or more joints.

[0204] In some embodiments, the location, or a representation of the location over time, of one or more internal elements / components may be presented in a manner that indicates the status of the corresponding internal component. For example, a component that is determined to be associated with an anomalous sensor reading or that is in an error state may be rendered in a visual manner (e.g., red, blinking, etc.) that indicates such status.

[0205] Additionally, in some embodiments, status information may be communicated in a non-visual manner via the MR headset. For example, in some embodiments, an audible alert (e.g., a beep, tone, etc.) or an audible message may be presented via the speaker of the MR headset. Such an alert or message may be presented in response to a determination that an element is in an error or abnormal state, that a particular element is moving or about to move, etc.

[0206] In some embodiments, the manner in which the MR headset presents information regarding the location or location over time of internal elements of a semiconductor manufacturing tool can be configured by a user. For example, such user configuration can be received via one or more user interfaces used to set and modify settings associated with the MR headset. In some embodiments, the functionality of rendering 3D images of components / elements can be activated or deactivated by a user via the MR headset using various command / input mechanisms disclosed by the present disclosure.

[0207] 8B illustrates an exemplary process 850 for providing and obtaining information for rendering a representation of an internal element / component of a semiconductor manufacturing tool by an MR control system, according to some embodiments. In some embodiments, the blocks of process 850 illustrated in FIG. 8B may be performed in various orders, and some blocks may be performed simultaneously. In some embodiments, one or more blocks of process 850 may be omitted. In some embodiments, process 850 is performed following establishment of a communication channel between an MR headset and an MR control system.

[0208] At 852, the MR control system obtains 3D model information associated with the semiconductor manufacturing tool. In some embodiments, the 3D model information can be stored in a memory associated with the MR control system. In some embodiments, the MR control system can retrieve the 3D model information from a server.

[0209] At 854, the MR control system transmits at least a portion of the 3D model information representing the portion of the semiconductor manufacturing tool to the MR headset. In some embodiments, the MR control system can identify the portion of the 3D model information to transmit based on an indication of the portion of the semiconductor manufacturing tool that is within the field of view of the MR headset.

[0210] At 856, the MR control system determines a position or a position over time of one or more internal elements of the semiconductor manufacturing tool. The position or the position over time can be based on sensor data received from the semiconductor manufacturing tool. For example, the position of a robot arm can be determined based on encoder values. In some embodiments, the position or the position over time can be based on a known model of how the links of the robot arm move.

[0211] In some embodiments, the MR control system can transmit the sensor data to the MR headset without determining position information (e.g., at block 858). In some such embodiments, block 856 may be omitted. In some embodiments, the MR control system can determine an initial position of one or more elements / components based on the sensor data received from the semiconductor manufacturing tool. In some such embodiments, the MR headset is capable of determining the position of one or more elements over time based on the initial position.

[0212] At 858, the MR control system transmits position / location information to the MR headset indicating a position of one or more internal elements / components of the semiconductor manufacturing tool. In some embodiments, the position / location information may include the position or position over time of the one or more internal elements / components determined in block 856. In some embodiments, the position / location information may include sensor data (e.g., from an encoder, etc.) that allows the MR headset to determine position information.

[0213] 9A shows a processing chamber 901 in an exemplary view 900. As shown, the view 900 includes a processing chamber 901 having an opaque sidewall 902 and a top wall 904. The processing chamber 901 also includes sensors, such as sensor 906, which may be in an upper portion of the processing chamber 901. The processing chamber 901 also includes a front-facing wafer loading slot 908. In addition, the view 900 includes a view of the physical environment (e.g., a room) in which the processing chamber 901 is located. The view 900 can be seen within the field of view of an MR headset if virtual content is not overlaid on the user's field of view.

[0214] FIG. 9B illustrates an example view 950 showing how 3D images of internal elements / components may be rendered in an AR, VR, or MR environment. As shown, in view 950, walls of a virtual processing chamber 951 are rendered as transparent walls 952 and 954. The virtual processing chamber 951 is a virtual representation of the processing chamber 901 shown in FIG. 9A. In addition, representations of internal equipment components or elements are rendered within the transparent walls 952 and 954. For example, view 950 shows a virtual pedestal 956, a virtual wafer loading slot 958, and a virtual wafer handling robot end effector 960, which represent actual physical components within the semiconductor tool. In addition, view 950 shows a virtual wafer 962 positioned on top of the virtual wafer handling robot end effector 960. The positions and orientations of the virtual wafer 962 and the virtual wafer handling robot end effector 960 reflect the actual positions and orientations of the respective components within the semiconductor manufacturing tool in near real-time. As shown, the portion of the physical environment (e.g., room) in which the virtual processing chamber 951 is rendered remains visible within the rendered environment (e.g., AR rendered environment). In some embodiments, virtual 3D renderings of various interior elements / components are overlaid on a realistic projection of the real physical object. In some embodiments, the rendered objects are programmed to visually replace their real corresponding objects projected in the rendered environment. For example, in FIG. 9B, the virtual processing chamber 951 visually replaced the projected real processing chamber 901 of FIG. 9A. In some embodiments, features of the real object are selectively rendered and components / elements not of interest are not rendered. For example, the virtual processing chamber 951 of FIG. 9B does not show the sensor 906 on the top wall and the front-facing wafer loading slot 908 of the real processing chamber 901 shown in FIG. 9A.

[0215] Interacting with the digital twin using mixed reality headsets In some embodiments, the MR headset can be used to render virtual reality (VR) content associated with a digital twin of a physical semiconductor manufacturing tool. According to some embodiments, the digital twin is a virtual representation or simulation of the physical semiconductor manufacturing tool. In some embodiments, by rendering virtual reality content associated with a digital twin representing the physical semiconductor manufacturing tool, the MR headset can enable a wearer of the MR headset to interact with the virtual representation of the physical semiconductor manufacturing tool. For example, the wearer can initiate or start various processes on the digital twin, observe and analyze sensor outputs as a result of various inputs and system changes, observe instructions or parameter values ​​that lead to a particular error condition, etc. In some embodiments, a new user can benefit from interacting with the digital twin via the MR headset and training the digital twin before performing operations on the physical semiconductor manufacturing tool.

[0216] In some embodiments, the digital twin communicates with an MR control system that issues instructions to the digital twin that simulate certain semiconductor manufacturing tool operations and receives outputs from the digital twin that reflect simulated values ​​and states of the semiconductor manufacturing tool provided by the digital twin. As noted above, it is noted that the MR control system that communicates with the digital twin may be installable and / or operable to communicate with the physical semiconductor manufacturing tool. In some embodiments, the digital twin communicates directly with the MR headset without the MR control system.

[0217] In some embodiments, the MR headset can receive operational information from the MR control system indicative of, for example, state information of various components of the digital twin, simulated sensor values ​​associated with simulated sensors of the digital twin, etc. In some embodiments, the MR headset can receive the same or similar operational information directly from the digital twin. In some embodiments, the MR headset is configured to render content in the MR environment that is representative of the received operational information.

[0218] FIG. 10 illustrates an example schematic diagram of a system for rendering semiconductor manufacturing tool operation information from a digital twin of a semiconductor manufacturing tool using a MR headset, according to some embodiments.

[0219] As shown, the MR control system 202 communicates with the device executing the digital twin 1002. In some embodiments, the MR control system 202 is integrated within the digital twin 1002. In some embodiments, communication between the MR control system 202 and the digital twin 1002 can use a TCP-based protocol, an IP-based protocol, or the like. The communication can be wired or wireless. In some embodiments, tool control product software executing on the MR control system 202 provides instructions to the digital twin 1002 that cause the digital twin 1002 to simulate various semiconductor manufacturing tool operations. In some embodiments, the MR control system 202 can receive information from the device executing the digital twin 1002. For example, the MR control system 202 can receive information indicative of simulated sensor values, simulated state information, or the like.

[0220] The digital twin 1002 can include various algorithms that simulate various components or aspects of a semiconductor manufacturing tool. For example, the digital twin 1002 can include digital or computational models of elements used to simulate multiple components in a semiconductor manufacturing / fabrication tool, including, but not limited to, an electrostatic chuck pedestal, a showerhead of a process chamber, a robotic arm that moves a wafer from a first process chamber to a second process chamber, etc. In some embodiments, the components of the digital twin 1002 can be coupled or linked in the digital twin such that the components can interact with one another. For example, a digital component that simulates a showerhead can interact with a digital component that simulates a wafer, such that a wafer property or parameter controlled by the simulation of the wafer can change based on the simulation of the showerhead.

[0221] In some embodiments, the MR control system 202 can interact with the digital twin 1002 to initiate and / or control a simulation of one or more fabrication operations. For example, the MR control system 202 can be used to set or adjust settings on the digital twin 1002, initiate certain simulated actions (e.g., start a simulated vacuum operation, start a simulated temperature change operation, start a simulated gas flow operation, etc.), obtain or look up parameter values ​​of the digital twin 1002 (e.g., current simulated temperature, current simulated pressure level, current simulated gas flow rate, etc.), etc.

[0222] 2 and described above, one or more three-dimensional models 208 of the physical semiconductor manufacturing tool represented by the digital twin 1002 may be stored in a memory of the MR headset 206 and / or a memory of the MR control system 202. Additionally or alternatively, the three-dimensional models 208 may be stored on a server 210 that may be configured to provide one or more of the three-dimensional models 208 to the MR headset 206 and / or the MR control system 202 in response to a request.

[0223] FIG. 11A illustrates an exemplary process 1100 for rendering content associated with a digital twin of a semiconductor manufacturing tool, according to some embodiments. In some embodiments, the blocks of process 1100 may be performed by an MR headset in communication with an MR control system that communicates with the digital twin, and may be performed by an MR headset in direct communication with the digital twin. Note that in some embodiments, the blocks of process 1100 illustrated in FIG. 11A may be performed in various orders, and in the case of some blocks, simultaneously. Additionally, in some embodiments, one or more blocks of process 1100 may be omitted. In some embodiments, process 1100 may be performed following the establishment of a communication channel between the MR headset and the MR control system, or between the MR headset and the digital twin. In some embodiments, the MR headset renders all content associated with the digital twin (e.g., operational information, process simulation, control panel, etc.) in a complete VR environment.

[0224] In some embodiments, at 1102, the MR headset retrieves 3D model information associated with at least a portion of the semiconductor manufacturing tool represented by the digital twin. The 3D model information may include 3D model information for any suitable component or part of the semiconductor manufacturing tool. In some embodiments, the retrieved 3D model information may be a portion of 3D model information related to a particular component or element of the semiconductor manufacturing tool. For example, 3D model information may be retrieved for a particular robot arm, a particular pedestal, a particular shower head, etc.

[0225] In some embodiments, 1102 may be omitted. For example, in some embodiments, one or more control panels (e.g., including UI elements for presenting virtual sensor values ​​or other data) may be rendered in 2D without rendering a 3D representation of the components of the semiconductor manufacturing tool represented by the digital twin.

[0226] The 3D model information may be retrieved from a memory of the MR headset. Additionally or alternatively, the 3D model information may be received at the MR headset from a memory associated with the MR control system or from the digital twin via a respective communication channel.

[0227] In some embodiments, at 1104, the MR headset identifies a physical location and / or orientation of the MR headset. The physical location and / or orientation of the MR headset may be identified based on one or more cameras of the MR headset and / or based on one or more sensors of the MR headset (e.g., accelerometers, gyroscopes, etc.). The physical location and / or orientation of the MR headset may be identified with respect to the physical environment in which the MR headset is physically located. For example, the physical location and / or orientation may be determined with respect to physical landmarks within the physical environment.

[0228] In some embodiments, 1104 may be omitted. For example, in some embodiments, the target object rendered by the MR headset may be rendered and / or updated based on user interaction and / or navigation in the virtual space. For example, the representation may be zoomed in or out based on explicit user input (e.g., pinching or pulling a rendered user interface element). In some embodiments, the operator's viewing angle may be changed by virtually moving the FOV using directional commands. Because the FOV is less limited in the virtual space, more viewing angles may be achieved in some embodiments. For example, the operator may be able to see the tool from below, which is very difficult in some of the AR and MR environments mentioned above. In some embodiments, certain operation / status data may be shown next to some or all components shown on one screen. In these embodiments, the operator may be able to observe the effects from input commands across multiple components at once.

[0229] At 1106, the MR headset receives operational information from the MR control system or the digital twin that indicates a state of the digital twin. For example, the operational information may include one or more simulated sensor values ​​associated with simulated sensors of the digital twin. As another example, the operational information may include one or more simulated positions of various simulated components or internal elements of a semiconductor manufacturing tool represented by the digital twin.

[0230] At 1108, the MR headset determines a current state of the digital twin based on the operational information. For example, in some embodiments, the current state may be an error or abnormal state identified based on simulated sensor values ​​that are outside of normal ranges. In some embodiments, the MR headset simply renders / presents the received state information since the state determination is made in the MR control system or the digital twin. In some embodiments, the simulated sensor values ​​may correspond to simulated temperature values, simulated gas flow values, simulated pressure values, etc.

[0231] In some embodiments, the current state may indicate position or motion information for one or more simulated components of the semiconductor manufacturing tool represented by the digital twin. For example, the position information may indicate the position of the simulated component with respect to a reference frame that is correlated or associated with the semiconductor manufacturing tool. In another example, the motion information may directly or indirectly indicate the direction of movement and / or the speed of movement or rotation of the simulated component with respect to one or more other simulated components of the semiconductor manufacturing tool or with respect to a reference frame that is fixed with respect to the simulated semiconductor manufacturing tool.

[0232] In some embodiments, the current state may indicate an operational status of one or more simulated components of the semiconductor manufacturing tool represented by the digital twin. For example, the operational status of an airlock may indicate whether the airlock is pumped. As another example, the operational status of a door may indicate whether the door is safe to close, whether the door is currently closed, etc. As another example, the operational status of a gas line may indicate whether gas is currently flowing through the gas line.

[0233] In some embodiments, information indicative of the current state of the digital twin may be received by the MR headset from the MR control system. That is, in some embodiments, the MR control system may determine that the current state is an error or abnormal state, and then the MR control system may send information indicative of the error or abnormal state to the MR headset. The MR headset may then render content indicative of the error or abnormal state, for example, at block 1110 of process 1100.

[0234] At 1110, the MR headset causes content to be rendered that is indicative of the current state of the digital twin. In some embodiments, the content may be rendered based on the 3D model information. For example, a 3D image of one or more components or elements of a semiconductor manufacturing tool represented by the digital twin may be rendered.

[0235] In some embodiments, one or more 3D images representing a particular component may be generated and / or rendered such that the one or more 3D images are sized, positioned, and / or oriented in a manner consistent with 3D images of other components or elements of the semiconductor manufacturing tool represented by the digital twin. For example, if the one or more 3D images correspond to a robot arm in motion, e.g., with an action initiated to move the robot arm, a script may be used to identify the position of the robot arm over a series of time points. As a more detailed example, the position of the robot arm may be determined based on the known manner in which various links of the robot arm rotate around joints, etc. Continuing with this example, the one or more 3D images may correspond to a representation of the robot arm at each time point in the series of time points. Continuing with this example, the one or more 3D images may be rendered in sequence such that the one or more 3D images appear to show an animated representation of the simulated robot arm.

[0236] In some embodiments, the MR headset may be configured to continuously update the rendering of the 3D image over time.

[0237] In some embodiments, the rendered content may be presented in 2D, for example, in some embodiments, one or more panels displaying virtual sensor information, status information associated with the digital twin, etc. may be presented in 2D.

[0238] In some embodiments, the MR headset may be configured to present content that represents an error condition (if detected based on the operational information) or operational status of one or more simulated components of the semiconductor manufacturing tool represented by the digital twin. For example, the MR headset may render a 3D image that represents a component based on its operational status or based on a detected error condition. Visual characteristics that may be used to indicate a detected error condition or operational status may include color, blinking, etc.

[0239] In some embodiments, the MR headset may be configured to provide an audible alert or message. For example, an audible alert (e.g., a tone, beep, etc.) or message may be provided to indicate a detected error condition or a particular operational status. As a more detailed example, an audible message may be provided to indicate a change in operational status, such as a particular airlock being pumped, a particular door being closed, etc.

[0240] In some embodiments, following block 1112, the MR headset may loop back to block 1104 and identify an updated position and / or orientation of the MR headset. The rendered content may be updated based on the updated position and / or orientation of the MR headset. In some embodiments, the rendered content may be updated without identifying position and / or orientation information of the MR headset. For example, in some embodiments, the rendered content may be updated based on a user interacting with the rendered content, such as zooming in or out of the rendered content by pinching or pulling the rendered content.

[0241] In some embodiments, at block 1112, the MR headset receives input corresponding to an operational instruction to be performed by the digital twin. Examples of operational instructions may include, but are not limited to, initiating or starting a process or a step of a process, changing the state of a component or element of the digital twin (e.g., modifying a particular airlock to switch to a venting state, closing a particular door, etc.), etc.

[0242] The input may be received via selection of a user interface element via the MR headset, for example, the user interface element may be presented within a menu of available action instructions that may be performed.

[0243] At block 1114, the MR headset sends a message to the MR control system indicating the motion command generated from the input received at block 1112. The MR control can then cause the digital twin to implement the motion command, as described below in connection with block 1160 of FIG. 11B. In some embodiments, the MR headset sends the message directly to the digital twin.

[0244] FIG. 11B illustrates an example process 1150 for providing operational information associated with a digital twin of a semiconductor manufacturing tool by an MR control system and for causing the digital twin to implement operational instructions. Note that in some embodiments, the blocks of process 1150 illustrated in FIG. 11B may be performed in various orders and, in the case of some blocks, simultaneously. Additionally, in some embodiments, one or more blocks of process 1150 may be omitted. In some embodiments, process 1150 may be performed following the establishment of a communication channel between an MR headset and an MR control system. In some embodiments, the MR control system is integrated within the digital twin.

[0245] In some embodiments, at 1152, the MR control system obtains 3D model information associated with the semiconductor manufacturing tool represented by the digital twin. In some embodiments, the 3D model information may be stored in a memory associated with the MR control system. Additionally or alternatively, in some embodiments, the MR control system may retrieve the 3D model information from a server.

[0246] In some embodiments, 1152 may be omitted. For example, if the MR headset renders one or more control panels in 2D without rendering a 3D representation of the components of the semiconductor manufacturing tool represented by the digital twin, the MR control system may not obtain the 3D model information.

[0247] In some embodiments, the MR control system transmits at least a portion of the 3D model information representing the portion of the semiconductor manufacturing tool to the MR headset at 1154. In some embodiments, the MR control system can identify the portion of the 3D model information to be transmitted based on an indication of a portion of the virtual representation of the semiconductor manufacturing tool that is within the field of view of the MR headset.

[0248] In some embodiments, 1154 may be omitted. For example, if the MR headset renders the content in 2D, the MR control system may not send 3D model information to the MR headset.

[0249] At 1156, the MR control system transmits operational information indicative of a state of the digital twin. For example, the operational information may include one or more simulated sensor values ​​associated with simulated sensors of the digital twin. As another example, the operational information may include one or more simulated positions of various simulated components or internal elements of the semiconductor manufacturing tool represented by the digital twin.

[0250] At 1158, the MR control system receives a message from the MR headset indicating an operational command to be performed by the digital twin. Examples of operational commands include initiating or starting a process or a step of a process, changing the state of a component or element of the digital twin (e.g., modifying a particular airlock to switch to a venting state, closing a particular door, etc.), etc.

[0251] At 1160, the MR control system causes a command to be sent to the digital twin, where the command changes the state of the digital twin, where the command is based on the motion instruction. For example, in some embodiments, the command may be sent over using a TCP message.

[0252] Context for Disclosed Computational Embodiments Certain embodiments disclosed herein relate to computing systems that cooperate to render control and status information associated with semiconductor manufacturing / fabrication tools in an MR environment, a VR environment, an AR environment, or a combination thereof. Such systems may also be configured to receive data and instructions, such as program code, sensor data, etc., that represent physical processes occurring during semiconductor device fabrication operations.

[0253] Many types of computing systems having any of a variety of computer architectures may be used as the disclosed system for implementing machine learning models and algorithms for generating and / or optimizing such models. For example, the system may include software components running on one or more general-purpose processors or specially designed processors such as application specific integrated circuits (ASICs) or programmable logic devices (e.g., field programmable gate arrays (FPGAs)). Furthermore, the system may be implemented on a single device or distributed across multiple devices. The functions of the computing elements may be integrated together or further divided into multiple sub-modules.

[0254] In some embodiments, the code executed during communication with various devices and / or during rendering of various contents on an appropriately programmed system may be embodied in the form of a software element that can be stored on a non-volatile storage medium (e.g., an optical disk, a flash storage device, a mobile hard disk, etc.) that includes a number of instructions for producing a computing device (e.g., a personal computer, a server, a network appliance, etc.).

[0255] At one level, software elements are implemented as a set of commands prepared by a programmer / developer. However, modular software that can be executed by computer hardware is executable code committed to memory using "machine code" selected from a specific machine instruction set, or "native instructions", designed into the hardware processor. The machine instruction set, or native instruction set, is known to the hardware processor and is essentially built into it. It is the "language" by which system and application software communicate with the hardware processor. Each native instruction is an individual piece of code that is recognized by the processing architecture and can specify a particular register for arithmetic, addressing, or control functions, a particular memory location or offset, and a particular addressing mode to be used to interpret the operands. More complex operations are constructed by combining these simple native instructions, which are executed sequentially or as directed by control flow instructions.

[0256] The interrelationship between executable software instructions and a hardware processor is structural. In other words, the instructions themselves are a series of symbols or numbers. A series of symbols or numbers does not inherently convey any information. It is the processor, pre-configured by design to interpret the symbols / numbers, that gives meaning to the instructions.

[0257] The processes and methods described herein may be configured to run on a single machine at a single location, on multiple machines at a single location, or on multiple machines at multiple locations. When multiple machines are used, the individual machines can be tailored to their particular tasks. For example, large blocks of code and / or operations requiring significant processing power may be performed on large and / or stationary machines.

[0258] Additionally, certain embodiments relate to tangible and / or non-transitory computer-readable media or computer program products that contain program instructions and / or data (including data structures) for performing various computer-implemented operations. Examples of computer-readable media include, but are not limited to, semiconductor memory devices, phase change devices, magnetic media such as disk drives, optical media such as magnetic tapes, CDs, magneto-optical media, and hardware devices specially configured to store and execute program instructions, such as read-only memory devices (ROM) and random access memories (RAM). Computer-readable media may be directly controlled by an end user, or the media may be indirectly controlled by an end user. Examples of directly controlled media include media located at a user premises and / or media that is not shared with other entities. Examples of indirectly controlled media include media that are indirectly accessible to a user via an external network and / or via a service that provides shared resources, such as the "cloud". Examples of program instructions include both machine code, such as produced by a compiler, and files containing high-level code that can be executed by a computer using an interpreter.

[0259] In various embodiments, data or information used in the disclosed methods and apparatus is provided in electronic form. Such data or information may include sensor data, parameter values, etc. As used herein, data or other information provided in electronic form is available for storage on a machine and transmission between machines. Traditionally, data in electronic form is provided digitally and may be stored as bits and / or bytes in various data structures, lists, databases, etc. Data may be embodied electronically, optically, etc.

[0260] In some embodiments, various aspects described herein can be implemented as system software. System software typically interfaces with computer hardware and associated memory. In some embodiments, system software includes operating system software and / or firmware, as well as any middleware and drivers installed on the system. System software provides basic functionality that is not task specific for a computer. In contrast, modules and other application software are used to accomplish specific tasks. Each native instruction for a module is stored in a memory device and represented by a numerical value.

[0261] An exemplary computer system 1200 is illustrated in FIG. 12. As shown, computer system 1100 includes an input / output subsystem 1202 that can implement an interface for interacting with a human user and / or other computer systems depending on the application. An embodiment of the present disclosure can be implemented in program code on system 1200 having an I / O subsystem 1202 that is used to receive input program statements and / or data from a human user (e.g., via a GUI or keyboard) and display them to the user. I / O subsystem 1202 can include, for example, a keyboard, a mouse, a graphical user interface, a touch screen, a virtual command panel, or other interface for input, and, for example, an LED or other flat screen display, or other interface for output.

[0262] Communications interface 1207 may include any suitable components or circuitry used to communicate with any suitable communications network (e.g., the Internet, an intranet, a wide area network (WAN), a local area network (LAN), a wireless network, a virtual private network (VPN), and / or any other suitable type of communications network). For example, communications interface 1207 may include network interface card circuitry, wireless communication circuitry, etc.

[0263] The program code may be stored in a non-transitory medium, such as the secondary memory 1210 or the memory 1208, or both. In some embodiments, the secondary memory 1210 may be a persistent storage device. The one or more processors 1204 read the program code from the one or more non-transitory media and execute the code to enable the computer system to accomplish the method implemented by the embodiments herein. Those skilled in the art will understand that the processor can accept source code, such as statements to perform training and / or modeling operations, and interpret or compile the source code into machine code that is understandable at the hardware gate level of the processor. The bus 1205 couples the I / O subsystem 1202, the processor 1204, the peripheral devices 1206, the communication interface 1207, the memory 1208, and the secondary memory 1210. The devices, systems, and platforms described herein (e.g., MR rendering devices (MR headsets) and MR control systems) may embody one or more elements described above.

[0264] Various computational elements, including processors, memories, instructions, routines, models, or other components, may be described or claimed as being "configured" to perform one or more tasks. In such contexts, the phrase "configured to" is used to connote structure by indicating that the component includes structure (e.g., stored instructions, circuits, etc.) that performs one or more tasks during operation. Thus, a unit / circuit / component may be said to be configured to perform a task even if the specified component is not necessarily currently operating (e.g., turned on).

[0265] An element used with the language "configured to" can refer to hardware, e.g., a circuit, a memory that stores executable program instructions to perform an operation, and the like. Additionally, "configured to" can refer to a general structure (e.g., a general circuit) that is manipulated by software and / or firmware (e.g., an FPGA, or a general-purpose processor that executes software) to operate in a manner capable of performing a described task. Additionally, "configured to" can refer to one or more memories or memory elements that store computer-executable instructions to perform a described task. Such memory elements can include memory on a computer chip that has processing logic. In some contexts, "configured to" can also include adapting a manufacturing process (e.g., a semiconductor fabrication facility) to produce a device (e.g., an integrated circuit) that is adapted to implement or perform one or more tasks.

[0266] In the description, numerous specific details have been set forth in order to provide a thorough understanding of the presented embodiments. The disclosed embodiments may be practiced without some or all of these specific details. In other instances, well-known process operations have not been described in detail so as not to unnecessarily obscure the disclosed embodiments. Although the disclosed embodiments have been described in conjunction with specific embodiments, it will be understood that the specific embodiments are not intended to limit the disclosed embodiments.

[0267] Unless otherwise indicated, the method acts and device features disclosed herein involve techniques and apparatus commonly used in metrology, semiconductor device fabrication technology, software design and programming, and statistics, which are within the skill of the art.

[0268] Unless otherwise defined herein, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art.Various scientific dictionaries, including the terms contained herein, are well known and available to those skilled in the art.Any method and material similar or equivalent to those described herein can be used in the practice or testing of the embodiments disclosed herein, but some methods and materials are described.

[0269] Numeric ranges are inclusive of the numbers defining the range. Every maximum numerical limitation given throughout this specification is intended to include every lower numerical limitation, as if such lower numerical limitation were expressly written herein. Every minimum numerical limitation given throughout this specification includes every higher numerical limitation, as if such higher numerical limitation were expressly written herein. Every numerical range given throughout this specification includes every narrower numerical range that falls within such broader numerical range, as if such narrower numerical ranges were all expressly written herein.

[0270] It should be understood that phrases such as "for each <item> of one or more <items>," "for each <item> of one or more <items>," as used herein, should be understood to include both single and multiple item groups, i.e., the phrase "for each ..." is used in the sense that it is used in programming languages ​​to refer to each item of a referenced population of items. For example, if the referenced population of items is a single item, then "each" refers only to that single item (despite the fact that dictionary definitions of "each" often define the term to refer to "one of two or more things") and does not imply that there must be at least two of those items. Similarly, the terms "set" or "subset" should not, in and of themselves, be considered as necessarily encompassing a plurality of items, and it will be understood that a set or subset can encompass only one member or multiple members (unless the context dictates otherwise).

[0271] The headings provided herein are not intended to limit the disclosure.

[0272] As used herein, the singular terms "a," "an," and "the" include plural references unless the context clearly dictates otherwise. As used herein, the term "or" refers to a non-exclusive "or" unless indicated otherwise.

Claims

1. 1. A mixed reality (MR) control platform for operating a semiconductor manufacturing tool in a MR environment and displaying data associated with the semiconductor manufacturing tool, comprising:

1. An MR control system, comprising: one or more processors; and one or more memories of the MR control system, the one or more processors being configured to, when executed, perform: acquiring sensor data representative of a sensor output from a semiconductor manufacturing tool; determining operational information associated with the semiconductor manufacturing tool and based, at least in part, on the sensor data; and in response to a wireless communication channel being established with the MR headset, transmitting the operational information associated with the semiconductor manufacturing tool to the MR headset via the wireless communication channel. an MR control system including instructions; The MR headset, wherein the MR headset includes one or more processors and one or more memories, and when executed, the one or more processors of the MR headset include: Establishing the wireless communication channel with the MR control system; receiving the operational information associated with the semiconductor manufacturing tool from the MR control system; causing an MR environment to render content associated with said motion information and one or more control features. An MR headset containing instructions; An MR control platform comprising:

2. 2. The MR control platform of claim 1, The instructions stored in the one or more memories of the MR headset, when executed, further cause the one or more processors of the MR headset to: Identifying a wireless access point associated with the MR control system and a password associated with the wireless access point; Connecting to the wireless access point using the password. The MR control platform establishes the wireless communication channel by

3. 3. The MR control platform of claim 2, The instructions stored in the one or more memories of the MR headset, when executed, further cause the one or more processors of the MR headset to: acquiring image data via a camera associated with the MR headset; Identifying a machine readable code in the image data; Decoding the machine-readable code to retrieve the encrypted information; decrypting the encrypted information using key information stored in the memory of the MR headset, the decrypted information including an identifier of the wireless access point and the password. The MR control platform identifies the wireless access point by

4. 4. An MR control platform according to claim 1, further comprising: The MR control platform, wherein the rendered content includes user interface elements that indicate sensor values ​​contained in the sensor data acquired by the MR control system.

5. 5. The MR control platform of claim 4, The instructions stored in the one or more memories of the MR headset, when executed, further cause the one or more processors of the MR headset to: receiving a user input indicating that the user interface element is to be fixed in spatial coordinates with respect to the semiconductor manufacturing tool; identifying a group of spatial coordinates within a coordinate system that is fixed with respect to the semiconductor manufacturing tool, the group of spatial coordinates indicating a boundary of the user interface element with respect to the fixed spatial coordinates; identifying a physical position and orientation of the MR headset relative to the coordinate system; modifying the presentation of the user interface elements based on the physical position and the orientation of the MR headset relative to the fixed spatial coordinates. MR control platform.

6. 4. An MR control platform according to claim 1, further comprising: The instructions stored in the one or more memories of the MR headset, when executed, further cause the one or more processors of the MR headset to identify a physical location and orientation of the MR headset, and the content is rendered based on the physical location and orientation of the MR headset.

7. 7. The MR control platform of claim 6, An MR control platform, wherein the physical position and the orientation of the MR headset is identified with respect to the semiconductor manufacturing tool.

8. 4. An MR control platform according to claim 1, further comprising: an MR control platform, wherein the operational information includes positions of one or more internal elements of the semiconductor manufacturing tool, and the rendered content includes a three-dimensional representation of the positions of the one or more internal elements of the semiconductor manufacturing tool over time, the three-dimensional representation of the positions of the one or more internal elements of the semiconductor manufacturing tool being rendered based on a physical position and orientation of the MR headset relative to the semiconductor manufacturing tool.

9. 9. The MR control platform of claim 8, The instructions stored in the one or more memories of the MR control system, when executed, further cause the one or more processors of the MR control system to transmit three-dimensional model information associated with the semiconductor manufacturing tool to the MR headset; The instructions stored in the one or more memories of the MR headset, when executed, further cause the one or more processors of the MR headset to receive and render the three-dimensional model information, wherein the three-dimensional representation of the position of the one or more internal features is rendered based on the three-dimensional model information for the semiconductor manufacturing tool. MR control platform.

10. 9. The MR control platform of claim 8, The one or more internal elements include at least one of a wafer support, a showerhead, one or more lift pins, one or more wafers, one or more slit valves, a robotic arm, an indexer, a carousel, or any combination of two or more thereof.

11. 4. An MR control platform according to claim 1, further comprising: The instructions stored in the one or more memories of the MR headset, when executed, further cause the one or more processors of the MR headset to: receiving one or more input signals associated with operational instructions for the semiconductor manufacturing tool; causing the MR control system to transmit the operation command in response to receiving the one or more input signals; The instructions stored in the one or more memories of the MR control system, when executed, further cause the one or more processors of the MR control system to: receiving the movement command from the MR headset; transmitting a command to change a state of the semiconductor manufacturing tool or a digital twin representing the semiconductor manufacturing tool via a communication interface configured to be communicatively coupled to the semiconductor manufacturing tool; MR control platform.

12. 4. An MR control platform according to claim 1, further comprising: An MR control platform, wherein the sensor data includes virtual sensor data generated by the digital twin, and the instructions stored in the memory of the MR control system cause the one or more processors of the MR control system to receive the virtual sensor data from the digital twin.

13. 13. The MR control platform of claim 12, The instructions stored in the one or more memories of the MR control system, when executed, further cause the one or more processors of the MR control system to transmit three-dimensional model information associated with the semiconductor manufacturing tool to the MR headset; The instructions stored in the one or more memories of the MR headset, when executed, further cause the one or more processors of the MR headset to render the content based on an orientation of the MR headset and the three-dimensional model information, the rendered content including content indicative of a state of the digital twin. MR control platform.

14. 14. The MR control platform of claim 13, The instructions stored in the one or more memories of the MR headset, when executed, further cause the one or more processors of the MR headset to: Identifying an updated orientation of the MR headset; updating the rendered content based on the updated orientation of the MR headset. MR control platform.

15. 2. The MR control platform of claim 1, The instructions stored in the one or more memories of the MR headset may further cause the one or more processors of the MR headset to: receiving an input indicative of second operational information associated with the semiconductor manufacturing tool, the second operational information being at least partially different from the operational information; causing a request for the second motion information to be sent to the MR control system; In response to receiving the second motion information from the MR control system, rendering second content associated with the second motion information; The instructions stored in the one or more memories of the MR control system may further cause the one or more processors of the MR control system to: receiving the request for the second operational information; In response to receiving the request, causing the second motion information to be transmitted to the MR headset. MR control platform.

16. 1. A mixed reality (MR) headset configured to control a semiconductor manufacturing tool in an MR environment, comprising: one or more processors; a display coupled to the one or more processors; One or more cameras; When executed, the one or more processors are Establishing a wireless communication channel with the MR control system of the semiconductor manufacturing tool; receiving operational information associated with the semiconductor manufacturing tool from the MR control system; causing an MR environment to render content associated with said motion information and one or more control features. one or more memories for storing computer executable instructions; An MR headset comprising:

17. 17. An MR headset as claimed in claim 16, The instructions, when executed, further cause the one or more processors to: Identifying a wireless access point associated with the MR control system and a password associated with the wireless access point; Connecting to the wireless access point using the password. the establishing of the wireless communication channel by

18. 18. An MR headset as claimed in claim 17, The instructions, when executed, further cause the one or more processors to: acquiring image data via one of the one or more cameras; Identifying a machine readable code in the image data; Decoding the machine-readable code to retrieve the encrypted information; decrypting the encrypted information using key information stored in the memory, the decrypted information including an identifier of the wireless access point and the password. The MR headset identifies the wireless access point by

19. MR headset according to any one of claims 15 to 17, The instructions, when executed, further cause the one or more processors to identify a physical position and orientation of the MR headset based on data from one or more sensors of the MR headset, and the content is rendered from a viewpoint based on the identified physical position and orientation of the MR headset.

20. An MR headset according to any one of claims 15 to 17, The instructions, when executed, further cause the one or more processors to: receiving an input indicative of second operational information associated with the semiconductor manufacturing tool, the second operational information being at least partially different from the operational information; causing a request for the second motion information to be sent to the MR control system; receiving the second motion information from the MR control system; rendering second content associated with the second motion information; MR headset.

21. 21. An MR headset as claimed in claim 20, The input indicative of the second motion information indicates a selection of a selectable input included in a menu rendered by the MR headset.

22. 21. An MR headset as claimed in claim 20, The MR headset, wherein the input indicative of the second motion information is generated based on an image capture of a machine readable code identifying the second motion information.

23. 21. An MR headset as claimed in claim 20, The MR headset, wherein the rendered content includes user interface elements presenting sensor data obtained from one or more sensors of the semiconductor manufacturing tool, the sensor data corresponding to the requested second operational information.

24. 24. An MR headset as claimed in claim 23, The instructions, when executed, further cause the one or more processors to: receiving a second input indicating that the user interface element is to be fixed in spatial coordinates with respect to the semiconductor manufacturing tool; identifying a group of spatial coordinates within a coordinate system that is fixed with respect to the semiconductor manufacturing tool, the group of spatial coordinates indicating a boundary of the user interface element with respect to the fixed spatial coordinates; identifying a physical position and orientation of the MR headset relative to the coordinate system; modifying the presentation of the user interface elements based on the physical position and the orientation of the MR headset relative to the fixed spatial coordinates. MR headset.

25. An MR headset according to any one of claims 16 to 18, The instructions, when executed, further cause the one or more processors to: receiving, as part of the operational information, three-dimensional model information associated with the semiconductor manufacturing tool; Identifying a physical location and orientation of the MR headset relative to the semiconductor manufacturing tool; Rendering a three-dimensional representation of one or more elements of the semiconductor manufacturing tool based on 1) the three-dimensional model information and 2) the physical position and orientation of the MR headset relative to the semiconductor manufacturing tool as part of the rendered content associated with the motion information in the MR environment. MR headset.

26. 26. An MR headset as claimed in claim 25, An MR headset, wherein the operational information includes positions of one or more internal elements of the semiconductor manufacturing tool over time, and the rendered content includes a representation of the positions of the one or more internal elements of the semiconductor manufacturing tool over time relative to the semiconductor manufacturing tool.

27. 27. An MR headset as claimed in claim 26, comprising: The one or more internal elements include at least one of a wafer support, a showerhead, one or more lift pins, one or more wafers, one or more slit valves, a robotic arm, an indexer, or a carousel.

28. 27. An MR headset as claimed in claim 26, comprising: The instructions, when executed, further cause the one or more processors to: generating one or more three-dimensional images representative of the one or more internal elements using the three-dimensional model information; rendering, by the MR headset, the one or more three-dimensional images based on the positions of the one or more internal features relative to the semiconductor manufacturing tool. The MR headset causes the content to be rendered by

29. An MR headset according to any one of claims 16 to 18, The instructions, when executed, further cause the one or more processors to: receiving, as part of the operational information, three-dimensional model information associated with the semiconductor manufacturing tool; rendering the content based on the three-dimensional model information, the rendered content including content indicative of a state of a component digital twin represented by the three-dimensional model information, the digital twin representing the semiconductor manufacturing tool; MR headset.

30. A mixed reality (MR) control system, comprising: one or more processors; When executed, the one or more processors are Establish a wireless communication channel with the MR headset; acquiring sensor data representative of a sensor output from a semiconductor manufacturing tool; determining operational information for the semiconductor manufacturing tool based on the sensor data; transmitting said motion information to said MR headset via said communication channel one or more memory devices for storing computer executable instructions; An MR control system comprising:

31. 31. The MR control system of claim 30, The MR control system is in communication with a digital twin, and the sensor data includes virtual sensor data obtained from the digital twin.

32. 32. An MR control system according to claim 30 or 31, comprising: The operational information includes an indication of a state of the digital twin.

33. 32. The MR control system of claim 31, The instructions further cause the one or more processors to transmit three-dimensional model information associated with at least a portion of the semiconductor manufacturing tool to the MR headset, the MR headset rendering content indicative of the state of the digital twin based on the three-dimensional model information.

34. 31. The MR control system of claim 30, The MR control system is in communication with the semiconductor manufacturing tool, and the sensor data includes sensor data obtained from one or more physical sensors of the semiconductor manufacturing tool.

35. MR control system according to any of claims 30 and 34, comprising: The operational information includes a status of the semiconductor manufacturing tool.

36. MR control system according to any of claims 30 and 34, comprising: The instructions, when executed, further cause the one or more processors to determine positions of one or more internal elements of the semiconductor manufacturing tool over time, and the operational information includes information indicative of the positions of the one or more internal elements of the semiconductor manufacturing tool over time relative to the semiconductor manufacturing tool.

37. 37. The MR control system of claim 36, The instructions, when executed, further cause the one or more processors to transmit three-dimensional model information associated with at least a portion of the semiconductor manufacturing tool including at least one of the one or more internal elements, the three-dimensional model information being used by the MR headset to render a representation of the one or more internal elements based on the three-dimensional model information.

38. MR control system according to any one of claims 30 to 34 or 37, The instructions, when executed, further cause the one or more processors to: receiving a request for second motion information from the MR headset, the second motion information being at least partially different from the motion information; transmitting the requested second motion information to the MR headset; MR control system.

39. 1. A method for controlling a semiconductor manufacturing tool via an MR session, comprising: establishing, by the MR headset, a wireless communication channel with the MR control system; acquiring, by the MR control system, sensor data representative of a sensor output from a semiconductor manufacturing tool; determining, by the MR control system, operational information associated with the semiconductor manufacturing tool and based, at least in part, on the sensor data; transmitting, in response to a wireless communication channel established by the MR control system and with an MR headset, the operational information associated with the semiconductor manufacturing tool via the communication channel to the MR headset; receiving, by the MR headset, the operational information associated with the semiconductor manufacturing tool from the MR control system; Rendering, by the MR headset, content associated with the motion information and one or more control features in an MR environment. A method comprising:

40. 40. The method of claim 39, identifying, by the MR headset, a wireless access point associated with the MR control system and a password associated with the wireless access point; connecting to the wireless access point using the password; The method further comprising:

41. 41. The method of claim 40, acquiring image data via a camera associated with the MR headset; identifying a machine readable code in the image data; decoding the machine readable code to retrieve encrypted information; decrypting the encrypted information using key information stored in a memory of the MR headset, the decrypted information including an identifier of the wireless access point and the password; The method further comprising:

42. The method according to any one of claims 39 to 41, comprising: The method, wherein the rendered content includes user interface elements that indicate sensor values ​​contained in the sensor data acquired by the MR control system.

43. 43. The method of claim 42, comprising: receiving, by the MR headset, a user input indicating that the user interface element is to be fixed in spatial coordinates with respect to the semiconductor manufacturing tool; identifying a group of spatial coordinates within a coordinate system that is fixed with respect to the semiconductor manufacturing tool, the group of spatial coordinates indicating a boundary of the user interface element with respect to the fixed spatial coordinates; Identifying a physical position and orientation of the MR headset relative to the coordinate system; modifying the presentation of the user interface elements based on the physical position and the orientation of the MR headset relative to the fixed spatial coordinates; The method further comprising:

44. The method according to any one of claims 39 to 41, comprising: The method, further comprising identifying a physical location and an orientation of the MR headset, wherein the content is rendered based on the physical location and the orientation of the MR headset.

45. 45. The method of claim 44, The method, wherein the physical position and the orientation of the MR headset is identified with respect to the semiconductor manufacturing tool.

46. The method according to any one of claims 39 to 41, comprising: the operational information includes positions of one or more internal elements of the semiconductor manufacturing tool, and the rendered content includes a three-dimensional representation of the positions of the one or more internal elements of the semiconductor manufacturing tool over time, and the three-dimensional representation of the positions of the one or more internal elements of the semiconductor manufacturing tool is rendered based on a physical position and orientation of the MR headset relative to the semiconductor manufacturing tool.

47. 47. The method of claim 46, transmitting, by the MR control system, three-dimensional model information associated with the semiconductor manufacturing tool as part of the operational information; receiving, by the MR headset, the three-dimensional model information, wherein the three-dimensional representation of the position of the one or more internal features is rendered based on the three-dimensional model information for the semiconductor manufacturing tool; The method further comprising:

48. 47. The method of claim 46, The method, wherein the one or more internal components include at least one of a wafer support, a showerhead, one or more lift pins, one or more wafers, one or more slit valves, a robotic arm, an indexer, or a carousel.

49. The method according to any one of claims 39 to 41, comprising: receiving, by the MR headset, one or more input signals associated with operational commands for the semiconductor conductor manufacturing tool; transmitting the operation command to the MR control system in response to receiving the one or more input signals; receiving, by the MR control system, the motion command from the MR headset; sending, by the MR control system, a command to change a state of the semiconductor manufacturing tool or a digital twin representing the semiconductor manufacturing tool via a communication interface configured to be communicatively coupled to the semiconductor manufacturing tool; The method further comprising:

50. The method according to any one of claims 39 to 41, comprising: The method, wherein the sensor data includes virtual sensor data generated by the digital twin, and the instructions stored in the memory of the MR control system cause one or more processors of the MR control system to receive the virtual sensor data from the digital twin.

51. 51. The method of claim 50, transmitting, by the MR control system, three-dimensional model information associated with the semiconductor manufacturing tool to the MR headset; causing the MR headset to render the content based on an orientation of the MR headset and the three-dimensional model information, the rendered content including content indicative of a state of the digital twin; The method further comprising:

52. 52. The method of claim 51 , Identifying an updated orientation of the MR headset; updating the rendered content based on the updated orientation of the MR headset; The method further comprising:

53. 40. The method of claim 39, receiving, by the MR headset, an input indicative of second operational information associated with the semiconductor manufacturing tool, the second operational information being at least partially different from the operational information; transmitting, by the MR headset, a request for the second motion information to the MR control system; receiving, by the MR control system, the request for the second motion information; transmitting, by the MR control system, the second motion information to the MR headset in response to receiving the request; rendering, by the MR headset, second content associated with the second motion information in response to receiving the second motion information from the MR control system; The method further comprising:

54. 1. One or more non-transitory computer-readable media comprising instructions that, when executed by one or more processors, cause the one or more processors to perform a method for controlling a semiconductor manufacturing tool via an MR session, the method comprising: establishing, by the MR headset, a wireless communication channel with the MR control system; acquiring, by the MR control system, sensor data representative of a sensor output from a semiconductor manufacturing tool; determining, by the MR control system, operational information associated with the semiconductor manufacturing tool and based, at least in part, on the sensor data; transmitting, in response to a wireless communication channel established by the MR control system and with an MR headset, the operational information associated with the semiconductor manufacturing tool via the communication channel to the MR headset; receiving, by the MR headset, the operational information associated with the semiconductor manufacturing tool from the MR control system; Rendering, by the MR headset, content associated with the motion information and one or more control features in an MR environment. [0023] In one or more non-transitory computer readable media,

55. 55. The one or more non-transitory computer-readable media of claim 54, the method comprising: identifying, by the MR headset, a wireless access point associated with the MR control system and a password associated with the wireless access point; connecting to the wireless access point using the password; [0023] 3. The method of claim 1, further comprising:

56. 56. The one or more non-transitory computer-readable media of claim 55, the method comprising: acquiring image data via a camera associated with the MR headset; identifying a machine readable code in the image data; decoding the machine readable code to retrieve encrypted information; decrypting the encrypted information using key information stored in a memory of the MR headset, the decrypted information including an identifier of the wireless access point and the password; [0023] 3. The method of claim 1, further comprising:

57. One or more non-transitory computer readable media according to any one of claims 54 to 56, comprising: One or more non-transitory computer-readable media, wherein the rendered content includes user interface elements that indicate sensor values ​​contained in the sensor data acquired by the MR control system.

58. 58. The one or more non-transitory computer-readable media of claim 57, the method comprising: receiving, by the MR headset, a user input indicating that the user interface element is to be fixed in spatial coordinates with respect to the semiconductor manufacturing tool; identifying a group of spatial coordinates within a coordinate system that is fixed with respect to the semiconductor manufacturing tool, the group of spatial coordinates indicating a boundary of the user interface element with respect to the fixed spatial coordinates; Identifying a physical position and orientation of the MR headset relative to the coordinate system; modifying the presentation of the user interface elements based on the physical position and the orientation of the MR headset relative to the fixed spatial coordinates; [0023] 3. The method of claim 1, further comprising:

59. 57. The one or more non-transitory computer readable media of any one of claims 54 to 56, wherein the method further includes identifying a physical location and orientation of the MR headset, and wherein the content is rendered based on the physical location and orientation of the MR headset.

60. 60. The one or more non-transitory computer readable media of claim 59, One or more non-transitory computer readable media, wherein the physical location and the orientation of the MR headset are identified with respect to the semiconductor manufacturing tool.

61. One or more non-transitory computer readable media according to any one of claims 54 to 56, comprising: one or more non-transitory computer-readable media, wherein the operational information includes positions of one or more internal elements of the semiconductor manufacturing tool, and the rendered content includes a three-dimensional representation of the positions of the one or more internal elements of the semiconductor manufacturing tool over time, the three-dimensional representation of the positions of the one or more internal elements of the semiconductor manufacturing tool being rendered based on a physical position and orientation of the MR headset relative to the semiconductor manufacturing tool.

62. 62. The one or more non-transitory computer-readable media of claim 61, the method comprising: transmitting, by the MR control system, three-dimensional model information associated with the semiconductor manufacturing tool as part of the operational information; receiving, by the MR headset, the three-dimensional model information, wherein the three-dimensional representation of the position of the one or more internal features is rendered based on the three-dimensional model information for the semiconductor manufacturing tool; [0023] 3. The method of claim 1, further comprising:

63. 62. The one or more non-transitory computer readable media of claim 61, The one or more internal components include at least one of a wafer support, a showerhead, one or more lift pins, one or more wafers, one or more slit valves, a robotic arm, an indexer, or a carousel.

64. 57. One or more non-transitory computer readable media according to any one of claims 54 to 56, wherein the method comprises: receiving, by the MR headset, one or more input signals associated with operational commands for the semiconductor conductor manufacturing tool; transmitting the operation command to the MR control system in response to receiving the one or more input signals; receiving, by the MR control system, the motion command from the MR headset; sending, by the MR control system, a command to change a state of the semiconductor manufacturing tool or a digital twin representing the semiconductor manufacturing tool via a communication interface configured to be communicatively coupled to the semiconductor manufacturing tool; [0023] 3. The method of claim 1, further comprising:

65. One or more non-transitory computer readable media according to any one of claims 54 to 56, comprising: One or more non-transitory computer-readable media, wherein the sensor data includes virtual sensor data generated by the digital twin, and the instructions stored in the memory of the MR control system cause the one or more processors of the MR control system to receive the virtual sensor data from the digital twin.

66. 66. The one or more non-transitory computer readable media of claim 65, the method comprising: transmitting, by the MR control system, three-dimensional model information associated with the semiconductor manufacturing tool to the MR headset; causing the MR headset to render the content based on an orientation of the MR headset and the three-dimensional model information, the rendered content including content indicative of a state of the digital twin; [0023] 3. The method of claim 1, further comprising:

67. 67. The one or more non-transitory computer readable media of claim 66, the method comprising: Identifying an updated orientation of the MR headset; updating the rendered content based on the updated orientation of the MR headset; [0023] 3. The method of claim 1, further comprising:

68. 55. The one or more non-transitory computer-readable media of claim 54, the method comprising: receiving, by the MR headset, an input indicative of second operational information associated with the semiconductor manufacturing tool, the second operational information being at least partially different from the operational information; transmitting, by the MR headset, a request for the second motion information to the MR control system; receiving, by the MR control system, the request for the second motion information; transmitting, by the MR control system, the second motion information to the MR headset in response to receiving the request; rendering, by the MR headset, second content associated with the second motion information in response to receiving the second motion information from the MR control system; [0023] 3. The method of claim 1, further comprising:

Images