Illuminated and weighted cards

Abstract

The light-emitting and weighted card includes a metal member and a non-conductive surrounding member having an opening, the metal member being disposed within the opening, the metal member and the surrounding member forming at least a portion of an inlay. The card further includes first and second conductive contact rails on one side of the metal member, isolated from each other without contacting the metal member, for receiving an electrical signal, and a light-emitting patch on the first side of the metal member, electrically connecting with the first and second contact rails, for emitting light upon receiving an electrical signal at the first and second contact rails, without contacting the metal member. The card may include at least one antenna for receiving a contactless signal.

Description

Technical Field

[0001] This international application claims the benefit of priority of U.S. Provisional Patent Application No. 63 / 195,753, filed Jun. 2, 2021, with the title “Illuminable Metal Card,” and the entire disclosure thereof is incorporated herein by reference for all purposes. This patent application incorporates by reference in its entirety PCT Application No. PCT / US2018 / 065015, filed Dec. 11, 2018, and U.S. Patent No. 10,032,099, issued Jul. 24, 2018.

Background Art

[0002] Single panel cards, and in particular cards having a size suitable for quick insertion into and removal from a wallet or purse, are utilized for a wide variety of purposes. For example, this type of card may take the form of collector cards, access cards, identification cards, loyalty cards, membership cards, transportation cards, and transaction cards (e.g., credit cards, debit cards, and gift cards). This type of card is often associated with a particular financial institution and / or a particular merchant of goods and / or services that issues or promotes the distribution / use of this type of card. In turn, this type of card often includes distinguishable and / or functional features that are unique to or associated with the corresponding merchant and / or financial institution, thereby enhancing brand recognition and goodwill by consumers with respect to the merchant and / or financial institution.

[0003] In an attempt to distinguish one card from another, multiple cards having some or one or more of the above-described features have increasingly incorporated unique features (features, some features). However, some features of this type often involve a significant additional cost of card production, thereby suppressing the spread of implementation. For example, the implementation (implementation, implementation on a card, realization, attachment, etc.) of some features of this type may involve a certain degree of customization, and that degree of customization is relatively small or limited by cost-conscious financial institutions and merchants or, rather, too expensive for extensive card circulation activities. Furthermore, the incorporation of such unique features often achieves only one of two opposing purposes, namely, card differentiation in terms of discernibility (discernible, distinguishable, in terms of visual distinctiveness, in terms of the visual aspect, in terms of the appearance, etc.) or card differentiation in terms of functionality. SUMMARY OF THE INVENTION

[0004] The present disclosure includes some embodiments (embodiments, aspects in which the above disclosure is embodied, etc.) of improved cards and manufacturing methods, and these embodiments facilitate the combined implementation of unique visual / functional illumination features (illumination features, features for performing illumination, features for electrical decoration, etc.) and weighting features (weighting features, features for weighting a card, features for giving a card weight, features for adding weight to a card, etc.), while at the same time achieving both card customization and high manufacturing efficiency of the card.

[0005] In some embodiments, the improved card includes a metal member having a weight that is at least 40% of the total weight of the card, and a non-conductive surround member having an opening with the metal member disposed within the opening. The metal member and the surround member may form at least a portion of an inlay. Conductive first and second contact rails are positioned side-by-side with a gap therebetween on a first side of the metal member for receiving electrical signals and may be electrically insulated from the metal member. Further, illuminable patches may be electrically coupled to the first and second contact rails on the first side of the metal member and insulated from the metal member for emitting light when receiving an electrical signal at the first and second contact rails. At least a portion of such illumination may be visible on a first side of the card and / or along one or more circumferential edges of the card.

[0006] The card may further include a first antenna (e.g., at least one or a plurality of conductive metal loops), and the first antenna is electrically insulated from the metal member and is electrically interconnected to different ones of the first and second contact rails at a plurality of offset locations (offset locations thereof, a plurality of offset locations of the first antenna, a plurality of mutually displaced positions of the first antenna, etc.) in order to receive a non-contact signal and provide a first electrical signal (e.g., an alternating current signal) to the first and second contact rails in response to the non-contact signal. The non-contact signal may include a radio frequency electromagnetic wave signal.

[0007] In some exemplary implementations, the card may further include a non-conductive first core layer positioned (located, arranged, etc.) on the side of the first surface of the metal member and overlying the first and second contact rails and the light-emitting patch, and a non-conductive second core layer positioned (located, arranged, etc.) on the side of the second surface of the metal member opposite to the first surface of the metal member. In some arrangements, the first core layer may be light-transmissive (e.g., transparent, translucent), in which case the light emitted from the light-emitting patch is visible from the first surface of the card. The first core layer and / or the second core layer may have a corresponding first printing (printing, printing result) printed on the first core layer and / or a corresponding second printing (printing, printing result) printed on the second core layer.

[0008] In some specific examples, the card may further include a mask, which overlays (such as overlying, covering from above, etc.) at least a part of the light-emitting pads, and when the light-emitting patch emits light, a predetermined visible image (such as visible, recognizable) is formed on the side of the first side of the card. Here, the mask may have a configuration that blocks the transmission of the first part of the light emitted by the light-emitting patch and also blocks the transmission of the second part of the light emitted by the light-emitting patch. For example, the predetermined visible image may correspond to a name, logo, character, graphics or other visual representation associated with or selected by a specific entity. Optionally, the mask may be formed as part of the first printed matter printed on the first core layer.

[0009] In some contemplated specific examples, the first and second contact rails may be interconnected in a state of being supported by a non-conductive first carrier layer (such as a first communication layer, a first support layer, etc.) positioned between the metal member and the first core layer on the side of the first surface of the metal member. Optionally, the first and second contact rails each have a corresponding length dimension that is longer than the maximum cross-dimension of the light-emitting patch (such as the maximum value of the dimensions of the portion of the light-emitting patch traversed by each contact rail), thereby allowing the light-emitting patch to be arranged in a series of multiple positions (such as a continuum of positions, a series consisting of multiple positions that can be continuously selected rather than discretely, a series consisting of multiple positions arranged along the contact rails between the first and second contact rails and including any position) along the contact rails between the first and second contact rails during the manufacturing process. Here, the opposing edge portions of the first and second contact rails may each have a corresponding length in a first dimension that is longer than the maximum cross-dimension of the light-emitting patch in the first dimension.Furthermore, the opposing edge portions of the first and second contact rails may extend in a state where they coincide with each other and / or at equal intervals along the lengths (such as lengths, length dimensions, etc.) of the corresponding rails. For example, the opposing edge portions of the first and second contact rails may extend in a state where they are substantially parallel to each other along the lengths (such as lengths, length directions, etc.) of the corresponding rails.

[0010] In one approach, a rectangular card may be provided. In this case, the opposing edge portions of the first and second contact rails may extend parallel to a peripheral edge (such as an outer peripheral edge, a certain edge on the outer periphery, a certain side on the outer periphery, at least one edge of the outer periphery, a lengthwise edge or a widthwise edge, etc.) of the card. For example, the opposing edge portions of the first and second contact rails may extend in a state where they are parallel to an edge extending in the length direction or the width direction of the card, thereby enabling the light-emitting patches to be arranged at a plurality of different positions arranged along the length (such as length, length direction, etc.) or width (such as width, width direction, etc.) of the card.

[0011] In some embodiments, the first and second contact rails may each have a corresponding width that is substantially constant along the corresponding length (such as length, length direction, length dimension, etc.). In one approach, the first and second contact rails may each have the same width along the corresponding length. Furthermore, the first and second contact rails may each have substantially the same corresponding length.

[0012] In some specific examples, the card may be provided as a contactless chip card for performing a contactless interface with a contactless chip card reader (for example, for the purpose of a transaction card). In this case, the card has an integrated circuit (IC) chip module, and the integrated circuit (IC) chip module is positioned (such as located, arranged, etc.) in a pocket extending through the first core layer and is interconnected with the substrate while being supported by the substrate, and has an integrated circuit (IC) chip. In some specific examples of this type, the first antenna may be electrically interconnected at a plurality of first offset locations (such as first offset locations thereof, a plurality of first offset locations among the first antennas, etc.) to the first and second contact rails via different ones of a first pair of connection lines formed of a pair of conductive connection lines. Also, a second pair of connection lines formed of a pair of conductive connection lines may be electrically connected to different ones of a first pair of electrical contact portions (such as electrical contacts, electrical joints, etc.) among the plurality of electrical contact portions of the integrated circuit chip to provide the first electrical signal to the integrated circuit chip, and may be electrically interconnected at a plurality of second offset locations among the first antennas. In some arrangements of this type, the first electrical signal may be used for both the emission of light from the light-emitting patch and the operation of the integrated circuit chip, including transmitting a non-contact signal from the card to the contactless chip card reader using the first antenna.

[0013] In some embodiments, the card may be provided as a dual interface chip card due to the added contact interface functionality that uses a chip card reader (e.g., for use as a transaction card). In this case, the IC chip module further includes a plurality of contact plates interconnected to the substrate's outer surface to receive a second electrical signal as a contact signal (e.g., a DC signal). The plurality of contact plates are electrically interconnected to a corresponding plurality of contacts (contacts, joints, etc.) supported by the substrate's inner surface via the substrate, and may be electrically interconnected to different ones of the plurality of electrical contacts (electrical contacts, electrical joints, etc.) of the integrated circuit chip. The IC chip module may further have a pair of contact pads interconnected to the substrate's inner surface. The pair of contact pads may be electrically interconnected to different ones of a pair of second electrical contact parts that are a different pair from the first pair of electrical contact parts of the plurality of electrical contact parts of the integrated circuit chip and are a pair of different ones of the plurality of contacts (the plurality of joints, etc.) for providing the second electrical signal to the first and second contact rails. In some arrangements of this type, the second electrical signal may be used for both the emission of the light emitting patch and the operation of the integrated circuit chip, including transmitting a contact signal from the card to a contact chip card reader using the IC chip module.

[0014] In connection with such a plurality of specific examples, each of the first connection line pairs that electrically interconnect the first antenna to different ones of the first and second contact rails may have an in-line capacitor (in-line, series-connected in a circuit, etc.) to insulate the first antenna from the second electrical signal (e.g., a DC signal of a contact signal, a DC signal that is a non-contact signal, etc.). Further, at least one or both of the third connection line pairs that electrically interconnect the pair of contact pads of the IC chip module to different ones of the first and second contact rails may have an in-line diode (in-line, series-connected in a circuit, etc.) to insulate the IC chip module from the first energy signal (the first electrical signal, etc.) (e.g., an AC signal from a non-contact signal, an AC signal generated from a non-contact signal, etc.).

[0015] In the first antenna approach (such as the first approach or method regarding the arrangement and configuration of the antenna), the first antenna may be interconnected to the first surface of the first carrier layer while being supported by the inward-facing first surface of the first carrier layer and in a non-overlapping relation (in non-overlapping relation, having a non-overlapping positional relationship, etc.) with the metal member. Also, the first and second contact rails and the first and second connection line pairs may be interconnected to each other while being supported by the first surface of the first carrier layer. Thus (In turn, in this case), each connection line of the third connection line pair has a corresponding first portion that is interconnected to the first surface of the first carrier layer while being supported by the first surface of the first carrier layer, a corresponding bridge that extends through the first carrier layer, and a corresponding second portion that is interconnected to the second surface of the first carrier layer using a corresponding metal pad while being supported by the outward-facing second surface of the first carrier layer. The metal pad is connected to the second surface of the first carrier layer and may be positioned (located, arranged, etc.) in a state of contacting a different corresponding one of the said pair of contact pads of the IC chip module. In the latter case, the metal pads (the metal pads, some of the above, or one or more metal pads, etc.) may be at least partially embedded.

[0016] The first antenna, the first and second contact rails, the first connection line pair, the second connection line pair, and the third connection line pair may be formed by metallization (metal coating, metal thin film formation, conductor thin film formation, etc.), printed conductive ink, and / or combinations thereof. For example, the first antenna, the first and second contact rails, the first connection line pair, the second connection line pair, and the third connection line pair may be formed of aluminum and / or copper that has been plated and etched.

[0017] In connection with the first antenna approach, the light emitting patch may be interconnected and supported in a state where it is supported by a non-conductive second carrier layer (second communication layer, second support layer, etc.) located between the metal member and the first carrier layer on the side of the first surface of the metal member. The first and second contact rails and the light emitting patch are arranged in a face-to-face relation between the first carrier layer and the second carrier layer. For example, the light emitting patch and a pair of electric contacts (a pair of electrical contact portions, etc.) may be printed on the second carrier layer. In this case, different ones of the pair of electric contacts are positioned to separately contact different ones of the first and second contact rails for passing an electrical signal.

[0018] Optionally, a phosphorescent (the property of a substance that absorbs light and re-emits that light, such as photoluminescence, phosphorescence that emits visible light, fluorescence, energy storage luminescence, etc.) patch may be provided in an overlapping state with the light-emitting patch such that when the light-emitting patch emits light, it fluoresces (fluoresce, the property of a substance that absorbs light and re-emits that light, emits fluorescence, etc.). The phosphorescent patch may have a configuration mode that is substantially the same as the configuration mode of the light-emitting patch. In one approach, the phosphorescent patch may be interconnected with the second carrier layer in a state where it is supported by the second carrier layer on the same side as the light-emitting patch (e.g., in a state of directly covering the light-emitting patch from below (in direct underlying relation to)). In another approach, the phosphorescent patch may be interconnected with the second carrier layer in a state where it is supported by the opposing side of the second carrier layer (the opposing side of the second carrier layer in the former approach, i.e., the side opposite to the side of the second carrier layer where the phosphorescent patch is interconnected in the former approach, etc.).

[0019] In some specific examples, the card may have a translucent layer (for example, a translucent, polymer-based material containing an acrylic polymer, a polycarbonate polymer, or the like), and the translucent layer is positioned in an overlapping state with the light-emitting patch and has at least a portion extending to a peripheral edge of the card (a peripheral edge, a periphery that is an edge of the entire outer periphery, an edge on the outer periphery, a side on the outer periphery, at least one edge of the outer periphery, etc.). Therefore (In turn, in this case), a part of the light emitted by the light-emitting patch is internally reflected in the translucent layer and travels toward the peripheral edge of the card, thereby illuminating the peripheral edge and providing a distinctive (distinctive, distinguishable from other cards, differential, etc.) feature to the card. In one approach, the translucent layer may have a sheet-like layer that extends to the peripheral edge of the card and extends circumferentially along the entire peripheral edge thereof. For example, when a quadrilateral light-emitting card is provided, when the light-emitting patch emits light, each of the plurality of lengthwise edges and the plurality of widthwise edges may be illuminated by the translucent layer. Optionally, the translucent layer may contain a phosphorescent pigment (pigment, colorant, etc.) or dye. In various specific examples, the first carrier layer and / or the second carrier layer may be translucent to provide the translucent layer.

[0020] Relating to some specific examples of the second antenna approach (such as the second approach or method regarding the arrangement and configuration of the antenna), the light-emitting patch and the first and second contact rails may be interconnected while being supported by the first carrier layer. Also, the first antenna may be interconnected while being supported by a non-conductive second carrier layer disposed between the metal member and the second core layer (such as the second carrier layer) on the side of the second surface of the metal member. In this case, the first antenna is disposed in a state of not overlapping with the metal member. Therefore (In turn, in this case), the first connection line pair may extend along the metal member in a state of being electrically insulated from the metal member (extend around the metal member, extend along the surface of the metal member, extend along the outer periphery of the metal member, extend so as to surround the metal member, etc.) or extend through the metal member.

[0021] Relating to some specific examples of the second approach (the second approach regarding the arrangement and configuration of the antenna, etc.), the first and second carrier layers are a non-conductive substrate that is a single continuum and is folded around a peripheral edge portion of the metal member (folded around a peripheral edge portion, folded so as to wrap around the peripheral edge portion, folded so as to sandwich the peripheral edge portion, folded along the peripheral edge portion, folded with the peripheral edge portion as a bending portion, etc.), and may be formed by corresponding first and second portions. Thus (In turn, in this case), the light-emitting patch, the first and second contact rails, the first portion of the first connection line pair, and the second connection line pair may be mutually connected in a state supported by the first surface of the substrate within the first portion of the substrate, and the first antenna and the second portion of the first connection line pair may be mutually connected in a state supported by the same first side (the same first side as the above-mentioned first surface (inner-facing surface), in the state before folding of the substrate, a plurality of components are mounted on one of the two surfaces of the substrate, etc.) of the substrate within the second portion of the substrate.

[0022] The first antenna, the first and second contact rails, the first connection line pair, and the second connection line pair may be formed by metallization (such as metal coating, metal thin film formation, conductor thin film formation, etc.), printed conductive ink, and / or combinations thereof. For example, the first antenna, the first and second contact rails, the first connection line pair, and the second connection line pair may be formed of aluminum and / or copper that has been plated and etched. For example, the light emitting patch and the pair of electrical connection portions may be printed on the first carrier layer, in which case different ones of the pair of electrical contact portions are positioned in a state of being in overlying contact with different ones of the first and second contact rails (such as in a face contact state).

[0023] In some specific examples of the second approach (the second approach regarding the arrangement and configuration of the antenna, etc.), the first carrier layer is interconnected with at least the first and second contact rails and the light-emitting patch being supported by the first carrier layer, and the second carrier layer is interconnected with at least the first antenna being supported by the second carrier layer. Both the first and second carrier layers are disposed within the opening of the surrounding member, thereby forming some other portions of the inlay. In this regard, the inlay may further have first and second cover layers that extend to cover the entire first and second sides of the inlay that face each other in order to facilitate single piece handling of the inlay (handling the inlay as an integrated whole of multiple components rather than handling the inlay with multiple components existing separately, etc.) prior to the manufacture of the card. In the latter case, the inlay and the first and second core layers may be laminated together with some other optional, or one or more, layers to provide the card.

[0024] In some embodiments, the card may be provided as a contactless chip card (e.g., for use as a transaction card) to perform a contactless interface with a contactless chip card reader. In this case, the card has an integrated circuit (IC) chip module (e.g., an integrated circuit (IC) chip interconnected and supported by the inward-facing surface of a substrate), and the integrated circuit (IC) chip module is positioned (located, arranged, etc.) within a pocket extending through the first core layer. In this case, the first antenna is electrically interconnected to the first and second contact rails via different ones of a first pair of connection line pairs, which are a pair of conductive connection lines, at a plurality of offset locations (offset locations thereof, a plurality of offset locations of the first antenna, etc.) to provide the first energy signal to the first and second contact rails. Also, in this case, the first antenna is not electrically connected to the IC chip of the integrated circuit (IC) chip module. In some examples of this type, the card may further have a second antenna that is electrically insulated from the metal member to receive a contact signal and provide a second electrical signal to the integrated circuit chip in response to the contact signal. For the same purpose, the card may have a second pair of connection line pairs, which are a pair of conductive connection lines, electrically interconnected at a plurality of offset locations of the second antenna to electrically couple different ones of a first pair of electrical contact pairs, which are a first pair of electrical contacts of a plurality of electrical contacts (electrical contacts, electrical joints, etc.) of the integrated circuit chip, to provide the second electrical signal to the integrated circuit chip (e.g., by direct contact or inductive coupling (inductive coupling, inductive coupling, inductive coupling, etc.)).In some arrangements of this kind, the first electrical signal may be used for the emission of light from the light-emitting patch, and the second electrical signal may be used for the operation of the integrated circuit chip, including transmitting a non-contact signal from the card to the non-contact chip-card reader using the second antenna.

[0025] In some two antenna implementations (such as implementations related to arrangements and configurations using two antennas), the card may be provided as a dual interface chip card due to the added contact interface function that uses a chip card reader (for example, for the purpose of a transaction card). In this case, the IC chip module further includes a plurality of contact plates that are interconnected to each other in a state supported by the outward-facing surface of the substrate for receiving a third electrical signal as a contact signal (for example, a DC signal). The plurality of contact plates are electrically interconnected to a corresponding plurality of contacts (such as contacts) that are interconnected to each other in a state supported by the inward-facing surface of the substrate via the substrate, and may be electrically interconnected to different ones among the plurality of electrical contacts of the IC chip. The IC chip module further includes a pair of contact pads that are interconnected to each other in a state supported by the inward-facing surface of the substrate, and are electrically interconnected to different ones among different ones of a pair of second electrical contact pairs that are different from the first electrical contact pair among the plurality of electrical contacts of the integrated circuit chip, and are electrically interconnected to different ones among different ones of one pair of them. In this case, different ones among the pair of contact pads are electrically interconnected to different ones among the first and second contact rails to provide the third electrical signal to the first and second contact rails.In some arrangements of this kind, the third electrical signal may be used for both the emission of light from the light-emitting patch and the operation of the integrated circuit chip, including transmitting a contact signal from the card to the contact-type chip card reader using the IC chip module.

[0026] In connection with some specific examples of such a two-antenna system, one or both of the first connection line pairs that electrically interconnect the first antenna to different ones of the first and second contact rails may have in-line capacitors to isolate the first antenna from the second electrical signal (e.g., the DC signal of the contact signal). Further, one or both of the third connection line pairs that electrically interconnect a pair of contact pads of the IC chip module to different ones of the first and second contact rails may have in-line diodes to isolate the IC chip from the first energy signal (first electrical signal, etc.) (e.g., the AC signal from the contactless signal).

[0027] In the first antenna approach (such as the first approach or method regarding the arrangement and configuration of the antenna), the first antenna is interconnected to the first surface of the first carrier layer while being supported by the inward first surface of the first carrier layer and without overlapping with the metal member. Also, the second antenna may be interconnected to it while being supported by the surrounding member without overlapping with the metal member (for example, the second antenna may have a wire at least partially embedded in the surrounding member). The first and second contact rails and the first and second connection line pairs may further be interconnected to the first surface of the first carrier layer while being supported by the first surface of the first carrier layer. Thus (In turn, in this case), each connection line of the third connection line pair includes a corresponding first portion that is interconnected to the first surface of the first carrier layer while being supported by the first surface of the first carrier layer, a corresponding bridge that extends through the first carrier layer, and a corresponding second portion that is supported by the outward second surface of the first carrier layer and interconnected to the second surface using a corresponding metal pad. The metal pad is connected to the second surface of the first carrier layer and is arranged in contact with a different corresponding one of the said pair of contact pads of the IC chip module. In the latter case, the metal pad may be at least partially embedded in the second surface of the first carrier layer.

[0028] The first antenna, the first and second contact rails, the first connection line pair, the second connection line pair, and the third connection line pair may be formed by metallization (such as metal coating, metal thin film formation, conductor thin film formation, etc.), printed conductive ink, and / or combinations thereof. For example, the first antenna, the first and second contact rails, the first connection line pair, the second connection line pair, and the third connection line pair may be formed of aluminum and / or copper that has been plated and etched.

[0029] In relation to the first antenna approach, the light emitting patch may be interconnected to the metal member in a state of being supported by a non-conductive second carrier layer positioned between the metal member and the first carrier layer on the side of the first surface of the metal member (such as on, above, etc.). In this case, the first and second contact rails and the light emitting patch are arranged in a face-to-face relation between the first carrier layer and the second carrier layer. For example, the light emitting patch and a pair of electric contacts (such as a pair of electrical contact portions, etc.) may be printed on the second carrier layer. In this case, different ones of the pair of electric contacts are positioned (such as located, arranged, etc.) for the purpose of separately contacting different ones of the first and second contact rails to allow an electrical signal to pass through.

[0030] In the second antenna approach (such as the second approach or method regarding the arrangement and configuration of the antenna), the light-emitting patch and the first and second contact rails may be interconnected while being supported by the first carrier layer. Also, the first antenna and the second antenna may be interconnected while being supported by a non-conductive second carrier layer disposed between the metal member and the second core layer (the second carrier layer, etc.) on the side of the second surface of the metal member (on, above, etc.). Accordingly (In turn, in this case), the first connection line pair may extend along the metal member (extend around the metal member, extend so as to wrap the metal member, extend along the outer periphery of the metal member, etc.) or extend through the metal member while being electrically insulated from the metal member.

[0031] Relating to some specific examples of the second approach (the second approach regarding the arrangement and configuration of the antenna, etc.), the first and second carrier layers may be formed by a first portion and a second portion of a non-conductive substrate that is a single continuum and is folded around a peripheral edge portion of the metal member (folded around a peripheral edge portion, folded so as to wrap around the peripheral edge portion, folded so as to sandwich the peripheral edge portion, folded along the peripheral edge portion, folded with the peripheral edge portion as a bending portion, etc.). Thus (In turn, in this case), the light-emitting patch, the first and second contact rails, the first portion of the first connection line pair, and the second connection line pair may be interconnected and supported by the first surface of the substrate within the first portion of the substrate, and the first antenna and the second portion of the first connection line pair may be interconnected and supported by the same first side of the substrate within the second portion of the substrate.

[0032] The first antenna, the first and second contact rails, the first connection line pair, and the second connection line pair may be formed by metallization (metal coating, metal thin film formation, conductor thin film formation, etc.), printed conductive ink, and / or combinations thereof. For example, the first antenna, the first and second contact rails, the first connection line pair, and the second connection line pair may be formed of aluminum and / or copper that has been plated and etched. For example, the light-emitting patch and the pair of electrical connection portions may be printed on the second carrier layer, in which case, different ones of the pair of electrical contact portions are positioned in an overlying contact with different ones of the first and second contact rails.

[0033] In some specific examples of the second approach (the second approach regarding the arrangement and configuration of the antenna, etc.), the second carrier layer is arranged within the opening of the surrounding member such that at least the first and second contact rails and the light-emitting patch are interconnected by the second carrier layer and supported thereby, and the first carrier layer is connected to the surrounding member such that at least the first antenna is interconnected by the first carrier layer and supported thereby, thereby forming some other portions of the inlay. In connection with this, the inlay may further have first and second cover layers that extend to cover the entire first and second sides of the inlay that face each other in order to facilitate single piece handling of the inlay prior to the manufacture of the card. In the latter case, the inlay and the first and second core layers may be laminated together with some other optional layers to provide the card.

[0034] A card may be disclosed in a first version of the present invention. The card has an electronics layer , a layer on which electronics, i.e., a plurality of electronic components or electrical components such as a contact rail, a signal filter, a connection line, an IC chip, a light-emitting patch, a contact pad, etc. are mounted, etc. that forms a first side (first side, first side, first side, first side, etc.) and a second side (second side, second side, second side, second side, etc.) opposite to the first side, and an illuminable patch that is capable of emitting light and is configured to couple (couple, couple electrically, couple mechanically, etc.) at a plurality of positions on the side of the first side of the electronics layer and emits light in response to an electrical signal, a communications element communication element such as, which is electrically connected to the card and is configured to wirelessly receive an electrical signal, and the electrical signal received by the communications element provides power (power, electric energy, etc.) to the light-emitting patch.

[0035] In a first example of the first version, the card may further have a communications element that is electrically connected to the electronics layer and is configured to wirelessly receive electrical signals (electrical signals, at least one electrical signal, etc.), and the electrical signal received by the communications element provides power (power, electric energy, etc.) to the light-emitting patch.

[0036] In another example of the first example, the card may further include one or more signal filters that are electrically (electrically, in an electrically connected state, in an electrically communicating state, etc.) arranged between the communication element and the light-emitting patch, and configured to limit (limit, enable a specific one, etc.) the form (waveform, waveform shape, form, type, etc.) of the current transmitted between the communication element and the light-emitting patch.

[0037] In yet another example of the first example, the one or more metal members are arranged so as not to interfere with the electrical signals (electrical signals, at least one electrical signal, etc.) received by the communication element.

[0038] In a second example of the first version, the card may further include a power receiving element (power receiving element, power receiving element, power storage element, power receiving element, power storage element, etc.) that is electrically connected to the electronics layer, and one or more signal filters that are electrically (electrically, in an electrically connected state, in an electrically communicating state, etc.) arranged between the power receiving element and the light-emitting patch, and configured to limit the form (waveform, waveform shape, form, type, etc.) of the current transmitted between the power receiving element and the light-emitting patch.

[0039] In the third example of the first version, the card may further have one or more signal filters that are electrically connected to the electronics layer. In this case, the one or more signal filters limit the form (such as waveform, wave shape, form, type, etc.) of the current transmitted to, transmitted from, or transmitted through the electronics layer.

[0040] In the fourth example of the first version, the electronics layer includes first and second contact rails on the side of the first face. In this case, the first and second contact rails are configured to couple to the light-emitting patch and transmit an electrical signal to or from the light-emitting patch.

[0041] In the first variation of the fourth example, the card may further have a communication element that is electrically insulated from the one or more metal members and electrically connected to the first and second contact rails at a plurality of offset positions to receive a non-contact signal and provide the electrical signal to the first and second contact rails in response to the non-contact signal.

[0042] In the second modification of the fourth example, the card may further include a first carrier layer that forms the top most layer (the top most layer, the upper layer, the outer layer, etc.) of the card on the side of the first surface of the electronics layer, and further forms an opening in a part of the electronics layer, a second carrier layer that is formed as a layer coupled to the metal member layer on the side opposite to the electronics layer, and an integrated chip module. In this case, the integrated chip module is disposed inside the opening of the first carrier layer, electrically connected to the electronics layer, and further configured to transmit (transmit to, send out, transmit, etc.) an electrical signal to a first external device or transmit (transmit from, receive, receive, etc.) an electrical signal from a first external device. In this case, the integrated chip module may further include one or more contact plates. In this case, the plurality of contact plates (the contact plates, the one or more contact plates, etc.) are configured to electrically contact the first external device and one or more communication elements (one or more communication elements, one or more communication parts, one or more transmission elements, one or more signal transmission elements, one or more communication elements etc.) that are electrically connected to the integrated chip module. In this case, the one or more communication elements extend along the perimeter (the perimeter, the outer perimeter, etc.) of one or more of the plurality of layers and are configured to transmit a non-contact electrical signal to a second external device or transmit a non-contact electrical signal from a second external device.

[0043] In the first example of the second modification, the card may further include one or more connection lines that send the electrical signal from the plurality of contact plates (the contact plates, the one or more contact plates, etc.) or the plurality of communication elements (the communication elements, one or more communication elements, etc.) to the first and second contact rails, thereby providing power to the light-emitting patch. The plurality of connection lines (the connection lines, the one or more connection lines, etc.) may further include one or more signal filters that are electrically (electrically, in an electrically connected state, in an electrically communicating state, etc.) disposed between the plurality of contact plates (the contact plates, the one or more contact plates, etc.) and the light-emitting patch and between the plurality of communication elements (the communication elements, the one or more communication elements, etc.) and the light-emitting patch, and limit the form (waveform, waveform shape, type of DC or AC, method, format, etc.) of the electrical signal transmitted or received by the one or more communication elements, one or more contact plates or integrated chip modules.

[0044] In the second example of the second modification, the one or more metal members do not overlap with the one or more communication elements, and the first carrier layer, the second carrier layer and the electronics layers (electronics layers, a plurality of electronics layers, etc.) have the same spatial extent (coextensive, having the same spatial extent as each other, having the same epitaxy, sharing the same spatial extent, etc.).

[0045] In the fifth example of the first version, the card may further have a light-transmitting layer that is connected to the light-emitting patch and has translucency or phosphorescence (the property of a substance that absorbs light and re-emits that light, such as photoluminescence, phosphorescence, fluorescence, energy storage, etc.), and the light-transmitting layer further transmits light to a position visible from the outside of the card.

[0046] In the sixth example of the first version, the card may further have a mask that is placed in a vertically spaced relationship to the light-emitting patch and in a direction of light emission from the light-emitting patch. In this case, the mask permits or blocks the emission of light from the light-emitting patch, thereby being configured to generate an image visible from the outside.

[0047] In a first variant of the fourth example of the first version, the card may further include a carrier layer, the carrier layer being a first portion configured to couple to the electronics layer on the side of a first side (first side, first side, first side, first side surface, etc.), and on the side of a second side (second side, second side, second side, second side surface, etc.), forming an opening that penetrates the second side and reaches the electronics layer; a second portion configured to couple to the metal member layer on the side of the first surface of the second portion; and an edge forming an intersection (junction, etc.) of the first portion and the second portion and being movable such that the first surface of the first portion can be coupled to the first surface of the second portion, and may have an integrated chip module, in which case the integrated chip module is disposed inside the opening of the first portion, electrically connected to the electronics layer, and further configured to transmit an electrical signal to or receive an electrical signal from a first external device. The integrated chip module further includes one or more contact plates, the one or more contact plates (the contact plates, the one or more contact plates, etc.) being configured to electrically contact the first external device and one or more communication elements, in which case the one or more communication elements are electrically connected to the integrated chip module, and in which case the one or more communication elements extend through the edge from the second portion to the electronics layer and are configured to receive a non-contact electrical signal from or send a non-contact electrical signal to a second external device.

[0048] In one example of the first modification of the fourth example, the card may further include one or more connection lines that send the electrical signal from the plurality of contact plates (the contact plates, the one or more contact plates, etc.) or antennas (antennas, multiple antennas, etc.) to the first and second contact rails, thereby providing power to the light-emitting patch. The plurality of connection lines may further include one or more signal filters that are electrically (electrically, in an electrically connected state, in an electrically communicating state, etc.) disposed between the plurality of contact plates (the contact plates, the one or more contact plates, etc.) and the light-emitting patch and between the plurality of communication elements (the communication elements, the one or more communication elements, etc.) and the light-emitting patch. The one or more signal filters include limiting (limiting, excluding, etc.) the unwanted form (form, waveform, waveform shape, type such as DC or AC, method, format, etc.) of the electrical signal from being sent or received by the plurality of communication elements (the communication elements, the one or more communication elements, etc.), the plurality of contact plates (contact plates, the one or more contact plates, etc.) or the integrated chip module.

[0049] In another example of the above example, the one or more metal members do not overlap with the one or more communication elements. In this case, the first carrier layer, the second carrier layer, and the electronics layers (electronics layers, multiple electronics layers, etc.) have the same spatial extent (coextensive, having the same spatial extent with each other, having the same extension, etc.).

[0050] A card may be disclosed in a second version of the present invention. The card has an electronics layer (such as an electronics layer, an electronic component layer, etc.) that forms a first side (such as a first side, a first side, a first side, a first side surface, etc.) and a second side opposite to the first side, and an illuminable patch that is capable of emitting light. The illuminable patch is configured to couple (such as couple, electrically couple, mechanically couple, etc.) at a plurality of positions on the side of the first side of the electronics layer and emit light in response to an electrical signal. The card may also have a communication element that is electrically connected to the electronics layer and configured to wirelessly receive an electrical signal, and the electrical signal received by the communication element provides power (such as power, electrical energy, etc.) to the illuminable patch.

[0051] In a first example of the second version, the card may further include one or more signal filters that are electrically arranged (such as electrically connected, in an electrically connected state, in an electrically communicating state, etc.) between the communication element and the illuminable patch and are configured to limit (such as limit, enable a specific one, etc.) the form (such as waveform, waveform shape, type of DC or AC, method, form, etc.) of the current transmitted between the communication element and the illuminable patch.

[0052] In a first variant of the first example of the second version, the electronics layer may have first and second contact rails, in which case the first and second contact rails couple to the light-emitting patch on the side of the first face of the electronics layer (on, above, etc.) and transmit (transmit to, send, transmit, etc.) an electrical signal to the light-emitting patch or transmit (transmit from, receive, receive, etc.) an electrical signal from the light-emitting patch, in which case the first and second contact rails are arranged electrically (electrically, in an electrically connected state, in an electrically connected state, in a state of performing electrical communication, etc.) between the one or more signal filters and the light-emitting patch.

[0053] In the second example of the first version, the card may further have a metal member layer, in which case a part of the metal member layer includes one or more metal members for imparting rigidity or weight to the card and is configured to couple to the side of the second face of the electronics layer, and in this case, the one or more metal members (communication element, communication element, etc.) do not overlap with the communication element.

[0054] Many other features and effects of the present invention will become apparent to those skilled in the art upon consideration of the detailed description of the embodiments described below.

Brief Description of the Drawings

[0055]

Figure 1

[0056]

Figure 2A

[0057]

Figure 2B

[0058]

Figure 3A

[0059]

Figure 3B

[0060]

Figure 3C

[0061]

Figure 3D

[0062]

Figure 4A

[0063]

Figure 4B

[0064]

Figure 5

[0065]

Figure 6

[0066]

Figure 7

[0067]

Figure 8

[0068]

Figure 9

[0069]

Figure 10

DETAILED DESCRIPTION OF THE INVENTION

[0070] The following description is not intended to limit the present invention to any of the forms disclosed in this application document. Accordingly, various modifications and various changes that are commensurate with the teachings, skills, and knowledge regarding the technology related to the present invention are within the scope of the present invention. Some of the embodiments described in this application document further have the intention of explaining some aspects that are well understood as implementing the present invention, and also have the intention of enabling those skilled in the art to utilize the present invention in this kind or some other embodiments, and with various modifications necessary for specific uses or applications of the present invention.

[0071] In one example, an illuminable weighted card (such as an illuminable and weighted card, a heavy card that emits light, etc.) is disclosed. The card includes at least one weighted element or a metal element (e.g., a weighted metal member, a slug (a small lump of metal), or a frame (a framework, a structure, a support structure, etc.)). The element acts to increase both the weight and / or the aesthetic appeal of the card (e.g., adding rigidity, weight, and substantialness to the card). The card may further include a lighting assembly, which may include an illuminable element, such as a light source (a device that converts electricity into light, a device that creates light from electricity, etc.) or a patch (a recognition ticket, a visual identifier, a visual discriminator, an identification display, a small piece, etc.). The lighting assembly can be selectively activated via a remote source (e.g., a card reader). In one example, the card is configured as a "dual interface" card and can be used with both a contact reader, such as a credit card reader that physically receives or touches the card, and a non-contact reader, such as a credit card reader that exchanges information wirelessly with the card and does not require physical contact with the card.In any case, the card can receive sufficient power from the external reader to activate the light-emitting element and cause a part of the card to emit light. In some embodiments, the card may be one or more signal filters, and it is ensured that the different types of power received from a plurality of different types of readers (e.g., contact type vs. non-contact type), such as the different types of power (the different types of power, the aforementioned contact signals and non-contact signals, etc.), do not damage the light-emitting element or other features inside the card. In this way, the card can be used with a plurality of different types of external readers, and the card can still emit light without being accompanied by an increase in the thickness of the card that may prevent compliance with some standards of transaction cards or other cards.

[0072] In some embodiments, the card may be a mounting connectivity assembly (an assembly having a mounting part and a connectable part, an assembly for mounting to and having connectability with the light-emitting element, etc.), and without restructuring (restructure, remake, retrofit, etc.) the electronics carrier (the electronics carrier, the electronics carrier layer, the carrier layer, etc.) or the connectivity layer, it may have something that enables the light-emitting element to be arranged at a plurality of different positions on the main body of the card. For example, the mounting element (the mounting element, the mounting element, etc.) may be a rail or pad having connectability, which enables the light-emitting element to be arranged at a plurality of different positions and the electronics , electronic components such as the aforementioned contact rail, signal filter, connection line, IC chip, light-emitting patch, contact pad, etc. Or may have a length sufficient to enable conductively connecting to a connectivity element (the connectivity element, the connectivity device, etc.) inside the connectivity layer or some of the above. Some features of this type enable the manufacturing (manufacturing process, etc.) of the card to be a new and modified (modified, modified according to requirements, etc.) tooling (method of manufacturing, manufacturing method, etc.) that is extremely expensive and difficult to change without the need, and enables easy modification (modify, modify according to requirements, etc.) and update for different aesthetic designs with the illuminable element at different locations as the position of the light-emitting element varies.

[0073] In some other embodiments, the card may be configured to have a single connectivity , a single connection to a single EMF source, etc. ) to, for example, a connectivity element (the connectivity element, the connectivity device, etc.) that receives power and / or signals wirelessly from an external card reader. In these examples, the wirelessly transmitted power may be sufficient to activate the light-emitting element of the card.

[0074] In some embodiments, the card may include multiple layers and one or more metal members to add a desired weight or a desired stiffness to the light - emitting metal card. The one or more metal members may be disposed inside the interior of the card's structure or may be visible on its exterior, for example, along an exterior edge of the card (around an exterior edge, wrapping around the outer edge, along the entire perimeter of the outer periphery, etc.). The light - emitting card may have one or more power elements (power elements, power supply elements, etc.), for example, but not limited to, a plurality of features for transmitting and receiving signals in the form of one or more communication elements, some contact pads, or some integrated chips, and those communication elements, contact pads, or integrated chips may be configured to transmit current and signals between different features of the light - emitting metal card and some external devices. Some communication elements may include an antenna or other features sufficient to wirelessly transmit and receive electrical signals. The light - emitting metal card may further include a light - emitting patch, which is configured to generate visible light from the exterior of the card (the exterior, outer surface, etc.) and may receive power from one or more contact rails, and the one or more contact rails may be configured to allow for the light - emitting patch to be disposed at one or more of a plurality of positions. Another feature, such as a mask (coating, shield, etc.), may be configured to cause the visible light to appear in the form of an image, logo, or other visual feature.The light - emitting metal card may further include a plurality of phosphorescent or translucent layers or properties to further enhance the appearance of the card or to provide, in response to a plurality of different signals received by the card, another visual information such as a glowing patch or a glowing edge, or from the light emitted from the light - emitting patch.

[0075] Referring now to some of the drawings, FIG. 1 is a partial exploded perspective view showing an embodiment of a light - emitting metal card 1, the card 1 including a weighted member layer in the form of an inlay 10 or weighted slug, the weighted member layer including, as will be described in more detail later, a metal member 12 and conductive first and second contact rails 60a, 60b which are spaced apart from each other with a gap on the side of the first surface of the metal member 12 for receiving an electrical signal and are electrically insulated from the metal member 12, and a light - emitting patch 70 which is disposed on the side of the first surface of the metal member 12 for receiving an electrical signal at the first and second contact rails 60a, 60b and for emitting light and is electrically coupled to the first and second contact rails 60a, 60b and is electrically insulated from the metal member 12. At least a portion of this kind of illumination (illumination, light image, illumination, etc.) may be visible on the first surface of the card 1 and / or along one or more peripheral edges (one or more peripheral edges, one or more sides, one or more sides of the outer periphery, etc.) of the card 1.

[0076] Card 1 may further include a non-conductive first core layer 20 that is disposed on the side of the first surface of the metal member (such as the metal member 12) and overlies the first and second contact rails 60a, 60b and the light-emitting patch 70, and a non-conductive second core layer 30 that is disposed on the side of the second surface of the metal member 12 that is opposite to the first surface of the metal member 12. Prints 22 and 32 may be provided on the first core layer 20 and the second core layer 30, respectively, as will be described in detail later. In the illustrated embodiment, the first and second contact rails 60a, 60b and the light-emitting patch 70 are interconnected in a supported state and are disposed in a face-to-face relation between a first carrier layer 40 (for example, a layer having non-conductivity and light transmissivity) and a second carrier layer 50 (for example, a layer having non-conductivity and optionally having light transmissivity), and the first carrier layer 40 and the second carrier layer 50 are each disposed between the first core layer 20 and the metal member 12 on the side of the first surface of the metal member 12.

[0077] Card 1 may further include a mask 72, which overlays at least a portion of the light-emitting patch 70 and forms a predetermined image 74 on the side of the first surface of the card 1 when the light-emitting patch 70 emits light. The mask 72 permits the passage of and blocks the passage of different portions of the illumination to provide the predetermined image 74. For example, the predetermined visible image may be a name, logo, character, graphic, or other visual representation associated with or selected by a particular entity. Optionally, the mask may be formed as part of the printed matter 22 on top of the first core layer 20. In some applications where the overall thickness of the card 1 must be within a predetermined range, such as to comply with ISO / IEC standard 7810 or meet other customer requirements, the printed mask may be desirable to minimize the thickness of the mask 72, which may enable some other features to be more easily placed within the card than in a card having a thicker mask 72.In a plurality of cards (such as one or more cards) that may have a wider range of thicknesses, the mask 72 may instead be formed by etching, molding, engraving, or a similar manufacturing method for providing a predetermined image 74. In the illustrated embodiment, the first and second outer layers 46, 48 as protective layers may be provided in a state of overlaying the first and second core layers 20, 30, respectively.

[0078] Reference is now made to FIGS. 3A, 3B and 3C, which illustrate embodiments of a weighted member layer, i.e., a "pre-lam" (pre-laminated layer, layer before lamination, etc.) in the form of an inlay 10. The weighted member layer may be formed as a metal member layer or a similar layer sufficient to add rigidity or weight to the card. The weighted member layer may also be a stack of several other layers, for example, including graphical elements and / or personalization (customizing the card for the owner, recording and printing personal information, payment information, etc. on the card for personalization, etc.) - elements. The weighted member layer may be set for several overlamination (overlaminate, another layer laminated to cover the original layer, etc.) layers having personalization elements. As shown, the inlay 10 may include an enclosure member 14 having an opening 14a that houses a metal member 12 therein. The opening 14a and the metal member 12 may have corresponding configurations (arrangement, shape, etc.) with respect to the length and width dimensions. For example, the metal member 12 may abut within the opening 14a of the enclosure member 14, thereby facilitating positioning by press-fit. Further, in the illustrated embodiment, the enclosure member 14 (the surround member 14g 14a) And the metal member 12 may have a common thickness. As shown in FIG. 3C, the cover layers 16a, 16b may be interconnected to both opposite surfaces of the surrounding member 14 and the metal member 12 fitted therein while being supported by the both surfaces as part of the inlay 10. The inlay 10, the surrounding member 14, and the metal member 12 may be further configured such that the metal member 12 may be visible from the outer surface of the card 1. In some such examples, the surrounding member 14 and the opening 14a may be configured such that the metal member 12 can be disposed at or near the exterior edge of the card 1. In some other examples, the inlay 10 may be configured to accommodate a plurality of metal members sufficient to add an increased weight or rigidity or a metallic appearance or texture (such as feel, texture, etc.) to the card 1. In some examples where the metal member 12 extends to a position near some transceiver components of the card 1, such as the first antenna 80 described later, a ferrite material may be added to the metal member 12 as a coating or by another application method (such as another application means) to limit signal interference. In some other examples, the weight-increasing member layer may have various configuration modes (such as configuration, arrangement, shape, etc.) sufficient to enable a feature such as the metal member 12 to be directly connected to an adjacent layer. In some examples, one or more metal members have a shape that does not interfere with some communication elements such as an antenna, and are covered with an adhesive that directly adheres to some adjacent layers, such as the first carrier layer 40 or the second carrier layer 50 (the second carrier layer 30) and may be covered with an adhesive that directly adheres to the second carrier layer. In some other examples, some adjacent layers, such as the first carrier layer 40 or the second carrier layer 50 (the second carrier layer 30) may have a shape for accommodating and holding the weight member layer or some components of the weight member layer, such as the metal member 12.

[0079] A number of approaches may be utilized to provide electrical signals to the contact elements, such as the first and second contact rails 60a, 60b, in order to cause the light emitting patch 70 to emit light, including non-contact signals and / or contact signals (e.g., in cases where contact and / or non-contact card readers are used). In this regard, reference is made hereinafter to FIG. 4A showing a plan view of the inward (e.g., downward) surface of the first carrier layer 40. Some electrical signals sufficient to convey data or power to and from the light emitting patch may be effected via one or more power receiving elements. The power receiving elements may include metal contact pads 68a, 68b, an IC module 90, or some communication elements that may have some antennas such as the first antenna 80. As shown, the first antenna 80 (e.g., at least one or a plurality of conductive metal loops) as well as the first and second contact rails 60a, 60b may be interconnected to the first carrier layer 40 in a state supported by the inward surface thereof. In this case, the first antenna 80 may be interconnected to different ones of a first pair of connection lines 62a, 62b each consisting of a pair of conductive connection lines at a plurality of offset positions, and the connection lines 62a, 62b are among the first and second contact rails 60a, 60b different ones (a plurality of contact rails different from each other, etc.) are electrically interconnected, where in this case the first antenna 80 receives a non-contact signal (e.g., a radio frequency signal) and may provide a first electrical signal (e.g., an alternating current (AC) signal) to the first and second contact rails 60a, 60b in response thereto to cause the light-emitting patch 70 (shown by a virtual line) to emit light. The non-contact signal may be an electrical signal in the form of an alternating current, i.e., AC, which is defined as an electrical current that regularly changes direction.

[0080] Regarding the latter case, FIG. 4B is referred to hereinafter, which shows a plan view of the outward-facing surface (e.g., upward) of the second carrier layer 50. In this figure, the light-emitting patch 70 and the first and second contact rails 60a, 60b are interconnected in a state where the light-emitting patch 70 is supported by the second carrier layer 50 so as to perform electrical coupling (electrical connection, electrical interconnection, etc.). The first and second contact rails 60a, 60b may be configured such that the light-emitting patch 70 can be positioned at a plurality of positions arranged along the length directions of the first and second contact rails 60a, 60b. In the example shown in FIG. 4A, the light-emitting patch 70 may be arranged at any of a plurality of positions arranged along the respective lengths of the first and second contact rails 60a, 60b. That is, the light-emitting patch 70, i.e., the light-emitting element, can be connected in a conductive state (connectively, etc.) at substantially any of a plurality of positions arranged along the length directions of the contact rails 60a, 60b.

[0081] By using a card having first and second contact rails that provide multiple placement positions (such as placement positions, placement locations, etc.) for the light-emitting patch 70, the manufacturing time and cost for a given card may be reduced, and various design aspects for different customers may be more easily manufactured. Specifically, often, each layer of a card (a card, one card, etc.) may require unique (unique, sole, etc.) molding (mold, molding, etc.), printing, or manufacturing methods similar thereto, and it may be expensive to prepare multiple configuration aspects for certain specific layers, such as the first carrier layer 40, for various orders. That is, for a plurality of different card design aspects, such as a plurality of different aesthetic and graphic layers where the light-emitting patch 70 is arranged along different areas of the card, such as a plurality of horizontal and / or vertical positions relative to the surface of the card, which are different from each other, by extending the rail length and the connectivity area (connectivity, area where a connection state can be realized, area where a connection state is achievable, etc.), it becomes possible to change the placement position of the light-emitting patch 70 without changing the electrical connection positions (electrical connections) between a plurality of contact points (contact points, contact points, the counterpart with which the light-emitting patch 70 contacts, etc.) (for example, a plurality of rails) and the electronics components. According to this type of configuration aspect, further, among the plurality of layers, those excluding the layer where the light-emitting patch 70 exists (the illuminable patch 70 layer) can be prepared in a similar way to realize various design aspects.Furthermore, by diversifying the mounting features (features for attaching other components to itself, etc.), the tolerance (tolerance for the placement position of the light-emitting patch 70 on the card 1, tolerance for misalignment, degree of freedom regarding the placement position, etc.) for the placement of the light-emitting patch 70 may be forgiving (expanded, etc.) compared to positioning the light-emitting patch 70 at a single discrete position (the light-emitting patch 70 can only be placed at a single position, etc.), reducing the cost and precision required to manufacture the card 1.

[0082] With this approach, the illuminable patch 70 can be arranged at multiple positions by changing the configuration of a reduced number of layers (a subset of all layers, a number of layers less than the number that would conventionally need to be changed, etc.) to meet different customer requirements regarding design aspects. For example, by changing only the placement of the illuminable patch 70, it is possible to achieve various design aspects. The first and second contact rails 60a, 60b are in a state that is substantially parallel to the other contact rail (the one that is different from itself among the first and second contact rails 60a, 60b, the other rail, etc.). Similarly, as shown in FIG. 4A, it may be in a state that is substantially parallel to the edge (one edge, etc.) of the card 1. In some other examples, the first and second contact rails 60a, 60b may maintain a shape conformity (such as shape following, consistency, compliance, conformity, subordination, etc.) that is substantially parallel to the other rail (the one that is different from itself among the first and second contact rails 60a, 60b, the other rail, etc.), but may form various paths (such as curves, routes, orbits, one or more paths, etc.) or patterns (such as patterns, etc.) that are relative to the edge of the card 1, for example, an arcing shape (such as a curved shape, etc.). Further, the first and second contact rails 60a, 60b may each form a positive or negative contact rail such that the first contact rail 60a may correspond to a positive (such as positive electrode, positive terminal, positive charge, etc.) contact rail and the second contact rail 60b may correspond to a negative (such as negative electrode, negative terminal, negative charge, etc.) contact rail.

[0083] In some other examples, the first and second contact rails 60a, 60b may be replaced by various feature parts for signal transmission or various contact elements. The signal transmission feature parts may be configured to transmit electrical signals to and from the light emitting patch 70 in substantially the same manner, or may be configured to be physically different from each other. The signal transmission feature parts may form one or more mounting points (for mounting other parts to itself, mounting points, mounting positions, etc.) for the light emitting patch 70 at one or more positions relative to the card 1, for example, near a plurality of corners of the card 1 or at one or more other discrete (unique, discrete, etc.) positions. The plurality of mounting points may be a plurality of pairs of a plurality of connection points (electrical connection points, etc.), and are defined as having a minimum tolerance (tolerance for the position of the light emitting patch 70, etc.) sufficient to accurately position the light emitting patch 70 or a feature part larger than it in various orientations for any given one of the mounting points. In those examples, multiple layers of the card 1 may still be utilized to diversify the design aspect, but in this case, the amount of conductive material may be reduced compared to the card 1 using the first and second contact rails 60a, 60b.

[0084] In some embodiments, the light-emitting patch 70 is a substantially clear electrically-conductive layer (such as a conductive portion), and is arranged to be supported thereby on the second carrier layer 50 for electrically connecting (e.g., direct coupling (direct connection, direct bonding, direct energy transfer, etc.) or capacitive coupling (capacitive coupling, capacitive coupling, coupling using the capacitance between two points in a circuit, etc.)) with the first contact rail 60a; an intermediate layer having a plurality of light-emitting diodes arranged to be supported thereby on the conductive layer; and an electrically-conductive pad (such as a conductive portion), which is arranged to be supported thereby on the intermediate layer for electrically connecting (e.g., direct coupling or capacitive coupling (capacitive coupling, coupling using a capacitor, capacitive coupling, electrostatic coupling, etc.)) with the second contact rail 60b. In such a sense, the light-emitting patch 70 may form a circuit that passes through the conductive layer from the first contact rail 60a, through the intermediate layer, through the conductive pad, and through the second contact rail 60b. The intermediate layer may have a plurality of small diodes arranged in a combination of positions, and / or a plurality of sublayers (such as the plurality of lower layers into which the intermediate layer is divided, partial layers, sublayers, etc.) for forming the intermediate layer such that the plurality of diodes emit light when current flows through the intermediate layer. The light-emitting patch 70 may be configured to emit light at various voltage values and current values (at a range of voltages and amperages). For example, the light-emitting patch may be configured to emit light at 3 volts and 80 - 100 milliamperes.In some other examples, the light patch (such as the light-emitting patch 70) may emit light at 3, 6, 9, and 12 volts and with corresponding amperes and powers respectively. In some examples, the patch (such as the light-emitting patch 70) may generate more light when the current flows in one direction than when it flows in the reverse direction.

[0085] The conductive pad may be electrically insulated from the conductive layer by a layer made of a non-conductive material disposed between the conductive pad and the conductive layer or (or, i.e.) an electronics carrier (electronics carrier, electronics holder, layer supporting or supporting the electronics layer, the carrier layer, etc.). As already detailed, the conductive layer and the conductive pad may be configured to connect to the first and second contact rails 60a, 60b at a plurality of positions on those rails, or also various plural paths (paths, short-circuit paths, signal transmission paths, energy transmission paths, bridges between rails, etc.) of the first and second contact rails 60a, 60b, which are spaced from each other between the first and second contact rails 60a, 60b (spaced relations between the first and second contact rails 60a, 60b, a plurality of paths are spaced from each other in the rail length direction between the first and second contact rails 60a, 60b, etc.) may be further configured to connect. This may enable the arrangement of the light-emitting patch 70 to be changed to achieve various customer designs in order to minimize the costs and components required to achieve various design aspects. When assembling the card 1, each component (component, component, etc.) may be placed on a prefabricated layer that requires special tooling (tooling, construction method, manufacturing method, etc.) and other setups. By using the first and second contact rails 60a, 60b, the light-emitting patch 70 can be connected at one or more positions, thereby, for example, maintaining the same (same, same shape, etc.) first carrier layer 50 to achieve various arrangements of the light-emitting patch 70 for achieving various different design aspects, and preventing the need to change other layers of the card 1 to achieve any given design aspect.The light emission from the light-emitting patch 70 may occur in response to an interaction associated with an external device, for example, the light emission of lights during a transaction process or when a locking mechanism is activated. The light emission may block (block, make invisible by an obstacle, interfere with, etc.) the screen of a card reader during non-contact payment, for example, when other visual indicators are unavailable or difficult to understand, for the user. from a user It may provide useful feedback.

[0086] The first and second core layers 20, 30, the first and second outer layers 46, 48, and the surrounding member 14 (surround 12) The first and second cover layers 16a, 16b may contain polymer-based materials (e.g., polyvinyl chloride, polyethylene terephthalate, glycol-modified polyethylene terephthalate, polyester, and / or polycarbonate). Further, the first carrier layer 40 and the second carrier layer 50 may contain polymer-based materials (e.g., polyethylene terephthalate and / or polycarbonate). Further, the various layers (layers, one or more layers, etc.) made of polymer-based materials described in this application document may be thermo-adhesive polymer-based layers or thermosetting polymer-based layers disposed between adjacent ones of the plurality of layers by lamination. may be interconnected with

[0087] As shown in FIGS. 1, 2A and 2B, the light-emitting card 1 can be provided in various forms, including a collector card, an identity card, an access card, a royalty card, a membership card, a transportation card, or a transaction card (e.g., a credit card, a debit card, a stored value card, a reward card, or a card employable for payment). In this regard, the light-emitting card 1 may be provided with several other features to facilitate their usages.

[0088] In particular, the card 1 may have a card configuration with a length L, a width W, and a thickness that conforms to the ISO / IEC standard 7810 (e.g., ID-1 card). In this regard, the inlay 10, the first core layer 20, the second core layer 30, and the first and second carrier layers 40, 50 may each be common to each other with respect to length and width, thereby adapting them to be laminated into an interconnected assembly.

[0089] The card 1 may further include several power receiving elements configured to receive electrical signals and power from an external device, and the power receiving elements are, for example, an integrated circuit (IC) chip module 90 disposed in a pocket 21 on the side of the first surface of the card, and the pocket 21 extends through the first core layer 20. The IC chip module 90 may include an integrated circuit (IC) chip 92 (shown by a virtual line), and the IC chip 92 is interconnected to and supported by the inward surface of a substrate. In this case, in accordance with the ISO / IEC standard 14443, a non-contact signal interface with a non-contact card reader is provided by a first antenna 80 (the first antenna 70) To supply electrical energy to the IC chip 92 for performing via, the IC chip (the IC chip, IC chip 92, etc.) may utilize the first energy signal provided by the first antenna 80. In this regard, during the execution of the personalization (personalization, the process of customizing the card for the owner, recording and printing personal information, payment information, etc. on the card for personalization) process, the IC chip 92 may be encoded using data corresponding to an account or record (for example, a payment account managed by or on behalf of the card issuer settlement institution, a membership account managed by the card issuer franchise institution, an identity verification record, etc.) that is uniquely associated with the card 1.

[0090] In this regard, further referring to FIG. 4A, different ones of the second connection line pair, which is a second pair consisting of a pair of conductive connection lines 64a, 64b, are electrically connected to different ones of the first pair of electrical contacts of the plurality of electrical contacts (electrical contacts, electrical contact 92a, etc.) of the IC chip of the IC chip module 90 in order to provide the first electrical signal to the IC chip module 90 (for example, direct contact or inductive coupling (inductive coupling, inductive coupling, etc.)), and may be electrically interconnected to a plurality of second offset positions of the first antenna 80. For example, in the arrangement shown in FIG. 4A, the second connection line pair 64a, 64b, which is a second pair consisting of a pair of electrical connection lines, is the first carrier layer 40 (the first carrier layer) It is electrically interconnected to a plurality of offset positions of the coupling antenna 82 interconnected thereto while being supported thereby. In turn, the IC chip module 90 includes a module antenna 94 (shown by phantom lines in FIGS. 1, 6, and 7), and the module antenna 94 is interconnected to the inward-facing surface of the substrate of the IC chip module 90 while being supported by the inward-facing surface of the substrate and overlapping with the coupling antenna 82. In this case, the module antenna (the module antenna, module antenna 94, etc.) and the coupling antenna 82 may be provided to perform inductive coupling to provide the first energy signal from the first antenna 80 to the IC chip of the IC chip module 90. As noted, such an arrangement may be utilized for contactless data transmission signals via the first antenna 80 between the IC chip 92 and a contactless card reader in accordance with the ISO / IEC standard 14443.

[0091] Referring again to FIGS. 1 and 2A, the IC chip module 90 may have a plurality of contact plates 96 that are interconnected to and supported by the outward-facing surface of the substrate to provide a contact-type signal interface with a contact card reader via the plurality of contact plates 96 in accordance with ISO / IEC standard 7816, and to receive a contact-type second energy signal (e.g., a direct current or DC signal) for supplying electrical energy to the IC chip 92 (power, energize, etc.). The contact electrical signal may have the form of a direct current signal, i.e., DC, and the direct current signal may be defined as a current flowing in only one direction. In some arrangements, the card 1 may be provided such that the contact-type second energy signal is also provided to the first and second contact rails 60a, 60b to cause the light-emitting patch 70 to emit light. By providing a plurality of features sufficient to provide power and electrical signals to the light-emitting patch 70, a single card 1 may be used in a variety of applications using both external devices, e.g., both a contact or contactless credit card reader (both a contact credit card reader and a contactless credit card reader, etc.).

[0092] In this regard, further reference is made to FIG. 6, which shows a plan view of an embodiment of the power receiving element, in which the power receiving element has the form of an IC chip module 90 and a plurality of contact plates 96, which are electrically interconnected via a non-conductive support substrate 91 to a corresponding plurality of contacts 93 (shown by phantom lines), and those contacts 93 are interconnected to it while being supported by the inward-facing surface of the substrate 91. In this case (In turn), a plurality of contacts 93 (for example, a plurality of contacts 93 corresponding to a plurality of contact plates VCC, GND, I / O, reset and clock) are provided to the IC chip 92 for the second electrical signal, via a plurality of electrically conductive lines (such as conducting wires, etc.) 95 (for example, a plurality of wire lines or a plurality of trace lines on the substrate 91 (the substrate 93) ), may be electrically interconnected to different ones of a first subset of a plurality of electrical contacts 92a of the IC chip 92. Further, as described above, different ones of a first pair of electrical contact pairs, which are a first subset of a plurality of electrical contacts 92a of the IC chip 92 and are not included in the first subset, may be electrically interconnected to a plurality of offset positions of the module antenna 94 for performing inductive coupling with the coupling antenna 82.

[0093] The IC chip module 90 further includes a pair of contact pads 98a, 98b, and the pair of contact pads 98a, 98b are on the substrate 91 (the substrate 93) while being interconnected to it in a state of being supported by the inward-facing surface thereof, and being electrically interconnected to different ones among a pair of contacts which is one pair of the plurality of contacts 93 (for example, a plurality of contacts for a plurality of contact plates VCC and GND), the contact pairs 93, 93 are electrically interconnected to different ones among a second pair of electrical contacts which is a second pair of the plurality of electrical contacts 92a of the IC chip 92, and the second pair of electrical contacts is different from the first pair of electrical contacts. In turn, referring to both FIGS. 6 and 4A, different ones among a pair of contact pads 98a, 98b may be electrically interconnected to different ones among the first and second contact rails 60a, 60b via different ones among a third pair of connection lines 66a, 66b which is a third pair consisting of a pair of interconnection lines 66a, 66b for providing the second electrical signal to the first and second contact rails 60a, 60b. Each of the third pair of connection lines 66a, 66b has a corresponding first portion which is interconnected to it in a state of being supported by the first surface of the first carrier layer 40, a corresponding bridge which extends through the first carrier layer 40 (the first carrier layer) and a corresponding second portion which is interconnected to the outward-facing second surface of the first carrier layer 40 using corresponding ones among the metal pads 68a, 68b in a state of being supported by the outward-facing second surface of the first carrier layer 40, and the metal pads 68a, 68b are connected to the first carrier layer and are arranged in a state of being in contact with corresponding ones among a pair of contact pads 98a, 98b of the IC chip module 90 which are different from others. In the latter case, the metal pads 68a, 68b may be at least partially embedded. In the embodiment shown in FIG. 6, the contact pads 98a, 98b are in contact plate 96 (the contact pads 96) and in a state of not overlapping with the module antenna 94, and along an edge of the IC chip module 90 corresponding to the length dimension of the card 1, contact plate 96 (the contact pads 96) is arranged horizontally between the and the module antenna 94. In another embodiment, the contact pads 98a, 98b are in contact plate 96 (the contact pads 96) and in a state of not overlapping with the module antenna 94, and along another edge of the IC chip module 90 corresponding to the width dimension of the card 1 (another edge, one edge different from the said edge, etc.), contact plate 96 (the contact pads 96) is arranged horizontally between the and the module antenna 94.

[0094] The first antenna 80, the first and second contact rails 60a, 60b, the first connection line pair 62a, 62b, the second connection line pair 64a, 64b and the third connection line pair 66a, 66b (66a) may be formed by metallization (metal coating, metal thin film formation, conductor thin film formation, etc.), printed conductive ink and / or a combination thereof. For example, the first antenna 80, the first and second contact rails 60a, 60b, the first connection line pair 62a, 62b, the second connection line pair 64a, 64b and the third connection line pair 66a, 66b (66a) may be formed of aluminum and / or copper that has been plated and etched.

[0095] As shown in FIG. 4, one or both of the first connection line pairs 62a, 62b that electrically interconnect the first antenna 80 to different ones of the first and second contact rails may have an in-line capacitor 61 to insulate the first antenna 80 from the second electrical signal (e.g., a DC signal of the contact signal, a DC signal extracted from the contact signal, etc.). Further, as shown, one or both of the third connection line pairs 66a, 66b that electrically interconnect a pair of contact pads 98a, 98b of the IC chip module 90 to different ones of the first and second contact rails 60a, 60b may have an in-line diode 63 to insulate the IC chip 92 from the first energy signal (e.g., an AC signal from the non-contact signal, an AC signal extracted from the non-contact signal, etc.).

[0096] In various examples, an electrical signal may be transmitted to the first and second contact rails 60a, 60b from either or both of a contactless application with an external device (applying card 1 to an external device in a contactless manner, accessing card 1 to an external device in a contactless manner, using the card in a contactless manner with an external device, contactless access, etc.) and a contact application to an external device (e.g., a card reader). In many examples, the contactless external device uses an AC signal, and the contact application (contact applications, contact access, etc.) uses a DC signal, and card 1 may have one or more signal filters 61, 63 between the first and second contact rails 60a, 60b and the contactless circuit assembly, and the contactless circuit assembly may include some communication elements such as the first antenna 80 and a contact application such as the IC chip module 90. The filters 61, 63 limit the transmission of different electrical signal forms (form, waveform, waveform shape, type of DC or AC, method, format, etc.) to certain components, for example, limit to a DC signal for the first antenna 80 or limit to an AC signal for the IC chip module 90, and may include one or more in-line capacitors 61 or in-line diodes 63 as shown in FIG. 4A or other similar components.

[0097] Filters 61 and 63 function to allow only a circuit with an electrical signal, i.e., either an AC form (AC form, AC system, etc.) or a DC form (DC form, DC system, etc.), to pass through. For example, the in-line diode 63 functions to prevent an AC electrical signal from being transmitted to the IC chip module 90 while allowing a DC electrical signal to be transmitted to flow through a contact circuit that may include the IC chip module 90, the first and second contact rails 60a and 60b, and the light-emitting patch 70. In contrast, the capacitor 61 functions to prevent a DC electrical signal from being transmitted to the first antenna 80 while allowing an AC electrical signal to be transmitted to flow through a non-contact circuit that may include the first antenna 80, the first and second contact rails 60a and 60b, and the light-emitting patch 70. By having the filters 61 and 63, the card 1 can be used for both non-contact and contact applications and may prevent both the card 1 and external devices and the light-emitting patch 70 from being damaged. Further, the filters 61 and 63 may reduce the need to provide several other layers, several connections, or circuits for preventing the intersection (intersection, crossing, overlap, mixing, interference, etc.) of AC and DC signals, thereby potentially substantially improving the functionality (performance, etc.) of a card having a specified thickness (with a specified thickness, having a non-selectable thickness, etc.).

[0098] In a modified embodiment of Card 1, the first antenna 80 may be provided without having the second connection line pair 64a, 64b shown in FIG. 4A. Optionally, further, as shown in FIGS. 3B and 3C, the second antenna 84 may be interconnected to the surrounding member 14 in a supported state, in which case the second antenna 84 may be provided to receive a non-contact signal and provide another electrical signal to the IC chip 92 in response to the non-contact signal. For these purposes, the card may include another pair consisting of a pair of conductive connection lines 86a, 86b, which are electrically connected to different ones of the aforementioned first electrical contact pairs 92a of the IC chip 92 to provide another electrical signal to the IC chip 92 (e.g., by direct contact or inductive coupling, etc.), and in this case, in accordance with ISO / IEC standard 14443, the IC chip 92 may utilize the additional energy signal provided by the second antenna 84 to supply electrical energy to the IC chip 92 for performing a non-contact signal interface with a non-contact card reader via the second antenna 84.

[0099] For example, in the arrangement shown in FIGS. 3B and 3C, the aforementioned another pair consisting of a pair of conductive connection lines 86a, 86b is surround member 14 (the support member, the aforementioned support member) A plurality of offset positions of the coupling antenna 88 interconnected thereto while being supported thereby may be electrically interconnected. In this case, the coupling antenna 88 and the module antenna 94 are provided to perform inductive coupling so as to provide the another energy signal from the second antenna 84 to the IC chip 92 of the IC chip module 90. As described above, such an arrangement configuration may be used to perform contactless data transmission signals (such as contactless data transmission) between the IC chip 92 and the contactless card reader in accordance with the ISO / IEC standard 14443 via the second antenna 84. The second antenna 84, another pair of connection lines which is another pair consisting of a pair of connection lines 86a, 86b, and the coupling antenna 88 may be formed of a metal wire, and the wire is arranged on the surrounding member while being supported by the surrounding member and is partially embedded in the surrounding member.

[0100] In another approach, further referring to FIG. 3D, another pair consisting of the aforementioned pair of connection lines 86a, 86b may be electrically interconnected to corresponding contact pads 87a, 87b so as to be directly electrically connected to corresponding plurality of electrical contacts. The corresponding plurality of electrical contacts are interconnected to each other while being supported by the inward surface of the substrate of the IC chip module 90 to provide the another electrical signal to the IC chip 92, and are electrically connected to different ones of the aforementioned first electrical contact pair among the plurality of electrical contacts 92a of the IC chip 92. Here, referring to FIG. 5, which shows a schematic cross-sectional view of the card-related embodiment shown in FIG. 1, the card-related embodiment, in the first approach for providing an electrical signal to the IC chip 92, as described above with reference to FIGS. 4A and 3B, 3C respectively, the pair of connection lines (the pair of connection lines, the second pair of connection lines, etc.) 64a, 64b and the coupling antenna 88 (coupling antenna 82) including, and in the second approach for providing an electrical signal to the IC chip 92, the card-related embodiment alternatively includes a second antenna 84, the pair of connection lines (the other pair of connection lines, etc.) 86a, 86b, and a coupling antenna 88.

[0101] As further shown in FIG. 5, an optional phosphorescent (the property of a substance that absorbs light and re-emits that light, photoluminescence, phosphorescence, fluorescence, energy storage, etc.) patch 73 may be provided in an overlapping state with the light-emitting patch 70 such that when the light-emitting patch 70 emits light, it fluoresces (a substance that absorbs light re-emits that light, emits fluorescence, etc.). The phosphorescent patch 73 may have a configuration substantially the same as the configuration (shape, etc.) of the light-emitting patch 70. In one approach, the phosphorescent patch 73 may be supported by and interconnected therewith by the second carrier layer 50 on the same side as the light-emitting patch 70 (e.g., in an underlying relation to the light-emitting patch 70 and in direct contact with the second carrier layer 50). In the approach shown in FIG. 5, the phosphorescent patch 73 may be supported by and interconnected therewith by the opposing side of the second carrier layer , in the former approach, the surface of the second carrier layer 50 opposite to the surface on which the phosphorescent patches 73 are interconnected, etc. (e.g., in direct contact with the second carrier layer 50).

[0102] In some embodiments, card 1 may include a translucent layer that overlaps the light-emitting patch 70 and has at least a portion that extends to the circumferential edge of card 1. In this case, a portion of the light emitted by the light-emitting patch 70 internally reflects within the translucent layer and travels towards the circumferential edge of card 1 to illuminate the circumferential edge as described above, thereby potentially providing a distinguishing feature for card 1 from other cards. In one approach, the translucent layer may have a sheet-like layer that extends to and about the entirety of the peripheral edge of card 1. For example, when a quadrilateral light-emitting card is provided, when the light-emitting patch 70 emits light, each of its plurality of length edges and width edges (the length edges and width edges of card 1) may be illuminated by the translucent layer. Optionally, the translucent layer may contain a phosphorescent pigment (pigment, colorant, etc.) or dye. In the embodiment shown in FIG. 5, the second carrier layer 50 may be translucent to provide the translucent layer.

[0103] In some examples, card 1 may have a light-transmissive layer, which may be the translucent layer or something similar thereto. and / or (and, or) It may have phosphorescent patches, where the light emitted by the light-emitting patch 70 internally reflects and reaches a position on the card that is visible from the outside, such as a peripheral edge of card 1 or the second mask 74. and / or (and, or) In response to the light emission by the light emitting patch 70, both perform fluorescence (fluoresce, where a substance that absorbs light re-emits that light, emits fluorescence, etc.), exhibiting one or both of translucency and phosphorescence. The translucent layer may be utilized to provide another feedback to the user in response to an operation on an external device, or may be utilized to provide means for high-quality aesthetics or differentiating various cards. In one example, the layer (the translucent layer, etc.) may be formed by utilizing a PET material, and the PET material includes a powder or material having phosphorescence in order to provide both translucency and phosphorescence to the layer. Some specific colors, for example, yellow or orange may appear to show a bright appearance, but several other colors may also be used in the same way. The translucent layer may be disposed at a position near the light emitting patch 70 or in physical contact with the light emitting patch 70. The translucent layer may be coextensive (having the same shape in plan view, having the same boundary line in plan view, having the same dimensions in plan view, etc.) with the first and second carrier layers, or the translucent layer may be bounded by a shorter length dimension or width dimension (a shorter, a length dimension or width dimension shorter than the first and second carrier layers, etc.).

[0104] In one embodiment, the various layers described above may be provided to have the following approximate thicknesses, that is, First outer layer 46: 0.002 inches; First core layer 20 having the first print 22: 0.004 inches - 0.008 inches; First carrier layer 40 having the first and second contact rails 60, 60b and the first antenna 80: 0.001 inches; Second carrier layer 50 having the light emitting patch 70 and the phosphorescent patch 73: 0.002 inches - 0.010 inches; Inlay 10: 0.008 inches - 0.020 inches; First cover layer 16a: 0.002 inches; Metal member 12 and surrounding member 14 having optional second antenna 84: 0.004 inches - 0.008 inches; Second cover layer 16b: 0.002 inches; Second core layer 48 having a second print: 0.004 inches - 0.008 inches; and Second outer layer 48: 0.002 inches.

[0105] The approximate value of the overall card thickness may be in the range from about 0.030 inches to about 0.033 inches, at which time the weight is in the range from about 8 grams to about 20 grams. In some other examples, the card may have a different thickness or weight depending on its intended use or purpose.

[0106] Further, reference is now made to FIGS. 1, 2A and 2B, which show, respectively, an optional printing (printing, printing result) 22 visible from the first face of the card 1 and an optional printing (printing) 32 visible from the second face of the light - emitting card 1. The print 22 and / or 32 may have one or more predetermined print areas, which may each have a corresponding graphic (e.g., a pictorial scene, logo, photograph, etc.), a corresponding human - readable character (e.g., numbers, letters, and / or their representations), and / or a corresponding one or more machine - readable markings (e.g., barcodes, multi - dimensional matrix codes, etc.). As described above, the print 22 may be provided to form part or all of the mask 72. The print may, in some examples, be more desirable than other ways of generating visual information in order to minimize the amount of the graphics that contribute to the overall thickness of the card 1.

[0107] The printed matter 22 may be forward-printed (normally printed, non-inverted printed) on the outer-facing surface of the transparent first core layer 20 (for example, regardless of whether the first core layer 20 is transparent, translucent or opaque), or may be reverse printed on the inner-facing surface of the transparent first core layer 20 (the first core layer 10) 30. Similarly, the printed matter 32 may be forward-printed (forward-printed, normally printed, non-inverted printed, etc.) on the outer-facing surface of the second core layer 30 (for example, regardless of whether the second core layer 30 is transparent, translucent or opaque), or may be reverse printed on the inner-facing surface of the second core layer 30 if the second core layer 30 is transparent.

[0108] As shown in FIG. 2A, the light-emittable card 1 may further have personalization data 24a, 24b, and the personalization data 24a, 24b are indicia (identifying displays, symbols, visual information having a specific meaning, displays, instructions, seals, etc.) that represent or correspond to an account or record (for example, a settlement account managed by or for a card-issuing settlement institution, a membership account managed by a card-issuing merchant institution, etc.) uniquely associated with the light-emittable card 1 and are visible. In some embodiments, the visible personalization indicia 24a and / or 24b may be provided by embossing the card body of the card 1 to form the indicia. In some other embodiments, the visible personalization indicia 24a and / or 24b may be formed by printing on one or both of the first core layer 20 and / or the second core layer 30. In still some other embodiments, the visible personalization indicia 24a and / or 24b may be formed on the outer-facing surface of the card 1 (for example, by at least one of laser engraving, inkjet printing, and thermal printing).

[0109] The visible personalization indicia 24a may have human-readable characters indicating the corresponding account (e.g., account number). Further, the visible personalization indicia 24b may have other human-readable data corresponding to a specific account, and such other human-readable data includes the corresponding card expiration date, the corresponding account service grade level, and / or the corresponding customer-specific data (e.g., customer name, customer period, customer data, etc.). In one embodiment of the card 1 shown in FIGS. 2A and 2B, the visible indicia 24a, 24b are provided so as to be visible from the first face of the card 1. In some other embodiments, the visible indicia 24a and / or 24b may be provided so as to be visible from the second face of the card 1 in addition to or instead of that. As may be understood, the visible indicia 24a, 24b may be provided as personalization data on the luminescent card 1 as part of the card personalization process.

[0110] As shown in FIG. 2B, the card 1 may further have a magnetic stripe 26 attached to the second face of the card 1. The magnetic stripe 26 may be encoded (encoded, encoded data is recorded) using personalization data unique to the card 1 (e.g., data corresponding to the account indicated by the visible personalization indicia 24a) during card personalization. The magnetic stripe 26 may be provided in accordance with ISO / IEC standard 7811. As further illustrated, a signature block 27 and / or a hologram 28 may also be attached to the second face of the card 1 (e.g., by hot stamping).

[0111] FIG. 7 is a partial exploded perspective view of another embodiment of the light-emitting metal card 100, the card 100 including an inlay 110, where in this case the inlay 110 includes a metal member 112 and conductive first and second contact rails 160a, 160b which are spaced apart from each other with a gap on the side of the first surface of the metal member 112 (on, on the surface of, etc.) and are electrically insulated from the metal member 112, and a light-emitting patch 170 which is arranged on the side of the first surface of the metal member 112 (on, on top of, etc.) and is electrically insulated from the metal member 112 and is electrically coupled to the first and second contact rails 160a, 160b to emit light when receiving an electrical signal at the first and second contact rails 160a, 160b. At least a part of this kind of electrical decoration (illumination, light image formed by the light-emitting patch 170, illumination, etc.) may be visible on the first surface of the card 100 and / or along one or more peripheral edges (one or more peripheral edges, one or more sides, one or more sides of the outer periphery, etc.) of the card 100.

[0112] The card 100 may further include a non-conductive first core layer 20 which is arranged on the side of the first surface of the metal member 112 (on, on top of, etc.) and overlays (overlying, covering from above, coating, superimposing, etc.) the inlay 110, the first and second contact rails 160a, 160b and the light-emitting patch 170 all of which are included in the card 100, and a non-conductive second core layer 30 which is arranged on the side of the second surface of the metal member 1 12 (the metal member 122) which is on the side opposite to the said first surface thereof. Prints (printing, printing results, etc.) 22 and 32 may be provided on the first core layer 20 and the second core layer 30 respectively as will be described in detail later. The card 1 00 (The card 1) Further, it may have a mask (such as a covering, a shielding body, etc.) 72, and the mask 72 overlays at least a part of the light-emitting patch 170 and forms a predetermined image 74 on the side of the first surface of the card 100 when the light-emitting patch 170 emits light. The mask 72 permits the passage of and blocks the passage of different portions of the illumination (such as a light image) to provide the predetermined image 74. For example, the predetermined visible image may be a name, a logo, a character, a graphic, or other visual representation that coincides with or is associated with a specific entity or selected by a specific entity. Optionally, the mask may be formed as a part of the printed matter 22 on the first core layer 20. In the illustrated embodiment, the first and second outer layers 46, 48 as protective layers may be provided in a state of overlaying the first and second core layers 20, 30, respectively. Optionally, a translucent layer 178 may be disposed between the inlay 110 and the first core layer 20 to illuminate the peripheral edge of the card 100 as described above.

[0113] A number of approaches may be utilized to provide an electrical signal to the contact elements, such as the first and second contact rails 160a, 160b, to cause the light emitting patch 170 to emit light, including non-contact signals and / or contact signals (e.g., where a contact and / or non-contact card reader is used). In this regard, FIGS. 8 and 9 are referred to below, which show embodiments of the inlay 110 of the assembled card 100 shown in FIG. 7, respectively. As shown in FIG. 8, the light emitting patch 170 and the first and second contact rails 160a, 160b may be interconnected to it in a state supported by the first carrier layer 140 so as to be positioned on the side of the first surface of the metal member 112 and between the metal member 112 and the first core layer 20. Also, the first antenna 180 (e.g., at least one or a plurality of conductive metal loops) may be interconnected to it in a state supported by the non-conductive second carrier layer 150 so as to be positioned on the side of the second surface of the metal member 112 and between the metal member 112 and the second core layer 30. In this case, the first antenna 180 is arranged so as not to overlap the metal member 112. Therefore, the first antenna 180 may be interconnected to different ones of a pair of first connection line pairs each including a pair of conductive connection lines 162a, 162b at a plurality of offset positions (offset, different from each other, shifted, different from each other on the same plane, etc.). The connection lines 162a, 162b are among the first and second contact rails 160a, 160b different ones (a plurality of contact rails different from each other, etc.) are electrically interconnected, where the first antenna 180 may receive a non-contact signal (e.g., a radio frequency signal) and provide a first electrical signal (e.g., an alternating current (AC) signal) to the first and second contact rails 160a, 160b in response thereto, in which case the first connection line pair 162a, 162b may extend around the metal member 112 while being electrically insulated from the metal member 112 or extend through the metal member 112.

[0114] In the illustrated approach, the first and second carrier layers 140, 150 may be formed by corresponding first and second portions of a non-conductive substrate that is a single continuum, in which case the metal member 112 may be disposed within the opening 114a of the surrounding member 114, in which case the metal member 112 does not overlap the first antenna 180. In assembly, the substrate is folded back, and then the second portion of the substrate corresponding to the second carrier layer 150 is (the second portion, the aforementioned first portion, etc.)entering and passing through an opening 142 within those corresponding to the first carrier layer 140 so that the second portion of the substrate corresponding with second carrier layer 150 is advanced into and through an opening 142, it may be flexed (folded, bent, refracted, etc.), and subsequently may be folded forward (towards the upper or front surface of the first portion of the substrate, etc.). In this case, the first antenna 180 on the first carrier layer 140 faces downward, and the second carrier layer 150 is interconnected with the first and second contact rails 160a, 160b and the light-emitting patch 170, which are interconnected with each other, in a state where they are supported by the second carrier layer 150, and the first carrier layer 140 (the first carrier layer 140, the second carrier layer 150, etc.) The folded substrate may be flipped or inverted so as to project (exposed, etc.) upward from the first carrier layer 140. Then, with the protruding second carrier layer 150 extending through the opening 114a of the surrounding member 114, the downward surface of the surrounding member 114 may be arranged to cover the entire upward surface of the first carrier layer 140 and secured so as not to move thereon. The cover layer 116b is, the first carrier layer 140 (the first carrier layer 140)It may be secured so as not to move on the downward surface. Then, the metal member 112 may be disposed within the opening 114a of the surrounding member 114, and the surrounding member 114 is located on the upward surface of the first carrier layer 140. Next, the protruding second carrier layer 150 may be forward folded around a peripheral edge portion of the metal member 112 (such as forward folded around a peripheral edge portion, forward folded with the peripheral edge portion as a bent portion, etc.) so that the first carrier layer 140 is disposed to cover the entire metal member 112. In this case, the first connection line pair 162a, 162b extends along the peripheral edge portion of the metal member 112 (around, such as surrounding the peripheral edge portion) to the upward first and second contact rails 160a, 160b and the light emitting patch 170 on the second carrier layer 150. In this kind of approach, the first and second contact rails 160a, 160b and the first portion of the first connection line pair 162a, 162b may be interconnected in a state supported by the first surface of the substrate within the first portion of the substrate, and the first antenna 180 and the second portion of the first connection line pair 162a, 162b may be interconnected in a state supported by the same one as the first surface of the substrate within the second portion of the substrate, thereby possibly improving the manufacturing efficiency. By using the substrate as a single continuum to form the first and second carrier layers 140, 150, the several electronic components may be arranged in a way that the electrical signal is received from or transmitted to either side of the two sides of the card 100. Further, such a configuration may reduce the respective number of openings (such as recesses), apertures (such as air openings) or contacts necessary to facilitate the transmission of the electrical signal between the several electronic components so as to penetrate the metal member 112 or span between the carrier layers 140, 150.This configuration aspect may further function to reduce interference from the metal member 112 with respect to the transmission and reception of electrical signals from, to, or within the card 100.

[0115] The first and second core layers 20, 30, the first and second outer layers 46, 48, and the surrounding member 114 (surround 112) and the first and second cover layers 116a, 116b may contain a polymer-based material (e.g., polyvinyl chloride, polyethylene terephthalate, glycol-modified polyethylene terephthalate, polyester, and / or polycarbonate). Further, the substrates of the first carrier layer 140 and the second carrier layer 150 may contain a polymer-based material (e.g., polyethylene terephthalate and / or polycarbonate). Further, various layers (layers, one or more layers, etc.) made of polymer-based materials described in this application document may be interconnected by lamination with a thermally adhesive polymer-based layer or a thermosetting polymer-based layer disposed between adjacent ones of the plurality of layers.

[0116] Returning to FIG. 7, the card 100 may be provided in various types (forms, shapes, forms, etc.) including a collector's card, an identification card, an access card, a loyalty card, a membership card, a transportation card, or a transaction card (e.g., a credit card, a debit card, a stored value card, a reward card, or a card employable for payment). In this regard, the card 100 may be provided with several other features to facilitate their usages (usages, applications, etc.).

[0117] In particular, the card 100 may have a card shape (configuration, etc.) with a length L, width W, and thickness conforming to ISO / IEC standard 7810 (e.g., ID-1 card). In this regard, the inlay 110, the first core layer 20, and the second core layer 30 may each be common to one another with respect to length and width, thereby adapting them for lamination into an interconnected assembly. Further, the card 100 may have some other features provided on the first core layer 20 and the second core layer 30, as described above in connection with the embodiment of card 1 shown in FIGS. 2A and 2B.

[0118] Further, in this regard, the card 100 may further have an integrated circuit (IC) chip module 90 (shown by phantom lines), the IC chip module 90 being disposed in a pocket 21 on the side of the first face of the card 100, the pocket 21 extending through the first core layer 20. The IC chip module 90 may include an integrated circuit (IC) chip 92 (shown by phantom lines), the IC chip 92 being interconnected thereto in a state supported by the inward face of a substrate. In this case, the IC chip (the IC chip 92) conforms to ISO / IEC standard 14443 and provides a contactless signal interface with a contactless card reader via a first antenna 1 80 (the first antenna 170)To supply electrical energy to the IC chip 92 for performing via, the first energy signal provided by the first antenna 180 may be utilized. In this regard, during the execution of the personalization process (the process of customizing the card for the owner, recording and printing personal information, payment information, etc. on the card for personalization), the IC chip 92 may be encoded using data corresponding to an account or record (for example, a payment account managed by or for the card issuer settlement institution, a membership account managed by the card issuer franchise institution, an identity verification record, etc.) that is uniquely associated with the card 100.

[0119] Regarding this point, further referring to FIG. 8, different ones of the second connection line pair, which is a second pair consisting of a pair of conductive connection lines 164a, 164b, are electrically coupled (for example, direct contact or inductive coupling) to different ones of the first electrical contact pair, which is a first pair of a plurality of electrical contacts of the IC chip of the IC chip module 90, in order to provide the first electrical signal to the IC chip module 90. For example, in the arrangement shown in FIG. 8, the second connection line pair 164a, 164b (64a, 64b) is the second carrier layer 1 40 (the second carrier layer 150)It is electrically interconnected to a plurality of offset positions of the coupling antenna 182 that is interconnected thereto while being supported thereby. In this case, the IC chip module 90 includes a module antenna 94 (shown by a virtual line in FIG. 7), and the module antenna 94 is interconnected to the inward-facing surface of the substrate in a state of being supported by the inward-facing surface of the substrate of the IC chip module 90 and overlapping with the coupling antenna 182. In this case, the module antenna 94 and the coupling antenna 182 may be provided for performing inductive coupling so as to provide the first energy signal from the first antenna 180 to the IC chip of the IC chip module 90. As described above, such an arrangement may be used for performing contactless data transmission signals (such as contactless data transmission) via the first antenna 180 between the IC chip 92 and the contactless card reader in accordance with the ISO / IEC standard 14443.

[0120] Returning to FIG. 7 again, the IC chip module 90 may have a plurality of contact plates 96 that are interconnected thereto while being supported by the outward-facing surface of the substrate for receiving a contact-type second energy signal (for example, a direct current or DC signal) in order to supply power to the IC chip 92 for performing a contact-type signal interface with a contact card reader via the plurality of contact plates 96 in accordance with the ISO / IEC standard 7816. In some arrangements, the card 100 may be provided such that the contact-type second energy signal is also provided to the first and second contact rails 160a, 160b to cause the light-emitting patch 170 to emit light.

[0121] In this regard, the IC chip-module 90 shown in and described above with reference to FIG. 6 may be utilized. Thus, referring to both FIGS. 6 and 8, in order to provide the second electrical signal to the first and second contact rails 160a, 160b, different ones of the pair of contact pads 98a, 98b may be electrically interconnected to different ones of the first and second contact rails 160a, 160b via different ones of a third pair of connection lines 166a, 166b which consists of a pair of interconnection lines. Each of the third pair of connection lines 166a, 166b may be interconnected thereto while being supported by the first surface of the first carrier layer 140 in a state where the corresponding one of the metal pads 168a, 168b is connected to the first carrier layer 140 and is in contact with a different one of a pair of contact pads 98a, 98b of the IC chip 92 of the IC chip-module 90.

[0122] The first antenna 180, the first and second contact rails 160a, 160b, the first pair of connection lines 162a, 162b, the second pair of connection lines 164a, 164b, and the third pair of connection lines 166a, 166b may be formed by metallization (metal coating, metal thin film formation, conductor thin film formation, etc.), printed conductive ink, and / or combinations thereof. By way of example, the first antenna 180, the first and second contact rails 162a, 162b, the second pair of connection lines 164a, 164b, and the third pair of connection lines 166a, 166b may be formed of aluminum and / or copper that has been plated and etched.

[0123] Furthermore, as described in connection with FIG. 4A and as shown in FIG. 8, the first and second contact rails 160a, 160b may allow for attaching the light-emitting patch 170 at a plurality of placement locations (such as placement locations, arrangement positions, placement positions, etc.) that are arranged along the length dimension of the first and second contact rails 160a, 160b and are relative to the card 100 itself. The first and second contact rails 160a, 160b may be substantially parallel to each other and substantially parallel to an edge (such as one edge) of the card 100. The first and second contact rails 160a, 160b may have an inter-rail spacing relationship that is different from the above, for example, having a bend (such as being bent round or angled, being folded, etc.) or a curve (such as being bent round).

[0124] As shown in FIG. 8, one or both of the first connection line pairs 162a, 162b that electrically interconnect the first antenna 180 to different ones of the first and second contact rails 160a, 160b may have an in-line capacitor 161 to insulate the first antenna 180 from the second electrical signal (for example, the DC signal of the contact signal). Further as shown, one or both of the third connection line pairs 166a, 166b that electrically interconnect a pair of contact pads 198a, 198b of the IC chip module 90 to different ones of the first and second contact rails 160a, 160b may have an in-line diode 163 to insulate the IC chip 92 from the first energy signal (for example, the AC signal from the contactless signal).

[0125] As shown in FIG. 8, electrical signals may be transmitted from either or both of a contactless application using an external device and a contact application using an external device to the first and second contact rails 160a, 160b. Due to the reason that contactless applications generally use AC signals and the reason that contact applications generally use DC signals, the card 100 may have one or more signal filters 161, 163 between the first and second contact rails 160a, 160b and the corresponding features, and the features used for the contactless application are, for example, the first antenna 180, and those used for the contact application are, for example, the IC chip module 90. The filters (such as the signal filters 161, 163) limit the transmission of different electrical signal forms (such as waveforms, methods, types, forms, etc.) to certain components, for example, limit to DC signals for the first antenna 180 or AC signals for the IC chip module 90, and may include in-line capacitors 161 or in-line diodes 163 shown in FIG. 8, or other similar components. By providing the filters 161, 163, the card 100 may be utilized for both contactless and contact applications and prevent damage to both the card 100 and the external device. Further, through the use of the filters 161, 163, the light-emitting patch 170 emits light during the implementation of both contactless and contact applications.

[0126] Here, FIG. 9 is referred to, which shows a schematic cross-sectional view of the card-related embodiments shown in FIGS. 7 and 8. In one embodiment, the various layers described above may be provided to have the following approximate thicknesses, that is, The first outer layer 46: 0.002 inches; The first core layer 20 having the first print 22: 0.004 - 0.010 inches; Inlay 110: 0.008 inch - 0.02 inch; First cover layer 116a: 0.002 inch; Entire surrounding member 114, entire second carrier layer 150 with light-emitting patch 170 (0.002 inch - 0.010 inch), and metal member 112 (0.004 inch - 0.010 inch): 0.006 inch - 0.020 inch; First carrier layer 140 having first antenna 180: 0.002 inch - 0.010 inch Second cover layer 116b: 0.002 inch; Second core layer 48 having second print: 0.004 inch - 0.010 inch; and Second outer layer 48: 0.002 inch.

[0127] The approximate value of the overall card thickness is in the range from about 0.030 inch to about 0.033 inch, and at this time, the weight is in the range from about 8 grams to about 20 grams.

[0128] In a modified embodiment of the card 100, the first antenna 180 may be provided without having the second connection line pair 164a, 164b shown in FIG. 8. Optionally, as shown in FIG. 10, the second antenna 184 may be mutually connected to the first antenna 180 on the same side while being supported by the first carrier layer 140. In this case, the second antenna 184 may be provided to receive a non-contact signal and provide another electrical signal to the IC chip 92 in response to the non-contact signal. For these purposes, the card 100 may include another pair consisting of a pair of conductive connection lines 186a, 186b, which are electrically connected to different ones of the aforementioned first electrical contact pairs 92a of the IC chip 92 to provide another electrical signal to the IC chip 92 (e.g., by direct contact or inductive coupling). In this case, in order to perform a non-contact signal interface with a non-contact card reader via the second antenna 184 in accordance with the ISO / IEC standard 14443 and supply electrical energy to the IC chip 92, the IC chip 92 may utilize the aforementioned another energy signal provided by the second antenna 184. In another approach, another pair consisting of the aforementioned pair of connection lines 186a, 186b may be electrically interconnected to corresponding plurality of contact pads for being directly electrically connected to corresponding plurality of electrical contacts. The plurality of electrical contacts are mutually connected to the IC chip module 90 while being supported by the inward surface of the substrate of the IC chip module 90 to provide the another electrical signal to the IC chip 92, and are electrically connected to different ones of the aforementioned first electrical contact pairs among the plurality of electrical contacts 92a of the IC chip 92.

[0129] In the modified embodiment shown in FIG. 10, the insulating layer 118 may be positioned between the metal member 112 and the second antenna 184 to insulate the reception of the non-contact signal by the second antenna 184. In one approach, the isolation layer (the insulating layer 118) may include a ferrite material. In some approaches, the insulating layer 118 may be provided with a pressure-sensitive adhesive on one or both sides, thereby facilitating attachment to the metal member 112 and / or the first carrier layer 140.

[0130] In the various embodiments described above, the metal member 112 may be substantially homogenous (e.g., a solid metal member), in which case the metal member 112 may be a single piece member. For example, the metal member 12, 112 may contain stainless steel, palladium, platinum, gold, silver, or tungsten. The metal member 12, 112 may further be formed from two or more separate and different metal members, and the two or more metal members 12, 112 may contribute to an increase in the total weight of the card. In some examples, the metal member 12, 112 may be entirely present inside the card 1, 100, or the metal member 12, 112 may be at least partially visible from the outer surface of the card 1, 100. The metal member 12, 112 may further form one or more discontinuities (such as breaks, discontinuities, cuts, perforations, etc.) for purposes such as providing a plurality of openings, a plurality of spaces, or a plurality of other placement positions due to differences in components for the card 1, 100.

[0131] The metal members 12, 112 may be configured relative to the card 1, 100 in such a way as to prevent overlap (physical overlap, etc.) or electrical interference with one or more of a plurality of communication elements such as the first antennas 80, 180 or the second antennas 84, 184. Metallic materials are generally known to interfere with the transmission of electrical signals. As a result, the metal members within the contactless card interfere with the electrical signals transmitted from or to the card, inhibiting the function of the card and preventing the adoption of contactless cards. By configuring the metal members in such a way as to prevent or reduce electrical interference, the metal members 12, 112 may be utilized within the card 1, 100 for contactless applications.

[0132] As described above, the weight of the metal member may include at least about 40% of the total weight of the card 1, 100. In some embodiments, the weight of the metal member is at least about 50% of the total weight of the card 1, 100 and may include at least about 80% or less of the total weight of the card 1, 100. In some other embodiments, the metal members may include a higher percentage of the total weight of the card 1, 100.

[0133] In some of the embodiments described above, the metal members 12, 112 may include at least about 50% of the length of the card 1, 100, and in some embodiments, the length of the metal members 12, 112 may include at least about 70% of the length of the card 1, 100. In some embodiments, the metal members 12, 112 may include at least about 50% of the width of the card 1, 100. In some examples, the metal members 12, 112 may be coextensive with or appear to be coextensive with one or more dimensions of the length, width, or thickness of the card, or may have a sufficient length or width such that they have the same dimension with respect to one or more of these dimensions. For example, the metal members 12, 112 may be arranged as a frame (such as a frame, etc.) extending along one or more edges of the card 1, 100 in order to create the appearance of a card that is entirely or substantially entirely metal.

[0134] The following aspects are obtained by the present invention.

[0135] (Aspect 1) A card comprising an electronics layer that forms a first side and a second side opposite the first side, an illuminable patch that is capable of emitting light and is configured to be connected at a plurality of positions on the first side of the electronics layer and emits light in response to an electrical signal, a metal member layer, a part of which has one or more metal members for imparting rigidity or weight to the card and is configured to be connected to the second side of the electronics layer a card including. (Aspect 2) The card of Aspect 1, further comprising a communications element that is electrically connected to the electronics layer and is configured to receive an electrical signal wirelessly, and the electrical signal received by the communications element provides power to the illuminable patch (Aspect 3) The card of Aspect 2, further comprising one or more signal filters that are electrically positioned between the communications element and the illuminable patch and are configured to limit the form of the current transmitted between the communications element and the illuminable patch (Aspect 4) The card of Aspect 2, wherein the one or more metal members are arranged so as not to interfere with the electrical signal received by the communications element (Aspect 5) The card of Aspect 1, further comprising a power receiving element that is electrically connected to the electronics layer One or more signal filters, electrically positioned between the power receiving element and the light emitting patch, for restricting the form of the current transmitted between the power receiving element and the light emitting patch A card including the same (Aspect 6) The card of Aspect 1, further comprising One or more signal filters, electrically connected to the electronics layer, configured to restrict the form of the current transmitted to, from, or through the electronics layer (Aspect 7) The card of Aspect 1, wherein the electronics layer includes first and second contact rails on the side of the first surface, the first and second contact rails being connected to the light emitting patch and configured to send an electrical signal to the light emitting patch (Aspect 8) The card of Aspect 7, further comprising A communications element, electrically insulated from the one or more metal members and electrically connected to the first and second contact rails at a plurality of offset positions for receiving a non-contact signal and providing the electrical signal to the first and second contact rails in response to the non-contact signal (Aspect 9) The card of Aspect 7, further comprising A first carrier layer, forming the uppermost layer of the card on the side of the first surface of the electronics layer, and further forming an opening in a part of the electronics layer A second carrier layer, formed as a layer connected to the metal member layer on the side opposite to the electronics layer An integrated chip module, disposed inside the opening of the first carrier layer, electrically connected to the electronics layer, and further configured to send an electrical signal to a first external device or receive an electrical signal from a first external device Including The integrated chip module further comprises One or more contact plates, configured to be in electrical contact with the first external device One or more communication elements, electrically connected to the integrated chip module, extending along the outer periphery of one or more of the plurality of layers, and configured to receive a non-contact electrical signal from a second external device or transmit a non-contact electrical signal to a second external device A card including the above (Aspect 10) The card of Aspect 9, further comprising One or more connection lines for supplying power to the light-emitting patch by sending the electrical signal from the plurality of contact plates (the contact plates, the one or more contact plates, etc.) or communication elements (communication elements, the one or more communication elements, etc.) to the first and second contact rails, including The plurality of connection lines (the plurality of connection lines, the one or more connection lines, etc.) further include One or more signal filters, electrically positioned between the plurality of contact plates (the contact plates, the one or more contact plates, etc.) and the light-emitting patch and between the plurality of communication elements (the communication elements, the one or more communication elements, etc.) and the light-emitting patch, and including those that limit the form of the electrical signal transmitted or received by the one or more communication elements (Aspect 11) The card of Aspect 9, wherein the one or more metal members have a non-overlapping relationship with the one or more communication elements, and the first carrier layer, the second carrier layer, and the electronics layer have the same spatial extent (Aspect 12) The card of Aspect 1, further comprising A light-transmitting layer, connected to the light-emitting patch and having translucency or phosphorescence The light-transmitting layer is further configured to transmit light to a position visible from the outside of the card. (Aspect 13) The card of Aspect 1, further comprising a mask disposed so as to be spaced apart from the light-emitting patch in a direction perpendicular thereto and facing the direction in which light is emitted from the light-emitting patch, the mask being configured to permit or block the emission of light from the light-emitting patch in order to generate an image visible from the outside. (Aspect 14) The card of Aspect 7, further comprising a carrier layer, the carrier layer comprising a first portion configured to be connected to the electronics layer on the side of the first surface and to form an opening that penetrates the second surface and reaches the electronics layer, a second portion configured to be connected to the metal member layer on the side of its first surface, an edge forming an intersection of the first portion and the second portion and being movable such that the first surface of the first portion can be connected to the first surface of the second portion, and the card further comprising an integrated chip module disposed inside the opening of the first portion, electrically connected to the electronics layer, and further configured to send an electrical signal to a first external device or receive an electrical signal from a first external device. The integrated chip module further comprises one or more contact plates configured to contact the first external device. The card further comprises one or more communication elements electrically connected to the integrated chip module, passing through the edge, extending from the second portion to the electronics layer, and configured to receive a non-contact electrical signal from a second external device or transmit a non-contact electrical signal to a second external device. (Aspect 15) The card of Aspect 14, further comprising One or more connection lines for delivering the electrical signal from the plurality of contact plates (the contact plates, the one or more contact plates, etc.) or the antenna to the first and second contact rails to provide power to the light-emitting patch, The plurality of connection lines (the plurality of connection lines, the one or more connection lines, etc.) further One or more signal filters electrically positioned between the plurality of contact plates (the contact plates, the one or more contact plates, etc.) and the light-emitting patch and between the plurality of communication elements (the communication elements, the one or more communication elements, etc.) and the light-emitting patch, and limiting the unwanted forms of the electrical signal from being sent or received by the plurality of communication elements (the communication elements, the one or more communication elements, etc.), the plurality of contact plates (contact plates, one or more contact plates, etc.) or the integrated chip module. A card including such. (Aspect 16) The card of aspect 15, wherein the one or more metal members have a non-overlapping relationship with the one or more communication elements, and the first carrier layer, the second carrier layer, and the electronics layer have the same spatial extent. (Aspect 17) A card, An electronics layer forming a first surface and a second surface on the side opposite to the first surface, A light-emitting patch configured to be connected at a plurality of positions on the side of the first surface of the electronics layer and to emit light in response to an electrical signal, A communication element (communications element) electrically connected to the card and configured to wirelessly receive an electrical signal, and the electrical signal received by the communication element provides power to the light-emitting patch A card including such. (Aspect 18) The card of aspect 17, further One or more signal filters, electrically positioned between the communication element and the light-emitting patch and configured to limit the form of the current transmitted between the communication element and the light-emitting patch, a card including the same. (Aspect 19) The card of aspect 18, wherein the electronics layer includes first and second contact rails, the first and second contact rails being connected to the light-emitting patch on the side of the first surface of the electronics layer and configured to transmit an electrical signal to the light-emitting patch or transmit an electrical signal from the light-emitting patch, the first and second contact rails being electrically positioned between the one or more signal filters and the light-emitting patch. (Aspect 20) The card of aspect 17, further including A metal member layer, a part of the metal member layer having one or more metal members for imparting rigidity or weight to the card and configured to be connected to the side of the second surface of the electronics layer, The one or more metal members having a non-overlapping relationship with the communication element. (Aspect 21) A card, A metal member having a weight that is at least 40% of the total weight of the card, A non-conductive surrounding member having an opening, the metal member being disposed within the opening, the metal member and the surrounding member forming at least a part of an inlay, Conductive first and second contact rails, spaced apart from each other with a gap on the side of the first surface of the metal member for receiving an electrical signal and electrically insulated from the metal member, A light-emitting patch, disposed on the side of the first surface of the metal member in an electrically insulated state from the metal member for receiving an electrical signal at the first and second contact rails and being electrically connected to the first and second contact rails to emit light. A first antenna, which is electrically insulated from the metal member and is interconnected to different ones of the first and second contact rails at a plurality of offset positions of the first antenna, for receiving a non-contact signal and providing a first electrical signal to the first and second contact rails in response to the non-contact signal. A first core layer, which is disposed on the side of the first surface of the metal member and overlays the first and second contact rails and the light-emitting patch. A second core layer, which is disposed on the side of the second surface of the metal member, which is on the side opposite to the first surface thereof. A card including the above. (Aspect 22) The card according to aspect 21, wherein the first and second contact rails are interconnected to each other in a state of being supported by a non-conductive first carrier layer disposed between the metal member and the first core layer on the side of the first surface of the metal member. (Aspect 23) The card according to aspect 22, wherein the first antenna is electrically interconnected to different ones of the first and second contact rails via different ones of a first pair of connection lines, which is a first pair of conductive connection lines, at a plurality of first offset positions of the first antenna. The card further includes An integrated circuit module having an integrated circuit chip disposed in a pocket extending through the first core layer and interconnected to the substrate in a state of being supported by the inward-facing surface of the substrate. A second pair of connection lines, which is a second pair of conductive connection lines, and is electrically connected to different ones of a first pair of electrical contact portions, which is a first pair of electrical contact portions of a plurality of electrical contact portions of the integrated circuit chip, to provide the first electrical signal to the integrated circuit chip, and is electrically interconnected at a plurality of second offset positions of the first antenna. A card including the above. (Aspect 24) The card according to aspect 23, wherein the integrated circuit module further includes A plurality of contact plates, interconnected with each other while being supported by the outward-facing surface of the substrate to receive a contact signal and provide a second electrical signal in response to the contact signal, the plurality of contact plates being electrically interconnected via the substrate to corresponding ones of a plurality of contacts interconnected with each other while being supported by the inward-facing surface of the substrate, the plurality of contact plates being electrically interconnected to different ones among the plurality of electrical contacts of the integrated circuit chip to provide the second electrical signal to the integrated circuit chip, A pair of contact pads, interconnected with each other while being supported by the inward-facing surface of the substrate and being electrically interconnected to different ones among a pair of different ones of the plurality of contacts, the plurality of contacts being a second pair of electrical contact portions different from a first pair of electrical contact portions among the plurality of electrical contact portions of the integrated circuit chip, different ones among the pair of contact pads being electrically interconnected to different ones among the first and second contact rails to provide the second electrical signal to the first and second contact rails, A card including the above. (Aspect 25) The card according to aspect 24, wherein at least one connection line of the first pair of connection lines includes at least one in-line capacitor, different ones among the pair of contact pads being electrically interconnected to different ones among the first and second contact rails via different ones among the second pair of connection lines, and at least one connection line of the second pair of connection lines including at least one in-line diode. (Aspect 26) The card according to aspect 24, wherein the first antenna is interconnected to the first surface of the first carrier layer while being supported by the inward-facing first surface of the first carrier layer and without overlapping the metal member, the first and second contact rails being interconnected with each other while being supported by the first surface of the first carrier layer, Each connection line of the second pair of connection lines A corresponding first part, interconnected therewith while being supported by the first surface of the first carrier layer; A corresponding bridge, extending through the first carrier layer; A corresponding second part, supported thereby on the outward second surface of the first carrier layer and interconnected using corresponding metal pads, the metal pads being connected to the second surface of the first carrier layer and arranged in contact with a corresponding one of the pair of contact pads, different from the other; A card including the above. (Aspect 27) The card according to aspect 26, wherein the first antenna is interconnected to the first carrier layer while being supported by the first carrier layer and without overlapping with the metal member. (Aspect 28) The card according to aspect 27, wherein the light-emitting patch is interconnected therewith while being supported by a non-conductive second carrier layer arranged between the metal member and the first carrier layer on the side of the first surface of the metal member, and the first and second contact pads (rails) and the light-emitting patch are arranged in a facing state between the first carrier layer and the second carrier layer. (Aspect 29) The card according to aspect 27, wherein the first antenna and the first and second contact rails are formed on the same surface of the first carrier layer by metal coating, conductive ink, or a combination thereof. (Aspect 30) The card according to aspect 23, wherein the first antenna is interconnected therewith while being supported by a non-conductive second carrier layer arranged between the metal member and the second core layer on the side of the second surface of the metal member, and the first antenna is arranged without overlapping with the metal member. (Aspect 31) The card according to aspect 30, wherein the first connection line pair extends along the metal member or through the metal member while being electrically insulated from the metal member. (Aspect 32) The card according to aspect 30, wherein the first and second carrier layers are formed by a first part and a second part of a non-conductive substrate that is a single continuum and is folded so as to wrap the circumferential edge part of the metal members. (Aspect 33) The card according to aspect 32, wherein the first connection line pair is interconnected to the substrate while being supported by the substrate. (Aspect 34) The card according to aspect 30, wherein the light-emitting patch is interconnected to the first carrier layer while being supported by the first carrier layer. (Aspect 35) The card according to aspect 34, wherein the first carrier layer, in a state where the first and second contact rails and the light-emitting patch are interconnected to the first carrier layer while being supported by the first carrier layer, and the second carrier layer, in a state where the first antenna is interconnected to the second carrier layer while being supported by the second carrier layer, are disposed within the opening of the surrounding member, thereby forming some other parts of the inlay. (Aspect 36) The card according to aspect 22, wherein the first antenna is electrically interconnected to the first and second contact rails at a plurality of offset positions thereof via different ones of a first connection line pair that is a first pair of conductive connection lines. The card further includes an integrated circuit module having an integrated circuit chip disposed in a pocket extending through the first core layer and interconnected to the substrate while being supported by the inner surface of the substrate, a second antenna that is electrically insulated from the metal member for receiving a non-contact signal and providing a second electrical signal to the integrated circuit chip in response to the non-contact signal and includes a card. (Aspect 37) The card according to aspect 36, further including a second connection line pair that is a second pair of conductive connection lines, electrically interconnected at a plurality of offset positions of the second antenna to different ones of a first pair of first electrical contact part pairs among a plurality of electrical contact parts of the integrated circuit chip to provide the second electrical signal to the integrated circuit chip. (Aspect 38) The card according to aspect 37, wherein the integrated circuit module further comprises a plurality of contact plates, which are interconnected to the outer surface of the substrate in a state of being supported thereby, for receiving a contact signal and providing a third electrical signal in response to the contact signal, and the plurality of contact plates are electrically interconnected via the substrate to corresponding plurality of contact portions, which are interconnected to the inner surface of the substrate in a state of being supported thereby, and the contact plates are electrically interconnected to different ones among the plurality of electrical contact portions of the integrated circuit chip to provide the third electrical signal to the integrated circuit chip, and a pair of contact pads, which are interconnected to the inner surface of the substrate in a state of being supported thereby, and are electrically interconnected to different ones among a pair of different ones among the plurality of contact portions, and the plurality of contact portions are a second pair of electrical contact portions different from the first pair of electrical contact portions among the plurality of electrical contact portions of the integrated circuit chip, and different ones among the pair of contact pads are electrically interconnected to different ones among the first and second contact rails to provide the third electrical signal to the first and second contact rails, and a card including the above. (Aspect 39) The card according to aspect 38, wherein different ones among the pair of contact pads are electrically interconnected to different ones among the first and second contact rails via different ones among the second pair of connection lines, and at least one connection line among the second pair of connection lines includes an in-line type diode. (Aspect 40) The card according to aspect 36, wherein the first antenna is interconnected to the first carrier layer in a state of being supported by the first carrier layer and without overlapping the metal member. (Aspect 41) The card according to aspect 40, wherein the light-emitting patch is supported and interconnected by a non-conductive second carrier layer disposed between the metal member and the first carrier layer on the side of the first surface of the metal member, and the first and second contact rails and the light-emitting patch are disposed facing each other between the first carrier layer and the second carrier layer. (Aspect 42) The card according to aspect 40, wherein the first antenna and the first and second contact rails are formed on the same surface of the first carrier layer by metal film formation, conductive ink, or a combination thereof. (Aspect 43) The card according to aspect 40, wherein the second antenna is supported and interconnected by the surrounding member. (Aspect 44) The card according to aspect 43, wherein the second antenna is formed by a wire at least partially embedded in the surrounding member. (Aspect 45) The card according to aspect 36, wherein the first antenna is supported and interconnected by a non-conductive second carrier layer disposed between the metal member and the second core layer on the side of the second surface of the metal member. (Aspect 46) The card according to aspect 45, wherein the first connection line pair extends along the metal member or through the metal member in a state electrically insulated from the metal member. (Aspect 47) The card according to aspect 45, wherein the first and second carrier layers are formed by a first portion and a second portion of a non-conductive substrate that is a single continuum and is folded to wrap the circumferential edge portion of the metal member. (Aspect 48) The card according to aspect 47, wherein the first connection line pair is supported and interconnected by the substrate. (Aspect 49) The card according to aspect 45, wherein the second antenna is supported and interconnected by the second carrier layer. (Aspect 50) The card according to aspect 49, wherein the second antenna has a loop structure extending along the periphery of a first area on the second carrier layer without overlapping the metal member, and the first antenna has another loop structure disposed within the first area on the second carrier layer. (Aspect 51) The card according to aspect 49, wherein at least a part of at least one of the first antenna and the second antenna is disposed in a state of overlapping the metal member. The card further includes an insulating layer disposed between the metal member and at least one of the first antenna and the second antenna for insulating reception of a contact signal by at least one of the first antenna and the second antenna. (Aspect 52) The card according to aspect 51, wherein the insulating layer includes a ferrite material. (Aspect 53) The card according to aspect 30, wherein the light-emitting patch is interconnected to the first carrier layer while being supported by the first carrier layer. (Aspect 54) The card according to aspect 53, wherein the first carrier layer, in which the first and second contact rails and the light-emitting patch are interconnected to the first carrier layer while being supported by the first carrier layer, the second carrier layer, in which the first antenna and the second antenna are interconnected to the second carrier layer while being supported by the second carrier layer, and the insulating layer are disposed within the opening of the surrounding member, thereby forming some other portions of the inlay. (Aspect 55) The card according to aspect 22, wherein the first antenna is interconnected to the first carrier layer while being supported by the first carrier layer and without overlapping the metal member. (Aspect 56) The card according to aspect 55, wherein the light-emitting patch is interconnected to a non-conductive second carrier layer disposed between the metal member and the first carrier layer on the side of the first surface of the metal member while being supported by the non-conductive second carrier layer, and the first and second contact rails and the light-emitting patch are disposed in a facing state between the first carrier layer and the second carrier layer. (Aspect 57) The card according to aspect 55, wherein the first antenna and the first and second contact rails are formed on the same surface of the first carrier layer by metal film formation, conductive ink, and / or a combination thereof. (Aspect 58) The card according to aspect 22, wherein the first antenna is supported and interconnected to the metal member by a non-conductive second carrier layer disposed between the metal member and the second core layer on the side of the second surface of the metal member, and the first antenna is in a non-overlapping relationship with the metal member. (Aspect 59) The card according to aspect 58, wherein the first antenna is electrically interconnected via different ones of a first pair of conductive connection lines that extend along or through the metal member in a state electrically insulated from the metal member at first and second offset positions of the first and second contact rails. (Aspect 60) The card according to aspect 58, wherein the first and second carrier layers are formed by a first portion and a second portion of a non-conductive substrate that is a single continuum and is folded to wrap a circumferential edge portion of the metal member. (Aspect 61) The card according to aspect 60, wherein the first antenna is electrically interconnected via different ones of a first pair of conductive connection lines that are supported and interconnected to the first and second contact rails at first and second offset positions thereof by the substrate. (Aspect 62) The card according to aspect 60, wherein the light-emitting patch is supported and interconnected to the first carrier layer. (Aspect 63) The card according to aspect 62, wherein the first carrier layer is in a state where the first and second contact rails and the light-emitting patch are supported and interconnected to the first carrier layer, and the second carrier layer is in a state where the first antenna is supported and interconnected to the second carrier layer, and both are disposed within the opening of the surrounding member, thereby forming some other portions of the inlay. (Aspect 64) The card according to Aspect 21, further comprising a phosphorescent patch that overlaps at least a part of the light-emitting patches on the side of the first surface of the metal member. (Aspect 65) The card according to Aspect 21, wherein the first and second contact rails are provided for positioning the light-emitting patches at a plurality of different positions between the first and second contact rails during the manufacturing process. (Aspect 66) The card according to Aspect 21, further comprising a mask that overlays at least a part of the light-emitting pads on the side of the first surface of the metal member, and forms a predetermined image on the side of the first surface of the card when the light-emitting patches emit light. (Aspect 67) A card comprising a metal member having a weight that is at least 40% of the total weight of the card, a non-conductive surrounding member having an opening, wherein the metal member is disposed within the opening, and the metal member and the surrounding member form at least a part of an inlay, conductive first and second contact rails that are spaced apart from each other with a gap on the side of the first surface of the metal member for receiving an electrical signal and are disposed without contacting the metal member, a light-emitting patch that is electrically connected to the first and second contact pads (rails) without contacting the metal member on the side of the first surface of the metal member for emitting light when receiving an electrical signal at the first and second contact rails, an integrated chip module disposed within a pocket extending through the first core layer and comprising the integrated chip module comprising an integrated circuit chip that is interconnected thereto while being supported by the inward-facing surface of the substrate A plurality of contact plates, interconnected to each other in a state supported by the outward-facing surface of the substrate in order to receive a contact signal and provide a first electrical signal in response to the received contact signal, the plurality of contact plates being electrically interconnected to corresponding plurality of contact portions via the substrate, the plurality of contact portions being interconnected to each other in a state supported by the inward-facing surface of the substrate and being electrically interconnected to different ones among the plurality of electrical contact portions of the integrated circuit chip in order to provide the first electrical signal to the integrated circuit chip, A pair of contact pads, interconnected to each other in a state supported by the inward-facing surface of the substrate and being electrically interconnected to different ones among a pair of different ones among the plurality of contact portions, the plurality of contact portions being a second pair of electrical contact portions among the plurality of electrical contact portions of the integrated circuit chip, different from the first pair of electrical contact portions, and being electrically interconnected to different ones among different ones among the second pair of electrical contact portions, different ones among the pair of contact pads being interconnected to different ones among the first and second contact rails in order to provide the first electrical signal to the first and second contact rails, A first core layer, disposed on the side of the first surface of the metal member and overlaying the first and second contact rails and the light-emitting patch, A second core layer, disposed on the side of the second surface of the metal member, which is on the side opposite to the first surface thereof A card including the above.

[0136] The foregoing detailed description of the invention has been presented for purposes of illustration and description with reference to the figures and the text. Furthermore, the detailed description is not intended to limit the invention to the form disclosed in this application document. Accordingly, some variations and some modifications, which are commensurate with the foregoing teachings, skills, and knowledge of the technology related to the invention, are within the scope of the invention. Some of the embodiments described in this application document are further intended to illustrate some of the manners known as practicing the invention and to enable those skilled in the art to utilize the invention in this or other some embodiments and with various modifications required for specific some uses or applications of the invention. It is intended that the appended claims be construed to cover multiple alternative embodiments to the extent permitted by the prior art.

Claims

Claim 1 A card, comprising: An electronics layer forming a first side and a second side opposite to the first side; An illuminable patch capable of emitting light, configured to be connected at a plurality of positions on the side of the first side of the electronics layer, and emitting light in response to an electrical signal; A communications element (at least one communications element), electrically connected to the electronics layer and configured to wirelessly receive an electrical signal, wherein the electrical signal received by the communications element provides power to the illuminable patch; One or more signal filters, electrically positioned between the communications element and the illuminable patch and configured to limit the form of the current transmitted between the communications element and the illuminable patch; A metal member layer, a part of which has one or more metal members for imparting rigidity or weight to the card and is configured to be connected to the side of the second side of the electronics layer; A card including the above components. Claim 2 The card according to claim 1, wherein the one or more metal members are arranged so as not to interfere with the electrical signal received by the communications element. Claim 3 The card according to claim 1, further comprising: A power receiving element electrically connected to the electronics layer; One or more signal filters, electrically positioned between the power receiving element and the illuminable patch and configured to limit the form of the current transmitted between the power receiving element and the illuminable patch; A card including the above components. Claim 4 The card of claim 1, wherein the one or more signal filters are electrically connected to the electronics layer and are configured to limit the form of current transmitted to, from, or through the electronics layer.

5. The card of claim 1, wherein the electronics layer includes first and second contact rails on the side of the first surface, and the first and second contact rails are connected to the light-emitting patch and configured to send an electrical signal to the light-emitting patch.

6. The card of claim 5, wherein the communications element is electrically insulated from the one or more metal members and is electrically connected to the first and second contact rails at a plurality of offset positions to receive a non-contact signal and provide the electrical signal to the first and second contact rails in response to the non-contact signal.

7. The card of claim 5, further comprising: a first carrier layer that forms the uppermost layer of the card on the side of the first surface of the electronics layer and further forms an opening in a part of the electronics layer; a second carrier layer formed as a layer connected to the metal member layer on the side opposite to the electronics layer; an integrated chip module that is disposed inside the opening of the first carrier layer, is electrically connected to the electronics layer, and is further configured to send an electrical signal to a first external device or receive an electrical signal from a first external device; and the integrated chip module further includes: one or more contact plates configured to be in electrical contact with the first external device; one or more of the one or more communication elements that are electrically connected to the integrated chip module, extend along the outer periphery of one or more of the plurality of layers, and are configured to receive a non-contact electrical signal from a second external device or send a non-contact electrical signal to a second external device; a card including.

8. The card of claim 7, further comprising one or more connection lines for delivering the electrical signal from the one or more contact plates or the one or more communication elements to the first and second contact rails to provide power to the light-emitting patch. The one or more connection lines further comprise one or more signal filters electrically positioned between the one or more contact plates and the light-emitting patch and between the one or more communication elements and the light-emitting patch for restricting the form of the electrical signal transmitted or received by the one or more communication elements. **Claim 9** The card of claim 7, wherein the one or more metal members do not overlap with the one or more communication elements, and the first carrier layer, the second carrier layer, and the electronics layer have the same spatial extent. **Claim 10** The card of claim 1, further comprising a light-transmitting layer connected to the light-emitting patch and having translucency or phosphorescence. The light-transmitting layer is further configured to transmit light to a position visible from the outside of the card. **Claim 11** The card of claim 1, further comprising a mask disposed so as to be spaced apart from the light-emitting patch in a direction perpendicular thereto and facing the direction in which light is emitted from the light-emitting patch. The mask is configured to permit or block the emission of light from the light-emitting patch to generate an image visible from the outside. **Claim 12** The card of claim 5, further comprising a carrier layer. The carrier layer is A first part configured to connect to the electronics layer on the side of the first surface and to form an opening that penetrates the second surface and reaches the electronics layer, A second part configured to connect to the metal member layer on the side of its first surface, An edge that forms an intersection between the first part and the second part and is movable such that the first surface of the first part can be connected to the first surface of the second part including, The card further includes an integrated chip module disposed inside the opening of the first part, electrically connected to the electronics layer, and further configured to send an electrical signal to a first external device or receive an electrical signal from a first external device. The integrated chip module further includes one or more contact plates configured to contact the first external device. The card further includes one or more of the communication elements, electrically connected to the integrated chip module, passing through the edge, extending from the second part to the electronics layer, and configured to receive a non-contact electrical signal from a second external device or transmit a non-contact electrical signal to a second external device.

13. The card according to claim 12, further comprising One or more connection lines for sending the electrical signal from the one or more contact plates or antennas to the first and second contact rails to provide power to the light-emitting patch. The one or more connection lines further comprise One or more signal filters electrically positioned between the one or more contact plates and the light-emitting patch to limit the unwanted forms of the electrical signal from being sent or received by the one or more communication elements, the one or more contact plates, or the integrated chip module.

14. The card of claim 13, wherein the one or more metal members have a non-overlapping relationship with the one or more communication elements, and the first carrier layer, the second carrier layer, and the electronics layer have the same spatial extent.

15. A card, comprising: An electronics layer forming a first surface and a second surface opposite to the first surface; A light-emitting patch configured to be connected at a plurality of positions on the side of the first surface of the electronics layer and to emit light in response to an electrical signal; A communication element (a communications element, at least one communication element) electrically connected to the card and configured to wirelessly receive an electrical signal, wherein the electrical signal received by the communication element provides power to the light-emitting patch; One or more signal filters electrically positioned between the communication element and the light-emitting patch and configured to limit the form of the current transmitted between the communication element and the light-emitting patch; A card comprising the above.

16. The card of claim 15, wherein the electronics layer includes first and second contact rails configured to be connected to the light-emitting patch on the side of the first surface of the electronics layer and to transmit an electrical signal to or from the light-emitting patch, and the first and second contact rails are electrically positioned between the one or more signal filters and the light-emitting patch.

17. The card of claim 15, further comprising: A metal member layer, a part of which has one or more metal members for imparting rigidity or weight to the card and is configured to be connected to the side of the second surface of the electronics layer; The one or more metal members having a non-overlapping relationship with the communication element.

18. A card, comprising: A metal member having a weight that is at least 40% of the total weight of the card, A non-conductive surrounding member having an opening, wherein the metal member is disposed within the opening, and the metal member and the surrounding member form at least a part of the inlay, Conductive first and second contact rails that are spaced apart from each other with a gap on the side of the first surface of the metal member for receiving an electrical signal and are electrically insulated from the metal member, A light-emitting patch that is electrically insulated from the metal member on the side of the first surface of the metal member and is disposed in a state of being electrically connected to the first and second contact rails in order to emit light when receiving an electrical signal at the first and second contact rails, A first antenna that is electrically insulated from the metal member and is interconnected to different ones of the first and second contact rails at a plurality of offset positions of the first antenna for receiving a non-contact signal and providing a first electrical signal to the first and second contact rails in response to the non-contact signal, A first core layer that is disposed on the side of the first surface of the metal member and overlays the first and second contact rails and the light-emitting patch, A second core layer that is disposed on the side of the second surface of the metal member, which is on the side opposite to the first surface thereof A card including the above.

19. The card according to claim 18, wherein the first and second contact rails are interconnected in a state of being supported by a non-conductive first carrier layer disposed between the metal member and the first core layer on the side of the first surface of the metal member.

20. The card according to claim 19, wherein the first antenna is electrically interconnected to different ones of the first and second contact rails via different ones of a first pair of connection lines, which is a first pair of conductive connection lines, at a plurality of first offset positions of the first antenna, The card further includes An integrated circuit module having an integrated circuit chip disposed in a pocket extending through the first core layer and interconnected to the integrated circuit chip in a state of being supported by an inward-facing surface of a substrate. A second connection line pair, which is a second pair consisting of a pair of conductive connection lines, is electrically connected to different ones of a first pair of electrical contact parts among the plurality of electrical contact parts of the integrated circuit chip to provide the first electrical signal to the integrated circuit chip, and is electrically interconnected at a plurality of second offset positions of the first antenna. A card including the above.

21. The card according to claim 20, wherein the integrated circuit module further includes a plurality of contact plates, which are interconnected to each other in a state supported by the outer surface of the substrate to receive a contact signal and provide a second electrical signal in response to the contact signal. The plurality of contact plates are electrically interconnected via the substrate to corresponding ones of a plurality of contact parts that are interconnected to each other in a state supported by the inner surface of the substrate. The plurality of contact plates are electrically interconnected to different ones of the plurality of electrical contact parts of the integrated circuit chip to provide the second electrical signal to the integrated circuit chip. A pair of contact pads, which are interconnected to each other in a state supported by the inner surface of the substrate and are electrically interconnected to different ones of a pair of the plurality of contact parts. The plurality of contact parts are a second pair of electrical contact parts among the plurality of electrical contact parts of the integrated circuit chip, which are different from the first pair of electrical contact parts, and different ones of the plurality of contact parts are electrically interconnected to different ones of the second pair of electrical contact parts. Different ones of the pair of contact pads are electrically interconnected to different ones of the first and second contact rails to provide the second electrical signal to the first and second contact rails. A card including the above.

22. The card according to claim 21, wherein at least one connection line of the first connection line pair includes at least one in-line capacitor, and different ones of the pair of contact pads are electrically interconnected via different ones of the second connection line pair to different ones of the first and second contact rails, and at least one connection line of the second connection line pair includes at least one in-line diode.

23. The card according to claim 21, wherein the first antenna is interconnected to the first surface of the first carrier layer while being supported by the inward first surface of the first carrier layer and without overlapping with the metal member, and the first and second contact rails are interconnected to the first surface of the first carrier layer while being supported by the first surface of the first carrier layer. Each connection line of the second connection line pair is a corresponding first portion that is interconnected to the first surface of the first carrier layer while being supported by the first surface of the first carrier layer, is a corresponding bridge that extends through the first carrier layer, and is a corresponding second portion that is supported by and interconnected using a corresponding metal pad to the outward second surface of the first carrier layer, and the metal pad is connected to the second surface of the first carrier layer and is arranged in contact with a corresponding one of the pair of contact pads that is different from the other one. A card including the above.

24. The card according to claim 23, wherein the first antenna is interconnected to the first carrier layer while being supported by the first carrier layer and without overlapping with the metal member.

25. The card according to claim 24, wherein the light-emitting patch is interconnected to the first carrier layer while being supported by a non-conductive second carrier layer arranged between the metal member and the first carrier layer on the side of the first surface of the metal member, and the first and second contact rails and the light-emitting patch are arranged in a face-to-face state between the first carrier layer and the second carrier layer.

26. The card according to claim 24, wherein the first antenna and the first and second contact rails are formed on the same surface of the first carrier layer by metal coating, conductive ink, or a combination thereof.

27. The card according to claim 20, wherein the first antenna is supported and interconnected therewith by a non-conductive second carrier layer disposed between the metal member and the second core layer on the side of the second surface of the metal member, and the first antenna is disposed in a state of not overlapping the metal member.

28. The card according to claim 27, wherein the first connection line pair extends along the metal member or through the metal member in a state of being electrically insulated from the metal member.

29. The card according to claim 27, wherein the first and second carrier layers are formed by a first part and a second part of a non-conductive substrate that is a single continuum and is folded to wrap the circumferential edge portion of the metal member.

30. The card according to claim 29, wherein the first connection line pair is supported and interconnected therewith by the substrate.

31. The card according to claim 27, wherein the light-emitting patch is supported and interconnected therewith by the first carrier layer.

32. The card according to claim 31, wherein the first carrier layer, in which the first and second contact rails and the light-emitting patch are supported and interconnected therewith, and the second carrier layer, in which the first antenna is supported and interconnected therewith, are disposed within the opening of the surrounding member, thereby forming some other portions of the inlay.

33. The card according to claim 19, wherein the first antenna is electrically interconnected at a plurality of offset positions thereof to the first and second contact rails via different ones of a first connection line pair that is a first pair of conductive connection lines. The card further comprises An integrated circuit module having an integrated circuit chip disposed within a pocket extending through the first core layer and interconnected therewith while being supported by an inward-facing surface of the substrate. A second antenna electrically insulated from the metal member for receiving a non-contact signal and providing a second electrical signal to the integrated circuit chip in response to the non-contact signal. A card including the same.

34. The card according to claim 33, further comprising: A second pair of connection lines consisting of a pair of conductive connection lines, electrically interconnected at a plurality of offset positions of the second antenna to different ones of a first pair of electrical contact portions among a plurality of electrical contact portions of the integrated circuit chip to provide the second electrical signal to the integrated circuit chip.

35. The card according to claim 34, wherein the integrated circuit module further comprises: A plurality of contact plates interconnected with and supported by an outward-facing surface of the substrate for receiving a contact signal and providing a third electrical signal in response thereto, the plurality of contact plates being electrically interconnected via the substrate to corresponding ones of a plurality of contacts interconnected with and supported by the inward-facing surface of the substrate, the contact plates being electrically interconnected to different ones of the plurality of electrical contact portions of the integrated circuit chip to provide the third electrical signal to the integrated circuit chip. A pair of contact pads interconnected with and supported by an inward-facing surface of the substrate and electrically interconnected to different ones of a pair of the plurality of contacts, the plurality of contacts being a second pair of electrical contact portions among the plurality of electrical contact portions of the integrated circuit chip different from the first pair of electrical contact portions, different ones of the pair of contact pads being electrically interconnected to different ones of the first and second contact rails to provide the third electrical signal to the first and second contact rails. A card including the same.

36. The card according to claim 35, wherein different ones of the pair of contact pads are electrically interconnected via different ones of the pair of second connection lines to different ones of the first and second contact rails, and at least one connection line of the pair of second connection lines includes an in-line type diode.

37. The card according to claim 33, wherein the first antenna is interconnected to the first carrier layer while being supported by the first carrier layer and without overlapping the metal member.

38. The card according to claim 37, wherein the light emitting patch is interconnected to the metal member while being supported by a non-conductive second carrier layer disposed between the metal member and the first carrier layer on the side of the first surface of the metal member, and the first and second contact rails and the light emitting patch are disposed facing each other between the first carrier layer and the second carrier layer.

39. The card according to claim 37, wherein the first antenna and the first and second contact rails are formed on the same surface of the first carrier layer by metal coating, conductive ink, or a combination thereof.

40. The card according to claim 37, wherein the second antenna is interconnected to the surrounding member while being supported by the surrounding member.

41. The card according to claim 40, wherein the second antenna is formed by a wire at least partially embedded in the surrounding member.

42. The card according to claim 33, wherein the first antenna is interconnected to the metal member while being supported by a non-conductive second carrier layer disposed between the metal member and the second core layer on the side of the second surface of the metal member.

43. The card according to claim 42, wherein the first connection line pair extends along the metal member while being electrically insulated from the metal member or extends through the metal member.

44. The card according to claim 42, wherein the first and second carrier layers are a non-conductive substrate that is a single continuum and is folded so as to wrap the circumferential edge portions of the metal members, and is formed by a first portion and a second portion among those.

45. The card according to claim 44, wherein the first connection line pair is interconnected to the substrate while being supported by the substrate.

46. The card according to claim 42, wherein the second antenna is interconnected to the second carrier layer while being supported by the second carrier layer.

47. The card according to claim 46, wherein the second antenna has a loop structure extending along the periphery of a first area on the second carrier layer without overlapping with the metal member, and the first antenna has another loop structure disposed within the first area on the second carrier layer.

48. The card according to claim 46, wherein at least a part of at least one of the first antenna and the second antenna is disposed in a state of overlapping with the metal member, and the card further includes an insulating layer disposed between the metal member and the at least one of the first antenna and the second antenna in order to insulate reception of a contact signal by the at least one of the first antenna and the second antenna.

49. The card according to claim 48, wherein the insulating layer includes a ferrite material.

50. The card according to claim 27, wherein the light-emitting patch is interconnected to the first carrier layer while being supported by the first carrier layer.

51. The card according to claim 50, wherein the first carrier layer in a state where the first and second contact rails and the light-emitting patch are interconnected to the first carrier layer while being supported by the first carrier layer, and the second carrier layer in a state where the first antenna and the second antenna are interconnected to the second carrier layer while being supported by the second carrier layer, and the insulating layer are disposed within the opening of the surrounding member, thereby forming some other portions of the inlay.

52. The card according to claim 19, wherein the first antenna is interconnected to the first carrier layer while being supported by the first carrier layer and without overlapping the metal member.

53. The card according to claim 52, wherein the light-emitting patch is interconnected to and supported by a non-conductive second carrier layer disposed between the metal member and the first carrier layer on the side of the first surface of the metal member, and the first and second contact rails and the light-emitting patch are disposed facing each other between the first carrier layer and the second carrier layer.

54. The card according to claim 52, wherein the first antenna and the first and second contact rails are formed on the same surface of the first carrier layer by metal coating, conductive ink, and / or a combination thereof.

55. The card according to claim 19, wherein the first antenna is interconnected to and supported by a non-conductive second carrier layer disposed between the metal member and the second core layer on the side of the second surface of the metal member, and the first antenna is in a non-overlapping relationship with the metal member.

56. The card according to claim 55, wherein the first antenna is electrically interconnected via different ones of a first pair of conductive connection lines that are a first pair of a first connection line pair that extends along or through the metal member in a state of being electrically insulated from the metal member at first and second offset positions of the first and second contact rails.

57. The card according to claim 55, wherein the first and second carrier layers are formed by a first portion and a second portion of a non-conductive substrate that is a single continuum and is folded so as to wrap around a circumferential edge portion of the metal member.

58. The card according to claim 57, wherein the first antenna is, at first and second offset positions thereof, a pair of first conductive connection lines that are interconnected to the first and second contact rails while being supported by the substrate, and the card is electrically interconnected via different ones of the pair of first connection lines.

59. The card according to claim 57, wherein the light-emitting patch is interconnected to the first carrier layer while being supported by the first carrier layer.

60. The card according to claim 59, wherein the first carrier layer interconnects the first and second contact rails and the light-emitting patch while supporting them, and the second carrier layer interconnects the first antenna while supporting it, and both are disposed within the opening of the surrounding member, thereby forming some other portions of the inlay.

61. The card according to claim 18, further comprising a phosphorescent patch that overlaps at least a part of the light-emitting patches on the side of the first surface of the metal member.

62. The card according to claim 18, wherein the first and second contact rails are provided to position the light-emitting patch at a plurality of different positions between the first and second contact rails during the manufacturing process.

63. The card according to claim 21, further comprising a mask that overlays at least a part of the light-emitting pads on the side of the first surface of the metal member and forms a predetermined image on the side of the first surface of the card when the light-emitting patch emits light.

64. A card, comprising a metal member having a weight that is at least 40% of the total weight of the card, and a non-conductive surrounding member having an opening, wherein the metal member is disposed within the opening, and the metal member and the surrounding member form at least a part of the inlay. Conductive first and second contact rails that are arranged side by side with a gap therebetween on the side of the first surface of the metal member for receiving an electrical signal and are arranged in a state of not contacting the metal member, A light-emitting patch that is arranged on the side of the first surface of the metal member in a state of not contacting the metal member for electrically connecting to the first and second contact rails in order to emit light when receiving an electrical signal at the first and second contact rails, An integrated chip module that is arranged in a pocket extending through the first core layer including, The integrated chip module, An integrated circuit chip that is interconnected to the substrate while being supported by the inward-facing surface of the substrate, A plurality of contact plates that are interconnected to the substrate while being supported by the outward-facing surface of the substrate for receiving a contact signal and providing a first electrical signal in response to the received contact signal, and the plurality of contact plates are electrically interconnected via the substrate to corresponding plurality of contact portions, and the plurality of contact portions are interconnected to the substrate while being supported by the inward-facing surface of the substrate and are electrically interconnected to different ones of the plurality of electrical contact portions of the integrated circuit chip for providing the first electrical signal to the integrated circuit chip, A pair of contact pads that are interconnected to the substrate while being supported by the inward-facing surface of the substrate and are electrically interconnected to different ones of a pair of the plurality of contact portions, and the plurality of contact portions are a second pair of electrical contact portions of the plurality of electrical contact portions of the integrated circuit chip that are different from the first pair of electrical contact portions, and different ones of the pair of contact pads are interconnected to different ones of the first and second contact rails for providing the first electrical signal to the first and second contact rails, A first core layer that is arranged on the side of the first surface of the metal member and overlays the first and second contact rails and the light-emitting patch, A second core layer, which is disposed on the side of the second surface of the metal member, which is on the side opposite to the first surface thereof A card including the same

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